JP5469913B2 - Thermal insulation structure and storage device having the thermal insulation structure - Google Patents

Description

  The present invention, for example, ensures that the high temperature heat dissipated from one unit in a precision device does not affect the other unit in the precision device adjacent to this unit and that this heat is installed in the installation environment in which these units are installed. The present invention relates to a heat insulating structure that insulates heat dissipated from one unit so as not to have an influence, and a storage device having the heat insulating structure.

  For example, precision devices such as semiconductor manufacturing devices and precision measuring instruments are composed of a plurality of units. These units are greatly affected by temperature changes in the environment in which the precision machine is installed. Therefore, this heat does not affect the installation environment in which these units are installed and does not affect the high temperature heat dissipated from one unit in the precision device to the other unit in the precision device adjacent to this unit. As described above, one unit is required to have high heat insulation performance for heat insulation so that the temperature of the environment in which the precision machine is installed is not changed by the heat generated from itself.

  Therefore, in one unit, a heat insulating material such as a vacuum heat insulating material is disposed on the outer surface of one unit for heat insulation. The heat insulating material may also be disposed in the other unit. Moreover, the heat insulation material may be arrange | positioned between one unit and the other unit.

  For example, Patent Document 1 discloses a vacuum heat insulating panel that has high heat insulating performance and can be used at high temperatures, and a device including the heat insulating panel.

JP 2008-249003 A

  Examples of the heat insulating material described above include inexpensive urethane foam. However, the heat insulating performance of inexpensive heat insulating materials such as urethane foam is low.

  Further, a heat insulating material having high heat insulating performance is expensive. In addition, heat insulating materials with high heat insulating performance need to be supplemented with other heat insulating materials such as urethane foam because gaps are created at the ends of the heat insulating materials. There will be a cost. Therefore, it takes cost and labor to arrange a heat insulating material having high heat insulating performance in the unit.

  Therefore, in view of the above circumstances, an object of the present invention is to provide a heat-insulating structure that insulates inexpensively and with high performance and a storage device having the heat-insulating structure.

  In order to achieve the object, the present invention sets the temperature of the environment in which the second unit, which is disposed in the first unit having a heating element that generates heat, and is affected by the temperature change of the environment in which the device is installed, is installed. A heat insulating structure having a heat insulating performance so as not to be changed by the heat generated from the heat generating element, wherein the first heat is generated to cool the heat generated from the heat generating element and accumulated in the first unit. A fan that sucks gas from the outside of the unit and sends the gas toward the inside of the first unit, and a box shape, and the fan of the first unit is formed from the outside of the first unit by the fan. A panel having the gas flow path inside the box fed toward the inside, and insulating the heat in the first unit, and the panel is in the vicinity of the outer edge of the front of the panel A plurality of air inlets that are arranged along the outer edge and intake the gas from the outside, and are arranged on the back surface of the panel to be mounted on the fan. The opening is arranged on the same straight line, and is formed between an air supply port for supplying the gas sucked from the intake port to the inside of the first unit, and the front surface and the back surface. The flow path for flowing the gas from the intake port to the air supply port, and in order to insulate the heat in the first unit by the flowing gas, the inside of the first unit through the back surface And a flow path portion formed so as to be in contact with the heat insulating structure.

  In order to achieve the object, the present invention provides the heat insulating structure described above, wherein the fan is disposed on the back surface of the panel.

  In order to achieve the object of the present invention, the gas is an opening area of the inlet, an arrangement position of the inlet, a thickness of the panel, and a length from the inlet to the air inlet. The heat insulation condition composed of the air supply length and the air volume of the fan is set to a desired value, and the arrangement structure described above is provided.

In order to achieve the object, the present invention is a heat insulating structure disposed in a unit that accommodates a heating element in an internal space, and is provided in contact with the internal space, and gas in an external space of the unit is supplied to the internal space. Forming a flow path portion between the inner surface panel provided with an air supply port for supplying air to the space and the outer space side with respect to the inner surface panel and allowing the gas to flow between the inner surface panel and the outer panel; An outer surface panel provided with an inlet for introducing the gas from the space into the flow path, and an air supply fan provided at the air supply port for supplying the gas to the internal space, The air supply port and the air intake port are respectively arranged so that the gas flows in the flow path part along the inner surface panel and the outer surface panel, and the air supply port and the air intake port are the inner surface. In the plane of the panel and the outer panel Radiating between the inner panel and the outer panel between the inner panel and the outer panel in the vertical direction and between the inner panel and the outer panel in the vertical direction. Provided is a heat insulating structure characterized in that an intermediate panel for suppressing the above is disposed .

  A storage device having the heat insulating structure described above is provided.

  ADVANTAGE OF THE INVENTION According to this invention, the heat insulation structure which insulates inexpensively and highly efficiently and the storage apparatus which has this heat insulation structure can be provided.

Fig.1 (a) is a front view of the heat insulation structure of this invention. FIG.1 (b) is a schematic sectional drawing of the heat insulation structure in the AA line shown to Fig.1 (a). It is a schematic diagram which shows gas supply in the heat insulation structure shown in FIG. 2, FIG. FIG. 3A is a front view of the heat insulating structure. FIG. 3B is a diagram showing the heat insulating structure shown in FIG. 3A in a driving state. Fig.4 (a) is a front view of the heat insulation structure which has a radiation prevention board. FIG. 4B is a diagram showing the heat insulating structure shown in FIG. 4A in a driving state.

Hereinafter, an embodiment according to the present invention will be described in detail with reference to FIGS. 1 and 2.
For example, precision devices (not shown) such as semiconductor manufacturing devices and precision measuring instruments are composed of a plurality of units. One unit (housing device) 10 has a heating element 11 that generates heat in the inside 10 a of the unit 10. The heating element 11 is, for example, a motor. The other unit (not shown) that is greatly influenced by the temperature change of the environment in which the precision device is installed is installed adjacent to or around the unit 10.

  The unit 10 has a heat insulating structure 30 having heat insulating performance so that the temperature of the environment in which the unit (precision device) is installed is not changed by the heat generated from the heating element 11.

  The heat insulating structure 30 is generated from the heating element 11, sucks gas from the outside 10b to cool the heat accumulated in the inside 10a of the unit 10, and sends a gas toward the inside 10a of the unit 10; Two sheets of low-emissivity polished thin plates are bent to form a box shape, heat from the unit 10 is insulated by the low-emissive polished thin plates, and the fan 33 is directed from the outside 10b of the unit 10 toward the inside 10a of the unit 10. And a panel 35 having a gas flow path inside the box to be fed.

  The fan 33 is disposed on the back surface 35a (inner surface panel) of the panel 35, for example. More specifically, the fan 33 is disposed so as to be offset from the same straight line as an air inlet 37 described later in the thickness direction of the panel 35. In the present embodiment, the fan 33 is disposed, for example, at the center of the back surface 35a.

  The panel 35 is fixed to the unit 10 by screws or the like (not shown) via the back surface 35a of the panel 35. The back surface 35 a also serves as a side surface of the unit 10. Further, the front surface 35b (outer panel) of the panel 35 is exposed to the outside 10b.

  The panel 35 is formed in a box shape by bending two low-emissivity polished thin plates, but it is sufficient that at least one of the panel 35 and the front surface 35b is subjected to a low radiation treatment.

The panel 35 is disposed along the outer edge 35 c in the vicinity of the outer edge 35 c (four sides) of the front surface 35 b, and has a plurality of air inlets 37 for sucking gas from the outside 10 b and the rear surface 35 a to be mounted on the fan 33. Is formed between the front surface 35b and the back surface 35a (inside the panel 35), and is provided between the front surface 35b and the back surface 35a. And a flow path portion 41 that is a flow path for flowing gas from the intake port 37 to the air supply port 39.
In other words, the back surface 35a (inner surface panel) is provided in contact with the interior 10a (internal space). The back surface 35a has an air supply port 39 for supplying (introducing) gas from the outside 10b (external space) of the unit 10 to the inside 10a. Further, the front surface 35b (outer panel) is provided on the outer 10b side with respect to the rear surface 35a (inner panel). The front surface 35b forms a flow channel portion 41 through which gas flows between the front surface 35a and has an intake port 37 for sucking (introducing) gas into the flow channel portion 41 from the outside 10b.

  The intake port 37 and the air supply port 39 are arranged so that the gas flows through the flow path portion 41 along the back surface 35a and the front surface 35b.

  The intake port 37 has, for example, a rectangular shape. The intake ports 37 are arranged in a row along the outer edge 35c.

  The same number of air supply ports 39 as the fans 33 are arranged. The fan 33 described above is provided in the air supply port 39 and supplies gas to the inside 10a. The air supply port 39 is disposed at the center of the back surface 35 a so as to face the fan 33. The air supply port 39 has, for example, a packing (not shown) that is in close contact with the fan 33 so that gas does not leak from between the air supply port 39 and the fan 33. The air supply port 39 and the air intake port 37 are arranged at different positions when viewed from the thickness direction of the panel 35 (perpendicular to the plane of the back surface 35a and the front surface 35b). In other words, the air supply port 39 is arranged so as to be shifted from the same straight line as the air intake port 37 in the thickness direction of the panel 35. More specifically, the air supply port 39 and the air intake port 37 are disposed so that the gas flows in a laminar flow through the flow path portion 41.

  In the present embodiment, the flow path portion 41 is a space portion formed inside the panel 35 by the front surface 35 b and the back surface 35 a and communicates with the intake port 37 and the air supply port 39.

  In the present embodiment, when the heating element 11 generates heat, the temperature inside the unit 10a of the unit 10 having the heating element 11 becomes higher than the temperature of the outside 10b. This heat is transferred to the back surface 35a. Therefore, the back surface 35a has a higher temperature than the front surface 35b in contact with the outside 10b. Furthermore, heat is transferred from the back surface 35a to the front surface 35b by radiation of the back surface 35a and the front surface 35b, and is also transferred from the back surface 35a to the front surface 35b by conduction. As a result, heat is transferred from the front surface 35 b to the outside 10 b, and the temperature of the environment in which the unit (precision device) is installed is changed by the heat generated from the heating element 11.

  Therefore, the back surface 35a and the front surface 35b suppress heat transfer from the back surface 35a to the front surface 35b by radiation of the back surface 35a and the front surface 35b, and suppress heat transfer from the front surface 35b based on this heat transfer to the outside 10b. Therefore, it is a polished plate with a low heat radiation rate. Generally, the radiant energy that radiates heat is proportional to the emissivity. For this reason, when the emissivity is low, the radiant energy becomes low, and as a result, heat transfer to the outside 10b is suppressed.

  Further, when heat transfer is generated by conduction from the unit 10 to the front surface 35b through the back surface 35a (heat exchange occurs), the intake port 37 includes a plurality of air intake ports to suppress heat transfer by conduction from the front surface 35b to the external 10b. The heat transfer area (surface area) of the front surface 35b is reduced. In addition, the flow passage portion 41 is formed inside the panel 35 so as to be in contact with the entire interior 10a of the unit 10 via the back surface 35a. In order to improve the heat insulation efficiency, the air inlet 37 is disposed in the vicinity of the outer edge 35c. ing.

  Moreover, in the flow path part 41, the temperature of the flow path part 41 on the back surface 35a side is higher than the temperature of the flow path part 41 on the front face 35b side. In the present embodiment, the opening area of the intake port 37, the arrangement position of the intake port 37 and the air supply port 39, the thickness t of the panel 35 (distance between the front surface 35 b and the back surface 35 a), and the intake port 37. The heat insulation condition composed of the gas supply length L that is the length to the air supply port 39 and the air volume of the fan 33 is set to a desired value in advance. As a result, the gas flows through the panel 35 in a laminar flow state (more specifically, flows from the intake port 37 to the air supply port 39 through the flow channel portion 41), and the temperature boundary layer does not reach the front surface 35b and flows Heat transfer from the back surface 35a to the front surface 35b due to convection is suppressed in the passage portion 41, and heat transfer from the front surface 35b to the outside 10b is suppressed by this suppression.

  If the heat insulation condition is not set as desired, the gas does not flow inside the panel 35 in a laminar state, and convection occurs inside the panel 35. Thereby, heat transfer from the back surface 35a to the front surface 35b is not suppressed by the flowing gas, and heat transfer from the front surface 35b to the outside 10b is not suppressed.

In the present embodiment, the temperature boundary layer refers to the temperature of the gas in the flow path portion 41 heated by heat transfer from the inside 10 a of the unit 10 and the gas sent from the outside 10 b to the flow path portion 41 through the intake port 37. It is a layer which shows the boundary of the temperature.
Moreover, in order to insulate the heat | fever in the unit 10 with the flowing gas, it is suitable for the flow-path part 41 to be formed in the inside of the panel 35 so that the whole inside 10a of the unit 10 may be contacted via the back surface 35a.

  Thus, the heat insulating structure 30 cools the unit 10 by supplying gas from the air supply port 39 to the unit 10 by the fan 33, and the air supply port 39 from the air intake port 37 through the flow path portion 41 by the fan 33. The heat in the unit 10 is insulated through the back surface 35a by the gas flowing up to.

Next, the operation method of this embodiment will be described.
The back surface 35a is disposed in the unit 10 by screws. At this time, the air supply port 39 is mounted on the fan 33 via packing so that gas does not leak from between the air supply port 39 and the fan 33.

  When the heating element 11 generates heat, the unit 10 generates heat. Then, the temperature in the inside 10a of the unit 10 becomes higher than the temperature in the outside 10b. Therefore, the temperature of the back surface 35a in contact with the inside 10a of the unit 10 is higher than the temperature of the front surface 35b in contact with the outer surface. Thereby, in the flow path part 41, the temperature of the flow path part 41 on the back surface 35a side becomes higher than the temperature of the flow path part 41 on the front surface 35b side.

  Then, the fan 33 is driven and the gas is sucked into the intake port 37 from the outside 10b. The gas sucked from the air inlet 37 by the fan 33 flows from the air inlet 37 to the flow channel portion 41, and further flows from the flow channel portion 41 to the air supply port 39. That is, the gas flows from the intake port 37 to the air supply port 39 through the flow path portion 41 provided inside the panel 35. At this time, the gas flows in the panel 35 from the outer edge 35c side of the panel 35 toward the center by the flow path portion 41, and contacts the entire interior 10a of the unit 10 via the back surface 35a.

At this time, as described above, the back surface 35a having a temperature higher than that of the front surface 35b exchanges heat with the gas flowing through the flow path portion 41. More specifically, the heat in the interior 10a of the unit 10 moves (absorbs and is transmitted) to the gas flowing through the flow path portion 41 through the back surface 35a. Thereafter, the heat flows from the gas to the air supply port 39 through the flow path portion 41 together with the gas by the fan 33 before moving from the gas to the front surface 35b and is supplied to the inside 10a of the unit 10. That is, the gas is supplied to the interior 10a of the unit 10 with heat exchanged from the interior 10a of the unit 10 to the back surface 35a, and does not transmit this heat to the front surface 35b.
At this time, the gas flows inside the panel 35 in a laminar state due to the heat insulation condition, and the temperature boundary layer does not reach the front surface 35b. Therefore, the heat insulation structure 30 suppresses heat transfer from the back surface 35a to the front surface 35b due to convection in the flow path portion 41, suppresses heat transfer from the front surface 35b to the outside 10b, and insulates heat in the unit 10.

  In general, the front surface 35b and the back surface 35a exchange heat by radiation. However, in the present embodiment, the front surface 35b and the back surface 35a are polished plates having a low heat radiation rate. Therefore, the heat insulation structure 30 suppresses heat transfer (heat exchange) from the back surface 35a to the front surface 35b by radiation of the back surface 35a and the front surface 35b, and suppresses heat transfer from the front surface 35b based on this heat transfer to the outside 10b. Then, heat in the unit 10 is insulated.

  At this time, the back surface 35 a exchanges heat with the gas flowing through the flow path portion 41. More specifically, the heat in the back surface 35a is transferred (absorbed / transmitted) to the gas flowing through the flow path portion 41 through the back surface 35a. Thereafter, the heat flows from the gas to the air supply port 39 through the flow path portion 41 together with the gas by the fan 33 before moving from the gas to the front surface 35 b, and is supplied to the inside 10 a of the unit 10. That is, the gas is supplied to the interior 10a of the unit 10 with heat in the interior 10a of the unit 10, and does not transmit this heat to the front surface 35b.

  In addition, the front surface 35 b that has been subjected to minute heat transfer by radiation also exchanges heat with the gas flowing through the flow path portion 41. More specifically, the heat in the front surface 35b moves (absorbs / transmits) to the gas flowing through the flow path portion 41 through the front surface 35b. Thereafter, before the heat is transferred from the front surface 35b to the outside 10b, the heat flows through the flow passage portion 41 to the air supply port 39 by the fan 33 and is supplied to the inside 10a of the unit 10. That is, the gas is supplied to the inside 10a of the unit 10 with heat at the front surface 35b, and does not transmit this heat to the outside 10b.

  Further, since the flow path portion 41 is formed inside the panel 35 so as to be in contact with the entire interior 10a of the unit 10 via the back surface 35a, the front surface 35b and the back surface 35a are composed of a large amount of gas flowing through the flow path portion 41. Exchange heat. Thereby, the heat insulation structure 30 insulates the heat in the unit 10.

  The panel 35 conducts heat from the unit 10 through the screw to the back surface 35a, and further heat exchange occurs from the back surface 35a to the front surface 35b. However, the heat transfer area (surface area) of the front surface 35 b is reduced by the intake port 37. Therefore, the heat insulating structure 30 suppresses heat transfer due to conduction from the front surface 35b to the outside 10b and insulates heat in the unit 10.

  As described above, the gas that has flowed to the air supply port 39 is supplied to the inside 10 a of the unit 10 through the air supply port 39 without leaking by the packing. As a result, the heat insulating structure 30 supplies gas to the heating element 11 disposed in the interior 10 a of the unit 10 and cools the unit 10.

  In this way, the heat insulating structure 30 suppresses heat transfer due to convection, radiation, and conduction by the fan 33 and the panel 35, prevents a temperature rise of the front surface 35 b through the back surface 35 a, and insulates heat in the unit 10. Thereby, the heat insulation structure 30 prevents the influence to the unit by a temperature change, and prevents the temperature change of the environment where a precision apparatus is installed. Further, the heat insulating structure 30 cools the heating element 11 by the fan 33, prevents the influence of the temperature change on the unit, and prevents the temperature change of the environment where the precision device is installed.

  As described above, in the present embodiment, the fan 33 is provided, the air inlet 37, the air inlet 39, and the flow path portion 41 are provided in the panel 35, and the panel 35 is formed by a polished thin plate having a low emissivity. By suppressing heat transfer due to convection, radiation, and conduction by the structure 30, it is possible to provide a heat insulating structure 30 that insulates at low cost and with high performance and a unit (storage device) 10 having the heat insulating structure 30.

  In the present embodiment, by disposing the fan 33, gas can be supplied to the heating element 11, and the heating element 11 can be cooled.

  In the present embodiment, a plurality of intake ports 37 are arranged, and the intake ports 37 are arranged along the outer edge 35c in the vicinity of the outer edge 35c of the front surface 35b, so that heat transfer by conduction from the front surface 35b to the outside 10b is performed. The heat in the unit 10 can be insulated.

  Moreover, in this embodiment, by forming the panel 35 with a polished thin plate having a low emissivity, heat transfer (heat exchange) from the back surface 35a to the front surface 35b is suppressed by radiation, and the front surface 35b based on this heat transfer is used. Heat transfer to the outside 10b can be suppressed and heat in the unit 10 can be insulated. Further, in the present embodiment, in the thickness direction of the panel 35, the air supply port 39 is arranged so as to be shifted from the same straight line as the intake port 37, and the flow path is in contact with the entire interior 10a of the unit 10 via the back surface 35a. By forming the portion 41 inside the panel 35, heat exchange between the back surface 35a and the gas flowing through the flow path portion 41 can be performed more effectively, and heat in the unit 10 can be insulated.

  Moreover, in this embodiment, gas can be flowed in the state of a laminar flow by adjusting the heat insulation conditions as desired, and heat transfer from the front surface 35b to the outside 10b due to convection is suppressed in the flow path portion 41, and in the unit 10 Heat can be insulated.

  In the present embodiment, the heat insulating structure 30 is disposed in the unit 10, but it is not necessary to be limited to this, and it may be disposed in the other unit or between the unit 10 and the unit. May be.

  In this embodiment, since the back surface 35a also serves as the side surface of the unit 10, the unit 10 to be insulated can be made small and space-saving.

In the present embodiment, the intake port 37 is disposed in the vicinity of the outer edge 35c, and the air supply port 39 is disposed in the center of the back surface 35a. However, the present invention is not limited to this.
As shown in FIG. 3, for example, when the fan 33 is disposed at the upper center of the back surface 35a, the air supply port 39 is unevenly disposed at the upper center, which is the end of the back surface 35a, and the intake port 37 is disposed at the back surface. The end portion of 35a is unevenly distributed along the outer edges 35c of the left and right and the lower portion, which are the end portions of the front surface 35b having different arrangement positions in the thickness direction of the panel 35 (the vertical direction described above). In this way, the intake ports 37 and the air supply ports 39 can freely change the arrangement positions as desired according to the arrangement positions of the fans 33.

  At this time, in the panel 35, the gas flows upward from the left and right sides and the outer edge 35 c of the lower panel 35.

  In this case, the unit 10 has a fan 51 and an exhaust duct 53 that are exhausted toward the outside 10b of the unit 10 and are exhausted by the fan 33 and that cools the heating element 11 below the heating element 11. ing.

  The fan 33 is disposed in the unit 10. The exhaust duct 53 has, for example, a packing so that gas does not leak from between the fan 51 and the exhaust duct 53. The exhaust duct 53 is mounted on the fan 51 through packing, and is disposed on the floor surface 10c on which the unit 10 is installed.

  As a result, the gas is sent from the upper side to the lower side of the unit 10 inside the unit 10a. Specifically, the gas is sent from the upper side of the unit 10 toward the heating element 11 by the fan 33, and after cooling the heating element 11, the gas is sent from the heating element 11 toward the exhaust duct 53 by the fan 51. .

  In the present embodiment, as shown in FIG. 4, the panel 35 may further include a radiation suppressing plate 55 serving as an intermediate panel that suppresses radiation between the front surface 35 b and the back surface 35 a. The radiation suppressing plate 55 is disposed in the flow path portion 41. In this case, the intake port 37 is disposed at the center of the front surface 35b.

  That is, the air supply port 39 and the air intake port 37 are arranged on the same straight line in the thickness direction of the panel 35, and the radiation suppressing plate 55 is located between the air supply port 39 and the air intake port 37 in the thickness direction of the panel 35. It is arranged on a straight line.

  The gas flows from the central portion to the outer edge 35c side of the panel 35 by the radiation suppression plate 55 from the central portion by the intake port 37 and then returns to the central portion where the air supply port 39 is disposed. That is, the gas flows along the radiation suppression plate 55. At this time, the radiation suppression plate 55 suppresses radiation from the front surface 35b and the back surface 35a.

  Thereby, in this embodiment, in the panel 35, radiation from the back surface 35a to the front surface 35b can be further suppressed, and heat transfer due to radiation can be prevented from being transmitted from the unit 10 to the outside 10b. In addition, heat transfer due to radiation can be further suppressed. Therefore, in this embodiment, heat insulation performance can be improved more.

  The present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. Further, various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the embodiment.

  DESCRIPTION OF SYMBOLS 10 ... Unit (storage device), 10a ... Inside, 10b ... Outside, 10c ... Floor surface, 11 ... Heating element, 30 ... Heat insulation structure, 33 ... Fan, 35 ... Panel, 35a ... Back, 35b ... Front, 35c ... Outer edge 37... Air intake port, 39... Air supply port, 41... Channel portion, 51... Fan, 53.

Claims (4)

It is a heat insulating structure disposed in a unit that houses a heating element in an internal space,
An inner surface panel provided in contact with the internal space and provided with an air supply port for supplying gas in the external space of the unit to the internal space;
Provided on the outer space side of the inner surface panel is a flow path portion through which the gas flows between the inner surface panel, and an intake port for introducing the gas from the outer space into the flow path portion is provided. An outer panel,
An air supply fan that is provided in the air supply port and supplies the gas to the internal space;
Comprising
The air supply port and the air intake port are respectively arranged so that the gas flows through the flow path part along the inner surface panel and the outer surface panel ,
The air supply port and the air intake port are arranged on the same straight line in a direction perpendicular to the plane of the inner surface panel and the outer surface panel,
An intermediate panel that suppresses radiation between the inner surface panel and the outer surface panel is disposed between the inner surface panel and the outer surface panel in the vertical direction and on the same straight line. Thermal insulation structure.   The heat insulation structure according to claim 1, wherein at least one of the inner surface panel and the outer surface panel is subjected to a low radiation treatment.   The heat insulation according to any one of claims 1 to 2, wherein the air supply port and the air intake port are arranged so that the gas flows in a laminar flow state in the flow path portion. Construction.   A storage device having the heat insulating structure according to any one of claims 1 to 3.

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