JP6227923B2 - Method for producing laminated film, adhesive composition kit and reaction initiator composition - Google Patents

Description

  The present invention relates to a method for producing a laminated film, an adhesive composition kit used in the method for producing a laminated film, and a reaction initiator composition constituting the adhesive composition kit.

  Laminate films are used in a wide range of fields including automobiles, aircraft, and electrical / electronic devices. With the increasing demand for quality and cost of laminate films from each field, a method for producing laminate films However, improvement in productivity, improvement in yield, etc. are required while maintaining the quality of the laminated film produced.

  For example, in many fields, a light and / or thermosetting adhesive is used for bonding a film constituting a laminated film.

On the other hand, a polarizing plate used in an optical member or a liquid crystal display device has conventionally been provided with a TAC (triacetylcellulose) -based protective film on both surfaces of a PVA (polyvinyl alcohol) -based polarizer film dyed with iodine (PVA aqueous solution). )
The material of the protective film is limited to TAC with good water vapor permeability for drying water,
Due to quality and cost issues such as the need for a saponification process when using the TAC, heat and / or photocurable adhesives and other (e.g. It has been investigated to form a film made of a COP (cyclic polyolefin resin: ZEONOR film, etc., Nippon Zeon Co., Ltd.) material that does not pass water vapor into a polarizing plate laminated film (Patent Document 1).

JP 2004-245925 A

  However, when using a photo-curable adhesive as an adhesive for laminated films, for example, when the laminated film is multi-layered, light irradiation must be performed from both sides of the laminated film, etc. In addition, there are problems such as complicated process management such as illuminance variation of the UV lamp in order to achieve a uniform and stable photocuring reaction.

  Also in the polarizing plate laminated film, if a film that does not pass water vapor such as COP is used as a protective film, it takes more time to dry the water paste than TAC, so it is necessary to slow down the production speed or lengthen the drying process. If a photocurable adhesive is used in the manufacturing process of a laminated film, such as laminating a polarizer and a protective film, underneath the light irradiation lamp to cure the photocurable adhesive applied to the film. In this case, the heat from the lamp causes a difference in film expansion / expansion between the irradiated surface and the back surface, and a quality control problem occurs such as deterioration of a laminated film such as a polarizer. Also, in terms of equipment, new investments such as the introduction of UV irradiators are required.

  The problem to be solved by the present invention is that when a laminated film is produced by laminating at least two films via a reactive curable composition, the reactive curable composition can be cured in a low temperature environment. It is providing the reaction initiator composition which comprises the manufacturing method of a laminated | multilayer film, the adhesive composition kit used for the manufacturing method of the said laminated | multilayer film, and the said adhesive composition kit.

The present invention includes the following.
(1) A method for producing a laminated film in which at least two films are laminated via a cured product of a reactive curable composition,
Step 1: Disposing a reaction initiator capable of initiating a polymerization reaction of a reaction curable compound in the reaction curable composition on one or both of the opposing surfaces of the two films.
Step 2: Disposing the reaction curable composition on at least one surface of the reaction initiator disposed on the surface and the surface on which the reaction initiator is not disposed,
Step 3: The two reaction films are bonded to each other so that the arranged reaction initiator and the reaction curable composition are in contact with each other, and the reaction curable compound is polymerized to form the reaction curable composition. A method for producing a laminated film including a step of curing a product,
(2) The method for producing a laminated film according to (1), wherein in the step 3, the reaction curable compound undergoes a polymerization reaction at 120 ° C. or lower.
(3) The method for producing a laminated film according to (1) or (2), wherein the step 3 does not include a step of irradiating the reaction curable composition with light.
(4) The reaction curable compound is at least one compound selected from the group consisting of a radical reaction curable compound, a cation reaction curable compound, an anion reaction curable compound, and a polycondensation reaction curable compound (1). Or the manufacturing method of the laminated | multilayer film of (2).
(5) a reaction curable composition containing a radical reaction curable compound as the reaction curable compound;
A combination of initiators including a radical generator (composition / agent kit 1),
A reaction curable composition comprising a cationic reaction curable compound as the reaction curable compound; and
A combination of initiators including a cation generator (composition / agent kit 2),
A reaction curable composition comprising an anion reaction curable compound as the reaction curable compound;
A combination of initiators including an anion generator (composition / agent kit 3),
A reaction curable composition containing a polycondensation / polyaddition reaction curable compound as the reaction curable compound;
A combination of reaction initiators including a polycondensation / polyaddition initiator (composition / agent kit 4),
A reactive curable composition comprising an ethylenically unsaturated group-containing compound as the reactive curable compound and a radical generator that generates radicals in the presence of a reducing agent;
A combination of a reaction initiator containing the reducing agent (composition / agent kit 5), and a reaction curable composition containing an ethylenically unsaturated group-containing compound as the reaction curable compound and a reducing agent;
(1) to (4) using at least one kit selected from the group consisting of a combination of initiators including a radical generator that generates radicals in the presence of the reducing agent (composition / agent kit 6). A method for producing any one of the laminated films.
(6) In the step 1, the reaction initiator is arranged together with the reaction curable composition B,
In the said process 2, the said reactive curable composition is arrange | positioned with the reaction initiator b which can start the polymerization reaction of the said reactive curable composition B. Manufacture of the laminated | multilayer film in any one of (1)-(5) Method.
(7) The method for producing a laminated film according to any one of (1) to (6), wherein in the step 1, the reaction initiator is disposed as a coat layer containing a reaction initiator.
(8) Step 1 is steps 1A to 1B:
1A: a step of disposing a reaction initiator composition containing the reaction initiator on one or both of the opposing surfaces of the two films; and 1B: reaction by curing the reaction initiator composition. The manufacturing method of the laminated film in any one of (1)-(7) which is the process of obtaining the coating layer containing an initiator.
(9) The method for producing a laminated film according to any one of (1) to (8), wherein one of the two films is a polarizer film, and the laminated film is a polarizing plate.
(10) Adhesive for producing a laminated film according to any one of (1) to (9), comprising a reaction initiator composition comprising the reaction initiator of (1) and a reaction curable composition of (1) Composition kit.
(11) The adhesive composition kit according to (10), wherein the reaction initiator composition has a viscosity of 1 to 3000 mPa · s, and the reaction curable composition has a viscosity of 1 to 3000 mPa · s.
(12) The reaction initiator composition according to (10) or (11) for the adhesive composition kit according to (10) or (11).

  According to the present invention, when a laminated film is produced by laminating at least two films via a reactive curable composition, production of a laminated film capable of curing the reactive curable composition in a low temperature environment. The method, the adhesive composition kit used in the method for producing the laminated film, and the reaction initiator composition constituting the adhesive composition kit can be provided.

[Production method of laminated film]
The production method of the present invention is a method for producing a laminated film in which at least two films are laminated via a cured product of a reactive curable composition,
Step 1: Disposing a reaction initiator capable of initiating a polymerization reaction of a reaction curable compound in the reaction curable composition on one or both of the opposing surfaces of the two films.
Step 2: Disposing the reaction curable composition on at least one surface of the reaction initiator disposed on the surface and the surface on which the reaction initiator is not disposed,
Step 3: The two reaction films are bonded to each other so that the arranged reaction initiator and the reaction curable composition are in contact with each other, and the reaction curable compound is polymerized to form the reaction curable composition. A step of curing the object.

  That is, in the production method of the present invention, in steps 1 and 2, a reaction initiator capable of initiating a polymerization reaction of the reaction curable composition and the reaction curable composition is preferably overlapped on each surface of the two films. And / or separated (preferably separated), and in step 3, when the two films are bonded, the reaction curable composition and the reaction initiator are bonded so that they are in direct contact, or , Preferably 120 ° C. or lower, more preferably 100 ° C. or lower, further preferably 80 ° C. or lower, more preferably 60 ° C. or lower, and further preferably 50 ° C. or lower, preferably 0.00001 seconds. Characterized in that the reaction curable compound is cured by polymerization reaction in a contact time of ˜1 hour, more preferably 0.0001 seconds to 30 minutes, and even more preferably 0.001 seconds to 10 minutes.

  According to the production method of the present invention, in Step 3, after the reaction curable composition and the reaction initiator come into contact, the reaction initiator diffuses into the reaction curable composition, and in the reaction curable composition. Directly contact with the reactive curable compound to generate radicals that trigger polymerization of the reactive curable compound, or contact with the source of the radicals in the reactive curable composition to generate radicals, etc. However, it is considered that the polymerization of the reaction curable compound is started in the aforementioned low temperature environment.

  According to the production method of the present invention, since the reaction curable composition can be cured under a low temperature environment, conventionally, the light irradiation device that is indispensable in the case of the photocurable adhesive is no longer essential. Is essential, for example, illuminance adjustment of the light irradiation device, complicated process management such as lamp replacement, increase in the number of light irradiators accompanying the complicated configuration of the laminated film, double-sided irradiation of the laminated film, etc. It is possible to solve the complexity of irradiation management, the complexity of process management in consideration of the thermal load (due to quality degradation) due to light irradiation, and the like.

  Step 1 may be performed inline or off-line with respect to the production line of the laminated film.

  In step 1, the reaction initiator is disposed on either or either (preferably any) of the two films as a spray coater, direct gravure coater, (micro) chamber doctor coater, gravure kiss reverse coater, Coating methods such as offset guaia coater, bar coater, roll kiss coater, reverse roll coater, slot die coater, air doctor coater, forward rotation roll coater, blade coater, knife coater, vacuum die coater, spin coater, dipping coater, etc. From the viewpoint of disposing uniformly and thinly, a spray coater, a spin coater, a gravure kiss reverse coater, and a chamber doctor coater are preferable.

  When the film laminating process is a Roll To Roll process, a coater characterized by thin coating such as a gravure kiss reverse coater, a chamber doctor coater, a slot die coater, or a vacuum slot die is preferable.

  From the viewpoint that coating is suitably performed by these coating methods, the reaction initiator is preferably provided to Step 1 as a reaction initiator composition containing a reaction initiator described later.

  The viscosity of the reaction initiator composition is preferably from 1 to 3000 mPa · s, more preferably from 1 to 1000 mPa · s, still more preferably from 1 to 3000 mPa · s, from the viewpoint of the coating property of the reaction initiator composition to the film. 200 mPa · s. The viscosity is a value measured at 25 ° C. using a RE-U type viscosity system (manufactured by Toki Sangyo Co., Ltd.).

In Step 1, from the viewpoint of quickly and strongly curing the reaction curable compound of the reaction curable composition, the arrangement amount of the reaction initiator is preferably with respect to a suitable coating thickness of 0.1 to 100 μm of the reaction curable composition. Is 0.0001 to 100 g / m ² , more preferably 0.001 to 10 g / m ² , and still more preferably 0.001 to 1.00 g / m ² .

When the laminated film is a polarizing plate, from the viewpoint of quickly and strongly curing the reaction curable compound of the reaction curable composition, the reaction initiator is used for a suitable coating thickness of 0.1 to 5 μm. placement weight is preferably 0.00001~100g / ^{m 2,} more preferably 0.0001~100g / ^{m 2,} more preferably 0.0001~10g / ^{m 2,} more preferably 0.0001～1.00G / m ² , more preferably 0.001 to 1.00 g / m ² . Further, the arrangement amount of the reaction initiator is preferably 0.001 to 10 g / m ² .

  In Step 1, the reaction initiator may be present on the film as a composition layer of a liquid reaction initiator composition, or may be present on the film as a coat layer containing the reaction initiator. Since a film having a coat layer containing a reaction initiator can be produced off-line and stored, the reaction initiator is preferably arranged as a coat layer containing a reaction initiator. The thickness of the coat layer containing the reaction initiator is preferably 0.01 to 5 μm, and more preferably 0.1 to 1 μm. Such a thickness of the coating layer is preferable in terms of ensuring adhesion and reducing the risk of impairing optical properties.

Therefore, in this invention, the process 1 is the process 1A-1B:
1A: a step of disposing a composition layer of a reaction initiator composition containing the reaction initiator on one or both of the opposing surfaces of the two films, and 1B: curing the reaction initiator composition It is preferable to be a step of obtaining a coat layer containing a reaction initiator.

  Examples of the method for curing the reaction initiator composition include light irradiation, heating, and solvent volatilization. These may be used alone or in combination.

  In forming the coating layer, the reaction initiator composition can be heated and cured. The means for heating is as described later in Step 3. The heating temperature and heating time in the heat curing are not particularly limited as long as the curing reaction of the resin contained in the reaction initiator composition proceeds, and for example, a temperature of 20 to 120 ° C., preferably 20 to 80 ° C. The time can be 5 seconds to 5 minutes, preferably 10 to 60 seconds.

In forming the coating layer, the reaction initiator composition can be cured by light irradiation. The means for light irradiation is as described later in Step 3. Although the integrated light quantity in the curing by energy ray irradiation is not particularly limited as long as the curing reaction of the resin contained in the reaction initiator composition proceeds, for example, 50 to 3,000 mJ / cm ² , preferably 50 to ² is preferable. 000 mJ / cm ² .

  In the formation of the coat layer, the solvent in the reaction initiator composition can be volatilized to be cured by increasing the viscosity of the composition. The solvent can be volatilized by heating or applying a vacuum. The vacuum means can volatilize the solvent by introducing a film having a composition layer of the reaction initiator composition into the chamber and applying a vacuum. The means for heating is as described later in Step 3. The temperature and time for volatilizing the solvent are not particularly limited as long as the temperature and time for evaporating the solvent contained in the composition are used. For example, the temperature is 20 to 120 ° C., preferably 20 to 80 ° C., 10 seconds to 2 hours. Time.

  By steps 1A to 1B, a coating layer containing a reaction initiator is obtained on the film.

  In step 2, the reaction curable composition is applied to at least one surface (preferably the surface where the reaction initiator is not disposed) of the surface of the reaction initiator disposed on the surface and the surface where the reaction initiator is not disposed. As for the arrangement method, spray coater, direct gravure coater, (micro) chamber doctor coater, gravure kiss reverse coater, offset guavia coater, bar coater, roll kiss coater, reverse roll coater, slot die coater, air doctor coater, positive Examples include coating methods such as a rotary roll coater, blade coater, knife coater, vacuum die coater, spin coater, dipping coater, etc. From the viewpoint of uniform thin arrangement, preferably a spray coater, spin coater, gravure kiss Bath coater, chamber doctor coater is preferred.

  Further, since the reaction curable composition is preferably solvent-free, when the film bonding process is a Roll To Roll process, a gravure kiss reverse coater, chamber doctor coater, slot die coater, vacuum slot die Even if the viscosity is relatively high (for example, around 400 cps), a coater that can be applied thinly is more preferable.

  In step 2, the viscosity of the reaction curable composition is preferably 1 to 3000 mPa · s, more preferably 1 to 1000 mPa · s, and still more preferably, from the viewpoint of the coating property of the reaction curable composition to the film. Is 1 to 200 mPa · s.

  In Step 2, from the viewpoint of ensuring uniform coating properties and stable reactivity of the reactive curable composition with an appropriate amount of solvent, the coating thickness of the reactive curable composition is preferably 0.1 to 100 μm, More preferably, it is 0.1-10 micrometers, More preferably, it is 0.2-5 micrometers, More preferably, it is 1-5 micrometers.

When the laminated film is a polarizing plate, from the viewpoint of quickly and strongly curing the reaction curable compound of the reaction curable composition, the reaction initiator is used for a suitable coating thickness of 0.1 to 5 μm. placement weight is preferably 0.00001~100g / ^{m 2,} more preferably 0.0001~100g / ^{m 2,} more preferably 0.0001~10g / ^{m 2,} particularly preferably 0.0001～1.00G / m ² , more particularly preferably 0.001 to 1.00 g / m ² . Further, the arrangement amount of the reaction initiator is preferably 0.001 to 10 g / m ² .

  In Step 3, when two films are bonded so that the reaction initiator and the reaction curable composition are in contact with each other, from the viewpoint of ensuring sufficient contact, air bubbles are further removed, liquid convection is promoted, etc. From this point of view, it is preferable to pass two films laminated so that the reaction initiator and the reaction curable composition are in contact with each other through a nip roll.

  In Step 3, when the reaction curable composition is polymerized with a reaction initiator and cured, the reaction curable composition may be cured at the indoor environment temperature as long as the above-described preferable low temperature environment is used. In addition, a reactive compound that is not photo-reactive curable may be polymerized by heating using reaction heat upon irradiation with light, or may be separately heated to accelerate and homogenize the curing. Alternatively, photoreaction curing and heat curing may be used in combination.

  According to the production method of the present invention, the combination of the reaction initiator and the reaction curable composition can be performed in a low temperature environment where the reaction curable compound is preferably 50 ° C. or less, 40 ° C. or less, 30 ° C. or less, and further 20 ° C. or less. If the polymerization reaction is selected, the light irradiation device and the heating device are not essential in step 3.

  Therefore, in the step 3, when active heating is not performed or only auxiliary heating is performed, the reaction curable compound in the present invention is at least one selected from the group consisting of 10 ° C, 20 ° C, and 30 ° C. The polymerization reaction is carried out in a temperature range in which the temperature is the minimum temperature and at least one temperature selected from the group consisting of 120 ° C, 100 ° C, 80 ° C, 60 ° C, 50 ° C, 40 ° C, 30 ° C, and 20 ° C is the maximum temperature. It is preferable.

  In Step 3, the combination of the reaction initiator and the reaction curable composition is such that the reaction temperature of the reaction curable compound is 10 ° C. or lower, and even when the polymerization reaction is performed at 0 ° C. or lower, The temperature can be controlled below the temperature at which the polymerization reaction can be performed, and when the polymerization reaction is desired to be started, the control is canceled and the temperature is raised, or the polymerization reaction can be started by positively heating.

  In the case of light irradiation, examples of energy rays include electron beams, X-rays, ultraviolet rays, visible light in a low wavelength region, infrared rays, and the like. Ultraviolet light is preferred.

  When heating, it is preferable to let a laminated film pass through ovens, such as a hot-air drying furnace and an infrared heater furnace, from a viewpoint of heating uniformly.

[Laminated film]
As a material constituting the two films, for example, a thermoplastic resin excellent in transparency, mechanical strength, thermal stability, moisture barrier property, isotropy and the like is used.

  Specific examples of such thermoplastic resins include cellulose resins such as triacetyl cellulose, polyester resins, polyethersulfone resins, polysulfone resins, polycarbonate resins, polyamide resins, polyimide resins, polyolefin resins, (meth) acrylic resins, cyclic Examples thereof include polyolefin resins (norbornene resins), polyarylate resins, polystyrene resins, polyvinyl alcohol resins, and mixtures thereof.

  One or more kinds of arbitrary appropriate additives may be contained in the film. Examples of the additive include an ultraviolet absorber, an antioxidant, a lubricant, a plasticizer, a mold release agent, an anti-coloring agent, a flame retardant, a nucleating agent, an antistatic agent, a pigment, and a coloring agent.

  The content of the thermoplastic resin in the transparent protective film is preferably 50 to 100% by weight, more preferably 50 to 99% by weight, still more preferably 60 to 98% by weight, and still more preferably, from the viewpoint of high transparency. 70 to 97% by weight. The content of the thermoplastic resin in the film other than the transparent protective film is preferably 50 to 100% by weight, more preferably 50 to 99% by weight, still more preferably 60 to 98% by weight, still more preferably 70 to 70%. 97% by weight.

  Examples of the film include a polymer film described in JP-A-2001-343529 (WO2001 / 37007), for example, (A) a thermoplastic resin having a substituted and / or unsubstituted imide group in the side chain, and (B) Examples thereof include a resin composition containing a thermoplastic resin having a substituted and / or unsubstituted phenyl and nitrile group in the side chain. Specific examples include a film of a resin composition containing an alternating copolymer composed of isobutylene and N-methylmaleimide and an acrylonitrile / styrene copolymer. As the film, a film made of a mixed extruded product of the resin composition or the like can be used. Since these films have a small phase difference and a small photoelastic coefficient, problems such as unevenness due to the distortion of the polarizing plate can be eliminated, and since the moisture permeability is small, the humidification durability is excellent.

  The thickness of the film can be appropriately determined, but is generally about 1 to 500 μm, preferably 1 to 300 μm, and more preferably 5 from the viewpoints of workability such as strength and handleability and thin layer properties. ~ 200 μm. A protective film is suitable in the case of 5-150 micrometers.

  As the film for polarizing plate, it is preferable to use at least one selected from cellulose resin, polycarbonate resin, polyester resin, cyclic polyolefin resin, and (meth) acrylic resin.

  Cellulose resin is an ester of cellulose and fatty acid. Specific examples of the cellulose ester-based resin include cellulose triacetate, cellulose diacetate, cellulose tripropionate, cellulose dipropionate, and the like, and cellulose triacetate is more preferable from the viewpoint of film formability of the amorphous film.

  Many products of cellulose triacetate are commercially available, which is advantageous in terms of availability and cost. Examples of commercially available cellulose triacetate include trade names “UV-50”, “UV-80”, “SH-80”, “TD-80U”, “TD-TAC”, “UZ” manufactured by Fuji Photo Film Co., Ltd. -TAC "and" KC series "manufactured by Konica.

  The cyclic polyolefin resin (COP, COC) is preferably a norbornene resin. The cyclic polyolefin resin is a general term for resins that are polymerized using a cyclic olefin as a polymerization unit, and is described in, for example, JP-A-1-240517, JP-A-3-14882, JP-A-3-122137, and the like. Resin. Specific examples include ring-opening (co) polymers of cyclic olefins, addition polymers of cyclic olefins, cyclic olefins and α-olefins such as ethylene and propylene (typically random copolymers), And graft polymers obtained by modifying them with an unsaturated carboxylic acid or a derivative thereof, and hydrides thereof. Specific examples of the cyclic olefin include norbornene monomers.

  Various products are commercially available as the cyclic polyolefin resin. As specific examples, trade names “ZEONEX” and “ZEONOR” manufactured by ZEON CORPORATION, trade names “ARTON” manufactured by JSR Corporation, “TOPAS” manufactured by Polyplastics Corporation, and products manufactured by Mitsui Chemicals, Inc. Product name “Apel”.

  In the case of polarizing plate applications, the (meth) acrylic resin has a Tg (glass transition temperature) of preferably 115 to 170 ° C, more preferably 120 to 170 ° C, from the viewpoint of durability and formability of the polarizing plate. Preferably it is 125-170 degreeC, More preferably, it is 130-170 degreeC.

As the (meth) acrylic resin, any appropriate (meth) acrylic resin can be adopted as long as the effects of the present invention are not impaired. For example, poly (meth) acrylic acid ester such as polymethyl methacrylate, methyl methacrylate- (meth) acrylic acid copolymer, methyl methacrylate- (meth) acrylic acid ester copolymer, methyl methacrylate-acrylic acid ester- (Meth) acrylic acid copolymer, (meth) methyl acrylate-styrene copolymer (MS resin, etc.), polymer having an alicyclic hydrocarbon group (for example, methyl methacrylate-cyclohexyl methacrylate copolymer, Methyl methacrylate- (meth) acrylate norbornyl copolymer, etc.). Preferably, poly (meth) acrylic acid C _1-6 alkyl such as poly (meth) acrylate methyl is used. More preferred is a methyl methacrylate-based resin containing methyl methacrylate as a main component (50 to 100% by weight, preferably 70 to 100% by weight).

  Specific examples of (meth) acrylic resins include (meth) acrylic resins having a ring structure in the molecule described in, for example, Acrypet VH and Acrypet VRL20A manufactured by Mitsubishi Rayon Co., Ltd., and JP-A-2004-70296. And a high Tg (meth) acrylic resin system obtained by intramolecular crosslinking or intramolecular cyclization reaction.

  As the (meth) acrylic resin, a (meth) acrylic resin having a lactone ring structure can be used from the viewpoint of high heat resistance, high transparency, and high mechanical strength by biaxial stretching. Examples of the (meth) acrylic resin having a lactone ring structure include JP 2000-230016, JP 2001-151814, JP 2002-120326, JP 2002-254544, and JP 2005. Examples thereof include (meth) acrylic resins having a lactone ring structure described in Japanese Patent No. 146084.

  The polarizer film is often formed from a polyvinyl alcohol-based resin. In this case, the polarizer film is a uniaxially stretched film obtained by dyeing a polyvinyl alcohol resin film with a dichroic substance (typically iodine or a dichroic dye). The degree of polymerization of the polyvinyl alcohol resin constituting the polyvinyl alcohol resin film is preferably 100 to 5000, and more preferably 1400 to 4000, from the viewpoint of stretchability. The polyvinyl alcohol-based resin film constituting the polarizer film can be formed by any appropriate method (for example, a casting method in which a solution obtained by dissolving a resin in water or an organic solvent is cast, a casting method, an extrusion method). .

  Although the thickness of a polarizer film is suitably set according to the objectives and uses, such as a liquid crystal display in which a polarizing plate is used, and an organic EL display, it is about 5-80 micrometers normally.

  As a method for producing a polarizer film, any appropriate method is adopted depending on the purpose, materials used, conditions, and the like. For example, the system which uses the said polyvinyl alcohol-type resin film for a series of manufacturing processes including a swelling, dyeing | staining, bridge | crosslinking, extending | stretching, water washing, and a drying process is employ | adopted normally. In each processing step except the drying step, the treatment is performed by immersing the polyvinyl alcohol-based resin film in a liquid containing a solution used in each step. The order, frequency, and presence / absence of each treatment of swelling, dyeing, crosslinking, stretching, washing and drying can be appropriately set according to the purpose, materials used, conditions and the like. For example, several processes may be performed simultaneously in one step, and the swelling process, the dyeing process, and the crosslinking process may be performed simultaneously. Further, for example, it can be suitably employed to perform the crosslinking treatment before and after the stretching treatment. For example, the water washing process may be performed after all the processes, or may be performed only after a specific process.

  As a film having an optical compensation function (retardation film), a birefringent film obtained by uniaxially or biaxially stretching a polymer material, a liquid crystal polymer alignment film, a liquid crystal polymer alignment layer supported by a film A thickness of about 20 to 150 μm is common.

  Examples of the polymer material include polyvinyl alcohol, polyvinyl butyral, polymethyl vinyl ether, polyhydroxyethyl acrylate, hydroxyethyl cellulose, hydroxypropyl cellulose, methyl cellulose, polycarbonate, polyarylate, polysulfone, polyethylene terephthalate, polyethylene naphthalate, polyether sulfone, Polyphenylene sulfide, polyphenylene oxide, polyallylsulfone, polyamide, polyimide, polyolefin, polyvinyl chloride, cellulose resin, cyclic polyolefin resin (norbornene resin), or any of these binary, ternary copolymers, graft copolymers Examples thereof include polymers and blends. These polymer materials become an oriented product (stretched film) by stretching or the like.

  Examples of the liquid crystal polymer include various main chain types and side chain types in which a conjugated linear atomic group (mesogen) imparting liquid crystal alignment is introduced into the main chain or side chain of the polymer. . Specific examples of the main chain type liquid crystal polymer include, for example, a nematic orientation polyester liquid crystal polymer, a discotic polymer, and a cholesteric polymer having a structure in which a mesogen group is bonded at a spacer portion that imparts flexibility. Specific examples of the side chain type liquid crystal polymer include polysiloxane, polyacrylate, polymethacrylate, or polymalonate as a main chain skeleton, and a nematic alignment-providing para-substitution through a spacer portion composed of a conjugated atomic group as a side chain. Examples thereof include those having a mesogenic part composed of a cyclic compound unit.

  The retardation film may have an appropriate retardation according to the purpose of use, such as for the purpose of compensating for coloration, viewing angle, etc. due to birefringence of various wave plates and liquid crystal layers, for example. What laminated | stacked retardation film and controlled optical characteristics, such as phase difference, etc. may be used.

  The film may be the same material or different materials, and it is preferable to select an appropriate material, thickness, strength, transparency and the like according to the use of the laminated film.

  During coating, the reaction initiator and the reaction curable composition are uniformly applied, and in order to develop sufficient adhesive strength, corona treatment is performed on the film surface on which the reaction initiator and the reaction curable composition are disposed. It is preferable to perform plasma treatment, primer treatment, chemical treatment such as alkali and acid, and coupling agent treatment.

  The laminated film preferably includes at least two films laminated via a cured reaction curable composition, and an appropriate layer structure is preferably selected depending on the application.

  When the laminated film is a polarizing plate, if it is a polarizing plate for liquid crystal such as TN (Twisted Nematic Type), IPS (In-Place-Switching Type), VA (Vertical Alignment Type), etc., it is necessary for the liquid crystal function and the liquid crystal mode. A film having an optical compensation function is appropriately selected and has a configuration of a polarizer film / adhesive / protective film composed of protective film / adhesive / PVA. The protective film can be appropriately changed to an optical compensation film (retardation film). The surface of the protective film where the polarizer is not adhered may be subjected to a hard coat layer, antireflection treatment, anti-sticking treatment, or treatment for diffusion or antiglare. In addition, a thin liquid crystal pattern layer having an optical compensation function may be applied to the adhesive layer of the protective film.

Therefore, in the present invention, when the laminated film is a polarizing plate, the production method of the present invention is preferably the following method.
A polarizing plate in which a protective film or an optical compensation film is laminated on one or both surfaces of a polarizer film composed of a polyvinyl alcohol-based resin film dyed with a dichroic material via a cured product of a reaction curable composition A manufacturing method of
Step 1A ′: a step of disposing a composition layer of a reaction initiator composition containing the reaction initiator on one surface of the protective film or the optical compensation film;
Step 1B ′: a step of curing the reaction initiator composition to obtain a coat layer containing the reaction initiator,
Step 2 ′: disposing the reaction curable composition on one or both surfaces of the polarizer film,
Step 3 ′: The protective film or the optical film so that the coating layer of the reaction initiator disposed on the surface of the protective film or the optical compensation film is in contact with the reaction curable composition disposed on the polarizer film. The manufacturing method of a polarizing plate including the process of bonding a compensation film and the said polarizer film, carrying out the polymerization reaction of the said reaction curable compound, and hardening the said reaction curable composition.

[Reactive curable compound]
Examples of the reaction curable compound contained in the reaction curable composition of the present invention include a radical reaction curable compound, a cation reaction curable compound, an anion reaction curable compound, a polycondensation / polyaddition reaction curable compound, and the like. The reaction curable compound is preferably a radical reaction curable compound and / or a cation reaction curable compound from the viewpoint of reactivity with the reaction initiator.

  The radical reaction curable compound is preferably at least one selected from the group consisting of ethylenically unsaturated group-containing compounds such as (meth) acrylic compounds, vinyl ether compounds and vinyl ester compounds, silicone compounds and unsaturated polyester compounds. A compound, more preferably at least one compound selected from the group consisting of an ethylenically unsaturated group-containing compound and a silicone compound, and still more preferably an ethylenically unsaturated group-containing compound.

  As the cationic reaction curable compound, an epoxy group-containing compound such as an aliphatic epoxy compound, an alicyclic epoxy compound, and an epoxy compound containing an aromatic group, an oxetane compound, a styrenic compound, a vinyl ether compound or the like is preferable. At least one compound selected from the group consisting of saturated group-containing compounds, more preferably epoxy group-containing compounds and / or oxetane compounds.

  The anion reaction curable compound is preferably at least selected from the group consisting of an epoxy group-containing compound, an oxetane compound, an ethylenically unsaturated group-containing compound such as a (meth) acrylic compound, a cyanoacrylate compound, and a styrene compound. One compound, more preferably, at least one compound selected from the group consisting of an epoxy group-containing compound, an ethylenically unsaturated group-containing compound, a cyanoacrylate compound, and a styrene compound, more preferably a cyanoacrylate compound And / or a styrenic compound.

  The polycondensation / polyaddition reaction curable compound is preferably a combination of compounds capable of forming a polyamide, a combination of compounds capable of forming a polyester, a combination of compounds capable of forming a polycarbonate, and a combination of compounds capable of forming a silicone. , A combination of compounds capable of forming a polyimide, and a combination of an epoxy compound having two or more epoxy groups in the molecule and a polythiol compound or acid anhydride having two or more thiol groups in the molecule, more preferably A combination of compounds capable of forming a polyamide, a combination of compounds capable of forming a polyester, a combination of compounds capable of forming a polycarbonate, and a combination of compounds capable of forming a silicone, and an epoxy having two or more epoxy groups in the molecule Compound and polythio having two or more thiol groups in the molecule A combination of a compound capable of forming a polyester, a combination of a compound capable of forming a polycarbonate, a combination of a compound capable of forming a silicone, and an epoxy group in the molecule. It is a combination of an epoxy compound having two or more and a polythiol compound or acid anhydride having two or more thiol groups in the molecule.

Examples of the compound that can form a polyamide include a combination of an amine compound and a carboxylic acid compound, and a combination of an amine compound and an ester compound.
Examples of the compound capable of forming polyester include a combination of an alcohol and a carboxylic acid compound, and a combination of an alcohol and an ester compound.
Examples of the compound capable of forming a polycarbonate include a combination of bisphenol A and phosgene, and a combination of bisphenol A and diphenyl carbonate.
Examples of the compound capable of forming silicone include a combination of an organohalosilane (such as dimethyldichlorosilane) and an organoalkoxysilane (such as dimethyldimethoxysilane).
The amount of these compounds used is not particularly limited as long as the desired polyamide, polyester, polycarbonate and silicone can be obtained.

  Examples of the ethylenically unsaturated group-containing compound include (meth) acrylate compounds, aliphatic acrylamide compounds, alicyclic acrylamide compounds, aromatic acrylamide compounds and N-substituted acrylamide compounds.

  Examples of (meth) acrylate compounds include paracumylphenoxyethylene, glycol (meth) acrylate, t-butyl (meth) acrylate, ethoxylated phenyl (meth) acrylate, benzyl (meth) acrylate, and glycidyl (meth) acrylate. Aliphatic (meth) acrylates and aromatic ring-containing (meth) acrylates can be mentioned.

  The ethylenically unsaturated group-containing compound is preferably a radically polymerizable unsaturated compound having at least one ethylenically unsaturated group, and a radically polymerizable unsaturated compound having one ethylenically unsaturated group (hereinafter, Compound E1), polyfunctional radical polymerizable unsaturated compound having two ethylenically unsaturated groups (hereinafter also referred to as compound E2), polyfunctional radical polymerizable unsaturated compound having three or more ethylenically unsaturated groups (Hereinafter also referred to as compound E3), and at least one radical polymerization reactive compound selected from the group consisting of other polyfunctional radical polymerizable compounds.

  From the viewpoint of the viscosity of the reaction curable composition, a monomer compound is preferred.

  Compound E1 includes tetrahydrofurfuryl (meth) acrylate, isooctyl (meth) acrylate, and cyclohexyl (meth) acrylate from the viewpoint of ensuring the composition viscosity, film hardness, and flexibility of the photocurable compound composition of the present invention. , Isobornyl (meth) acrylate, dicyclopentanyl (meth) acrylate, cyclohexyl (meth) acrylate, dicyclopentanyloxyethyl (meth) acrylate, isomyristyl (meth) acrylate, lauryl (meth) acrylate and tert-butyl ( One or more compounds selected from the group consisting of (meth) acrylates are preferred and include isobornyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, dicyclopentanyl (meth) acrylate and cyclohexyl (meth) One or more compounds selected from the group consisting of acrylate are more preferred.

  Among the reactive curable compounds, epoxy (meth) acrylate is preferable from the viewpoint of polarizing plate use, and monofunctional (meth) acrylate having an aromatic ring and a hydroxy group is more preferable.

  As the monofunctional (meth) acrylate having an aromatic ring and a hydroxy group, various monofunctional (meth) acrylates having an aromatic ring and a hydroxy group can be used. The hydroxy group may be present as a substituent of the aromatic ring, but in the present invention, a hydroxyl group is preferably present as an organic group that binds the aromatic ring and (meth) acrylate.

  Examples of the monofunctional (meth) acrylate having an aromatic ring and a hydroxy group include a reaction product of a monofunctional epoxy compound having an aromatic ring and (meth) acrylic acid. Examples of the monofunctional epoxy compound having an aromatic ring include phenyl glycidyl ether, t-butylphenyl glycidyl ether, and phenyl polyethylene glycol glycidyl ether. Examples of the monofunctional (meth) acrylate having an aromatic ring and a hydroxy group include 2-hydroxy-3-phenoxypropyl (meth) acrylate, 2-hydroxy-3-t-butylphenoxypropyl (meth) acrylate, and 2-hydroxy. Examples include -3-phenyl polyethylene glycol propyl (meth) acrylate. As a commercially available product, 2-hydroxy-3-phenoxypropyl acrylate (R128H manufactured by Nippon Kayaku Co., Ltd.) can be mentioned.

  Moreover, as a compound which has a (meth) acryloyl group, a nitrogen-containing compound and / or a carboxyl group compound are used suitably. These compounds are preferable in terms of adhesiveness.

Examples of nitrogen-containing compounds include heterocycle-containing acrylics having heterocycles such as morpholine rings such as N-acryloylmorpholine, N-acryloylpiperidine, N-methacryloylpiperidine, and N-acryloylpyrrolidine, piperidine rings, pyrrolidine rings, and piperazine rings. Monomer. Examples of the nitrogen-containing monomer include maleimide, N-cyclohexylmaleimide, N-phenylmaleimide; (meth) acrylamide, N, N-dimethyl (meth) acrylamide, N, N-diethyl (meth) acrylamide, and N-hexyl. (Meth) acrylamide, N-methyl (meth) acrylamide, N-butyl (meth) acrylamide, N-butyl (meth) acrylamide, N-methylol (meth) acrylamide, N-methylolpropane (meth) acrylamide, N-hydroxyethyl (N-substituted) amide monomers such as (meth) acrylamide and N-isopropyl (meth) acrylamide; aminoethyl (meth) acrylate, aminopropyl (meth) acrylate, N, N-dimethylamino (meth) acrylate Ethyl, (meth) (Meth) acrylic acid alkylaminoalkyl monomers such as t-butylaminoethyl crylate and 3- (3-pyridinyl) propyl (meth) acrylate; N- (meth) acryloyloxymethylene succinimide and N- (meth) acryloyl- Examples include succinimide monomers such as 6-oxyhexamethylene succinimide and N- (meth) acryloyl-8-oxyoctamethylene succinimide. Examples of commercially available products include N-acryloylmorpholine (ACMO manufactured by Kojin Co., Ltd.) and N- (2-hydroxyethyl) acrylamide (HEAA manufactured by Kojin Co., Ltd.).
For example, the nitrogen-containing compound is preferably a heterocyclic ring-containing acrylic compound, and particularly preferably N-acryloylmorpholine. The nitrogen-containing compound is preferably, for example, an (N-substituted) amide compound. These nitrogen-containing compounds can be used alone or in combination of two or more.

  Examples of the carboxyl group-containing compound include (meth) acrylic acid, carboxyethyl (meth) acrylate, carboxypentyl (meth) acrylate, and the like. Of these, acrylic acid is preferred.

  In addition to the above, compounds having a (meth) acryloyl group include methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate, and isononyl. C1-C12 alkyl (meth) acrylates such as (meth) acrylate and lauryl (meth) acrylate; (meth) acrylic acid alkoxyalkyl monomers such as (meth) acrylic acid methoxyethyl and (meth) acrylic acid ethoxyethyl ; 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, 8-hydroxyoctyl (meth) acrylate , (Meth) acrylic acid 10-hydride Hydroxyl group-containing monomers such as xyldecyl, 12-hydroxylauryl (meth) acrylate and (4-hydroxymethylcyclohexyl) -methyl acrylate; acid anhydride group-containing monomers such as maleic anhydride and itaconic anhydride; caprolactone addition of acrylic acid Products; sulfones such as styrene sulfonic acid, allyl sulfonic acid, 2- (meth) acrylamide-2-methylpropane sulfonic acid, (meth) acrylamide propane sulfonic acid, sulfopropyl (meth) acrylate, (meth) acryloyloxynaphthalene sulfonic acid Acid group-containing compounds; phosphoric acid group-containing compounds such as 2-hydroxyethylacryloyl phosphate.

  Compound E2 includes diethylene glycol monoethyl ether (meth) acrylate, dimethylol dicyclopentane di (meth) acrylate, from the viewpoint of ensuring the composition viscosity, film hardness, and flexibility of the photocurable compound composition of the present invention. , Ethylene oxide (EO) modified 1,6-hexanediol di (meth) acrylate, EO modified bisphenol A di (meth) acrylate, modified bisphenol A di (meth) acrylate, polyester di (meth) acrylate, polyethylene glycol di (meth) One or more compounds selected from the group consisting of acrylate, silicone di (meth) acrylate, triethylene glycol di (meth) acrylate, urethane di (meth) acrylate and polybutadiene di (meth) acrylate are preferred, and dimethylo Distearate cyclopentane (meth) acrylate and / or modified bisphenol A di (meth) acrylate are more preferred. Among them, modified bisphenol A (meth) acrylate, urethane di (meth) acrylate (UV-H K8540, manufactured by KSM) and polybutadiene di (meth) acrylate (TE-2000EM, manufactured by Nippon Soda Co., Ltd.) are preferable. Modified bisphenol A (meth) acrylate is available from Kyoeisha Chemical Co., Ltd. as light acrylate BP-4EAL (EO adduct diacrylate of bisphenol A), BP-4PA (propylene oxide (PO) adduct diacrylate of bisphenol A), etc. Has been.

  As the compound E3, epichlorohydrin (ECH) modified glycerol tri (meth) acrylate, EO modified glycerol triacetate is used from the viewpoint of ensuring the composition viscosity, film hardness and flexibility of the photocurable compound composition of the present invention. One or more compounds selected from the group consisting of (meth) acrylate, PO-modified glycerol tri (meth) acrylate, pentaerythritol triacrylate, dipentaerythritol hexa (meth) acrylate and pentaerythritol tetra (meth) acrylate are preferred, and EO Modified glycerol tri (meth) acrylate and / or dipentaerythritol hexa (meth) acrylate are more preferred.

  A (meth) acrylate-modified epoxy compound obtained by reacting an epoxy group-containing compound with (meth) acrylic acid can also be used, preferably an epoxy having a bisphenol type epoxy compound having a hydroxyl group modified with (meth) acrylic acid. Examples thereof include acrylates, and epoxy ester 3000A, epoxy ester 3000MK and the like are commercially available from Kyoeisha Chemical Co., Ltd.

  The epoxy group-containing compound is preferably at least one compound selected from the group consisting of an aliphatic epoxy compound, an alicyclic epoxy compound, an epoxy compound containing an aromatic group, and an epoxy group-containing compound hydrogenated with an aromatic group. More preferably, it contains at least one compound selected from the group consisting of an aliphatic epoxy compound, an alicyclic epoxy compound and an epoxy compound containing an aromatic group, and more preferably contains an aliphatic epoxy compound and / or an aromatic group. It is an epoxy compound.

  Specifically, the epoxy group-containing compound is preferably a bisphenol A type epoxy compound, a bisphenol F type epoxy compound, a bisphenol AD type epoxy compound, a phenol novolac type epoxy compound, a naphthalene type epoxy compound, or a hydrogenated compound thereof. And at least one compound selected from the group consisting of alicyclic epoxy compounds and aliphatic epoxy compounds, more preferably selected from the group consisting of aliphatic epoxy compounds, alicyclic epoxy compounds and bisphenol A type epoxy compounds. At least one compound, more preferably an aliphatic epoxy compound.

  Examples of the aromatic epoxy resin include bisphenol type epoxy resins such as diglycidyl ether of bisphenol A, diglycidyl ether of bisphenol F, diglycidyl ether of bisphenol S; phenol novolac epoxy resin, cresol novolac epoxy resin, hydroxybenzaldehyde Examples include novolak-type epoxy resins such as phenol novolac epoxy resins; glycidyl ethers of tetrahydroxyphenylmethane, glycidyl ethers of tetrahydroxybenzophenone, and polyfunctional epoxy resins such as epoxidized polyvinylphenol.

  Examples of the alicyclic epoxy resin include hydrogenated aromatic epoxy resins, cyclohexane-based, cyclohexylmethyl ester-based, cyclohexylmethyl ether-based, spiro-based, and tricyclodecane-based epoxy resins.

  Examples of the aliphatic epoxy resin include polyglycidyl ethers of aliphatic polyhydric alcohols or alkylene oxide adducts thereof. Specific examples thereof include 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, glycerin triglycidyl ether, trimethylolpropane triglycidyl ether (Epolite 100MF manufactured by Kyoeisha Chemical Co., Ltd.), polyethylene glycol di Polyether obtained by adding one or more alkylene oxides (ethylene oxide or propylene oxide) to aliphatic polyhydric alcohols such as glycidyl ether, propylene glycol diglycidyl ether, ethylene glycol, propylene glycol, and glycerin Examples include polyol polyglycidyl ether.

  Specific examples of the bisphenol A type epoxy compound include EPICLON 850S, 860, and 1055 manufactured by DIC. Specific examples of the hydrogenated bisphenol A type epoxy compound include KRM-2408 manufactured by ADEKA and YX-8034 manufactured by JER. Specific examples of the bisphenol F-type epoxy compound include EPICLON 830S manufactured by DIC. Specific examples of the naphthalene type epoxy compound include EPICLON HP4032D and HP-7200H manufactured by DIC. Specific examples of the phenol novolac type epoxy compound include EPICLON N-740 and N-770 manufactured by DIC. Specific examples of the cresol novolac type epoxy compound include EPICLON N-660 and N-670 manufactured by DIC. Specific examples of the alicyclic epoxy compound include 3 ′, 4′-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate (Delcel's Celoxide 2021P (Cel2021P)), 1,2: 8,9 diepoxy. Limonene (Celoxide 3000 manufactured by Daicel), 1,2-epoxy-4-vinylcyclohexane (Celoxide 2000 manufactured by Daicel), 1,2-epoxy-4- (2,2-bis (hydroxymethyl) -1-butanol 2-oxiranyl) cyclohexane adduct (EHPE3150 manufactured by Daicel).

  Examples of the oxetane compound include 3-ethyl-3-hydroxymethyloxetane (for example, OXT-101 manufactured by Toagosei Co., Ltd.), 2-ethylhexyl oxetane (for example, OXT-212 manufactured by Toagosei Co., Ltd.), and xylylenebisoxetane (for example, Toagosei OXT-121), 3-ethyl-3 {[(3-ethyloxetane-3-yl) methoxy] methyl} oxetane (for example, OXT-221 manufactured by Toagosei), oxetanylsilsesquioxetane (for example, Toa Synthetic OXT-191), phenol novolac oxetane (for example, Toagosei PHOX), and 3-ethyl-3- (phenoxymethyl) oxetane (for example, Toagosei OXT-211) At least one compound, more preferably 3-ethyl-3-hydride Carboxymethyl oxetane (e.g., manufactured by Toagosei Co., Ltd. OXT-101) is a and 3-ethyl-3- (phenoxymethyl) oxetane (e.g., manufactured by Toagosei Co., Ltd. OXT-211).

  The epoxy compound having two or more epoxy groups in the molecule may have an average of two or more epoxy groups per molecule, for example, an aliphatic compound having two or more epoxy groups per molecule. An epoxy compound, an alicyclic epoxy compound, an epoxy compound containing an aromatic group, and an epoxy group-containing compound obtained by hydrogenating an aromatic group are included.

  Polythiol compounds having two or more thiol groups in the molecule include, for example, 3,3′-dithiodipropionic acid, trimethylolpropane tris (thioglycolate), pentaerythritol tetrakis (thioglycolate), ethylene glycol dithioglycolate 1,4-bis (3-mercaptobutyryloxy) butane (commercial name: commercially available as Karenz MT (registered trademark) BD1 from Showa Denko KK), tris [(3-mercaptopropionyloxy) -ethyl] -isocyanurate (TEMPIC), 1,3,5-tris (3-mercaptobutyloxyethyl) -1,3,5-triazine-2,4,6 (1H, 3H, 5H) -trione (trade name from Showa Denko KK) : Commercially available as Karenz MT (registered trademark) NR1, Trimethylolpropa Tris (3-mercaptopropionate) (TMMP), pentaerythritol tetrakis (3-mercaptopropionate) (PEMP), pentaerythritol tetrakis (3-mercaptobutyrate) (trade name: Karenz MT (Showa Denko) Thiol compound obtained by esterification reaction of polyol and mercapto organic acid such as dipentaerythritol hexakis (3-mercaptopropionate) (DPMP), 1,4-butanedithiol, Alkyl polythiol compounds such as 6-hexanedithiol and 1,10-decanedithiol; terminal thiol group-containing polyethers; terminal thiol group-containing polythioethers; thiol compounds obtained by reaction of epoxy compounds with hydrogen sulfide; Richioru compound and an epoxy compound and a thiol compound having two or more thiol groups in the molecule, such as thiol compounds having terminal thiol group obtained by the reaction can be used. Preferred polythiol compounds are 1,4-bis (3-mercaptobutyryloxy) butane, tris [(3-mercaptopropionyloxy) -ethyl] -isocyanurate (TEMPIC), 1,3,5-tris (3-mercapto Butyloxyethyl) -1,3,5-triazine-2,4,6 (1H, 3H, 5H) -trione, trimethylolpropane tris (3-mercaptopropionate) (TMMP), pentaerythritol tetrakis (3- Mercaptopropionate (PEMP), pentaerythritol tetrakis (3-mercaptobutyrate), dipentaerythritol hexakis (3-mercaptopropionate) (DPMP). Polythiol compounds may be used alone or in combination.

  Examples of acid anhydrides include hexahydrophthalic anhydride, 3-methylhexahydrophthalic anhydride, 4-methylhexahydrophthalic anhydride, 1-methylnorbornane-2,3-dicarboxylic anhydride, 5- Methylnorbornane-2,3-dicarboxylic acid anhydride, norbornane-2,3-dicarboxylic acid anhydride, 1-methylnadic acid anhydride, 5-methylnadic acid anhydride, nadic acid anhydride, phthalic acid anhydride, tetrahydro Examples include phthalic anhydride, 3-methyltetrahydrophthalic anhydride, 4-methyltetrahydrophthalic anhydride, dodecenyl succinic anhydride, and terpene diene or triene compounds such as α-terpinene and alloocimene and maleic anhydride Diels-Alder reactants with these, and those with unsaturated bonds of these acid anhydrides Hydrogenated products, including structural isomers or geometric isomers of these acid anhydrides, mixtures or modified products thereof are exemplified. Among them, acid anhydride curing agents that are liquid at room temperature by methods such as structural isomerization, geometric isomerization, and mixing of two or more of these acid anhydrides are exemplified. The acid anhydride may be a compound having two or more acid anhydride groups in the molecule, and examples of the compound include tetracarboxylic dianhydride, hexacarboxylic dianhydride, hexacarboxylic dianhydride, Polycarboxylic acid anhydrides such as maleic anhydride copolymer resin can be used. Specifically, as tetracarboxylic dianhydride, pyromellitic anhydride, benzophenonetetracarboxylic dianhydride, Biphenyl tetracarboxylic dianhydride, oxydiphthalic dianhydride, diphenyl sulfone tetracarboxylic dianhydride, diphenyl sulfide tetracarboxylic dianhydride, butane tetracarboxylic dianhydride, perylene tetracarboxylic dianhydride, naphthalene tetra There are carboxylic dianhydrides. The acid anhydrides may be used alone or in combination.

  The amount of the acid anhydride and / or polythiol compound used is preferably 0.01 to 10 weights with respect to 100 weight parts of the epoxy compound having two or more epoxy groups in the molecule in the reaction curable composition. Parts, more preferably 0.1 to 5 parts by weight, still more preferably 0.5 to 5 parts by weight.

[Reaction curable composition and reaction initiator]
The reaction curable composition used in the production method of the present invention contains a reaction curable compound. The reaction initiator used in the production method of the present invention is a compound capable of initiating a polymerization reaction of a reaction curable compound.

  The reaction initiator acts directly on the reaction curable compound in the reaction curable composition to generate radicals, cations, anions, etc., causing the reaction curable compounds to undergo radical, cation or anion reaction, or polycondensation. You may make it react, and you may start or accelerate the polymerization reaction of a reaction curable compound through reaction with the compound contained with a reaction curable compound in a reaction curable composition.

  In the production method of the present invention, the combination of the reaction curable composition and the reaction initiator (also referred to as composition / agent kit) is at least one kit selected from the group consisting of the following compositions / agent kits 1 to 6. It is preferable to use it. The reaction initiator may be a reaction initiator and a reaction initiator composition including a further component selected from the group consisting of a solvent, a thermal initiator, and a photoinitiator.

(1) Composition / agent kit 1
A combination of a reaction curable composition containing a radical reaction curable compound as a reaction curable compound and a reaction initiator containing a radical generator.

  Examples of radical generators include 2,6-dimethylbenzoyldiphenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, 2,6-dichlorobenzoyldiphenylphosphine oxide, and 2,6-dimethoxybenzoyldiphenylphosphine oxide. Acylphosphine oxides, iron (Fe), aluminum (Al), cobalt (Co), manganese (Mn), tin (Sn), zinc (Zn), vanadium (V), chromium (Cr), zirconium (Zr), Examples thereof include metals such as indium (In) and titanium (Ti), and complexes of these metals. These may be used alone or in combination of two or more.

  The amount of the radical generator used is preferably 0.01 to 10 parts by weight, more preferably 0.1 to 5 parts by weight, with respect to 100 parts by weight of the radical reaction curable compound used in the reaction curable composition. More preferably, it is 1 to 5 parts by weight.

(2) Composition / agent kit 2
A combination of a reaction curable composition containing a cation reaction curable compound as a reaction curable compound and a reaction initiator containing a cation generator.

  Examples of the cation generator include aryl diazonium salts, diaryl halonium salts, triphosphonium salts, aromatic iodonium salts, aromatic onium salts such as aromatic sulfonium salts, iron allene complexes, titanocene complexes, aryl silanol aluminum complexes, and the like. It is done. In addition, Lewis acid compounds such as trialkylborane, trihalogen borane, trialkylaluminum, and trialkylaluminum ion are also included. Bronsted acid compounds such as hexafluorophosphoric acid and hexafluoroantimonic acid may also be used. From the viewpoint of safety, an aromatic-containing sulfonium salt that is a thermal polymerization initiator is preferred.

  Further examples of thermal polymerization initiators used as cation generators include benzylsulfonium salts, thiophenium salts, thiolanium salts, benzylammonium, pyridinium salts, hydrazinium salts, carboxylic acid esters, sulfonic acid esters, and amine imides.

  As the cation generator, a compound that absorbs light energy to generate a cation can be used. Such compounds include sulfone compounds, sulfonic acid ester compounds, sulfonimide compounds, disulfonyldiazomethane compounds, onium salts, and amine compounds. In a compound that absorbs light energy and generates a cation, the onium salt can also be used as a thermal polymerization initiator.

  Examples of onium salts include sulfonium salts [bis [4- (diphenylsulfonio) phenyl] sulfide bishexafluorophosphate, allylsulfonium hexafluorophosphate, triarylsulfonium hexafluoroantimonate, etc.], iodonium salts (diphenyliodonium hexafluorophosphate, etc.) ), Phosphonium salts (such as ethyltriphenylphosphonium tetrafluoroborate), diazonium salts (such as phenyldiazonium hexafluorophosphate), ammonium salts (such as 1-benzyl-2-cyanopyridinium hexafluorophosphate), and ferrocene [(2,4 -Cyclopentadien-1-yl) [(1-methylethyl) benzene] -Fe (II) hexafluorophosphate etc. That.

  Examples of the sulfone compound include phenacylphenylsulfone, 4-trisphenacylsulfone-ketosulfone, β-sulfonylsulfone, and α-diazo compounds thereof.

  Examples of the sulfonic acid ester compounds include benzoin tosylate, pyrogallol tris trifluoromethanesulfonate, pyrogallol methanesulfonic acid triester, α-methylol benzoin tosylate, α-methylol benzoindodecyl sulfonate, and the like.

  Examples of the sulfonimide compound include N- (trifluoromethylsulfonyloxy) succinimide, N- (p-toluenesulfonyloxy) bicyclo [2.2.1] hept-5-ene-2,3-dicarboximide, N- (Perfluorooctanesulfonyloxy) naphthylimide, N- (benzenesulfonyloxy) bicyclo [2.2.1] hept-5-ene-2,3-dicarboximide, N- (benzenesulfonyloxy) bicyclo [2. 2.1] heptane-5,6-oxy-2,3-dicarboximide, N- (benzenesulfonyloxy) naphthylimide and the like.

  Disulfonyldiazomethane compounds include bis (trifluoromethylsulfonyl) diazomethane, bis (phenylsulfonyl) diazomethane, bis (p-toluenesulfonyl) diazomethane, bis (2,4-dimethylbenzenesulfonyl) diazomethane, bis (1-methylethyl) And sulfonyl) diazomethane and bis (1,4-dioxaspiro [4,5] decan-7-sulfonyl) diazomethane.

  As the thermal polymerization initiator used as the cation generator, commercially available products can be obtained. For example, Adecapton CP77, Adeka Opton CP77 (manufactured by Asahi Denka Kogyo Co., Ltd.), CI-2623, CI-2624 As mentioned above, Nippon Soda Co., Ltd.), Sun-Aid SI-80L, Sun-Aid SI-100L, Sun-Aid SI-60L, Sun-Aid SI-45, Sun-Aid SI-60 (above, Sanshin Chemical Industry Co., Ltd.) and the like can be mentioned. . These may be used independently and 2 or more types may be used together. When using an epoxy group-containing compound as the reaction curable compound, hexafluoroantimonate sulfonium salt is preferable, and SI-45 is more preferable from the viewpoint of generating cations at a low temperature and polymerizing the reaction curable compound in a low temperature environment. .

  The amount of the cation generator used is preferably 0.01 to 10 parts by weight, more preferably 0.1 to 5 parts by weight with respect to 100 parts by weight of the cation reaction curable compound used in the reaction curable composition. More preferably, it is 0.5 to 5 parts by weight. When an epoxy group-containing compound is used as the reaction curable compound, the thermal polymerization initiator used as the cation generator is blended in the range of 0.5 to 10 parts by weight per 100 parts by weight of the epoxy group-containing compound. Is preferred.

(3) Composition / agent kit 3
A combination of a reaction curable composition containing an anion reaction curable compound as a reaction curable compound and a reaction initiator containing an anion generator.

  Examples of the anion generator include base amine compounds, alkali metals (lithium, sodium, and potassium), and alkali metal salts such as alkyl lithium, and base amine compounds (for example, polyamine, imidazole, hydrazide, etc.) It is preferable to include a compound that generates an amine compound by heat or light. Specifically, 1,10-diaminodecane, 4,4′-trimethylenedipiperazine, carbamates and derivatives thereof, cobalt-amine complexes, aminooxyiminos, ammonium borates, tertiary amines, imidazoles Etc. are preferred. These may be used independently and 2 or more types may be used together.

  The amount of the anion generator used is preferably 0.01 to 10 parts by weight, more preferably 0.1 to 5 parts by weight, based on 100 parts by weight of the anion reaction curable compound in the reaction curable composition. More preferably, it is 0.5 to 5 parts by weight.

(4) Composition / agent kit 4
A combination of a reaction curable composition containing a polycondensation / polyaddition reaction curable compound as a reaction curable compound and a reaction initiator containing a polycondensation / polyaddition initiator.

  As the polycondensation / polyaddition reaction initiator, metal catalysts such as triphenylphosphine, amines, imidazole, pyridine, isocyanate compounds, titanium, aluminum, germanium, and platinum are preferable. These may be used independently and 2 or more types may be used together.

  In the present invention, the polycondensation / polyaddition reaction curable compound is a combination of an epoxy resin having two or more epoxy groups in the molecule and a polythiol compound or acid anhydride having two or more thiol groups in the molecule. In this case, highly basic amines are used as amines.

  Highly basic amines include lauryl dimethylamine, dimethylcyclohexylamine, dimethylbenzylamine, dimethylaminomethylphenol, 2,4,6-tris (N, N-dimethylaminomethyl) phenol, 1,4-diazabicyclo [2.2. .2] Octane, 1,8-diazabicyclo [5,4,0] undec-7-ene (DBU), 1,5-diazabicyclo [4,3,0] non-5-ene (DBN), 2-methyl Imidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2- Phenylimidazole, 1-benzyl-2-methylimidazole, 1-sia Ethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 2,4-diamino-6- (2- Methylimidazolylethyl) -1,3,5-triazine, 2,4-diamino-6- (2-undecylimidazolylethyl) -1,3,5-triazine, 2,4-diamino-6- (2-ethyl) Examples include -4-methylimidazolylethyl) -1,3,5-triazine, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, and the like. Preferred highly basic amines are 1,4-diazabicyclo [2.2.2] octane, 1,8-diazabicyclo [5,4,0] undec-7-ene (DBU), 1,5-diazabicyclo [4, 3,0] cyclic amines such as non-5-ene (DBN). Highly basic amines may be used alone or in combination.

  The amount of the polycondensation / polyaddition reaction initiator used is preferably 0.01 to 10 parts by weight with respect to 100 parts by weight of the polycondensation / polyaddition reaction curable compound in the reaction curable composition. Preferably it is 0.05-5 weight part, More preferably, it is 0.1-2 weight part.

  In addition, when the reaction curable composition is a combination of an epoxy compound having two or more epoxy groups in the molecule and a polythiol compound or acid anhydride having two or more thiol groups in the molecule, a highly basic amine compound Is preferably 0.01 to 10 parts by weight, more preferably 0.1 to 100 parts by weight of the epoxy compound having two or more epoxy groups in the molecule in the reaction curable composition. -5 parts by weight, more preferably 0.5-5 parts by weight.

(5) Composition / agent kit 5
A combination of a reaction curable composition containing an ethylenically unsaturated group-containing compound as the reaction curable compound and a radical generator that generates radicals in the presence of a reducing agent, and a reaction initiator containing a reducing agent.

(6) Composition / agent kit 6
A combination of a reaction curable composition containing an ethylenically unsaturated group-containing compound as the reaction curable compound and a reducing agent, and a reaction initiator containing a radical generator that generates radicals in the presence of the reducing agent.

  The reducing agent used in the composition / agent kits 5 and 6 is preferably a metal catalyst and / or an amine compound or a quaternary ammonium compound, and the radical generator is preferably a peroxide.

  As the metal catalyst, copper (Cu), iron (Fe), aluminum (Al), cobalt (Co), manganese (Mn), tin (Sn), zinc (Zn), vanadium (V), chromium (Cr), Examples thereof include at least one compound selected from the group consisting of metals such as zirconium (Zr), indium (In), and titanium (Ti), and metal complexes thereof. The metal complex may be any reducing metal complex that can promote radical polymerization by generating a radical by contact with an organic oxide, and preferably a metal complex such as iron, molybdenum, vanadium, particularly Preferable examples include vanadium complexes. Examples of vanadium complexes include tetravalent vanadium compounds such as bis (acetylacetonato) oxovanadium (IV), bis (benzoylacetonato) oxovanadium (IV), bis (stearoyloxy) oxovanadium (IV), and oxalic acid. Examples include vanadyl and vanadyl naphthenate. Further, pentavalent vanadium compounds such as vanadium pentoxide (V), metavanadate (V) salt, and tri (alkoxy) oxovanadium (V) may be used. The pentavalent vanadium compound is preferably a reaction curable composition or a reaction initiator composition (especially reaction hardening) in the presence of an acidic compound such as a phosphoric acid compound (for example, dibutyl phosphoric acid and tributyl phosphoric acid). The tetravalent vanadium compound can be formed in the system of the composition. Examples of such compounds include acetylacetone vanadyl (Nippon Chemical Industry Co., Ltd .: Nasemuvanadil), vanadium alkoxide vanadium oxytriisobutoxide (manufactured by Nichia Corporation), bis (acetylacetonato) oxovanadium (IV) (Toagosei Co., Ltd.) Manufactured by AT-Quickka VE3, and dibutyl phosphate and tributyl phosphate are included as stabilizers).

  Examples of the amine compound include polyamine, imidazole, hydrazide, aniline derivatives (eg, dimethylaniline), toluidine derivatives (eg, N, N-dimethyl-p-toluidine, N, N-diethyl-p-toluidine, etc.), bis [4 It is preferable to include an amine compound such as-(dimethylamino) phenyl] methane and a compound that generates an amine compound by heat or light. These may be used independently and 2 or more types may be used together.

  As the peroxide, an organic peroxide is preferable, and at least one selected from the group consisting of ketone peroxide, peroxyketal, hydroperoxide, dialkyl peroxide, diacyl peroxide, peroxyester and peroxydicarbonate. And more specifically, benzoyl peroxide, modified benzoyl peroxide, methyl ethyl ketone peroxide, cyclohexanone peroxide, cumene hydroperoxide, t-butyl hydroperoxide, di-t-butyl hydroperoxide, dichloride At least one compound selected from the group consisting of milperoxide and tetramethyl hydroperoxide is preferred, hydroperoxide from the viewpoint of the stability of the organic oxide with respect to temperature, More preferable is at least one compound selected from the group consisting of alkyl peroxides, peroxyketals, and peroxyesters, and at least one compound selected from the group consisting of hydroperoxides, dialkyl peroxides, and peroxyketals is further provided. preferable. Examples of commercially available products include cumene hydroperoxide (Kayakumen H manufactured by Kayaku Akzo) and modified benzoyl peroxide (Nyper BZ manufactured by Nippon Oil & Fats Co., Ltd.).

  From the viewpoint of reactivity, in the combination with a reducing agent, for example, the reaction proceeds at 100 ° C. or lower, and ketone peroxide-cobalt complex, hydroperoxide-vanadium complex, diacyl peroxide-dimethylaniline, and peroxy A combination of at least one reducing agent-peroxide selected from the group consisting of ketal-quaternary ammonium salts is preferred, and from the viewpoint that the reaction proceeds even at room temperature, a ketone peroxide-cobalt complex, a hydroperoxide-vanadium complex, And a combination of at least one reducing agent-peroxide selected from the group consisting of diacyl peroxide-dimethylaniline.

  The amount of the reducing agent used is preferably 0.01 to 20 parts by weight, more preferably 0.1 to 10 parts by weight, with respect to 100 parts by weight of the reactive curable compound in the reaction curable composition. Preferably it is 0.5-5 weight part.

  In addition, the mechanism of radical generation by peroxide and reducing agent, which are radical generators, is based on a one-to-one reaction between peroxide peroxide group —O—O— and electrons released from the reducing agent. From this point of view, the amount of peroxide used is the amount of peroxide peroxidation per electron that can be released from the reducing agent when the reducing agent diffuses homogeneously in the reaction curable composition containing the peroxide. The number of groups —O—O— is preferably 0.2 to 5.0, more preferably 0.5 to 2.0, and still more preferably 0.7 to 1.5. More preferably, it is 0.9 to 1.1.

  The reaction curable composition preferably includes a heat / light stabilizer from the viewpoint of stabilizing optical transparency. Preferably, the heat / light stabilizer is a hindered phenol antioxidant, phosphorus processing heat stabilizer, hydroxylamine processing heat stabilizer, benzotriazole UV absorber, triazine UV absorber, hindered amine light. Stabilizers, benzoate silica ultraviolet absorbers, more preferably hindered phenol antioxidants, phosphorus processing heat stabilizers, hindered amine light stabilizers, and more preferably hindered phenol antioxidants. is there.

  The reaction curable composition preferably contains a silane coupling agent from the viewpoint of the stability of the adhesive strength. For silane coupling, tetramethoxysilane, tetraethoxysilane, tetrapropoxysilane, tetraisopropoxysilane, tetrabutoxysilane, dimethoxydiethoxysilane, dimethoxydiisopropoxysilane, diethoxydiisopropoxysilane, diethoxydibutoxysilane Tetraalkoxysilanes such as methyltrimethoxysilane, methyltriethoxysilane, methyltriisopropoxysilane, ethyltriethoxysilane, ethyltributoxysilane, cyclohexyltriethoxysilane, and phenyltriisopropoxysilane; And dimethyldimethoxysilane, dimethyldiethoxysilane, diethyldiethoxysilane, diethyldibutoxysilane, phenylethyldiethoxysilane And at least one silane coupling agent selected from the group consisting of dialkoxysilanes such as vinyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, and 3-methacryloxypropyltrimethoxysilane. Methoxysilane, methyltriethoxysilane, methyltriisopropoxysilane, ethyltriethoxysilane, ethyltributoxysilane, cyclohexyltriethoxysilane, phenyltriisopropoxysilane, vinyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, And at least one trialkoxysilane-based silane coupling agent selected from the group consisting of 3-methacryloxypropyltrimethoxysilane, more preferably 3-methacryloxypropyltrimethyl Kishishiran is more preferable.

  In the reaction curable composition, the amount of the solvent in the reaction curable composition is preferably 95% by weight or less, more preferably 80% by weight or less, and still more preferably 60% by weight, from the viewpoint of reaction curability and production environment. % Or less, more preferably 0% by weight (that is, no solvent is used).

(Reaction initiator composition)
In Step 1, when a reaction initiator is arranged on one or both surfaces of the two films facing each other, a reaction containing the reaction initiator from the viewpoint of stably securing production efficiency and uniformity of arrangement. It is preferable to apply the initiator composition to the film surface and arrange the reaction initiator.

  The reaction initiator composition may be, for example, a liquid or a paste containing a reaction initiator capable of coating the film surface and a medium. As the medium, an organic solvent that serves as a solvent for the reaction initiator, and an organic compound or an inorganic compound that is considered to be able to form a monomolecular film or more on the surface of the film are preferable.

  Examples of organic compounds or inorganic compounds that are considered to be capable of forming a monomolecular film or more on the film surface include Si-based monomer compounds, F-based monomer compounds, diene-based monomer compounds, ethylene that do not react with the reaction initiator. Examples thereof include monomeric unsaturated group-containing monomer compounds, epoxy monomer compounds, glycol monomer compounds, alkyl monomer compounds, amide monomer compounds, acrylic polymers, polyols, silicone polymers, fluorine polymers, diene polymers, and polyurethanes. These may react with energy irradiation.

In Step 1, when the reaction initiator is arranged as a coat layer containing a reaction initiator, or when Step 1 is Steps 1A to 1B, the reaction initiator composition is a compound having curability with respect to heating. , A compound having reaction curability with respect to light irradiation, and / or a solvent.
Examples of the compound having a reaction curable property against heating and the compound having a reaction curable property against light irradiation include a radical reaction curable compound, a cation reaction curable compound, and an anion reaction curable compound. Examples of these compounds include the compounds described in the reaction curable composition.

  The compound having a reaction curable property with respect to heating and a compound having a reaction curable property with respect to light irradiation, which are included in the reaction initiator composition, preferably have excellent adhesion to the film. Can be selected. For example, when the film is PET, TAC, or COP, a radical having a compound having a reaction curable property with respect to heating and a compound having a reaction curable property with respect to light irradiation included in the reaction initiator composition Reaction curable compounds are preferred, and ethylenically unsaturated group-containing compounds such as urethane (meth) acrylate and polybutadiene (meth) acrylate are more preferred. Further, in the present invention, the composition / agent kit is the composition / agent kit 5, wherein the reaction initiator containing a reducing agent is a reaction initiator composition, and the reaction initiator composition is a radical reaction curable compound. More preferred is a composition / agent kit 5 comprising

  The reaction initiator composition can further contain a thermosetting agent and / or a photoinitiator. When the reaction initiator composition includes a compound having reaction curability with respect to heating, it is preferable to include a thermosetting agent, and when the reaction initiator composition includes a compound having reactivity to light irradiation. Preferably, a photoinitiator is included. In this invention, since a thermosetting agent and / or a photoinitiator are used for coat layer formation, they do not function as a reaction initiator. That is, in the present invention, the thermosetting agent and photoinitiator contained in the reaction initiator composition for forming the coat layer and the reaction initiator are different compounds.

As a thermosetting agent, the above-described onium salt; (η6-benzene) (η5-cyclopentadienyl) iron (II) hexafluoroantimonate; a combination of o-nitrobenzylsilyl ether and aluminum acetylacetonate; Combination of sun and aluminum acetylacetonate; melamine resin; organic peroxide (eg, ketone peroxide, peroxyketal, diacyl peroxide, peroxyester, peroxydicarbonate), Lewis acid (trifluoride) Boron, zinc chloride, aluminum chloride, iron chloride, tin chloride, etc.), azo compounds (azobisisobutyronitrile, 1,1'-azobis (cyclohexanecarbonitrile), etc.), acids (organic acids or acids at low temperature heating) Generated sulfonium salt acid generator, etc. , Bases (polyamines such as aliphatic polyamines, amine compounds such as imidazole, hydrazide, and ketimine, compounds that generate amine compounds by low-temperature heating), polyamide resins, polymercaptan, and platinum group metal compounds or complexes thereof (platinum chloride) (IV), chloroplatinic acid hexahydrate, bis (alkynyl) bis (triphenylphosphine) platinum complex and the like.
The amount of the thermosetting agent is preferably 90 parts by weight or less, more preferably 0.01 to 80 parts by weight, with respect to a total of 100 parts by weight of the compounds reactive to heating, The amount is more preferably 60 parts by weight, particularly preferably 1 to 50 parts by weight.

As a photoinitiator, the radical generator described above; 4- (2-hydroxyethoxy) phenyl (2-hydroxy2-2propyl) ketone, 2,2-dimethoxy-1,2-diphenylethane-1-one, 2- Methyl-1,4- (methylthio) phenyl-2-morpholinopropan-1-one, 1-phenyl-2-hydroxy-2-methylpropan-1-one, 1-hydroxycyclohexyl-phenylketone, 4-diphenoxy Acetophenone compounds such as dichloroacetophenone, diethoxyacetophenone, 1- (4-isopropylphenyl) -2-hydroxy-2-methylpropan-1-one; benzophenone, methyl benzoylbenzoate, 4-phenylbenzophenone, hydroxybenzophenone 3, 3'-dimethyl-4-methoxybenzof Benzophenone compounds such as enone and diphenoxybenzophenone, 1,10-diaminodecane, 4,4'-trimethylenedipiperazine, carbamates and derivatives thereof, cobalt-amine complexes, aminooxyiminos, ammonium borates, aryl Ionic photoacid generators such as diazonium salts, diarylhalonium salts, triarylsulfonium salts, triphosphonium salts, iron allene complexes, titanocene complexes, arylsilanol aluminum complexes; nitrobenzyl esters, sulfonic acid derivatives, phosphate esters, phenols Nonionic photoacid generators such as sulfonic acid ester, diazonaphthoquinone, and N-hydroxyimide sulfonate are listed. As a commercially available product, I-184 (manufactured by BASF, 1-hydroxycyclohexyl-phenyl ketone) can be mentioned.
The amount of the photoinitiator is preferably 50 parts by weight or less, more preferably 0.001 to 50 parts by weight, based on 100 parts by weight of the compound having reactivity to light irradiation. More preferably, it is 01-20 weight part, and it is especially preferable that it is 0.1-10 weight part.
Examples of the solvent include those described below. The amount of the solvent is not particularly limited as long as a coating layer containing a reaction initiator having a desired dry thickness is obtained, and is 0.001 to 20,000 parts by weight with respect to 100 parts by weight of the reaction initiator. It is preferable that it is 0.01 to 15,000 parts by weight.

  The reaction initiator composition may further contain a surfactant for improving wettability to the surface of the film and a film forming agent for forming a film on the surface of the display device component.

  As the surfactant, soap, lauryl sulfate, polyoxyethylene alkyl ether sulfate, alkylbenzene sulfonate, polyoxyethylene alkyl ether phosphate, polyoxyethylene alkyl phenyl ether phosphate, N -Acyl amino acid salt, α-olefin sulfonate, alkyl sulfate ester salt, alkyl phenyl ether sulfate ester salt, methyl taurate, and the like. As the amphoteric surfactant, alkyldiaminoethylglycine hydrochloride, 2-alkyl- N-carboxymethyl-N-hydroxyethylimidazolinium betaine, lauryl dimethylaminoacetic acid betaine, coconut oil fatty acid amidopropyl betaine, fatty acid alkyl betaine, sulfobetaine, amidoxide, etc. Nonionic surfactants include polyethylene glycol alkyl ester type compounds, triethylene glycol monobutyl ether and other alkyl ether type compounds, polyoxysorbitan ester and other ester type compounds, alkylphenol type compounds, fluorine type compounds and silicones. Type compounds and the like. These compounds can be used alone or in combination of two or more.

  The film forming agent is preferably a silicone-based additive, an ethylenically unsaturated group-containing leveling agent, a wax-based surface modifier, a fluorine-based surface modifier, and more preferably a silicone-based additive from the viewpoint of leveling properties. , An ethylenically unsaturated group-containing leveling agent, a fluorine-based surface modifier, and more preferably a fluorine-based surface modifier.

  The reaction initiator composition may use a solvent having a low boiling point in which the reaction initiator and other additives are dissolved, for example, acetone, ethyl acetate, methyl ethyl ketone (MEK), propylene glycol monomethyl ether (PGME) and the like. . However, in the step 2 or 3, when the reaction curable composition and the reaction initiator are in contact with each other, it is preferable that the solvent in the reaction initiator composition is volatilized.

  The amount of the reaction initiator in the reaction initiator composition is preferably 0.01 to 80% by weight, more preferably 0.8% in the reaction initiator composition from the viewpoint of the coating property on the film surface in Step 1. 1 to 50% by weight, more preferably 1 to 30% by weight.

[Adhesive composition kit]
Since the reaction initiator composition and the reaction curable composition are used in combination in the production method of the present invention, the reaction initiator composition and the reaction curable composition are the adhesive composition for the production method of the present invention. Construct a product kit.

  The adhesive composition kit reacts with the suitable reaction initiators already mentioned according to the mode of reaction between the reaction initiator composition and the reaction initiator, for example, as in the composition / agent kits 1 to 6. What is necessary is just to combine an initiator composition and a reaction curable composition so that a sclerosing | hardenable compound may combine. For example, the reaction curable composition and the reaction initiator composition so that the combination of the reaction curable composition and the reaction initiator is any one kit selected from the group consisting of the composition / agent kits 1 to 6. Are preferably combined.

  In the production method of the present invention, in step 1, the reaction initiator a is arranged together with the reaction curable composition B, and in step 2, the reaction includes a reaction curable compound a ′ that can start a polymerization reaction by the reaction initiator a. Reaction initiator a and reaction curable composition when curable composition A is arranged together with reaction initiator b capable of initiating a polymerization reaction of reaction curable compound b ′ contained in reaction curable composition B The adhesive composition kit of the present invention comprising a reaction initiator composition containing the product B and a reaction curable composition containing the reaction initiator b and the reaction curable composition A is also preferred.

  In this case, the reaction initiator composition containing the reaction initiator b and the reaction curable composition A, and the reaction curable composition containing the reaction initiator a and the reaction curable composition B are also used in the adhesive composition kit of the present invention. Configure.

  The following examples illustrate the invention.

〔the film〕
Using the special high frequency power supply DTW-0212 (Wedge Corp.), the following film reaction initiator composition and reaction curable composition are coated or coated on conditions of 0.5 kW and 2.23 m / min. The corona treatment was performed.
Lumirror 100T60 (PET film, manufactured by Toray Industries, Inc.)
Fujitac TD80U (TAC film, manufactured by FUJIFILM Corporation)
ZEONOR film ZF14 (COP film, manufactured by ZEON CORPORATION)

(Reaction curable compound)
(1) Epoxy compound Epolite 100MF (trimethylolpropane triglycidyl ether (aliphatic epoxy), manufactured by Kyoeisha Chemical Co., Ltd.)
Cel2021P (3 ′, 4′-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, manufactured by Daicel Chemical Industries)

(2) Ethylenically unsaturated group-containing compound R128H (2-hydroxy-3-phenoxypropyl acrylate, manufactured by Nippon Kayaku Co., Ltd.)
ACMO (N-acryloylmorpholine, manufactured by Kojin Co., Ltd.)
HEAA (N- (2-hydroxyethyl) acrylamide, manufactured by Kojin Co., Ltd.)
UV-HK8540 (urethane acrylate, manufactured by KSM (including 30% by weight of methyl ethyl ketone))
TE-2000 (polybutadiene acrylate, manufactured by Nippon Soda Co., Ltd.)

(3) Oxetane compound OXT-101 (3-ethyl-3-hydroxymethyloxetane, manufactured by Toagosei Co., Ltd.)
OXT-211 (3-ethyl-3- (phenoxymethyl) oxetane, manufactured by Toagosei Co., Ltd.)

(Reaction initiator)
SI-45 (sulfonium compound (epoxy curing initiator), manufactured by Sanshin Chemical Co., Ltd.)
AT-Quickka VE-3 (bis (acetylacetonato) oxovanadium (IV) (reducing agent), manufactured by Toagosei Co., Ltd.)

[Peroxide]
Kayakumen H (a mixture of cumene hydroperoxide and cumene, manufactured by Kayaku Akzo)
NIPER BZ (modified benzoyl peroxide, manufactured by NOF Corporation)
[Photoinitiator]
I-184 (1-hydroxycyclohexyl phenyl ketone, manufactured by BASF)

(Reaction curable composition)
A reaction curable composition was produced with the formulation described in Table 1. Add 100g of the reactive curable compound to a Nanko container with a capacity of about 200ml, add 3g of kayakmen H, mix at room temperature (25 ° C) with a three-one motor (manufactured by Shinto Kagaku), and obtain 103g of a reactive curable composition. It was. The viscosity was as described in Table 1.

(Reaction initiator composition)
A solution obtained by diluting the reaction initiator into a 3% solution with acetone was used as a reaction initiator composition (AT-Quick (VE-3) was an ethanol solvent and the metal complex nonvolatile content was about 3%, and the stock solution was used as it was). The viscosities were all 1.5 mPa · s.

[Step 1]
The reaction initiator composition was applied to film A with a spin coater. The conditions of the spin coater were 500 rpm, 20 sec, and the dropping amount of the reaction initiator composition was 0.7 ml). Prior to entering Step 3, acetone or ethanol volatilized from the applied initiator composition.

[Step 2]
A reactive curable composition was applied to film B with a thickness of 2 to 3 μm using a bar coater. The coating thickness was measured with a micrometer.

[Step 3]
A laminator (two laminators) is used so that the reaction initiator composition-coated surface of the film coated with the reaction initiator composition is in contact with the reaction-curable composition coated surface of the film coated with the reaction curable composition. Laminating speed: 0.3 m / min), the laminated film immediately after lamination in which the reaction curable composition is polymerized at room temperature and the two films are laminated through the cured body of the reaction curable composition. Obtained. The laminated film immediately after pasting was further left in an oven (DFS72, manufactured by Yamato Scientific Co., Ltd.) at 80 ° C. for 10 seconds, 20 seconds, 30 seconds, and 60 seconds, and the heat-treated laminated film and 120 ° C. for 30 seconds. A laminated film after the heat treatment was allowed to stand.

[Evaluation conditions]
(1) Curability Peel off from the end of the laminated film, observe the state of the adhesive, dry with the finger, and when the curing is complete, ○, still partially liquid with the finger It was judged as Δ when the condition was inadequate and curing was insufficient.
(2) Viscosity Using a viscometer (RC-215 manufactured by Toki Sangyo), the reaction curable compositions of Examples 1 to 10 were No. 1 at 25 ° C. ± 1 ° C. The measurement was performed under the conditions of 1 ° 34 ′ × R24 rotor and 100 rpm.

[Examples 1 to 10]
As shown in Table 1, Examples 1 to 10 all cured well in a low temperature environment of 120 ° C. or lower.

[Test Examples 1 to 4 and Comparative Test Examples 1 to 4]
For Test Examples 1 to 4, 90 g of the reaction curable compound was placed in a Nangko container having a capacity of about 200 ml at room temperature (25 ° C.), and the properties after 12 hours were confirmed. For Comparative Test Examples 1 to 4, 90 g of the reaction curable compound was put into a Nanko container having a capacity of about 200 ml, and 2 g of SI-45 was further added and mixed at room temperature (25 ° C.) with a three-one motor (manufactured by Shinto Kagaku Co., Ltd.). 92 g of a reaction curable composition was obtained. In Test Examples 1 to 4, there was no change in the viscosity after 12 hours of the reaction curable composition (indicated by ○ in the table), and it was stable for 1 year or more. In Comparative Test Examples 1 to 4, thickening started during stirring, 200% or more thickening after 2 hours, gel state after 6 hours, and solidification after about 12 hours (indicated by x in the table). .

[Test Examples 5-7 and Comparative Test Examples 5-7]
For Test Examples 5 to 7, 100 g of the reaction curable compound was placed in a Nangko container having a capacity of about 200 ml at room temperature (25 ° C.). For Comparative Test Examples 5 to 7, 100 g of the reaction curable compound was put in a Nanko container having a capacity of about 200 ml, 3 g of kayakmen H was further added, and mixed with a three-one motor (manufactured by Shinto Kagaku Co., Ltd.). A complex component (solid content of AT-Quickka) was added to obtain a reaction curable composition. In Test Examples 5 to 7, there was no change in the immediately following viscosity (indicated by ○ in the table). In Comparative Test Examples 5 to 7, the reaction explosively proceeds immediately after the addition of the metal complex component, resulting in an effervescent brown solid, and a stable liquid cannot be obtained (indicated by x in the table).

[Examples 11 to 16 and Comparative Examples 1 to 4]
(1) Production of reaction initiator composition and curable composition A reaction initiator composition was produced with the formulation described in Table 4, and a curable composition was produced with the formulation described in Table 5. Note that AT-Quick (VE-3) was used after removing ethanol with an evaporator. The numerical values in Tables 4 and 5 are parts by weight.

※1 ＵＶ−Ｈ Ｋ８５４０は、３０重量％のメチルエチルケトンを含む重量である。
※2 ＴＥ−２０００・２−ヒドロキシエチルメタクリレート混合物は、ＴＥ−２０００５ ５６．５重量部及び２−ヒドロキシエチルメタクリレート １０重量部の混合物である。

* 1 UV-H K8540 contains 30% by weight of methyl ethyl ketone.
* 2 The TE-2000 / 2-hydroxyethyl methacrylate mixture is a mixture of 56.5 parts by weight of TE-20005 and 10 parts by weight of 2-hydroxyethyl methacrylate.

(2) Production of laminated film A laminated film was obtained under the conditions described in the following Step 1 and Step 2.

[Step 1]
The reaction initiator composition was applied to the corona-treated surface of the corona-treated film A with a thickness of 1 to 2 μm using a bar coater. Next, the film A having the composition layer of the reaction initiator composition was treated at 80 ° C. for 20 seconds to volatilize the solvent contained in the reaction initiator composition. Furthermore, UV was irradiated using a metal halide lamp at 1500 mJ / cm ² (amount of light at 365 nm) to cure the reaction initiator composition, thereby forming a coat layer of the reaction initiator. The thickness of the coat layer was 100 nm.

[Step 2]
The coat layer surface of the film A with a coat layer produced in Step 1 and the corona surface of the film B were combined and inserted into a nip roll (nip roll speed: 0.3 m / min). The reaction curable composition was dropped between the films and nipped. The thickness of the reaction curable composition was 1 to 3 μm. The reaction curable composition was polymerized at room temperature to obtain a laminated film immediately after lamination in which two films were laminated via a cured product of the reaction curable composition. The laminated film immediately after pasting was left in an oven at 80 ° C. for 10 seconds to obtain a laminated film after heat treatment. About the film after leaving still at 80 degreeC for 10 second, sclerosis | hardenability was confirmed according to the said sclerosis | hardenability evaluation conditions. The results of confirmation of curability are summarized in Table 6.

  As shown in Table 6, Examples 11 to 16 all cured well in a low temperature environment at 80 ° C. for 10 seconds. On the other hand, none of Comparative Examples 1 to 4 was cured.

Claims (10)

A method for producing a laminated film in which at least two films are laminated via a cured product of a reactive curable composition,
Step 1: Disposing a reaction initiator capable of initiating a polymerization reaction of a reaction curable compound in the reaction curable composition on one or both of the opposing surfaces of the two films.
Step 2: Disposing the reaction curable composition on at least one surface of the reaction initiator disposed on the surface and the surface on which the reaction initiator is not disposed,
Step 3: The two reaction films are bonded to each other so that the arranged reaction initiator and the reaction curable composition are in contact with each other, and the reaction curable compound is polymerized to form the reaction curable composition. A method for producing a laminated film including a step of curing an object ,
Step 1 is steps 1A-1B:
1A: Arranging a reaction initiator composition containing the reaction initiator on one or both surfaces of the opposing surfaces of the two films, and
1B: The reaction initiator composition is cured by a curing method that is light irradiation, or a curing method that is a combination of light irradiation and one or more selected from the group consisting of heating and volatilization of a solvent, to react. Step of obtaining a coat layer containing an initiator
A method for producing a laminated film .   The method for producing a laminated film according to claim 1, wherein in the step 3, the reaction curable compound undergoes a polymerization reaction at 120 ° C or lower.   The manufacturing method of the laminated | multilayer film of Claim 1 or 2 in which the said process 3 does not have the process of light-irradiating the said reaction curable composition. The reaction curable compound, method for producing a laminated film of at least one of which is a compound according to claim 1 or 2, wherein selected from a radical-curable compound and a cationic-curable compound or Ranaru group. Wherein the reactive curable composition comprising a radical-curable compound as a reactive curable compound, allowed combination of initiators containing a radical generator,
Wherein the reactive curable composition comprising a cationically-curable compound as a reactive curable compound, allowed combination of initiators containing a cation generator,
A reaction curable composition comprising a radical generator to generate radicals in the presence of an ethylenically unsaturated group-containing compound and a reducing agent as a pre-Symbol-curable compound, allowed combination of initiators containing the reducing agent and combination of initiators containing a reactive curable composition containing an ethylenically unsaturated group-containing compound and a reducing agent as the reaction-curable compound, a radical generator to generate radicals in the presence of the reducing agent Set
Method for producing a laminated film according to any one of claims 1 to 4 using at least one kit or selected from Ranaru group. In the step 1, the reaction initiator further includes a reaction curable compound b ′ (however, different from the reaction curable compound in the reaction curable composition),
In the step 2, the reaction curable composition further includes a reaction initiator b capable of initiating a polymerization reaction of the reaction curable compound b ′ (however, different from the reaction initiator in the reaction initiator). the production method of a laminated film of any one of claims 1 to 5. Wherein one of the two films is a polarizer film, a manufacturing method of the laminated film of the laminated film according to any one of claims 1 to 6 is a polarizing plate. Adhesives for the production method of the laminated film according to any one of claims 1-7 comprising the initiator composition comprising the initiator of claim 1 wherein the claim 1 reactive curable composition according Composition kit. The adhesive composition according to claim 8 , wherein the viscosity of the reaction initiator composition at 25 ° C is 1 to 3000 mPa · s, and the viscosity of the reaction curable composition at 25 ° C is 1 to 3000 mPa · s. kit. The initiator composition according to claim 8 or 9 for the adhesive composition kit according to claim 8 or 9 .