JP5401905B2 - 熱硬化性樹脂組成物 - Google Patents

熱硬化性樹脂組成物 Download PDF

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Publication number
JP5401905B2
JP5401905B2 JP2008264136A JP2008264136A JP5401905B2 JP 5401905 B2 JP5401905 B2 JP 5401905B2 JP 2008264136 A JP2008264136 A JP 2008264136A JP 2008264136 A JP2008264136 A JP 2008264136A JP 5401905 B2 JP5401905 B2 JP 5401905B2
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JP
Japan
Prior art keywords
resin composition
thermosetting resin
curing
acid
cured
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2008264136A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009280788A5 (enExample
JP2009280788A (ja
Inventor
勇人 小谷
直之 浦崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP2008264136A priority Critical patent/JP5401905B2/ja
Publication of JP2009280788A publication Critical patent/JP2009280788A/ja
Publication of JP2009280788A5 publication Critical patent/JP2009280788A5/ja
Application granted granted Critical
Publication of JP5401905B2 publication Critical patent/JP5401905B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Epoxy Resins (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
JP2008264136A 2008-04-25 2008-10-10 熱硬化性樹脂組成物 Active JP5401905B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008264136A JP5401905B2 (ja) 2008-04-25 2008-10-10 熱硬化性樹脂組成物

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008115391 2008-04-25
JP2008115391 2008-04-25
JP2008264136A JP5401905B2 (ja) 2008-04-25 2008-10-10 熱硬化性樹脂組成物

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012256297A Division JP5803883B2 (ja) 2008-04-25 2012-11-22 光半導体素子搭載用基板及びその製造方法、並びに光半導体装置

Publications (3)

Publication Number Publication Date
JP2009280788A JP2009280788A (ja) 2009-12-03
JP2009280788A5 JP2009280788A5 (enExample) 2011-09-22
JP5401905B2 true JP5401905B2 (ja) 2014-01-29

Family

ID=41451571

Family Applications (4)

Application Number Title Priority Date Filing Date
JP2008264136A Active JP5401905B2 (ja) 2008-04-25 2008-10-10 熱硬化性樹脂組成物
JP2012256297A Active JP5803883B2 (ja) 2008-04-25 2012-11-22 光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
JP2015086231A Pending JP2015149507A (ja) 2008-04-25 2015-04-20 光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
JP2017002764A Active JP6512228B2 (ja) 2008-04-25 2017-01-11 光半導体素子搭載用基板及びその製造方法、並びに光半導体装置

Family Applications After (3)

Application Number Title Priority Date Filing Date
JP2012256297A Active JP5803883B2 (ja) 2008-04-25 2012-11-22 光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
JP2015086231A Pending JP2015149507A (ja) 2008-04-25 2015-04-20 光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
JP2017002764A Active JP6512228B2 (ja) 2008-04-25 2017-01-11 光半導体素子搭載用基板及びその製造方法、並びに光半導体装置

Country Status (1)

Country Link
JP (4) JP5401905B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102194965B (zh) * 2010-03-18 2015-01-07 展晶科技(深圳)有限公司 化合物半导体封装结构及其制造方法
JP2015053468A (ja) * 2013-08-07 2015-03-19 日東電工株式会社 半導体パッケージの製造方法
JP2016180088A (ja) * 2014-07-24 2016-10-13 三菱化学株式会社 熱硬化性樹脂組成物及びその成形体
KR20230172564A (ko) * 2021-07-26 2023-12-22 다이요 홀딩스 가부시키가이샤 Led 실장용 기판 및 led 실장 기판

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5021151B2 (ja) * 2003-11-19 2012-09-05 株式会社カネカ 半導体のパッケージ用硬化性樹脂組成物および半導体
JP5303097B2 (ja) * 2005-10-07 2013-10-02 日立化成株式会社 熱硬化性光反射用樹脂組成物、ならびにこれを用いた光半導体搭載用基板とその製造方法および光半導体装置。
EP2034526B1 (en) * 2006-06-02 2019-12-25 Hitachi Chemical Company, Ltd. Package for mounting optical semiconductor element and optical semiconductor device employing the same
JP5572936B2 (ja) * 2007-11-26 2014-08-20 日立化成株式会社 熱硬化性光反射用樹脂組成物、これを用いた光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
JP4586925B2 (ja) * 2008-01-09 2010-11-24 日立化成工業株式会社 熱硬化性樹脂組成物、エポキシ樹脂成形材料、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
JP4666075B2 (ja) * 2008-01-11 2011-04-06 日立化成工業株式会社 多価カルボン酸縮合体、並びにこれを用いたエポキシ樹脂用硬化剤、エポキシ樹脂組成物、ポリアミド樹脂及びポリエステル樹脂

Also Published As

Publication number Publication date
JP6512228B2 (ja) 2019-05-15
JP2017103470A (ja) 2017-06-08
JP2009280788A (ja) 2009-12-03
JP2013079384A (ja) 2013-05-02
JP5803883B2 (ja) 2015-11-04
JP2015149507A (ja) 2015-08-20

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