JP5365003B2 - Honeymoon type adhesive composition, mounting substrate bonding method, and mounting substrate assembly - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a honeymoon-type adhesive composition excellent in adhesion, water resistance and room-temperature curability. <P>SOLUTION: The honeymoon-type adhesive composition comprises a liquid A containing an epoxy resin having two or more epoxy groups in a molecule and a thiol compound having two or more mercapto groups in a molecule and a liquid B containing an amine compound. There are also provided a method for bonding a mounted substrate using the honeymoon-type adhesive composition and a mounted substrate assembly in which a pad portion of a mounted substrate and a bump of a functional element mounted on the mounted substrate are electrically connected with the honeymoon-type adhesive composition. <P>COPYRIGHT: (C)2009,JPO&amp;INPIT

Description

  The present invention relates to a honeymoon adhesive composition, a method for bonding a mounting substrate, and a mounting substrate assembly.

For example, Patent Document 1 proposes that a mounting substrate and a functional element are bonded using a honeymoon adhesive to form an assembly of a mounting substrate.
The honeymoon type adhesive comprises a main agent and a curing agent, the main agent is applied to the first adherend, the curing agent is applied to the second adherend, the first adherend and the second adherend. It is an adhesive that bonds the first adherend and the second adherend to each other by bonding the adherend to the adherend on the application surface, thereby bringing the main agent and the curing agent into contact with each other and curing the adhesive. It is used without mixing with a curing agent.
Further, for example, Patent Document 2 (Example 1) proposes a method of bonding a semiconductor chip and a substrate with a two-component epoxy adhesive.

Japanese Patent Laid-Open No. 11-029748 Japanese Patent Laid-Open No. 10-022338

However, the inventor of the present application has found that a honeymoon type adhesive composition containing an acrylic monomer as in Patent Document 1 has low adhesiveness, and its cured product has poor water resistance.
In addition, when the present inventor uses a conventional epoxy composition as a honeymoon type adhesive composition as in Patent Document 2, the cured product does not become a uniform cured state after curing at room temperature, resulting in poor curing. I found out.
Then, an object of this invention is to provide the honeymoon type adhesive composition excellent in adhesiveness, water resistance, and room temperature curability.

  As a result of diligent research to solve the above problems, the present inventor has a liquid A containing an epoxy resin having two or more epoxy groups in the molecule and a thiol compound having two or more mercapto groups in the molecule. The present inventors have found that a two-component composition comprising a liquid B containing an amine compound can be a honeymoon adhesive composition having excellent adhesion, water resistance, and room temperature curability, and completed the present invention.

That is, the present invention provides the following (1) to (10).
(1) Liquid A containing an epoxy resin having two or more epoxy groups in the molecule and a thiol compound having two or more mercapto groups in the molecule;
A honeymoon type adhesive composition comprising B liquid containing an amine compound.
(2) The honeymoon adhesive composition according to (1), wherein the mercapto group is 0.1 to 0.6 equivalents relative to the epoxy group.
(3) The honeymoon adhesive composition according to (1) or (2), wherein the thiol compound is a condensate of a mercapto group-containing silane compound.
(4) The honeymoon adhesive composition according to any one of (1) to (3), wherein the amine compound is a tertiary amine.
(5) The honeymoon adhesive composition according to any one of (1) to (4), wherein the liquid B further contains an imidazole compound.
(6) The honeymoon adhesive composition according to any one of (1) to (5), wherein the liquid A further contains a phenol compound.
(7) The honeymoon adhesive composition according to any one of (1) to (6), wherein the liquid A and / or the liquid B further contains a benzoxazine compound.
(8) A method for bonding a mounting substrate, in which a functional element and a mounting substrate are bonded using the honeymoon adhesive composition according to any one of (1) to (7).
(9) a mixing step of mixing the epoxy resin and the thiol compound;
Applying the liquid A to the mounting substrate and applying the liquid B to the functional element;
The mounting substrate and the functional element are overlapped so that the application surface of the mounting substrate and the application surface of the functional element are in contact with each other, and the liquid A and the liquid B are cured at room temperature to form a laminate. Curing process;
The mounting substrate bonding method according to (8), further comprising a heat curing step in which the laminate is heated to form a mounting substrate assembly.
(10) The pad portion of the mounting substrate and the bumps of the functional element mounted on the mounting substrate were electrically connected with the honeymoon adhesive composition according to any one of (1) to (7) above. Mounting board assembly.

The honeymoon type adhesive composition of the present invention is excellent in adhesiveness, water resistance and room temperature curability.
The mounting substrate bonding method of the present invention is excellent in adhesiveness and room temperature curability, and according to the mounting substrate bonding method of the present invention, a mounting substrate assembly excellent in conductivity and water resistance can be obtained.
The mounting board assembly of the present invention is excellent in conductivity and water resistance.

The present invention will be described in detail below.
The honeymoon adhesive composition of the present invention is
A liquid containing an epoxy resin having two or more epoxy groups in the molecule and a thiol compound having two or more mercapto groups in the molecule;
It is a composition which consists of B liquid containing an amine compound.
Hereinafter, this may be referred to as “the composition of the present invention”.

The epoxy resin will be described below.
The epoxy resin used for the composition of this invention will not be specifically limited if it is a compound which has a 2 or more oxirane ring (epoxy group) in 1 molecule.
Specifically, for example, epoxy compounds having a bisphenyl group, such as bisphenol A type, bisphenol F type, brominated bisphenol A type, hydrogenated bisphenol A type, bisphenol S type, bisphenol AF type, and biphenyl type, polyalkylene Bifunctional glycidyl ether type epoxy resins such as glycol type, alkylene glycol type epoxy compounds, epoxy compounds having a naphthalene ring, epoxy compounds having a fluorene group; phenol novolac type, orthocresol novolak type, trishydroxyphenylmethane type, Trifunctional, polyfunctional glycidyl ether type epoxy resin such as tetraphenylolethane type; glycidyl ester type epoxy resin of synthetic fatty acid such as dimer acid; N, N, N ′, N′-tetraglyce Aromatic epoxy resins having glycidylamino groups, such as dildiaminodiphenylmethane (TGDDM), tetraglycidyl-m-xylylenediamine, triglycidyl-p-aminophenol, N, N-diglycidylaniline; tricyclo [5.2. 1.0 ^2,6 ] Epoxy compound having a decane ring (for example, an epoxy compound obtainable by a production method in which dicyclopentadiene is polymerized with cresols or phenols such as m-cresol and then reacted with epichlorohydrin) Is mentioned.

  Examples of the epoxy resin include an epoxy resin having a sulfur atom in an epoxy resin main chain such as Flep 10 manufactured by Toray Fine Chemical Co., Ltd .; a urethane-modified epoxy resin having a urethane bond; polybutadiene, liquid polyacrylonitrile-butadiene rubber, Rubber-modified epoxy resin containing rubber such as acrylonitrile butadiene rubber (NBR); bisphenol A type epoxy resin, bisphenol F type epoxy resin, sorbitol type epoxy resin, polyglycerol type epoxy resin, pentaerythritol type epoxy resin, trimethylolpropane An epoxy resin having an acetoacetate group in the molecule, such as a type epoxy resin.

The epoxy resin is preferably liquid at room temperature from the viewpoint of ease of handling and mixing.
The epoxy resins can be used alone or in combination of two or more.

One preferred embodiment of the epoxy resin is at least one selected from the group consisting of a bifunctional epoxy resin and a trifunctional or higher functional epoxy resin.
The bifunctional epoxy resin is not particularly limited as long as it is a compound having two oxirane rings (epoxy groups). For example, a conventionally well-known thing is mentioned.
The trifunctional or higher functional epoxy resin is not particularly limited as long as it is a compound having three or more oxirane rings (epoxy groups). For example, a conventionally well-known thing is mentioned.

The thiol compound will be described below.
The thiol compound used in the composition of the present invention is not particularly limited as long as it is a compound having two or more mercapto groups (—SH) in the molecule. The thiol compound can be activated in the presence of an amine compound and can be cured by reacting with an epoxy resin at room temperature. As a thiol compound, a conventionally well-known thing is mentioned, for example.
The mercapto group can be bonded, for example, to the terminal or skeleton of the thiol compound.
In addition to the mercapto group, the thiol compound has a functional group such as a carbonyl group, a urea group (carbamide group), or an isocyanate group; a bond such as an ether bond, a thioether bond, an ester bond, an amide bond, or a urethane bond. be able to.
Examples of the thiol compound include a dithiol compound having two mercapto groups and a tri- or more functional thiol compound having three or more mercapto groups.

  Examples of the dithiol compound include ethanedithiol, propanedithiol, butanedithiol, pentanedithiol, hexanedithiol, heptanedithiol, octanedithiol, nonanedithiol, decanedithiol, benzenedithiol, toluene-3,4-dithiol, and 3,6-dichloro. -1,2-benzenedithiol, 1,5-naphthalenedithiol, benzenedimethanethiol, 4,4'-thiobisbenzenethiol, 2-di-n-butylamino-4,6-dimercapto-s-triazine, 5 , 5-bis (mercaptomethyl) -3,7-dithianonane-1,9-dithiol, dimercaptopropanol, dithioerythritol, dimercaptoethyl sulfide.

  Examples of the trifunctional or higher functional thiol compound include polythiol (for example, “QE-340M” manufactured by Toray Fine Chemical Co., Ltd.), trithioglycerin, and the like obtained by introducing a mercapto group at the end of a polyether (for example, polyoxypropylene glycol). , 3,5-triazine-2,4,6-trithiol (trimercapto-triazine), trimethylolpropane tristhioglycolate, trimethylolpropane tristhiopropionate, 1,2,4-tris (mercaptomethyl) benzene 1,3,5-tris (mercaptomethyl) benzene, 2,4,6-tris (mercaptomethyl) mesitylene, tris (mercaptomethyl) isocyanurate, tris (3-mercaptopropyl) isocyanurate, 2,4,5 -Tris (mercaptomethi) ) -1,3-dithiolane-like trithiols; pentaerythritol tetrakisthioglycolate, pentaerythritol tetrakisthiopropionate, 1,2,4,5-tetrakis (mercaptomethyl) benzene, tetramercaptobutane, pentaerythrithiol Tetrathiols such as: hexathiols such as dipentaerythritol hexa-3-mercaptopropionate; mercapto group-containing silane compounds, or condensates of mercapto group-containing silane compounds.

  Among them, from the viewpoint of being excellent at room temperature curing and physical properties of the resulting cured product, a dithiol compound such as dimercaptoethylsulfide; a hexathiol compound such as dipentaerythritol hexa-3-mercaptopropionate; containing a mercapto group Condensates of silane compounds are preferred.

The mercapto group-containing silane compound as the thiol compound is not particularly limited as long as it is a compound having a mercapto group and a silicon atom.
The silicon atom preferably forms a hydrolyzable silyl group (a hydrolyzable silyl group) or a silanol group.
The hydrolyzable silyl group is not particularly limited as long as it becomes a silanol group after hydrolysis. Examples of the hydrolyzable silyl group include those in which 1 to 3 alkoxy groups and phenoxy groups are bonded to a silicon atom. Examples of the alkoxy group include a methoxy group and an ethoxy group.
When there are 1 to 2 alkoxy groups and phenoxy groups bonded to the silicon atom, the remaining groups bonded to the silicon atom are not particularly limited. Examples thereof include a methyl group and an ethyl group.

  Examples of the mercapto group-containing silane compound include 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropylmethyldiethoxysilane, and 3-mercaptopropylethyldiethoxy. Examples include silane.

  The condensate of the mercapto group-containing silane compound as the thiol compound is not particularly limited. For example, the condensate of said mercapto group containing silane compound is mentioned.

The condensate of the mercapto group-containing silane compound is preferably from 500 to 5,000 in terms of weight average molecular weight from the viewpoint of excellent adhesion and excellent glass transition temperature of the cured product. More preferably, it is 000.
The production of the condensate of the mercapto group-containing silane compound is not particularly limited. For example, a conventionally well-known thing is mentioned.
The thiol compounds can be used alone or in combination of two or more.

  From the viewpoint that the mercapto group of the thiol compound is superior in room temperature curability and excellent in cured product properties, it is preferably 0.1 to 1.1 equivalents relative to the epoxy group of the epoxy resin, More preferably, it is 0.6 equivalent.

The amine compound will be described below.
The amine compound used in the composition of the present invention is a compound having a nitrogen atom and is not particularly limited as long as it can activate a mercapto group.

The amine compound is preferably a polyamine compound having two or more nitrogen atoms.
Examples of the polyamine compound include aliphatic polyamines, alicyclic polyamines, aromatic polyamines, latent curing agents, and special amines.
Aromatic polyamines and special amines are preferred examples.

The aromatic polyamine curing agent is not particularly limited as long as an amino group and / or an imino group are bonded to the aromatic ring. For example, preparative squirrel dimethylaminomethyl phenol, 2,4,6-tris (dimethylaminomethyl) phenol, 1,8-diazabicyclo [5.4.0] undecene -1,1,4- diazabicyclo [2.2.2 Tertiary amines such as octane; N, N′-dimethylethylenediamine, N, N′-diethylethylenediamine, N, N′-diisopropylethylenediamine, N, N′-dimethyl-1,3-propanediamine, N, N'-diethyl-1,3-propanediamine, N, N'-diisopropyl-1,3-propanediamine, N, N'-dimethyl-1,6-hexanediamine, N, N'-diethyl-1,6 Secondary amines such as hexanediamine; 3,3'-diaminodiphenylsulfone (3,3'-DDS), 4,4'-diaminodi Enirusuruhon diaminodiphenylsulfone such as (4,4'-DDS), diaminodiphenyl ether (DADPE), bisaniline, 3, 3'-dichloro-4,4'-diaminodiphenylmethane (MOCA), 4,4'-diaminodiphenylmethane 2,4'-diaminodiphenylmethane, 3,3'-diaminodiphenylmethane, 3,4'-diaminodiphenylmethane, 2,2'-diaminobiphenyl, 3,3'-diaminobiphenyl, 2,4-diaminophenol, 2, 5-diaminophenol, o-phenylenediamine, m-phenylenediamine, p-phenylenediamine, 2,3-tolylenediamine, 2,4-tolylenediamine, 2,5-tolylenediamine, 2,6-tolylenediamine Amine, 3,4-tolylenediamine, methylthio Toluenediamine, include primary amines such as diethyl toluene diamine.

The latent curing agent is not particularly limited as long as it generates an amine compound by heat or the like, and the generated amine compound functions as a curing agent for an epoxy resin or a thiol compound. Examples thereof include organic acid dihydrazide, dicyandiamide, amine imide, tertiary amine salt, imidazole salt, Lewis acid, Bronsted acid, oxazolidine compound, and ketimine compound.
Among them, a ketimine compound is mentioned as one of preferable embodiments.

The ketimine compound is a compound having a ketimine bond derived from a ketone or aldehyde and an amine. In the present specification, the ketimine compound includes aldimine having a —HC═N bond.
The ketimine compound is not particularly limited. For example, obtained from methyl isobutyl ketone (MIBK) and propylene diamine; obtained from methyl isopropyl ketone (MIPK) and / or methyl-t-butyl ketone (MTBK) and Jeffamine EDR148; and MIPK and / or MTBK Obtained from 1,3BAC; obtained from MIPK and / or MTBK and norbornanediamine (NBDA); obtained from MIPK and / or MTBK and m-xylylenediamine (MXDA); MIPK and / or Those obtained from MTBK and polyamidoamine; those obtained from diethyl ketone and MXDA.

Of these, tertiary amines are preferred from the viewpoints of excellent activation of thiol compounds and physical properties of cured products, and that they are less likely to form salts with thiol compounds and are superior in room temperature rapid curability, and 2,4,6-tris (dimethylamino) is preferred. Methyl) phenol is more preferred.
An amine compound can be used individually or in combination of 2 types or more, respectively.

The amount of the amine compound is preferably 0.1 to 5 parts by mass with respect to 100 parts by mass of the epoxy resin, from the viewpoint of being excellent in room temperature rapid curability and excellent in heat resistance of the cured product. More preferably, it is 3 parts by mass.
When the amine compound is liquid, the liquid amine compound may form a salt with the thiol compound. In such a case, an amine compound that forms a salt with the thiol compound and an amine compound that does not form a salt with the thiol compound can be used in combination. The amine compound that forms a salt with the thiol compound can be used in an amount that does not cause curing inhibition.

In the composition of this invention, it is preferable to contain an imidazole compound from a viewpoint that it is excellent in adhesive strength and the heat resistance of hardened | cured material.
The imidazole compound used in the composition of the present invention can be used as a polymerization catalyst for an epoxy resin.
The imidazole compound is not particularly limited as long as it is a compound having an imidazole ring. For example, N-methylimidazole, 2-methylimidazole, 1,2-dimethylimidazole, 2-phenylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1-isobutyl-2-methylimidazole, 2-phenyl-4 -Methylimidazole, 2-ethyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1 -Cyanoethyl-2-undecylimidazole, 2,4-diamino-6 (2'-methylimidazole (1 ')) ethyl-s-triazine, 2,4-diamino-6 (2'-undecylimidazole (1' )) Ethyl-s-triazine, 2,4- Amino-6 (2'-ethyl, 4-methylimidazole (1 ')) ethyl-s-triazine, 2,4-diamino-6 (2'-methylimidazole (1')) ethyl-s-triazine isocyanuric acid Adduct, 2: 3 adduct of 2-methylimidazole isocyanuric acid, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-3,5-dihydroxymethylimidazole, 2-phenyl-4-hydroxymethyl-5-methylimidazole Various imidazoles such as 1-cyanoethyl-2-phenyl-3,5-dicyanoethoxymethylimidazole, and these imidazoles and phthalic acid, isophthalic acid, terephthalic acid, trimellitic acid, pyromellitic acid, naphthalenedicarboxylic acid , Salts with polyvalent carboxylic acids such as maleic acid and succinic acid It is below.

Of these, N-methylimidazole is preferable from the viewpoint of excellent low-temperature curability and low viscosity.
The imidazole compounds can be used alone or in combination of two or more.

The amount of the imidazole compound is preferably 0.1 to 5 parts by mass with respect to 100 parts by mass of the epoxy resin from the viewpoint of being excellent in adhesion and excellent in curability (heat resistance), and 0.5 to 3 More preferred is part by mass.
The imidazole compound is preferably added to the B liquid from the viewpoint of excellent storage stability.

The honeymoon adhesive composition of the present invention can further contain a phenol compound. Further, examples of the phenol compound that can be contained include those that can be used as an epoxy resin curing agent.
The phenol compound is not particularly limited as long as it has two or more phenolic hydroxy groups in one molecule. For example, phenol, cresol, resorcin, catechol, bisphenol A, bisphenol F, phenylphenol, aminophenol, etc. Phenols and / or novolak type phenol resins and phenols obtained by condensation or cocondensation of naphthols such as α-naphthol, β-naphthol, dihydroxynaphthalene and the like and compounds having an aldehyde group such as formaldehyde in the presence of an acidic catalyst And / or phenol-aralkyl resins synthesized from naphthols and dimethoxyparaxylene or bis (methoxymethyl) biphenyl, aralkyl-type phenol resins such as naphthol-aralkyl resins, dicyclopentadiene modification Phenolic resin, cyclopentadiene modified phenolic resin, terpene modified phenolic resin, polycyclic aromatic ring modified phenolic resin, triphenolmethane type phenolic resin, bisphenol A, bisphenol F, bisphenol S, thiodiphenol, naphthalenediol and the like. Moreover, a phenol resin can be used as an allylated product.

Especially, from a viewpoint that it is excellent in hardened | cured material physical property, a novolak-type phenol resin is mentioned as one of the preferable aspects.
A phenol compound can be used individually or in combination of 2 types or more, respectively.

  The amount of the phenolic compound is preferably 0.05 to 0.6 equivalent, preferably 0.1 to 0.4 equivalent with respect to the epoxy resin, from the viewpoint of excellent adhesion, particularly water-resistant adhesion. Is more preferable.

The composition of the present invention may further contain a benzoxazine compound. When the composition of the present invention further contains a benzoxazine compound, such a composition is excellent in room temperature curability and adhesiveness and can be a cured product having a high glass transition temperature.
As a benzoxazine compound which the composition of this invention can contain further, the compound represented by following formula (1) is mentioned, for example.
In the formula, each R ¹ is independently a hydrocarbon group having 1 to 10 carbon atoms, the hydrocarbon group may have a substituent, and R ¹ may be the same or different, n is an integer of 0-4 each independently.

The benzoxazine compound represented by the formula (1) is a condensed polycyclic compound in which an oxazine ring is condensed with a benzene ring. The benzoxazine compound has two benzoxazine rings.
In the formula (1), the nitrogen atoms of the two benzoxazine rings face each other in the central direction of the benzoxazine compound [the direction in which the methylene group bonding two phenylene groups in the formula (1)]. The benzoxazine ring is arranged. When the same thing is said about the benzene ring of a benzoxazine ring, in Formula (1), the benzoxazine ring is arrange | positioned so that both the benzene rings of a benzoxazine ring may be located in the outer side of a benzoxazine compound.

The hydrocarbon group having 1 to 10 carbon atoms is not particularly limited.
Moreover, the hydrocarbon group can have a substituent.
Examples of the substituent that the hydrocarbon group having 1 to 10 carbon atoms may have include an alkoxy group such as a methoxy group, an ethoxy group, and a butoxy group; an alkenyl group such as a vinyl group, an allyl group, and a butenyl group; An aryl group such as a phenyl group, a naphthyl group and a biphenyl group; an alkyl group such as a methyl group, an ethyl group, a butyl group and a t-butyl group; an ether bond and an ester bond.

  Examples of the hydrocarbon group having 1 to 10 carbon atoms include a methyl group, an ethyl group, a propyl group, an isopropyl group, an n-butyl group, a sec-butyl group, a t-butyl group, a pentyl group, a hexyl group, and an octyl group. , A branched alkyl group such as decyl group; an alicyclic hydrocarbon group such as cyclopentyl group, cyclohexyl group, cycloheptyl group, cyclopentenyl group, cyclohexenyl group; benzyl group, phenethyl group Aryl group-substituted alkyl groups such as: methoxy group-substituted alkyl groups, ethoxy group-substituted alkyl groups, alkoxy group-substituted alkyl groups such as butoxy group-substituted alkyl groups; alkenyl groups such as vinyl groups, allyl groups, and butenyl groups; phenyl Group, aryl group such as naphthyl group; tolyl group, dimethylphenyl group, ethylphenyl group, butyl group Group, an alkyl group substituted aryl group such as t- butylphenyl group; methoxyphenyl group, ethoxyphenyl group, butoxyphenyl group, an alkoxy group-substituted aryl group such as a t- butoxyphenyl group.

R ¹ may be the same or different.
Each n is independently an integer of 0 to 4, and is preferably 0, 1, or 2 and more preferably 0 from the viewpoint that the glass transition temperature is high and the adhesiveness is excellent.

Examples of the benzoxazine compound include a compound represented by the following formula (4) and Pd-type benzoxazine (trade name Pd-type benzoxazine, manufactured by Shikoku Kasei Kogyo Co., Ltd.).

Of these, the compound represented by the formula (4) and Pd-type benzoxazine are preferable from the viewpoint that the glass transition temperature is high and the adhesiveness is excellent.
The benzoxazine compounds can be used alone or in combination of two or more.

The amount of the epoxy resin is preferably less than 90% by mass of the total amount of the epoxy resin and the benzoxazine compound from the viewpoint that the glass transition temperature becomes high and the adhesiveness is excellent.
When the amount of the epoxy resin is less than 90% by mass of the total amount of the epoxy resin and the benzoxazine compound, the amount of the benzoxazine compound exceeds 10% by mass.
In addition, the amount of the epoxy resin and the benzoxazine compound is such that the ratio of the benzoxazine compound to the epoxy resin (benzoxazine compound / epoxy resin) in terms of mass ratio, from the viewpoint that the glass transition temperature becomes higher and the adhesiveness is superior. It is preferably more than 10 / less than 90 to 80/20, more preferably 20/80 to 80/20.

  The composition of the present invention includes an epoxy resin, a thiol compound, an amine compound, an imidazole compound, a phenol compound and a benzoxazine compound, as long as the object of the present invention is not impaired, for example, a curing catalyst, a silane coupling agent, Additives such as fillers (fillers), plasticizers, antioxidants, anti-aging agents, inorganic pigments, organic pigments, adhesion-imparting agents, flame retardants, dehydrating agents, solvents, thixotropic agents, anti-static agents, fillers Can be blended. The amount of the additive is not particularly limited.

  The curing catalyst is not particularly limited as long as it can be used for an epoxy resin or a thiol compound. Examples thereof include carboxylic acids such as 2-ethylhexanoic acid and oleic acid; phosphoric acids such as polyphosphoric acid, ethyl acid phosphate, and butyl acid phosphate; and organic metals such as dibutyltin dilaurate and dioctyltin dilaurate.

The silane coupling agent is not particularly limited as long as it is a compound having a functional group that reacts with an epoxy resin or a thiol compound and a hydrolyzable silicon-containing group.
Examples of the functional group include an amino group, an imino group, a ureido group, a mercapto group, and an acid anhydride group.
The hydrolyzable silicon-containing group is the same as the hydrolyzable silyl group described above.
Examples of the silane coupling agent include γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-aminopropylmethyldimethoxysilane, γ-aminopropylethyldiethoxysilane, bistrimethoxysilylpropylamine, and bistriethoxy. Silylpropylamine, bismethoxydimethoxysilylpropylamine, bisethoxydiethoxysilylpropylamine, N-β (aminoethyl) γ-aminopropyltrimethoxysilane, N-β (aminoethyl) γ-aminopropylmethyldimethoxysilane, N -Β (aminoethyl) γ-aminopropyltriethoxysilane, N-β (aminoethyl) γ-aminopropylethyldiethoxysilane, 3,3-dimethyl-4-aminobutyltrimethoxysilane, 3,3-di Aminosilane compounds such as til-4-aminobutylmethyldimethoxysilane; (N-cyclohexylaminomethyl) methyldiethoxysilane, (N-cyclohexylaminomethyl) triethoxysilane, (N-phenylaminomethyl) methyldimethoxysilane, (N -Phenylaminomethyl) trimethyloxysilane, a compound represented by the following formula (1), N-phenyl-3-aminopropyltrimethoxysilane represented by the following formula (2), represented by the following formula (3) Iminosilane compounds such as compounds;

Ureidosilane compounds such as γ-ureidopropyltrimethoxysilane; containing mercapto groups such as γ-mercaptopropyltrimethoxysilane, γ-mercaptopropyltriethoxysilane, γ-mercaptopropylmethyldimethoxysilane, γ-mercaptopropylmethyldiethoxysilane A silane compound etc. are mentioned.
Among these, N-phenyl-3-aminopropyltrimethoxysilane represented by the formula (2) is preferable from the viewpoint of excellent curability and physical properties after curing.
A silane coupling agent can be used individually or in combination of 2 types or more, respectively.

  The amount of the silane coupling agent is preferably 0.1 to 20 parts by mass with respect to 100 parts by mass of the epoxy resin from the viewpoint of being excellent in adhesiveness and water resistance (water-resistant adhesiveness). More preferably, it is part.

An amine-based silane coupling agent such as an aminosilane compound, an iminosilane compound, or a ureidosilane compound is preferably added to the B liquid from the viewpoint of excellent storage stability.
In addition, silane coupling agents other than amines can be added to the A liquid.

  Examples of the filler include fumed silica, calcined silica, precipitated silica, ground silica, fused silica, aerosil; diatomaceous earth; iron oxide, zinc oxide, titanium oxide, barium oxide, magnesium oxide; calcium carbonate, Magnesium carbonate, zinc carbonate; wax stone clay, kaolin clay, calcined clay; carbon black; or a treated product of these treated with, for example, fatty acid, resin acid, fatty acid ester or urethane compound.

  Examples of the plasticizer include diisononyl adipate dioctyl phthalate, dibutyl phthalate, butyl benzyl phthalate, dioctyl adipate, isodecyl succinate, diethylene glycol dibenzoate, pentaerythritol ester, butyl oleate, methyl acetylricinoleate, tricresyl phosphate, phosphate Examples include trioctyl, propylene glycol adipate polyester, butylene glycol adipate polyester.

Examples of the antioxidant include butylhydroxytoluene, butylhydroxyanisole, triphenyl phosphite and the like.
Examples of the antiaging agent include hindered phenol compounds, benzotriazole compounds, and hindered amine compounds.

Examples of inorganic pigments include titanium dioxide, zinc oxide, ultramarine, bengara, lithopone, lead, cadmium, iron, cobalt, aluminum, hydrochloride, and sulfate.
Examples of organic pigments include azo pigments and copper phthalocyanine pigments.
Examples of the adhesion imparting agent include terpene resin, phenol resin, terpene-phenol resin, rosin resin, and xylene resin.
Examples of the flame retardant include chloroalkyl phosphate, dimethylmethylphosphonate, bromine atom and / or phosphorus atom-containing compound, ammonium polyphosphate, diethyl bishydroxyethylaminoethyl phosphate, neopentyl bromide polyether, and brominated polyether. Can be mentioned.
Examples of the dehydrating agent include acyloxysilyl group-containing polysiloxane.

The composition of the present invention is not particularly limited for its production.
For example, liquid A containing an epoxy resin, a thiol compound, a phenol compound, and an additive that can be used as needed, an amine compound and a benzoxazine compound, and an imidazole compound that can be used as needed The liquid B containing the agent can be separately kneaded and prepared in advance under reduced pressure or in the presence of nitrogen gas using a stirring device such as a mixing mixer.
In addition, a benzoxazine compound can be used for A liquid and / or B liquid.

  About preparation of A liquid, the epoxy resin and the thiol compound are fully mixed uniformly from a viewpoint that the whole hardened | cured material can harden | cure uniformly and does not generate | occur | produce the partial hardening defect, but the sclerosis | hardenability of a composition is more excellent. It is preferable to do.

It is preferable that the composition of the present invention is first cured by bringing the liquid A and the liquid B into contact with each other and curing in advance at room temperature.
The temperature at which the composition of the present invention is cured at room temperature is preferably 10 to 40 ° C, more preferably 20 to 30 ° C, from the viewpoint of curing time.
The temperature at which the composition of the present invention is heated and cured is preferably 80 to 180 ° C, more preferably 120 to 180 ° C, from the viewpoint of curing time.

Applications of the composition of the present invention include, for example, underfill materials, anisotropic conductive adhesives, structural adhesive seals, sealing materials, adhesives, coating materials, primers, and paints.
The adherend to which the composition of the present invention can be applied is not particularly limited, and examples thereof include mounting boards such as printed circuit boards and printed wiring boards, functional elements such as various electronic components, metals, plastics, glass, and coated plates. .

  The composition of the present invention is excellent in adhesion, water resistance and room temperature curability. In addition, the composition of the present invention can be cured by heating after curing under room temperature conditions. The curing time at room temperature is cured in a short time of 1 to 5 hours, resulting in a uniform cured product and poor curing. Is less likely to occur and the adhesive strength is high.

Next, a method for bonding a mounting board according to the present invention will be described below.
The mounting method of the mounting substrate of the present invention is as follows:
This is an adhesion method in which a functional element and a mounting substrate are adhered using the honeymoon adhesive composition of the present invention.
Hereinafter, this may be referred to as “the bonding method of the present invention”.

The functional element or mounting substrate used in the bonding method of the present invention is not particularly limited as long as it is used in semiconductor technology.
Examples of functional elements include integrated circuit chips such as IC and LSI.
On the other hand, examples of the mounting board include a printed circuit board and a printed wiring board.
The bonding method of the present invention can exhibit particularly favorable effects when used for bonding electronic components and / or mounting boards including members that are vulnerable to heat.

The honeymoon type adhesive composition used in the bonding method of the present invention is not particularly limited as long as it is the honeymoon type adhesive composition of the present invention.
The honeymoon type adhesive composition includes the liquid A and the liquid B, but it is not particularly limited whether one of the liquid A or the liquid B is applied to the functional element and the rest is applied to the mounting substrate. A liquid can be applied to a functional element and B liquid can be applied to a mounting substrate. Moreover, B liquid can be applied to a functional element and A liquid can be applied to a mounting substrate.

As the bonding method of the present invention, for example,
A mixing step of mixing an epoxy resin and a thiol compound;
An application step of applying A liquid to the mounting substrate and applying B liquid to the functional element;
A room temperature curing step in which the mounting substrate and the functional element are superposed so that the application surface of the mounting substrate and the application surface of the functional element are in contact with each other, and the liquid A and the liquid B are cured at room temperature to form a laminate;
There is a method for bonding a mounting substrate, which includes a heat curing step in which the laminated body is heated to form a mounting substrate assembly.
Hereinafter, the adhesion method may be referred to as “the adhesion method A of the present invention”.

The bonding method A of the present invention will be described below.
The mixing step is a step of mixing an epoxy resin and a thiol compound to form a mixture.
In the mixing step, an additive can be added and mixed in addition to the epoxy resin and the thiol compound.
About preparation of A liquid, the epoxy resin and the thiol compound are fully mixed uniformly from a viewpoint that the whole hardened | cured material can harden | cure uniformly and does not generate | occur | produce the partial hardening defect, but the sclerosis | hardenability of a composition is more excellent. It is preferable to do.
The mixing step can be performed, for example, at the stage of preparing the liquid A of the honeymoon type adhesive composition, immediately before the use of the honeymoon type adhesive composition.

The steps after the coating step of the bonding method A of the present invention will be described with reference to the accompanying drawings. The present invention is not limited to the attached drawings.
FIG. 1 is a cross-sectional view schematically showing an example of a cross-section of a main part of a mounting substrate and a functional element for explaining the bonding method A of the present invention.
2 and 3 are schematic views schematically illustrating an example of bonding between a mounting substrate and a functional element for explaining the bonding method A of the present invention.

The application process is a process in which the liquid A is applied to the mounting substrate and the liquid B is applied to the functional element.
In the application step, the method for applying the A liquid to the mounting substrate and the method for applying the B liquid to the functional element are not particularly limited. For example, a conventionally well-known thing is mentioned.

  In FIG. 1A, the A agent 51A is applied to the mounting substrate 3, and the B agent 52B is applied to the functional element 1. In this case, the A agent 51 </ b> A is applied so as to cover the electrodes 4 (pad portions) formed on the mounting substrate 3. The B agent 52B is applied so as to cover the bumps 2 (lead terminals) formed on the functional element 1.

In FIG. 2A, B agent (not shown) is applied to the adhesive surface 11B (B agent application surface) of the functional element 1 (for example, an integrated circuit chip).
In FIG.2 (b), A agent (not shown) is apply | coated to the predetermined area | region 31 (A agent application surface) on the mounting board | substrate 3 (for example, wiring circuit board).

  The room temperature curing process is a process in which the mounting substrate and the functional element are overlapped so that the application surface of the mounting substrate and the application surface of the functional element are in contact with each other, and the liquid A and liquid B are cured at room temperature to form a laminate. is there.

In the room temperature curing step, the temperature at the time of curing at room temperature is as defined above.
The room temperature curing time is preferably 30 to 300 minutes.

When A liquid and B liquid contact in a room temperature hardening process, the thiol compound in A agent is activated by the amine compound in B agent, reacts with an epoxy resin at room temperature, and is hardened.
Therefore, the mounting substrate is not deformed by heating at a high temperature to cure the adhesive composition as in the prior art, and the conductivity of the mounting substrate assembly can be made excellent.
In addition, it is possible to prevent the mounting substrate from being deformed by heat in the heat curing process by pre-curing the honeymoon adhesive composition at room temperature before heat curing and firmly bonding the mounting substrate and the functional element. The conductivity of the mounting board assembly can be made excellent.

In FIG. 1B, the functional element 1 and the mounting substrate 3 are stacked on the mounting substrate 3 with the bumps 2 of the functional element 1 and the corresponding electrodes 4 of the mounting substrate 3 facing each other. It is set as the laminated body 10 collectively.
In FIG. 1B, after the A liquid 51A and the B liquid 52A are in contact, the honeymoon adhesive composition 5 is cured at room temperature to become a cured product 5.

In FIG. 2C, alignment is performed so that the electrodes 4 of the mounting substrate 3 and the bumps 2 of the functional element 1 face each other. In FIG. 2C, reference numeral 53A means A agent, and 54B means B agent.
Next, in FIG. 3A, the functional element 1 is pressurized to the mounting substrate 3 at a room temperature in a direction indicated by an arrow with a pressure of 5 to 7 kg / cm ² by the pressurizing table 6a and the pressurizing unit 6b.

The heat curing step is a step of heating the laminated body to obtain a mounting substrate assembly.
In the heat curing step, the temperature when heated and cured is as defined above.
The heat curing time is preferably 30 to 360 minutes.
The direction of heating is not particularly limited. Heating can be performed from either the mounting substrate or the functional element, or from both directions of the mounting substrate and the functional element.

  In FIG. 1B, the laminated body 10 can be heated (not shown) in the heat curing step, and the laminated body 10 can be used as the mounting substrate assembly 10.

  In FIG. 3B, the laminate 10 can be heated from the functional element 1 side (not shown) to form the laminate 10 as the mounting substrate assembly 10.

  The bonding method of the present invention is excellent in adhesion and room temperature curability, and according to the mounting substrate bonding method of the present invention, a mounting substrate assembly excellent in conductivity and water resistance can be obtained.

Next, the mounting board assembly of the present invention will be described below.
The mounting board assembly of the present invention is
The pad portion of the mounting substrate and the bumps of the functional element mounted on the mounting substrate are electrically connected with the honeymoon adhesive composition of the present invention.

The mounting board assembly of the present invention will be described below with reference to the accompanying drawings. The present invention is not limited to the attached drawings.
FIG. 4 is a cross-sectional view schematically showing a cross section of an example of the mounting board assembly of the present invention.
In FIG. 4, the mounting substrate assembly 400 of the present invention electrically connects the pad portion 4 of the mounting substrate 3 and the bumps 2 of the functional element 1 mounted on the mounting substrate 3 with the honeymoon adhesive composition 5. Connected.

The honeymoon type adhesive composition used for the mounting substrate assembly of the present invention is not particularly limited as long as it is the composition of the present invention.
The mounting substrate and the functional element used in the mounting substrate assembly of the present invention have the same meaning as described above.
If the mounting board assembly of this invention uses the composition of this invention, it will not restrict | limit in particular about the manufacture. For example, it can be manufactured by the bonding method of the present invention.

  In the mounting substrate assembly of the present invention, the liquid A contains a thiol compound in the honeymoon type adhesive composition used, whereby the curability of the composition becomes uniform. In addition, since the honeymoon type adhesive composition contains an epoxy resin and a thiol compound, it is excellent in heat resistance, water resistance, and adhesiveness as compared with an acrylic composition. In addition, the honeymoon type adhesive composition is excellent in curability at room temperature and has high adhesive strength. By pre-adhering the mounting substrate and the functional element at room temperature, the warping of the mounting substrate under subsequent heating conditions is suppressed. The mounting board can be held flat, and the mounting board assembly is excellent in electrical conductivity.

  Hereinafter, the present invention will be specifically described with reference to examples. However, the present invention is not limited to these.

1. Evaluation The following evaluation was performed about the obtained composition. The results are shown in Tables 1 and 2.
(1) Room temperature curing time Two PET films (length 1 cm, width 1 cm) are prepared, 0.1 g of A solution is applied to one of them, and a necessary amount of B solution is applied to the remaining one, and PET The two coated PET films were laminated with the coated surfaces of the films facing each other, and the time until curing at 23 ° C. was measured.

(2) Adhesive strength Two adherends (10 mm long, 50 mm wide, 1.6 mm thick glass epoxy) were prepared, one of which was coated with 0.1 g of solution A, and the remaining one was B Apply the required amount of the liquid, superimpose the application surfaces of the adherends on top of each other, bond the two adherends, leave them at 23 ° C for 3 hours, and heat-treat at 170 ° C for 1 hour. A sample in which two adherends were laminated via an adhesive was obtained. The obtained sample was used as a sample for adhesive strength.
A sample for adhesive strength was attached to a tensile tester, a tensile test was performed under conditions of a tensile speed of 1 mm / min, and the adhesive strength was measured.

(3) Water resistance The sample for adhesive strength was put into a pressure cooker tester (temperature 121 ° C., humidity 100%), taken out of the pressure cooker tester 24 hours later, and placed at 23 ° C. for 1 hour. After 1 hour, the strength of the obtained sample was determined by a tensile test (tensile speed: 1 mm / min).
The evaluation criteria for water resistance are as follows: ○ when the strength retention of the adhesive strength after the water resistance test with respect to the evaluation result of (2) adhesive strength is 70% or more, Δ when the strength retention is 60% or more and less than 70%, 60 The case where it was less than% was set as x.

(4) Conductivity A mounting substrate assembly was produced using the obtained composition and a conduction test was performed.
Liquid A was applied to a predetermined area on a printed circuit board made of glass epoxy.
The solution B was applied to a predetermined surface of a 1 cm ² □ integrated circuit chip (having bumps of about 300 pins).

The bumps on the coated surface of the integrated circuit chip and the electrodes on the coated surface of the wiring circuit board were aligned. Further, the integrated circuit chip is pressed against a printed circuit board with a pressure device at a pressure of 5 to 7 kg / cm ² , and the thiol compound in the composition is cured at room temperature (23 ° C.) for 180 minutes to thereby integrate the integrated circuit chip. The printed circuit board was fixed to form a laminated body, and the laminated body was heated at 170 ° C. for 1 hour to thermally cure the epoxy resin, thereby obtaining a mounting board assembly.

About the obtained mounting substrate assembly, it was tested whether electricity could be supplied by supplying electricity.
As the evaluation criteria for continuity, the case of energization was marked with ◯, and the case of not energizing was marked with x.
When the composition is sufficiently cured at normal temperature, warpage of the substrate from stress during heating is suppressed, and poor conduction (bump breakage) can be prevented.

2. Production of Composition (1) Components and Amount of Composition Each component shown in Tables 1 and 2 was used in an amount (unit: parts by mass) shown in the same table.
In addition, the quantity of the thiol compounds 1-3 was described as the equivalent of the mercapto group with respect to the epoxy group of the epoxy resin 1 or 2.
Moreover, the amount of the phenol compound is described as the equivalent of the hydroxy group with respect to the epoxy group of the epoxy resin 1 or 2.
Moreover, the quantity of the filler 1 was described as weight% of the filler 1 which occupies for A liquid.
The amount of the filler 2 is described as the weight% of the filler 2 in the B liquid.
(2) Production method of the composition A solution is agitated for 2 minutes at a rotational speed of 2,000 times per minute using an air bubble stirrer with the epoxy resin and thiol compound shown in Tables 1 and 2. Then, the other components shown in Tables 1 and 2 were added, and the mixture was further stirred until uniform.
Liquid B was made uniform by stirring the components shown in Tables 1 and 2 using a defoaming stirrer.

The details of each component shown in Tables 1 and 2 are as follows.
Epoxy resin 1: bisphenol A type epoxy resin (EP-4100E, manufactured by Asahi Denka Co.)
Epoxy resin 2: triglycidyl-p aminophenol (MY-0510, manufactured by Huntsman Advanced Materials)
Benzoxazine compound: a compound represented by the following formula (4) (trade name: benzoxazine Pd, manufactured by Shikoku Chemicals)
・ Acrylate 1, 2: NK ester DCP (manufactured by Shin-Nakamura Chemical Co., Ltd.)
-Thiol compound 1: Dimercaptoethyl sulfide-Thiol compound 2: Dipentaerythritol hexa-3-mercaptopropionate (DPMP, manufactured by Sakai Chemical Co., Ltd.)
Thiol compound 3: a condensate of mercapto group-containing silane compounds. 196 g of 3-mercaptopropyltrimethoxysilane (KBM-803, manufactured by Shin-Etsu Chemical Co., Ltd.) is stirred for 15 hours at room temperature in a nitrogen atmosphere in the presence of 18 g of water and 0.5 g of dibutyltin-dilaurate, and the solvent is removed after completion of the reaction. As a result, a condensate of a mercapto group-containing silane compound was obtained. The resulting condensate is designated as thiol compound 3.
-Phenol compound: Trade name MEH-8000H, manufactured by Meiwa Kasei Co., Ltd.-Silane coupling agent 1: 2- (3,4 epoxycyclohexyl) ethyltrimethoxysilane (KBM-303, manufactured by Shin-Etsu Chemical Co., Ltd.)
Silane coupling agent 2: N-phenyl-3-aminopropyltrimethoxysilane (KBM-573, manufactured by Shin-Etsu Chemical Co., Ltd.)
Filler 1: Silica filler (UF-103A, manufactured by Tokuyama Corporation)
Filler 2: Aerosil (RY-202S, manufactured by Nippon Aerosil)
Amine compound 1: Special amine (U-cat 41, manufactured by San Apro Chemical Co.)
Amine compound 2: 2,4,6-tris (dimethylaminomethyl) phenol (DMP-30, manufactured by Seiko Chemical Co., Ltd.)
-Polymerization catalyst: N-methylimidazole-Amine compound 3: Ketimine (HOK-01, manufactured by Daito Sangyo Co., Ltd.)
・ Peroxide: Niper BMT-M (manufactured by NOF Corporation)

As is apparent from the results shown in Tables 1 and 2, Comparative Example 1 containing no thiol compound was inferior in room temperature curability. Comparative Example 2 containing no amine compound was inferior in room temperature curability. In Comparative Example 3 in which the liquid B contains a thiol compound, the entire cured product was not uniformly cured after curing at room temperature, and partial curing failure occurred .
On the other hand, the compositions of Examples 1 to 15 are excellent in room temperature curability and water resistance, and have high adhesive strength and excellent adhesiveness.
Moreover, the adhesion method of Examples 1-15 is excellent in adhesiveness and room temperature curability, and according to the adhesion method of Examples 1-15 , the mounting substrate assembly excellent in electroconductivity and water resistance can be obtained.
The mounting board assemblies of Examples 1 to 15 are excellent in conductivity and water resistance.

FIG. 1 is a cross-sectional view schematically showing an example of a cross-section of a main part of a mounting substrate and a functional element for explaining the bonding method A of the present invention. FIG. 2 is a schematic view schematically illustrating an example of bonding between a mounting substrate and a functional element for explaining the bonding method A of the present invention. FIG. 3 is a schematic view illustrating the bonding method A of the present invention in order following FIG. FIG. 4 is a cross-sectional view schematically showing a cross section of an example of the mounting board assembly of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Functional element 2 Bump 3 Mounting board 4 Electrode 5 Honeymoon type adhesive composition, hardened | cured material 51A A liquid 52B B liquid 6a Pressurization stand 6b Pressurization part 10 Laminated body, mounting board assembly 11B B agent application surface 31A A agent Coating surface 53A A agent 54B B agent 400 Mounting board assembly

Claims (17)

A liquid containing an epoxy resin having two or more epoxy groups in the molecule and a thiol compound having two or more mercapto groups in the molecule;
Ri Do and a B solution containing the polyamine compound,
The liquid A is applied to the first adherend, the liquid B is applied to the second adherend, and the first adherend and the second adherend are bonded together on the application surface. , Honeymoon type adhesive composition.   The honeymoon adhesive composition according to claim 1, wherein the mercapto group is 0.1 to 0.6 equivalents relative to the epoxy group.   3. The honeymoon type according to claim 1, wherein the thiol compound is at least one selected from the group consisting of dithiol, trithiol, tetrathiol, hexathiol, a mercapto group-containing silane compound, and a condensate of a mercapto group-containing silane compound. Adhesive composition.   The honeymoon type adhesive composition according to any one of claims 1 to 3, wherein the thiol compound is a condensate of a mercapto group-containing silane compound. The honeymoon adhesive composition according to any one of claims 1 to 4, wherein the polyamine compound is at least one selected from the group consisting of an aliphatic polyamine, an alicyclic polyamine, an aromatic polyamine, and a latent curing agent. . The polyamine compound, honeymoon type adhesive composition according to any one of claims 1 to 5 which is a tertiary amine. The amount of the said polyamine compound is 0.1-5 mass parts with respect to 100 mass parts of said epoxy resins, The honeymoon type adhesive composition in any one of Claims 1-6. The honeymoon adhesive composition according to any one of claims 1 to 7 , wherein the liquid B further contains an imidazole compound. The honeymoon adhesive composition according to any one of claims 1 to 8 , wherein the liquid A further contains a phenol compound. The honeymoon adhesive composition according to any one of claims 1 to 9 , wherein the liquid A and / or the liquid B further contains a benzoxazine compound.   The honeymoon adhesive composition according to any one of claims 1 to 10, wherein the mercapto group is 0.1 to 0.5 equivalents relative to the epoxy group. Applying the liquid A to a functional element as the first adherend and / or applying the liquid B to a mounting substrate as the second adherend, or applying the liquid B to the first adherend The honeymoon type adhesion according to any one of claims 1 to 11, which is applied to a functional element as one adherend adherend and the liquid A is applied to a mounting substrate as the second adherend adherend. Agent composition. The liquid B further comprises γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-aminopropylmethyldimethoxysilane, γ-aminopropylethyldiethoxysilane, bistrimethoxysilylpropylamine, bistriethoxysilylpropyl. Amine, 3,3-dimethyl-4-aminobutyltrimethoxysilane, 3,3-dimethyl-4-aminobutylmethyldimethoxysilane, (N-cyclohexylaminomethyl) methyldiethoxysilane, (N-cyclohexylaminomethyl) tri Ethoxysilane, (N-phenylaminomethyl) methyldimethoxysilane, (N-phenylaminomethyl) trimethyloxysilane, a compound represented by the following formula (1), a compound represented by the following formula (2), and the following Expressed by equation (3) Honeymoon-type adhesive composition according to any one of claims 1 to 12 containing at least one selected from the group consisting of that compound.
The solution A further comprises γ-mercaptopropyltrimethoxysilane, γ-mercaptopropyltriethoxysilane, γ-mercaptopropylmethyldimethoxysilane, γ-mercaptopropylmethyldiethoxysilane, and 2- (3,4 epoxycyclohexyl) ethyl. The honeymoon type | mold adhesive composition in any one of Claims 1-13 containing at least 1 sort (s) chosen from the group which consists of trimethoxysilane. Functional element and the mounting substrate and the claims 1-14 the method of bonding the mounting substrate to be bonded using honeymoon adhesive composition according to any one of. A mixing step of mixing the epoxy resin and the thiol compound;
Applying the liquid A to the mounting substrate and applying the liquid B to the functional element;
The mounting substrate and the functional element are overlapped so that the application surface of the mounting substrate and the application surface of the functional element are in contact with each other, and the liquid A and the liquid B are cured at room temperature to form a laminate. Curing process;
The mounting substrate bonding method according to claim 15 , further comprising a heat curing step of heating the laminated body to obtain a mounting substrate assembly. Mounting board assembly electrically connected with honeymoon adhesive composition according to any one of the pad portion of the mounting substrate and the bump of the mounted functional element on the mounting substrate according to claim 1-14.