JP5450153B2 - Sheet peeling apparatus and sheet peeling method - Google Patents

Description

  The present invention relates to a sheet peeling apparatus and a sheet peeling method for peeling an adhesive sheet affixed to an adherend.

  As a sheet peeling device that peels off an adhesive sheet such as a protective tape affixed to an adherend such as a semiconductor wafer, the peeling tape is attached to the surface of the adhesive sheet, and the peeling is performed while suppressing the peeling tape or adhesive sheet at the edge of the edge member. A configuration is known in which the adhesive sheet is peeled from the wafer surface by folding the sheet at an acute angle at the tip of the edge member and pulling it, and simultaneously retracting the edge member along the adhesive sheet (Patent Document 1).

JP 2002-124494 A

  However, in the configuration as in Patent Document 1, the adhesive sheet is peeled off from the adherend while holding the adhesive sheet and the peeling tape attached to the edge member at the tip of the edge member, so that in addition to the peeling force of the adhesive sheet itself Thus, it is necessary to pull the peeling tape against the force caused by the frictional resistance between the adhesive sheet and the tip of the edge member generated by sandwiching the adhesive sheet at the tip of the edge member. For this reason, the force which pulls a peeling tape becomes large, and there exists a problem that a peeling tape peels off from an adhesive sheet or cuts, and causes the peeling defect of an adhesive sheet. In addition, when the adherend is a semiconductor wafer having bumps, the edge of the edge member that moves along the wafer surface while holding the release tape is caught by the bumps, and the bumps may be peeled off or the wafers may be damaged. Inconvenience occurs.

  The present invention reliably suppresses an adhesive sheet to the adherend side, suppresses an increase in force required for peeling, and can release the adhesive sheet without damaging the adherend. An object is to obtain a peeling method.

(1) In the sheet peeling apparatus according to claim 1 of the present invention, an adhesive layer is laminated on one surface of a base sheet, and the adhesive sheet attached to an adherend via the adhesive layer A sheet peeling apparatus for peeling from an adherend, wherein fluid is ejected from a base sheet side of the adhesive sheet to a peeling edge where the adhesive sheet peels from the adherend, and the adhesive sheet is suppressed to the adherend side. A pressing means for attaching , a jet region changing means for changing a region for jetting the fluid in the pressing means according to the length of the peeling edge, and a fluid discharge for discharging the fluid jetted from the pressing means and means, is characterized in Rukoto provided with an exhaust port and an exhaust port moving means capable of moving according to the length of the peeling edge of the fluid discharge means.

(2) In the invention described in claim 2, an adhesive layer is laminated on one surface of the base sheet, and a release tape is attached to the adhesive sheet attached to the adherend via the adhesive layer. , a sheet peeling apparatus for peeling off the adhesive sheet from the adherend by relatively moving said adherend and the peeling tape, the adhesive on the peel edge which the adhesive sheet is peeled off from the adherend A pressing means for ejecting fluid from the base sheet side of the sheet to restrain the adhesive sheet to the adherend side, and a region of the restraining means for ejecting the fluid to be variable according to the length of the peeling edge An ejection region varying means, a fluid ejecting means for ejecting the fluid ejected from the restraining means, and an exhaust port moving means capable of moving an exhaust port in the fluid ejecting means in accordance with the length of the peeling edge. and features a Rukoto with To have.

(3) The invention described in claim 3 is the sheet peeling apparatus according to (1) or (2), further comprising temperature control means for controlling the temperature of the fluid supplied to the pressing means .

(4) In the sheet peeling method according to claim 4 of the present invention, an adhesive layer is laminated on one surface of the base sheet, and the adhesive sheet attached to the adherend via the adhesive layer A sheet peeling method for peeling from an adherend, wherein a fluid is ejected from a base sheet side of the adhesive sheet to a peeling edge where the adhesive sheet peels from the adherend, and the adhesive sheet is moved to the adherend side. The area where the fluid is ejected while being suppressed is changed according to the length of the separation edge, and the exhaust port for discharging the ejected fluid is moved according to the length of the separation edge to move the fluid. It is characterized by discharging.

(5) In the invention of claim 5, an adhesive layer is laminated on one surface of the base sheet, and a release tape is attached to the adhesive sheet attached to the adherend via the adhesive layer. A sheet peeling method for peeling the adhesive sheet from the adherend by moving the peeling tape and the adherend relative to each other, wherein the adhesive sheet is peeled off from the adherend on the peeling edge of the adhesive sheet. The fluid is ejected from the base sheet side and is peeled while the adhesive sheet is held down on the adherend side, and the region for ejecting the fluid is changed according to the length of the peeling edge, and the ejected fluid is It is characterized in that the fluid is discharged by moving the exhaust port to be discharged according to the length of the peeling edge.

  According to the present invention, a sheet peeling apparatus that can reliably hold the adhesive sheet to the adherend side, suppress an increase in the force required for peeling, and peel the adhesive sheet without damaging the adherend. And a sheet peeling method can be obtained.

It is a perspective view of the sheet peeling apparatus which is one Embodiment of this invention. It is a perspective view which shows the internal mechanism of the suppression means of FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In FIG. 1 and FIG. 2, the sheet peeling apparatus 10 has an adhesive layer AD laminated on one surface of a base sheet BS, and is attached to a semiconductor wafer W as an adherend through the adhesive layer AD. An apparatus for peeling the adhesive sheet S from the semiconductor wafer W.

The semiconductor wafer W on which the adhesive sheet S is stuck is placed on the table 11 and sucked and held by a suction hole (not shown) provided on the table 11.
The peeling tape 13 is attached to the upper surface (base material sheet BS side) of the adhesive sheet S by using, for example, a sheet peeling device disclosed in JP-A-11-16862, for example, on the semiconductor wafer W held on the table 11. Is done. Note that the peeling tape 13 is fed from the sticking device 12 for each peeling operation, and is held by a chuck mechanism 14 that can be moved in a direction indicated by an arrow A in FIG. On the other hand, the table 11 is fixed on a slider (not shown) of the linear motor 15 and is provided so as to be movable in a direction indicated by an arrow B in FIG. 1 opposite to the moving direction of the chuck mechanism 14. This enables relative movement between the peeling tape 13 and the semiconductor wafer W.

  Above the adhesive sheet S to which the release tape 13 is adhered, a pressing means 16 is disposed in a non-contact state with a predetermined gap. The restraining means 16 is formed on a wedge-shaped tapered edge side of the ejection nozzle 16A, which is provided in a substantially wedge-shaped outer shape in cross-sectional view and configured by a housing, and is slit along the longitudinal direction thereof. And a supply pipe 18 for supplying a fluid such as air from the fluid supply means (not shown) such as a pump to the inside of the ejection nozzle 16A. The lengths of the ejection nozzle 16A and the ejection port 17 in the longitudinal direction are set to be larger than the outer diameter of the semiconductor wafer W, and are provided so as to be able to run over the semiconductor wafer W. Thereby, the air supplied into the ejection nozzle 16A can be ejected from the ejection port 17, and the adhesive sheet S and the peeling tape 13 are formed on the ejection nozzle 16A spanned above the semiconductor wafer W. It is folded along the ejection port 17. That is, the restraining means 16 restrains the peeling edge F from which the adhesive sheet S is peeled from the semiconductor wafer W from the base sheet BS side to the semiconductor wafer W side of the adhesive sheet S by the air ejected from the ejection port 17. (Pressing) is possible.

  When peeling off the circular adhesive sheet S attached to the circular semiconductor wafer W, the length of the peeling edge F changes as the peeling of the adhesive sheet S proceeds. Therefore, it is preferable that the width of the ejection port 17 through which air is ejected is also variable according to the length of the peeling edge F. Therefore, as shown in FIG. 2, an ejection region varying means 36 is employed that makes the width of the ejection port 17 variable according to the length of the peeling edge F. The ejection region varying means 36 includes a pair of screw shafts 26 and 27 provided inside the ejection nozzle 16A, motors 28 and 29 having output shafts (not shown) connected to one end sides of the screw shafts 26 and 27, and Rotating bearings 34 and 35 that rotatably support the other end sides of the screw shafts 26 and 27, nut members 30 and 31 screwed to the screw shafts 26 and 27, and the nut members 30 and 31, respectively. Partition plates 32 and 33. The partition plates 32 and 33 are slidable on the inner surface of the ejection nozzle 16A. Inside the ejection nozzle 16A, an inner space 37 sandwiched between the partition plates 32 and 33, and the partition plates 32 and 33. The outer space 38 located outside is sealed in an airtight manner. Further, the supply pipe 18 is connected to the central portion in the longitudinal direction of the ejection nozzle 16 </ b> A and supplies air only to the space sandwiched between the partition plates 32 and 33. With such a configuration, when the length of the peeling edge F changes as the peeling progresses as described above, the operation of the motors 28 and 29 causes the partition plates 32 and 33 to match the length of the peeling edge F. It is movable.

  Further, a fluid discharge means 20 is provided on the downstream side of the ejection port 17 in the gas ejection direction. The fluid discharge means 20 is located on both sides of the peeling edge F, and has an exhaust port 21 with the openings 21A facing each other, a pump (not shown) that applies a suction force to each exhaust port 21, and the like. And an exhaust pipe 22 connected to the suction means. Air that is ejected from the ejection port 17 and hits the substrate sheet BS side of the peeling edge F toward the outer edge of the semiconductor wafer W is sucked from the respective exhaust ports 21 and discharged to the outside through the respective exhaust pipes 22. Is done.

  Furthermore, the fluid discharge means 20 is supported by the exhaust port moving means 23 so as to be movable along the longitudinal direction of the ejection nozzle 16A. The exhaust port moving means 23 is a pair of linear motors 24 arranged along the longitudinal direction of the ejection nozzle 16 </ b> A, and a pair of arms 25 that are attached to the sliders 24 </ b> A of the linear motors 24 and support the exhaust ports 21. And. With such a configuration, when the length of the peeling edge F changes as the peeling progresses as described above, the exhaust motors 21 always maintain a predetermined interval by the operation of the linear motor 24 so that both of the peeling edges F can be maintained. It can be positioned aside.

  Further, a temperature control means 19 comprising a heater, a Peltier element or the like is provided in the middle of the supply pipe 18 so that the supplied air is heated or cooled, and air having an appropriate temperature is supplied into the ejection nozzle 16A. And is ejected from the ejection port 17. For example, when a material having high rigidity is adopted as the base sheet BS and the peeling edge F cannot be properly formed by folding the adhesive sheet S, the air supplied into the ejection nozzle 16A is heated, This heated air is jetted onto the adhesive sheet S. Thereby, even if it is the base sheet BS with high rigidity, it can soften and can form the peeling edge F appropriately, and can isolate the adhesive sheet S from the wafer W. Depending on the properties of the adhesive that constitutes the adhesive layer AD, the adhesive force may be reduced by heating or cooling. You may make it heat or cool suitably the temperature of the air supplied in 16A.

  As described above, according to the present embodiment, the release edge F is suppressed from the base sheet BS side of the adhesive sheet S to the semiconductor wafer W side without bringing the pressing means 16 into contact with the release sheet 13 or the adhesive sheet S. Therefore, the force for sandwiching the adhesive sheet S at the tip of the edge member does not occur as in the prior art. That is, the air blown out from the restraining means 16 gives a force to restrain the adhesive sheet S to the semiconductor wafer W side, but the air is a fluid, so that the frictional resistance with the adhesive sheet S increases. There is almost nothing. As a result, in addition to the peeling force of the adhesive sheet S itself as in the prior art, it resists the force caused by the frictional resistance between the adhesive sheet S and the edge of the edge member generated by sandwiching the adhesive sheet S at the edge of the edge member. Thus, the peeling tape 13 is not pulled, and it is possible to eliminate that the peeling tape 13 is peeled off from the adhesive sheet S or is cut and causes a peeling failure of the adhesive sheet S. Even if bumps are formed on the semiconductor wafer W, the bumps are not peeled off.

Further, since the width of the ejection port 17 through which the air is ejected can be changed by the ejection region varying means 36, the air blown from the ejection port 17 is efficiently sprayed on the base sheet BS side of the peeling edge F. The peeling edge F can be formed appropriately.
Moreover, since the fluid discharge means 20 is provided, it is possible to prevent dust and dirt from being rolled up by the air that is ejected.
Furthermore, since the position of the exhaust port 21 can be changed by the exhaust port moving means 23, dust and dust can be further reduced.
Further, when the temperature control means 19 is provided, the temperature of the air ejected from the ejection port 17 is adjusted in accordance with the types and properties of the base material sheet BS, the adhesive constituting the adhesive layer AD, and the peeling tape 13. It is also possible to realize more efficient peeling.

  In this embodiment, the adherend is not limited to the semiconductor wafer W, and other adherends such as a glass plate, a steel plate, pottery, a wooden plate, or a resin plate can also be targeted. May be a silicon semiconductor wafer or a compound semiconductor wafer, and the present invention can be similarly applied to any apparatus that peels off an adhesive sheet.

  Further, the chuck mechanism 14, a driving means (not shown) for moving the chuck mechanism 14, a linear motor 15 for moving the table 11, a mechanism for moving the partition plates 32 and 33, a mechanism for moving the exhaust port 21, and the like are examples. Any conventionally known drive mechanism may be used.

Furthermore, the pressing means 16 may be provided with a pressing means moving mechanism, and the adhesive sheet S may be peeled off by relative movement between the pressing means 16 and the chuck mechanism 14 with the table 11 stopped. In the state where the chuck mechanism 14 is stopped, the adhesive sheet S may be peeled off by the relative movement of the pressing means 16 and the table 11.
In addition to air, the fluid ejected by the restraining means 16 may employ nitrogen gas, neon gas, water, alcohol, cleaning liquid, or the like.

DESCRIPTION OF SYMBOLS 10 Sheet peeling apparatus 13 Peeling tape 16 Suppression means 36 Ejection area variable means 19 Temperature control means 20 Fluid discharge means 21 Exhaust port 23 Exhaust port moving means AD Adhesive layer BS Base material sheet F Peel edge S Adhesive sheet W Semiconductor wafer ( Adherend)

Claims (5)

An adhesive layer is laminated on one surface of the base sheet, and is a sheet peeling device for peeling an adhesive sheet attached to an adherend through the adhesive layer from the adherend,
A pressing means for ejecting fluid from the base sheet side of the adhesive sheet to the peeling edge where the adhesive sheet peels from the adherend and holding the adhesive sheet to the adherend side ;
An ejection region variable means for making the fluid ejecting region in the restraining means variable according to the length of the peeling edge;
Fluid discharge means for discharging the fluid ejected from the restraining means;
Sheet peeling apparatus according to claim Rukoto a movable outlet transportation combined outlet in said fluid discharge means the length of the peeling edge. An adhesive layer is laminated on one surface of the base sheet, and a release tape is attached to the adhesive sheet attached to the adherend via the adhesive layer, and the release tape and the adherend are relative to each other. It said adhesive sheet by causing moved a sheet peeling apparatus for peeling from the adherend,
A pressing means for ejecting fluid from the base sheet side of the adhesive sheet to the peeling edge where the adhesive sheet peels from the adherend and holding the adhesive sheet to the adherend side ;
An ejection region variable means for making the fluid ejecting region in the restraining means variable according to the length of the peeling edge;
Fluid discharge means for discharging the fluid ejected from the restraining means;
Sheet peeling apparatus according to claim Rukoto a movable outlet transportation combined outlet in said fluid discharge means the length of the peeling edge. Sheet peeling apparatus according to any one of claims 1 or claim 2, characterized in that it comprises temperature control means for controlling the temperature of the fluid supplied to the suppressed with means. An adhesive layer is laminated on one surface of the base sheet, and a sheet peeling method for peeling an adhesive sheet attached to an adherend through the adhesive layer from the adherend,
The adhesive sheet is the detached while held down on the adherend side front Symbol adhesive sheet by ejecting a fluid substrate sheet side of the adhesive sheet from the release edge for peeling from the adherend,
The region for ejecting the fluid is changed according to the length of the separation edge, and the exhaust port for discharging the ejected fluid is moved according to the length of the separation edge to discharge the fluid. Sheet peeling method. An adhesive layer is laminated on one surface of the base sheet, and a release tape is attached to the adhesive sheet attached to the adherend via the adhesive layer, and the release tape and the adherend are relative to each other. A sheet peeling method for peeling the adhesive sheet from the adherend by moving,
The adhesive sheet is peeled off while pressing the adhesive sheet to the adherend side by ejecting fluid from the base sheet side of the adhesive sheet to the peeling edge where the adhesive sheet peels from the adherend,
The region for ejecting the fluid is changed according to the length of the separation edge, and the exhaust port for discharging the ejected fluid is moved according to the length of the separation edge to discharge the fluid. Sheet peeling method.

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