JP5397850B2 - Microprojection removal apparatus, microprojection removal method, and microprojection removal tape - Google Patents

Description

  The present invention relates to a microprojection removing device that removes microprojections attached to a flat plate-like object such as a liquid crystal color filter substrate, a microprojection removing method that removes the microprojections, the microprojection removing device, and the microprojection removal. The present invention relates to a microprojection removal tape used in the method.

  When a liquid crystal color filter substrate is manufactured, if microprojections of several microns are attached to the surface of the liquid crystal color filter substrate, the thickness of the liquid crystal encapsulated portion is not uniform, and the image quality of the liquid crystal display is degraded.

  For this reason, the minute protrusions that are foreign matters on the liquid crystal color filter substrate must be removed as much as possible. Recently, the minute protrusion removal that smoothes the liquid crystal color filter substrate by removing the minute protrusions attached to the liquid crystal color filter substrate. A device is provided.

  The apparatus has a surface on which the liquid crystal color filter substrate is mounted, a flat mounting table, a tape transfer mechanism that is disposed above the mounting table, and that continuously transfers the polishing tape, and is arranged to be movable up and down. The back surface of the tape is pressed in the direction of the mounting table, and the polishing head for removing the fine protrusions attached to the liquid crystal color filter substrate placed on the mounting table via the polishing tape, and the micro protrusions are enlarged and observed. And an optical system.

  In this apparatus, after observing the minute protrusions using the optical system and selecting the minute protrusions to be polished, the height of the minute protrusions is measured, and the polishing head is lowered according to the height of the minute protrusions. The polishing tape is continuously transferred while pressing the polishing tape against the portion to be polished, and the fine protrusions are removed by the polishing action of the polishing tape (see, for example, Patent Document 1).

JP 2003-266292 A

  However, the microprojection removing apparatus configured as described above has the following problems. That is, since the fine protrusions are polished with the polishing tape, the amount of the polishing tape to be lowered must be determined according to the height of the fine protrusions. It is necessary to measure. Therefore, the time required for the microprojection removal operation becomes longer.

  In addition, since the polishing tape is continuously transferred while pressing the polishing tape against the portion to be polished, in order to grind and remove one minute protrusion, it is necessary to use a considerably long portion of the polishing tape. The frequency of replacement is increased, and the work of removing microprojections is troublesome.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a microprojection removal apparatus and a microprojection removal method that can shorten the time required for microprojection removal work.

  It is another object of the present invention to provide a microprojection removal tape with a low replacement frequency.

The present invention is characterized by the following points in order to solve the above problems. That is, the microprojection removal apparatus according to claim 1 is a microprojection removal apparatus that removes microprojections attached to a flat plate-like object, an observation apparatus that observes the microprojections, and an observation of the observation apparatus. A moving device that moves a portion to an arbitrary position on the object to be corrected, a minute protrusion removing portion attached to an attachment portion of the moving device, and an inclination of the minute protrusion removing portion with respect to the surface of the object to be corrected And a microprojection removal tape provided with a grinding projection made of a hard material harder than the microprojection at one end in the width direction of the tape base.

  According to a second aspect of the present invention, there is provided the microprojection removing device according to the first aspect, wherein the microprojection removing portion is provided via a retracting means for making the mounting portion retract the microprojection removing portion. It is characterized by having attached.

  According to a third aspect of the present invention, there is provided a microprojection removal method for removing microprojections adhering to a flat plate-like object to be repaired, wherein the microprojections are removed at one end in the width direction of the tape substrate from the microprojections. A fine protrusion removal tape provided with a grinding protrusion made of a hard material is bent into a U-shape, and the grinding protrusion is moved while the grinding protrusion is in contact with the surface of the object to be corrected. The microprojections are ground and removed by applying a shearing force to the microprojections.

  According to a fourth aspect of the present invention, there is provided the microprojection removal method according to the third aspect, wherein the end of the microprojection removal tape opposite to the end provided with the grinding projection is a plate-like body. It makes it contact | abut.

A microprojection removal tape according to claim 5 is used for the microprojection removal apparatus according to claim 1 or 2, and is a microprojection removal tape that removes microprojections attached to a flat plate-like object to be corrected. Further, the present invention is characterized in that a grinding protrusion made of a hard material harder than the minute protrusion is provided at one end in the width direction of the tape substrate.

  A microprojection removal tape according to a sixth aspect is the microprojection removal tape according to the fifth aspect, wherein a plurality of the grinding projections are provided on the tape base.

  Further, the microprojection removal tape according to claim 7 is the microprojection removal tape according to claim 5 or 7, wherein recesses are provided on both sides of the portion of the end portion of the tape base where the grinding projection is provided. It is characterized by.

  The present invention has the following excellent effects. That is, in the invention according to claim 1, with the above-described configuration, it is not necessary to determine the descending amount of the microprojection removal tape in accordance with the height of the microprojections. Therefore, it is necessary to measure the height of the microprojections. Therefore, the time required for removing the microprojections is shortened.

  Further, in the invention according to claim 2, with the above-described configuration, the microprojection removal portion can be in a retracted state, and therefore the microprojection removal tape is not displayed on the screen of the display device of the observation apparatus. can do.

  Moreover, in the invention which concerns on Claim 3, it can prevent that the peripheral part of the microprotrusion on the surface of a to-be-corrected body is damaged by setting it as the above-mentioned structure.

  In the invention according to claim 4, with the above-described configuration, when the fine protrusions are ground and removed by the grinding protrusions, the movement of the tape base can be prevented by the plate-like body, and the grinding protrusions are worn. In addition, the fine protrusion removal tape can be moved in the length direction to make the other grinding protrusion usable.

  Further, in the invention according to claim 5, by adopting the above-described configuration, the microprojection removing tape is not continuously transferred and a large number of microprojections can be removed by one grinding projection. The removal tape needs to be replaced less frequently.

  In the invention according to claim 6, with the above-described configuration, a plurality of grinding protrusions can be used if one minute protrusion removal tape is attached to the minute protrusion removal portion. The replacement frequency is further reduced.

  Moreover, in the invention which concerns on Claim 7, by setting it as the above-mentioned structure, it can maintain so that a grinding protrusion may become parallel with respect to the surface of a to-be-corrected body.

It is a figure which shows the microprotrusion removal tape which concerns on this invention. It is a schematic plan view which shows the microprotrusion removal apparatus which concerns on this invention. FIG. 3 is an enlarged view as viewed from an arrow B in FIG. 2. It is C arrow line view of FIG. FIG. 5 is a partially enlarged view of FIG. 4. It is the partially expanded view which cut | disconnected a part of FIG. It is explanatory drawing of the microprotrusion removal method which concerns on this invention. It is explanatory drawing of the microprotrusion removal method which concerns on this invention. It is explanatory drawing of the microprotrusion removal method which concerns on this invention. It is explanatory drawing of the microprotrusion removal method which concerns on this invention. It is the schematic which shows a part of other microprotrusion removal apparatus which concerns on this invention. It is a figure which shows a part of other microprotrusion removal tape which concerns on this invention. It is a figure which shows the state which uses the microprotrusion removal tape shown in FIG.

  FIG. 1 is a view showing a microprojection removal tape according to the present invention, and (b) is a cross-sectional view taken along the line AA of (a). As shown in the figure, a plurality of grinding protrusions 2 are provided at one end of the tape base 1 made of polyimide of the fine protrusion removing tape 10 in the width direction (FIG. 1A, vertical direction on the paper surface). The tape substrate 1 has a width dimension of about 10 mm and a thickness of 50 to 200 μm. The grinding projection 2 has a thickness of 2 μm and a vertical and horizontal dimension (FIG. 1A, horizontal and vertical dimensions on the paper surface) of 50 μm. The grinding projection 2 has a hard metal such as tungsten and nickel, tungsten oxide, ceramic, It is made of a hard material harder than the minute protrusions to be removed, such as diamond, and the grinding protrusions 2 are provided by vapor deposition or the like. A sheet metal 3 is fixed to one end of the tape substrate 1, and a hole 4 is provided in the tape substrate 1 and the sheet metal 3. A mounting hole 5 that is a square hole is provided at the other end of the tape base 1.

  2 is a schematic plan view showing a microprojection removing apparatus according to the present invention, FIG. 3 is a view as viewed from an arrow B in FIG. 2, FIG. 4 is a view as viewed from an arrow C in FIG. FIG. 6 is a partially enlarged view of a part of FIG. As shown in the drawing, a frame 51 is provided with two rails 52 and a traveling body 53 that travels on each rail 52 is provided. A plurality of mounting pins 32 (described later) are provided inside the frame body 51. Also, a rod body 54 having both ends attached to the traveling body 53 is provided, and a moving body 55 that moves along the rod body 54 is provided. Further, the attachment portion 11 is attached to the moving body 55 via the lifting device 56, and the lifting device 56 moves the attachment portion 11 up and down relative to the moving body 55. The observation unit 58 of the observation apparatus is attached to the attachment unit 11. The observation unit 58 includes a microscope, and the microscope includes the objective lens 12. The rail 52, the traveling body 53, the rod body 54, the moving body 55, the lifting and lowering device 56, and the mounting portion 11 constitute a moving device 57 that moves the observation unit 58. The moving device 57 includes the observation unit 58 described above. It is possible to move to an arbitrary position on a liquid crystal color filter substrate (not shown) which is a flat plate-like object mounted on the mounting pin 32. In addition, a display device 59 of an observation device is connected to the observation unit 58.

  A θ stage 13 is attached to the attachment portion 11, and the θ stage 13 is driven by a θ motor 14. A support 15 is attached to the movable portion 13 a of the θ stage 13, and a protruding plate 16 is provided on the support 15. In the illustrated state, the support 15 and the protruding plate 16 are inclined by 30 ° with respect to the optical axis of the objective lens 12. As described above, the microprojection removal portion 23 having the support 15, the protruding plate 16, and the like is attached to the attachment portion 11 via the θ stage 13.

  Further, a winding device 17 is attached to one side of the support 15, and a projecting pin 18 is provided on the other side of the support 15, and the attachment hole 5 of the microprojection removal tape 10 shown in FIG. The one end of the microprojection removal tape 10 is attached to the winding device 17, and the other end of the microprojection removal tape 10 is attached to the projecting pin 18 via the spring 19. That is, one end of the spring 19 is attached to the protruding pin 18, and the other end of the spring 19 is inserted into the hole 4. In this way, the microprojection removal tape 10 is attached to the microprojection removal portion 23, and the microprojection removal tape 10 is pulled by the spring 19.

  The protruding plate 16 is provided with two guide pins 20 and one support pin 21, and the center lines of the guide pins 20 and the support pins 21 are perpendicular to the protruding plate 16. Therefore, the support pin 21 is inclined by 30 ° with respect to a plane perpendicular to the optical axis of the objective lens 12. Moreover, the support pin 21 is provided in the vicinity of the front-end | tip part of the protrusion board 16, and the cross-sectional shape of the support pin 21 is an ellipse. The microprojection removal tape 10 is hung on the guide pin 20 and the support pin 21. That is, the microprojection removal tape 10 is wound around the support pin 21. In this state, the microprojection removal tape 10 is bent into a U shape by the support pin 21, and the end portion of the tape base 1 on which the grinding projection 2 is provided protrudes from the tip portion of the support pin 21. Further, the end portion of the microprojection removal tape 10 provided with the grinding projection 2 is hung on the guide pin 20 and the support pin 21 so that one of the grinding projections 2 is positioned as shown in FIG. The end on the opposite side is in contact with the protruding plate 16 which is a plate-like body. In the state shown in FIGS. 3 and 4, the tip of the support pin 21 is located substantially on the optical axis of the objective lens 12. Further, a hole 22 is provided in the protruding plate 16, and in the state shown in FIGS. 3 and 4, the center of the hole 22 and the optical axis of the objective lens 12 substantially coincide with each other.

  Next, a microprojection removal method according to the present invention using the microprojection removal apparatus shown in FIGS. First, by inspecting the liquid crystal color filter substrate, the position of minute protrusions that are foreign matters attached to the liquid crystal color filter substrate is detected, and the position of the minute protrusions is stored in the storage means.

  Next, as shown in FIG. 7, the liquid crystal color filter substrate 31 is placed on the plurality of placement pins 32 by the robot hand 35 and sucked by the suction pad 33, thereby bringing the liquid crystal color filter substrate 31 to a predetermined position. Fix it. Next, when the θ stage 13 is driven by the θ motor 14, as shown in FIG. 8, the support pin 21 is positioned on the left side and above the position shown in FIG. The portion 23 is retracted to the retracted position with respect to the attachment portion 11, and the observation unit 58 and the microprojection removal unit 23 are moved by the moving device 57 based on the position stored in the storage unit, and FIG. ), The fine protrusions 34 to be ground are displayed on the screen of the display device 59.

  Next, by performing image processing, the positional relationship between the objective lens 12 and the minute projections 34 is detected, and the observation unit 58 is moved by the moving device 57 based on the positional relationship between the objective lens 12 and the minute projections 34. As shown in FIG. 9B, the minute projection 34 is positioned at the center in the vertical direction of the paper surface in the screen of the display device 59 from the right in the horizontal direction of the paper surface.

  Next, after slightly lifting the microprojection removal unit 23 by the lifting device 56 of the moving device 57, the θ stage 13 is driven by the θ motor 14, so that the support pin 21 (microprojection removal unit 23) is attached to the mounting unit 11. 3 is returned to the grinding position shown in FIG. 3, and thereafter, the observation unit 58 and the microprojection removal unit 23 are lowered to the focal height of the objective lens 12 by the elevating device 56 to show the position of the grinding projection 2. The position shown in FIG. In this case, as shown in FIG. 9C, the microprojection removal tape 10 is displayed on the screen of the display device 59. In this state, the grinding protrusion 2 is located in the vicinity of the minute protrusion 34 and above the liquid crystal color filter substrate 31, and the lowermost portion of the tape substrate 1 is inclined by 30 ° with respect to the surface of the liquid crystal color filter substrate 31. Yes.

  Next, the support pin 21 (the minute protrusion removing portion 23) is lowered by the lifting device 56. Then, as shown in FIG. 10B, the grinding protrusion 2 comes into contact with the surface of the liquid crystal color filter substrate 31, the tape base 1 is deformed, and the grinding protrusion 2 is positioned in the vicinity of the minute protrusion 34. In this case, as shown in FIG. 9D, the position of the protruding side end of the tape base 1 on the screen of the display device 59 moves to the right of the page. For example, if the protruding amount of the tape base 1 from the tip of the support pin 21 is 100 μm, the lift pin 56 lowers the support pin 21 (microprojection removal portion 23) to the position shown in FIG. The position of the projecting side end of the substrate 1 moves to the right of about 15 μm on the paper surface. Therefore, if the movement amount of the position of the protruding end portion of the tape base 1 is detected by image processing and the lowering of the support pin 21 by the lifting device 56 is stopped when the movement amount reaches a predetermined value, FIG. The state shown in (b), that is, the state where the lower surface of the grinding protrusion 2 is in contact with the liquid crystal color filter substrate 31 can be obtained. Since the resolution in image processing can be 1.5 μm, it is possible to detect the amount of movement of the position of the protruding end of the tape substrate 1 by image processing.

  Next, by moving the support pin 21 (microprojection removing portion 23) in the right direction of FIG. 10, that is, in a direction parallel to the surface of the liquid crystal color filter substrate 31 by the moving device 57, the microprojections 34 are ground by the grinding projections 2. Remove. In this case, the scraps generated by grinding the fine protrusions are removed by suction by sucking the vicinity of the grinding protrusions 2 with a suction device (not shown).

  In this manner, the grinding protrusion 2 is moved in parallel with the surface of the liquid crystal color filter substrate 31 in a state where the micro protrusion removal tape 10 is bent into a U shape and the grinding protrusion 2 is in contact with the surface of the liquid crystal color filter substrate 31. Then, by applying a shearing force to the fine protrusions 34 by the grinding protrusions 2, the fine protrusions 34 are ground and removed.

  In this case, since the fine protrusion removing tape 10 is bent in a U-shape, the tape base 1 has rigidity, and the tape base 1 is removed when the fine protrusion 34 is ground and removed by the grinding protrusion 2. There is no deformation. Further, since the end of the microprojection removal tape 10 opposite to the end provided with the grinding projection 2 is in contact with the protruding plate 16, the tape substrate 1 is removed when the microprojection 34 is ground and removed by the grinding projection 2. 10 is applied to the left side of FIG. 10, but the tape substrate 1 is prevented from moving leftward by the protruding plate 16.

  Next, the support pin 21 (microprojection removing portion 23) is raised to a position slightly higher than the height shown in FIG. 10A by the elevating device 56, and then the θ stage 13 is driven by the θ motor 14, thereby causing the microprojections. The removal unit 23 is in a retracted state, and then the observation unit 58 and the microprojection removal unit 23 are lowered by the lifting device 56 to the focal height of the objective lens 12.

  Next, based on the position memorize | stored in the memory | storage means, the observation part 58 is moved with the moving apparatus 57, It is set as the state by which the microprotrusion 34 which is the next grinding object is displayed on the screen of the display apparatus 59. FIG. Thereafter, the same process as described above is performed.

  When the grinding protrusion 2 is worn, one end of the minute protrusion removing tape 10 is wound up by the winding device 17 and the minute protrusion removing tape 10 is moved in the length direction thereof, and the grinding next to the worn grinding protrusion 2 is ground. By setting the projection 2 to the position shown in FIG. 6, the grinding projection 2 can be used. In this way, the grinding projections 2 are used one after another, and after all the grinding projections 2 provided on the microprojection removal tape 10 are used, they are replaced with new microprojection removal tapes 10.

  In such a microprojection removal apparatus and microprojection removal method, since the microprojections 34 are ground by the microprojection removal tape 10, the descending amount of the microprojection removal tape 10 is determined according to the height of the microprojections 34. Therefore, it is not necessary to measure the height of the microprojections 34. That is, regardless of the height of the fine protrusion 34, after the grinding protrusion 2 is positioned in the vicinity of the fine protrusion 34, the grinding protrusion 2 is moved by the moving device 57, and the fine protrusion 34 is ground and removed by the grinding protrusion 2. Therefore, it is not necessary to measure the height of the minute protrusion 34. For this reason, the time required for the microprojection removal operation is shortened.

  Further, in the above-described microprojection removal apparatus and microprojection removal method, since the microprojection removal tape 10 is not pressed against the microprojections 34, the liquid crystal color filter substrate 31 is not deformed, so that the liquid crystal color filter substrate 31 is not deformed. The surface does not need to be adsorbed on a flat mounting table. That is, after the liquid crystal color filter substrate 31 is mounted on the mounting table, it is not necessary to suck the air between the mounting table and the liquid crystal color filter substrate 31 to adsorb the liquid crystal color filter substrate 31 to the mounting table. Further, when the liquid crystal color filter substrate 31 from which the fine protrusions 34 have been removed is discharged from the mounting table, air is supplied between the mounting table and the liquid crystal color filter substrate 31 so that the liquid crystal color filter substrate 31 is not attracted to the mounting table. There is no need to be in a state. For this reason, the time required for the microprojection removal operation is shortened.

  Further, in the above-described microprojection removal apparatus, since the microprojection removal portion 23 is attached to the attachment portion 11 via the θ stage 13, the microprojection removal portion 23 can be in a retracted state. It is possible to make a state in which the fine protrusion removing tape 10 is not displayed on the screen 59.

  Further, in the above-described microprojection removal method, the microprojection removal tape 10 is bent into a U shape, and the grinding projection 2 is brought into contact with the surface of the liquid crystal color filter substrate 31, and the grinding projection 2 is placed in the liquid crystal color filter substrate 31. Since the microprojections 34 are removed by grinding by moving the projections 2 parallel to the surface of the substrate and applying a shearing force to the microprojections 34 by the grinding projections 2, only the grinding projections 2 are in contact with the surface of the liquid crystal color filter substrate 31. Therefore, it is possible to prevent the peripheral portion of the fine protrusion 34 on the surface of the liquid crystal color filter substrate 31 from being damaged.

  Further, in the above-described microprojection removal method, since the end of the microprojection removal tape 10 opposite to the end provided with the grinding projection 2 is in contact with the protruding plate 16, the microprojection by the grinding projection 2 is used. At the time of grinding removal of 34, the movement of the tape base 1 can be prevented by the protruding plate 16, and when the grinding projection 2 is worn, the microprojection removal tape 10 is moved in its length direction to perform other grinding. The protrusion 2 can be in a usable state.

  Further, in the above-described microprojection removal method, the support pin 21 is inclined by 30 ° with respect to a plane perpendicular to the optical axis of the objective lens 12, and the amount of movement of the protruding end portion of the tape base 1 is adjusted by image processing. While detecting, the support pin 21 (the microprojection removing unit 23) is lowered by the elevating device 56, and when the movement amount reaches a predetermined value, the support pin 21 (the microprojection removing unit 23) is lowered by the elevating device 56. Therefore, the lower surface of the grinding projection 2 can be brought into contact with the liquid crystal color filter substrate 31 easily and reliably. As a result, the fine projections 34 can be reliably ground and removed by the grinding projections 2 by the movement of the grinding projections 2.

  Further, in the above-described microprojection removal method, the microprojection removal unit 23 is lifted to a level slightly higher than the height shown in FIG. 23 is in a retracted state, and thereafter the observation unit 58 and the microprojection removal unit 23 are lowered to the focal height of the objective lens 12, so that the grinding projection 2 can be prevented from contacting the liquid crystal color filter substrate. it can.

  Further, as in the prior art, when the fine protrusions are polished and removed by the polishing tape, the polishing range is widened to, for example, 200 μm. However, in the above-described fine protrusion removal apparatus and fine protrusion removal method, Since it can be as small as 50 μm, even when the minute protrusion 34 is present near the photo spacer (PS) provided on the liquid crystal color filter substrate 31, the minute protrusion 34 can be ground and removed.

  In addition, when the liquid crystal color filter substrate is attracted to the mounting table as in the past, the robot hand for mounting the liquid crystal color filter substrate on the mounting table moves on the mounting table, so the robot hand is placed on the mounting table. If the microprojection removing device is moved due to a malfunction when it exists, the microprojection removing device may collide with the robot hand and damage the microprojection removing device. On the other hand, as shown in FIG. 7, when the liquid crystal color filter substrate 31 is fixed by placing the liquid crystal color filter substrate 31 on the plurality of placement pins 32 and sucking it with the suction pads 33, the liquid crystal color filter substrate 31 is fixed. Since the robot hand 35 for placing the color filter substrate 31 on the placement pin 32 can be moved below the upper end of the placement pin 32, the robot hand 35 exists in the vicinity of the placement pin 32. Sometimes, even if the microprojection removal unit 23 is moved due to a malfunction, the microprojection removal unit 23 does not collide with the robot hand 35, so the microprojection removal unit 23 is not damaged.

  Further, in the above-described microprojection removal apparatus, since the operator can observe the grinding state of the microprojections 34 with an observation device, even if there is grinding residue, the manual operation is performed while viewing the screen of the display device 59. Grinding correction work can be performed.

  Further, in the above-described microprojection removal tape 10, the microprojection removal tape 10 is not continuously transferred, and a large number of microprojections 34 can be removed by a single grinding projection 2. Since the grinding protrusion 2 is provided, the replacement frequency of the fine protrusion removal tape 10 is reduced.

  FIG. 11 is a schematic view showing a part of another microprojection removing apparatus according to the present invention. As shown in the figure, a linear motion stage 41 is attached to the attachment portion 11, and the linear motion stage 41 is driven by a drive device 42. The movable portion 41 a of the linear motion stage 41 moves in a direction inclined by 60 ° with respect to the optical axis of the objective lens 12, and the support 15 is attached to the movable portion 41 a of the linear motion stage 41. That is, the minute protrusion removing portion 23 is attached to the attachment portion 11 via the linear motion stage 41. Other configurations are the same as those of the microprojection removing apparatus shown in FIGS.

  In the microprojection removal method according to the present invention using the microprojection removal apparatus shown in FIG. 11, after the liquid crystal color filter substrate 31 is fixed at a predetermined position, the linear motion stage 41 is driven by the drive device 42. A state in which the support pin 21 is positioned on the left side and above the position shown in FIG. 11, that is, a state in which the microprojection removal portion 23 is retracted to the retracted position with respect to the attachment portion 11 is stored in the storage means. The observation unit 58 is moved by the moving device 57 based on the determined position.

  Further, as shown in FIG. 9B, the minute protrusion 34 is positioned at the center of the screen of the display device 59 in the vertical direction of the paper from the right in the horizontal direction of the paper, and the minute protrusion removal unit 23 is moved by the lifting device 56. Then, the driving pin 42 is driven by the driving device 42 to return the support pin 21 (microprojection removing portion 23) to the grinding position shown in FIG. Thereafter, the observation unit 58 and the microprojection removal unit 23 are lowered to the focal height of the objective lens 12 by the lifting device 56.

  Further, the fine protrusions 34 are ground and removed by the grinding protrusions 2, and the support pins 21 (microprotrusion removal portions 23) are lifted to a little higher than the height shown in FIG. By driving the linear motion stage 41, the microprojection removal unit 23 is retracted, and thereafter the observation unit 58 and the microprojection removal unit 23 are lowered to the focal height of the objective lens 12 by the lifting device 56.

  As described above, in the microprojection removal method using the microprojection removal apparatus shown in FIGS. 2 to 6, the microprojection removal portion 23 is moved relative to the attachment portion 11 by driving the θ stage 13 by the θ motor 14. However, in the microprojection removal method using the microprojection removal apparatus shown in FIG. 8, the micromotion removal section 23 is driven by driving the linear motion stage 41 by the drive device 42. Are moved to a grinding position and a retracted position with respect to the attachment portion 11, and the other steps are the same as those in the method for removing microprojections using the microprojection removing apparatus shown in FIGS.

  Also, in the microprojection removal method using the microprojection removal apparatus shown in FIG. 11 and the microprojection removal apparatus shown in FIG. 11, the microprojection removal apparatus shown in FIGS. The same effect as the method for removing microprojections using the microprojection removing apparatus shown is obtained.

  FIG. 12 is a view showing a part of another microprojection removal tape according to the present invention, and (b) is a sectional view taken along the line DD of (a). As shown in the figure, recesses 1a are provided on both sides of the portion of the tape base 1 where the grinding projections 2 are provided.

  When the fine protrusion removing tape shown in FIG. 12 is used, when the grinding protrusion 2 comes into contact with the surface of the liquid crystal color filter substrate 31, the corner 1b adjacent to the recess 1a of the tape substrate 1 is shown in FIG. Is deformed downward by its own weight, the corner portion 1 b is also in contact with the surface of the liquid crystal color filter substrate 31, so that the grinding protrusion 2 can be kept parallel to the surface of the liquid crystal color filter substrate 31. it can.

  In the above-described embodiment, the case where the flat plate-shaped corrected body is the liquid crystal color filter substrate 31 has been described. However, the flat plate-shaped corrected body is not limited to the liquid crystal color filter substrate 31.

  In the above-described embodiment, the θ stage 13 and the θ motor 14 or the linear motion stage 41 and the driving device 42 are used as the retracting means for retracting the microprojection removing unit 23. It is not limited. In other words, the microprojection removal portion may be attached via a retracting means that places the microprojection removal portion in the attachment portion.

  In the above-described embodiment, the minute protrusion removing unit 23 (support 15) is attached to the attachment portion 11 via the θ stage 13 or the linear motion stage 41. However, the θ stage is attached to the attachment portion 11 via a rotation mechanism. 13 or the linear motion stage 41 is attached so that the direction of the grinding projection 2 can be changed if the microprojection removal portion 23 can be rotated about the optical axis of the objective lens 12. Even when the minute protrusions 34 are present in the vicinity of the photo spacers provided on the color filter substrate 31, the minute protrusions 34 can be ground and removed while avoiding the photo spacers, and the liquid crystal color filter substrate 31 has a long shape. Even if there are small projections, the polishing projections 2 are moved to follow the long minute projections while changing the direction of the grinding projections 2. The scale-like microprojections 34 can be removed by grinding.

  Further, in the above-described embodiment, the liquid crystal color filter substrate 31 is placed on the plurality of placement pins 32 and sucked by the suction pads 33 to fix the liquid crystal color filter substrate 31 at a predetermined position. The color filter substrate 31 may be placed on a glass stage. In this case, since the fine protrusions 34 are ground and removed by the grinding protrusions 2, it is not necessary to adsorb the liquid crystal color filter substrate 31 to the glass stage. Therefore, in this invention, the mounting part which mounts a flat plate-shaped to-be-corrected body is not limited to the mounting table where the surface is planar.

  In the above embodiment, the support 15 and the protruding plate 16 are inclined by 30 ° with respect to the optical axis of the objective lens 12, and the lowermost portion of the tape base 1 is 30 with respect to the surface of the liquid crystal color filter substrate 31. The support 15 and the protruding plate 16 are inclined 15 to 45 ° with respect to the optical axis of the objective lens 12, and the lowermost portion of the tape base 1 is 15 to 45 ° with respect to the surface of the liquid crystal color filter substrate 31. You may incline 45 degrees.

  Further, in the above-described embodiment, the scraps generated by grinding the fine protrusions are sucked and removed by sucking the vicinity of the grinding protrusions 2 by the suction device, but are generated by grinding the fine protrusions. The shavings may be blown off by an air blowing device.

  In the above-described embodiment, the plurality of grinding protrusions 2 are provided on the tape base 1 of the fine protrusion removing tape 10. However, one grinding protrusion 2 may be provided on the tape base 1. In this case, the microprojection removal tape is detachably attached to the projecting plate.

  In the above embodiment, the tape substrate 1 made of polyimide is used, but the material of the tape substrate may be other than polyimide.

  In the above embodiment, the width of the tape substrate 1 is about 10 mm, the thickness is 50 to 200 μm, the thickness of the grinding protrusion 2 is 2 μm, and the length and width are 50 μm. The dimension of 2 is not limited to the above dimension.

  Even if the grinding protrusion 2 is formed so as to protrude from the end portion of the tape substrate 1, there is no problem as long as the fine protrusion 34 can be ground and removed by the grinding protrusion 2.

DESCRIPTION OF SYMBOLS 1 ... Tape base | substrate 1a ... Concave part 2 ... Grinding protrusion 10 ... Minute protrusion removal tape 11 ... Mounting part 12 ... Objective lens 13 ... (theta) stage 14 ... (theta) motor 15 ... Supporting body 16 ... Projection plate 17 ... Winding device 18 ... Projection pin DESCRIPTION OF SYMBOLS 19 ... Spring 20 ... Guide pin 21 ... Support pin 23 ... Minute protrusion removal part 41 ... Linear motion stage 42 ... Drive apparatus 57 ... Moving apparatus 58 ... Observation part 59 ... Display apparatus

Claims (7)

A microprojection removing device that removes microprojections adhering to a flat plate-shaped object,
An observation device for observing the microprojections;
A moving device that moves the observation unit of the observation device to an arbitrary position on the object to be corrected;
A microprojection removing part attached to the attaching part of the moving device;
A micro projection provided with a grinding projection made of a hard material harder than the micro projection on one end portion in the width direction of the tape base is attached to the micro projection removal portion so as to be inclined with respect to the surface of the object to be corrected. A microprojection removing apparatus comprising a projection removing tape.   The microprojection removal device according to claim 1, wherein the microprojection removal unit is attached to the attachment unit via a retracting unit configured to retract the microprojection removal unit. A microprojection removal method for removing microprojections adhering to a flat plate-shaped object,
A fine protrusion removing tape having a grinding protrusion made of a hard material harder than the fine protrusion at one end in the width direction of the tape base is bent into a U shape, and the ground protrusion is brought into contact with the surface of the object to be corrected. A method of removing a microprojection, wherein the grinding projection is moved in a state where the grinding projection is moved, and a shearing force is applied to the microprojection by the grinding projection to grind and remove the microprojection.   4. The method of removing microprojections according to claim 3, wherein an end of the microprojection removal tape opposite to the end provided with the grinding projection is brought into contact with a plate-like body. A microprojection removal tape for use in the microprojection removal apparatus according to claim 1 or 2, which removes microprojections attached to a flat plate-shaped object,
A microprojection removal tape, wherein a grinding projection made of a hard material harder than the microprojection is provided at one end in the width direction of the tape base.   6. The microprojection removal tape according to claim 5, wherein a plurality of the grinding projections are provided on the tape base.   The microprojection removal tape according to claim 5 or 6, wherein recesses are provided on both sides of a portion of the end portion of the tape base where the grinding projection is provided.

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