JP5475001B2 - リボンで機械的に接続された高周波送受信装置を用いたチップによるアセンブリの製造方法 - Google Patents
リボンで機械的に接続された高周波送受信装置を用いたチップによるアセンブリの製造方法 Download PDFInfo
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- JP5475001B2 JP5475001B2 JP2011541540A JP2011541540A JP5475001B2 JP 5475001 B2 JP5475001 B2 JP 5475001B2 JP 2011541540 A JP2011541540 A JP 2011541540A JP 2011541540 A JP2011541540 A JP 2011541540A JP 5475001 B2 JP5475001 B2 JP 5475001B2
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- 238000004519 manufacturing process Methods 0.000 title description 2
- 239000000758 substrate Substances 0.000 claims description 42
- 238000000034 method Methods 0.000 claims description 33
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 238000003466 welding Methods 0.000 claims description 4
- 238000000926 separation method Methods 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 229920006254 polymer film Polymers 0.000 claims description 2
- 239000012212 insulator Substances 0.000 description 5
- 238000004377 microelectronic Methods 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000002679 ablation Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 230000005226 mechanical processes and functions Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07775—Antenna details the antenna being on-chip
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
- G06K19/07777—Antenna details the antenna being of the inductive type
- G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/96—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
- Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Power Engineering (AREA)
- Details Of Aerials (AREA)
Description
− 基板上に複数のチップを形成し、各チップは少なくとも1つの受信領域を備えており、
− アセンブリのチップの受信領域を、平坦な電気的絶縁リボンを用いて連続的に(in series)に接続し、電気的絶縁リボンは、互いに電気的に絶縁された複数の金属パターンを備え、各パターンは、平坦なアンテナの少なくとも一部分を形成しており、アンテナは、そのアンテナの少なくとも1つの接続領域を介して、対応する受信領域と電気的に接続しており、
− 基板のレベル(level)においてチップを分離し、これらのチップはこのリボンにより互いに機械的に接続されている。
Claims (9)
- 高周波送受信手段が設けられている複数のチップ(2)によるアセンブリを形成する方法であって、前記方法は、
− 基板(1)上に複数のチップを形成し、前記各チップは少なくとも1つの受信領域(3)を備えており、
− 前記アセンブリの前記チップ(2)の前記受信領域(3)を、平坦な電気的絶縁リボン(4)を用いて連続的に接続し、前記電気的絶縁リボンは、互いに電気的に絶縁された複数の金属パターン(5)を備え、前記各パターン(5)は、平坦なアンテナの少なくとも一部分を形成しており、前記アンテナは、前記アンテナの少なくとも1つの接続領域(6)のレベルで、対応する前記受信領域(3)と電気的に接続しており、
− 前記基板(1)のレベルにおいて前記チップ(2)を分離し、前記チップは前記リボン(4)により互いに機械的に接続されている、
ことを連続的に備えることを特徴とする方法。 - 前記各チップ(2)は2つの前記受信領域(3)を備え、前記チップ(2)のレベルにある前記リボン(4)は2つのパターン(5、5´)を備え、前記2つのパターンは、ダイポールアンテナを形成するように、前記チップの前記受信領域(3、3´)とそれぞれ電気的に接続する、ことを特徴とする請求項1に記載の方法。
- 連続的に接続する接続は、前記リボン(4)を広げ、且つ、前記チップの前記受信領域(3)に対応する前記アンテナの各接続領域(6)を接続することにより行われ、前記各接続領域(6)は、接着又は超音波溶接の前に、対応する前記受信領域(3)と向かい合うように配置されている、ことを特徴とする請求項1又は2に記載の方法。
- 前記リボン(4)は高分子フィルムであることを特徴とする請求項1から3のいずれか1つに記載の方法。
- 前記リボン(4)は、フレキシブルで、且つ、透明であることを特徴とする請求項1から4のいずれか1つに記載の方法。
- 前記パターン(5)は、銅又はアルミニウムにより形成されることを特徴とする請求項1から5のいずれか1つに記載の方法。
- 前記基板(1)は暫定支持体(8)を備え、前記方法は、前記受信領域(3)を連続的に接続する前に、前記基板(1)のレベルにおいて前記チップ(2)を部分的に薄く切るステップを備え、前記暫定支持体(8)は前記チップ(2)の分離を行う際に除去される、ことを特徴とする請求項1から6のいずれか1つに記載の方法。
- 前記チップ(2)による前記アセンブリはリールを形成する、ことを特徴とする請求項1から7のいずれか1つに記載の方法。
- 2つの隣り合う前記チップ(2)の前記受信領域(3)を連続的に接続する際に、前記リボン(4)は、前記2つの隣り合うチップの間の前記基板に対して垂直にストレッチし、前記チップが分離された後には、前記2つの隣り合うチップは所定の距離を持って離される、ことを特徴とする請求項1から8のいずれか1つに記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0807332A FR2940486B1 (fr) | 2008-12-22 | 2008-12-22 | Procede de fabrication d'un assemblage de puces a moyens d'emission-reception radiofrequence reliees mecaniquement au moyen d'un ruban et assemblage |
FR0807332 | 2008-12-22 | ||
PCT/FR2009/001469 WO2010072921A1 (fr) | 2008-12-22 | 2009-12-21 | Procede de fabrication d'un assemblage de puces a moyens d'emission-reception radiofrequence reliees mecaniquement au moyen d'un ruban |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012513629A JP2012513629A (ja) | 2012-06-14 |
JP5475001B2 true JP5475001B2 (ja) | 2014-04-16 |
Family
ID=40941455
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011541540A Expired - Fee Related JP5475001B2 (ja) | 2008-12-22 | 2009-12-21 | リボンで機械的に接続された高周波送受信装置を用いたチップによるアセンブリの製造方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8375563B2 (ja) |
EP (1) | EP2368217B1 (ja) |
JP (1) | JP5475001B2 (ja) |
CN (1) | CN102265293B (ja) |
ES (1) | ES2402224T3 (ja) |
FR (1) | FR2940486B1 (ja) |
WO (1) | WO2010072921A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2937464B1 (fr) * | 2008-10-21 | 2011-02-25 | Commissariat Energie Atomique | Assemblage d'une puce microelectronique a rainure avec un element filaire sous forme de toron et procede d'assemblage |
FR2940486B1 (fr) * | 2008-12-22 | 2011-02-11 | Commissariat Energie Atomique | Procede de fabrication d'un assemblage de puces a moyens d'emission-reception radiofrequence reliees mecaniquement au moyen d'un ruban et assemblage |
US8701271B2 (en) * | 2010-04-14 | 2014-04-22 | Avery Dennison Corporation | Method of assembly of articles |
FR2961949B1 (fr) * | 2010-06-24 | 2012-08-03 | Commissariat Energie Atomique | Elements a puce assembles sur des fils presentant une amorce de rupture |
US9281552B2 (en) | 2011-12-09 | 2016-03-08 | Smartrac Ip B.V. | Method for producing an antenna element of an RFID transponder |
Family Cites Families (17)
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US4688150A (en) * | 1984-06-15 | 1987-08-18 | Texas Instruments Incorporated | High pin count chip carrier package |
JPS63149191A (ja) * | 1986-12-15 | 1988-06-21 | 日立マクセル株式会社 | Icカ−ド |
JPH08125154A (ja) * | 1994-10-24 | 1996-05-17 | Olympus Optical Co Ltd | 半導体装置の製造方法 |
US6574858B1 (en) * | 1998-02-13 | 2003-06-10 | Micron Technology, Inc. | Method of manufacturing a chip package |
JP2001024145A (ja) * | 1999-07-13 | 2001-01-26 | Shinko Electric Ind Co Ltd | 半導体装置及びその製造方法 |
ATE237849T1 (de) * | 1999-10-08 | 2003-05-15 | Andreas Plettner | Verfahren zur herstellung kontaktloser chipkarten sowie zur herstellung von elektrischen einheiten, bestehend aus chips mit kontaktelementen |
US6951596B2 (en) * | 2002-01-18 | 2005-10-04 | Avery Dennison Corporation | RFID label technique |
US6800018B2 (en) * | 2002-02-12 | 2004-10-05 | Saint-Gobain Abrasives Technology Company | Cutting device for separating individual laminated chip assemblies from a strip thereof, method of separation and a method of making the cutting device |
KR100486290B1 (ko) * | 2002-12-23 | 2005-04-29 | 삼성전자주식회사 | 반도체 패키지 조립방법 및 반도체 패키지 공정의보호테이프 제거장치 |
US20040217488A1 (en) * | 2003-05-02 | 2004-11-04 | Luechinger Christoph B. | Ribbon bonding |
JPWO2004107262A1 (ja) * | 2003-05-28 | 2006-07-20 | 株式会社日立製作所 | 無線認識半導体装置及びその製造方法 |
TWI228804B (en) * | 2003-07-02 | 2005-03-01 | Lite On Semiconductor Corp | Chip package substrate having flexible printed circuit board and method for fabricating the same |
FR2893734A1 (fr) | 2005-11-21 | 2007-05-25 | St Microelectronics Sa | Micromodule electronique et procede de fabrication d'un tel micromodule |
US20070146135A1 (en) * | 2005-12-27 | 2007-06-28 | David Boyadjieff | Assembling RFID components using webs |
CN100538731C (zh) * | 2006-02-10 | 2009-09-09 | 富士通株式会社 | Rfid标签制造方法和rfid标签 |
JP2008009881A (ja) * | 2006-06-30 | 2008-01-17 | Fujitsu Ltd | Rfidタグ製造方法およびrfidタグ |
FR2940486B1 (fr) * | 2008-12-22 | 2011-02-11 | Commissariat Energie Atomique | Procede de fabrication d'un assemblage de puces a moyens d'emission-reception radiofrequence reliees mecaniquement au moyen d'un ruban et assemblage |
-
2008
- 2008-12-22 FR FR0807332A patent/FR2940486B1/fr not_active Expired - Fee Related
-
2009
- 2009-12-21 CN CN200980151862.1A patent/CN102265293B/zh not_active Expired - Fee Related
- 2009-12-21 EP EP09804282A patent/EP2368217B1/fr active Active
- 2009-12-21 JP JP2011541540A patent/JP5475001B2/ja not_active Expired - Fee Related
- 2009-12-21 US US13/140,888 patent/US8375563B2/en active Active
- 2009-12-21 ES ES09804282T patent/ES2402224T3/es active Active
- 2009-12-21 WO PCT/FR2009/001469 patent/WO2010072921A1/fr active Application Filing
Also Published As
Publication number | Publication date |
---|---|
JP2012513629A (ja) | 2012-06-14 |
EP2368217A1 (fr) | 2011-09-28 |
CN102265293B (zh) | 2015-06-24 |
CN102265293A (zh) | 2011-11-30 |
WO2010072921A1 (fr) | 2010-07-01 |
US8375563B2 (en) | 2013-02-19 |
EP2368217B1 (fr) | 2013-01-02 |
US20110247198A1 (en) | 2011-10-13 |
FR2940486A1 (fr) | 2010-06-25 |
FR2940486B1 (fr) | 2011-02-11 |
ES2402224T3 (es) | 2013-04-29 |
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