JP5350817B2 - Printed circuit board base and electronic device manufacturing method - Google Patents

Description

  The present invention relates to a printed circuit board pedestal used for assembling electronic devices each including a plurality of printed circuits imposed on a printed circuit board, and an electronic device manufacturing method using the printed circuit board pedestal. .

  Of the production processes of electronic modules and packages that individually include a plurality of printed circuits imposed on a printed circuit board, for example, a dividing process for each printed circuit shown in FIG. 15, and its pre-process and post-process Many processes such as high-temperature function inspection, retrofitting of parts, installation of shield cases, application of nameplate labels, function inspection, and packaging are performed manually.

Such manual work has been used more frequently than before because it enables flexible response to start-up of new production, variation, and variable production, and inexpensive line design.
It is done manually.

  In addition, as prior art related to the invention of the present application, for example, as shown in Patent Document 1 to be described later, there are a plurality of recesses to which parts can be sucked, and the main body is moved by suction and sucked into these recesses. There is a tray that realizes a “tray part inspection method” by individually positioning parts with respect to a camera.

JP 2007-003326 A

  By the way, in the above-described conventional example, in order to keep the efficiency of the assembly process high, it is necessary to compress the gap between the tact times of the surface mount (SMT) process and the inline function inspection shown in FIG. For this reason, the maximum value of the number of printed circuits imposing on the printed circuit board (hereinafter referred to as “imposition number”) is limited to “4” or less.

  In addition, since reduction of work time and generation of defective products and prevention of outflow are achieved for each process, there is a limit in meeting strict demands for increase in production volume and cost reduction.

  An object of the present invention is to provide an electronic device manufacturing method capable of improving quality and environmental conservation in conjunction with the efficiency of the assembly process, and a printed circuit board base that realizes the electronic device manufacturing method. .

The invention according to claim 1 is a printed circuit board base for individually supporting a plurality of modules imprinted on the printed circuit board,
A space provided on the casing for each of the plurality of modules on the printed circuit board base;
A space where a blade provided for singulation of the plurality of modules acts on the printed circuit board on the printed circuit board base;
For each of the plurality of modules, a space necessary for maintaining a connection with a device used for a test on the printed circuit board base;
Of the space necessary for displaying on the printed circuit board base of serial numbers for a plurality of electronic devices individually including the plurality of modules,
Has multiple spaces.

The invention according to claim 2 is a printed circuit board base for individually supporting a plurality of modules imprinted on the printed circuit board,
A structure enabling a casing for each of the plurality of modules on the printed circuit board base;
A plurality of electronic devices individually including the plurality of modules, or a material, shape and size structure that also serves as a packaging material for components incorporated in the plurality of electronic devices;
It has the structure of both or any one of these.

A third aspect of the present invention is the printed circuit board base according to the first or second aspect, further comprising a stacking support member that supports the printed circuit board base at a position where a plurality of the printed circuit board bases can be stacked.

In the invention according to claim 4, in the process of manufacturing a plurality of electronic devices on the printed circuit board base according to any one of claims 1 to 3,
The printed circuit board base is reused for carrying in and / or transporting a plurality of modules impositioned on the printed circuit board and delivering them to the delivery destination of the plurality of electronic devices.

In the present invention, it is possible to set the number of imprints on the printed circuit board to a larger value than before, and the manufacturing process can be flexibly automated.
The printed circuit board base according to the present invention is used to realize a manufacturing process of a plurality of electronic devices as a collective operation or an in-line process, and can be used for transportation and transportation of these electronic devices.
In the present invention, the performance and reliability of a plurality of electronic devices are stably maintained high.

In the present invention, in the process of manufacturing an electronic apparatus to which the present invention is applied, the accuracy of component mounting and assembly is improved.
In the present invention, simplification and efficiency of the manufacturing process can be easily realized, and the manufacturing cost can be reduced.
In the present invention, it is not necessary to compress the difference in tact time between processes, and the production efficiency can be improved by setting the imposition number to a large value.

In the present invention, the test in the manufacturing process can be realized as an inline process.
In the present invention, the serial number can be displayed as an inline process.
In the present invention, unpacking work before parts are put into the manufacturing process is simplified or omitted, and labor saving, efficiency, and cost reduction of the manufacturing process are achieved.
In the present invention, manufacturing costs can be reduced, which contributes to effective use of resources.
Therefore, electronic devices manufactured by applying the present invention can be further reduced in price without being restricted by environmental problems due to improvements in quality and reliability as well as reduction in price.

It is a figure which shows the flow of the process in one Embodiment of this invention. FIG. 3 is a diagram (1) illustrating a configuration of a dedicated tray. FIG. 6 is a diagram (2) illustrating a configuration of a dedicated tray. It is a figure which shows the state before a shield case is attached. FIG. 2 is a diagram (1) showing an appearance of a shield case assembling jig.

FIG. 2 is a diagram (2) showing an appearance of a shield case assembling jig. It is a figure which shows the state in which the shield case was attached. It is a figure which shows the state which the batch division process completed. It is a figure which shows the positioning of an inspection apparatus, and a lower suppression member. It is a figure which shows the lower holding member which supports a printed circuit board.

It is a figure which shows the printed circuit board positioned on the exclusive tray for contact with a probe. It is a figure which shows the probe for a test | inspection. It is a figure which shows the module accommodated in a special tray and shipped. It is a figure which shows the mechanism of the exclusive tray which enables loading. It is a figure which shows the flow of the conventional production process.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 is a diagram showing a flow of steps in an embodiment of the present invention.
FIG. 2 is a diagram (1) showing the configuration of the dedicated tray.
FIG. 3 is a diagram (2) showing the configuration of the dedicated tray.

  The feature of this embodiment is that the dedicated tray 10 shown in FIG. 2 is used instead of the conventional tray, and as shown in FIG. 1 as a difference from FIG. 15, many processes are inline processes or batch operations. It is in a point to be realized.

  2 and 3, the dedicated tray 10 is formed (or cut) by a quadrangular frustum material whose imposition number is set to “15” which is significantly larger than the conventional tray and the thickness T is uniform. It has the following elements.

(1) A locking member 11 that protrudes most of the periphery of the side wall of the square frustum and that has a uniform thickness t (<T).
(2) Convex part 12 which protrudes with a predetermined thickness (= T / 2) in a region where the locking member 11 is not formed in the side wall of the truncated pyramid, and continues to the top of the truncated pyramid.

(3) Of the specific region, a recess 13 formed at a uniform depth (= T / 2) and connected to the bottom of the truncated pyramid.
(4) Storage that is a depression that is arranged in a lattice pattern in 3 rows × 5 columns corresponding to the number of impositions “15” on the top of the square pyramid and that is stored in a shield case that will be described later when loosely fitted. Parts 14-11-14-15, 14-21-14-25, 14-31-14-35

(5) Guide holes 15-1 and 15-2 which are formed on the locking member 11 and used for alignment of the dedicated tray 10.
(6) Lower holding holes 16-11 to 16-15 drilled in the central portion of the bottoms of the storage portions 14-11 to 14-15, 14-21 to 14-25, and 14-31 to 14-35, 16-21-16-25, 16-31-16-35

(7) Dividing holes (17-11a, 17-11b, 17-11b, 14-11 to 14-15, 14-21 to 14-25, 14-31 to 14-35) formed in the four corners of the bottom, respectively. 17-11c, 17-11d) to (17-15a, 17-15b, 17-15c, 17-15d), (17-21a, 17-21b, 17-21c, 17-21d) to (17-25a, 17-25b, 17-25c, 17-25d), (17-31a, 17-31b, 17-31c, 17-31d) to (17-35a, 17-35b, 17-35c, 17-35d)

(8) Notch 18 formed in part of locking member 11
(9) Alignment protrusions 19 formed in the vicinity of any of the storage portions 14-11 to 14-15, 14-21 to 14-25, and 14-31 to 14-35 among the tops of the square pyramid.

Hereinafter, among the side walls of the truncated pyramid, the side wall connected to both ends of the convex portion 12 is referred to as “upper side wall 10SU”, and the side wall continuous to both ends of the concave portion 13 is referred to as “lower side wall 10SL”. Called.
Further, the storage portions 14-11 to 14-15, 14-21 to 14-25, 14-31 to 14-35, and the lower holding holes 16-11 to 16-15, 16-21 to 16-25, 16-31 ˜16-35 indicate the correspondence with the above-described 3 rows × 5 columns grid arrangement by the two subscripts added to the reference numerals “14” and “16”. The reference numerals other than “14-11”, “14-35”, “16-11”, and “16-35” in FIG.

The dedicated tray 10 having such a configuration includes a mounting process of electronic components on fifteen printed circuits imprinted on a printed circuit board (hereinafter referred to as “20”), which will be described later, and these electronic components. It is used for both the packing process of 15 modules (packages) manufactured by mounting components.
The electronic component mounting process will be described below.

[Attaching the shield case]
Among the electronic components described above, 15 shield cases 21-11 to 21-15, 21-21 to 21-25, and 21-31 to 21-35, as shown in FIG. 14-15, 14-21 to 14-25, and 14-31 to 14-35.

On the other hand, as shown in FIG. 4, the printed circuit board 20 has an alignment hole 21 </ b> H having a shape and size that can be engaged with the alignment protrusion 19, and the 15 printed circuits (not shown) described above. Fifteen sets of fitting holes 22-11 to 22-15, 22-21 to 22-25, and 22-31 to 22-35 formed in an arrangement corresponding to these printed circuits are formed.
These fitting holes 22-11 to 22-15, 22-21 to 22-25, and 22-31 to 22-35 are described in the three lines described above by the two subscripts added to the reference numeral “22”. The correspondence with the grid-like arrangement of × 5 rows is shown, and in the following, the reference signs other than the reference numerals “22-11” and “22-35” on the drawing are omitted.

Electronic components other than the shield cases 21-11 to 21-15, 21-21 to 21-25, and 21-31 to 21-35 are mounted on the printed circuit board 20 in advance.
Further, as shown in FIG. 4, an alignment protrusion 19 is inserted into the alignment hole 20H at the top of the above-described quadrangular pyramid (hereinafter referred to as “the top of the dedicated tray 10”), and the fitting hole 22 − 11-22-15, 22-21-22-25, 22-31-22-35 and shield cases 21-11-21-21, 21-21-21-21, outside 21-31-21-35 The printed circuit board 20 is disposed in a state where all the corresponding portions of the housing can be fitted.

The printed circuit board 20, shield cases 21-11 to 21-15, 21-21 to 21-25, 21-31 to 21-35 and the dedicated tray 10 are shown in FIG. Set on the mounting jig 30.
The shield case attaching jig 30 is arranged so that the shield cases 21-11 to 21-15, 21-21 to 21-25, and 21-31 to 21-35 come into contact with the top of the dedicated tray 10 uniformly. Then, the printed circuit board 20 is pressurized.

Therefore, the shield cases 21-11 to 21-15, 21-21 to 21-25, and 21-31 to 21-35 are fitted into the fitting holes 22-11 to 22-15, 22 as shown in FIGS. -21 to 22-25 and 22-31 to 22-35, and attached to the printed circuit board 20 (FIG. 1 (1)).
In addition, as shown in FIG. 6, the above-described pressurization is dispersed by a large number of protrusions provided on the shield case mounting jig 30 in an arrangement that does not contact any electronic component mounted on the printed circuit board 20. Realized by applied force.
Hereinafter, items common to all elements are described by adding “C”, “c”, and “x” as first to third subscripts to the reference numerals of the corresponding elements.

[Division of printed circuit board]
In the printed circuit board dividing step, the printed circuit board 20, the shield cases 21-11 to 21-15, 21-21 to 21-25, and 21-31 to 21-35 are placed on the dedicated tray 10 as shown in FIG. In the arranged state, it is set on a substrate divider (not shown).
The substrate dividing machine has one blade whose blade edge can come into contact with one surface of the printed circuit board 20 through the dividing hole 17-Ccx, and the other blade edge that faces the other edge of the printed circuit board 20 on the blade edge. Compress the distance between the blades. Therefore, the printed circuit board 20 is cut as shown in FIG. 8 and divided into electronic modules each including 15 printed circuits (FIG. 1 (2)).

[Inline function inspection]
In the inline function inspection process, the printed circuit board 20, the shield cases 21-11 to 21-15, 21-21 to 21-25, and 21-31 to 21- which have completed the above-described shield case mounting process and printed circuit board dividing process. 35 is turned over in a state of being placed on the dedicated tray 10 and set in the inspection apparatus 40 as shown in FIG.

In addition, the test | inspection apparatus 40 has the following members in the top part, as shown in FIG.
(1) Two posts 41-1 and 41-2 erected at positions corresponding to the guide holes 15-1 and 15-2 described above
(2) As shown in FIG. 10, lower pressing members 42-11 to 42-15, 42-21 to 42-25 erected at positions corresponding individually to substantially the center of the lower pressing hole 16 -Cc, 42-31〜42-35

  In a state where the dedicated tray 10 (including the printed circuit board 20 and the like) is set with respect to the inspection apparatus 40, the dedicated tray 10 is placed on the guide holes 15-1 and 15-2 described above on the post 41 in the inspection apparatus 40. -1 and 41-2 are fixed in a fitted state. Further, the printed circuit board 20 is supported not only by the dedicated tray 10 but also by the top portion of the lower pressing member 42-Cc that is in contact with the lower pressing hole 16-Ccx described above.

  Furthermore, as shown in FIG. 11, the dedicated tray 10 and the printed circuit board 20 are conveyed by the conveyor 51 to a position where connection with an inspection device (not shown) used for in-line function inspection is possible.

  By the way, connection parts such as pins for realizing connection with the inspection apparatus are attached to the printed circuit board 20 in advance.

  When the dedicated tray 10 and the printed circuit board 20 are fixed at the above-described positions, they are connected to the inspection apparatus 4- via a probe 52 disposed so as to be in contact with such a connection component as shown in FIG. The

  The inspection apparatus is connected to the printed circuit board 20 via the probe, outputs signals and data based on a predetermined procedure, and determines whether the response obtained for these signals and data is correct or not. Then, the function of the module individually including the printed circuit imposed on the printed circuit board 20 is inspected (FIG. 1 (3)).

[Inline serial number printing]
The 15 modules for which the inline function inspection has been normally completed are delivered to the inline serial number printing process by the conveyor 51 while being arranged on the dedicated tray 10.
When the dedicated tray 10 is handed over, the serial number printing device (not shown), for example, has the above-described lower presser holes 16 formed on all the tops of the shield cases 21-Cc arranged on the dedicated tray 10. Print a unique serial number (including information that enables traceability) via -Cc (Fig. 1 (4)).

〔packing〕
As shown in FIG. 13, the dedicated tray 10 for which the inline serial number printing process has been completed is stacked in the following state and then packed (FIG. 1 (5)).
(1) As shown in FIG. 14, the two dedicated trays 10 stacked adjacent to each other have the upper side wall 10SU of the lower dedicated tray fitted to the lower side wall 10SL of the upper dedicated tray.
(2) Further, the convex portion 12 of the lower dedicated tray is fitted into the concave portion 13 of the upper dedicated tray.

[Final inspection and shipment]
In each of the dedicated trays packed in this way, the 15 modules described above are stored without being separated. These dedicated trays are shipped to a delivery destination after a predetermined final inspection (FIG. 1 (6)). (Fig. 1 (7))

[Collection and reuse of dedicated trays]
The delivery destination uses the delivered package in the production line while being stored on the dedicated tray 10, and then returns the dedicated tray 10 (FIG. 1 (8)).

  The special tray 10 thus returned is supplied to the manufacturer of the shield case 21-Cc described above (FIG. 1 (9)). The manufacturer stores the shield case to be delivered next in the dedicated tray 10 supplied in this way and delivers it (FIG. 1 (10)).

  That is, the shield case 21-Cc, which is an electronic component to be attached to the printed circuit board 20, is stored in advance in the dedicated tray 10 and delivered, and is configured to include 15 printed circuits imposed on the printed circuit board 20. For any module, all of the following processes are realized as a batch operation or an inline process on the dedicated tray 10.

(1) Shield case installation process
(2) PCB division process
(3) Function inspection process
(4) Production number printing process

Further, as indicated by a broken line in FIG. 1, the dedicated tray 10 is used as a packaging material for the module and is recycled (reused) in cooperation with the manufacturer of the shield case 21-Cc.
Therefore, according to the present embodiment, unlike the conventional example, the number of impositions is not limited to a small value in order to reduce the difference in tact time between the surface mounting process and the inline function inspection.

In the present embodiment, as the number of impositions is set larger, the loading time is shortened, and all of the above steps (1) to (4) are performed without human intervention.
Therefore, along with cost reduction, quality and reliability are improved, and the possibility of automation of the manufacturing process is expanded.
Further, in the present embodiment, in conjunction with the attachment of the retrofitting parts in the above steps (1) to (4), buffering via a magazine rack or the like between these steps can be realized flexibly, and FIG. ), The high-temperature function inspection preceding the shield case attachment process can also be realized as an inline process.

  In addition, according to the present embodiment, the dedicated tray 10 also serves as a packaging material and is reused (recycled), thereby protecting the environment.

In the present embodiment, the dedicated tray 10 may be configured as follows.
(1) The shield case 21-Cc is made of a material, shape, and dimensions that have sufficient rigidity so as not to be damaged or worn by the force applied when the shield case 21-Cc is attached.
(2) Consists of materials, shapes, and dimensions that keep the thermal coupling between the outside of the returnable box and the package described above during transportation sufficiently low.

(3) Highly storable in a returnable box, and is made of a material having sufficient buffering properties, elasticity, and resilience, such as polyethylene material.
(4) Consists of materials, shapes, and dimensions that are suitable for reuse and can reduce weight and reduce transportation costs.

(5) Consists of anti-static (non-charging) material.
(6) It is composed of materials, shapes and dimensions that are inexpensive and have a low environmental impact to the extent that reuse is not necessary.

(7) Consists of shapes and dimensions that minimize the space occupied by the returnable box.
(8) Consists of shapes and dimensions that allow easy in-process repair.
(9) Consists of materials, shapes, and dimensions suitable for the production line at the package delivery destination described above.

In the present embodiment, the dedicated tray 10 may not be returned by the delivery destination of the module described above, or may not be supplied to the shield case manufacturer by the manufacturer of the module. ) And the subject of payment may be anything.
Furthermore, any module may be manufactured based on the present embodiment.

In the present embodiment, the number of impositions is not limited to “15”, and may be set to a large value such as “24” to “32” for the purpose of improving production efficiency.
Furthermore, in this embodiment, the shape of the dedicated tray 10 does not have to be a tray shape, functions as a pedestal for conveyance between processes or between factories / delivery destinations, and a desired effect is achieved. For example, it may have any shape such as a plate shape.

In the present embodiment, the dedicated tray 10 may be supplied by any one other than the manufacturer who manufactures the module described above.
Further, since the shield case 21-Cc is a kind of components attached to the printed circuit board 20 on the dedicated tray 10, the present invention is similarly applied to the manufacture of a module that does not include the shield case 21-Cc. Is possible.

  Further, the present invention is not limited to the above-described embodiments, and various configurations of the embodiments are possible within the scope of the present invention, and any improvements may be made to all or some of the components.

Hereinafter, the operational effects of the invention disclosed in the present application will be listed in a format according to the descriptions in the columns of “Claims” and “Means for Solving the Problems”.

Many of the assembly processes of a plurality of electronic devices to which the present invention is applied are realized as a batch operation or an inline process on a printed circuit board base.
Therefore, it is possible to set the number of imprints on the printed circuit board to a larger value than before, and in addition to cost reduction, the quality and reliability can be improved, and the manufacturing process can be flexibly automated.

The printed circuit board base according to the present invention is used to realize the manufacturing process of the plurality of electronic devices as a collective operation or an in-line process, and can be used for transportation and transportation of these electronic devices.

According to the present invention, in a manufacturing process, a transport process, and a transport process of a plurality of electronic devices that are arranged on or stored in a printed circuit board, these electronic devices may fail due to static electricity, or the characteristics may deteriorate. The property is kept low.
Therefore, the performance and reliability of the plurality of electronic devices are stably maintained high.

According to the present invention, it becomes possible for a plurality of electronic devices to appropriately and accurately store and position components necessary for each manufacturing process.
Therefore, in the process of manufacturing an electronic apparatus to which the present invention is applied, the accuracy of component mounting and assembly is improved.

The printed circuit board base according to the present invention, either during tightening or Module Installation according set pressure, rigid to withstand the forces applied through the PCB or multiple modules.
That is, the mounting of the module performed by caulking or pressing is realized without the printed circuit board being supported by a member other than the printed circuit board base according to the present invention.
Therefore, simplification and efficiency of the manufacturing process can be easily realized, and the manufacturing cost can be reduced.

According to the present invention, the division of the individual printed circuits imposed on the printed circuit board can be realized as a batch operation on the printed circuit board base according to the present invention, and the subsequent processes are also performed on the printed circuit board base. It is realized as a batch operation or an inline process.
Therefore, the difference in tact time between processes is not required, and the production efficiency can be increased by setting the imposition number to a large value.

According to the present invention, testing of a plurality of electronic devices can be realized in a state of being arranged on the printed circuit board base according to the present invention.
Therefore, such a test is appropriately realized as an inline process in a manufacturing process performed as a batch operation or an inline process on a printed circuit board base.

According to the present invention, the display of the serial number can be realized in a state where any of the plurality of electronic devices is arranged on the printed circuit board base according to the present invention.
Therefore, the display of the serial number is appropriately realized as an inline process in a manufacturing process performed as a batch operation or an inline process on the printed circuit board base.

According to the present invention, it can be realized as a batch operation or in-line process in a printed circuit board on the base also serving as a packing material of a module to be incorporated into a plurality of electronic devices.
Therefore, the unpacking operation before parts are put into the plurality of manufacturing processes is simplified or omitted, and labor saving, efficiency and cost reduction of the manufacturing process are achieved.

According to the present invention, a plurality of electronic devices can be packed together with the printed circuit board base while being accommodated on the printed circuit board base according to the present invention.
Therefore, labor saving, efficiency improvement, and cost reduction of the packing work are possible.

The printed circuit board base according to the present invention can be used for a manufacturing process over a plurality of times.
Therefore, the manufacturing cost can be reduced, which contributes to effective use of resources.

According to the present invention, many of the assembly processes of a plurality of electronic devices are realized as a batch operation or an inline process on a printed circuit board base.
Therefore, it is possible to set the number of imprints on the printed circuit board to a larger value than before, and in addition to cost reduction, the quality and reliability can be improved, and the manufacturing process can be flexibly automated.

According to the present invention, the printed circuit board pedestal is transported or transported in a state of being loaded together with a plurality of other electronic devices stored in other printed circuit board pedestals while the plurality of electronic devices are stored in the printed circuit board pedestal. Provided.
Therefore, the printed circuit board base according to the present invention is used to realize the manufacturing process of the plurality of electronic devices as a collective operation or an inline process, and can also be used for transportation and transportation of these electronic devices.

According to the present invention, it can be realized as a batch operation or in-line process on multiple printed circuit board pedestal components are carried is accommodated to be incorporated in electronic equipment.
Therefore, the unpacking operation before parts are put into the plurality of manufacturing processes is simplified or omitted, and labor saving, efficiency and cost reduction of the manufacturing process are possible.

According to the present invention, Ru is in used in printed circuit board pedestal transport to delivery destination of the plurality of electronic devices.
That is, a plurality of electronic devices can be packed together with the printed circuit board base while being stored on the printed circuit board base according to the present invention.
Therefore, labor saving, efficiency improvement, and cost reduction of the packing work are possible.

10 Dedicated tray 10SL Lower side wall 10SU Upper side wall 11 Locking member 12 Convex part 13 Concave part

14 Guide hole 15 Storage part 16 Lower holding hole 17 Dividing hole 18 Notch part 19 Protrusion

20 Printed Circuit Board 20H Alignment Hole 21 Shield Case 22 Mating Hole 30 Shield Case Mounting Jig 40 Inspection Device

41 Post 42 Lower holding member 51 Conveyor 52 Probe

Claims (4)

A printed circuit board pedestal for individually supporting a plurality of modules mounted on the printed circuit board,
A space provided on the casing for each of the plurality of modules on the printed circuit board base;
A space where a blade provided for singulation of the plurality of modules acts on the printed circuit board on the printed circuit board base;
For each of the plurality of modules, a space necessary for maintaining a connection with a device used for a test on the printed circuit board base;
Of the space necessary for displaying on the printed circuit board base of serial numbers for a plurality of electronic devices individually including the plurality of modules,
A printed circuit board base having a plurality of spaces . A printed circuit board pedestal for individually supporting a plurality of modules mounted on the printed circuit board,
A structure enabling a casing for each of the plurality of modules on the printed circuit board base;
A plurality of electronic devices individually including the plurality of modules, or a material, shape and size structure that also serves as a packaging material for components incorporated in the plurality of electronic devices;
A printed circuit board base having the structure of either or both of the above . In the printed circuit board base according to claim 1 or 2,
A stacking support member for supporting the printed circuit board base at a position where a plurality of sheets can be stacked;
A printed circuit board base characterized by that. An electronic device manufacturing method for manufacturing a plurality of electronic devices on the printed circuit board base according to any one of claims 1 to 3,
The printed circuit board base is reused for carrying in and / or transporting a plurality of modules that are impositioned on a printed circuit board and delivering them to a delivery destination of the plurality of electronic devices. An electronic device manufacturing method.