JP5496437B2 - Ultrasonic sensor module mounting structure - Google Patents

Ultrasonic sensor module mounting structure Download PDF

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Publication number
JP5496437B2
JP5496437B2 JP2013556036A JP2013556036A JP5496437B2 JP 5496437 B2 JP5496437 B2 JP 5496437B2 JP 2013556036 A JP2013556036 A JP 2013556036A JP 2013556036 A JP2013556036 A JP 2013556036A JP 5496437 B2 JP5496437 B2 JP 5496437B2
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sensor module
ultrasonic sensor
bumper
attachment
back surface
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JPWO2013114466A1 (en
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井上　　悟
睦生 関谷
幸生 西本
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R19/00—Wheel guards; Radiator guards, e.g. grilles; Obstruction removers; Fittings damping bouncing force in collisions
    • B60R19/02—Bumpers, i.e. impact receiving or absorbing members for protecting vehicles or fending off blows from other vehicles or objects
    • B60R19/48—Bumpers, i.e. impact receiving or absorbing members for protecting vehicles or fending off blows from other vehicles or objects combined with, or convertible into, other devices or objects, e.g. bumpers combined with road brushes, bumpers convertible into beds
    • B60R19/483—Bumpers, i.e. impact receiving or absorbing members for protecting vehicles or fending off blows from other vehicles or objects combined with, or convertible into, other devices or objects, e.g. bumpers combined with road brushes, bumpers convertible into beds with obstacle sensors of electric or electronic type
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/52—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00
    • G01S7/521—Constructional features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S15/00—Systems using the reflection or reradiation of acoustic waves, e.g. sonar systems
    • G01S15/88—Sonar systems specially adapted for specific applications
    • G01S15/93—Sonar systems specially adapted for specific applications for anti-collision purposes
    • G01S15/931—Sonar systems specially adapted for specific applications for anti-collision purposes of land vehicles
    • G01S2015/937—Sonar systems specially adapted for specific applications for anti-collision purposes of land vehicles sensor installation details
    • G01S2015/938—Sonar systems specially adapted for specific applications for anti-collision purposes of land vehicles sensor installation details in the bumper area

Description

この発明は、超音波センサモジュールの前面とバンパ表面が略面一になるようにバンパ裏面で固定する構造のベゼルレス型の超音波センサモジュールの取り付け構造に関する。   The present invention relates to a mounting structure for a bezelless ultrasonic sensor module having a structure in which the front surface of the ultrasonic sensor module is fixed on the back surface of the bumper so that the front surface of the bumper is substantially flush with the bumper surface.

従来、この種のベゼルレス型取り付け構造では、特許文献１に開示されるように、バンパの裏面における貫通孔の周辺に取り付けられた固定部材によって、超音波センサモジュールの振動面がバンパ表面と略面一になるように固定されている。この固定部材は、超音波センサモジュールの外周面を取り囲む円筒状のセンサ固定部と、バンパの裏面に固定されるバンパ固定部と、これらセンサ固定部とバンパ固定部とを連結する連結部とを有しており、バンパに対する超音波センサモジュールの高さ位置が位置決めされている。   Conventionally, in this type of bezel-less mounting structure, as disclosed in Patent Document 1, the vibration surface of the ultrasonic sensor module is substantially flush with the bumper surface by a fixing member attached around the through hole on the back surface of the bumper. It is fixed to become one. The fixing member includes a cylindrical sensor fixing portion that surrounds the outer peripheral surface of the ultrasonic sensor module, a bumper fixing portion that is fixed to the back surface of the bumper, and a connecting portion that connects the sensor fixing portion and the bumper fixing portion. And the height position of the ultrasonic sensor module with respect to the bumper is positioned.

特開２００９−２１４６１０号公報JP 2009-214610 A

従来の取り付け構造は以上のように構成されているので、超音波センサモジュールの高さ、バンパの厚み等が変わった場合、バンパ裏面に沿って超音波センサモジュールを固定することが困難であるという課題があった。従って、高さの異なる超音波センサモジュールを使用する場合、固定部材を兼用することができず、高さに応じた別の固定部材を必要とすることになるため、標準化することができなかった。   Since the conventional mounting structure is configured as described above, it is difficult to fix the ultrasonic sensor module along the back surface of the bumper when the height of the ultrasonic sensor module, the thickness of the bumper, or the like changes. There was a problem. Therefore, when using ultrasonic sensor modules having different heights, the fixing member cannot be used together, and another fixing member corresponding to the height is required. .

この発明は、上記のような課題を解決するためになされたもので、超音波センサモジュールの高さおよびバンパの形状等に拘らず、バンパ裏面に沿って超音波センサモジュールを固定することを目的とする。   The present invention has been made to solve the above-described problems, and aims to fix the ultrasonic sensor module along the back surface of the bumper regardless of the height of the ultrasonic sensor module and the shape of the bumper. And

この発明の超音波センサモジュールの取り付け構造は、超音波センサモジュールを内包する有底筒状のキャップ部と、キャップ部の開放端面の複数箇所から軸方向に突出した複数の脚部と、個々の脚部の先端側に形成され、バンパの裏面に接着する接着部と、キャップ部と脚部との境界、および脚部と接着部との境界を他の部分より薄い肉厚にして屈曲可能にした屈曲部とを有したアタッチメントを、バンパ裏面に接着固定するようにしたものである。   The ultrasonic sensor module mounting structure according to the present invention includes a bottomed cylindrical cap portion containing the ultrasonic sensor module, a plurality of leg portions protruding in the axial direction from a plurality of locations on the open end surface of the cap portion, It is formed on the tip side of the leg, and can be bent with a thinner thickness than the other part, the boundary between the adhesive part that adheres to the back of the bumper, the boundary between the cap part and the leg part, and the leg part and the adhesive part The attachment having the bent portion is bonded and fixed to the back surface of the bumper.

この発明によれば、屈曲部の屈曲により、超音波センサモジュールの高さおよびバンパの形状等に合わせて脚部および接着部を任意の角度で開脚することができるので、接着部とバンパ面の倣いが容易になる。よって、バンパ裏面に沿って超音波センサモジュールを固定することができ、取り付け作業が容易になると共に接着の信頼性も向上する。また、超音波センサモジュールの高さおよびバンパの形状等に拘らず、アタッチメントを標準化することができる。   According to the present invention, the leg portion and the adhesive portion can be opened at an arbitrary angle in accordance with the height of the ultrasonic sensor module, the shape of the bumper, and the like by bending of the bent portion. Is easy to copy. Therefore, the ultrasonic sensor module can be fixed along the back surface of the bumper, so that the mounting operation is facilitated and the reliability of bonding is improved. Further, the attachment can be standardized regardless of the height of the ultrasonic sensor module, the shape of the bumper, and the like.

この発明の実施の形態１を示す各構成要素のバンパ取り付け前の状態を示し、図１（ａ）は正面図、図１（ｂ）は平面図、図１（ｃ）は側面図である。The state before each bumper attachment of each component which shows Embodiment 1 of this invention is shown, Fig.1 (a) is a front view, FIG.1 (b) is a top view, FIG.1 (c) is a side view. 実施の形態１を示す各構成要素をバンパに取り付けた状態を示し、図２（ａ）は正面図、図２（ｂ）は平面図、図２（ｃ）は側面図である。FIG. 2A is a front view, FIG. 2B is a plan view, and FIG. 2C is a side view, showing a state in which each component showing Embodiment 1 is attached to a bumper. 実施の形態１を示す各構成要素をバンパに取り付けた状態での荷重を示し、図３（ａ）は正面図、図３（ｂ）は平面図、図３（ｃ）は側面図である。The load in the state which attached each component which shows Embodiment 1 to the bumper is shown, Fig.3 (a) is a front view, FIG.3 (b) is a top view, FIG.3 (c) is a side view. 高さの異なる超音波センサモジュールをバンパに取り付けた状態を示す正面図である。It is a front view which shows the state which attached the ultrasonic sensor module from which height differs to a bumper. 曲面状のバンパに超音波センサモジュールを取り付けた状態を示し、図５（ａ）は正面図、図５（ｂ）はホルダの断面拡大図である。The state which attached the ultrasonic sensor module to the curved bumper is shown, Fig.5 (a) is a front view, FIG.5 (b) is a cross-sectional enlarged view of a holder. 傾斜したバンパに超音波センサモジュールを取り付けた状態を示し、図６（ａ）は正面図、図６（ｂ）はホルダの断面拡大図である。The state which attached the ultrasonic sensor module to the inclined bumper is shown, Fig.6 (a) is a front view, FIG.6 (b) is a cross-sectional enlarged view of a holder. この発明の実施の形態２を示す各構成要素をバンパに取り付けた状態を示し、図７（ａ）は正面図、図７（ｂ）は平面図、図７（ｃ）は側面図である。FIG. 7 (a) is a front view, FIG. 7 (b) is a plan view, and FIG. 7 (c) is a side view showing a state in which each component showing Embodiment 2 of the present invention is attached to a bumper. この発明の実施の形態３を示す各構成要素のバンパ取り付け前の状態を示し、図８（ａ）は正面図、図８（ｂ）は平面図、図８（ｃ）は側面図である。The state before each bumper attachment of each component which shows Embodiment 3 of this invention is shown, Fig.8 (a) is a front view, FIG.8 (b) is a top view, FIG.8 (c) is a side view. 実施の形態３を示す各構成要素をバンパに取り付けた状態を示し、図９（ａ）は正面図、図９（ｂ）は平面図、図９（ｃ）は側面図である。FIG. 9A is a front view, FIG. 9B is a plan view, and FIG. 9C is a side view, showing a state in which each constituent element showing Embodiment 3 is attached to a bumper.

以下、この発明をより詳細に説明するために、この発明を実施するための形態について、添付の図面に従って説明する。
実施の形態１．
図１および図２に示すように、実施の形態１に係る取り付け構造により、超音波センサモジュール１０をバンパ１に取り付ける。この取り付け構造は、バンパ１と超音波センサモジュール１０との間に介装されるホルダ２０と、超音波センサモジュール１０をバンパ１の裏面に固定するアタッチメント３０とから構成される。
なお、図１（ａ）のバンパ１、ホルダ２０およびアタッチメント３０は図１（ｂ）のＡＡ線に沿って切断した断面を示す。同様に図２（ａ）のバンパ１、ホルダ２０およびアタッチメント３０は図２（ｂ）のＢＢ線に沿って切断した断面を示す。Hereinafter, in order to explain the present invention in more detail, modes for carrying out the present invention will be described with reference to the accompanying drawings.
Embodiment 1 FIG.
As shown in FIGS. 1 and 2, the ultrasonic sensor module 10 is attached to the bumper 1 by the attachment structure according to the first embodiment. This attachment structure includes a holder 20 interposed between the bumper 1 and the ultrasonic sensor module 10 and an attachment 30 that fixes the ultrasonic sensor module 10 to the back surface of the bumper 1.
In addition, the bumper 1, the holder 20, and the attachment 30 of FIG. 1A show a cross section cut along the AA line of FIG. Similarly, the bumper 1, the holder 20, and the attachment 30 in FIG. 2A show a cross section cut along the line BB in FIG. 2B.

超音波センサモジュール１０は、バンパ１に形成された挿入穴２に挿入する形状の挿入部１１が形成され、その挿入部１１の基部に挿入穴２の径よりも大きな径の掛止部１２が形成されている。この挿入部１１の前面が超音波を出力する振動面である。また、超音波センサモジュール１０の外周面にはコネクタ１３と２個のフック１４がそれぞれ突設されている。   In the ultrasonic sensor module 10, an insertion portion 11 having a shape to be inserted into the insertion hole 2 formed in the bumper 1 is formed, and a hooking portion 12 having a diameter larger than the diameter of the insertion hole 2 is formed at the base of the insertion portion 11. Is formed. The front surface of the insertion portion 11 is a vibration surface that outputs ultrasonic waves. A connector 13 and two hooks 14 project from the outer peripheral surface of the ultrasonic sensor module 10.

ホルダ２０は、例えばシリコーンゴム等で形成されており、超音波センサモジュール１０の挿入部１１を挿入する筒状部２１と、バンパ１に対向する掛止部１２の表面を覆う平面部２２とを有する。なお、挿入部１１をバンパ１の挿入穴２に挿入したときに、バンパ１の表面と挿入部１１の前面とが面一になるよう、予め平面部２２の厚みを調整しておく。   The holder 20 is formed of, for example, silicone rubber, and includes a cylindrical portion 21 into which the insertion portion 11 of the ultrasonic sensor module 10 is inserted, and a flat portion 22 that covers the surface of the latching portion 12 that faces the bumper 1. Have. In addition, when the insertion part 11 is inserted in the insertion hole 2 of the bumper 1, the thickness of the plane part 22 is adjusted in advance so that the surface of the bumper 1 and the front surface of the insertion part 11 are flush with each other.

アタッチメント３０は、例えば樹脂等で形成されており、超音波センサモジュール１０を内包する有底筒状のキャップ部３１と、キャップ部３１の開放端面の３箇所から軸方向に突出した３本の脚部３２と、個々の脚部３２の先端側をバンパ１の裏面に接着固定するための接着部３３とを有する。脚部３２は固い一方、キャップ部３１と脚部３２の境界、および脚部３２と接着部３３との境界には、他の部分より薄い肉厚で屈曲可能な屈曲部３４が形成されている。この屈曲部３４は樹脂成形で容易に実現できるので、アタッチメント３０の一体成形が可能である。なお、図示例では脚部３２を３本形成したが、これに限定されるものではなく、少なくとも２本以上形成すればよい。キャップ部３１の筒形状は円形以外であってもよい。また、屈曲部３４は肉厚を薄くして屈曲可能であればよく、図示例の形状に限定されるものではない。   The attachment 30 is made of, for example, resin or the like, and has a bottomed cylindrical cap portion 31 containing the ultrasonic sensor module 10 and three legs protruding in the axial direction from three locations of the open end surface of the cap portion 31. And a bonding portion 33 for bonding and fixing the distal end side of each leg portion 32 to the back surface of the bumper 1. While the leg portion 32 is hard, a bent portion 34 that is thinner and thinner than other portions is formed at the boundary between the cap portion 31 and the leg portion 32 and at the boundary between the leg portion 32 and the adhesive portion 33. . Since the bent part 34 can be easily realized by resin molding, the attachment 30 can be integrally molded. In the illustrated example, three leg portions 32 are formed. However, the present invention is not limited to this, and at least two leg portions may be formed. The cylindrical shape of the cap portion 31 may be other than a circle. Moreover, the bending part 34 should just be thin and can be bent, and is not limited to the shape of the example of illustration.

キャップ部３１の周面には、コネクタ１３を避けるための切欠部３５と、フック１４を嵌めてガイドするための溝穴部３６とが形成されている。なお、フック１４を溝穴部３６に挿入しやすいよう、溝穴部３６を脚部３２まで延ばしてもよい。また、脚部３２を配設する位置は任意であるが、コネクタ１３を避けるためにコネクタ１３の突出方向とは異なる方向に脚部３２を配設することが好ましい。また、図示例の超音波センサモジュール１０が側方にコネクタ１３を備える形状であるため、これに合わせてキャップ部３１の周面に切欠部３５を形成したが、これに限定されるものではなく、キャップ部３１の任意の位置にコネクタ１３を通すための切欠部３５を形成すればよい。例えば、図１（ｂ）ではキャップ部３１の周面に切欠部３５を形成すると共に、キャップ部３１の頭部にも略円形の切欠部を形成しており、超音波センサモジュール１０が頭部にコネクタ（不図示）を備える形状の場合にこの略円形の切欠部にコネクタ（不図示）を通すことが可能である。また例えば、後述する図３のようにキャップ部３１の周面にのみ切欠部３５を形成してもよい。   A cutout portion 35 for avoiding the connector 13 and a slot portion 36 for fitting and guiding the hook 14 are formed on the peripheral surface of the cap portion 31. The slot portion 36 may be extended to the leg portion 32 so that the hook 14 can be easily inserted into the slot portion 36. Further, the position where the leg portion 32 is disposed is arbitrary, but it is preferable to dispose the leg portion 32 in a direction different from the protruding direction of the connector 13 in order to avoid the connector 13. Moreover, since the ultrasonic sensor module 10 in the illustrated example has a shape including the connector 13 on the side, the cutout portion 35 is formed on the peripheral surface of the cap portion 31 according to the shape, but the embodiment is not limited thereto. A notch 35 for passing the connector 13 may be formed at an arbitrary position of the cap 31. For example, in FIG. 1B, a notch 35 is formed on the peripheral surface of the cap part 31, and a substantially circular notch is also formed on the head of the cap 31. In the case of a shape having a connector (not shown), it is possible to pass the connector (not shown) through this substantially circular cutout. For example, the notch 35 may be formed only on the peripheral surface of the cap 31 as shown in FIG.

次に、車両のバンパ１に対する超音波センサモジュール１０の取り付け方法について説明する。まず、超音波センサモジュール１０の２箇所のフック１４を、アタッチメント３０の２箇所の溝穴部３６それぞれに嵌め、溝穴部３６のガイドによりキャップ部３１を超音波センサモジュール１０の頭部に挿入していき、超音波センサモジュール１０とアタッチメント３０を一体化する。次に、バンパ１の挿入穴２にホルダ２０の筒状部２１を挿入し、この筒状部２１の一端に一体に形成された平面部２２をバンパ１の裏面に被せる。この状態の挿入穴２に、アタッチメント３０を装着した超音波センサモジュール１０の挿入部１１を圧入し、ホルダ２０の摩擦力で仮固定する。その後、３本の脚部３２と接着部３３とを各屈曲部３４で折り曲げて任意の角度で外向きに開脚し、接着部３３をバンパ１の裏面に接着テープ３７で固定する。   Next, a method of attaching the ultrasonic sensor module 10 to the vehicle bumper 1 will be described. First, the two hooks 14 of the ultrasonic sensor module 10 are fitted in the two slot portions 36 of the attachment 30, and the cap portion 31 is inserted into the head of the ultrasonic sensor module 10 by the guide of the slot portion 36. Then, the ultrasonic sensor module 10 and the attachment 30 are integrated. Next, the cylindrical portion 21 of the holder 20 is inserted into the insertion hole 2 of the bumper 1, and the flat portion 22 formed integrally with one end of the cylindrical portion 21 is put on the back surface of the bumper 1. The insertion portion 11 of the ultrasonic sensor module 10 equipped with the attachment 30 is press-fitted into the insertion hole 2 in this state, and temporarily fixed by the frictional force of the holder 20. Thereafter, the three leg portions 32 and the bonding portion 33 are bent at each bending portion 34 and opened outward at an arbitrary angle, and the bonding portion 33 is fixed to the back surface of the bumper 1 with an adhesive tape 37.

あるいは、超音波センサモジュール１０の頭部にキャップ部３１を装着すると共に、挿入部１１にホルダ２０の筒状部２１を被せ、掛止部１２にホルダ２０の平面部２２を被せた状態にする。この状態で、超音波センサモジュール１０の挿入部１１をバンパ１の挿入穴２へ圧入し、ホルダ２０の摩擦力で超音波センサモジュール１０をバンパ１に仮固定する。その後、３本の脚部３２と接着部３３とを各屈曲部３４で折り曲げて任意の角度で外向きに開脚し、接着部３３をバンパ１の裏面に接着テープ３７で固定する。   Alternatively, the cap portion 31 is attached to the head of the ultrasonic sensor module 10, the cylindrical portion 21 of the holder 20 is covered on the insertion portion 11, and the flat portion 22 of the holder 20 is covered on the hook portion 12. . In this state, the insertion portion 11 of the ultrasonic sensor module 10 is press-fitted into the insertion hole 2 of the bumper 1, and the ultrasonic sensor module 10 is temporarily fixed to the bumper 1 by the frictional force of the holder 20. Thereafter, the three leg portions 32 and the bonding portion 33 are bent at each bending portion 34 and opened outward at an arbitrary angle, and the bonding portion 33 is fixed to the back surface of the bumper 1 with an adhesive tape 37.

図３は、超音波センサモジュール１０をバンパ１に取り付けた状態での荷重を示し、図３（ａ）は正面図、図３（ｂ）は平面図、図３（ｃ）は側面図である。また、実線矢印は超音波センサモジュール１０の荷重、一点鎖線矢印は超音波センサモジュール１０の重量が脚部３２に作用する荷重、破線矢印は接着部３３の支持する荷重を示す。
アタッチメント３０は超音波センサモジュール１０をバンパ１側へ押し出す力を常に加えている。また、アタッチメント３０に形成された３本の脚部３２のうち、超音波センサモジュール１０の重力作用方向に位置する２本の脚部３２が、超音波センサモジュール１０の重量を支持する。このため、超音波センサモジュール１０を確実に保持できる。
なお、図示例では重力作用方向に平行な２本の脚部３２で超音波センサモジュール１０を支持したが、これに限定されるものではなく、重力作用方向に平行な脚部３２が少なくとも１本あれば超音波センサモジュール１０を支持できる。FIG. 3 shows the load when the ultrasonic sensor module 10 is attached to the bumper 1, FIG. 3 (a) is a front view, FIG. 3 (b) is a plan view, and FIG. 3 (c) is a side view. . The solid line arrow indicates the load of the ultrasonic sensor module 10, the alternate long and short dash line arrow indicates the load on which the weight of the ultrasonic sensor module 10 acts on the leg portion 32, and the broken line arrow indicates the load supported by the bonding portion 33.
The attachment 30 always applies a force for pushing the ultrasonic sensor module 10 toward the bumper 1 side. Of the three legs 32 formed on the attachment 30, the two legs 32 positioned in the direction of gravity of the ultrasonic sensor module 10 support the weight of the ultrasonic sensor module 10. For this reason, the ultrasonic sensor module 10 can be reliably held.
In the illustrated example, the ultrasonic sensor module 10 is supported by two legs 32 parallel to the gravitational action direction. However, the present invention is not limited to this, and at least one leg 32 parallel to the gravitational action direction is provided. If there is, the ultrasonic sensor module 10 can be supported.

図４は、高さの異なる超音波センサモジュール１０をバンパ１に取り付けた状態を示す正面図である。なお、図４ならびに後述する図５および図６では、バンパ１とホルダ２０を断面で示す。
超音波センサモジュール１０の型名が変わると、超音波センサモジュール１０の高さも変わる。また、バンパ１の厚みが変わった場合、ホルダ２０の平面部２２の厚みを変えることによりバンパ１の表面と挿入部１１の前面を面一にするので、超音波センサモジュール１０の高さも変わる。
このように超音波センサモジュール１０の高さが変わっても、屈曲部３４を屈曲させて脚部３２の開き角度を変えることにより、キャップ部３１からバンパ１までの距離を調節することができる。また、屈曲部３４の屈曲により接着部３３のバンパ１への倣いが容易になるので、超音波センサモジュール１０の固定作業が簡便となる。また、接着部３３とバンパ１の接着を確実にできるため、固定の信頼性が向上する。さらに、高さの異なる超音波センサモジュール１０毎にアタッチメント３０を準備する必要が無く、コスト低減に効果がある。FIG. 4 is a front view illustrating a state in which the ultrasonic sensor modules 10 having different heights are attached to the bumper 1. 4 and FIGS. 5 and 6 described later, the bumper 1 and the holder 20 are shown in cross section.
When the model name of the ultrasonic sensor module 10 changes, the height of the ultrasonic sensor module 10 also changes. Further, when the thickness of the bumper 1 is changed, the height of the ultrasonic sensor module 10 is also changed because the surface of the bumper 1 is flush with the front surface of the insertion portion 11 by changing the thickness of the flat portion 22 of the holder 20.
Thus, even if the height of the ultrasonic sensor module 10 changes, the distance from the cap part 31 to the bumper 1 can be adjusted by bending the bent part 34 and changing the opening angle of the leg part 32. Moreover, since the copying of the bonding portion 33 to the bumper 1 is facilitated by the bending of the bending portion 34, the fixing operation of the ultrasonic sensor module 10 is simplified. Moreover, since the adhesion between the bonding portion 33 and the bumper 1 can be ensured, the fixing reliability is improved. Furthermore, there is no need to prepare an attachment 30 for each ultrasonic sensor module 10 having a different height, which is effective in reducing costs.

図５（ａ）は、曲面状のバンパ１に超音波センサモジュール１０を取り付けた状態を示す正面図であり、図５（ｂ）にホルダ２０の断面拡大図を示す。バンパ１が曲面の場合でも、屈曲部３４を屈曲させて脚部３２および接着部３３の開き角度を変えることにより、接着部３３のバンパ１への倣いが容易になる。
なお、バンパ１が曲面の場合、ホルダ２０の平面部２２の厚みを変えることにより、バンパ１の表面と挿入部１１の前面が面一になるように調整する。あるいは、図５（ｂ）に示すように、スペーサ２３をホルダ２０に取り付けて、このスペーサ２３の厚みで調整する。FIG. 5A is a front view showing a state in which the ultrasonic sensor module 10 is attached to the curved bumper 1, and FIG. 5B shows an enlarged cross-sectional view of the holder 20. Even when the bumper 1 is a curved surface, the bending portion 34 is bent to change the opening angle of the leg portion 32 and the bonding portion 33, whereby the copying of the bonding portion 33 to the bumper 1 is facilitated.
When the bumper 1 is a curved surface, the thickness of the flat portion 22 of the holder 20 is changed so that the surface of the bumper 1 and the front surface of the insertion portion 11 are flush with each other. Alternatively, as shown in FIG. 5B, the spacer 23 is attached to the holder 20, and the thickness of the spacer 23 is adjusted.

図６（ａ）は、傾斜状のバンパ１に超音波センサモジュール１０を取り付けた状態を示す正面図であり、図６（ｂ）にホルダ２０の拡大断面図を示す。バンパ１が傾斜している場合でも、屈曲部３４を屈曲させて脚部３２および接着部３３の開き角度を変えることにより、接着部３３のバンパ１への倣いが容易になる。
なお、バンパ１が傾斜している場合、ホルダ２０の平面部２２の厚みａ，ｂをバンパ１の傾斜角度に応じて変えることにより（例えば、ａ＞ｂ）、バンパ１に対する挿入部１１の前面の取り付け角度を調整する。FIG. 6A is a front view showing a state in which the ultrasonic sensor module 10 is attached to the inclined bumper 1, and FIG. 6B shows an enlarged sectional view of the holder 20. Even when the bumper 1 is inclined, the bending portion 34 is bent to change the opening angle of the leg portion 32 and the bonding portion 33, whereby the copying of the bonding portion 33 to the bumper 1 is facilitated.
In addition, when the bumper 1 is inclined, the front surface of the insertion portion 11 with respect to the bumper 1 is changed by changing the thicknesses a and b of the flat portion 22 of the holder 20 according to the inclination angle of the bumper 1 (for example, a> b). Adjust the mounting angle.

図５および図６に示すように、バンパ１の形状によらず超音波センサモジュール１０の固定作業が簡便となり、また、固定の信頼性も向上する。さらに、形状の異なるバンパ１毎にアタッチメント３０を準備する必要が無く、コスト低減に効果がある。   As shown in FIGS. 5 and 6, the fixing operation of the ultrasonic sensor module 10 becomes simple regardless of the shape of the bumper 1, and the fixing reliability is improved. Furthermore, it is not necessary to prepare the attachment 30 for each bumper 1 having a different shape, which is effective in reducing the cost.

以上より、実施の形態１によれば、超音波センサモジュール１０を内包する有底筒状のキャップ部３１と、キャップ部３１の開放端面の３箇所から軸方向に突出した３本の脚部３２と、個々の脚部３２の先端側に形成され、バンパ１の裏面に接着する接着部３３と、キャップ部３１と脚部３２との境界および脚部３２と接着部３３との境界を他の部分より薄い肉厚にして屈曲可能にした屈曲部３４とを有したアタッチメント３０を、バンパ１の裏面に接着固定する取り付け構造にした。このため、屈曲部３４の屈曲により脚部３２および接着部３３を任意の角度で開脚することができ、接着部３３とバンパ１の裏面の倣いが容易になる。よって、バンパ１の裏面に沿って超音波センサモジュール１０を固定することができ、取り付け作業が容易になると共に接着の信頼性も向上する。また、超音波センサモジュール１０の高さおよびバンパ１の形状等に拘らず、アタッチメント３０を標準化することができ、コスト低減が可能になる。   As described above, according to the first embodiment, the bottomed cylindrical cap portion 31 containing the ultrasonic sensor module 10, and the three leg portions 32 protruding in the axial direction from the three open end surfaces of the cap portion 31. And an adhesive portion 33 that is formed on the distal end side of each leg portion 32 and adheres to the back surface of the bumper 1, and the boundary between the cap portion 31 and the leg portion 32 and the boundary between the leg portion 32 and the adhesive portion 33 The attachment 30 having the bent portion 34 that is thinner than the portion and made bendable is attached to the back surface of the bumper 1 so as to be bonded. For this reason, the leg 32 and the bonding portion 33 can be opened at an arbitrary angle by bending the bending portion 34, and the back surface of the bonding portion 33 and the bumper 1 can be easily copied. Therefore, the ultrasonic sensor module 10 can be fixed along the back surface of the bumper 1, and the attachment work becomes easy and the reliability of adhesion is improved. In addition, the attachment 30 can be standardized regardless of the height of the ultrasonic sensor module 10 and the shape of the bumper 1, thereby reducing costs.

また、実施の形態１によれば、アタッチメント３０の脚部３２は、キャップ部３１の開放端面の複数箇所に配設され、屈曲部３４の屈曲により任意の角度で外向きに開脚可能であり、少なくともそのうちの１つの脚部３２が超音波センサモジュール１０の重力作用方向に位置して重量を支持する構造にした。このため、アタッチメント３０が超音波センサモジュール１０に押し込む力を加えつつ重量を支持することができ、超音波センサモジュール１０を確実に保持できる。   Further, according to the first embodiment, the leg portions 32 of the attachment 30 are disposed at a plurality of locations on the open end surface of the cap portion 31, and can be opened outward at an arbitrary angle by bending of the bending portion 34. At least one of the legs 32 is positioned in the direction of gravity of the ultrasonic sensor module 10 to support the weight. For this reason, weight can be supported, applying the force which the attachment 30 pushes into the ultrasonic sensor module 10, and the ultrasonic sensor module 10 can be hold | maintained reliably.

また、実施の形態１によれば、超音波センサモジュール１０は、側面にアタッチメント３０を仮止めするフック１４を有し、アタッチメント３０のキャップ部３１は、超音波センサモジュール１０のフック１４に係止する仮固定穴となる溝穴部３６を有し、フック１４と溝穴部３６の係止によりアタッチメント３０を超音波センサモジュール１０に仮止めした状態でバンパ１の裏面に装着固定する構造にした。このため、取り付け作業をより容易にすることができる。   Further, according to the first embodiment, the ultrasonic sensor module 10 has the hook 14 for temporarily fixing the attachment 30 on the side surface, and the cap portion 31 of the attachment 30 is locked to the hook 14 of the ultrasonic sensor module 10. And has a structure in which the attachment 30 is attached and fixed to the back surface of the bumper 1 in a state where the attachment 30 is temporarily fixed to the ultrasonic sensor module 10 by locking the hook 14 and the slot 36. . For this reason, attachment work can be made easier.

実施の形態２．
図７は、実施の形態２を示す各構成要素をバンパ１に取り付けた状態を示し、図７（ａ）は正面図、図７（ｂ）は平面図、図７（ｃ）は側面図である。なお、図７（ａ）のバンパ１、ホルダ２０およびアタッチメント３０ａは図７（ｂ）のＣＣ線に沿って切断した断面を示す。また、図７において図１〜図６と同一または相当の部分については同一の符号を付し説明を省略する。Embodiment 2. FIG.
FIG. 7 shows a state in which each component shown in the second embodiment is attached to the bumper 1, FIG. 7 (a) is a front view, FIG. 7 (b) is a plan view, and FIG. 7 (c) is a side view. is there. In addition, the bumper 1, the holder 20, and the attachment 30a of Fig.7 (a) show the cross section cut | disconnected along CC line of FIG.7 (b). In FIG. 7, the same or corresponding parts as those in FIGS. 1 to 6 are denoted by the same reference numerals and description thereof is omitted.

この実施の形態２は、キャップ部３１ａの内径を底面に行くに従い小さくし、当たり面３８を形成したものである。このように構成すると、超音波センサモジュール１０の外形が変わっても、同一のアタッチメント３０ａを使用できる。例えば図７に示す大径の超音波センサモジュール１０の場合、キャップ部３１ａに超音波センサモジュール１０をその頭部から挿入すると、キャップ部３１ａの底面に到達する手前で頭部端が当たり面３８に当接し、位置決めされる。超音波センサモジュール１０の外形に応じて、超音波センサモジュール１０の頭部端と当たり面３８との当接位置が変わるので、バンパ１からキャップ部３１ａまでの距離も変わるが、屈曲部３４の屈曲によりキャップ部３１ａの高さを調節できる。   In the second embodiment, the inner diameter of the cap portion 31a is reduced toward the bottom surface to form a contact surface 38. If comprised in this way, even if the external shape of the ultrasonic sensor module 10 changes, the same attachment 30a can be used. For example, in the case of the large-diameter ultrasonic sensor module 10 shown in FIG. 7, when the ultrasonic sensor module 10 is inserted into the cap portion 31a from its head, the head end comes into contact with the front surface 38 before reaching the bottom surface of the cap portion 31a. And is positioned. Since the contact position between the head end of the ultrasonic sensor module 10 and the contact surface 38 changes according to the outer shape of the ultrasonic sensor module 10, the distance from the bumper 1 to the cap portion 31a also changes. The height of the cap part 31a can be adjusted by bending.

以上より、実施の形態２によれば、アタッチメント３０ａのキャップ部３１ａを、底面の内径が開放端面の内径に比べて小さい形状にしたので、超音波センサモジュール１０の外形が変わっても同一のアタッチメント３０ａが使用できる。   As described above, according to the second embodiment, the cap part 31a of the attachment 30a has a shape in which the inner diameter of the bottom surface is smaller than the inner diameter of the open end surface. Therefore, even if the outer shape of the ultrasonic sensor module 10 changes, the same attachment 30a can be used.

実施の形態３．
図８は、実施の形態３を示す各構成要素をバンパ１に取り付ける前の状態を示し、図８（ａ）は正面図、図８（ｂ）は平面図、図８（ｃ）は側面図である。図９は、各構成要素をバンパ１に取り付けた状態を示し、図９（ａ）は正面図、図９（ｂ）は平面図、図９（ｃ）は側面図である。なお、図８（ａ）のバンパ１、ホルダ２０およびアタッチメント３０ｂは図８（ｂ）のＤＤ線に沿って切断した断面を示す。同様に図９（ａ）のバンパ１、ホルダ２０およびアタッチメント３０ｂは図９（ｂ）のＥＥ線に沿って切断した断面を示す。また、図８および図９において図１〜図６と同一または相当の部分については同一の符号を付し説明を省略する。Embodiment 3 FIG.
FIG. 8 shows a state before each component shown in Embodiment 3 is attached to the bumper 1, FIG. 8 (a) is a front view, FIG. 8 (b) is a plan view, and FIG. 8 (c) is a side view. It is. 9 shows a state in which each component is attached to the bumper 1. FIG. 9 (a) is a front view, FIG. 9 (b) is a plan view, and FIG. 9 (c) is a side view. In addition, the bumper 1, the holder 20, and the attachment 30b of FIG. 8A show a cross section cut along the DD line of FIG. 8B. Similarly, the bumper 1, the holder 20, and the attachment 30b in FIG. 9A show a cross section cut along the line EE in FIG. 9B. 8 and 9, the same or corresponding parts as those in FIGS. 1 to 6 are denoted by the same reference numerals and description thereof is omitted.

この実施の形態３は、溝穴部３６の脚部３２側に、フック１４を仮止めして前後位置を固定するための仮固定穴３９を形成したものである。バンパ１に超音波センサモジュール１０を取り付ける際、まず、超音波センサモジュール１０の２箇所のフック１４を、アタッチメント３０ｂの２箇所の仮固定穴３９にそれぞれ嵌め、アタッチメント３０ｂを超音波センサモジュール１０に仮装着する。次に、バンパ１の挿入穴２にホルダ２０の筒状部２１を挿入し、この筒状部２１の一端に一体に形成された平面部２２をバンパ１の裏面に被せる。この状態の挿入穴２に、アタッチメント３０ｂを仮装着した超音波センサモジュール１０の挿入部１１を圧入し、ホルダ２０の摩擦力で仮固定する。超音波センサモジュール１０をバンパ１に嵌めて位置決めした状態でアタッチメント３０ｂを押し込むことで、フック１４が仮固定穴３９から外れて溝穴部３６に嵌り、溝穴部３６のガイドにより超音波センサモジュール１０の頭部にキャップ部３１ａが挿入されていく。その後、３本の脚部３２と接着部３３とを各屈曲部３４で折り曲げて任意の角度で外向きに開脚し、接着部３３をバンパ１の裏面に接着テープ３７で固定する。
あるいは、超音波センサモジュール１０をバンパ１に嵌める前に、予め、挿入部１１にホルダ２０を装着しておいてもよい。In the third embodiment, a temporary fixing hole 39 for temporarily fixing the hook 14 to fix the front and rear positions is formed on the leg portion 32 side of the slot portion 36. When attaching the ultrasonic sensor module 10 to the bumper 1, first, the two hooks 14 of the ultrasonic sensor module 10 are respectively fitted into the two temporary fixing holes 39 of the attachment 30 b, and the attachment 30 b is attached to the ultrasonic sensor module 10. Temporarily attach. Next, the cylindrical portion 21 of the holder 20 is inserted into the insertion hole 2 of the bumper 1, and the flat portion 22 formed integrally with one end of the cylindrical portion 21 is put on the back surface of the bumper 1. The insertion portion 11 of the ultrasonic sensor module 10 temporarily attached with the attachment 30b is press-fitted into the insertion hole 2 in this state, and temporarily fixed by the frictional force of the holder 20. By pushing the attachment 30b in a state where the ultrasonic sensor module 10 is fitted and positioned on the bumper 1, the hook 14 is detached from the temporary fixing hole 39 and fits into the slot 36, and the ultrasonic sensor module is guided by the slot 36. The cap portion 31a is inserted into the 10 heads. Thereafter, the three leg portions 32 and the bonding portion 33 are bent at each bending portion 34 and opened outward at an arbitrary angle, and the bonding portion 33 is fixed to the back surface of the bumper 1 with an adhesive tape 37.
Alternatively, the holder 20 may be attached to the insertion portion 11 in advance before the ultrasonic sensor module 10 is fitted to the bumper 1.

また、図示は省略するが、キャップ部３１ｂの底面の内径を開放端面の内径に比べて小さい形状にし、上記実施の形態２の図７に示したような当たり面３８を形成してもよい。   Although not shown, the inner surface of the bottom surface of the cap portion 31b may be smaller than the inner diameter of the open end surface, and the contact surface 38 as shown in FIG. 7 of the second embodiment may be formed.

以上より、実施の形態３によれば、超音波センサモジュール１０は、側面にアタッチメント３０ｂを仮止めするフック１４を有し、アタッチメント３０ｂのキャップ部３１ｂは、超音波センサモジュール１０のフック１４に係止する仮固定穴３９を有し、フック１４と仮固定穴３９の係止によりアタッチメント３０ｂを超音波センサモジュール１０に仮止めした状態でバンパ１に装着固定する構造にした。このため、取り付け作業をより容易にすることができる。   As described above, according to the third embodiment, the ultrasonic sensor module 10 has the hook 14 for temporarily fixing the attachment 30b on the side surface, and the cap portion 31b of the attachment 30b is related to the hook 14 of the ultrasonic sensor module 10. The structure has a temporary fixing hole 39 to be stopped, and is attached and fixed to the bumper 1 in a state in which the attachment 30b is temporarily fixed to the ultrasonic sensor module 10 by locking the hook 14 and the temporary fixing hole 39. For this reason, attachment work can be made easier.

なお、本願発明はその発明の範囲内において、各実施の形態の自由な組み合わせ、あるいは各実施の形態の任意の構成要素の変形、もしくは各実施の形態において任意の構成要素の省略が可能である。   In the present invention, within the scope of the invention, any combination of the embodiments, or any modification of any component in each embodiment, or omission of any component in each embodiment is possible. .

以上のように、この発明に係る超音波センサモジュールの取り付け構造は、屈曲部を折り曲げて脚部と接着部の開き角度を変えることにより接着部のバンパ裏面への倣いを容易にしたので、形状が一定化しない車体のバンパに対し、超音波センサモジュールを取り付けるのに適している。   As described above, the ultrasonic sensor module mounting structure according to the present invention facilitates copying of the bonded portion to the back surface of the bumper by bending the bent portion and changing the opening angle between the leg portion and the bonded portion. It is suitable for mounting an ultrasonic sensor module to a bumper of a vehicle body where the constant is not constant.

１ バンパ、２ 挿入穴、１０ 超音波センサモジュール、１１ 挿入部、１２ 掛止部、１３ コネクタ、１４ フック、２０ ホルダ、２１ 筒状部、２２ 平面部、２３ スペーサ、３０，３０ａ，３０ｂ アタッチメント、３１，３１ａ，３１ｂ キャップ部、３２ 脚部、３３ 接着部、３４ 屈曲部、３５ 切欠部、３６ 溝穴部、３７ 接着テープ、３８ 当たり面、３９ 仮固定穴。   DESCRIPTION OF SYMBOLS 1 Bumper, 2 Insertion hole, 10 Ultrasonic sensor module, 11 Insertion part, 12 Latch part, 13 Connector, 14 Hook, 20 Holder, 21 Cylindrical part, 22 Planar part, 23 Spacer, 30, 30a, 30b Attachment, 31, 31a, 31b Cap part, 32 Leg part, 33 Adhesion part, 34 Bending part, 35 Notch part, 36 Slot part, 37 Adhesive tape, 38 Contact surface, 39 Temporary fixing hole.

Claims (7)

車両のバンパに設けた挿入穴の穴径より小さい径の挿入部と当該挿入穴の穴径より大きい径の掛止部を設けた超音波センサモジュールの、前記挿入部を前記バンパの裏面から前記挿入穴に挿入して前記掛止部を掛止し、前記挿入部の前面が前記バンパの表面と略面一になるよう固定する構造のベゼルレス型の超音波センサモジュールの取り付け構造であって、
前記超音波センサモジュールを内包する有底筒状のキャップ部と、
前記キャップ部の開放端面の複数箇所から軸方向に突出した複数の脚部と、
前記個々の脚部の先端側に形成され、前記バンパの裏面に接着する接着部と、
前記キャップ部と前記脚部との境界、および前記脚部と前記接着部との境界を他の部分より薄い肉厚にして屈曲可能にした屈曲部とを有したアタッチメントを、前記バンパの裏面に接着固定したことを特徴とする超音波センサモジュールの取り付け構造。The ultrasonic sensor module having an insertion portion having a diameter smaller than the diameter of the insertion hole provided in the bumper of the vehicle and a latching portion having a diameter larger than the diameter of the insertion hole, the insertion portion from the back surface of the bumper. A mounting structure for a bezelless ultrasonic sensor module having a structure in which the insertion part is inserted into an insertion hole to hold the hooking part and the front surface of the insertion part is fixed to be substantially flush with the surface of the bumper.
A bottomed cylindrical cap portion containing the ultrasonic sensor module;
A plurality of leg portions protruding in the axial direction from a plurality of locations on the open end surface of the cap portion;
An adhesive part formed on a tip side of each of the leg parts and adhered to the back surface of the bumper;
An attachment having a bendable portion that has a boundary between the cap portion and the leg portion, and a bendable portion that has a thinner wall thickness than the other portions and that can be bent, on the back surface of the bumper. An ultrasonic sensor module mounting structure characterized by being bonded and fixed. 前記アタッチメントの脚部は、前記キャップ部の開放端面の複数箇所に配設され、前記屈曲部の屈曲により任意の角度で外向きに開脚可能であり、少なくともその内の１つの脚部が前記超音波センサモジュールの重力作用方向に位置して重量を支持する構造であることを特徴とする請求項１記載の超音波センサモジュールの取り付け構造。   Legs of the attachment are arranged at a plurality of locations on the open end surface of the cap part, and can be opened outward at an arbitrary angle by bending of the bent part, at least one leg part of which is The ultrasonic sensor module mounting structure according to claim 1, wherein the ultrasonic sensor module is configured to support a weight by being positioned in a direction of gravity of the ultrasonic sensor module. 前記アタッチメントのキャップ部は、前記超音波センサモジュールのコネクタ部を通す切欠部を有し、
前記アタッチメントの複数箇所の脚部は、前記コネクタ部の突出方向とは異なる方向に配設されたことを特徴とする請求項２記載の超音波センサモジュールの取り付け構造。The cap portion of the attachment has a cutout portion through which the connector portion of the ultrasonic sensor module passes,
3. The ultrasonic sensor module mounting structure according to claim 2, wherein the plurality of leg portions of the attachment are arranged in a direction different from a protruding direction of the connector portion. 前記アタッチメントのキャップ部は、底面の内径が開放端面の内径に比べて小さいことを特徴とする請求項１記載の超音波センサモジュールの取り付け構造。   The ultrasonic sensor module mounting structure according to claim 1, wherein an inner diameter of the bottom surface of the cap portion of the attachment is smaller than an inner diameter of the open end surface. 前記超音波センサモジュールは、側面に前記アタッチメントを仮止めするフックを有し、
前記アタッチメントのキャップ部は、前記超音波センサモジュールのフックに係止する溝穴を有し、前記フックと前記溝穴の係止により前記アタッチメントを前記超音波センサモジュールに仮止めした状態で、前記アタッチメントを前記バンパの裏面に接着固定した構造であることを特徴とする請求項１記載の超音波センサモジュールの取り付け構造。The ultrasonic sensor module has a hook for temporarily fixing the attachment to a side surface,
The cap portion of the attachment has a slot that is locked to a hook of the ultrasonic sensor module, and the attachment is temporarily fixed to the ultrasonic sensor module by locking the hook and the slot, 2. The ultrasonic sensor module mounting structure according to claim 1, wherein an attachment is bonded and fixed to the back surface of the bumper. 前記バンパの挿入穴と前記超音波センサモジュールの挿入部との間に介装される筒状部と、前記バンパの裏面と前記超音波センサモジュールの掛止部との間に介装される平面部とから成るホルダを備え、
前記ホルダの平面部の厚みを、前記超音波センサモジュールを前記バンパに固定した場合の、前記バンパの裏面から前記超音波センサモジュールの掛止部までの隙間に応じた厚みにしたことを特徴とする請求項１記載の超音波センサモジュールの取り付け構造。A cylindrical portion interposed between the insertion hole of the bumper and the insertion portion of the ultrasonic sensor module, and a plane interposed between the back surface of the bumper and the latching portion of the ultrasonic sensor module. A holder comprising a portion,
The thickness of the flat portion of the holder is set to a thickness corresponding to the gap from the back surface of the bumper to the latching portion of the ultrasonic sensor module when the ultrasonic sensor module is fixed to the bumper. The ultrasonic sensor module mounting structure according to claim 1. 前記バンパの裏面と前記超音波センサモジュールの掛止部との間に介装されるスペーサを備え、
前記ホルダの平面部と前記スペーサとを合わせた厚みを、前記超音波センサモジュールを前記バンパに固定した場合の、前記バンパの裏面から前記超音波センサモジュールの掛止部までの隙間に応じた厚みにしたことを特徴とする請求項６記載の超音波センサモジュールの取り付け構造。A spacer interposed between the back surface of the bumper and the hooking portion of the ultrasonic sensor module;
Thickness according to the gap from the back surface of the bumper to the latching portion of the ultrasonic sensor module when the ultrasonic sensor module is fixed to the bumper. The ultrasonic sensor module mounting structure according to claim 6, wherein the ultrasonic sensor module is mounted.
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