JP5388754B2 - Photoelectric conversion device and photoelectric conversion module - Google Patents

Description

  The present invention relates to a photoelectric conversion device and a photoelectric conversion module using the photoelectric conversion device.

  In recent years, development of a photoelectric conversion device having a photoelectric conversion element has been advanced. As an exemplary photoelectric conversion device, there is a solar cell device that converts solar energy into electric power. In particular, for the purpose of improving the power generation efficiency, a concentrating solar cell device is being developed. The photoelectric conversion device includes a photoelectric conversion element that converts light energy into electric power energy. When the photoelectric conversion device is, for example, a solar cell device, the photoelectric conversion element is a solar cell element that converts solar energy into electric power energy (see, for example, Patent Documents 1 and 2).

JP 2001-274301 A JP 2008-91440 A

  In the development of photoelectric conversion devices, downsizing of photoelectric conversion elements is required. This invention is made | formed in view of the above, Comprising: It aims at providing the photoelectric conversion apparatus and photoelectric conversion module which can contribute to size reduction of an apparatus.

  In order to solve the above problems, a photoelectric conversion device according to a first aspect of the present invention includes a substrate on which a first main surface and a second main surface having different height positions are formed on one main surface side, and the substrate A frame body formed on the first main surface and the main surface of the second main surface so as to surround a part of both main surfaces, and the first main surface in a space defined by the frame body A photoelectric conversion element formed on the first main surface; a first terminal electrically connected to a lower surface of the photoelectric conversion element; formed on the second main surface; And a second terminal electrically connected to the upper surface of the conversion element; and a light collecting member that is joined to the frame and covers a space surrounded by the frame.

  Further, in the photoelectric conversion module according to the second aspect of the present invention, a plurality of photoelectric conversion devices in which the first terminal and the second terminal extend to the inside and outside of the frame body are arranged in parallel. The first terminal of the first photoelectric conversion device and the second terminal of the second photoelectric conversion device are connected between adjacent photoelectric conversion devices.

  ADVANTAGE OF THE INVENTION According to this invention, the photoelectric conversion apparatus which can contribute to size reduction of an apparatus, and a photoelectric conversion module can be provided.

It is a disassembled perspective view which shows the external appearance of the photoelectric conversion module which concerns on this embodiment. It is sectional drawing of the photoelectric conversion apparatus which concerns on this embodiment. It is an outline perspective view except a photoelectric conversion element and a condensing member of a photoelectric conversion device concerning this embodiment. It is sectional drawing which showed the connection state of the photoelectric conversion apparatuses shown in FIG. It is an expanded sectional view of A part shown in FIG. It is sectional drawing except the condensing member of the photoelectric conversion apparatus which concerns on one modification, and a top view. It is sectional drawing which showed the connection state of the photoelectric conversion apparatuses shown in FIG.

  Embodiments of a photoelectric conversion module and a photoelectric conversion device according to the present invention will be described below with reference to the accompanying drawings. In addition, this invention shall not be limited to the following embodiment.

<Schematic configuration of photoelectric conversion module>
FIG. 1 is an overview perspective view of the photoelectric conversion module according to the present embodiment and an exploded perspective view in which a part thereof is enlarged. 2 is a cross-sectional view of the photoelectric conversion device shown in FIG. FIG. 3 is a schematic perspective view of the photoelectric conversion device from which the photoelectric conversion element and the light collecting member are removed.

  The photoelectric conversion module 1 according to the present embodiment is a photovoltaic power generation module that converts sunlight into electric power. Moreover, the photoelectric conversion device 2 according to the present embodiment includes a photoelectric conversion element 3 that collects light. For example, the photoelectric conversion element 3 has a function of collecting power by collecting sunlight.

  The photoelectric conversion module 1 includes a plurality of photoelectric conversion devices 2 and a light receiving member 4 that receives light. The light receiving member 4 is, for example, a dome-shaped Fresnel lens. The light receiving member 4 has a function of receiving light from the outside and collecting the received light in the photoelectric conversion device 2. The light receiving member 4 is made of, for example, glass, plastic, or translucent resin. The light receiving member 4 includes a frame member 4a and a lens member 4b, and is fixed by the frame member 4a so as to surround the lens member 4b.

  As shown in FIG. 2, the photoelectric conversion device 2 is formed on a substrate 5 on which a first main surface S1 and a second main surface S2 having different height positions are formed on one main surface side, and on the substrate 5, A frame 6 that surrounds both main surfaces of the first main surface S1 and the second main surface, and a photoelectric conversion element 3 formed on the first main surface S1 in the frame 6; A first terminal 7 formed on the first main surface S1 and electrically connected to the lower surface of the photoelectric conversion element, and formed on the second main surface and electrically connected to the upper surface of the photoelectric conversion element 3. A second terminal 8 and a light collecting member 9 that is joined to the frame body 6 and covers the space SP surrounded by the frame body 6 are provided.

  The substrate 5 has a step. A first main surface S1 is formed on the surface having the lower step height. In addition, the second main surface S2 is formed on the surface having the higher step height. The substrate 5 is an insulating substrate and is made of a ceramic material such as alumina or mullite, or a glass ceramic material. Or it consists of a composite material which mixed several materials among these materials. The end of the first main surface S1 located in the frame 6 and the end of the second main surface S2 located in the frame 6 are designed to overlap in plan view. Here, the end of the first main surface S1 and the end of the second main surface S2 overlap each other when the step 5 provided on the substrate 5 is viewed in cross section. Is an angle between 85 degrees and 95 degrees.

  The first terminal 7 formed on the first main surface S1 of the substrate 5 is made of, for example, a metal material such as copper, silver, gold, iron, aluminum, nickel, cobalt, or chromium, or an alloy thereof. The second terminal 8 formed on the second main surface S2 of the substrate 5 is similar to the first terminal 7, for example, a metal material such as copper, silver, gold, iron, aluminum, nickel, cobalt, or chromium. Or an alloy thereof.

  The photoelectric conversion element 3 is provided on the first main surface S <b> 1 and is connected to the first terminal 7.

  The photoelectric conversion element 3 is, for example, a solar cell element that includes a III-V group compound semiconductor. The photoelectric conversion element 3 can immediately convert the received light into electric power and output it by the photovoltaic effect. An exemplary solar cell element has an InGaP / GaAs / Ge3 junction cell structure. The indium gallium phosphide (InGaP) top cell converts energy contained in a wavelength region of 660 nm or less. The gallium arsenide (GaAs) middle cell converts energy contained in a wavelength region from 660 nm to 890 nm. The germanium (Ge) bottom cell converts light contained in a wavelength region from 890 nm to 2000 nm. The three cells are connected in series via a tunnel junction. The open circuit voltage is the sum of the electromotive voltages of the three cells. Note that one side of the photoelectric conversion element 3 has a length of, for example, 3 mm or more and 15 mm or less. Moreover, the photoelectric conversion element 3 has a thickness of 0.3 mm or more and 5 mm or less, for example.

  A lower surface electrode pattern of the photoelectric conversion element 3 is formed on the lower surface of the photoelectric conversion element 3 facing the first main surface S1. The lower electrode pattern is electrically connected to the first terminal 7 via, for example, solder.

  Further, an upper surface electrode pattern formed on the upper surface of the photoelectric conversion element 3 is formed. The upper surface electrode pattern is electrically connected to the second terminal 8 formed on the second main surface S2 through, for example, a wire.

  Here, the first terminal 7 functions as a positive electrode. The second terminal 8 functions as a negative electrode. The photoelectric conversion element 3 is electrically connected to the first terminal 7 and the second terminal 8, and electricity can be taken out through the first terminal 7 or the second terminal 8.

  The frame body 6 is formed on the substrate 5 so as to surround a part of both main surfaces of the first main surface S1 and the second main surface S2. The first terminal 7 extends along the first main surface S <b> 1 from the inside of the frame body 6 toward the outside of the frame body 6. The second terminal 8 extends along the second main surface S <b> 2 from the inside of the frame body 6 toward the outside of the frame body 6.

  The frame 6 is an insulating substrate and is made of, for example, a ceramic material such as alumina or mullite, or a glass ceramic material. Or it consists of a composite material which mixed several materials among these materials.

  A support portion 6 a that supports the light collecting member 9 is formed on the upper portion of the frame body 6. The support portion 6 a is inclined from the upper surface of the frame body 6 to the inner wall surface of the frame body 6.

  The condensing member 9 is connected to the support portion 6a of the frame 6 so as to cover the space SP. The photoelectric conversion element 3 located in the space SP is hermetically sealed by being surrounded by the substrate 5, the frame body 6, and the light collecting member 9. Moreover, the condensing member 9 is fixed to the support portion 6a of the frame 6 via, for example, solder, resin, or glass.

  The condensing member 9 has a function of condensing the light transmitted through the light receiving member 4 and concentrating the condensed light on the photoelectric conversion element 3. The light collecting member 9 is made of, for example, glass, plastic, or translucent resin.

  The photoelectric conversion device 2 is fixed to the base substrate 10 via the connection member 11.

  The photoelectric conversion device 2 has a through hole H1 that penetrates the first terminal 7 and the substrate 5 and a through hole H2 that penetrates the second terminal 8 and the substrate 5 in a region that is not surrounded by the frame body 6 in plan view. Is formed. The through holes H <b> 1 and the through holes H <b> 2 are holes for connecting the photoelectric conversion device 2 and the base substrate 10.

  The base substrate 10 has a function of radiating heat transmitted to the photoelectric conversion device 2 to the outside. In the photoelectric conversion device 2, a part of the energy of the light transmitted through the light receiving member 4 is converted into heat to generate heat. For this reason, the base substrate 10 is connected to the photoelectric conversion device 2, absorbs heat transmitted from the photoelectric conversion device 2, and dissipates the heat to the outside. The base substrate 10 is made of a metal material having a heat radiation function such as aluminum, copper, or molybdenum.

  A screw groove H is formed in the base substrate 10. The screw groove H is formed in a region overlapping with the through hole H1 and the through hole H2 of the photoelectric conversion device 2 when the photoelectric conversion device 2 and the base substrate 10 are overlapped. And it fixes via the connection member 11 in the state which accumulated the photoelectric conversion apparatus 2 and the base substrate 10. FIG.

  The connecting member 11 functions as a screw. Then, the connection member 11 is inserted into the through hole H1 and the screw groove H and is fitted to the through hole H1 and the screw groove H. Similarly, another connecting member 11 is fitted into the through hole H2 and the screw groove H. The connection member 11 is an insulating member and is made of, for example, plastic or resin. Therefore, the first terminal 7 and the second terminal 8 are not electrically connected to the base substrate 10 via the connection member 11, and the electricity stored in the photoelectric conversion device 2 does not flow to the base substrate 10. Designed to be Note that the length of the connection member 11 inserted into the through hole H1 is different from the length of the connection member 11 inserted into the through hole H2, and is designed according to the thickness of the substrate 5.

  4 or 5 shows a state in which the photoelectric conversion devices 2 are connected to each other. 5 is a cross-sectional view showing a connection state between the photoelectric conversion devices 2 in which the portion A in FIG. 4 is enlarged.

  The photoelectric conversion devices 2 are connected to each other through a conductive connection member 12 as shown in FIG. 4 or FIG. The conductive connecting member 12 is formed between the adjacent photoelectric conversion devices 2 from the first terminal 7 of one substrate 5 to the second terminal 8 of the other substrate 5. The conductive connection member 12 is made of a conductive material, and electrically connects the first terminal 7 of one substrate 5 and the second terminal 8 of the other substrate 5. The conductive connecting member 12 is made of, for example, a metal material such as copper, iron, tungsten, molybdenum, nickel, or cobalt, or an alloy containing these metal materials.

  The conductive connecting member 12 has a second main surface S2 of the other substrate 5 through the end side surface on which the second main surface S2 of the other substrate 5 is formed from the first main surface S1 of the one substrate 5. Extended to the top. The extended conductive connecting member 12 can transmit electricity that has been discharged in one photoelectric conversion device 2 to the other photoelectric conversion device 2. In this way, electricity that has been discharged in the photoelectric conversion device 2 can be sent to the adjacent photoelectric conversion device 2. The photoelectric conversion module 1 includes a plurality of serial photoelectric conversion devices 2, and the electricity that has been discharged from each photoelectric conversion device 2 can be taken out from the end of the photoelectric conversion module 1. Although the conductive connection member 12 is directly connected to the connection member 11, electricity does not flow through the connection member 11 because the connection member 11 is insulative.

  According to this embodiment, the first terminal 7 and the second terminal 8 are provided by providing a step on the substrate 5 and changing the height positions of the first terminal 7 and the second terminal 8 connected to the photoelectric conversion element 3. The area on the first terminal 7 on which the photoelectric conversion element 3 is mounted can be reduced without being directly connected. And the area | region enclosed by the frame 6 can be made small, and the photoelectric conversion apparatus 2 can be reduced in size.

  In addition, by designing the height position of the second main surface S2 of the substrate 5 on which the second terminal 8 is formed to be higher than the height position of the upper surface of the photoelectric conversion element 3, the first terminal 7 and the first terminal The distance between the second terminal 8 and the upper surface of the photoelectric conversion element 3 can be made shorter than the distance between the two terminals 8. Even if a discharge phenomenon due to dielectric breakdown occurs from the second terminal 8 toward the first terminal 7, the distance between the second terminal 7 and the photoelectric conversion element 3 is shorter. Electricity tends to flow toward the conversion element 3, and the discharge phenomenon can be suppressed from occurring in the space SP surrounded by the frame body 6.

  In addition, this invention is not limited to the above-mentioned form, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.

<Method for producing photoelectric conversion module>
Here, a method for manufacturing the photoelectric conversion module 1 shown in FIG. 1 and the photoelectric conversion device shown in FIG. 2 will be described.

  First, the substrate 5 and the frame 6 are prepared. When the substrate 5 and the frame 6 are made of, for example, an aluminum oxide sintered body, an organic binder, a plasticizer, a solvent, or the like is added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide. Get.

  Then, after filling the molds of the substrate 5 and the frame body 6 with the mixture and drying, the substrate 5 and the frame body 6 before being sintered are taken out.

  Moreover, a high melting point metal powder such as tungsten or molybdenum is prepared, and an organic binder, a plasticizer, a solvent, or the like is added to and mixed with the powder to obtain a metal paste.

  And the metallized layer for joining the 1st terminal 7 and the 2nd terminal 8 is applied with respect to the taken-out upper surface of the board | substrate 5 before sintering using a metal paste, for example. In addition, when the substrate 5 and the frame body 6 are connected, a metallized layer is formed at a location where they are in contact with each other and apart from the first terminal 7 and the second terminal 8. And the board | substrate 5 and the frame 6 can be baked and each can be produced separately.

  Next, the first terminal 7 and the second terminal 8 are bonded to the upper surface of the metallized layer for bonding the first terminal 7 and the second terminal 8 of the substrate 5 with a brazing material or the like, respectively. Further, the frame body 6 is joined to the first terminal 7 and the surrogate 2 terminal 8 with a brazing material or the like. And the board | substrate 5 and the frame 6 of the connected state can be produced.

  Next, the photoelectric conversion element 3 is mounted on the first terminal 7 in a region surrounded by the substrate 5 and the frame body 6. Then, the first terminal 7 and the lower surface of the photoelectric conversion element 3 are electrically connected. Further, the second terminal 8 in the region surrounded by the frame body 6 is electrically connected to the upper surface of the photoelectric conversion element 3 through a bonding wire. And the condensing member 9 is fixed to the support part 6a of the frame 6 via solder. In this way, the photoelectric conversion device 2 can be manufactured.

  Next, a method for manufacturing the photoelectric conversion module 1 will be described. First, a plurality of photoelectric conversion devices 2 and a base substrate 10 are prepared. The photoelectric conversion device 2 and the base substrate 10 are provided with a through hole H1, a through hole H2, and a screw groove H in advance.

  Here, a method of connecting the two photoelectric conversion devices 2 will be described. Both are arrange | positioned so that the 1st terminal 7 of one photoelectric conversion apparatus 2 and the 2nd terminal 8 of the other photoelectric conversion apparatus 2 may adjoin. Then, the two arranged photoelectric conversion devices 2 are provided on the base substrate 10.

  Next, the conductive connection member 12 is aligned with respect to the two photoelectric conversion devices 2 arranged on the base substrate 10. After the conductive connecting member 12 is positioned with respect to the through hole H1, the through hole H2, and the screw hole H, the conductive connecting member 12 is connected to the two photoelectric conversion devices 2 arranged via the connecting member 11. As a result, the two photoelectric conversion devices 2 can be fixed to the base substrate 10.

  In this way, the photoelectric conversion device 2 can be fixed to the base substrate 10. Similarly, a plurality of photoelectric conversion devices 2 are arranged and fixed on the base substrate 10. And the photoelectric conversion module 1 is producible by providing on the several photoelectric conversion apparatus 2 which has arrange | positioned the light-receiving member 4. FIG.

<Modification 1>
In the above embodiment, the through hole H1 and the through hole H2 provided in the substrate 5 are directly provided in the substrate 5, but the present invention is not limited thereto. For example, as shown in FIG. 6 or FIG.

  A portion where the through hole H1 and the through hole H2 are provided is separated from the substrate 5, and a mounting portion 5a and a mounting portion 5b are provided separately from the substrate 5.

  The attachment portion 5a and the attachment portion 5b are insulating substrates like the substrate 5, and are made of, for example, a ceramic material such as alumina or mullite, or a glass ceramic material. Or it consists of a composite material which mixed several materials among these materials.

  A through hole H1 into which the connection member 11 is inserted is provided in the attachment portion 5a. Moreover, the through-hole H2 which inserts the connection member 11 is provided also in the attachment part 5b. In addition, the length of the connection member 11 uses a suitable thing suitably according to the thickness of the attachment part 5a or the attachment part 5b.

  Further, the first terminal 7a extends from the first main surface S1 of the substrate 5 on the attachment portion 5a. The second terminal 8a extends from the second main surface S2 of the substrate 5 on the attachment portion 5b.

  By making the attachment portion 5a, the attachment portion 5b, and the connection member 11 insulative materials, it is possible to prevent electricity from flowing from the first terminal 7a or the second terminal 8a to the base substrate 10.

  As shown in FIG. 5, when connecting a plurality of photoelectric conversion devices according to Modification 1, between the adjacent photoelectric conversion devices, the conductive connection member extends from one attachment portion 5 a to the other attachment portion 5 b. By providing 12, it is possible to electrically connect one first end 7a and the other second terminal 8a. The conductive connecting member 12a is made of, for example, a metal material such as copper, iron, tungsten, molybdenum, nickel, or cobalt, or an alloy containing these metal materials.

  Here, a method for connecting adjacent photoelectric conversion devices will be described.

  One substrate 5 and the mounting portion 5a are positioned on the base substrate 10, and the other substrate 5 and the mounting portion 5b are positioned on the base substrate 10. Similarly, the conductive connection member 12a is provided from one attachment portion 5a to the other attachment portion 5b. And the 1st terminal 7a can be fixed on the base substrate 10 via the attachment part 5a using the connection member 11. FIG. Similarly, the second terminal 8 a can be fixed on the base substrate 10 via the attachment portion 5 b using the connection member 11.

  When the connection member 11 is fixed to the attachment portion 5a or the attachment portion 5b, stress is applied from the connection member 11 to the attachment portion 5a or the attachment portion 5b. If the attachment portion 5a or the attachment portion 5b is directly connected to the substrate 5, the stress transmitted to the attachment portion 5a or the attachment portion 5b via the connection member 11 is greatly transmitted to the substrate 5. The photoelectric conversion device according to Modification 1 can reduce the stress applied from the connecting member 11 to both mounting portions from the connection member 11 to the substrate 5 by providing the mounting portion 5a and the mounting portion 5b separately from the substrate 5. . As a result, by relaxing the stress transmitted from the connection member 11 to the substrate 5, it is possible to suppress the substrate 5 from being deformed, and thus it is possible to provide a photoelectric conversion device having excellent airtightness.

DESCRIPTION OF SYMBOLS 1 Photoelectric conversion module 2 Photoelectric conversion apparatus 3 Photoelectric conversion element 4 Light receiving member 4a Frame member 4b Lens member 5 Board | substrate 6 Frame 6a Support part 7 1st terminal 8 2nd terminal 9 Condensing member 10 Base board 11 Connection member 12 Conductivity Connection member S1 1st main surface S2 2nd main surface SP Space H1 Through-hole H2 Through-hole H Screw groove

Claims (5)

A substrate on which a first principal surface and a second principal surface having different height positions are formed on one principal surface side;
A frame that is formed on the substrate and surrounds a part of both main surfaces across both main surfaces of the first main surface and the second main surface;
A photoelectric conversion element formed on the first main surface in the frame;
A first terminal formed on the first main surface and electrically connected to a lower surface of the photoelectric conversion element;
A second terminal formed on the second main surface and electrically connected to the upper surface of the photoelectric conversion element;
A condensing member that is joined to the frame and covers a space surrounded by the frame;
A photoelectric conversion device comprising: The photoelectric conversion device according to claim 1,
An end of the first main surface located in the frame and an end of the second main surface located in the frame overlap in plan view. The photoelectric conversion device according to claim 1 or 2, wherein
The photoelectric conversion module, wherein the first terminal and the second terminal extend to the inside and outside of the frame.   A plurality of photoelectric conversion devices according to claim 3 are arranged in parallel, and a first terminal of the first photoelectric conversion device and a second terminal of the second photoelectric conversion device are connected between adjacent photoelectric conversion devices. A photoelectric conversion module characterized by comprising: The photoelectric conversion module according to claim 4,
The photoelectric conversion module, wherein the first terminal of the first photoelectric conversion element and the second terminal of the second photoelectric conversion element are connected via a conductive connection member in plan view.

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