JP2001201752A - Optoelectronic panel, production type display device and method of producing optoelectronic panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optoelectronic panel having high accuracy in the gap dimension between substrates and having uniform gap dimension in the whole image display region, and to provided a projection type display device using the optoelectronic panel. SOLUTION: Projections are formed on the surface of a TFT array substrate 2 in such a manner that the projections protrude to the counter substrate 3 and touch the other substrate. Since the projections 25 are formed at specified positions in the pixel of the image display region 36 to control the gap dimension between the substrates, the gap dimension can be controlled by using a gap material appropriate for the sealing material.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to an electro-optical panel in which an electro-optical material such as liquid crystal is sealed between a pair of substrates, a projection display device using the electro-optical panel, and a method of manufacturing the electro-optical panel. Things. More specifically, the present invention relates to a technique for securing a gap of a predetermined size between a pair of substrates.

[0002]

BACKGROUND ART In an electro-optical panel in which an electro-optical material such as a liquid crystal is sealed between a pair of substrates, as shown in FIGS. 19 and 20, a pixel electrode 8 and a pixel switching device are formed on a surface of a transparent substrate such as a quartz glass. A TFT array substrate (transistor array substrate) 2 on which a thin film transistor (hereinafter, referred to as a TFT) 10 is formed; a counter substrate 3 on which a counter electrode 32 is formed on the surface of a highly heat-resistant glass substrate such as neoceram; And an electro-optical material 39 such as a liquid crystal enclosed and sandwiched between the substrates. The TFT array substrate 2 and the opposing substrate 3 are bonded to each other with a sealing material 200 ′ containing a gap material through a predetermined gap, and an image display area 37 in which an electro-optical material 39 is sealed is provided in the gap. Seal material 20
0 'is defined. Conventionally, as such a sealing material 200 'containing a gap material, a material in which glass beads or the like are mixed as a gap material with an epoxy resin-based or acrylic resin-based adhesive component is used.

[0005] In the electro-optical panel 1 ′ configured as described above, the pixel electrode 8 and the counter electrode are formed on the TFT array substrate 2 by an image signal applied to the pixel electrode 8 via a data line (not shown) and the TFT 10. 32, the alignment state of the electro-optical material 39 is controlled for each pixel,
A predetermined image corresponding to the image signal is displayed. Therefore, T
In the FT array substrate 2, it is necessary to supply an image signal to the pixel electrode 8 via the data line and the TFT 10 and also apply a predetermined potential to the counter electrode 32.

Therefore, in the electro-optical panel 1 ', the TFT
On the array substrate 2 side, a first electrode 47 for inter-substrate conduction is formed with the aid of a process for forming data lines and the like,
On the side of the opposing substrate 3, a second electrode 48 for inter-substrate conduction is formed with the aid of the formation process of the opposing electrode 32, and the first electrode 47 and the second electrode 47 for inter-substrate conduction are formed. 48
Are electrically connected to each other by a conductive material 56 in which conductive particles such as silver powder and gold-plated fiber are mixed with an epoxy resin-based or acrylic resin-based adhesive component. Therefore, in the electro-optical panel 1 ′, the input / output terminals 45 of the TFT array substrate 2 can be connected to the TFT array substrate 2 and the counter substrate 3 without connecting them to the flexible wiring substrate.
A predetermined signal can be input to both the TFT array substrate 2 and the opposing substrate 3 only by connecting the flexible wiring substrate 99 or the like to only the TFT substrate.

[0005]

However, in the electro-optical panel 1 ', an attempt is made to improve the display quality by narrowing the gap size (cell thickness) between the TFT array substrate 2 and the counter substrate 3 to about 2 .mu.m. However, if an attempt is made to secure such a thin cell thickness only by a gap material mixed in the peripheral sealing material 200 ', the variation becomes large due to the thin cell thickness. As a result, the variation in the thickness of the layer of the electro-optical material 39 becomes large,
On the display screen, unnatural brightness and unevenness in the response speed of the electro-optical material 39 occur, and the display quality deteriorates.

Therefore, a configuration in which the cell thickness is controlled by spraying a spacer material on the image display area 37 is considered. However, when the electro-optical panel 1 'in which the spacer material is scattered in the image display area 37 is used for a projection display device, the light transmittance is reduced in a place where the scattered spacer material is densely gathered. Is projected directly onto the screen as it is.

In the electro-optical panel 1 ′, the gap size (cell thickness) between the TFT array substrate 2 and the counter substrate 3 is 2 μm.
Attempts have been made to improve the display quality by narrowing the cell thickness to about m. However, if such a thin cell thickness is to be ensured only by the gap material blended in the peripheral sealing material 200 ', the cell thickness is reduced. Variations increase by the amount. As a result, the variation in the thickness of the layer of the electro-optical material 39 becomes large, so that unnatural light and dark on the display screen, the variation in the response speed of the electro-optical material 39, and the like occur, and the display quality is degraded. There is a problem.

Therefore, a configuration is conceivable in which the cell thickness is controlled by spraying a spacer material on the image display area 37. However, when the electro-optical panel 1 'in which the spacer material is scattered in the image display area 37 is used for a projection display device, the light transmittance is reduced in a place where the scattered spacer material is densely gathered. Is projected directly onto the screen as it is.

In view of the above problems, an object of the present invention is to provide:
An object of the present invention is to provide an electro-optical panel having a high gap size accuracy and a uniform gap size over the entire image display area, a projection display device using the electro-optical panel, and a method of manufacturing the electro-optical panel.

[0010]

According to the present invention, an electro-optical material is sandwiched between a pair of substrates, and the pair of substrates are bonded and fixed by a sealant. In the electro-optical panel having an image display region including a plurality of pixels in the formation region of the sealing material, one of the pair of substrates may be protruded toward the other substrate and may be disposed on the other substrate. It has a projection which is in contact with the projection, and the projection is formed in a region surrounding the pixel region.

According to the present invention, the gap size (cell thickness) between the substrates is controlled by bringing the protrusion formed on one substrate into contact with the other substrate. The gap size can be controlled with higher accuracy as compared with the configuration for controlling the gap. Further, since the projection is formed so as to surround the image display area, it is possible to suppress variation in the gap size between the substrates in the entire image display area. Therefore, it is possible to realize an electro-optical panel in which even if the gap is narrow, the gap dimension accuracy is high and the gap dimension is uniform over the entire image display area. Further, since it is not necessary to put a gap material in the seal material, even if there are wires under the seal material, it is possible to prevent the wires from being crushed by the gap material and being disconnected.

In the present invention, the protrusion is, for example,
The sealing material is formed along one of the inner peripheral edge and the outer peripheral edge of the formation region.

In the present invention, the projection has a first projection along an inner peripheral edge of a formation region of the sealing material and a second projection along an outer peripheral edge, and the sealing material includes the first projection and the second projection. Preferably, it is formed in a region sandwiched between the second protrusions. With this configuration, the seal material is blocked by the first protrusion and the second protrusion, so that when the uncured seal material is applied or the seal material is heated, the seal material protrudes to an unnecessary part. There is no. Therefore, a thermosetting material can be used as the sealing material.

According to another aspect of the present invention, an electro-optical material is sandwiched between a pair of substrates, the pair of substrates is bonded and fixed to each other with a sealing material, and a plurality of the In the electro-optical panel having an image display area composed of pixels, one of the pair of substrates has a projection that projects toward the other substrate and contacts the other substrate, and the projection includes And a conductive layer formed around the conductive layer that electrically connects the conductive layers formed on each of the pair of substrates.

For example, it is preferable that the projection is formed so as to surround a region where the conductive material is formed. With this configuration, the conductive material is blocked by the projections, so that when the uncured conductive material is applied or when the conductive material is heated, the conductive material does not protrude to unnecessary portions. Therefore, a thermosetting adhesive can be used as the adhesive component of the conductive material.

[0016] The sealing material is formed so as to at least partially overlap a light-shielding film formed around the image display area. With such a configuration,
Since the sealing material extends to the light shielding film, the adhesion by the sealing material can be improved.

In the present invention, it is preferable that the protrusion is made of an elastically deformable material and is crushed between the pair of substrates. With this configuration, between the substrates, the crushed projections return to the original shape, and a force is applied to spread the substrates. On the other hand, the substrates are fixed to each other with the sealing material, so that the The gap size can be made uniform.

In the present invention, the pair of substrates includes, for example, a transistor array substrate in which pixel electrodes and pixel switching thin film transistors are formed in a matrix, and a counter substrate in which counter electrodes are formed.

In a projection type display device (electro-optical device) using such an electro-optical panel, a light source, and a condensing optical system for guiding light emitted from the light source to the electro-optical panel,
An enlargement projection optical system that enlarges and projects light modulated by the electro-optical panel is arranged.

In the method of manufacturing an electro-optical panel according to the present invention, after forming the projection on one of the pair of substrates, the sealing material is applied, and then the pair of substrates is pressed. The sealing material is cured.

In the method of manufacturing an electro-optical panel according to the present invention, the protrusion is formed after forming a first protrusion along an inner peripheral edge and a second protrusion along an outer peripheral edge of a region where the sealing material is to be formed. Preferably, the sealing material is applied to a region sandwiched between the first projection and the second projection, and then the sealing material is cured while pressing the pair of substrates. With this configuration, when the uncured sealing material is applied, the sealing material is blocked by the projection, so that the sealing material does not protrude to an unnecessary part.

In the method of manufacturing an electro-optical panel according to the present invention, after forming the projection so as to surround a region where the conductive material is to be formed, the conductive material is placed in a region surrounded by the projection. It is preferable that the pair of substrates is pressed and then the sealing material and the conductive material are cured simultaneously or separately. With this configuration, when the uncured conductive material is applied, the conductive material is blocked by the projections, so that the conductive material does not protrude to an unnecessary part.

In the method of manufacturing an electro-optical panel according to the present invention, the protrusion is formed on one of the pair of substrates from a material that can be elastically deformed, and then a sealing material is applied to the one of the substrates. Thereafter, it is preferable that the projection is elastically deformed while pressing the pair of substrates, and the sealing material is cured in this state.

In the present invention, the electro-optical material is sandwiched between a pair of substrates, and the pair of substrates is bonded and fixed to each other with a sealing material. In the electro-optical panel having an image display area consisting of, one of the pair of substrates is formed with a projection protruding toward the other substrate and abutting on the other substrate, wherein the projection is It is characterized by being scattered at a predetermined position in the image display area.

According to the present invention, the gap size (cell thickness) between the substrates is controlled by bringing the protrusion formed on one substrate into contact with the other substrate. The gap size can be controlled with higher accuracy as compared with the configuration for controlling the gap. Further, since the projections are formed so as to be scattered in the image display area, the gap size between the substrates does not vary in the entire image display area. Therefore, it is possible to realize an electro-optical panel in which even if the gap is narrow, the gap dimension accuracy is high and the gap dimension is uniform over the entire image display area. Further, in such an electro-optical panel, even when the projection is formed in the image display area, the projection does not concentrate on a certain area in the image display area. Further, since it is not necessary to put a gap material in the seal material, even if there are wires under the seal material, it is possible to prevent the wires from being crushed and broken by the gap material.

In the present invention, it is preferable that the projection is formed in a non-opening area through which light does not pass in each pixel formed in the image display area. With this configuration, even if a projection is formed in the image display area,
The projection is not shown on the display. Therefore, the present invention is effective when the electro-optical panel is used as a light valve of a projection display device.

In the present invention, it is preferable that the protrusion is formed at the same position in each pixel formed in the image display area. That is, the protrusions are preferably formed on the same coordinates in each pixel. With this configuration, the projections are formed at the same height in each pixel, so that the dimension of the gap between the substrates can be made more constant. Therefore, even when a substrate having a large step is used, a certain gap can be secured between the substrate and the other substrate.

In the present invention, it is preferable that the projection has a cylindrical shape. With such a configuration, when the electro-optical material such as liquid crystal is filled, the electro-optical material smoothly goes around the protrusion, so that the filling failure of the electro-optical material does not occur.

In the present invention, it is preferable that the projections are formed at a higher density in a peripheral area in the image display area than in a central area. With this configuration, the center of the panel may expand depending on the timing of injecting an electro-optical material such as a liquid crystal between the substrates,
It is preferable to bond the substrates together in anticipation of the occurrence of such a bulge. That is, immediately after the substrates are bonded to each other, the gap between the substrates becomes narrower in the central area of the image display area. However, when the electro-optical material is injected into the image display area, the central area expands, and the gap in this area becomes larger. Even if the size is slightly increased, such enlargement is absorbed and reduced by the difference in the gap size before the electro-optical material is injected.
Therefore, the size of the gap between the substrates can be made uniform over the entire image display area.

In the present invention, it is preferable that the protrusions are formed at a higher density in one area in the image display area than in the other area. When manufacturing the electro-optical panel according to the present invention, after forming a projection on one of the substrates, a sealing material is applied, and then the sealing material is cured while adding a filler to fill a gap between the pair of substrates. However, if a region where the magnitude is always generated when the pair of substrates is pressed is known when the pair of substrates is pressed, the protrusions may be formed with a density that absorbs and relaxes the region. That is, the protrusions are formed on one of the substrates with a predetermined distribution in consideration of the habit of an apparatus for bonding the substrates, so that the gap between the substrates can be made uniform over the entire image display area.

In the present invention, it is preferable that the projection is made of an elastically deformable material and is crushed between the pair of substrates. With this configuration, a force is applied between the substrates so that the crushed protrusions try to return to the original shape and expand the spaces between the substrates. The gap size can be made uniform.

In the present invention, the pair of substrates includes, for example, a transistor array substrate on which pixel electrodes and pixel switching thin film transistors are formed in a matrix, and a counter substrate on which counter electrodes are formed.

In a projection display device (electro-optical device) using such an electro-optical panel, a light source, a condensing optical system for guiding light emitted from the light source to the electro-optical panel, and
An enlargement projection optical system that enlarges and projects light modulated by the electro-optical panel is arranged.

In the method of manufacturing an electro-optical panel according to the present invention, after forming the protrusion on one of the pair of substrates, the sealing material is applied, and then the pair of substrates are pressed while being pressed. The sealing material is cured.

In the method of manufacturing an electro-optical panel according to the present invention, after forming the projection on one of the pair of substrates with a material capable of being elastically deformed, a sealing material is applied to the one substrate. After that, it is preferable that the pair of substrates is pressed to elastically deform the projection, and the sealing material is cured in this state. With this configuration, a force is applied between the substrates so that the crushed protrusions try to return to the original shape and expand the spaces between the substrates. The gap size can be made uniform.

According to the present invention, an electro-optical material is sandwiched between a pair of substrates, the pair of substrates are bonded and fixed to each other with a sealing material, and a plurality of pixels are formed in a region where the sealing material is formed. In the electro-optical panel having an image display area, one of the pair of substrates has a projection that projects toward the other substrate and abuts on the other substrate, and the projection includes the pixel region. Is disposed so as to face a light-shielding film formed in a region surrounding.

According to the present invention, the protrusions formed on one substrate are brought into contact with the other substrate to control the gap size (cell thickness) between the substrates. The gap size can be controlled with higher accuracy as compared with the configuration for controlling the gap size. Further, since the projection is formed so as to surround the image display area, it is possible to suppress variation in the gap size between the substrates in the entire image display area. Further, since the projection is provided so as to face the light shielding film, the projection can be provided by effectively using the non-display area. .

Further, the present invention is characterized in that the projections are arranged so as to fit within the width of the light-shielding film in plan view. According to the present invention, since the projections fall within the width of the light-shielding film in a plan view, it is possible to prevent the projections from affecting the display area.

[0039]

Embodiments of the present invention will be described with reference to the drawings. Note that, in the electro-optical panel according to the present embodiment, the same portions as those of the conventional electro-optical panel are denoted by the same reference numerals and described.

[0040]

FIG. 1 is a plan view of an electro-optical panel according to the present embodiment as viewed from a counter substrate side. FIG. 2 is a cross-sectional view of the electro-optical panel taken along line HH ′ in FIG. FIG. 3 is a cross-sectional view of a panel end showing a TFT array substrate, a counter substrate, and a bonding structure of these substrates used in the electro-optical panel of the present embodiment.

As shown in FIGS. 1, 2 and 3, an electro-optical panel 1 used for a projection display device or the like has a TFT array in which transparent pixel electrodes 8 are formed in a matrix on a surface of quartz glass 30. Substrate 2 and quartz glass 3
1. A counter substrate 3 having a transparent counter electrode 32 formed on the surface thereof
And an electro-optical material 39 such as liquid crystal sealed and sandwiched between these substrates.

The TFT array substrate 2 and the counter substrate 3 are adhered to each other with a predetermined gap therebetween by a sealing material 200 formed along the outer peripheral edge of the counter substrate 3. Also,
An electro-optical material enclosing region 40 is defined between the TFT array substrate 2 and the counter substrate 3 by a sealing material 200, and an electro-optical material 39 such as liquid crystal is sealed in the image display region 37.

In the present embodiment, the gap dimension (cell thickness) between the TFT array substrate 2 and the opposing substrate 3 is ensured by a projection projecting from the TFT array substrate 2 toward the opposing substrate 3 as described later. ing. Therefore, unlike the related art, the seal material 200 used in the present embodiment does not need to include a gap material.

In the electro-optical panel 1, the counter substrate 3 is smaller than the TFT array substrate 2,
Are bonded so as to protrude from the outer peripheral edge of the counter substrate 3. Therefore, the driving circuits (the scanning line driving circuit 70 and the data line driving circuit 60) and the input / output terminals 45 of the TFT array substrate 2 are exposed from the counter substrate 3,
The connection of the flexible wiring board 99 to the input / output terminals 45 is possible. Here, since the sealing material 200 is partially interrupted, the interrupted portion forms the electro-optical material injection port 241. Therefore, if the inside area of the sealing material 200 is decompressed after the opposing substrate 3 and the TFT array substrate 2 are bonded, the electro-optic material 39 can be injected under reduced pressure from the electro-optic material injection port 241, and 39, the electro-optical material inlet 241
May be closed with a sealant 242. The counter substrate 3 includes
A light-shielding film 55 is formed around the image display area 37 inside the formation area of the sealant 200. Further, a light-shielding film 6 is formed on the counter substrate 3 in a region corresponding to a boundary region between the pixel electrodes 8 of the TFT array substrate 2.

The electro-optical panel 1 of the present embodiment is, for example,
Used in projection type display devices (projectors).
In this case, three electro-optical panels 1 are used as light valves for RGB, respectively, and each of the electro-optical panels 1 receives light of each color separated through a dichroic mirror for RGB color separation as projection light. Respectively. Therefore, no color filter is formed on the electro-optical panel 1 of the present embodiment. However, by forming an RGB color filter together with its protective film in a region facing each pixel electrode 8 on the counter substrate 3, a color display device such as a color liquid crystal television can be configured in addition to the projection display device. it can. Also, by stacking a number of interference layers having different refractive indexes on the opposite substrate 3,
A dichroic filter that produces RGB colors by utilizing the interference of light may be formed. According to the counter substrate with the dichroic filter, a brighter color display can be performed. Further, the counter substrate 3 and T
The type of the electro-optical material 39 to be used, that is, TN, is provided on the light incident side or light exit side of the FT array substrate 2.
(Twisted nematic) mode, STN (super TN) mode, DSTN (double-STN) mode, and other operation modes, and normally white mode / normal black mode, depending on the polarizing film, retardation film, polarizing plate, etc. Are arranged in a predetermined direction.

In the electro-optical panel 1 configured as described above, on the TFT array substrate 2, the pixel electrode 8 and the counter electrode 32 are formed by the image signal applied to the pixel electrode 8 via the data line (not shown) and the TFT 10. Controlling the alignment state of the electro-optical material 39 for each pixel,
A predetermined image corresponding to the image signal is displayed. Therefore, T
In the FT array substrate 2, it is necessary to supply an image signal to the pixel electrode 8 via the data line and the TFT 10 and also apply a predetermined potential to the counter electrode 32.

Therefore, in the electro-optical panel 1, a portion of the surface of the TFT array substrate 2 facing each corner of the opposing substrate 3 is formed of an aluminum film (light-shielding material) with the help of a process of forming data lines and the like. ), A first electrode 47 for inter-substrate conduction is formed. On the other hand, a second electrode 48 made of a transparent conductive film (Indium Tin Oxide: ITO film) for inter-substrate conduction is formed at each corner of the opposing substrate 3 with the aid of the formation process of the opposing electrode 3. .
Further, the first electrode 47 and the second
The electrodes 48 are electrically connected to each other by a conductive material 56 in which conductive particles such as silver powder and gold-plated fiber are mixed with an epoxy resin-based or acrylic resin-based adhesive component.
Therefore, in the electro-optical panel 1, the TFT array substrate 2 is connected to only the TFT array substrate 2 without connecting a flexible wiring substrate or the like to each of the TFT array substrate 2 and the opposing substrate 3. 2
A predetermined signal can be input to both the counter substrate 3 and the counter substrate 3.

(Configuration of TFT Array Substrate) FIG. 4 is a block diagram schematically showing the configuration of an electro-optical panel, and FIG.
FIG. 6 is a plan view showing a part of a pixel in the electro-optical panel. FIG.
FIG. 3 is a cross-sectional view of the FT array substrate.

As shown in FIGS. 1 and 4, each of the plurality of pixels formed in a matrix forming the image display area 37 of the electro-optical panel 1 according to the present embodiment has a scanning line 91 and a data line. A data line 90 to which an image signal is supplied is electrically connected to a source of the TFT 10. The data line 90 includes a pixel electrode 8, a pixel electrode 8, and a TFT 10 for controlling the pixel pith 8. .., Gm are applied to the scanning line 91 of the TFT 10 line-sequentially in this order. The pixel electrode 8 has T
TFT1 is electrically connected to the drain of FT10.
When the switch is closed for a certain period of time, the image signals S1, S2,.
n is written at a predetermined timing. The image signals S1, S2 of a predetermined level written to the liquid crystal via the pixel electrode 8
, Sn are held for a certain period between the counter electrode 32 formed on the counter substrate 3. The electro-optical material 39 modulates light by changing the orientation and order of the molecular assembly according to the applied voltage level, thereby enabling gray scale display. Here, in order to prevent the held image signal from leaking, a storage capacitor 40 is added in parallel with the electro-optical material formed between the pixel electrode 8 and the counter electrode 32. As a method of forming the storage capacitor 40 in this manner, a capacitor line 92 which is a wiring for forming a capacitor may be provided, or a capacitor may be formed between the storage line 40 and a preceding scanning line 91 as described later. You may.

FIG. 5 is a plan view of a part of the pixel. The data line 90 is electrically connected to the source region 16 of the semiconductor layer made of the polysilicon film via the contact hole, and the pixel electrode 8 is electrically connected to the drain region 17 via the contact hole. . Further, the scanning line 91 extends so as to face the channel region 15. In addition,
The storage capacitor 40 corresponds to an extension of the silicon film 10a (semiconductor film / the area shaded in FIG. 5) for forming the pixel switching TFT 10.
(Semiconductor film / the area shaded in FIG. 5) is made conductive, and the lower electrode 41 is connected to the capacitor line 9.
2 has an overlapping structure as an upper electrode.

FIG. 6 shows a cross section taken along the line AA 'of the pixel thus configured. First, TFT
An insulating underlying protective film 301 is formed on the surface of the quartz glass 30 serving as the base of the array substrate 2.
On the surface of No. 1, island-shaped silicon films 10a and 40a are formed. A gate insulating film 13 is formed on the surface of the silicon film 10a, and a scanning line (gate electrode) 91 is formed on the gate insulating film 13. In the silicon film 10a, a region facing the scanning line 91 via the gate insulating film 13 is a channel region 15.
A source region 16 having a low-concentration source region 161 and a high-concentration source region 162 is formed on one side of the channel region 15, and a drain region having a low-concentration drain region 171 and a high-concentration drain region 172 is formed on the other side. A region 17 is formed. The first interlayer insulating film 18 and the second interlayer insulating film 19 are formed on the surface side of the pixel switching TFT 10 configured as described above. The data line 90 formed on the surface of the first interlayer insulating film 18 is ,
It is electrically connected to the high-concentration source region 162 through a contact hole formed in the first interlayer insulating film 18.
In addition, the pixel electrode 8 is electrically connected to the high-concentration drain surface area 172 via contact holes formed in the first interlayer insulating film 18 and the second interlayer insulating film 19. A lower electrode 41 composed of a high-concentration region is formed on the silicon film 40a extending from the high-concentration drain region 172, and an insulating film (formed simultaneously with the gate insulating film 13) is formed on the lower electrode 41. The capacitance lines 92 face each other via the dielectric film). Thus, a storage capacitor is formed.

Here, the TFT 10 preferably has an LDD structure as described above, but may have an offset structure, or may be implanted with impurity ions at a high concentration using the scanning line 91 as a mask to form a self-aligned structure. Self-aligned TF with high concentration source and drain regions formed
It may be T. On the counter substrate 3, a light-shielding film 6, a counter electrode 32 and an alignment film 49 are formed in this order in a region facing the pixel switching TFT 10.

(Control of Gap Dimension between Substrates) In the electro-optical panel 1 thus configured, in the present embodiment, FIG.
As shown in FIGS. 2 and 3, on the surface of the TFT array substrate 2 (the surface on which the electro-optical material 39 is sandwiched), the formation region of the sealing material 200 is formed so as to surround the image display region 37. A projection 21 is formed along the inner peripheral edge of.
The protrusion 21 protrudes toward the opposing substrate 3 and abuts on the opposing substrate 3 to secure a gap (cell thickness) of 2 μm between the TFT array substrate 2 and the opposing electrode 3.
That is, the protrusion 21 is made of an elastically deformable material, and is in a state of being crushed between the TFT array substrate 2 and the counter electrode 3 that are bonded and fixed by the sealant 200.

(Manufacturing Method) This state will be described in detail together with a method of manufacturing the electro-optical panel 1 with reference to FIGS. FIG. 7 is a cross-sectional view showing a state immediately before bonding the substrates as shown in FIG.

In manufacturing the electro-optical panel 1 according to the present embodiment, first, the opposing substrate 3 is formed by forming the light shielding film 6 and the opposing electrode 32 on the surface of an insulating substrate such as quartz glass 31.
Are sequentially formed, a thin polyimide resin 49 for forming an alignment film is applied to the surface of the counter electrode 32. Next, the polyimide resin 49 is thermally cured at a temperature of about 150 ° C. to 200 ° C. After forming a layer of the polyimide resin 49 on the side of the counter substrate 3 in this manner, a rubbing process is performed.

On the other hand, in order to form the TFT array substrate 2, first, the TFT 10 and the pixel electrode 8 are sequentially formed on the surface of the quartz glass 30 by using a well-known semiconductor process.

Next, the entire surface of the TFT array substrate 2 is
After applying a resin of a type that can be elastically deformed even after curing, the resin is patterned using a photolithography technique to form a projection 21 in a region surrounding the image display region 37. Here, the target value of the gap size between the substrates is, for example, 2 μm.
If m, the protrusion 21 is aimed at the gap size (2 μm)
It is formed slightly thicker than it is.

Next, a thin polyimide resin 46 for forming an alignment film is formed on the surface of the TFT array substrate 2.
After that, a rubbing process is performed.

Next, TF is surrounded so as to surround the outside of the projection 21.
An uncured sealing material 200 is applied to the surface of the T array substrate 2 while being discharged from a dispenser. Further, on the surface of the TFT array substrate 2, an uncured conductive material 56 for substrate-to-substrate conduction is applied while being discharged from a dot-type dispenser, on a slightly outer peripheral side of the application region of the sealant 200. In the present embodiment, as the conductive material 56, a material in which conductive particles such as silver powder and gold-plated fiber are mixed with an epoxy resin-based or acrylic resin-based adhesive component having photo-curing or thermosetting properties is used. Further, as the sealing material 200,
Similarly to the conductive material 56, an epoxy resin or acrylic resin adhesive having photo-curing or thermo-curing properties is used. The sealing material 200 does not contain a gap material. Accordingly, since no gap material is required to be inserted into the seal material 200, even if there are wires under the seal material 200, these wires are not crushed by the gap material and disconnected.

Next, the inter-substrate conduction second electrode 48 formed on the counter substrate 3 is opposed to the inter-substrate conduction first electrode 47 formed on the TFT array substrate 2. Then, after aligning the opposing substrate 3 with the TFT array substrate 2, the opposing substrate 3 is pressed toward the TFT array substrate 2, and the protrusions 21 are slightly crushed to a height of 2 μm. From the side of the opposing substrate 3, the sealing material 20
0 to the conductive material 5 by ultraviolet irradiation or heat treatment.
6 and the sealing material 200 are cured.

Here, the conductive material 56 and the sealing material 200
May be applied and then cured together, but the conductive material 56 and the sealing material 200 may be separately applied and cured. Curing may be performed in two stages, that is, temporary curing and main curing.

As a result, as shown in FIGS. 1 to 3,
The opposing substrate 3 and the TFT array substrate 2 are bonded via a gap of 2 μm with the protrusion 21 interposed therebetween as a spacer, and a first electrode for substrate conduction formed on the TFT array substrate 2. 47 and a second electrode 48 formed on the opposite substrate 3 for inter-substrate conduction,
To the electric ladle via.

After the opposing substrate 3 and the TFT array substrate 2 have been bonded in this manner, as shown in FIG. The substance 39 is injected under reduced pressure, and then the electro-optical substance injection port 241 is closed with a sealant 242.

As described above, in the present embodiment, the gap size (cell thickness) between the substrates is controlled by interposing the protrusions 21 formed on the TFT array substrate 2 with the counter substrate 3 while being elastically deformed. Therefore, compared with a configuration in which the gap size is controlled by the gap material mixed with the sealing material, the
Even with a small gap size of m, it can be controlled with high accuracy. Further, since the protrusion 21 is formed so as to surround the image display area 37, the gap size is controlled in the entire image display area 37, and the gap size between the substrates does not vary from place to place. Therefore, it is possible to realize the electro-optical panel 1 in which the accuracy of the gap dimension is high even in a narrow gap and the gap dimension is uniform over the entire image display area 37. Therefore, when display is performed using the electro-optical panel 1, display quality is improved, for example, there is no display unevenness, a high contrast ratio, and a bright display can be performed.

[Embodiment 2] FIG. 8 is a plan view of an electro-optical panel according to this embodiment as viewed from a counter substrate side. 9A and 9B are a cross-sectional view of the electro-optical panel and a plan view of a conductive portion between the substrates, respectively, taken along the line H′-H ″ in FIG. B) is a cross-sectional view of the electro-optical panel and a plan view of a conductive portion between the substrates, respectively, showing a state immediately before bonding the substrates as shown in Fig. 9. In the electro-optical panel according to the present embodiment, Portions common to those of the electro-optical panel according to the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

In the first embodiment, the projections 21 for controlling the cell thickness are formed only along the inner peripheral edge of the formation region of the sealing material 200. In the present embodiment, as shown in FIGS. 8 and 9A, Of the surface of the TFT array substrate 2, the sealing material 20
The inner peripheral projection 22 and the outer peripheral projection 23 are formed along both the inner peripheral edge and the outer peripheral edge of the 0 forming region. Further, in the present embodiment, as shown in FIG. 9B, the outer peripheral side projection 23 is formed with a circular portion 24 surrounding a region where a conductive material 56 for conducting between the substrates is formed. In the example shown here, the circular portion 2 surrounding the region where the conductive material 56 is formed is shown.
4 and the outer peripheral side projection 23 are integrated, but they may be formed independently.

A method of manufacturing the electro-optical panel 1 having such a configuration will be described with reference to FIGS. 9 and 10, and a method of securing a predetermined gap between the substrates will be described in detail.

In manufacturing the electro-optical panel 1 of the present embodiment, first, as shown in FIG.
The light shielding film 6 and the counter electrode 3 are formed on the surface of the quartz glass 31 used for
2, and an alignment film made of polyimide resin 49 is formed.

On the other hand, on the surface of the quartz glass 30 used for the TFT array substrate 2, first, the TFT 10 and the pixel electrode 8
And so on.

Next, the entire surface of the TFT array substrate 2 is
After applying a resin of a type that can be elastically deformed even after curing, the resin is patterned using a photolithography technique, and an outer periphery including the inner peripheral side protrusion 22 and the circular portion 24 so as to surround the image display area 37. The side protrusion 23 is formed.
Here, if the target value of the clearance between the substrates is 2 μm, the inner protrusion 22 and the outer protrusion 23 are set to the target value of the clearance (2 μm).
m) is formed slightly thicker than m). In addition, as shown in FIG. 10B, in the corner portion of the outer peripheral side protrusion 23, the circular portion 24 surrounds the periphery of the first electrode 47 for conducting the substrates through the conducting material 56. Form.

Next, a polyimide resin 46 is formed on the surface of the TFT array substrate 2 and a rubbing process is performed, so that the layer of the polyimide resin 46 is used as an alignment film.

Next, of the surface of the TFT array substrate 2,
The uncured sealing material 200 is applied to a region sandwiched between the inner peripheral projection 22 and the outer peripheral projection 23 while being discharged from a dispenser. Also, the circular portion 2 of the outer peripheral side projection 23
An uncured conductive material 56 for inter-substrate conduction is applied to the region surrounded by 4 while being discharged from a dot type dispenser. Also in the present embodiment, the conductive material 56 is made of a light-curable or thermosetting epoxy resin-based or acrylic resin-based adhesive component mixed with conductive particles such as silver powder or gold-plated fiber. In addition, the sealing material 200
A photo-curable or thermo-curable epoxy resin-based or acrylic resin-based adhesive is used, and no gap material is compounded in the sealing material 200.

Next, the second electrode 48 for inter-substrate conduction formed on the counter substrate 3 is opposed to the first electrode 47 for inter-substrate conduction formed on the TFT array substrate 2. After aligning the opposing substrate 3 with the TFT array substrate 2, the opposing substrate 3 was pressed toward the TFT array substrate 2 and crushed until the heights of the protrusions 22, 23, and 24 became 2 μm. In this state, by irradiating the sealing material 200 with ultraviolet rays from the counter substrate 3 side or by heating
The conductive material 56 is cured and the sealing material 200 is cured.

As a result, as shown in FIGS. 8 and 9,
The opposing substrate 3 and the TFT array substrate 2 are bonded to each other with a predetermined gap therebetween, and are formed on the opposing substrate 3 and the first electrode 47 for inter-substrate conduction formed on the TFT array substrate 2. The second electrode 48 for inter-substrate conduction is electrically connected via a conductive material 56.

As described above, in the present embodiment, the gap dimension (cell thickness) between the substrates is controlled by bringing the inner peripheral projections 22 and the outer peripheral projections 23 formed on the TFT array substrate 2 into contact with the counter substrate 3. Therefore, the gap size can be controlled with higher accuracy as compared with a configuration in which the gap size is controlled by the gap material mixed with the sealing material. Further, since the inner peripheral side projection 22 and the outer peripheral side projection 23 are formed so as to surround the image display area 37, the gap size between the substrates does not vary in the entire image display area 37. Therefore, it is possible to realize the electro-optical panel 1 in which the accuracy of the gap dimension is high and the gap dimension is uniform over the entire image display area 37.

Since the uncured sealing material 200 is applied to the region sandwiched between the inner peripheral side projections 22 and the outer peripheral side projections 23, the uncured sealing material 200 does not protrude into an extra region when applied and heated. . Further, the uncured conductive material 56 is
Since it is applied inside the circular portion 24 of the outer peripheral side projection 23,
When applying and heating, it does not protrude into an extra area. Therefore, a thermosetting adhesive can be used as the adhesive component of the sealing material 200 and the conductive material 56. Here, when a thermosetting material is used as the sealing material 200 or the conductive material 56, unlike the case where an ultraviolet curable material is used, the polyimide resins 46 and 49 constituting the alignment film are deteriorated by irradiation with ultraviolet light. Things can be avoided. Therefore, there is no need for a troublesome process of shielding a predetermined region from light when irradiating with ultraviolet rays. When the ultraviolet-curable sealing material 200 is used, the sealing material 200
There is a restriction that various circuits, wirings, and the like cannot be formed in a region overlapping with the sealing material 200 so that the ultraviolet rays reach the region. However, if the thermosetting sealing material 200 is used, the overlapping region can be effectively used. Various circuits and wirings can be arranged in the device. In addition, by extending the formation region of the sealing material 200 to a position at least partially overlapping with the light shielding film 55 formed around the image display region 37, the sealing property can be improved.

[Embodiment 3] FIG. 11 is a plan view of an electro-optical panel according to the present embodiment as viewed from a counter substrate side.
12 and 13 are a plan view and a cross-sectional view of a pixel of the electro-optical panel, respectively. Also, FIG.
FIG. 4 is a cross-sectional view of a pixel showing a state immediately before bonding substrates as shown in FIG. Note that, in the electro-optical panel according to the present embodiment, the same parts as those of the electro-optical panel according to the first embodiment will be denoted by the same reference numerals, and description thereof will be omitted.

In the first and second embodiments, the projections 21, 22, 23 for controlling the cell thickness are formed along the formation region of the sealing material 200.
However, in the present embodiment, as shown in FIG. 11, no protrusion for controlling the cell thickness is formed along the formation region of the sealing material 200, and the conventional electric device described with reference to FIG. It has substantially the same planar shape as the optical panel.

Instead, in the present embodiment, as shown in FIG. 12 and FIG.
A large number of cylindrical projections 25 are provided at predetermined positions
Are formed, and the large number of projections 25
By interposing between the TFT array substrate 2 and the opposing substrate 3 bonded at 0, a predetermined gap is secured between the substrates. In this embodiment, as a position where the projection 25 is formed, any pixel formed in the image display area 37 is formed in a non-opening area through which light does not pass. In other words, each pixel corresponds to an extended portion of the silicon film 10a (semiconductor film / the area shaded in FIG. 5) for forming the pixel switching TFT 10 among the pixels described with reference to FIG. Silicon film 40
a (semiconductor film / region shaded in FIG. 5) and the region where the storage capacitor 40 is formed using the capacitance line 92, the projection 25 is formed.

A method for manufacturing the electro-optical panel 1 having such a configuration will be described with reference to FIGS. 11, 12, 13 and 14, and a method for securing a predetermined gap between the substrates. Will be described in detail.

In manufacturing the electro-optical panel 1 of this embodiment, first, as shown in FIG. 14, a surface of a quartz glass 31 used for a counter substrate 3 is formed of a light shielding film 6, a counter electrode 32, and a polyimide resin 49. An alignment film is formed.

On the other hand, on the surface of the quartz glass 30 used for the TFT array substrate 2, the TFT 10, the pixel electrode 8, and the like are formed.

Next, after applying a kind of resin that can be elastically deformed even after curing over the entire surface of the TFT array substrate 2, FIG.
As shown in FIG. 14, it is patterned by photolithography to form a columnar projection 25 on a relatively flat area of the surface of the TFT array substrate 2 where the storage capacitor 40 is formed. To form Here, when the target value of the gap size between the substrates is 2 μm, the protrusion 25 is formed to be slightly thicker than the target value (2 μm) of the gap size.

Next, a polyimide resin 46 is formed on the surface of the TFT array substrate 2 and a rubbing process is performed.
An alignment film made of a layer of the polyimide resin 46 is formed.

Next, as shown in FIG. 11, an uncured sealing material 200 is applied from a dispenser to a region of the surface of the TFT array substrate 2 which overlaps the outer peripheral edge of the counter substrate 3. On the outer peripheral side of the application region of the sealing material 200, an uncured conductive material 56 for inter-substrate conduction is applied while being discharged from a dot type dispenser. In this embodiment,
As the conductive material 56, a material obtained by mixing conductive particles such as silver powder and gold-plated fiber with an epoxy resin-based or acrylic resin-based adhesive component having photo-curing or thermosetting properties is used. Here, as the sealing material 200, an epoxy resin or acrylic resin adhesive having photo-curing or thermosetting properties is used, and the sealing material 200 includes a gap material. Any of those not performed may be used. Here, if the sealing material 200 containing no gap material is used, it is possible to prevent the wires from being crushed and broken by the gap material even if there are wires under the sealing material 200.

Next, the second electrode 48 for inter-substrate conduction formed on the counter substrate 3 is opposed to the first electrode 47 for inter-substrate conduction formed on the TFT array substrate 2. Next, after the opposing substrate 3 and the TFT array substrate 2 are aligned, the opposing substrate 3 is pressed toward the TFT array substrate 2 so that the height of the projection 25 is 2 μm as shown in FIG.
The conductive material 56 and the sealing material 200 are cured by irradiating the sealing material 200 with ultraviolet light or heating from the side of the counter substrate 3 while being slightly crushed to the order of m.

As a result, as shown in FIG. 11 and FIG. 13, the opposing substrate 3 and the TFT array substrate 2 are bonded to each other with a predetermined gap therebetween, and the inter-substrate conduction formed on the TFT array substrate 2 is established. The first electrode 47 and the second electrode 48 formed on the counter substrate 3 for inter-substrate conduction are connected to an electric ladle via a conductive material 56.

After the opposing substrate 3 and the TFT array substrate 2 have been bonded in this manner, as shown in FIG. After filling the electro-optical substance 39 with a reduced pressure and filling the electro-optical substance 39, the electro-optical substance injection port 241 is closed with a sealant 242. At this time, the projection 25
Is a columnar shape, so that the electro-optical material 39 such as a liquid crystal is used.
Is smooth without protrusions 25
5, the electro-optic material 39 is properly filled. Therefore, the filling failure of the electro-optical material 39 does not occur.

As described above, in the present embodiment, the gap dimension (cell thickness) between the substrates is controlled by bringing the protrusions 25 formed on the TFT array substrate 2 into contact with the opposing substrate 3.
The gap size can be controlled with higher precision as compared to a configuration in which the gap size is controlled by the gap material mixed with the sealing material. In addition, since the projections 25 are interposed between the TFT array substrate 2 and the counter substrate 3 at a number of positions scattered in the image display area 37, the gap size between the substrates varies in the entire image display area 37. Does not occur. Therefore, it is possible to realize the electro-optical panel 1 in which the accuracy of the gap dimension is high even in a narrow gap and the gap dimension is uniform over the entire image display area 37.

Further, since the projections 25 functioning as spacers are formed on the TFT array substrate 2, the image display area 37 is formed.
Unlike the case where the spacers are scattered, the projections 25 can be selectively formed only in the non-opening areas where light does not transmit in each pixel by avoiding positions where the display quality is deteriorated. For example, as in the present embodiment, the protrusion 25 can be selectively formed in a flat region where the storage capacitor 40 is formed. Therefore, even when the electro-optical panel 1 is used as a light valve of a projection display device, the projection 25 is not enlarged and projected as an image.

Further, since the projections 25 are formed at the same location (the formation region of the storage capacitor 40) in each pixel, that is, on the same coordinates in each pixel, the projections 25 have the same height in each pixel. Formed at the location.
Therefore, since the position of the height of the projection 25 is the same for each pixel, the gap size between the substrates can be more reliably made constant. Therefore, even when the TFT array substrate 2 having a large step is used, the TFT array substrate 2 and the opposing substrate 3
And a certain gap can be secured between them.

[Improvement of Third Embodiment] FIG. 15 is an explanatory view showing the distribution of protrusions in an electro-optical panel according to an improvement of the third embodiment, and FIG. 16 is another improvement of the third embodiment. FIG. 4 is an explanatory diagram showing a distribution of protrusions in the electro-optical panel according to the first embodiment.

In the electro-optical panel 1 according to the third embodiment, the columnar projections 25 are formed at the same density in the image display area 37, but in the example described here, The protrusions 25 are formed at a high density in a specific region, and the protrusions 25 are formed only at a low density in other regions.

That is, in the example shown in FIG. 15, among the many pixels arranged in a matrix in the image display area 37 of the electro-optical panel 1, the surrounding area is formed by the projection 25 (indicated by a black circle in FIG. 15). The projections 25 are formed in all the pixels as high-density formation regions, whereas the projections 25 are formed only in some of the pixels in the central region as low-density formation regions of the projections 25.

With such a configuration, immediately after the substrates are bonded to each other, the gap between the substrates is reduced in the central region of the image display area 37. That is, the center of the electro-optical panel 1 may swell depending on the timing of injecting an electro-optical material such as liquid crystal between the substrates, but the substrates can be bonded together in anticipation of such swelling. In other words, when the electro-optical material 39 is injected into the image display area 37 under reduced pressure, even if the central area slightly expands and the gap size becomes large, such an enlarged amount is equal to the gap size before the electro-optical substance 39 is injected. Absorbed and mitigated by the difference Therefore, the size of the gap between the substrates can be made uniform over the entire image display area 37.

As a form for changing the formation density of the projections 25, as shown in FIG. 16, when the opposing substrate 3 and the TFT array substrate 2 are bonded to each other, the opposing substrate 3 is pressed toward the TFT array substrate 2. In the device, when the pressing force tends to vary from place to place, the projections 25 are formed with a distribution that cancels such variations. For example, if the pressing force on the TFT array substrate 2 is large on the left side as viewed in FIG. 16 and the pressing force on the TFT array substrate 2 is small on the right side, the left side of the image display area 37 in FIG. For the region, the protrusion 25
The number of pixels forming the protrusions 25 as the high-density formation region is increased, for example, the protrusions 25 are formed in all the pixels. On the other hand, in the right region as viewed in FIG. The protrusion 25 is formed only on the pixel.

With this configuration, even if the pressing force differs depending on the location, the density of the protrusions 25 interposed between the opposing substrate 3 and the TFT array substrate 2 is set accordingly. The gap between the substrates can be made uniform over the entire surface of the image display area 37.

[Other Embodiments] FIG. 17A shows a first modification of the first embodiment. In the embodiment of the first embodiment, an example is shown in which the protrusions 21 are formed around the sealing material forming region on the TFT array substrate 2 and the sealing material 200 is also formed on the TFT array substrate 2. 17 (A)
In the modified example, while the protrusion 21 is formed at a predetermined position on the counter substrate 3 side, the sealing material 200 is formed on the TFT array substrate 2, and after sealing, the Tf-T array substrate 2 and the counter substrate 3 are connected to each other. Are pasted together. In this case, the position where the protrusion 21 is formed and the position where the sealant 200 is applied may be shifted as in Embodiment 1, but overlap with the protrusion 21 as in the example shown in FIG. Sealing material 200 in position
In this case, as shown in FIG. 17B, a sealing material 200 is interposed between the projection 21 and the TFT array substrate 2, and the projection 21 and the TFT array substrate 2 Are bonded and fixed. Other configurations are the same as those of the first embodiment, and corresponding portions are denoted by the same reference numerals and description thereof will be omitted.
Note that such a configuration can be adopted in the second and third embodiments, but the description thereof is omitted.

Fourth Embodiment FIG. 21 shows a fourth embodiment. In the embodiment of the fourth embodiment, the TFT array substrate 2
21 shows an example in which the projections 21 are formed around and inside the sealing material forming region on the side and the sealing material 200 is also formed on the TFT array substrate 2. However, in the fourth embodiment of FIG. The TFT array substrate 2 and the counter substrate 3 are attached to each other on the side of the counter substrate 3 or the TFT array substrate 2 so as to face the light shielding film 55 around the display area. The light-shielding film 55 is a film formed for separating a display region in which pixels are formed in a matrix form from a non-display region around the display region. In this case, the formation position of the projection 21 may be shifted from the application position of the light-shielding film 55. However, if the projection 21 is formed so as to be within the width of the light-shielding film 55, the projection 21 is not affected by the step of the light-shielding film 55. 21 allows the gap between the substrates to be controlled. In addition, since the projection 21 overlaps with the light shielding film 55 and is hidden by the light shielding film 55 in a plan view, it is possible to prevent the projection 21 from affecting the display. In addition, the protrusions 21 may be formed so as to surround the non-display region along the light shielding film 55, or may be scattered along the light shielding film 55. As described above, the sealing material 200 is interposed between the protrusion 21 and the TFT array substrate 2, and the protrusion 21 and the TFT array substrate 2 are bonded and fixed. Alternatively, the protrusions 21 may be provided so as to face four corners of the light-shielding film 55 on the TFT array substrate side, and the TFT array substrate and the counter substrate may be bonded to each other. In that case, the protrusion 21 provided on the TFT array substrate side can function as an alignment mark for bonding to the counter substrate.
Other configurations are the same as those of the first embodiment, and corresponding portions are denoted by the same reference numerals and description thereof will be omitted.

[Application of Electro-Optical Panel to Electronic Apparatus] Next, as an example of an electronic apparatus including the electro-optical panel 1,
The projection display device will be described. FIG. 18 is an overall configuration diagram of a projection display (electro-optical device) showing an example of use of the electro-optical panel 1 to which the present invention is applied.

In FIG. 18, a projection type display device 1100
Is a light bulb 1 for RGB for each electro-optical panel 1.
This is a projector used as 00R, 100G, and 100B. In this liquid crystal projector 1100, a lamp unit 1102 of a white light source such as a metal halide lamp is used.
When the projection light is emitted from the RGB, the three mirrors 1106 and the two dichroic mirrors 1108 cause RGB to be emitted.
Light components R, G, and B corresponding to the three primary colors, and light valves 100R, 100G, and 100 corresponding to each color.
B. At this time, in particular, the B light is guided through a relay lens system 1121 including an entrance lens 1122, a relay lens 1123, and an exit lens 1124 in order to prevent light loss due to a long optical path. The light components corresponding to the three primary colors modulated by the light valves 100R, 100G, and 100B are combined with the dichroic prism 1
After being recombined by 112, the image is projected as a color image on a screen 1120 via a projection lens 1114.

[0102]

As described above, according to the present invention, the protrusions formed on one substrate are brought into contact with the other substrate to control the gap size (cell thickness) between the substrates. The gap size can be controlled with higher accuracy as compared with a configuration in which the gap size is controlled with the gap material set. In addition, the protrusions do not cause a variation in the gap size between the substrates so as to surround the image display area or the screen projection area in the entire image display area. Therefore, it is possible to realize an electro-optical panel in which the accuracy of the gap dimension is high even in a narrow gap and the gap dimension is uniform over the entire image display area. Further, since it is not necessary to put a gap material in the seal material, even if there are wires under the seal material, these wires are not crushed by the gap material and disconnected.

[0103]

[Brief description of the drawings]

FIG. 1 is a plan view of an electro-optical panel according to Embodiment 1 of the present invention when viewed from a counter substrate side.

FIG. 2 is a cross-sectional view of the electro-optical panel taken along the line HH ′ in FIG.

FIG. 3 is a cross-sectional view of a panel end showing a TFT array substrate, a counter substrate, and a bonding structure of these substrates when cut along a line H′-H ″ in FIG. 1;

FIG. 4 is a block diagram schematically showing a configuration of the electro-optical panel shown in FIG.

FIG. 5 is a plan view of a part of a pixel of the electro-optical panel shown in FIG.

6 is a cross-sectional view of the electro-optical panel when cut at a position corresponding to line AA ′ in FIG.

FIG. 7 is a cross-sectional view showing a state immediately before bonding the substrates as shown in FIG. 3;

FIG. 8 is a plan view of the electro-optical panel according to Embodiment 2 of the present invention as viewed from a counter substrate side.

FIGS. 9A and 9B are a cross-sectional view of the electro-optical panel and a plan view of a substrate conducting portion, respectively.

FIGS. 10A and 10B are cross-sectional views of an end portion of an electro-optical panel and a plan view of a conductive portion between substrates, respectively, showing a state before the substrates are attached to each other as shown in FIG. 9A. It is.

FIG. 11 is a plan view of the electro-optical panel according to Embodiment 3 of the present invention as viewed from a counter substrate side.

FIG. 12 is a plan view showing a part of a pixel of the electro-optical panel shown in FIG. 11;

13 is a cross-sectional view of the electro-optical panel when cut at a position corresponding to the line AA 'in FIG.

FIG. 14 is a cross-sectional view showing a state before the substrates are bonded to each other as shown in FIG.

FIG. 15 is an explanatory diagram showing a distribution of protrusions in an electro-optical panel according to an improved example of Embodiment 3 of the present invention.

FIG. 16 is an explanatory diagram showing a distribution of protrusions in an electro-optical panel according to another improved example of Embodiment 3 of the present invention.

FIGS. 17A and 17B are explanatory views showing a state in which projections and seal materials are formed or applied to different substrates in an electro-optical panel according to a modification of the first embodiment of the present invention, respectively. FIG. 5 is an explanatory view showing a state where the substrates are bonded together.

FIG. 18 is an overall configuration diagram of a projection display device (projector) showing an example of use of an electro-optical panel to which the present invention is applied.

FIG. 19 is a plan view of a conventional electro-optical panel viewed from a counter substrate side.

20 is a cross-sectional view of the electro-optical panel taken along the line H′-H ″ in FIG. 19 and a plan view of a conductive portion between the substrates.

FIG. 21 is an explanatory diagram showing a state in which projections are formed and substrates are bonded to each other in the electro-optical panel according to Embodiment 4 of the present invention.

[Explanation of symbols]

 Reference Signs List 1 electro-optical panel 2 TFT array substrate 3 counter substrate 8 pixel electrode 10 pixel switching TFT 21, 22, 23, 25 protrusion for controlling gap size between substrates 30, 31 quartz glass 32 counter electrode 37 image display area 39 electro-optic Substance 47 First electrode for substrate-to-substrate conduction 48 Second electrode for substrate-to-substrate conduction 90 Data line 91 Scanning line 200 Sealant 241 Electro-optical material inlet 242 Sealant

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) G03B 21/00 G09F 9/00 338 G09F 9/00 338 360K 360 9/30 320 9/30 320 338 338 G02F 1/136 500

Claims (28)

[Claims] An electro-optical material is sandwiched between a pair of substrates, the pair of substrates are bonded and fixed to each other with a sealing material, and an image display including a plurality of pixels is formed in a region where the sealing material is formed. In the electro-optical panel having a region, one of the pair of substrates has a protrusion that projects toward the other substrate and contacts the other substrate, and the protrusion surrounds the pixel region. An electro-optical panel formed in a region. 2. The electro-optical panel according to claim 1, wherein the projection is formed along one of an inner peripheral edge and an outer peripheral edge of the sealing material forming region. 3. The projection according to claim 1, wherein the projection has a first projection formed along an inner peripheral edge of the formation region of the sealing material and a second projection formed along both an outer peripheral edge of the sealing material forming area. The electro-optical panel according to claim 1, wherein the sealing material is formed in a region sandwiched between the first protrusion and the second protrusion. 4. An image display comprising a plurality of pixels in which an electro-optical material is sandwiched between a pair of substrates, and the pair of substrates are bonded and fixed to each other with a sealing material. In the electro-optical panel having a region, one of the pair of substrates has a projection that projects toward the other substrate and abuts on the other substrate, and the projection is formed of the pair of substrates. An electro-optical panel formed around a formation region of a conductive material for electrically connecting conductive layers formed respectively. 5. The electro-optical panel according to claim 4, wherein the protrusion is formed so as to surround a region where the conductive material is formed. 6. The method according to claim 1, wherein the protrusion is made of an elastically deformable material and is in a state of being crushed between the pair of substrates. Electro-optical panel. 7. The image forming apparatus according to claim 1, wherein the sealing material is formed so as to at least partially overlap a light shielding film formed around the image display area. Electro-optical panel. 8. The pair of substrates according to claim 1, wherein the pair of substrates includes a transistor array substrate on which pixel electrodes and pixel switching thin film transistors are formed in a matrix, and a counter electrode. An electro-optical panel, comprising: a counter substrate; 9. An enlarged projection display device using the electro-optical panel according to claim 8, comprising: a light source; and a condensing optical system that guides light emitted from the light source to the electro-optical panel.
And a magnifying projection optical system for magnifying and projecting light modulated by the electro-optical panel. 10. The method of manufacturing an electro-optical panel according to claim 1, wherein the protrusion is formed on one of the pair of substrates, and then the sealing material is removed. A method for manufacturing an electro-optical panel, comprising applying and then curing the seal material while pressing the pair of substrates. 11. The method for manufacturing an electro-optical panel according to claim 3, wherein after forming a first protrusion along an inner peripheral edge and a second protrusion along an outer peripheral edge of a region where the sealing material is to be formed. An electro-optical panel, wherein the sealing material is applied to a region sandwiched between the first projection and the second projection, and then the sealing material is cured while pressing the pair of substrates. Production method. 12. The method of manufacturing an electro-optical panel according to claim 4, wherein the projection is formed so as to surround a region where the conductive material is to be formed, and then the region is surrounded by the projection. Applying the conductive material, applying the sealant so as to surround the image display area, and then simultaneously or separately curing the sealant and the conductive material while pressing the pair of substrates. A method for manufacturing an electro-optical panel, comprising: 13. The method for manufacturing an electro-optical panel according to claim 11, wherein the protrusion is formed on one of the pair of substrates by using an elastically deformable material, and then the other is formed on the one of the substrates. A method of manufacturing an electro-optical panel, comprising applying a sealing material, and thereafter curing the sealing material while pressing the pair of substrates. 14. The method according to claim 1, wherein the protrusion is formed of an elastically deformable material on one of the pair of substrates, and a sealant is formed on the other substrate. A method for manufacturing an electro-optical panel, comprising applying and then curing the sealing material while pressing the pair of substrates. 15. An image display comprising a plurality of pixels, wherein an electro-optical substance is sandwiched between a pair of substrates, and the pair of substrates are bonded and fixed to each other with a sealant. In the electro-optical panel having a region, one of the pair of substrates is formed with a protrusion protruding toward the other substrate and abutting on the other substrate, and the protrusion is formed in the image display region. An electro-optical panel, which is scattered at a predetermined position. 16. The electro-optical panel according to claim 15, wherein the projection is formed in a non-opening area through which light does not pass in each of the pixels. 17. The electro-optical panel according to claim 15, wherein the protrusions are formed on the same coordinates in each pixel. 18. The electro-optical panel according to claim 15, wherein the projection has a cylindrical shape. 19. The image display device according to claim 15, wherein the protrusions are formed at a higher density in a peripheral region in the image display region than in a central region. Electro-optical panel. 20. The image display device according to claim 15, wherein the projections are formed at a higher density in one side area in the image display area than in the other side area. Electro-optical panel. 21. The method according to claim 15, wherein the projection is made of an elastically deformable material and is in a state of being crushed between the pair of substrates. Electro-optical panel. 22. The pair of substrates according to claim 15, wherein the pair of substrates includes a transistor array substrate in which pixel electrodes and pixel switching thin film transistors are formed in a matrix, and a counter electrode. An electro-optical panel, comprising: a counter substrate; 23. An enlarged projection display device using the electro-optical panel according to claim 22, comprising: a light source; and a condensing optical system that guides light emitted from the light source to the electro-optical panel. A projection display apparatus comprising: an expansion projection optical system that expands and projects light modulated by an electro-optical panel. 24. The method of manufacturing an electro-optical panel according to claim 15, wherein after forming the protrusion on one of the pair of substrates, the sealing material is removed. A method for manufacturing an electro-optical panel, comprising applying and then curing the sealing material while pressing the pair of substrates. 25. The method of manufacturing an electro-optical panel according to claim 24, wherein the protrusion is formed on one of the pair of substrates by using an elastically deformable material, and then the other is formed on the one of the pair of substrates. A method of manufacturing an electro-optical panel, comprising applying a sealing material, and thereafter curing the sealing material while pressing the pair of substrates. 26. The method of manufacturing an electro-optical panel according to claim 15, wherein the protrusion is formed on one of the pair of substrates by using an elastically deformable material. On the other hand, a method of manufacturing an electro-optical panel, wherein a sealing material is applied to the other substrate, and then the sealing material is cured while pressing the pair of substrates. 27. An electro-optical material sandwiched between a pair of substrates, said pair of substrates being adhered and fixed by a sealing material, and an image display comprising a plurality of pixels in a region where said sealing material is formed. In the electro-optical panel having a region, one of the pair of substrates has a protrusion that projects toward the other substrate and contacts the other substrate, and the protrusion surrounds the pixel region. An electro-optical panel, wherein the electro-optical panel is arranged to face a light-shielding film formed in a region. 28. The electro-optical panel according to claim 27, wherein the projections are arranged so as to fit within a width of the light shielding film in a plan view.