JP5318633B2 - Protrusion defect repair device - Google Patents

Description

  The present invention relates to a protrusion defect correcting apparatus that polishes and corrects a protrusion defect portion of a fine pattern formed on a flat substrate surface, and more specifically, prevents over-polishing of the protrusion defect portion and shortens the protrusion defect correction tact. The present invention relates to a projection defect correcting device to be attempted.

  A conventional protrusion defect correcting device is configured to polish and remove the protrusion by pressing the polishing tape against the protrusion of an object with a polishing head while supplying the polishing tape by a tape feeding mechanism (for example, Patent Documents). 1).

JP 2007-175800 A

  However, in such a conventional protrusion defect correcting device, since the protrusion was polished and removed with the polishing tape, the pressing force by the polishing head was too strong, the feed speed of the polishing tape was too high, If the polishing time is long, over-polishing of the protrusions occurs, and there is a problem that the base is damaged and a new defect is generated.

  For such problems, the height of the protrusion is measured before polishing, and the relationship between the polishing tape numbering, the pressing force of the polishing head, the feeding speed of the polishing tape, and the polishing time and the polishing amount is previously determined. There is a problem in that it is necessary to set an appropriate polishing condition according to the polishing amount and perform polishing by referring to a lookup table obtained by experiment, and the correction tact of the protrusion defect becomes long. In this case, in order to suppress over-polishing more strictly, it is necessary to repeat the operation of measuring the height of the protrusion after polishing for a predetermined time and further polishing, and the correction tact for the protrusion defect becomes longer. There was a problem.

  SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a protrusion defect correcting device that addresses such problems and prevents over-polishing of the protrusion defect portion and shortens the tact correction tact time.

In order to achieve the above object, a protrusion defect correcting apparatus according to the present invention is a protrusion defect correcting apparatus that polishes and corrects a protrusion defect portion of a fine pattern formed on a flat substrate surface, and is opposed to the substrate surface. and have a smooth surface, relative sliding movement relative to the substrate and the polishing plate which is observable to form the protruding defect from above, in a state where the polishing plate spaced apart by a predetermined distance from the substrate surface A cutting mechanism provided on the polishing plate so as to intersect with the moving direction, and cutting the projection defect portion with the relative movement of the polishing plate.

With this configuration, the substrate in a state that have a smooth surface opposite the flat substrate surface, the abrasive plate which is observable formed from above the protrusion defect, remote from the substrate surface by a predetermined distance by the moving mechanism The cutting part provided on the polishing plate so as to cross the moving direction cuts the projection defect part of the fine pattern formed on the substrate surface as the polishing plate moves relative to the substrate. , Correct the protrusion defect.

Further, the polishing plate, ing a transparent substrate. Thereby, visual observation of the position where the projection defect part exists on the substrate surface is enabled by the polishing plate made of a transparent substrate .

Further, the polishing plate, the large concave shape than projections defect and at least one formed on the smooth surface, Ru der which an edge intersects the movement direction of the recess and with the cutting unit. Thus, the polishing plate the large concave shape to at least one than the protruding defect to the smooth surface moving relative to the substrate, a projection defect in cutting portion is the edge you cross to the moving direction of the recess Cut the part.

And the said grinding | polishing board forms at least one through-hole larger than the said projection defect part, and makes the said smooth surface side edge part which cross | intersects the said moving direction of this through-hole into the said cutting part. The As a result, the polishing plate on which at least one through-hole having a shape larger than that of the projection defect portion is moved relative to the substrate, and the projection is projected at the cutting portion which is the smooth surface side edge intersecting the moving direction of the through-hole. Cut the defective part .

  Further, a microscope was arranged so that the projection defect portion could be observed through the polishing plate. Thereby, a projection defect part is observed through a polishing board with a microscope.

  Further, the substrate is a color filter substrate or a TFT substrate of a liquid crystal display panel having a photo spacer for obtaining a certain cell gap on the surface. Thus, the protrusion defect portion of the color filter substrate or TFT substrate of the liquid crystal display panel in which the photo spacer for obtaining a certain cell gap is formed on the surface is corrected.

  The polishing plate slides relative to the substrate in a state where the smooth surface is in contact with an upper end surface of a photo spacer formed on the substrate. Thus, the polishing plate is slid relative to the substrate with the smooth surface of the polishing plate in contact with the upper end surface of the photo spacer formed on the substrate.

  According to the first aspect of the present invention, the polishing plate is slid relative to the substrate in a state of being separated from the substrate surface by a predetermined distance, and the polishing plate is polished by the cutting portion provided so as to intersect the moving direction. Since the projection defect portion on the substrate surface is cut as the plate moves relative to the substrate, the top of the projection defect portion is cut by setting the separation distance of the polishing plate to the substrate surface within an allowable value. The height can be kept within an allowable value. Therefore, overpolishing of the protrusion defect portion can be prevented. Furthermore, since it is not necessary to measure the height of the protrusion defect portion in advance, the correction tact of the protrusion defect can be shortened.

Moreover, according to the invention which concerns on Claim 2, the position of a projection defect part can be visually observed through a transparent polishing board. Therefore, the defect correction work is facilitated .

Furthermore, according to the invention according to claim 3, you crossing the moving direction of the recess formed on the smooth surface of the polishing plate with a polishing plate only slides in the horizontal direction and placed on the protruding defect edge The protrusion defect part can be cut by the cutting part. In this case, if a plurality of recesses are formed, it is not necessary to align the recesses with the projection defect part, and therefore the defect correction tact can be further shortened.

And according to the invention which concerns on Claim 4, the smooth surface side edge part which cross | intersects the said moving direction of the through-hole formed in the grinding | polishing board only by installing a grinding | polishing board on a protrusion defect part and slidingly moving in a horizontal direction. The protrusion defect part can be cut by the cutting part. In this case, if a plurality of through-holes are formed, it is not necessary to align the through-holes with the protruding defect portions, so that the defect correction tact can be further shortened .

  Moreover, according to the invention which concerns on Claim 5, a projection defect part can be expanded and observed with a microscope, and position alignment with the cutting part of a polishing board and a projection defect part can be performed easily. Therefore, defect correction can be performed reliably.

  Furthermore, according to the invention which concerns on Claim 6, the protrusion defect of the color filter substrate of a liquid crystal display panel or a TFT substrate can be corrected. Therefore, it is possible to manufacture a liquid crystal display panel with high display quality with a high yield.

  And according to the invention concerning Claim 7, even if it does not set the height of a grinding | polishing board, a projection defect part can be cut and it can match with the height of a photo spacer, and the correction tact of a projection defect is further improved. It can be shortened. Therefore, the occurrence of dark spot defects and interference fringe defects in the liquid crystal display panel can be prevented, and the image quality of the liquid crystal display panel can be improved.

It is a front view which shows schematic structure of embodiment of the protrusion defect correction apparatus by this invention. It is a figure which shows the grinding | polishing board used for the protrusion defect correction apparatus of this invention, (a) is a top view, (b) is the OO sectional view taken on the line of (a). It is explanatory drawing shown about the recessed part of the said grinding | polishing board, (a) shows the relationship between the moving direction of a grinding | polishing board and a grinding | polishing hollow, (b) has shown about the taper angle of the side surface of a recessed part. It is a block diagram which shows schematic structure of the moving mechanism used for the protrusion defect correction apparatus of this invention. It is explanatory drawing which shows the operation | movement of protrusion defect correction by the protrusion defect correction apparatus of this invention.

  Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a front view showing a schematic configuration of an embodiment of a projection defect correcting device according to the present invention. This protrusion defect correcting device corrects a protrusion defect portion of a fine pattern formed on a flat substrate surface by polishing, and includes a stage 1, a polishing plate 2, a moving mechanism 3, and a microscope 4. Become. In the following description, a case where the flat substrate is the color filter substrate 5 of the liquid crystal display panel on which photo spacers for obtaining a certain cell gap are formed on the surface will be described.

  The stage 1 is configured to place and hold the color filter substrate 5 on the upper surface. For example, a plurality of suction holes can be formed on the surface to adsorb the color filter substrate 5.

  A polishing plate 2 is provided facing the stage 1. The polishing plate 2 is in contact with the upper end surface of the photo spacer 6 (see FIG. 5) of the color filter substrate 5 and moves in the horizontal direction indicated by the arrow A, and is a protrusion having an allowable height or more existing on the color filter substrate 5. As shown in FIG. 2, the projection defect portion 7 is removed from the smooth surface 2 a facing the color filter substrate 5 at a substantially central portion of the transparent substrate 8 such as quartz. A concave portion (hereinafter referred to as “polishing recess”) 9 having a rectangular cross-sectional shape larger than the cross-sectional shape of the portion 7 is formed by, for example, sandblasting, laser processing, or etching processing, and the edge of the polishing recess 9 An edge that intersects the moving direction at the part is used as a cutting part 17, and the projection defect part 7 is cut by the cutting part 17. In this case, the polishing plate 2 is moved in the direction intersecting the major axis of the polishing recess 9 (the direction of arrow A shown in FIG. 1). Specifically, as shown in FIG. 3A, the polishing recess 9 is orthogonal to the moving direction (arrow A direction) of the polishing plate 2 in the plane parallel to the surface of the color filter substrate 5. It is good to incline by an angle θ (about 10 degrees or more) with respect to the direction to be performed. Thereby, the shearing property of the projection defect part 7 by the cutting part 17 of the said grinding | polishing hollow 9 improves. In order to incline the polishing recess 9 with respect to the moving direction of the polishing plate 2 (arrow A direction), the polishing recess 9 is formed to be inclined with respect to the moving direction of the polishing plate 2 when the polishing recess 9 is processed, or This can be realized by arranging the polishing plate 2 so that the major axis of the polishing recess 9 is inclined by an angle θ from the direction orthogonal to the moving direction of the polishing plate 2. Moreover, the cutting part 17 of the grinding | polishing hollow 9 which cross | intersects the moving direction (arrow A direction) of the grinding | polishing board 2 may be formed in a fine wave shape (sawtooth wave shape).

  Further, as shown in FIG. 3B, at least the taper angle δ of the side surface 9a on the front side in the moving direction on the side surface of the polishing recess 9 intersecting the moving direction (arrow A direction) of the polishing plate 2 is a color filter. The polishing recess 9 may be formed so as to be about 70 degrees or more with respect to the surface 5 a of the substrate 5. Also by this, the shearing property of the projection defect part 7 by the cutting part 17 of the said polishing hollow 9 can be improved. The polishing recess 9 may be a hole or a groove extending from one end of the substrate 8 to the other end. Further, the polishing recess 9 may have a shape such as a rhombus or an ellipse in plan view. Thereby, the shearing property of the projection defect part 7 can be improved.

  A moving mechanism 3 is provided so that the polishing plate 2 can slide. The moving mechanism 3 moves up and down while adsorbing and holding the upper peripheral edge 2b of the polishing plate 2, and brings the polishing plate 2 into contact with the upper end surface of the photo spacer 6 formed on the surface of the color filter substrate 5. In the state, it is moved in the horizontal direction indicated by an arrow A. As shown in FIG. 4, the holding means 10, the elevating means 11, the horizontal moving means 12, the driving means 13, and the control means 14 are provided. It is configured.

  Here, the holding means 10 is for adsorbing and holding the polishing plate 2, for example, a holding frame 15 having a plurality of suction holes formed on the lower surface, and a suction pump connected to the suction holes via a tube. 16 The elevating means 11 elevates and lowers the holding frame 15 in the directions of arrows B and C shown in FIG. 1 within a predetermined movement range. For example, the elevating means 11 is a Z stage, and includes a sensor and the polishing plate 2 is the color filter substrate 5. The descent is stopped upon contact with the photo spacer 6. Further, the elevating means 11 is formed so that when the polishing plate 2 comes into contact with the color filter substrate 5, the polishing plate 2 is brought into elastic contact with the photo spacer 6 of the color filter substrate 5 with a predetermined pressing force. The horizontal moving means 12 horizontally moves the holding frame 15 in the direction of arrow A shown in the figure within a predetermined movement range, and is, for example, an X stage. Furthermore, the drive means 13 drives the raising / lowering means 11 and the horizontal movement means 12, and is composed of, for example, a motor and a drive circuit. And the control means 14 integrates and controls the whole apparatus so that said each component may drive appropriately.

  A microscope 4 is provided above the polishing plate 2. This microscope 4 is used to observe the projection defect portion 7 of the color filter substrate 5 through the polishing plate 2.

Next, the operation of the projection defect correcting device configured as described above will be described with reference to FIG.
First, a defect inspection on the surface of the color filter substrate 5 is performed, and the position coordinates of the protrusion defect portion 7 are detected.

  Next, as shown in FIG. 5A, the color filter substrate 5 is placed on the stage 1. Then, the stage 1 or the microscope 4 is horizontally moved in the XY plane based on the position coordinate data of the protrusion defect portion 7 obtained by the defect inspection, and the protrusion defect portion 7 of the color filter substrate 5 is positioned below the microscope 4. . The Y axis is the direction from the front to the back in FIG.

  Subsequently, as shown in FIG. 5B, the driving unit 13 of the moving mechanism 3 is controlled and driven by the control unit 14, the horizontal moving unit 12 is moved, and the peripheral portion 2 b is sucked and held by the holding unit 10. The polished polishing plate 2 is moved to the bottom of the microscope 4. Then, the polishing recess 9 of the polishing plate 2 is positioned above the protrusion defect portion 7. Here, when the position of the polishing recess 9 is deviated from the upper side of the projection defect portion 7, the driving means is used while confirming the positions of the polishing recess 9 and the projection defect portion 7 through the polishing plate 2 through the microscope 4. The horizontal movement means 12 is finely moved by 13 to adjust the position so that the projection defect portion 7 is located in the polishing groove 9.

  In this way, when the polishing recess 9 is positioned above the projection defect portion 7, the elevating means 11 is driven by the driving means 13 so that the holding frame 15 moves vertically, and as shown in FIG. The polishing plate 2 descends in the direction of arrow B shown in the figure until the smooth surface 2a of the lower surface of the plate 2 contacts the upper end surface 6a of the photo spacer 6 of the color filter substrate 5.

  Next, as shown in FIG. 5 (d), the horizontal moving means 12 is driven by the driving means 13 while the smooth surface 2 a of the polishing plate 2 is in contact with the upper end face 6 a of the photo spacer 6 of the color filter substrate 5. When driven, the holding frame 15 moves horizontally, and the polishing plate 2 is moved in the direction of arrow A shown in FIG. Thereby, as shown in the figure, the protrusion defect portion 7 is cut and removed by the cutting portion 17 at the edge of the polishing recess 9 on the near side in the arrow A direction.

  As a result, as shown in FIG. 5 (e), the top of the projection defect portion 7 is cut, and the height of the projection defect portion 7 is made equal to the height of the photo spacer 6 of the color filter substrate 5. Thereafter, the elevating means 11 is driven by the driving means 13 so that the holding frame 15 is raised to a predetermined position in the direction of arrow C shown in FIG. 1, and the polishing plate 2 is separated from the surface of the color filter substrate 5 to protrude from the color filter substrate 5. Defect correction is completed.

  In the above embodiment, the case where the polishing plate 2 has one polishing recess 9 is described. However, the present invention is not limited to this, and the polishing recess 9 is predetermined in the moving direction of the polishing plate 2. A plurality may be provided side by side at intervals. Thereby, it is not necessary to align the polishing recess 9 of the polishing plate 2 with the protrusion defect portion 7, and the correction tact of the protrusion defect can be further shortened. That is, after the polishing plate 2 is positioned above the projection defect portion 7, the polishing plate 2 is simply brought into contact with the upper end surface 6a of the photo spacer 6 of the color filter substrate 5 and is slid in the horizontal direction to perform a plurality of polishing operations. The protrusion defect portion 7 existing on the color filter substrate 5 can be cut by the cutting portion 17 of any one of the recesses 9 among the recesses 9.

  In the above embodiment, the case where the flat substrate is the color filter substrate 5 on which the photo spacer 6 is formed has been described. However, the present invention is not limited to this, and the substrate is a TFT substrate on which the photo spacer 6 is formed. Also good.

  Furthermore, in the above-described embodiment, the case where the flat substrate has the photo spacer 6 formed has been described. However, the present invention is not limited to this, and the flat substrate may not have the photo spacer 6 formed thereon. Good. In this case, the polishing plate 2 is slid in the horizontal direction with respect to the substrate while being separated from the flat substrate surface by a predetermined distance (allowable height of protrusion). Thereby, the projection defect part 7 can be cut to an allowable height.

  Moreover, in the said embodiment, although the case where the cutting part 17 of the grinding | polishing board 2 was an edge part of the grinding | polishing hollow 9 was demonstrated, this invention is not limited to this, The cutting part 17 penetrates the grinding | polishing board 2 up and down. It may be an edge portion that intersects the moving direction at the smooth surface 2a side edge portion of the through-hole, or may be a smooth surface 2a side edge portion of the side surface that intersects the moving direction of the polishing plate 2.

  Further, in the above embodiment, the case where the polishing plate 2 is made of the transparent substrate 8 has been described. However, the present invention is not limited to this, and the polishing plate 2 is an opaque member made of glass, metal, resin material, or the like. It may be formed of a member having a low degree. In this case, it is preferable to select and use a material having high surface flatness and excellent surface lubricity and low adhesion. When an opaque member or a member with low permeability is selected as the polishing plate 2, a through-hole penetrating the substrate 8 up and down may be used. This makes it possible to position the projection defect portion 7 in the through hole while visually observing the flat substrate surface through the through hole or observing with a microscope.

  Furthermore, although the case where the polishing plate 2 is horizontally moved in the direction of arrow A has been described in the above embodiment, the present invention is not limited to this, and the polishing plate 2 may be reciprocated in the horizontal direction. In this case, two edges on the smooth surface 2a side intersecting with the moving direction of the polishing recess 9 or the through-hole of the polishing plate 2 or two side edges on the smooth surface 2a side intersecting with the moving direction of the polishing plate 2 are provided. It functions as the cutting part 17.

In the above description, the case where the polishing plate 2 is moved by the moving mechanism 3 has been described. However, the present invention is not limited to this, and the stage 1 may be moved by the moving mechanism 3.

2 ... polishing plate 2a ... smooth surface of polishing plate 3 ... moving mechanism 4 ... microscope 5 ... color filter substrate (substrate)
6 ... Photospacer 6a ... Upper end surface of photospacer 7 ... Projection defect 8 ... Transparent substrate 9 ... Polishing recess (recess)
17 ... Cutting part

Claims (7)

A projection defect correcting device that polishes and corrects a projection defect portion of a fine pattern formed on a flat substrate surface,
Have a smooth surface facing the substrate surface, a polishing plate which is observable to form the protruding defect from above,
A moving mechanism for sliding the polishing plate relative to the substrate in a state of being separated from the substrate surface by a predetermined distance; and
A projection defect correcting device, wherein the projection defect portion is cut with a relative movement of the polishing plate by a cutting portion provided on the polishing plate so as to intersect the moving direction. The projection defect correcting device according to claim 1 , wherein the polishing plate is made of a transparent substrate. Claim the polishing plate, wherein the large recess shape than projections defect and at least one formed on the smooth surface, characterized in that the edge that intersects the movement direction of the recess and said cutting portion 3. A protrusion defect repair apparatus according to 2. The polishing plate is characterized in that at least one through hole having a shape larger than that of the projection defect portion is formed, and the smooth surface side edge portion intersecting the moving direction of the through hole is used as the cutting portion. The protrusion defect correction apparatus according to claim 1 or 2 .   The projection defect correcting device according to claim 1, wherein a microscope is disposed so that the projection defect portion can be observed.   6. The protrusion according to claim 1, wherein the substrate is a color filter substrate or a TFT substrate of a liquid crystal display panel in which a photo spacer for obtaining a constant cell gap is formed on the surface. Defect correction device.   The protrusion defect correction according to claim 6, wherein the polishing plate slides relative to the substrate in a state where the smooth surface is in contact with an upper end surface of a photo spacer formed on the substrate. apparatus.

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