JP5440513B2 - Packaged device - Google Patents

Description

  The present invention relates to a packaged device in which a device chip in which a micro movable element such as a micromirror element is formed is sealed.

  In recent years, in various technical fields, application of elements or devices having a micro structure formed by using MEMS (micro-electromechanical systems) technology has been attempted. Such a device includes, for example, a micro movable element having a minute movable portion such as a micro mirror, an angular velocity sensor, and an acceleration sensor. The micromirror is used as a device having a light reflection function, for example, in the fields of optical disc technology and optical communication technology. The angular velocity sensor and the acceleration sensor are used, for example, in applications such as a camera shake prevention function of a video camera or a camera-equipped mobile phone, a car navigation system, an airbag opening timing system, and a posture control system such as a car or a robot. The micro movable element is described in, for example, the following Patent Documents 1 to 3.

JP 2003-19700 A JP 2004-341364 A JP 2006-72252 A

  These micro movable elements include, for example, a movable portion that can swing, a fixed portion, a connecting portion that connects the movable portion and the fixed portion, and a drive electrode pair for driving the movable portion. With respect to a package for sealing a device chip in which such a micro movable element is formed, it is required that the moisture in the internal space for accommodating the micro movable element or the device chip is maintained below a certain level (for example, 5000 ppm or less). This is because if the moisture in the internal space is high, the electrical characteristics or drive characteristics of the element may deteriorate due to the induction of electric discharge in the vicinity of the drive electrode of the micro movable element. Package members and device chips contain or have a very small amount of moisture, and this moisture may evaporate into the internal space, causing the internal space moisture to rise and exceed acceptable levels. It is.

  Conventionally, a moisture absorbent having a chemical or physical moisture absorption function may be used for the purpose of maintaining a low level of moisture in the interior space of the package. For example, a paste-like moisture absorbent is applied to a predetermined portion of the internal space of the package and then dried, and the moisture absorbent is provided in the internal space together with the device chip.

  However, when a moisture absorbent is used, it is necessary to secure an area for placing the moisture absorbent in addition to the device chip mounting area. As the amount of the moisture absorbent increases, the arrangement area tends to expand. Therefore, the use of the moisture absorbent is not preferable from the viewpoint of reducing the package size. In addition, since the moisture absorbing action of the moisture absorbent is likely to deteriorate over time, it is difficult to obtain sufficient reliability for maintaining the moisture in the internal space at a low level.

  The present invention has been conceived under such circumstances, and an object thereof is to provide a packaged device suitable for suppressing moisture in the internal space of a package.

  According to a first aspect of the present invention, a packaged device is provided. The packaged device includes a package having an inner surface defining a sealed inner space, a device chip fixed to the package in the inner space, at least a part of the inner surface of the package, and / or a device A parylene film covering at least part of the surface of the chip. The parylene film in the present invention is a film in which parylene (paraxylylene) is formed by a vapor deposition method. More specifically, the parylene film is formed by polymerizing a paraxylylene monomer on an object surface by a vapor deposition method. It consists of a high molecular paraxylylene resin. Since such a parylene film is produced by polymerizing a monomer gas having a small molecular weight on the object surface, even if there is a fine uneven shape on the object surface, it has a shape following the uneven shape, The film thickness is thin and uniform (conformal coating film).

  The parylene film is excellent in gas impermeability, water repellency, and water resistance, and moisture (water vapor) cannot substantially pass through the parylene film. In the packaged device, such a parylene film covers at least part of the inner surface of the package and / or at least part of the surface of the device chip. For this reason, the trace moisture contained in or adhering to the package member or device chip is prevented from evaporating into the internal space of the package, and therefore the moisture level of the internal space is suppressed. As the coverage area of the parylene film increases, the moisture suppression effect increases.

  Moreover, according to the parylene film, conformal coating is possible as described above. This is preferable from the viewpoint of miniaturization of the package size, unlike the conventional method using the moisture absorbent, in which it is necessary to secure the moisture absorbent arrangement region.

  As described above, in the packaged device according to the first aspect of the present invention, it is possible to enjoy the moisture suppression effect in the internal space of the package without hindering the downsizing of the package size. Thus, the packaged device is suitable for suppressing moisture in the internal space of the package.

  Preferably, the packaged device further includes an electronic component disposed in the internal space, and the parylene film further covers at least a part of the surface of the electronic component. According to such a configuration, a minute amount of moisture contained in or attached to the electronic component disposed in the internal space together with the device chip is suppressed from evaporating into the internal space, and thus the moisture in the internal space is suppressed. The level is suppressed.

  Preferably, a micro movable element having a fixed portion and a movable portion is built in a device chip mounted on the package. Examples of the micro movable element include a micro mirror, an angular velocity sensor, and an acceleration sensor.

  Preferably, the package includes a package body having a recess and a lid for closing the recess, and the lid includes an optical glass plate. According to such a configuration, light can be incident into and out of the package through the optical glass plate.

  In a preferred embodiment, the inner surface of the optical glass plate is not covered with a parylene film. Such a configuration is preferable for obtaining good optical characteristics in a packaged device.

  In another preferred embodiment, the entire inner surface of the optical glass plate is covered with a parylene film. According to such a configuration, it is easy to obtain a greater moisture suppression effect.

  Preferably, the parylene film further covers at least a part of the outer surface of the package. According to such a structure, the penetration | invasion of the water | moisture content from the exterior to the inside of a package can be suppressed.

  According to a second aspect of the present invention, a packaged device manufacturing method is provided. In this method, a mounting step of mounting a device chip in a recess is electrically connected to a package body having a recess and an electrode pad is provided in the recess, and the device chip and the electrode pad are electrically connected by a wiring component. To close the recess, and a coating step of depositing parylene in the recess of the package body (the deposition of the parylene forms a conformal coating of the recess of the package body on which the device chip has already been mounted). Joining the lid and the package body. According to such a method, the packaged device according to the first aspect of the present invention can be appropriately manufactured.

  In the second aspect of the present invention, preferably, the device chip mounted on the package body in the mounting step includes a fixed portion, a movable portion, and a temporary support portion that couples the fixed portion and the movable portion. A micro movable element having the above is built in. The temporary support part is cut or removed before use of the micro movable element, and until it is cut, the function of fixing the movable part to the fixed part or the connection between the movable part and the fixed part is reinforced. It bears the function to perform.

  In a preferred embodiment, the method further comprises a cutting step for cutting the temporary support in the micro movable element after the coating step and before the bonding step. In another preferred embodiment, the method further comprises a cutting step for cutting the temporary support in the micro movable element after the mounting step and before the coating step. As a means for cutting or removing the temporary support portion, for example, irradiation with a YAG laser can be employed. When the covering step is performed after the cutting step, the piece of material that can be generated in the recess in the cutting step can be fixed by the parylene film in the covering step.

  According to a third aspect of the present invention, a packaged device manufacturing method is provided. This method includes a step of vapor-depositing parylene in a concave portion in a package body having a concave portion and having an electrode pad provided in the concave portion (by the deposition of parylene, the concave portion of the package main body is conformally coated with a parylene film. A removal step of removing parylene from the electrode pad, a mounting step of mounting the device chip in the recess with respect to the package body, and a connection step of electrically connecting the device chip and the electrode pad by wiring components And a joining step of joining the lid for closing the recess and the package body. According to such a method, the packaged device according to the first aspect of the present invention can be appropriately manufactured.

  The packaged device manufacturing method according to the third aspect of the present invention is preferably a step of re-evaporating parylene in the recesses of the package body (re-coating step) after the connecting step and before the bonding step. ). According to such a configuration, the exposed surface of the electrode pad after the wiring component is connected in the connecting step can be covered with the parylene film.

  Preferably, a micro movable element having a fixed portion, a movable portion, and a temporary support portion that couples the fixed portion and the movable portion is built in the device chip mounted on the package body in the mounting step. The method further includes a cutting step for cutting the temporary support portion in the micro movable device between the mounting step and the bonding step. This cutting process may be performed between the mounting process and the connecting process, may be performed between the connecting process and the recoating process, or may be performed between the recoating process and the joining process.

  The packaged device manufacturing method according to the second and third aspects of the present invention preferably further includes a step of vapor-depositing parylene on at least a part of the surface of the lid body before the bonding step.

1 is a plan view (partially omitted) of a packaged device according to a first embodiment of the present invention. It is another top view of the packaged device which concerns on the 1st Embodiment of this invention. FIG. 3 is an enlarged sectional view taken along line III-III in FIG. 1. It is an enlarged plan view showing a micromirror element. FIG. 2 illustrates some steps in the method of manufacturing the packaged device illustrated in FIG. 1. The process which follows FIG. 5 is represented. The process following FIG. 6 is represented. It is sectional drawing of the modification of the packaged device which concerns on 1st Embodiment. It is a top view (partially omitted) of the packaged device according to the second embodiment of the present invention. It is another top view of the packaged device concerning a 2nd embodiment of the present invention. FIG. 10 is an enlarged sectional view taken along line XI-XI in FIG. 9. FIG. 10 illustrates some steps in the first manufacturing method of the packaged device illustrated in FIG. 9. The process following FIG. 12 is represented. The process following FIG. 13 is represented. FIG. 10 illustrates some steps in the second manufacturing method of the packaged device illustrated in FIG. 9. The process following FIG. 15 is represented. The process following FIG. 16 is represented.

  1 to 3 show a packaged device X1 according to the first embodiment of the present invention. FIG. 1 is a plan view (partially omitted) of the packaged device X1, and FIG. 2 is another plan view of the packaged device X1. FIG. 3 is a cross-sectional view taken along line III-III in FIG.

  The packaged device X1 includes a device chip 10, a package 20, and a parylene film 30 (not shown in FIG. 1).

  The device chip 10 is a so-called MEMS mirror device in the present embodiment, and includes a base substrate 11, a mirror substrate 12, and an electrode pad 13. The base substrate 11 and the mirror substrate 12 are bonded via bumps 14. In the mirror substrate 12, a plurality of micromirror elements (not shown in FIGS. 1 and 3) formed by processing an SOI (silicon on insulator) substrate by MEMS technology are formed.

  FIG. 4A shows the micromirror element Y built in the mirror substrate 12. The micromirror element Y includes a frame F, a swingable movable part M, a connecting part C that connects the frame F and the movable part M to define an axis A of the swinging motion of the movable part M, a movable part A predetermined drive electrode pair (not shown) for driving M. On the movable part M, a mirror surface R having light reflectivity is provided. A plurality of micromirror elements Y are arranged, for example, in a row on the mirror substrate 12. In each micromirror element Y, it is possible to apply a predetermined voltage between the drive electrode pair to rotationally displace the movable part M around the axis A. It is possible to adjust the amount of rotational displacement of the movable part M by controlling the applied voltage. By such a swing drive of the movable part M, the reflection direction of the light reflected by the mirror surface R on each movable part M can be appropriately switched.

  The package 20 includes a packaging member 21 that is a package main body and a packaging member 22 that is a package lid (not shown in FIG. 1). The packaging member 21 is made of a ceramic material and has a recess 20a '. The packaging member 22 is an optical glass plate having translucency. The packaging members 21 and 22 are joined so as to close the concave portion 20a ′ of the packaging member 21 to form a sealed internal space 20a (that is, the packaging members 21 and 22 are the internal space 20a). Have inner surfaces 21a and 22a). An electrode pad 23 is provided on the internal space 20a side of the packaging member 21, and an electrode pad 24 is provided on the outside as shown in FIGS. These electrode pads 23 and 24 are electrically connected by a plug 25 embedded in the packaging member 21.

  The above-described device chip 10 is fixed to the package 20 in the internal space 20a. The electrode pads 13 of the device chip 10 and the electrode pads 23 of the package 20 or the packaging member 21 are electrically connected by wirings 26. Further, the light that has entered the package 20 via the packaging member 22 is reflected by the mirror surface R shown in FIG. 4A of each micromirror element Y of the device chip 10, and passes through the packaging member 22. The light is emitted out of the package 20.

  The parylene film 30 is made of a polymer paraxylylene resin, and is a thin and uniform coating film (conformal coating film). The thickness of the parylene film 30 is, for example, 0.05 to 1.15 μm. In this embodiment, such a parylene film 30 covers the device chip 10, the inner surface 21a of the packaging member 21, the electrode pad 23, and the wiring 26 as shown in FIG. Specifically, the parylene film 30 includes a part of the surface of the device chip 10, a part of the inner surface 21 a of the packaging member 21, a part of the surface of the electrode pad 23, and a part of the surface of the wiring 26. Cover conformally.

  5 to 7 show a manufacturing method of the packaged device X1. In the manufacture of the packaged device X1, first, electrode pads 23 and 24 and a plug 25 are formed on the packaging member 21, as shown in FIG. Next, as shown in FIG. 5B, the device chip 10 is mounted on the packaging member 21 (mounting process). In this step, for example, Ag paste is applied to a predetermined mounting surface (a part of the inner surface 21a) in the recess 20a ′ of the packaging member 21, the device chip 10 is die-bonded on the mounting surface, and then heated. The Ag paste is cured through the treatment. As shown in FIG. 4B, the frame F and the movable part M in the device chip 10 are connected not only by the connecting part C but also by the temporary support part C ′. The temporary support portion C ′ is cut or removed before use of the micromirror element Y, and the function of fixing the movable portion M to the frame F or the movable portion M and the frame until the micromirror element Y is cut. It bears the function of reinforcing the connection of F.

  Next, as shown in FIG. 6A, the wiring 26 is formed (connection process). For example, the wiring 26 for connecting the electrode pads 13 and 23 is formed by wire bonding. Next, as illustrated in FIG. 6B, parylene is deposited in the recess 20 a ′ of the packaging member 21 to form a parylene film 30 (covering step). The parylene film 30 formed in this step is formed by depositing parylene (paraxylylene) by vapor deposition, and more specifically, formed by polymerizing paraxylylene monomer on the object surface by vapor deposition. It is made of a high molecular paraxylylene resin. Since such a parylene film 30 is formed by polymerizing a monomer gas having a small molecular weight on the surface of the object, it has a shape that follows the fine irregularities on the surface of the object, and has a thin and uniform coating film ( Conformal coating film).

  Next, the temporary support portion C ′ shown in FIG. 4B connecting the frame F and the movable portion M in each micromirror element Y in the device chip 10 is replaced with a laser beam 41 as shown in FIG. Is cut or removed by irradiation (cutting step). As a result, as shown in FIG. 4A, the frame F and the movable part M are connected only by the connecting part C, and can swing around the axis A. As the laser beam 41, a YAG laser can be employed. Next, as shown in FIG. 7B, the packaging members 21 and 22 are joined (joining step). For example, the packaging members 21 and 22 can be joined by interposing a predetermined bonding agent between the packaging members 21 and 22.

  The packaged device X1 can be manufactured as described above. A predetermined connector provided at the end of the flexible cable is attached to the side of the packaged device X1 shown in FIG. 2 as necessary, and the connector and the electrode pad 24 or the packaged device X1 are electrically connected. The Further, in this method, the cutting step described above with reference to FIG. 7A is after the connecting step described above with reference to FIG. 6A, and FIG. It may be performed before the coating step described above. In this case, after the covering step, the joining step described above with reference to FIG. 7B is performed without performing the cutting step described above with reference to FIG. When the covering step is performed after the cutting step, a piece of material that can be generated in the recess 20a 'by the laser beam irradiation in the cutting step can be fixed by the parylene film 30 in the covering step.

  In the packaged device X1, as described above, the parylene film 30 covers the device chip 10, the inner surface 21a of the packaging member 21, the electrode pad 23, and the wiring 26 as shown in FIG. Specifically, the parylene film 30 includes a part of the surface of the device chip 10, a part of the inner surface 21 a of the packaging member 21, a part of the surface of the electrode pad 23, and a part of the surface of the wiring 26. cover). The parylene film 30 is excellent in gas impermeability, water repellency, and water resistance, and moisture (water vapor) cannot substantially pass through the parylene film 30. For this reason, the trace moisture contained in or attached to the packaging member 21 or the device chip 10 is prevented from evaporating into the internal space 20a of the package 20, and thus the moisture level of the internal space 20a is suppressed. In addition, the parylene film 30 is a conformal coating film as described above. This is preferable from the viewpoint of miniaturization of the package size, unlike the conventional method using the moisture absorbent, in which it is necessary to secure the moisture absorbent arrangement region. As described above, in the packaged device X1, it is possible to enjoy the moisture suppression effect in the internal space 20a of the package 20 without hindering the downsizing of the package size.

  In the packaged device X1, as shown in FIG. 8A, the entire inner surface 22a of the packaging member 22 (optical glass plate) may be covered with a parylene film 30. According to such a configuration, it is easy to obtain a greater moisture suppression effect. In order to manufacture the packaged device X1 shown in FIG. 8A, the parylene film 30 covering the inner surface 22a of the packaging member 22 is formed before the bonding step described above with reference to FIG. To do. In the formation of the parylene film 30 on the inner surface 22a, for example, in a state where the Kapton tape P-221 (manufactured by Permacel) is bonded to the bonding portion of the packaging member 22 with the packaging member 21, the packaging member 22 Parylene is deposited on the inner surface 22a side, and then the tape is peeled off.

  In the packaged device X1, the outer surface of the package 20 may be covered with a parylene film 30 as shown in FIG. According to such a structure, the penetration | invasion of the water | moisture content from the exterior to the inside of a package can be suppressed. To manufacture the packaged device X1 shown in FIG. 8B, the parylene film 30 that covers the outer surface of the packaging member 21 is formed before the mounting step described above with reference to FIG. . In the formation of the parylene film 30 on the outer surface, for example, parylene is vapor-deposited on the outer surface side of the packaging member 21 in a state where Kapton tape P-221 (manufactured by Permacel) is bonded to the surface of the electrode pad 24. The tape is peeled off.

  9 to 11 show a packaged device X2 according to the second embodiment of the present invention. FIG. 9 is a plan view (partially omitted) of the packaged device X2, and FIG. 10 is another plan view of the packaged device X1. 11 is a cross-sectional view taken along line XI-XI in FIG.

  The packaged device X2 includes a device chip 10, a package 20, and a parylene film 30. The device chip 10 includes a base substrate 11, a mirror substrate 12, and an electrode pad 13. A plurality of micromirror elements Y (not shown in FIGS. 9 and 11) are formed on the mirror substrate 12. The package 20 includes a packaging member 21 that is a package main body and a packaging member 22 that is a package lid, and has a sealed internal space 20a. An electrode pad 23 is provided on the internal space 20a side of the packaging member 21, and an electrode pad 24 is provided outside as shown in FIGS. The packaging member 22 is an optical glass plate having translucency. The device chip 10 is fixed to the package 20 in the internal space 20a. The electrode pad 13 of the device chip 10 and the electrode pad 23 are electrically connected by a wiring 26. The parylene film 30 is made of a polymer paraxylylene resin, and is a thin and uniform coating film (conformal coating film).

  The packaged device X2 is different from the packaged device X1 according to the first embodiment in that the parylene film 30 is interposed at a joint portion between the device chip 10 and the packaging member 21. In the packaged device X2, for the same reason as described above with respect to the packaged device X1, it is possible to enjoy the moisture suppression effect in the internal space 20a of the package 20 without inhibiting the reduction of the package size. . The moisture suppression effect in the packaged device X2 tends to be larger than that in the packaged device X1. In the packaged device X2, since the parylene film 30 covers the packaging member 21 even at the junction between the device chip 10 and the packaging member 21, the trace moisture contained in or attached to the packaging member 21 is packaged. This is because transpiration into the 20 internal spaces 20a tends to be suppressed more than in the packaged device X1.

  12 to 14 show a first manufacturing method of the packaged device X2. In this manufacturing method, first, as shown in FIG. 12A, the electrode pads 23 and 24 and the plug 25 are formed on the packaging member 21, and then parylene is formed in the recess 20 a of the packaging member 21. The parylene film 30 is formed by vapor deposition (first coating step). Next, as shown in FIG. 12B, the parylene film 30 on the electrode pad 23 is removed by laser beam irradiation. An excimer laser can be employed as the laser beam.

  Next, as shown in FIG. 13A, the device chip 10 is mounted on the packaging member 21 (mounting process). The specific mounting method is the same as that described above with reference to the first embodiment with reference to FIG. Next, as shown in FIG. 13B, the wiring 26 for connecting the electrode pads 13 and 23 is formed by wire bonding, for example.

  Next, as illustrated in FIG. 14A, parylene is deposited in the recess 20 a ′ of the packaging member 21 to form a parylene film 30 that covers the device chip 10, the electrode pad 23, and the wiring 26 ( Second coating step). Next, the temporary support portion C ′ shown in FIG. 4B connecting the frame F and the movable portion M in each micromirror element Y in the device chip 10 is replaced with a laser beam 42 as shown in FIG. Is cut or removed by irradiation (cutting step). As a result, the frame F and the movable part M are connected only by the connecting part C as shown in FIG. As the laser beam 42, a YAG laser can be adopted. Thereafter, the packaging members 21 and 22 are joined (joining step). Specifically, it is the same as that described above with reference to FIG. 7B regarding the first embodiment.

  The packaged device X2 can be manufactured as described above. A predetermined connector provided at the tip of the flexible cable is attached to the side of the packaged device X2 shown in FIG. 10 as necessary, and the connector and the electrode pad 24 or the packaged device X2 are electrically connected. The Further, in this method, the cutting step described above with reference to FIG. 14B is performed from the mounting step described above with reference to FIG. 13A to the second step described above with reference to FIG. You may carry out before the coating process.

  15 to 17 show a second manufacturing method of the packaged device X2. In this manufacturing method, first, as shown in FIG. 15A, the electrode pads 23 and 24 and the plug 25 are formed on the packaging member 21, and then the tape 43 is stuck on the electrode pad 23. . As the tape 43, Kapton tape P-221 (manufactured by Palmercel) can be used. Next, as illustrated in FIG. 15B, parylene is deposited in the recess 20 a ′ of the packaging member 21 to form a parylene film 30 (first covering step). In this step, the parylene film 30 is also formed on the electrode pad 23 in the recess 20a ′ of the packaging member 21 in addition to the outer surface of the packaging member 21 and the joint surface of the packaging member 21 with the packaging member 22. Not formed.

  Next, after peeling off the tape 43, as shown in FIG. 16A, the device chip 10 is mounted on the packaging member 21 (mounting process). The specific mounting method is the same as that described above with reference to the first embodiment with reference to FIG. Next, as shown in FIG. 16B, a wiring 26 for connecting the electrode pads 13 and 23 is formed by wire bonding, for example.

  Next, as illustrated in FIG. 17A, parylene is deposited in the recess 20 a ′ of the packaging member 21 to form a parylene film 30 that covers the device chip 10, the electrode pad 23, and the wiring 26 ( Second coating step). Next, the temporary support portion C ′ shown in FIG. 4B connecting the frame F and the movable portion M in each micromirror element Y in the device chip 10 is replaced with a laser beam 44 as shown in FIG. Is cut or removed by irradiation (cutting step). As a result, the frame F and the movable part M are connected only by the connecting part C as shown in FIG. As the laser beam 44, a YAG laser can be adopted. Thereafter, the packaging members 21 and 22 are joined (joining step). Specifically, it is the same as that described above with reference to FIG. 7B regarding the first embodiment.

  The packaged device X2 can be manufactured as described above. A predetermined connector provided at the tip of the flexible cable is attached to the side of the packaged device X2 shown in FIG. 10 as necessary, and the connector and the electrode pad 24 or the packaged device X2 are electrically connected. The In this method, the cutting process described above with reference to FIG. 17B is performed from the mounting process described above with reference to FIG. 16A to the second process described above with reference to FIG. You may carry out before the coating process.

  As a summary of the above, the configurations of the present invention and variations thereof are listed below as supplementary notes.

(Appendix 1) a package having an inner surface that defines a sealed internal space;
A device chip fixed to the package in the internal space;
A parylene film that covers at least a part of the inner surface of the package and / or at least a part of the surface of the device chip.
(Supplementary note 2) The packaged device according to supplementary note 1, further comprising an electronic component disposed in the internal space, wherein the parylene film further covers at least a part of a surface of the electronic component. (Additional remark 3) The packaged device of Additional remark 1 or 2 by which the micro movable element which has a fixed part and a movable part is built in the said device chip.
(Additional remark 4) The said package contains the package main body which has a recessed part, and the cover body for closing the said recessed part, The said cover body contains an optical glass plate, The package as described in any one of Additional remark 1 to 3 Device.
(Supplementary note 5) The packaged device according to supplementary note 4, wherein the inner surface of the optical glass plate is not covered with a parylene film.
(Supplementary note 6) The packaged device according to supplementary note 4, wherein the entire inner surface of the optical glass plate is covered with a parylene film.
(Supplementary note 7) The packaged device according to any one of supplementary notes 1 to 6, wherein the parylene film further covers at least a part of an outer surface of the package.
(Supplementary Note 8) A mounting step of mounting a device chip in the recess with respect to a package body having a recess and an electrode pad provided in the recess;
Electrically connecting the device chip and the electrode pad by a wiring component;
A coating step of depositing parylene in the recess of the package body;
A packaged device manufacturing method comprising: a lid for closing the recess; and a joining step for joining the package body.
(Additional remark 9) The said device chip mounted in the said package main body at the said mounting process has a fixed part, a movable part, and the temporary support part which connects the said fixed part and the said movable part. Is built,
The packaged device manufacturing method according to appendix 8, further including a cutting step for cutting the temporary support portion of the micro movable element after the covering step and before the bonding step.
(Additional remark 10) The said device chip mounted in the said package main body at the said mounting process has a fixed part, a movable part, and the temporary support part which connects the said fixed part and the said movable part. Is built,
The packaged device manufacturing method according to appendix 8, further including a cutting step for cutting the temporary support portion in the micro movable element after the mounting step and before the covering step.
(Additional remark 11) The process of vapor-depositing parylene in the said recessed part in the package main body which has a recessed part and the electrode pad is provided in the said recessed part,
Removing parylene from the electrode pad;
A mounting step of mounting a device chip in the recess with respect to the package body,
A connecting step of electrically connecting the device chip and the electrode pad by a wiring component;
A packaged device manufacturing method comprising: a lid for closing the recess; and a joining step for joining the package body.
(Additional remark 12) The packaged device manufacturing method of Additional remark 11 which further includes the process of vapor-depositing parylene in the said recessed part of the said package main body after the said connection process and before the said joining process.
(Supplementary Note 13) A micro movable element having a fixed portion, a movable portion, and a temporary support portion connecting the fixed portion and the movable portion to the device chip mounted on the package body in the mounting step. Is built,
The packaged device manufacturing method according to appendix 11 or 12, further comprising a cutting step for cutting the temporary support portion of the micro movable element between the mounting step and the bonding step.
(Supplementary note 14) The packaged device manufacturing method according to any one of supplementary notes 8 to 13, further including a step of depositing parylene on at least a part of the surface of the lid body before the joining step.

DESCRIPTION OF SYMBOLS 10 Device chip 11 Base substrate 12 Mirror substrate 13, 23, 24 Electrode pad 20 Package 20a Internal space 21, 22 Packaging member 21a, 22a Inner surface 26 Wiring 30 Parylene film 41, 42, 44 Laser beam

Claims (3)

A package having an inner surface defining a sealed interior space;
A device chip fixed to the package in the internal space;
Electronic components disposed in the internal space;
A paraxylylene resin film covering at least a part of the inner surface of the package and / or at least a part of the surface of the device chip,
The paraxylylene resin film further covers at least part of the surface of the electronic component, and the device chip is a packaged device in which a micro movable element having a fixed portion and a movable portion is built.   The packaged device according to claim 1, wherein the package includes a package body having a recess and a lid for closing the recess, and the lid includes an optical glass plate. The packaged device according to claim 2, wherein the entire inner surface of the optical glass plate is covered with a paraxylylene resin film.

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