JP5292969B2 - Electro-optical device and electronic apparatus including the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To miniaturize an electro-optic device, while preventing light leakage from an alignment mark. <P>SOLUTION: The electro-optic device includes: a substrate; wiring 400 as a frame light-shielding film, which is formed in a frame area defining a periphery of a pixel area on the substrate, and in which openings 211, 212 are opened or cut out at a predetermined position; alignment marks 221, 222a, 222b, 231 and 232 which are formed in the openings 211, 212; and a mark light-shielding film 300 as an opening light-shielding film, which is formed so as to shield the openings 211, 212 in plan view on the substrate. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

  The present invention relates to an electro-optical device such as a liquid crystal device and an electronic apparatus such as a liquid crystal projector provided with the electro-optical device, and more particularly to a substrate constituting the electro-optical device when the electro-optical device is manufactured. The present invention relates to the technical field of alignment marks for positioning.

  In this type of electro-optical device, an alignment mark for aligning a pair of substrates constituting the electro-optical device is formed on each substrate. For example, in Patent Document 1, one of a pair of substrates has an alignment mark formed of a window frame-shaped opening pattern in the light shielding region of the substrate, and the other substrate has a center-oriented shape. A laminated optical panel is described as an example of an electro-optical device in which an alignment mark having the geometric pattern is formed.

JP 7-92456 A

However, according to the background art described above, since the alignment mark portion has removed the light-shielding film, light leakage from the alignment mark may occur when the distance between the pixel region and the alignment mark is reduced, for example, due to downsizing of the electro-optical device. There is a technical problem that it may occur during image display.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

Application Example 1 An electro-optical device according to this application example includes a substrate, a frame light shielding film having an opening or a notch around the pixel region on the substrate, and an inner side of the opening or the notch. And a light-shielding film formed so as to cover the opening or the notch from the substrate side .

  According to this configuration, on a substrate such as a TFT (Thin Film Transistor) substrate, for example, the frame light-shielding film is formed in a frame region that defines the periphery of the pixel region when viewed in plan on the substrate. . Here, “pixel area” does not mean an area of individual pixels, but means an entire area in which a plurality of pixels are arranged in a matrix, and is typically an “image display area”. It means the area that should be. The frame light-shielding film has an opening for arranging an alignment mark between a predetermined portion, for example, a region where the pixel region is planarly disposed (hereinafter referred to as a seal region), or It may be cut out. Since there is no frame light shielding film at the opening, light can pass through without being shielded by the frame light shielding film. The opening may be located at a corner or a side of the substrate as a predetermined location when viewed in plan on the substrate. Further, the number of openings is not limited to one, and a plurality of openings may be opened or cut out.

  An alignment mark is formed in the opening as viewed in plan on the substrate. The electro-optical device includes, for example, a counter substrate facing the TFT substrate, for example, and an alignment mark that is paired with an alignment mark formed on the TFT substrate is formed on the counter substrate.

  The opening light shielding film is formed in a layer different from the layer in which the alignment mark is formed so as to cover the opening when viewed in plan on the substrate.

  According to the inventor's research, in general, an electro-optical device is formed by forming an element such as a TFT on a mother substrate such as a large glass substrate and bonding a plurality of counter substrates on the mother substrate on which the element is formed. In the case of manufacturing an alignment mark, an alignment mark must be provided for each counter substrate.

  As the electro-optical device is miniaturized, light leakage from the alignment mark may occur when the distance between the pixel region and the alignment mark is reduced. If, for example, an alignment mark is formed in the seal area in order to increase the distance between the pixel area and the alignment mark, it has been found that the alignment mark cannot be correctly recognized due to the influence of the seal material.

  However, in this application example, the opening portion light shielding is performed separately from the frame light shielding film (that is, in a layer different from the frame light shielding film) so as to cover the opening portion where the alignment mark is formed in plan view on the substrate. A film is formed. For this reason, even if the distance between the pixel region and the alignment mark is reduced, light leakage from the alignment mark can be prevented by the opening light shielding film. On the other hand, if the reflectance of the opening light shielding film is made lower than that of the alignment mark, the alignment mark can be read using the contrast difference, and alignment can be achieved.

  In addition, if the opening light shielding film is formed in the same layer as the layer in which the wiring, electric elements, etc. constituting the drive circuit for driving the electro-optical device are formed, the opening light shielding film is formed. By doing so, it is possible to eliminate an increase in the height of the electro-optical device, and it is also possible to avoid a complicated structure and advanced manufacturing process on the substrate.

  Application Example 2 In the electro-optical device according to the application example described above, it is preferable that the opening light shielding film includes a material having a lower reflectance than a material forming the alignment mark.

  According to this aspect, the alignment mark can be read using the contrast difference caused by the difference in reflectance. The opening light shielding film may be configured to include a material having a light absorption rate higher than that of the material forming the alignment mark.

  Application Example 3 The electro-optical device according to the application example further includes a data line and a scanning line that intersect with each other in the pixel region, and the opening light shielding film is formed in the same layer as the data line or the scanning line. It is preferable.

  According to this aspect, by forming the opening light shielding film, it is possible to prevent the height of the electro-optical device from increasing, which is very advantageous in practice. In addition, in the manufacturing process of the electro-optical device, the opening light shielding film can be formed at the same time as the data line or the scanning line, and an increase in the number of processes for forming the opening light shielding film can be prevented. This is very advantageous in practice.

  Application Example 4 In the electro-optical device according to the application example, the opening is opened at a corner of the substrate as the predetermined portion.

  According to this aspect, the opening is opened at the corner of the substrate when viewed in plan on the substrate, that is, the alignment mark is formed at the corner of the substrate. The openings are typically opened at the four corners of the substrate or at the two corners located on a diagonal line.

  Application Example 5 In the electro-optical device according to the application example described above, the alignment mark is formed on the substrate above the opening light shielding film.

  According to this aspect, the alignment mark is formed on the upper layer side from the opening light shielding film. In other words, the layer in which the opening light shielding film is formed is disposed between the substrate and the layer in which the alignment mark is formed. Therefore, the light incident from the opening side is shielded by the opening light shielding film, and does not exit (light leak) to the substrate side. Alternatively, light incident from the substrate side is shielded by the opening light shielding film and does not exit (light leak) to the opening side.

  Application Example 6 An electronic apparatus according to this application example includes the electro-optical device according to the application example described above (including various aspects thereof).

According to this configuration, since the electro-optical device according to the application example is provided, a projection display device, a mobile phone, an electronic notebook, a word processor, a view, which is suitable for miniaturization while preventing light leakage from the alignment mark. Various electronic devices such as a finder type or a monitor direct-view type video tape recorder, a workstation, a videophone, a POS terminal, and a touch panel can be realized.

  Hereinafter, embodiments of the electro-optical device and the electronic apparatus according to the invention will be described with reference to FIGS. 1 to 7. In the following drawings, the scales are different for each layer and each member so that each layer and each member can be recognized on the drawing. In this embodiment, as an example of an electro-optical device, a TFT active matrix driving type liquid crystal device with a built-in driving circuit is taken as an example.

  First, the overall configuration of the liquid crystal device according to the present embodiment will be described with reference to FIGS. 1 and 2. FIG. 1 is a plan view of the TFT array substrate viewed from the side of the counter substrate together with the components formed thereon, and FIG. 2 is a cross-sectional view taken along the line H-H ′ of FIG. 1.

  1 and 2, in the liquid crystal device 100 according to the present embodiment, the TFT array substrate 10 and the counter substrate 20 are arranged to face each other. The TFT array substrate 10 is made of a transparent substrate such as a quartz substrate, a glass substrate, or a silicon substrate, and the counter substrate 20 is made of a transparent substrate such as a quartz substrate or a glass substrate, for example. A liquid crystal layer 50 is sealed between the TFT array substrate 10 and the counter substrate 20, and the TFT array substrate 10 and the counter substrate 20 are surrounded by an image display region 10a as an example of the “pixel region” according to the present invention. Are adhered to each other by a sealing material 52 provided on the surface.

  The sealing material 52 is made of, for example, an ultraviolet curable resin, a thermosetting resin, or an ultraviolet / heat combination type curable resin for bonding the two substrates, and is applied to the TFT array substrate 10 in the manufacturing process, and then irradiated with ultraviolet rays. And cured by heating or the like. In the sealing material 52, a gap material such as glass fiber or glass bead for mixing the TFT array substrate 10 and the counter substrate 20 (that is, the gap) to a predetermined value is mixed. Note that the gap material may be arranged in the image display region 10a or a peripheral region located around the image display region 10a in addition to or instead of the material mixed in the seal material 52.

  In FIG. 1, a light-shielding frame light-shielding film 53 for defining the image display region 10a is provided on the counter substrate 20 side in parallel with the inside of the seal region 52a where the sealant 52 is disposed. However, part or all of the frame light shielding film 53 may be provided as a built-in light shielding film on the TFT array substrate 10 side. The frame region 53a in which the frame light shielding film 53 is formed has a rectangular frame shape when viewed in plan on the TFT array substrate.

  In the peripheral region, the data line driving circuit 101 and the external circuit connection terminal 102 are provided along one side of the TFT array substrate 10 in a region located outside the sealing region 52 a where the sealing material 52 is disposed. The sampling circuit 7 is provided so as to be covered with the frame light-shielding film 53 on the inner side of the seal region 52a along the one side. The scanning line driving circuit 104 is provided in the frame region 53a inside the seal region 52a along two sides adjacent to this one side so as to be covered with the frame light shielding film 53. Further, alignment marks to be described later are provided between the corners of the frame light-shielding film 53 and the seal region 52a.

  On the TFT array substrate 10, vertical conduction terminals 106 for connecting the two substrates with the vertical conduction material 107 are arranged in regions facing the four corner portions of the counter substrate 20. Thus, electrical conduction can be established between the TFT array substrate 10 and the counter substrate 20. Further, a lead wiring 90 for electrically connecting the external circuit connection terminal 102 to the data line driving circuit 101, the scanning line driving circuit 104, the vertical conduction terminal 106, and the like is formed.

  In FIG. 2, on the TFT array substrate 10, a laminated structure in which pixel switching TFTs as drive elements, wiring lines such as scanning lines and data lines are formed is formed. Although the detailed structure of this laminated structure is not shown in FIG. 2, pixel electrodes 9a made of a transparent material such as ITO (Indium Tin Oxide) are provided on the laminated structure in a predetermined pattern for each pixel. It is formed in an island shape.

  The pixel electrode 9a is formed in the image display region 10a on the TFT array substrate 10 so as to face a counter electrode 21 described later. On the surface of the TFT array substrate 10 facing the liquid crystal layer 50, that is, on the pixel electrode 9a, an alignment film 16 is formed so as to cover the pixel electrode 9a.

  A light shielding film 23 is formed on the surface of the counter substrate 20 facing the TFT array substrate 10. For example, the light shielding film 23 is formed in a lattice shape when viewed in plan on the facing surface of the facing substrate 20. In the counter substrate 20, a non-opening area is defined by the light shielding film 23, and an area partitioned by the light shielding film 23 is an opening area through which light emitted from a projector lamp or a direct viewing backlight is transmitted. The light shielding film 23 may be formed in a stripe shape, and the non-opening region may be defined by the light shielding film 23 and various components such as data lines provided on the TFT array substrate 10 side.

  On the light shielding film 23, a counter electrode 21 made of a transparent material such as ITO is formed so as to face the plurality of pixel electrodes 9a. In order to perform color display in the image display region 10a on the light shielding film 23, a color filter (not shown in FIG. 2) may be formed in a region including a part of the opening region and the non-opening region. An alignment film 22 is formed on the counter electrode 21 on the counter surface of the counter substrate 20.

  In addition to the data line driving circuit 101, the scanning line driving circuit 104, the sampling circuit 7, etc., a plurality of data lines are pre-set at a predetermined voltage level on the TFT array substrate 10 shown in FIGS. A precharge circuit that supplies the charge signal before the image signal, an inspection circuit for inspecting the quality, defects, and the like of the liquid crystal device 100 during manufacture or at the time of shipment may be formed.

  Next, the configuration of the data line driving circuit 101 and the scanning line driving circuit 104 for driving the liquid crystal device 100 will be specifically described with reference to FIG. FIG. 3 is a schematic configuration diagram illustrating a schematic configuration of a main part of the liquid crystal device according to the present embodiment.

  As shown in FIG. 3, the image display area 10a of the TFT array substrate 10 includes a plurality of pixel portions 100c arranged in a matrix, a plurality of scanning lines 100a and a plurality of data lines 100b arranged so as to cross each other. And are formed. Although not shown here, each of the plurality of pixel portions 100c includes a pixel electrode 9a, a TFT for switching control of the pixel electrode 9a, and a storage capacitor for maintaining a voltage applied to the pixel electrode 9a. And is configured.

  The data line driving circuit 101 supplies the input start pulse DX, data transfer clock CLX, and sampling circuit driving signal to the sampling circuit 7. The sampling circuit 7 samples the input data signal Ds according to the sampling circuit drive signal. As a result, the data signal di (i = 1, 2, 3,..., M) is supplied to the data line 100b of the liquid crystal device 100. The scanning line driving circuit 104 sequentially outputs a scanning signal Gj (j = 1, 2, 3,..., N) from each stage based on the input start pulse DY and scanning side transfer clock CLY.

  The scanning line driving circuit 104 and the data line driving circuit 101 receive and output various signals in addition to those described above, but those not particularly related to the present embodiment will not be described.

  Next, an alignment mark in the liquid crystal device 100 according to the present embodiment will be described with reference to FIGS. FIG. 4 is an explanatory view showing the position of the alignment mark in the liquid crystal device, FIG. 5 is a plan view of the configuration of the alignment mark as seen from the counter substrate side, and FIG. 6 is an AA view of FIG. FIG. In FIGS. 4 to 6, for convenience of explanation, only the components related to the alignment mark are displayed, and the other components are omitted.

  First, as shown in FIG. 4, the alignment mark 200 is provided at a corner of the frame region 53a where the frame light shielding film 53 is not provided. 4 shows the alignment mark 200 provided at the upper left corner in FIG. 1, the liquid crystal device according to the present embodiment is provided with the same alignment mark 200 at the other three corners.

  Next, the configuration of the alignment mark 200 will be specifically described with reference to FIGS. 5 and 6. As shown in FIG. 5, the alignment mark 200 includes first alignment marks 221 and 231 for measuring the XY displacement amount and the θ displacement amount provided in the opening 211, and the assembly displacement amount provided in the opening 212. The second alignment marks 222a and 222b and 232 are used for measuring. These openings 211 and 212 are provided in the wiring 400.

  As shown in FIG. 6, the first alignment mark 221 is formed on the TFT array substrate 10, and the first alignment mark 231 is formed on the counter substrate 20. The second alignment marks 222a and 222b are formed in the same layer as the layer on which the first alignment mark 221 is formed on the TFT array substrate 10. The second alignment mark 232 is formed in the same layer as the layer where the first alignment mark 231 is formed on the counter substrate 20.

  The first alignment mark 221 and the second alignment marks 222a and 222b are formed including aluminum. The first alignment mark 231 and the second alignment mark 232 are formed including aluminum-chromium alloy or chromium.

  As shown in FIG. 5, a mark light-shielding film 300 as an example of an “opening light-shielding film” according to the present invention is formed so as to cover the openings 211 and 212 when viewed in plan on the substrate. As shown in FIG. 6, the mark light-shielding film 300 is formed on the TFT array substrate 10 below the layer on which the first alignment mark 221 is formed, that is, on the TFT array substrate 10 side. Although not shown here, the scanning line 100a or the data line 100b is formed in the same layer as the layer where the mark light shielding film 300 is formed. The mark light-shielding film 300 is provided so as to completely cover the openings 211 and 212 opened in the wiring 400 from the TFT array substrate 10 side.

  The mark light-shielding film 300 has a three-layer structure of, for example, a layer made of aluminum, a layer made of titanium nitride, and a layer made of plasma nitride film in order from the lower layer.

  By arranging a plurality of wirings including the wiring 400 as an example of the “frame light-shielding film” around the openings 211 and 212, light shielding is performed on a portion excluding the alignment mark 200. That is, by arranging a plurality of wirings, it is possible to obtain the same effect as when the frame light shielding film 53 is provided in the entire frame region 53a. The openings 211 and 212 are opened by not arranging the wiring in the portion where the alignment mark 200 is formed.

  The wiring 400 has a two-layer structure of a layer 400b containing aluminum as a lower layer and a layer 400a containing titanium nitride as an upper layer. Although not shown here, wirings are formed in other layers so as to cover the gaps between the wirings in FIG. 5 is specifically a signal wiring or a power supply wiring such as an inspection circuit, but depending on the position where the alignment mark 200 is formed, for example, the data line driving circuit 101, the scanning line, etc. Signal wiring and power supply wiring such as the drive circuit 104 and the sampling circuit 7 are arranged around the alignment mark 200.

  As shown in FIG. 6, unlike the wiring 400 formed in the same layer, the first alignment mark 221 does not have a layer containing titanium nitride. This is because the reflectance of the first alignment mark 221 with respect to the wiring 400 is improved by forming the first alignment mark 221 only with a layer containing aluminum.

  An interlayer insulating film 41 is provided between the TFT array substrate 10 and the layer where the mark light shielding film 300 is formed, and the layer where the mark light shielding film 300 is formed, the first alignment mark 221 and the like are formed. An interlayer insulating film 42 is provided between the layers, and an interlayer insulating film 43 is provided on the layer on which the first alignment marks 221 and the like are formed to prevent a short circuit between the elements. ing. Further, in these various interlayer insulating films 41, 42 and 43, contact holes and the like for electrically connecting wirings and the like included in each layer are formed.

As described above, the first alignment mark 221 and the second alignment marks 222a and 222b are formed to include aluminum having a relatively high reflectance, and the first alignment mark 231 and the second alignment mark 232 have a relatively high reflectance. It is made of a high aluminum-chromium alloy or chromium. On the other hand, the mark light-shielding film 300 has a relatively low reflectance, for example, a plasma nitride film formed in the uppermost layer. Therefore, when alignment is performed, when the alignment mark 200 is viewed from above the counter substrate 20, a contrast difference is generated due to a difference in reflectance, and the alignment mark 200 can be recognized.
According to such a liquid crystal device 100, the mark light-shielding film 300 can prevent light incident from the counter substrate 20 side from leaking from the openings 211 and 212 of the alignment mark 200 to the TFT array substrate 10 side. it can. As a result, it is possible to prevent problems such as malfunction of the TFT (thin film transistor) disposed in the pixel region or the peripheral region in the TFT array substrate 10 due to leaked light.
Alternatively, it is possible to prevent light incident from the TFT array substrate 10 side from leaking from the openings 211 and 212 of the alignment mark 200 to the counter substrate 20 side. Thereby, it is possible to prevent the optical characteristics of the liquid crystal device 100 from being changed by the leaked light.

<Electronic equipment>
Next, a case where the liquid crystal device 100 described above is applied to a projector which is an example of an electronic device will be described with reference to FIG. The liquid crystal device 100 described above is used as a light valve of a projector. FIG. 7 is a plan view showing a configuration example of the projector.

  As shown in FIG. 7, a lamp unit 1102 including a white light source such as a halogen lamp is provided inside the projector 1100 of the present embodiment. The projection light emitted from the lamp unit 1102 is separated into three primary colors of RGB by four mirrors 1106 and two dichroic mirrors 1108 arranged in the light guide 1104, and serves as a light valve corresponding to each primary color. The light enters the liquid crystal devices 1110R, 1110B, and 1110G.

  The liquid crystal devices 1110R, 1110B, and 1110G have the same configuration as that of the liquid crystal device 100 described above, and are driven by R, G, and B primary color signals supplied from the image signal processing circuit. . The light modulated by these liquid crystal devices 1110R, 1110B, and 1110G enters the dichroic prism 1112 from three directions. In the dichroic prism 1112, R and B light is refracted at 90 degrees, while G light travels straight. Accordingly, as a result of the synthesis of the images of the respective colors, a color image is projected onto the screen or the like via the projection lens 1114.

  Here, when attention is paid to the display images by the liquid crystal devices 1110R, 1110B, and 1110G, the display images by the liquid crystal devices 1110R and 1110B need to be horizontally reversed with respect to the display images by the liquid crystal device 1110G.

  The liquid crystal devices 1110R, 1110B, and 1110G receive light corresponding to the primary colors of R, G, and B by the four mirrors 1106 and the two dichroic mirrors 1108. Therefore, it is not necessary to provide a color filter. .

  The liquid crystal devices 1110R, 1110B, and 1110G are arranged with respect to the dichroic prism 1112 so that light corresponding to the primary colors of R, G, and B is incident from the counter substrate side. Furthermore, it goes without saying that optical elements such as polarizing elements are arranged on the light incident side and the light exit side of each of the liquid crystal devices 1110R, 1110B, and 1110G.

  Such a projector 1100 includes liquid crystal devices 1110R, 1110B, and 1110G as light valves in which light leakage from the openings 211 and 212 of the alignment mark 200 is prevented, so that stable operation and excellent projection quality are achieved. And have.

  In addition to the electronic device described with reference to FIG. 7, a mobile personal computer, a mobile phone, a liquid crystal television, a viewfinder type or a monitor direct view type video tape recorder, a car navigation device, a pager, and an electronic notebook , Calculators, word processors, workstations, videophones, POS terminals, devices with touch panels, and the like. Needless to say, the liquid crystal device 100 of the above embodiment can be applied to these various electronic devices.

  In addition to the liquid crystal device 100 described in the above-described embodiment, the present invention also includes a reflective liquid crystal device (LCOS), a plasma display (PDP), and a field emission display (FED, SED) in which elements are formed on a silicon substrate. It can also be applied to organic EL displays, digital micromirror devices (DMD), electrophoresis apparatuses, and the like.

  The present invention is not limited to the above-described embodiments, and can be appropriately changed without departing from the spirit or idea of the invention that can be read from the claims and the entire specification. An optical device and an electronic apparatus including the electro-optical device are also included in the technical scope of the present invention.

It is a top view which shows the whole structure of the liquid crystal device which concerns on this embodiment. It is the H-H 'sectional view taken on the line of FIG. It is a schematic block diagram which shows schematic structure of the principal part of the liquid crystal device which concerns on this embodiment. It is explanatory drawing which shows the position of the alignment mark which concerns on this embodiment. It is a top view which shows the structure of the alignment mark which concerns on this embodiment. FIG. 6 is a cross-sectional view taken along line A-A ′ of FIG. 5. It is a top view which shows the structure of the projector which is an example of the electronic device to which the electro-optical apparatus is applied.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... TFT array substrate, 20 ... Counter substrate, 52a ... Sealing region, 53a ... Frame region, 100 ... Liquid crystal device as electro-optical device, 211, 212 ... Opening, 221, 231 ... First alignment mark, 222a, 222b , 232... Second alignment mark, 300... Mark light shielding film as an opening light shielding film.

Claims (7)

A substrate,
A scanning line provided above the first surface of the substrate;
A data line provided above the first surface and intersecting the scanning line;
A first light-shielding film located in the same layer as the scanning line or the data line;
An insulating film provided above the first light-shielding film;
An alignment mark provided above the insulating film;
A second light-shielding film provided above the insulating film,
In the plan view of the substrate viewed from a direction perpendicular to the first surface,
A pixel area for displaying an image;
A peripheral region located around the pixel region,
The second light-shielding film has an opening or a notch in a portion overlapping the first light-shielding film in the vicinity of the corner of the substrate in the peripheral region,
The alignment mark is located inside the opening or the notch in a plan view seen from a direction perpendicular to the first surface,
An electro-optical device, wherein a reflectance of a surface of the first light shielding film on a side opposite to the substrate is lower than a reflectance of a surface of the alignment mark on a side opposite to the substrate. The electro-optical device according to claim 1.
The electro-optical device, wherein the first light shielding film is a film in which a plurality of layers are stacked. The electro-optical device according to claim 2.
The electro-optical device, wherein the plurality of layers include a layer made of aluminum and a layer made of titanium nitride. The electro-optical device according to any one of claims 1 to 3,
The electro-optical device, wherein the insulating film contains silicon nitride. The electro-optical device according to any one of claims 1 to 4,
The electro-optical device, wherein the alignment mark and the second light shielding film are located in the same layer. The electro-optical device according to claim 5.
The second light shielding film is a film in which a plurality of layers are laminated,
The alignment mark is a film having fewer layers than the second light shielding film,
The electro-optical device according to claim 1, wherein a reflectance of a surface of the alignment mark opposite to the substrate is different from a reflectance of a surface of the second light shielding film opposite to the substrate. An electronic apparatus comprising the electro-optical device according to any one of claims 1 to 6.