JP5460356B2 - Imaging device - Google Patents

Description

The present invention relates to a CCD (Charge Coupled Device) type or a CMOS (Complementary Metal).
The present invention relates to an imaging device using an imaging device such as an Oxide Semiconductor) type.

  2. Description of the Related Art Conventionally, an imaging apparatus used for a digital camera, an optical sensor, or the like, in which an imaging element such as a CCD type or a CMOS type is mounted on a wiring board is known. In such an imaging apparatus, for example, an imaging element is mounted on a wiring board, a lens is disposed on the imaging element by a lens fixing member, and the imaging element is sealed by the lens and the lens fixing member. It is. And such an imaging device converts the light (image) input into the light-receiving part of the image pick-up element mounted in the wiring board into an electrical signal by the image pick-up element, and connects the electrical connection members such as bonding wires and the wiring board. The signal is output to an external circuit or the like in the digital camera via a wiring conductor and an external terminal.

  A wiring board used in such an imaging device is manufactured using an insulating board made of an insulator such as ceramics or resin and formed with a wiring made of a conductor such as a metal. For example, the insulating board is made of ceramic. In some cases, a plurality of ceramic green sheets formed in a predetermined shape are laminated to form a laminate, and a wiring conductor made of a metallized conductor using metal powder such as tungsten or molybdenum is disposed on the surface or inside. And it is produced by baking this.

  And while mounting an image pick-up element on such a wiring board, each electrode of an image pick-up element was electrically connected to each corresponding wiring conductor via electrical connection members, such as solder and a bonding wire, and provided with a lens. A lid made of metal, ceramics, glass, resin, or the like is placed so that the lens is positioned above the image sensor and is bonded to the upper surface of the wiring board so as to cover the light receiving portion of the image sensor to seal the image sensor By doing so, an imaging device is manufactured. The lid body is bonded to the upper surface of the wiring board by a bonding material such as resin (see, for example, Patent Document 1).

  In addition, some imaging devices have an autofocus function for multi-functionality, and stepping motors, linear motors, and reverse piezoelectric effects are used as actuators to adjust the distance between the lens and the imaging device. Piezo drives are known. In such a camera with an autofocus function, the actuator and the lid are integrated for miniaturization, and the wiring conductor for the actuator is arranged inside the lid, so that the lid can be used without using a socket or the like. The wiring conductors formed inside each of the wiring boards are exposed on the respective surfaces, and the wiring conductors are joined to each other with a joining material made of a conductive resin, thereby electrically connecting the actuator and the external circuit board. There are known ones (see, for example, Patent Document 2).

  In recent years, there has been a demand for mounting a small electronic component on the lid for miniaturization, and in order to electrically connect the small electronic component in the same manner as the actuator in the camera with the autofocus function described above. In addition, it is conceivable that the wiring conductors formed inside the lid and the wiring board are exposed on the surface and are electrically connected to the outside by bonding them with a bonding material made of a conductive resin.

JP2003-163297 JP 2009-284260

  However, in recent years, there has been a demand for downsizing and high functionality of imaging devices. Corresponding to this, downsizing of imaging devices is progressing. However, for example, when mounting an imaging device that has become larger with higher functionality, a certain size is required as a region for mounting the imaging device. It is said that.

  As described above, in order to reduce the size of the image pickup apparatus while the area where the image pickup element is mounted has a certain size, it is required to reduce the area of the lid bonding area where the wiring board and the lid are bonded. It was done. For this reason, if the width of the lid bonding area is reduced to reduce the area, the area where the wiring board and the lid are bonded with the bonding material is reduced, so that the bonding between the wiring board and the bonding material is weakened, and the wiring There was a problem that the bonding material was peeled off from the substrate and the lid body was easily peeled off from the wiring board.

  Further, in order to protect the wiring conductor from corrosion or the like, a metal thin film such as Au plating is formed on the wiring conductor exposed on the surface of the wiring board to form a connection electrode. Since the surface roughness of the surface of the connection electrode subjected to Au plating or the like is smaller than that of the surface, the bonding strength is higher than that of the portion where the wiring board and the lid are bonded by a bonding material made of an insulating resin. There was a problem that the bonding material was easily peeled off from the wiring board starting from peeling of the bonding surface between the connection electrode and the conductive resin.

  Then, if the lid is peeled off due to the bonding material being peeled off from the wiring board, the dust that has entered from the air gap will cause a shadow on the image pickup surface of the image pickup device, making it impossible to take a good image. The purpose of sealing and protecting from the external environment cannot be achieved.

  In addition, since the bonding material made of conductive resin electrically connects the wiring conductor provided on the lid and the connection electrode provided on the wiring board, all of the bonding material was not completely peeled off. However, if the portion of the bonding material made of the conductive resin is peeled off, the wiring conductor and the connection electrode cannot be electrically connected, so that the imaging device does not function.

  The present invention has been devised in view of the above-described problems of the prior art, and an object thereof is to provide an imaging apparatus in which a lid is firmly joined.

In the imaging device of the present invention, an external terminal is formed on at least one of the lower surface or the side surface, and a first wiring conductor having one end electrically connected to the external terminal and the other end exposed on the upper surface is formed inside. A wiring board, an image sensor mounted on the upper surface of the wiring board, and a lid joint region surrounding the periphery of the image sensor on the upper surface of the wiring board and electrically connected to the first wiring conductor A connection electrode, a lens, and a drive device for moving the lens in a direction along its optical axis and an electronic component, and a frame-like shape in the lid joint region so as to accommodate the imaging device therein A box-shaped lid joined to the lower surface of the lid, a second wiring conductor connected to the driving device or the electronic component and drawn to the lower surface of the lid, the lid joined region of the wiring board, and the The lower surface of the lid and A first bonding material that is disposed between and electrically connects the connection electrode and the second wiring conductor; and a second bonding material that is formed of an insulating resin that bonds the lid and the wiring board. In the imaging device including a bonding material, a hole is formed in the connection electrode and the wiring board so as to pass through the connection electrode and reach a middle in a thickness direction of the wiring board. It is characterized by being filled with one bonding material.

  The imaging device according to the present invention is characterized in that, in the above configuration, the hole has a larger bottom surface than an opening.

  The image pickup apparatus according to the present invention is characterized in that, in the above-described configuration, the hole gradually increases from the opening toward the bottom surface.

  According to the imaging apparatus of the present invention, the external terminal is formed on at least one of the lower surface or the side surface, and the first wiring conductor is formed in which one end is electrically connected to the external terminal and the other end is exposed on the upper surface. A wiring board, an imaging element mounted on the upper surface of the wiring board, a connection electrode formed in a lid bonding region surrounding the periphery of the imaging element on the upper surface of the wiring board, and electrically connected to the first wiring conductor; And a lens, and at least one of a driving device for moving the lens in the direction along the optical axis and an electronic component, and a frame-shaped lower surface is bonded to the lid bonding region so as to house the image sensor inside The box-shaped lid, the second wiring conductor connected to the driving device or the electronic component and drawn to the lower surface of the lid, and disposed between the lid bonding area of the wiring board and the lower surface of the lid Electrically connect the electrode and the second wiring conductor An imaging apparatus including a first bonding material made of conductive resin and a second bonding material made of insulating resin for bonding the lid and the wiring board, wherein the connection electrode and the wiring board are connected to the connection electrode. Since the hole reaching the middle of the thickness direction of the wiring board is formed through the hole, and the hole is filled with the first bonding material, the bonding strength between the connection electrode and the first bonding material is increased. Peeling of the connection electrode and the first bonding material can be reduced, and the first bonding material and the second bonding material can be peeled off from the wiring board, and the lid can be peeled off from the wiring board. it can. And since it can reduce that a space | gap arises between a cover body and a wiring board, it can prevent that dust penetrate | invades and a 1st wiring conductor and a connection electrode disconnect. Therefore, it is possible to obtain an image pickup apparatus that can take a good image by sealing the image pickup element and protecting it from the external environment.

  In addition, in the above-described configuration, when the hole has a larger bottom surface than the opening, the imaging device according to the present invention is configured such that when the wiring substrate and the lid are joined via the joining material, the hole is the first joining material. When the first bonding material is cured by filling with, the hardened first bonding material is caught in the hole and is difficult to come off, so that the bonding material is peeled off from the connection electrode even if a force to peel off the lid is applied. Thus, the possibility that the lid body is peeled off can be more effectively reduced.

  In the imaging device of the present invention, in the above configuration, when the hole is gradually enlarged from the opening toward the bottom surface, the hole of the hole is formed when the wiring board and the lid are bonded via the bonding material. Since there is no corner on the inner wall surface, the first bonding material can be easily filled in the hole without any gaps. Therefore, the first bonding material after curing is obtained by filling the first bonding material well and widening the bonding area with the connection electrode. Can sufficiently secure the portion caught in the hole, and the possibility that the first bonding material is peeled off from the connection electrode and the lid is peeled off can be more effectively reduced.

(A) is a top view which removed the cover body provided with the lens which shows an example of embodiment of the imaging device of this invention, (b) is sectional drawing in the AA of (a). It is sectional drawing which shows an example of embodiment of the imaging device of this invention. It is sectional drawing which shows the other example of embodiment of the imaging device of this invention. It is sectional drawing which shows the other example of embodiment of the imaging device of this invention. It is sectional drawing which shows the other example of embodiment of the imaging device of this invention. It is sectional drawing which shows the other example of embodiment of the imaging device of this invention.

  The imaging apparatus of the present invention will be described with reference to the accompanying drawings. 1 to 6, 1 is a wiring board, 2 is an external terminal, 3 is a first wiring conductor, 4 is a hole, 5 is a connection electrode, 6 is a connection terminal, 7 is an image sensor, 7a is a light receiving portion, and 8 is Lid bonding area, 9 is a lid, 10 is a lens, 11 is a driving device, 12 is an electronic component, 13 is a second wiring conductor, 14 is a first bonding material, 15 is a second bonding material, 16 is a connection member, Reference numeral 17 denotes a recess.

  As shown in the examples shown in FIGS. 1 to 6, the imaging device of the present invention has an external terminal 2 formed on at least one of a lower surface or a side surface, one end is electrically connected to the external terminal 2, and the other end is A wiring board 1 on which the first wiring conductor 3 exposed on the upper surface is formed, an image sensor 7 mounted on the upper surface of the wiring board 1, and a lid joint region surrounding the periphery of the image sensor 7 on the upper surface of the wiring board 1 8, a connection electrode 5 electrically connected to the first wiring conductor 3, a lens 10, and a driving device 11 for moving the lens 10 in a direction along the optical axis thereof, and an image pickup device inside A box-like lid 9 having a frame-like lower surface joined to the lid-joining region 8 so as to accommodate 7, and a second wiring conductor 13 connected to the driving device 11 and drawn to the lower surface of the lid 9. , Disposed between the lid joint region 8 of the wiring board 1 and the lower surface of the lid 9, An image pickup apparatus including a first bonding material 14 made of a conductive resin that electrically connects the two wiring conductors 13 and a second bonding material 15 made of an insulating resin that bonds the lid 9 and the wiring board 1. In addition, a hole 4 is formed in the connection electrode 5 and the wiring substrate 1 so as to penetrate the connection electrode 5 and reach the middle of the wiring substrate 1 in the thickness direction. The hole 4 is filled with the first bonding material 14. Yes.

  According to such an imaging apparatus of the present invention, since the bonding strength between the connection electrode 5 and the first bonding material 14 is increased, it is possible to reduce the separation of the connection electrode 5 and the first bonding material 14. It can be reduced that the first bonding material 14 and the second bonding material 15 are peeled off from the wiring board 1 and the lid body 9 is peeled off from the wiring board 1. And since it can reduce that a space | gap arises between the cover body 9 and the wiring board 1, it can prevent that a dust penetrate | invades. Moreover, it is possible to prevent the first wiring conductor 3 and the connection electrode 5 from being disconnected. Therefore, it is possible to obtain an image pickup apparatus that can take a good image by sealing the image pickup element 7 and protecting it from the external environment.

  In the imaging apparatus of the present invention, in the above configuration, the hole 4 is preferably larger on the bottom surface than on the opening. At this time, when the lid 9 is bonded to the wiring board 1 via the first bonding material 14 made of conductive resin, the hole 4 is filled with the first bonding material 14 and the first bonding material 14 is cured. Since the hardened first bonding material 14 is caught in the hole 4 and is difficult to come out of the hole 4, even if a force for peeling the lid 9 is applied, the lid 9 may be peeled off due to the peeling of the bonding material. Can be more effectively reduced.

  In the imaging apparatus of the present invention, in the above configuration, the hole 4 is preferably gradually increased from the opening toward the bottom surface. At this time, when the lid 9 is bonded to the wiring board 1 via the first bonding material 14 made of a conductive resin, corners are formed only at the portion where the inner wall and the bottom surface of the hole 4 are in contact. Therefore, since the first bonding material 14 is easily filled in the hole 4 without a gap, it is possible to effectively reduce the portion that is not filled with the first bonding material 14 in the hole 4.

  The wiring board 1 is formed by forming external terminals 2, first wiring conductors 3 and connection terminals 6 on the surface or inside of an insulating board made of an insulating material such as ceramics or resin. In addition, the wiring board 1 may be formed in a flat plate shape as in the example shown in FIGS. 1 to 5, or a recess for mounting the image sensor 7 in the central portion as in the example shown in FIG. 6. 17 may be provided. If the insulating substrate is made of ceramics, the insulating substrate may be an aluminum oxide sintered body (alumina ceramic), an aluminum nitride sintered body, a mullite sintered body, a glass ceramic sintered body, or the like. It consists of ceramics.

When the insulating substrate is made of, for example, an aluminum oxide sintered body, an organic solvent suitable for a raw material powder such as alumina (Al ₂ O ₃ ), silica (SiO ₂ ), calcia (CaO), magnesia (MgO), etc. And a solvent, etc. are added and mixed to make a mud, and this is formed into a sheet by using a well-known doctor blade method, calendar roll method, etc. to obtain a ceramic green sheet, and then suitable for this ceramic green sheet It is manufactured by performing a punching process and laminating a plurality of sheets as necessary to form a laminated body and firing it at a high temperature (about 1500 to 1800 ° C.).

  When the insulating substrate is made of, for example, a resin, it can be formed by molding by a transfer molding method, an injection molding method, or the like using a mold that can be molded into the shape of a predetermined insulating substrate. Further, for example, a glass fiber base material impregnated with a resin, such as glass epoxy resin, in this case, a glass fiber base material is impregnated with an epoxy resin precursor, The epoxy resin precursor can be formed by thermosetting at a predetermined temperature.

  When the insulating substrate is made of ceramic, the external terminal 2, the first wiring conductor 3, the connection electrode 5 and the connection terminal 6 are tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag), copper ( Cu) or other metal powder metallized, printed on a ceramic green sheet for an insulating substrate in a predetermined shape by a screen printing method or the like with the external terminal 2, first wiring conductor 3, connection electrode 5 and connection terminal 6 conductor paste. Then, it is formed at a predetermined position of the insulating substrate by firing simultaneously with the ceramic green sheet for the insulating substrate. Of the first wiring conductor 3, the through conductor that penetrates the ceramic green sheet in the thickness direction may be filled with a through hole formed in the ceramic green sheet by printing a conductor paste.

  Such a conductor paste is mixed and kneaded by a kneading means such as a ball mill, a three-roll mill, a planetary mixer, etc., with an appropriate organic solvent and organic binder added to the above metal powder, and a dispersant added as necessary. And adjusted to an appropriate viscosity. In addition, glass or ceramic powder may be added to match the sintering behavior of the ceramic green sheet or to increase the bonding strength with the insulating substrate after firing. The conductor paste for the through conductor is adjusted to have a higher viscosity suitable for filling than the conductor paste for the wiring conductor layer, depending on the type and addition amount of the organic binder and organic solvent.

  When the insulating substrate is made of resin, the external terminal 2, the first wiring conductor 3, the connection electrode 5 and the connection terminal 6 are made of metal materials such as copper, gold, aluminum, nickel, chromium, molybdenum, titanium, and alloys thereof. Consists of. For example, the copper foil processed into the shape of the external terminal 2, the first wiring conductor 3, the connection electrode 5 and the connection terminal 6 is transferred onto a resin sheet made of glass epoxy resin, and the resin sheet to which the copper foil is transferred is laminated. It is formed by adhering with an adhesive. Of the internal conductors, the through conductors that penetrate the resin sheet in the thickness direction can be deposited on the inner surface of the through holes formed in the resin sheet by conductor paste printing or plating, or by filling the through holes. Good. Further, it is formed by integrating a metal foil or a metal column by resin molding, or depositing it on an insulating substrate using a sputtering method, a vapor deposition method, a plating method or the like.

On the exposed surfaces of the external terminal 2, the first wiring conductor 3, the connection electrode 5, and the connection terminal 6, a plating layer is deposited by a plating method such as an electrolytic plating method or an electroless plating method. The plating layer is made of a metal having excellent corrosion resistance, such as nickel or gold, and connectivity with the connecting agent 16 or the like. For example, the nickel plating layer has a thickness of about 1 to 10 μm and a thickness of about 0.1 to 3 μm. The gold plating layers are sequentially deposited. Thereby, while being able to suppress effectively that the external terminal 2, the 1st wiring conductor 3, the connection electrode 5, and the connection terminal 6 corrode, joining to the connection part agent 16 with the connection terminal 6, and an external terminal 2 and the wiring of the external electric circuit board can be strengthened.

  As shown in the example shown in FIGS. 1 to 3, a plurality of holes 4 are formed in the connection electrode 5 and the wiring board 1 so as to pass through the connection electrode 5 and reach the middle of the wiring board 1 in the thickness direction. ing. Such a hole 4 is formed as follows, for example, when the insulating base is made of ceramics. First, a through hole for the hole 4 is formed in at least the uppermost layer of the plurality of ceramic green sheets by a hole processing method such as laser processing or punching using a punching die. And this ceramic green sheet and the ceramic green sheet which does not form the through-hole for hole 4 are laminated | stacked, and it is set as a laminated body. Thereafter, a conductor paste to be the connection electrode 5 is printed around the opening of the through hole of the uppermost ceramic green sheet, and the holes 4 are formed by firing these ceramic green sheets at the same time. When the through hole for the hole 4 is formed, if the above-described through hole for the through conductor is simultaneously formed in the same ceramic green sheet, the through hole for the through conductor and the hole 4 can be efficiently formed. .

  Further, the through hole for the hole 4 is formed by printing the conductor paste to be the connection electrode 5 on the lid joining region 8 of the uppermost layer of the plurality of ceramic green sheets, and then the conductor paste and the ceramic green sheet. Further, it may be formed by a hole processing method such as laser processing or punching using a punching die.

  It is preferable that the bottom surface of the hole 4 is larger than the opening as in the example shown in FIGS. When the hole 4 has a step 4a such that the bottom surface is larger than the opening as in the example shown in FIG. 4, the hole 4 is at least a ceramic green sheet for forming a through hole for the hole 4. After preparing two sheets and forming through holes for holes 4 of different sizes in each ceramic green sheet, the ceramic green sheets with small through holes are formed on the ceramic green sheets with large through holes. It is formed by laminating so that the holes overlap.

  Further, as in the example shown in FIG. 5, in the case of the hole 4 that gradually increases from the opening toward the bottom surface and the inner wall surface is an inclined surface, punching using laser processing or a punching die or the like The through hole for hole 4 whose inner wall surface is inclined so that the diameter on the bottom surface side is larger than the diameter on the opening side in the ceramic green sheet for forming the through hole for hole 4 by a hole processing method such as processing And the ceramic green sheets are laminated. For example, if the through hole for the hole 4 is formed by punching, the ceramic green sheet is placed on a base having a hole having a diameter larger than that of the punching pin, and the ceramic green sheet is formed from the upper surface to the lower surface. By punching with a pin toward the surface, it is possible to form a through hole in which the inner wall surface is inclined from the upper surface to the lower surface of the ceramic green sheet.

  Moreover, the inner wall surface on the opening side of the hole 4 gradually increases from the opening toward the bottom surface side, and the inner wall surface on the opening side of the hole 4 is inclined halfway. In the case of a vertical surface, the angle between the inner wall surface of the hole 4 and the bottom surface is compared with the case where the inner wall surface of the hole 4 is formed only of an inclined surface as in the example shown in FIG. Becomes larger (about 90 °), it becomes easy to satisfactorily fill the bonding material into the bottom-side corners of the holes 4.

  The shape of the hole 4 is preferably a circular shape, an elliptical shape, or an oval shape in plan view. In the case of the holes 4 having these shapes, it is easy to satisfactorily fill the bonding material into the holes 4 as compared with the case where the holes 4 have a polygonal shape such as a square shape. In addition, when an impact is applied to the wiring board 1 from the outside, there is no corner portion where stress is concentrated in the hole 4, so that cracks are formed between the hole 4 and the outer wall surface of the insulating base or between the adjacent holes 4. Generation | occurrence | production can be suppressed.

The size of the opening of the hole 4 is preferably 0.3 mm or more, and the distance between the hole 4 and the outer wall surface of the insulating base and the distance between the adjacent holes 4 are preferably 0.2 mm or more. When the opening size of the hole 4 is 0.3 mm or more, the bonding material is easily filled in the hole 4 when a bonding material made of resin is applied to the upper surface of the lid bonding region 8. Further, if the distance between the hole 4 and the outer wall surface of the insulating base and the distance between the adjacent holes 4 are set to 0.2 mm or more, the outer space between the hole 4 and the outer wall surface of the insulating base and between the adjacent holes 4 are external. It is possible to effectively suppress the generation of cracks due to the impact from the.

  For example, when the image pickup device 7 is a flip chip type device, the image pickup device 7 is mounted on the wiring board 1 as in the example shown in FIGS. This is performed by electrically and mechanically connecting the electrode of the image sensor 7 and the connection terminal 6 disposed on the wiring board 1 through a connection member 16 such as an anisotropic conductive resin. In this case, an underfill may be injected between the image sensor 7 and the wiring board 1 after connecting via the bumps that are the connecting members 16. Alternatively, for example, when the image pickup element 7 is a wire bonding type element, after fixing the image pickup element 7 to the wiring board 1 with a bonding material such as glass, resin or brazing material, as shown in the example of FIG. This is performed by electrically connecting the electrode of the image sensor 7 and the connection terminal 6 via a bonding wire which is the connection member 16. In any case, a small electronic component 12 such as a resistance element or a capacitance element may be mounted around the imaging element 7 as necessary.

  The lid 9 includes a lens 10 and at least one of a driving device 11 and an electronic component 12 for moving the lens 10 in a direction along its optical axis, and is made of resin, ceramics, glass, or the like, and the lens 10 is disposed. It is formed in a box shape provided with an opening. The lid 9 is preferably one having a thermal expansion coefficient close to that of the insulating base, one having heat resistance, and easy to process. For example, the insulating base is made of an aluminum oxide sintered body. If a resin is used, a resin made of phenol resin, melamine resin, polypropylene, polystyrene, ABS resin or the like may be used.

  When such a lid 9 is made of resin, it is formed by a transfer mold method, an injection mold method, or the like using a mold that can be molded into the shape of a predetermined lid 9, and then the lens 10, the second The wiring conductor 13 and the driving device 11 or the electronic component 12 are arranged at a predetermined position. Further, the lid body 9 may be divided into a plurality of members according to a desired shape and then assembled. In such a case, it is possible to combine a plurality of resins according to the required properties, and the arrangement of the lens 10, the second wiring conductor 13, and the driving device 11 or the electronic component 12 is facilitated.

  The second wiring conductor 13 is provided inside the lid body 9 as in the example shown in FIGS. 1 to 6, but the second wiring conductor 13 may be provided on the surface. In such a case, the structure of the lid body 9 can be simplified. In such a case, the second wiring conductor 13 is preferably provided on the inner wall surface of the lid body 9 that houses the imaging element 7 in order to prevent a short circuit of the wiring due to dust or the like. In addition, as a material of the 2nd wiring conductor 13, the material similar to the above-mentioned external terminal 2, the 1st wiring conductor 3, the connection electrode 5, and the connection terminal 6 can be used.

  The lens 10 is made of a resin such as glass or epoxy resin, and is attached to the lid body 9 so that light transmitted through the lens 10 through the opening of the lid body 9 is incident on the light receiving portion 7a of the image sensor 7. Can do.

As the drive device 11, a device using a motor such as a stepping motor or a linear motor, a piezo drive using the reverse piezoelectric effect, or the like is used. In general, stepping motors and linear motors can increase the amount of displacement, but their accuracy is inferior, and piezo drives are characterized by the fact that they can be operated with high accuracy although they are smaller in displacement than stepping motors and linear motors. 11 is also acceptable. Further, when a plurality of lenses 10 are provided, a driving device 11 may be provided for each of them.

  When the lid body 9 includes the electronic component 12, the electronic component 12 is disposed on the lid body 9 and connected to the second wiring conductor 13 as in the example shown in FIG. Since the upper surface of the lid body 9 is used, the imaging device can be downsized as compared with the case where the electronic component 12 is disposed in a space sealed with the lid body 9.

  The lid body 9 and the wiring board 1 manufactured in this way are joined at the lid joint area 8 so that the second wiring conductor 13 on which the image sensor 7 is mounted and the connection electrode 5 are electrically connected. By doing so, an imaging apparatus is obtained.

  The first bonding material 14 is made of an electrically conductive resin material such as an acrylic resin, an epoxy resin, a phenol resin, a cresol resin, a silicone resin, or a polyether amide resin, such as thermosetting or photocurable. A mixture of fine particles of gold powder, silver powder, copper powder, nickel powder, aluminum powder, carbon powder, etc. is used. In particular, the use of a silver epoxy resin obtained by mixing silver powder with an epoxy resin is effective in relieving various stresses because the Young's modulus is lower than that of other materials.

  For the second bonding material 15, a resin material such as an acrylic resin, epoxy resin, phenol resin, cresol resin, silicone resin, or polyether amide resin, such as thermosetting or photocuring, can be used. . The second bonding material 15 may be mixed with a dark pigment or dye such as black, brown, dark brown, dark green or dark blue as necessary. It is possible to block unwanted light from penetrating through the second bonding material 15 and entering the imaging device.

  The joining of the wiring board 1 and the lid body 9 is performed as follows, for example. First, the first bonding material 14 made of a conductive resin before curing is applied onto the connection electrode 5 using a dispenser or the like. Next, an uncured second bonding material 15 made of an insulating resin is applied to a region other than the region where the first bonding material 14 is applied in the lid bonding region 8 of the wiring board 1 using a dispenser or the like. Thereafter, the lid body 9 is disposed on the first bonding material 14 and the second bonding material 15 before curing, and the first bonding material 14 and the second bonding material 15 before curing are cured by heating or ultraviolet irradiation. The wiring board 1 and the lid body 9 are joined via the first joining material 14 and the second joining material 15. At this time, when the first bonding material 14 before curing is applied to the upper surface of the connection electrode 5 using a dispenser or the like, the discharge nozzle is moved so that the discharge port of the discharge nozzle of the dispenser passes over the opening of the hole 4. By applying the first bonding material 14 so as to surely pass through the opening of the hole 4, the bonding material 7 is reliably filled into the plurality of holes 4.

  If an anisotropic conductive resin is used as the first bonding material 14 and the second bonding material 15, the conductive resin is formed between the connection electrode 5 and the second wiring conductor 13, and the wiring conductor 1 and the lid body. 9 is an insulating resin, so it is not necessary to apply the resin separately on the connection electrode 5 and in the region other than the region where the connection electrode 5 of the lid bonding region 8 is disposed. Can be applied. For this reason, if the anisotropic conductive resin is used, it is not necessary to apply the conductive resin for the first bonding material 14 and the insulating resin for the second bonding material 15 respectively. It is advantageous in shortening.

The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. For example, in the example of the imaging apparatus shown in FIGS. 1 to 6, the first wiring conductor 3 is led out from the upper surface of the wiring substrate 1 to the lower surface of the wiring substrate 1. May be derived. Further, a notch may be formed on the side surface of the wiring board 1 and an external terminal 2 may be formed on the inner surface of the notch so that the external terminal 2 is a so-called castellation conductor. Further, a filter made of a translucent plate material may be provided on the upper portion of the lens 10 or between the lens 10 and the light receiving portion 7a. As such a filter, two to three quartz plates having different crystal orientation angles are stacked, and a low-pass that prevents a moire phenomenon that occurs in an image captured by the image sensor 7 using the birefringence characteristics of the quartz plate. There is a filter. Also, in order to match the image sensor 7 whose sensitivity in the red to infrared region is generally higher than that of human vision with the hue sensitivity of the human eye, light having a wavelength in the red to infrared region is used. There is also an IR cut filter for cutting.

DESCRIPTION OF SYMBOLS 1 ... Wiring board 2 ... External terminal 3 ... 1st wiring conductor 4 ... Hole 5 ... Connection electrode 6 ... ... Connecting terminal 7 ... Image sensor 7a ... Light receiving part 8 ... Lid joint area 9 ... Lid
10 ・ ・ ・ ・ ・ ・ Lens
11 ・ ・ ・ ・ ・ ・ Driver
12 ・ ・ ・ ・ ・ ・ Electronic parts
13 ・ ・ ・ ・ ・ ・ Second wiring conductor
14 ・ ・ ・ ・ ・ ・ First bonding material
15 ・ ・ ・ ・ ・ ・ Second bonding material
16 ・ ・ ・ ・ ・ ・ Connecting member
17 ・ ・ ・ ・ ・ ・ Recess

Claims (3)

A wiring board formed with a first wiring conductor having an external terminal formed on at least one of a lower surface and a side surface, one end electrically connected to the external terminal and the other end exposed on the upper surface; An imaging element mounted on the upper surface of the wiring board; a connection electrode formed in a lid bonding region surrounding the imaging element on the upper surface of the wiring board; and electrically connected to the first wiring conductor; a lens; A box having at least one of a driving device and an electronic component for moving the lens in a direction along its optical axis, and having a frame-shaped lower surface joined to the lid joining region so as to accommodate the imaging device therein And a second wiring conductor connected to the driving device or the electronic component and drawn to the lower surface of the lid, the lid bonding region of the wiring board, and the lower surface of the lid Placed between and said A first bonding material made of a conductive resin for electrically connecting the connection electrode and the second wiring conductor; and a second bonding material made of an insulating resin for bonding the lid and the wiring board. An imaging device,
The connection electrode and the wiring board are formed with a hole that penetrates the connection electrode and reaches partway in the thickness direction of the wiring board, and the hole is filled with the first bonding material. An imaging device.   The imaging apparatus according to claim 1, wherein the hole has a larger bottom surface than an opening.   The imaging apparatus according to claim 2, wherein the hole gradually increases from the opening toward the bottom surface.

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