JP5415735B2 - ドレッシング方法、ドレッシング条件の決定方法、ドレッシング条件決定プログラム、および研磨装置 - Google Patents

ドレッシング方法、ドレッシング条件の決定方法、ドレッシング条件決定プログラム、および研磨装置 Download PDF

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JP5415735B2
JP5415735B2 JP2008247450A JP2008247450A JP5415735B2 JP 5415735 B2 JP5415735 B2 JP 5415735B2 JP 2008247450 A JP2008247450 A JP 2008247450A JP 2008247450 A JP2008247450 A JP 2008247450A JP 5415735 B2 JP5415735 B2 JP 5415735B2
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Prior art keywords
sliding distance
dressing
dresser
polishing
diamond dresser
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JP2010076049A5 (enExample
JP2010076049A (ja
Inventor
明 福田
宣宏 望月
雄高 和田
陽一 塩川
浩國 檜山
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Ebara Corp
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Ebara Corp
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Priority to US12/566,224 priority patent/US8655478B2/en
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Publication of JP2010076049A5 publication Critical patent/JP2010076049A5/ja
Priority to US14/150,068 priority patent/US8965555B2/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2008247450A 2008-09-26 2008-09-26 ドレッシング方法、ドレッシング条件の決定方法、ドレッシング条件決定プログラム、および研磨装置 Active JP5415735B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008247450A JP5415735B2 (ja) 2008-09-26 2008-09-26 ドレッシング方法、ドレッシング条件の決定方法、ドレッシング条件決定プログラム、および研磨装置
US12/566,224 US8655478B2 (en) 2008-09-26 2009-09-24 Dressing method, method of determining dressing conditions, program for determining dressing conditions, and polishing apparatus
US14/150,068 US8965555B2 (en) 2008-09-26 2014-01-08 Dressing method, method of determining dressing conditions, program for determining dressing conditions, and polishing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008247450A JP5415735B2 (ja) 2008-09-26 2008-09-26 ドレッシング方法、ドレッシング条件の決定方法、ドレッシング条件決定プログラム、および研磨装置

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JP2010076049A JP2010076049A (ja) 2010-04-08
JP2010076049A5 JP2010076049A5 (enExample) 2011-11-04
JP5415735B2 true JP5415735B2 (ja) 2014-02-12

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US (2) US8655478B2 (enExample)
JP (1) JP5415735B2 (enExample)

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US10600634B2 (en) * 2015-12-21 2020-03-24 Globalwafers Co., Ltd. Semiconductor substrate polishing methods with dynamic control
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JP6823541B2 (ja) * 2017-05-30 2021-02-03 株式会社荏原製作所 キャリブレーション方法およびキャリブレーションプログラム
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JP7141204B2 (ja) * 2017-10-19 2022-09-22 株式会社荏原製作所 研磨装置、及び研磨方法
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CN109459980A (zh) * 2018-10-25 2019-03-12 山东中衡光电科技有限公司 一种光学镜面加工共融机器人控制系统及方法
US12208487B2 (en) * 2018-10-29 2025-01-28 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing apparatus and method
JP7113737B2 (ja) * 2018-12-21 2022-08-05 株式会社荏原製作所 研磨装置及び研磨部材のドレッシング方法
TWI819138B (zh) * 2018-12-21 2023-10-21 日商荏原製作所股份有限公司 研磨裝置及研磨構件的修整方法
JP7113742B2 (ja) * 2018-12-26 2022-08-05 株式会社荏原製作所 研磨装置及び研磨部材のドレッシング方法
US11279001B2 (en) * 2019-02-22 2022-03-22 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for monitoring chemical mechanical polishing process
CN110990964A (zh) * 2019-10-24 2020-04-10 武汉理工大学 一种抑制机器人砂带磨抛工程陶瓷表面微裂纹的加工工艺
CN111805427B (zh) * 2020-07-21 2022-05-24 中国科学院长春光学精密机械与物理研究所 一种磁流变抛光设备的精度标定装置及方法
JP7529530B2 (ja) * 2020-10-21 2024-08-06 株式会社ディスコ リニアゲージ
JP2025059214A (ja) * 2023-09-29 2025-04-10 株式会社荏原製作所 ドレッシング条件決定装置およびドレッシング条件決定方法
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Publication number Publication date
JP2010076049A (ja) 2010-04-08
US20140120808A1 (en) 2014-05-01
US20100081361A1 (en) 2010-04-01
US8965555B2 (en) 2015-02-24
US8655478B2 (en) 2014-02-18

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