JP5359045B2 - 半導体装置およびその製造方法 - Google Patents

半導体装置およびその製造方法 Download PDF

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Publication number
JP5359045B2
JP5359045B2 JP2008158774A JP2008158774A JP5359045B2 JP 5359045 B2 JP5359045 B2 JP 5359045B2 JP 2008158774 A JP2008158774 A JP 2008158774A JP 2008158774 A JP2008158774 A JP 2008158774A JP 5359045 B2 JP5359045 B2 JP 5359045B2
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Japan
Prior art keywords
wiring
plating
insulating substrate
hole
corner
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JP2008158774A
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English (en)
Japanese (ja)
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JP2010003722A (ja
JP2010003722A5 (https=
Inventor
勇一 岡田
祐子 青木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
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Nichia Corp
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Priority to JP2008158774A priority Critical patent/JP5359045B2/ja
Publication of JP2010003722A publication Critical patent/JP2010003722A/ja
Publication of JP2010003722A5 publication Critical patent/JP2010003722A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/655—Fan-out layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Led Device Packages (AREA)
  • Semiconductor Lasers (AREA)
JP2008158774A 2008-06-18 2008-06-18 半導体装置およびその製造方法 Active JP5359045B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008158774A JP5359045B2 (ja) 2008-06-18 2008-06-18 半導体装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008158774A JP5359045B2 (ja) 2008-06-18 2008-06-18 半導体装置およびその製造方法

Publications (3)

Publication Number Publication Date
JP2010003722A JP2010003722A (ja) 2010-01-07
JP2010003722A5 JP2010003722A5 (https=) 2011-07-28
JP5359045B2 true JP5359045B2 (ja) 2013-12-04

Family

ID=41585228

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008158774A Active JP5359045B2 (ja) 2008-06-18 2008-06-18 半導体装置およびその製造方法

Country Status (1)

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JP (1) JP5359045B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5537385B2 (ja) * 2010-11-04 2014-07-02 スタンレー電気株式会社 サイドビュー型半導体発光装置およびその製造方法
JP6176302B2 (ja) * 2015-01-30 2017-08-09 日亜化学工業株式会社 発光装置の製造方法
US9755105B2 (en) 2015-01-30 2017-09-05 Nichia Corporation Method for producing light emitting device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3475757B2 (ja) * 1997-12-01 2003-12-08 松下電器産業株式会社 面実装型光電変換装置作製用基板
US7244965B2 (en) * 2002-09-04 2007-07-17 Cree Inc, Power surface mount light emitting die package
JP5073946B2 (ja) * 2005-12-27 2012-11-14 新光電気工業株式会社 半導体装置および半導体装置の製造方法
JP2007235003A (ja) * 2006-03-03 2007-09-13 Ngk Spark Plug Co Ltd 発光素子収納用パッケージ
JP5103805B2 (ja) * 2006-06-27 2012-12-19 日亜化学工業株式会社 発光装置及びその製造方法

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JP2010003722A (ja) 2010-01-07

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