JP5351026B2 - Symmetrical wood flooring using heat-treated wood and method for manufacturing the same - Google Patents
Symmetrical wood flooring using heat-treated wood and method for manufacturing the same Download PDFInfo
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- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
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- 235000005590 Larix decidua Nutrition 0.000 description 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical class OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 1
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- HNPDNOZNULJJDL-UHFFFAOYSA-N ethyl n-ethenylcarbamate Chemical compound CCOC(=O)NC=C HNPDNOZNULJJDL-UHFFFAOYSA-N 0.000 description 1
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- 239000008204 material by function Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-N phosphoric acid Substances OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
- E04F15/024—Sectional false floors, e.g. computer floors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
- B32B21/14—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board comprising wood board or veneer
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
- E04F15/04—Flooring or floor layers composed of a number of similar elements only of wood or with a top layer of wood, e.g. with wooden or metal connecting members
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Floor Finish (AREA)
- General Engineering & Computer Science (AREA)
- Finished Plywoods (AREA)
- Chemical And Physical Treatments For Wood And The Like (AREA)
Description
本発明は熱処理したウッドを上層及び下層に適用した対称構造のウッドフローリング及びその製造方法に係り、高温で熱処理した厚さ２ｍｍ以上の単板を基材層の上下部に対称に積層することによってバランスを取り、環境変化による変形の問題を完璧に解決した対称構造のウッドフローリングに関する。 The present invention relates to a wood flooring having a symmetrical structure in which heat-treated wood is applied to an upper layer and a lower layer, and a manufacturing method thereof. It is related to wood flooring with a symmetrical structure that balances and perfectly solves the problem of deformation caused by environmental changes.
一般に、上層の厚さが２ｍｍ未満のウッド板は合板床と称し、２ｍｍ以上のウッド板はナチュラルウッド床と通称する。一般のナチュラルウッド床は２ｍｍ以上の表面材と５ないし７ｍｍの合板やストリップ(strip)を基材にして構成される。合板床が幅寸法７５、９２ｍｍ、長さ寸法９００ｍｍに仕様が制限されている一方、ナチュラルウッド床は幅寸法６５ないし２１０ｍｍ、長さ寸法は３６０ないし２、２５ｍｍで多様な仕様で製造されている。また、表面強化のためにＷＰＣ(Wood Plastic Composite)含浸処理を施す製品もある。 In general, a wood board having an upper layer thickness of less than 2 mm is called a plywood floor, and a wood board of 2 mm or more is commonly called a natural wood floor. A typical natural wood floor is composed of a surface material of 2 mm or more and a plywood or strip of 5 to 7 mm as a base material. The plywood floor is limited to a width of 75, 92 mm and a length of 900 mm, while the natural wood floor is manufactured in various specifications with a width of 65 to 210 mm and a length of 360 to 2,25 mm. . There are also products that are subjected to WPC (Wood Plastic Composite) impregnation treatment for surface reinforcement.
ところが、薄厚の模様木を使った合板床とは違って、２ｍｍ以上の単板を使ったナチュラルウッド床の場合、水分条件の変化による寸法安定性と撓み安定性(Warping)に劣って韓国固有のオンドル文化に脆弱点を露出している。 However, unlike a plywood floor using thin patterned wood, a natural wood floor using a single board of 2 mm or more is inferior to Korea because of its dimensional stability and warping stability due to changes in moisture conditions. The vulnerabilities are exposed to the Ondol culture.
また、市中に流通しているナチュラルウッド床は上部に２ｍｍ以上の単板を、下部には合板やストラップ(床の幅寸法に比べて相対的に小さい寸法の角材を表面材の木目方向と垂直に接着)状の基材を含む上下非対称の構造によって、全体的な構造のバランスがとれなくて合板床に比べて製品の基本物性に劣るという短所がある。 In addition, natural wood floors that are distributed throughout the city have a veneer of 2 mm or more in the upper part, and plywood and straps in the lower part (a square material with a relatively small size compared to the width of the floor is the grain direction of the surface material. Due to the vertically asymmetric structure including the vertically bonded base material, the overall structure cannot be balanced and the basic physical properties of the product are inferior to the plywood floor.
日本特開第1994-158842号には基材合板の溝にヒータを設けた木質床暖房パネルが開示されているが、基材層を中心に非対称構造である。 Japanese Unexamined Patent Publication No. 1994-158842 discloses a wooden floor heating panel in which a heater is provided in a groove of a base material plywood, but it has an asymmetric structure centering on the base material layer.
日本特開第2005-161624号にはトラックの床板として使用される木質の複合板が開示されているが、熱処理したウッド層を使用しなくて寸法安定性に不十分である。 Japanese Unexamined Patent Publication No. 2005-161624 discloses a wood composite board used as a floor board of a truck, but it does not use a heat-treated wood layer and is insufficient in dimensional stability.
アメリカ特許公開2005/0153150号にはコンテーナ床用として使用される竹ボードが開示されているが、熱処理したウッド層を使用しなくて寸法安定性に不十分である。 US Patent Publication No. 2005/0153150 discloses a bamboo board used for a container floor, but it does not use a heat-treated wood layer and is insufficient in dimensional stability.
日本特開第2003-251616号には炭化木質繊維断熱材が開示されているが、床材ではなく外壁または床に使われる断燃材に関する。 Japanese Unexamined Patent Publication No. 2003-251616 discloses a carbonized wood fiber heat insulating material, but relates to a flame extinguishing material used for an outer wall or a floor, not a floor material.
本発明は前述した従来の技術の問題点を解決するために案出されたもので、その目的は上層と下層には熱処理ウッドを使用することによって水分と熱による変化率に優れて既存のナチュラルウッド床に比べて寸法安定性を改善することができ、下層の構成を上層と同じ材料で仕上げて熱を湿気による撓みを解決することができ、特に対称構造の安定性を与えることによって、韓国のオンドル文化に適するように設計されたウッドフローリングを提供するところにある。 The present invention was devised to solve the above-mentioned problems of the prior art, and its purpose is to use existing heat treated wood for the upper layer and the lower layer so that the rate of change due to moisture and heat is excellent. Compared with wood floor, the dimensional stability can be improved, and the lower layer structure can be finished with the same material as the upper layer to solve the heat deflection due to moisture, especially by giving the stability of symmetrical structure, Korea Is providing wood flooring designed to suit the Ondol culture.
本発明の他の目的は、熱処理を通じた材色（ウッドカラー）の高級化によって感性イメージを高めることのできるウッドフローリングを提供するところにある。 Another object of the present invention is to provide a wood flooring that can enhance the sensitivity image by upgrading the material color (wood color) through heat treatment.
本発明は前述した目的を達成するために、基材層と該基材層の上部及び下部に対称をなして積層される熱処理ウッド層を含むウッドフローリングを提供する。 In order to achieve the above-mentioned object, the present invention provides a wood flooring including a base material layer and a heat treated wood layer laminated symmetrically on the upper and lower portions of the base material layer.
本発明は熱処理したウッドを基材層の上下部に対称に構成することによって、寸法安定性を画期的に改善すると同時に、熱処理を通じたウッドカラーの高級化を達成することを特徴とする。 The present invention is characterized in that the heat treated wood is symmetrically formed on the upper and lower portions of the base material layer, thereby dramatically improving the dimensional stability and at the same time achieving a high quality wood color through the heat treatment.
本発明において熱処理ウッド層は１５０ないし２３０℃の温度下で熱処理した単板であることが望ましい。 In the present invention, the heat-treated wood layer is preferably a single plate heat-treated at a temperature of 150 to 230 ° C.
ウッドを構成する化学的成分は、セルロース(Cellulose)、ヘミセルロース(Hemicelluloses)、リグニン(Lignin)、抽出物とに大別される。 The chemical components constituting the wood are roughly classified into cellulose (Cellulose), hemicellulose (Hemicelluloses), lignin (Lignin), and an extract.
このような化学的成分のうちヘミセルロースは１５０℃以上の温度で熱分解が発生してウッドの化学的、物理的性質が変わる。また、セルロースの熱分解は２４０ないし３５０℃で起こるようになるが、セルロースの分解はウッドの深刻な強度低下を引き起こす。 Among such chemical components, hemicellulose undergoes thermal decomposition at a temperature of 150 ° C. or more, and the chemical and physical properties of wood change. In addition, the thermal decomposition of cellulose occurs at 240 to 350 ° C., but the decomposition of cellulose causes a serious decrease in strength of wood.
この熱処理過程中、水分吸着点の減少によって収縮、膨張率が安定的に維持され、生物学的耐久性が改善され、ウッドカラーが濃くなり、ウッド内の抽出物が移動し、ウッドが軽くなると、平衡含水率が減り、断熱性能がアップする。 During this heat treatment process, the shrinkage and expansion rate are stably maintained by reducing the moisture adsorption point, the biological durability is improved, the wood color becomes darker, the extract in the wood moves, and the wood becomes lighter , Equilibrium moisture content is reduced and insulation performance is improved.
本発明において適用しようとするウッドフローリングの望ましい形態は上部熱処理ウッド層の厚さが２ｍｍ以上のナチュラルウッド床である。 A desirable form of the wood flooring to be applied in the present invention is a natural wood floor in which the upper heat-treated wood layer has a thickness of 2 mm or more.
本発明において基材層はナチュラルウッド、耐水合板、ＭＤＦ(Medium Density Fiberboard：中密度繊維板)、ＨＤＦ(High Density Fiberboard：高密度繊維板)、パーチクルボード、樹脂木粉混合ボードの中から選ばれる１種以上の木質系ボードとからなる。 In the present invention, the base material layer is selected from natural wood, water-resistant plywood, MDF (Medium Density Fiberboard), HDF (High Density Fiberboard), particle board, and resin wood powder mixed board 1 It consists of more than a kind of wooden board.
本発明のウッドフローリングは、上から表面処理層、熱処理ウッド層、基材層、熱処理ウッド層とからなる。 The wood flooring of the present invention comprises a surface treatment layer, a heat treated wood layer, a base material layer, and a heat treated wood layer from above.
本発明のウッドフロリーングに多様な機能性を与えるため、表面処理層、熱処理ウッド層、基材層のうち一つ以上の層に炭、黄土、銀、麦飯石,ゲルマニウム、磁鉄鋼、玉、抗菌剤、防虫剤の中から選ばれる１種以上の機能性物質;エポキシ、フェノール、アクリル、メラミン、ポリウレタン、不飽和ポリエステル、ジアリルフタレートの中から選ばれる１種以上の硬化樹脂;炭酸カルシウム、滑石、酸化チタン、シリカー、ガラス粉末、二酸化ケイ素の中から選ばれる１種以上の充填材;及び/またはホスホン酸エステル、ハロゲン炭化水素、酸化アンチモン、アルミニウムヒドロキシ、リン酸化合物、ジシアンジアミドの中から選ばれる１種以上の難燃剤を添加することができる。 In order to give various functions to the wood floring of the present invention, charcoal, ocher, silver, barley stone, germanium, magnetic steel, balls, One or more functional substances selected from antibacterial and insect repellents; one or more cured resins selected from epoxy, phenol, acrylic, melamine, polyurethane, unsaturated polyester, diallyl phthalate; calcium carbonate, talc One or more fillers selected from titanium oxide, silica, glass powder, silicon dioxide; and / or selected from phosphonates, halogenated hydrocarbons, antimony oxide, aluminum hydroxy, phosphate compounds, dicyandiamide One or more flame retardants can be added.
本発明は床材の上層及び下層に同じ厚さの単板を適用し、中間基材層としてナチュラルウッド、耐水合板、ＭＤＦ、ＨＤＦ、パーチクルボード、樹脂木粉混合ボードなどのような木質系ボードを適用した３層構造を通じて、上下部対称構造にてバランスをとるように積層し、一定した温度と圧力で一体化することによって環境変化による変形の問題を解決することができる。 In the present invention, a single board having the same thickness is applied to the upper layer and the lower layer of the floor material, and a wood-based board such as natural wood, water-resistant plywood, MDF, HDF, particle board, resin wood powder mixed board, etc. is used as an intermediate base material layer. Through the applied three-layer structure, the upper and lower symmetrical structures are laminated so as to be balanced, and the problem of deformation due to environmental changes can be solved by integrating them at a constant temperature and pressure.
また、高温で熱処理した厚さ２ｍｍ以上の単板を上下層に適用することによって熱や湿気による変形を完璧に解決して、いずれの環境下でも使用可能であり、T&G加工を通じて床からの屈曲による製品間の段差を解決することができる。 In addition, by applying a single plate with a thickness of 2 mm or more that is heat-treated at high temperature to the upper and lower layers, it can be used in any environment, and can be used in any environment, and bends from the floor through T & G processing. The difference in level between products can be solved.
以下、添付した図面に基づき本発明を詳述する。 Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
図１は本発明に係る対称構造のウッドフローリングの断面図であって、上から表面処理層１０、熱処理ウッド層２０、基材層３０、熱処理ウッド層２０とからなる。
FIG. 1 is a cross-sectional view of a symmetric structure wood flooring according to the present invention, which is composed of a
表面処理層１０は通常の紫外線硬化型または熱硬化型表面処理層とからなる。
The
熱処理ウッド層２０は高温で熱処理して寸法安定化を導くウッド層であって、ウッドを熱処理すれば、ウッドの含水率が減ることによって寸法安定性が向上し、またウッドが黒くて濃く変わって高級品になる。
The heat-treated
熱処理ウッド層２０は１５０ないし２３０℃の温度下で熱処理した２ｍｍ以上の単板で構成されることが望ましく、完全な対称構造のために上層と下層の両方とも、同じ材料及び同じ厚さで構成するのが望ましい。単板としては一般のウッド類を使用することができる。
The heat-treated
基材層３０はナチュラルウッド, 耐水合板、ＭＤＦ、ＨＤＦ、パーチクルボード、樹脂木粉混合ボードなどの木質系ボードよりなる。
The
本発明に係るウッドフローリングに多様な機能性を与えるため、表面処理層１０、熱処理ウッド層２０、基材層３０のうち少なくとも一つの層に炭、黄土、銀、麦飯石, ゲルマニウム、磁鉄鋼,玉、抗菌剤、防虫剤などの機能性物質を添加して遠赤外線放射機能、陰イオン発散機能、抗菌機能、防虫機能など健康に役に立つ機能を与えることができる。また、エポキシ、フェノール、アクリル、メラミン、ポリウレタン、不飽和ポリエステル、ジアリルフタレートなどの硬化樹脂を添加して製品の耐久性、耐摩耗性、耐水性などの物性を改善することができ、炭酸カルシウム、滑石、酸化チタン、シリカー、ガラス粉末、二酸化ケイ素などの充填材を添加してオンドル効果、熱伝導向上などの機能を提供することができ、ホスホン酸エステル、ハロゲン炭化水素、酸化アンチモン、アルミニウムヒドロキシ、リン酸化合物、ジシアミドなどの難燃剤をミドなどの難燃剤を添加して難燃機能を付することができる。
In order to give various functions to the wood flooring according to the present invention, at least one of the
熱処理ウッド層を含むウッドフローリングの製造のために、製材後多量の単板が得られる厚さの角材形態に裁断して熱処理原材料を用意する。 In order to manufacture a wood flooring including a heat-treated wood layer, a heat-treated raw material is prepared by cutting into a square material having a thickness that allows a large amount of veneer to be obtained after sawing.
熱処理ウッド層に使用可能な闊葉樹種としては、オーク(Oak)、バーチ(Birch)、ウォルナット(Walnut)、チェリー(Cherry)、アッシュ(Ash), 韓国産針葉樹種としてはラーチ(Larch)であって含水率５ないし１０％のものを使用することができる。 Oak, Birch, Walnut, Cherry, Ash, and Larch are Korean coniferous species that can be used for heat-treated wood layers. A water content of 5 to 10% can be used.
生材をそのまま熱処理に使用可能であるが、必要に応じて予め乾燥されておいた方が良策である。また、角材の４面を鉋掛けで仕上げて熱処理後良質の表面状態を導くことができる。 The raw material can be used for the heat treatment as it is, but it is better to dry it beforehand if necessary. In addition, the four surfaces of the square can be finished with a hook, and a high-quality surface state can be derived after the heat treatment.
熱処理過程には条件に応じて１２時間ないし２４時間かかる。 The heat treatment process takes 12 to 24 hours depending on the conditions.
熱処理過程は、乾燥、高温処理、冷却とに大きく３段階に分けて見られる。一番目の段階として乾燥過程は高温乾燥とも言われるが、ウッド内含水率をほぼ０％に近く下げる過程である。内部の割裂を防止するためにはかなりの注意を要する。初期含水率、樹種とウッド厚さに応じて乾燥段階の条件が違ってくる。 The heat treatment process is roughly divided into three stages: drying, high-temperature treatment, and cooling. Although the drying process is said to be high temperature drying as the first stage, it is a process of lowering the moisture content in the wood to almost 0%. Considerable care must be taken to prevent internal splits. Depending on the initial moisture content, tree species and wood thickness, the drying stage conditions will vary.
２番目の段階は高温処理過程であって、予め設定した１５０ないし２３０℃の温度まで上昇させた後一定時間最適温度を維持させる。この際、蒸気(steam)を使って火事を予防し、ウッド内の化学的な変化を制御する。 The second stage is a high-temperature treatment process, in which the temperature is raised to a preset temperature of 150 to 230 ° C. and then the optimum temperature is maintained for a certain time. At this time, steam is used to prevent fire and control chemical changes in the wood.
最後の段階は冷却段階であって、熱処理したウッドと外気の高い温度差によってウッドが割れる現象を防止すべきである。この際、熱処理したウッドを最終使用用途に応じて適正含水率のレベルに調整する必要がある。一般的な最終含水率レベルは５ないし７％になり、熱処理温度によって５ないし１５時間冷却させる。 The last stage is a cooling stage, which should prevent the wood from cracking due to a high temperature difference between the heat-treated wood and the outside air. At this time, it is necessary to adjust the heat-treated wood to a proper moisture content level according to the end use application. The typical final moisture level is 5-7% and is cooled for 5-15 hours depending on the heat treatment temperature.
熱処理過程に使用される樹種(闊葉樹、針葉樹)に応じて各条件(熱処理最大温度、蒸気使用程度、各段階別運用時間)は最適化可能である。 Each condition (heat treatment maximum temperature, steam use degree, operation time for each stage) can be optimized according to the tree species (birch, conifer) used in the heat treatment process.
こうして熱処理したウッドをウッドフローリングの規格に合わせて裁断し仕上げて上層及び下層に使用し、基材層と共に各層を一定した温度及び圧力で一体化してウッドフローリングを形成する。 The wood thus heat-treated is cut and finished according to wood flooring standards and used for the upper layer and the lower layer, and the layers are integrated with the base material layer at a constant temperature and pressure to form a wood flooring.
上から熱処理ウッド層２０、基材層３０、熱処理ウッド層２０を圧着によって対称構造に一体化した後、表面処理層１０を形成し、Ｔ＆Ｇ形態に裁断して熱処理ウッド層を有する対称構造のウッドフローリングを製造した。
After the heat treated
この際、上層と下層に適用する熱処理ウッド層２０としては、１８０ないし２００℃で熱処理して厚さが約３.０ｍｍ、含水率が５ないし７％のものを使用したし、基材層３０としては厚さ４.０ｍｍ、含水率５％のフィランド産バーチ(Birch)合板を使用したし、接着剤は水性エマルジョンビニルウレタン系を主成分にして硬化剤を１０％まで混合して使用したし、常温圧着可能な常温硬化型樹脂を使用した。
At this time, as the heat-treated
製造工程を具体的に説明すれば、各層を積層した後プレスで一体化させるが、この際常温条件下で圧力は１２kgf/cm2にし、加圧時間は６０分で施して一体化した。一体化された表面層をサンディングした後下塗、中塗の順に塗装した後、実際製品サイズが幅７０ｍｍ、長さ５９０ｍｍになるようにテノーナ(Tenoner)を用いて裁断し、側面にＴ&Ｇ加工(Tongue and Groove)を経て、最後に表面上塗で塗装し包装して、完成品を製造した。 The manufacturing process will be described in detail. After laminating each layer, the layers are integrated by a press. At this time, the pressure is 12 kgf / cm 2 under normal temperature conditions, and the pressing time is 60 minutes for integration. After sanding the integrated surface layer, after coating in the order of undercoat and intermediate coat, cut with Tenoner so that the actual product size is 70mm wide and 590mm long, and T & G processing on the side (Tongue and Groove), and finally finished with a surface coating.
前記実施例１において、基材層３０をビルマ産チークコアボード(Teak Core Board)を積層して製造した。以降の製造工程は実施例１と同様に製造した。
In Example 1, the
実施例１と同様な構造の熱処理していないナチュラルウッド床 Untreated natural wood floor with the same structure as in Example 1
市販中の一般のナチュラルウッド床 General natural wood floor on the market
前記実施例に基づき製造した本発明の熱処理したウッドを上層及び下層に適用した対称構造のウッドフローリングの物性を同じ構造の未処理ナチュラルウッド床と既存に流通されていたナチュラルウッド床材の物性と比較したし、その結果表１から確認できるように、実施例において製造したウッドフローリングの寸法安定性と撓み安定性が比較例のナチュラルウッド床より優れた。 The physical properties of the wood flooring of the symmetrical structure in which the heat-treated wood of the present invention manufactured based on the above embodiment is applied to the upper layer and the lower layer are the same as the physical properties of the untreated natural wood floor having the same structure and the existing natural wood floor material. As a result, as can be confirmed from Table 1, the dimensional stability and the bending stability of the wood flooring produced in the example were superior to the natural wood floor of the comparative example.
ここで、高温条件の場合８０℃乾燥機で６時間乾燥させ、浸漬条件の場合、常温水で６時間浸漬した後、幅及び長さ方向の寸法と撓み程度(Warping)を各々バーニアカリパス (vernier calipers)と厚さゲージで測定した。
本発明によりオンドル文化への適用であるという形で設計された韓国型ナチュラルウッド床材が提供される。 According to the present invention, a Korean-style natural wood flooring designed to be applied to Ondol culture is provided.
１０：表面処理層
２０：熱処理ウッド層
３０：基材層
10: Surface treatment layer 20: Heat treated wood layer 30: Base material layer
Claims (7)
基材層の上部及び下部に熱処理ウッド層を備えてなり、
上から、表面処理層、熱処理ウッド層、基材層、熱処理ウッド層よりなり、
前記表面処理層が、紫外線硬化型又は熱硬化型表面処理層とからなるものであり、
前記表面処理層、前記熱処理ウッド層、前記基材層のうち一つ以上の層が、炭、黄土、銀、麦飯石、 ゲルマニウム、磁鉄鋼、 玉、抗菌剤、防虫剤の中から選ばれる１種以上の機能性物質を含んでなることを特徴とする、ウッドフローリング。 Wood flooring,
The heat treatment wood layer is provided in the upper part and the lower part of the base material layer,
From above, the surface treatment layer, heat treatment wood layer, base layer, Ri name than the heat treatment wood layer,
The surface treatment layer comprises an ultraviolet curable or thermosetting surface treatment layer,
One or more of the surface-treated layer, the heat-treated wood layer, and the base material layer are selected from charcoal, ocher, silver, barley stone, germanium, magnetic steel, jade, antibacterial agent, and insect repellent 1 Wood flooring characterized by comprising a functional substance of more than seeds .
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| KR20060093242A KR100970112B1 (en) | 2006-09-26 | 2006-09-26 | Wood flooring with carbonized solid wood using symmetric structure and process for preparing the same |
| KR10-2006-0093242 | 2006-09-26 | ||
| PCT/KR2007/001024 WO2008038869A1 (en) | 2006-09-26 | 2007-02-28 | Wood flooring with carbonized solid wood using symmetric structure and process for preparing the same |
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| JP2010504866A JP2010504866A (en) | 2010-02-18 |
| JP5351026B2 true JP5351026B2 (en) | 2013-11-27 |
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| EP2480733B1 (en) * | 2009-09-24 | 2017-11-15 | Philips Lighting Holding B.V. | Floor covering system comprising a lighting system |
| CN102071789A (en) * | 2009-11-23 | 2011-05-25 | 浙江世友木业有限公司 | Production method of large-breadth block floor and large-breadth block floor |
| CN102107446B (en) * | 2009-12-26 | 2013-09-25 | 浙江世友木业有限公司 | Surface-enhanced solid wood sectional material and manufacturing method thereof |
| KR101333574B1 (en) * | 2010-10-25 | 2013-11-27 | 홍재철 | Manufacturing method and Products of Pinewood that are characterized by heating below combustion temperature and removing skin tissue |
| CN102626940B (en) * | 2011-02-07 | 2016-03-30 | 刘锡丽 | A kind of solid wood profile modification method and section bar thereof |
| CN102825643A (en) * | 2011-06-13 | 2012-12-19 | 承泰丰木业有限公司 | Waterproof dense board |
| KR101338025B1 (en) * | 2011-09-21 | 2013-12-06 | 문중묵 | Flooring using high temperature heat treatment wood |
| CN102554980B (en) * | 2012-02-20 | 2014-10-22 | 浙江世友木业有限公司 | Manufacturing method of laminated veneer lumber |
| CN102672771A (en) * | 2012-05-31 | 2012-09-19 | 浙江林碳木业科技有限公司 | Single-side surface layer densification processing method and product for wood |
| AU2014240948B2 (en) * | 2013-03-29 | 2016-10-20 | Afi Licensing Llc | Hybrid wood products |
| CN103216075B (en) * | 2013-04-24 | 2016-06-01 | 琚长林 | A kind of vegetable fibre floor and making method thereof |
| US9228093B2 (en) | 2013-10-18 | 2016-01-05 | Weyerhaeuser Nr Company | Colored water-repellant and crocking-resistant compositions |
| CN103696556A (en) * | 2013-12-31 | 2014-04-02 | 徐州中原木业有限公司 | Inorganic nano-silver-ion parquet and production method thereof |
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| EP3173201A1 (en) * | 2015-11-30 | 2017-05-31 | Omya International AG | Calcium carbonate for particle boards |
| CN105860295A (en) * | 2016-05-06 | 2016-08-17 | 王泽陆 | Preparation method of low-moisture-absorption polybutylene-based wood-plastic composite floor material |
| CN106049824A (en) * | 2016-07-20 | 2016-10-26 | 平湖信达软木工艺有限公司 | Novel reinforced compound cork floor |
| CN106013723A (en) * | 2016-07-20 | 2016-10-12 | 平湖信达软木工艺有限公司 | Reinforced composite type soft wood floor |
| CN106121182A (en) * | 2016-07-27 | 2016-11-16 | 广东皇田环保科技有限公司 | A kind of high intensity solid wooden floor board and preparation method thereof |
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| JP2733641B2 (en) * | 1993-03-26 | 1998-03-30 | 株式会社ノダ | Architectural board |
| JP3803168B2 (en) * | 1997-06-06 | 2006-08-02 | 永大産業株式会社 | Composite wood for construction |
| JP2001262817A (en) * | 2000-03-17 | 2001-09-26 | Dantani Plywood Co Ltd | Base material for flooring |
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| KR100656539B1 (en) * | 2004-11-16 | 2006-12-11 | 충남대학교산학협력단 | Heat treatment by low melting alloy for innovation of soundboard of musical instruments |
| KR100688878B1 (en) * | 2004-12-29 | 2007-03-02 | 주식회사 엘지화학 | Plywood flooring and process for preparing the same |
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