JP5422901B2 - 接合方法および接合装置 - Google Patents

接合方法および接合装置 Download PDF

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Publication number
JP5422901B2
JP5422901B2 JP2008084354A JP2008084354A JP5422901B2 JP 5422901 B2 JP5422901 B2 JP 5422901B2 JP 2008084354 A JP2008084354 A JP 2008084354A JP 2008084354 A JP2008084354 A JP 2008084354A JP 5422901 B2 JP5422901 B2 JP 5422901B2
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Japan
Prior art keywords
substrate
substrates
pair
wafer
correction
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JP2008084354A
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Japanese (ja)
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JP2009239095A (ja
JP2009239095A5 (enExample
Inventor
功 菅谷
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Nikon Corp
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Nikon Corp
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Priority to JP2008084354A priority Critical patent/JP5422901B2/ja
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Publication of JP2009239095A5 publication Critical patent/JP2009239095A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2008084354A 2008-03-27 2008-03-27 接合方法および接合装置 Active JP5422901B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008084354A JP5422901B2 (ja) 2008-03-27 2008-03-27 接合方法および接合装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008084354A JP5422901B2 (ja) 2008-03-27 2008-03-27 接合方法および接合装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013209150A Division JP5561423B2 (ja) 2013-10-04 2013-10-04 接合方法および接合装置

Publications (3)

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JP2009239095A JP2009239095A (ja) 2009-10-15
JP2009239095A5 JP2009239095A5 (enExample) 2011-11-10
JP5422901B2 true JP5422901B2 (ja) 2014-02-19

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ID=41252676

Family Applications (1)

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JP2008084354A Active JP5422901B2 (ja) 2008-03-27 2008-03-27 接合方法および接合装置

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JP (1) JP5422901B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2463892B1 (de) * 2010-12-13 2013-04-03 EV Group E. Thallner GmbH Einrichtung, Vorrichtung und Verfahren zur Ermittlung von Ausrichtungsfehlern
TWI564982B (zh) * 2011-04-26 2017-01-01 尼康股份有限公司 A substrate holding device, a substrate bonding device, a substrate holding method, a substrate bonding method, a laminated semiconductor device, and a laminated substrate
US11829077B2 (en) 2020-12-11 2023-11-28 Kla Corporation System and method for determining post bonding overlay
US11782411B2 (en) 2021-07-28 2023-10-10 Kla Corporation System and method for mitigating overlay distortion patterns caused by a wafer bonding tool

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3901529B2 (ja) * 2002-01-31 2007-04-04 東レエンジニアリング株式会社 接合装置
JP4626160B2 (ja) * 2004-03-04 2011-02-02 株式会社ニコン ウェハ重ね合わせ方法及びウェハ重ね合わせ装置
JP4701953B2 (ja) * 2005-09-22 2011-06-15 パナソニック株式会社 押圧装置

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Publication number Publication date
JP2009239095A (ja) 2009-10-15

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