JP5470520B2 - Multi-system cooling device and its water supply setting method - Google Patents

Description

  The present invention relates to a multi-system cooling apparatus that supplies cooling water to an object to be cooled by a main water supply system and a sub-water supply system from a coolant tank that contains the coolant, and a water supply setting method thereof.

  2. Description of the Related Art Conventionally, a cooling device that supplies cooling water from a cooling liquid tank containing cooling liquid to an object to be cooled such as a laser processing machine, and in particular, includes a plurality of independent water supply systems including a main water supply system and a sub water supply system. A system cooling device is known. For example, Patent Document 1 discloses a cooling device for a laser processing machine having two circulating water paths.

  The cooling device for a laser beam machine disclosed in the same document 1 includes a circulation pump in its path, and among the devices constituting the laser beam machine, a first circulating water path that cools a device that generates a large amount of heat, Circulation of two systems comprising a circulation pump having a lower capacity than the circulation pump in its path, and a second circulation water path for cooling a device having a calorific value smaller than the calorific value although it is cooled by the first circulation water path A cooling device for a laser processing machine having a water path, comprising a bypass path connecting the first circulating water path and the second circulating water path, and is circulated by a circulation pump in the first circulating water path. 2 is configured to remove the gas remaining in the circulating water path.

JP 10-335720 A

  However, the conventional cooling device for a laser beam machine (Patent Document 1) described above has the following problems.

  First, when cooling a specific object to be cooled such as a laser processing machine, the first system for cooling the main part is required to secure a flow rate of the cooling water and is constant with respect to the water pressure. As the second system that cools some narrow mechanisms other than the main part needs to be restricted, the flow rate is not so important, and it may be required to secure the cooling water pressure. The system requires an independent design that meets the required water supply requirements. In particular, it is necessary to satisfy the required heads, so that the pressure pump is easily increased in size. As a result, the overall power consumption is increased, resulting in poor energy saving.

  Secondly, each water supply system requires different water supply conditions and requires two independent water supply systems that do not interfere with each other. Therefore, two independent water supply systems including a cooler and circuit parts are provided ( 2 units) is required. Eventually, since parts cannot be shared, the number of parts increases, which easily leads to an increase in cost and size.

  The object of the present invention is to provide a multi-system cooling device and a water supply setting method for solving the problems existing in the background art.

  In order to solve the above-described problem, the multi-system cooling device 1 according to the present invention supplies main cooling water that supplies the cooling water W to the cooled object M from the cooling liquid tank 2 in which the cooling liquid W is stored under the first water supply condition. A multi-system cooling device including a system 3 and a sub-water supply system 4 that supplies the cooling water W to the object to be cooled M from the coolant tank 2 according to the second water supply condition. A shared system 5 for sending the cooling water W to the shared water supply line Lo by the pump 6, a branching section 7 for branching the cooling water W sent to the shared water supply line Lo into at least two systems, and one of the branched cooling water W The main water supply system 3 that supplies the object M to be cooled through the main water supply line Lm and the other cooling water W branched off are sent out by the sub pumping pump 8 to thereby supply the object M to be cooled through the sub water supply line Ls. Connected between the water supply system 4, the sub water supply line Ls and the main water supply line Lm, the flow rate setting circuit 9 capable of setting the flow rate Qw of the sub water supply line Ls, and the main water supply line Lm and the coolant tank 2. And a water pressure setting circuit 10 capable of setting the water pressure Pw of the main water supply line Lm.

  On the other hand, in the water supply setting method for the multi-system cooling device 1 according to the present invention, in order to solve the above-described problem, the coolant tank 2 in which the coolant W is accommodated from the coolant tank 2 in the first water supply condition via the main water supply system 3. When the cooling water W is supplied to the cooled object M and the cooling water W is supplied from the cooling liquid tank 2 to the cooled object M via the sub water supply system 4 according to the second water supply condition, The cooling water W sent to the common water supply line Lo by the pressure pump 6 is branched into at least two systems, and one of the branched cooling waters W is supplied to the object to be cooled M through the main water supply line Lm of the main water supply system 3, and By sending the other branched cooling water W by the sub pumping pump 8, the sub cooling water W is supplied to the cooled object M through the sub water feeding line Ls of the sub water supply system 4, and the sub water feeding line Ls and the main The flow rate setting circuit 9 connected between the water lines Lm sets the flow rate Qw of the sub water supply line Ls to the target flow rate value Qws, and then the main pressure is set by the water pressure setting circuit 10 connected between the main water supply line Lm and the coolant tank 2. The water pressure Pw of the water supply line Lm is set to the target water pressure value Pwm.

  Further, according to a preferred aspect of the present invention, the multi-system cooling device 1 includes a main return line Lmr for returning the cooling water W supplied from the main water supply system 3 to the object M to be cooled to the coolant tank 2 and the sub water supply. A sub return line Lsr for returning the cooling water W supplied from the system 4 to the cooled object M to the coolant tank 2 can be provided. Furthermore, the cooler 11 which cools the cooling water W which flows through the said common water supply line Lo can be connected to the common water supply line Lo. On the other hand, a relief valve 12 for limiting the water pressure can be connected between the sub water supply line Ls and the coolant tank 2.

  According to such a multi-system cooling device 1 and its water supply setting method according to the present invention, the following remarkable effects are achieved.

  (1) The head of the sub pumping pump 8 in the sub water supply system 4 can be reduced, and the flexibility between the main water supply system 3 and the sub water supply system 4 can be increased. Therefore, in particular, the sub pumping pump 8 can be miniaturized, and the use of the cooling water W can be made highly efficient and optimized by using the remaining capacity of the sub water supply system 4 in the main water supply system 3. . As a result, energy saving can be improved by reducing the overall power consumption while ensuring the necessary flow rate Qw and water pressure Pw.

  (2) The coolant W sent from the coolant tank 2 to the common water supply line Lo by the main pump 6 is branched into at least two systems, and one coolant W is cooled through the main water supply line Lm of the main water supply system 3. By supplying the cooling water W to the object M and sending the other cooling water W by the sub-pressure feed pump 8, the sub-water feed line Ls and the main water feed line Lm are supplied to the cooled object M through the sub-water feed line Ls of the sub-water feed system 4. The flow rate setting circuit 9 connected in between sets the flow rate Qw of the sub water supply line Ls, and the water pressure setting circuit 10 connected between the main water supply line Lm and the coolant tank 2 sets the water pressure Pw of the main water supply line Lm. As a result, the entire water supply system has been partially reduced in size and weight by sharing a part of the water supply system and improving the flexibility between them. It can be realized Sutodaun.

  (3) If the cooler 11 which cools the cooling water W which flows through the said common water supply line Lo is connected to the common water supply line Lo by a suitable aspect, the cooler 11 with respect to the main water supply system 3 and the sub water supply system 4 is substantial. Therefore, it is possible to contribute to cost reduction and downsizing due to halving the number of coolers.

  (4) If the relief valve 12 for limiting the water pressure is connected between the sub water supply line Ls and the coolant tank 2 according to a preferred embodiment, the water pressure in the sub water supply line Ls can be limited. It is possible to protect a part of the narrow (fine) mechanism or the like on the object to be cooled M side supplied with high water pressure.

FIG. 2 is a circuit configuration diagram of a multi-system cooling device according to a preferred embodiment of the present invention and an object to be cooled that is cooled by the multi-system cooling device; A flow chart for explaining a setting procedure using the water supply setting method of the multi-system cooling device, Principle circuit diagram and experimental data table showing the operating conditions and performance (pump power consumption) of the general multi-system cooling device and the general multi-system cooling device according to the comparative example, Characteristic diagram of multi-system cooling device according to the preferred embodiment, The partial circuit block diagram of the multi-system cooling device which concerns on the modified embodiment of this invention, The partial circuit block diagram of the multi-system cooling device which concerns on other modified embodiment of this invention,

  Next, preferred embodiments according to the present invention will be given and described in detail with reference to the drawings.

  First, the configuration of the multi-system cooling device 1 according to the present embodiment will be specifically described with reference to FIG.

  In FIG. 1, 1 indicates the overall configuration of the multi-system cooling device according to the present embodiment, and M indicates an object M to be cooled connected to the multi-system cooling device 1. In addition, the to-be-cooled object M of illustration is the laser processing machine Mo, and has the main load Mm and the subload Ms. In this case, the main load Mm assumes a load whose main part such as an oscillator is to be cooled, and the sub load Ms assumes a specific part other than the main part such as some narrow mechanisms.

  The multi-system cooling device 1 includes a coolant tank 2 that stores the coolant W, and the coolant tank 2 is connected to the upstream end of the shared water supply line Lo. The downstream end of the common water supply line Lo becomes a branching portion 7, and the upstream end of the main water supply line Lm and the upstream end of the sub water supply line Ls are connected to the branching portion 7. Thereby, the cooling water W passing through the common water supply line Lo is branched by the branching unit 7 into the main water supply line Lm and the sub water supply line Ls. Furthermore, the downstream end of the main water supply line Lm and the downstream end of the sub water supply line Ls are connected to the discharge ports 21m and 21s in the multi-system cooling device 1, respectively. Thereby, the main water supply line Lm side becomes the main water supply system 3 that supplies the cooling water W to the laser processing machine Mo, and the sub water supply line Ls side becomes the sub water supply system 4 that supplies the cooling water W to the laser processing machine Mo and is shared. The water supply line Lo side serves as a shared system 5 for sending the cooling water W from the coolant tank 2 by the main pump 6.

  The coolant tank 2 is connected to the downstream end of the main return line Lmr and the downstream end of the sub return line Lsr, and the upstream end of the main return line Lmr and the upstream end of the sub return line Lsr are respectively cooled by the multi-system cooling. Connected to the return ports 22m and 22s in the apparatus 1. Thereby, the cooling water W supplied from the main water supply system 3 to the laser processing machine Mo is returned to the coolant tank 2 through the main return line Lmr, and the cooling water supplied from the sub-water supply system 4 to the laser processing machine Mo. W is returned to the coolant tank 2 through the sub return line Lsr.

  And the main pumping pump 6 which supplies the cooling water W of the coolant tank 2 to the said common water supply line Lo is connected to the common water supply line Lo. The main pumping pump 6 secures the flow rates of both the main water supply system 3 and the sub water supply system 4, and in particular, regardless of the supply state of the sub water supply system 4, the flow rate Qw (target flow value) required by the main water supply system 3 A pressure feed pump that can secure Qwm) is used. The example main pump 6 is inverter-driven and has an output of 3.2 [kW].

  Furthermore, a cooler 11 that cools the cooling water W flowing through the shared water supply line Lo is connected to the shared water supply line Lo on the downstream side of the main pump 6. The cooler 11 uses a heat exchanger constituting the refrigeration cycle C. In the refrigeration cycle C, the compressor 25, the condenser 26 and the expansion valve 27 are sequentially connected, and the cooler 11 is connected between the compressor 25 and the expansion valve 27. Thus, a refrigeration cycle C having a refrigerant circulation circuit in which the refrigerant circulates is configured. Thus, if the cooler 11 that cools the cooling water W flowing through the shared water supply line Lo is connected to the shared water supply line Lo, the cooler 11 is substantially shared by the main water supply system 3 and the sub water supply system 4. Therefore, it is possible to contribute to cost reduction and downsizing due to halving the number of coolers. In addition, 26f shows the condenser fan which air-cools the condenser 26, 28 shows the water pressure gauge connected to the shared water supply line Lo of the downstream of the main pressure feed pump 6. FIG.

  On the other hand, a sub pumping pump 8 that feeds the cooling water W through the sub water feeding line Ls is connected to the sub water feeding line Ls. Since the sub pumping pump 8 only needs to secure the flow rate of the sub water supply system 4, a small pump having a small output with respect to the main pumping pump 6 is used. In particular, a size that can ensure the target water pressure value Pws (for example, 0.8 [MPa]) at a necessary flow rate (for example, 30 [L / min]) is selected. The illustrated sub pumping pump 8 has an output of 0.4 [kW]. In addition, 29 shows the water pressure meter connected to the sub water supply line Ls, and 30 shows the flow meter connected to the sub water supply line Ls. The main water supply line Lm side can also be configured in the same manner as the sub water supply line Ls side, except that a pump is not connected. Reference numerals 31 and 32 denote a water pressure meter and a flow meter connected to the main water supply line Lm.

  On the other hand, a flow rate setting circuit 9 using a flow rate adjusting valve or the like is connected between the sub water supply line Ls and the main water supply line Lm on the downstream side of the sub pressure pump 8. The flow rate setting circuit 9 functions as a bypass circuit that connects between the sub water supply line Ls and the main water supply line Lm, and has a function of variably adjusting the flow rate of the bypass circuit. In this case, since the water pressure on the side of the sub water supply line Ls connected to the sub pressure feed pump 8 is increased, the cooling water W flows from the sub water supply line Ls to the main water supply line Lm. Therefore, the flow rate Qw of the sub water supply line Ls can be set by variably adjusting the flow rate of the cooling water W that is bypassed by the flow rate setting circuit 9.

  Furthermore, a water pressure setting circuit 10 using a flow rate adjusting valve or the like is connected between the main water supply line Lm and the coolant tank 2 (main return line Lmr). The water pressure setting circuit 10 functions as a bypass circuit that connects the main water supply line Lm and the coolant tank 2 (main return line Lmr), and has a function of variably adjusting the flow rate of the bypass circuit. Therefore, the water pressure Pw of the main water supply line Lm can be set by variably adjusting the flow rate of the cooling water W that is bypassed by the water pressure setting circuit 10.

  Next, the water supply setting method of the multi-system cooling device 1 according to the present embodiment will be described according to the flowchart shown in FIG. 2 with reference to FIG.

  Assume that a multi-system cooling device 1 is newly installed for the laser beam machine Mo shown in FIG. Usually, when cooling the laser beam machine Mo, the main part such as the oscillator is cooled by supplying the cooling water W with a sufficient flow rate from the main water supply system 3, and some parts other than the main part are specified. The portion is cooled by supplying cooling water W from a separate sub-water supply system 4 that does not require a large flow rate but can secure the water pressure of the cooling water W. Thereby, the cooling in specific parts, such as some narrow (fine) mechanisms which cannot fully cool with the cooling water W supplied from the main water supply system 3, is ensured.

  In FIG. 1, Mm equivalently indicates the flow resistance of the load (main load) of the main part of the laser beam machine Mo. Cooling water W is supplied from the main water supply system 3 to the main load Mm. In addition, the water supply conditions in the example main load Mm are the flow rate target value Qwm of 170 [L / min] (lifting 50 [m]) or more and the water pressure target value Pwm of 0.5 [MPa]. Ms equivalently indicates a flow resistance of a load (sub load) of a specific portion of the laser beam machine Mo. Cooling water W is supplied from the sub water supply system 3 to the sub load Ms. In addition, the water supply conditions in the illustrated sub load Ms are a flow rate target value Qws of 20 [L / min] (lifting 80 [m]) or more and a water pressure target value Pwm of 0.8 [MPa] or more.

  Hereinafter, installation and setting procedures will be described. First, the multi-system cooling device 1 is connected to the laser processing machine Mo (step S1). In this case, the discharge port 21m of the multi-system cooling device 1 is connected to the upstream side of the main load Mm in the laser processing machine Mo via the opening / closing valve 24m, and the downstream side of the main load Mm is connected via the opening / closing valve 25m. And connected to the return port 22m of the multi-system cooling device 1. Further, the discharge port 21s of the multi-system cooling device 1 is connected to the upstream side of the sub load Ms via the on-off valve 24s, and the downstream side of the sub-load Ms is connected to the multi-system cooling device 1 via the on-off valve 25s. Connect to the return port 22s. The flow rate setting circuit 9 and the water pressure setting circuit 10 are both in the initial state, that is, in the shut-off state (step S2).

  Next, the operation switch of the multi-system cooling device 1 is turned on to start the operation (step S3). During operation of the multi-system cooling device 1, the cooling liquid W accommodated in the cooling liquid tank 2 reaches the branching section 7 through the common water supply line Lo by the operation of the main pumping pump 6 and the sub pumping pump 8. 7 branches to one main water supply line Lm and the other sub-water supply line Ls. The cooling water W flowing into one main water supply line Lm passes through the main water supply line Lm, is supplied from the discharge port 21m to the main load Mm of the laser beam machine Mo, and cools into the other sub-water supply line Ls. The water W is delivered by the sub pumping pump 8, passes through the sub water feeding line Ls, and is supplied from the discharge port 21s to the sub load Ms of the laser beam machine Mo. At this time, the cooling water W flowing through the shared water supply line Lo is cooled (heat exchanged) by the cooler 11. Further, the cooling water W supplied to the main load Mm is heated (heat exchange) by the main load Mm, and the used cooling water W is returned to the coolant tank 2 through the main return line Lmr, and the sub load The cooling water W supplied to Ms is heated (heat exchange) by the sub load Ms, and the used cooling water W is returned to the coolant tank 2 through the sub return line Lsr.

  Now, it is assumed that the flow rate Qw of the sub water supply line Ls is 40 [L / min] and the flow rate Qw of the main water supply line Lm is 160 [L / min] in such an operation state. In this case, as described above, the water supply condition for the flow rate Qw of the sub water supply line Ls, that is, the target flow rate value Qws is 20 [L / min] or more, but securing the flow rate Qw on the sub water supply line Ls side is as follows. Since it is not so important, the flow rate setting circuit 9 variably adjusts the flow rate, bypasses 20 [L / min] from the sub water supply line Ls to the main water supply line Lm, and sets the flow rate Qw of the sub water supply line Ls to 20 [L / min. min] (steps S4 and S5). The flow rate Qw at this time can be confirmed by the flow meter 30. In addition, although the water supply condition with respect to the water pressure Pw of the sub water supply line Ls, that is, the target water pressure value Pws is 0.8 [L / min] or more, the output selection of the sub pressure pump 8 is selected in advance for the target water pressure value Pws. Secured by

  As described above, the flow rate setting circuit 9 can be variably adjusted to optimize the flow rate Qw of the sub water supply line Ls, and at the same time, the flow rate Qw of the main water supply line Lm is changed from 160 [L / min] to 180 [L / min]. Can be increased. Therefore, the flow rate Qw on the main water supply line Lm side can be given a margin, and can contribute to prevention of loss during use. On the other hand, as the flow rate Qw of the main water supply line Lm increases, the water pressure Pw on the main water supply line Lm side also increases (steps S6 and S7). Since the target water pressure value Pwm on the main water supply line Lm side is 0.5 [MPa], if the water pressure rises to 0.6 [MPa] due to the increase in the flow rate Qw, the flow rate can be changed by the water pressure setting circuit 10. The water pressure Pw of the main water supply line Lm is set to 0.5 [MPa] by adjusting and returning a part of the cooling water W of the main water supply line Lm to the coolant tank 2 (steps S8 and S9). The water pressure Pw at this time can be confirmed by the water pressure gauge 31. Thus, the water supply setting is completed (step S10).

  In FIG. 3, the operation state and pump power consumption in the multi-system cooling device (implementation device) 1 according to the present embodiment and the general multi-system cooling device (comparison device) 1x according to the comparative example are shown in comparison. . FIGS. 3 (aa) and (ab) show the principle circuit diagram and experimental data table of the implementation apparatus 1, respectively, and FIGS. 3 (ba) and (bb) show the principle circuit diagram and experimental data table of the comparison apparatus 1x, respectively. Show. The comparison device 1x includes two completely independent water supply systems, that is, a main water supply system 3x in which a main pumping pump 6x is connected to a main water supply line Lmx that connects a coolant tank 2 and a main load Mm (not shown), and A sub water supply system 4x in which a sub pumping pump 8x is connected to a sub water supply line Lsx that connects the coolant tank 2 and a sub load Ms (not shown) is provided. Vm and Vs are relief valves that limit the flow rate or water pressure. Further, FIG. 4 shows a characteristic diagram of the implementation apparatus 1.

  If the implementation apparatus 1 and the comparison apparatus 1x are compared, both satisfy the water supply conditions for the main load and the sub load. That is, both satisfy the water supply condition of 170 [L / min] or more for the main load and satisfy the water supply condition of 20 [L / min] or more for the sub load. In this case, the implementation apparatus 1 uses a smaller sub pumping pump 8 whose output is reduced to about 1/4 (0.4 [kW]) with respect to the sub pumping pump 8x of the comparison apparatus 1x. As a result, it can be confirmed that the power consumption of the sub pumping pump 8 is reduced to less than half and the total power consumption including the main pumping pump 6 is also reduced by about 10%.

  Thus, according to the water supply setting method according to the present embodiment, the head of the sub pumping pump 8 in the sub water supply system 4 can be reduced, and the flexibility between the main water supply system 3 and the sub water supply system 4 can be increased. . Therefore, in particular, the sub pumping pump 8 can be miniaturized, and the use of the cooling water W can be made highly efficient and optimized by using the remaining capacity of the sub water supply system 4 in the main water supply system 3. . As a result, energy saving can be improved by reducing the overall power consumption while ensuring the necessary flow rate Qw and water pressure Pw. Further, the coolant W sent from the coolant tank 2 to the common water supply line Lo by the main pump 6 is branched into at least two systems, and one coolant W is to be cooled through the main water supply line Lm of the main water supply system 3. M is supplied to M, and the other cooling water W is sent out by the sub pressure feed pump 8 to be supplied to the cooled object M through the sub water feed line Ls of the sub water feed system 4, and between the sub water feed line Ls and the main water feed line Lm. The flow rate setting circuit 9 connected to the flow rate setting circuit 9 sets the flow rate Qw of the sub-water supply line Ls, and the water pressure setting circuit 10 connected between the main water supply line Lm and the coolant tank 2 sets the water pressure Pw of the main water supply line Lm. As a result, part of the entire water supply system is shared and the flexibility of each other is improved. It can be realized Sutodaun.

  Next, the multi-system cooling device 1 according to the modified embodiment of the present invention will be described with reference to FIGS. 5 and 6.

  5 is a water pressure limiting relief valve 12 connected between the sub water supply line Ls and the main return line Lmr (coolant tank 2) on the downstream side of the sub pressure pump 8 of the multi-system cooling device 1 shown in FIG. It is a thing. Since the cooling water W delivered by the sub pumping pump 8 is supplied to a sub load Ms such as a narrow mechanism other than the main part of the object M to be cooled, it is necessary to secure the water pressure Pw. is there. However, on the other hand, due to the structure, if the water pressure Pw becomes too high, an adverse effect is likely to occur. Therefore, the relief valve 12 for limiting the water pressure is connected and, for example, by setting the limiter value to 0.9 [MPa], the water pressure Pw is limited to 0,8 to 0.9 [MPa], and the sub load Ms. Some narrow (fine) mechanisms on the side can be protected against high water pressure.

  FIG. 6 is obtained by adding a control system by a controller 51 to the multi-system cooling apparatus 1 shown in FIG. Reference numeral 51 s denotes an operation unit connected to the controller 51. The flow rate setting circuit 9 and the water pressure setting circuit 10 provided in the multi-system cooling apparatus 1 shown in FIG. 1 are assumed to be manually operated, but the multi-system cooling apparatus 1 shown in FIG. The flow rate setting circuit 9 and the water pressure setting circuit 10 that can be driven and controlled by signals are used. Accordingly, the water pressure meters 29 and 31 and the flow meters 30 and 32 are of a type that can give a detection signal to the controller 51. According to the multi-system cooling device 1, the automatic setting mode of the controller 51 is activated by turning on the automatic water supply setting button of the operation unit 51s. As a result, the controller 51 controls the flow rate setting circuit 9 and the water pressure setting circuit 10 according to the flowchart shown in FIG. 2 while monitoring the detection signals from the water pressure meters 29 and 31 and the flow meters 30 and 32 to set the water supply. Is performed automatically. For this reason, the controller 51 is equipped with a microcomputer (microcomputer), that is, has a computer function with a built-in CPU, memory, and the like. In addition to the function of controlling the entire multi-system cooling device 1, an automatic setting mode is set. Stores the sequence control program to be executed.

  As described above, the preferred embodiment and the modified embodiment have been described in detail. However, the present invention is not limited to such an embodiment, and the gist of the present invention is described in detail configuration, quantity, numerical value, method, and the like. Any change, addition, or deletion can be made without departing from the scope.

  For example, although the type provided with two systems, the main water supply system 3 and the sub water supply system 4, was shown as the multi-system cooling device 1, you may comprise more than three systems by adding a water supply system further. In this case, another water supply system can be added on the basis of the two systems of the main water supply system 3 and the sub water supply system 4 illustrated. Moreover, although the case where the main return line Lmr and the sub return line Lsr are provided and the circulation type configured to circulate the cooling water W is shown, the case where the non-circulation type configured to discard the cooling water W without being circulated is excluded. Not what you want. On the other hand, although the case where the cooler 11 that cools the cooling water W flowing through the common water supply line Lo is connected to the common water supply line Lo is shown, the main return line Lmr and the sub return line Lsr are merged and merged. It does not exclude other connection forms such as connecting the cooler 11 to the line. Although the refrigeration cycle C is used as the cooler 11, other coolers such as a thermo module using a Peltier element may be used. In addition, since the refrigeration cycle C and the thermo module can function as a cooler or a heater, “cooling” in the present invention is a concept including “heating”.

  The multi-system cooling device 1 and the water supply setting method thereof according to the present invention can be used for cooling various objects to be cooled that supply a cooling liquid by a plurality of systems including a laser processing machine.

  1: Multi-system cooling device, 2: Coolant tank, 3: Main water supply system, 4: Sub water supply system, 5: Shared system, 6: Main pumping pump, 7: Branch, 8: Sub pumping pump, 9: Flow rate Setting circuit, 10: Water pressure setting circuit, 11: Cooler, 12: Relief valve, W: Coolant, M: Object to be cooled, Lo: Shared water supply line, Lm: Main water supply line, Ls: Sub water supply line, Lmr: Main return line, Lsr: Sub return line

Claims (6)

  A main water supply system that supplies cooling water to the object to be cooled from the cooling liquid tank containing the cooling liquid according to the first water supply condition, and supplies cooling water to the object to be cooled from the cooling liquid tank according to the second water supply condition. A multi-system cooling device comprising a sub-water supply system, wherein a shared system for sending cooling water from the cooling liquid tank to a common water supply line by a main pumping pump, and at least cooling water sent to the shared water supply line Sub-water supply by branching into two systems, a main water supply system for supplying one of the branched cooling water to the object to be cooled through a main water supply line, and sending the other branched cooling water by a sub-pressure pump The sub-water supply system that supplies the object to be cooled through the line, and the flow rate of the sub-water supply line can be set by connecting between the sub-water supply line and the main water supply line. Quantity set and the circuit, said main water supply line and the coolant connected between the tank and characterized in that it comprises a hydraulically settable pressure setting circuit of the main water supply line multilineage cooling system.   A main return line that returns the cooling water supplied from the main water supply system to the object to be cooled to the cooling liquid tank, and a sub return line that returns the cooling water supplied from the sub water supply system to the object to be cooled to the cooling liquid tank. The multi-system cooling device according to claim 1, comprising:   The multi-system cooling device according to claim 1, wherein a cooler that cools cooling water flowing through the common water supply line is connected to the common water supply line.   4. The multi-system cooling device according to claim 1, wherein a relief valve for limiting water pressure is connected between the sub water supply line and the coolant tank.   Cooling water is supplied to the object to be cooled from the cooling liquid tank in which the cooling liquid is stored through the main water supply system through the first water supply condition, and from the cooling liquid tank through the sub water supply system through the second water supply condition. A water supply setting method of a multi-system cooling device for supplying cooling water to an object to be cooled, wherein the cooling water sent from the cooling liquid tank to a common water supply line by a main pumping pump is branched into at least two systems and branched The cooled water is supplied to the object to be cooled through the main water supply line of the main water supply system, and the other branched water is sent out by the sub pumping pump, so that the cooled water is supplied through the sub water supply line of the sub water supply system. And supplying the flow rate of the sub water supply line to the target flow rate by a flow rate setting circuit connected between the sub water supply line and the main water supply line. And then setting the water pressure of the main water supply line to a target water pressure value by a water pressure setting circuit connected between the main water supply line and the coolant tank. .   6. The water supply setting method for a multi-system cooling apparatus according to claim 5, wherein the cooling water flowing through the shared water supply line is cooled by a cooler.

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