JP5335514B2 - Coating device - Google Patents

Coating device Download PDF

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Publication number
JP5335514B2
JP5335514B2 JP2009078204A JP2009078204A JP5335514B2 JP 5335514 B2 JP5335514 B2 JP 5335514B2 JP 2009078204 A JP2009078204 A JP 2009078204A JP 2009078204 A JP2009078204 A JP 2009078204A JP 5335514 B2 JP5335514 B2 JP 5335514B2
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Prior art keywords
substrate
ejection
inert gas
coating apparatus
scanning direction
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JP2010227824A (en
Inventor
毅 松家
幹雄 増市
幸宏 高村
理史 川越
秀一 相良
隆介 伊藤
宗明 大宅
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Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
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Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
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Priority to JP2009078204A priority Critical patent/JP5335514B2/en
Priority to KR1020100022211A priority patent/KR101204577B1/en
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Abstract

PURPOSE: A coating device and a method of controlling the discharge of inert gas are provided to reduce the usage amount of the inert gas for controlling the adsorption of the moisture and the oxidation of flowable materials. CONSTITUTION: A coating device(1) comprises the following: a substrate holding unit holding a substrate(9); an extruding unit extruding flowable materials to the main surface of a substrate(91); a moving unit moving the extruding unit to the horizontal main scanning direction; a cover unit including an inert gas ejection unit spraying inert gas to the flowable materials, and a jet surface(211) covering the main surface; and an ejection range controller.

Description

本発明は、基板に流動性材料を塗布する塗布装置に関する。   The present invention relates to a coating apparatus that applies a fluid material to a substrate.

従来より、有機ＥＬ（Electro Luminescence）材料を利用した有機ＥＬ表示装置の開発が行われており、例えば、高分子有機ＥＬ材料を用いたアクティブマトリックス駆動方式の有機ＥＬ表示装置の製造では、ガラス基板（以下、単に「基板」という。）に対して、ＴＦＴ（Thin Film Transistor）回路の形成、陽極となるＩＴＯ（Indium Tin Oxide）電極の形成、隔壁の形成、正孔輸送材料を含む流動性材料（以下、「正孔輸送液」という。）の塗布、加熱処理による正孔輸送層の形成、有機ＥＬ材料を含む流動性材料（以下、「有機ＥＬ液」という。）の塗布、加熱処理による有機ＥＬ層の形成、陰極の形成、および、絶縁膜の形成が順次行われる。   2. Description of the Related Art Conventionally, an organic EL display device using an organic EL (Electro Luminescence) material has been developed. For example, in the production of an active matrix drive type organic EL display device using a polymer organic EL material, a glass substrate is used. (Hereinafter simply referred to as “substrate”), formation of TFT (Thin Film Transistor) circuits, formation of ITO (Indium Tin Oxide) electrodes as anodes, formation of barrier ribs, fluid materials including hole transport materials (Hereinafter referred to as “hole transport liquid”), formation of a hole transport layer by heat treatment, flowable material containing an organic EL material (hereinafter referred to as “organic EL liquid”), heat treatment An organic EL layer is formed, a cathode is formed, and an insulating film is formed in sequence.

有機ＥＬ表示装置の製造において、正孔輸送液または有機ＥＬ液を基板に塗布する装置として、例えば、特許文献１および特許文献２に示されるように、流動性材料を連続的に吐出する複数のノズルを、基板に対して主走査方向および副走査方向に相対移動することにより、基板上に流動性材料をストライプ状に塗布する装置が知られている。また、特許文献３のように、インクジェット方式にて流動性材料の微小液滴を基板に向けて吐出することにより基板上に流動性材料を塗布する装置も知られている。   In the manufacture of an organic EL display device, as a device for applying a hole transport liquid or an organic EL liquid to a substrate, for example, as shown in Patent Document 1 and Patent Document 2, a plurality of materials that continuously discharge a flowable material are used. 2. Description of the Related Art There is known an apparatus for applying a flowable material in a stripe shape on a substrate by moving a nozzle relative to the substrate in a main scanning direction and a sub scanning direction. Further, as in Patent Document 3, there is also known an apparatus for applying a fluid material on a substrate by discharging fine droplets of the fluid material toward the substrate by an inkjet method.

特許文献１ないし特許文献３では、基板上に塗布される流動性材料の酸化による品質劣化を防止するために、流動性材料の塗布に係る機構全体を不活性ガス雰囲気（すなわち、低酸素雰囲気）とされた密閉装置内に収容し、当該密閉装置内にて流動性材料の塗布を行う技術が開示されている。   In Patent Document 1 to Patent Document 3, in order to prevent quality deterioration due to oxidation of the fluid material applied on the substrate, the entire mechanism related to the application of the fluid material is treated with an inert gas atmosphere (that is, a low oxygen atmosphere). The technique which accommodates in the said sealing device and apply | coats a fluid material in the said sealing device is disclosed.

特開２００７−２２９５４２号公報JP 2007-229542 A 特開２００７−２６０６００号公報JP 2007-260600 A 特開２００３−２１７８４０号公報JP 2003-217840 A

ところで、特許文献１ないし特許文献３の装置では、流動性材料の塗布に係る機構全体が密閉装置内に収容されるため、装置全体が大型化するとともに、装置に対する基板の搬出入に係る構造が複雑化してしまう。また、大型の密閉装置に不活性ガスを充填する必要があるため、不活性ガスが大量に必要となり、有機ＥＬ表示装置の製造コストが増大してしまう。   By the way, in the apparatus of patent document 1 thru | or patent document 3, since the whole mechanism which concerns on application | coating of a fluid material is accommodated in a sealing apparatus, while the whole apparatus enlarges, the structure which concerns on carrying in / out of the board | substrate with respect to an apparatus is provided. It becomes complicated. Moreover, since it is necessary to fill a large sealing device with an inert gas, a large amount of the inert gas is required, and the manufacturing cost of the organic EL display device increases.

本発明は、上記課題に鑑みなされたものであり、塗布装置における不活性ガスの使用量を低減することを目的としている。   This invention is made | formed in view of the said subject, and aims at reducing the usage-amount of the inert gas in a coating device.

請求項１に記載の発明は、基板に流動性材料を塗布する塗布装置であって、基板を保持する基板保持部と、前記基板の主面に向けて流動性材料を吐出する吐出機構と、前記吐出機構を前記主面に平行な主走査方向に前記基板に対して相対的に移動するとともに、前記主走査方向への移動が行われる毎に前記基板を前記吐出機構に対して前記主走査方向に垂直かつ前記主面に平行な副走査方向に相対的に移動する移動機構と、前記副走査方向における前記基板の相対移動方向前側において前記吐出機構に隣接して配置され、前記基板の前記主面に塗布された前記流動性材料に向けて不活性ガスを噴出する不活性ガス噴出機構とを備え、前記不活性ガス噴出機構が、前記基板の前記主面に垂直な方向に関して前記基板から離間しつつ前記主面を前記主走査方向の全長に亘って覆うとともに不活性ガスの噴出領域が変更可能な噴出面を有するカバー部と、前記基板の前記副走査方向への相対移動に伴って前記基板の前記主面と前記噴出面との重複面積が増大するに従って、前記噴出面における前記噴出領域を、前記基板の前記相対移動方向前側へと拡大する噴出領域制御部とを備える。   The invention according to claim 1 is a coating apparatus that applies a fluid material to a substrate, a substrate holding portion that holds the substrate, a discharge mechanism that discharges the fluid material toward the main surface of the substrate, The ejection mechanism moves relative to the substrate in a main scanning direction parallel to the main surface, and each time the movement in the main scanning direction is performed, the substrate is moved relative to the ejection mechanism. A moving mechanism that moves in a sub-scanning direction that is perpendicular to the direction and parallel to the main surface, and is disposed adjacent to the ejection mechanism on the front side in the relative movement direction of the substrate in the sub-scanning direction. An inert gas ejection mechanism that ejects an inert gas toward the flowable material applied to the main surface, the inert gas ejection mechanism from the substrate in a direction perpendicular to the main surface of the substrate Front side facing away from the main surface A cover portion that covers the entire length in the main scanning direction and has an ejection surface in which the ejection area of the inert gas can be changed, and the main surface of the substrate and the substrate along with relative movement of the substrate in the sub-scanning direction A jetting region control unit that expands the jetting region on the jetting surface to the front side in the relative movement direction of the substrate as the overlapping area with the jetting surface increases;

請求項２に記載の発明は、請求項１に記載の塗布装置であって、前記副走査方向に互いに隣接して配列されるとともにそれぞれが前記基板の前記主走査方向の全長に亘る複数の噴出口が前記カバー部の前記噴出面に設けられ、前記噴出領域制御部により前記複数の噴出口への前記不活性ガスの供給が個別に制御され、前記基板の前記副走査方向への相対移動に伴って前記基板の前記主面と前記噴出面との重複面積が増大するに従って、前記複数の噴出口からの前記不活性ガスの噴出が、前記基板の相対移動方向後側の噴出口から前記相対移動方向前側の噴出口に向かって順次開始される。 A second aspect of the present invention is the coating apparatus according to the first aspect, wherein a plurality of jets are arranged adjacent to each other in the sub-scanning direction and each of the plurality of jets extends over the entire length of the substrate in the main scanning direction. An outlet is provided on the ejection surface of the cover portion, and the supply of the inert gas to the plurality of ejection ports is individually controlled by the ejection area control unit, so that the substrate is relatively moved in the sub-scanning direction. Accordingly, as the overlapping area between the main surface of the substrate and the ejection surface increases, the ejection of the inert gas from the plurality of ejection ports is caused to occur relative to the relative ejection direction from the ejection port on the rear side in the relative movement direction of the substrate. It is sequentially started toward the jet outlet on the front side in the moving direction.

請求項３に記載の発明は、請求項２に記載の塗布装置であって、前記複数の噴出口からそれぞれ噴出する前記不活性ガスの単位面積当たりの流量が互いに等しい。   A third aspect of the present invention is the coating apparatus according to the second aspect, wherein the flow rates per unit area of the inert gas ejected from the plurality of ejection ports are equal to each other.

請求項４に記載の発明は、請求項１に記載の塗布装置であって、前記不活性ガス噴出機構が、前記噴出面に対向することにより前記噴出面からの不活性ガスの噴出を部分的に遮る遮蔽板をさらに備え、前記基板の前記副走査方向への相対移動に伴って前記基板の前記主面と前記噴出面との重複面積が増大するに従って、前記噴出領域制御部により、前記遮蔽板による前記噴出面全体の遮蔽が前記基板の相対移動方向後側から前記相対移動方向前側に向かって順次開放される。 A fourth aspect of the present invention is the coating apparatus according to the first aspect, wherein the inert gas ejection mechanism partially ejects the inert gas from the ejection surface by facing the ejection surface. A shielding plate for shielding, and as the overlapping area of the main surface of the substrate and the ejection surface increases with relative movement of the substrate in the sub-scanning direction, the ejection region control unit causes the shielding to occur. Shielding of the entire ejection surface by the plate is sequentially opened from the rear side in the relative movement direction of the substrate toward the front side in the relative movement direction.

請求項５に記載の発明は、請求項４に記載の塗布装置であって、前記遮蔽板が、前記副走査方向に互いに隣接して配列されるとともにそれぞれが前記噴出面の前記主走査方向の全長に亘る板状であって前記主走査方向に平行な回転軸を中心として回転する複数の遮蔽要素を備え、前記複数の遮蔽要素のうち最も前記相対移動方向後側に位置する遮蔽要素である後端遮蔽要素が回転して前記噴出面の一部が開放される際に、前記後端遮蔽要素が、前記基板の前記主面に垂直な方向に関して前記基板の前記主面に近づくに従って前記相対移動方向後側に向かう姿勢とされることにより、前記後端遮蔽要素近傍において前記基板の前記主面に垂直な方向に関して前記基板の前記主面に向かうとともに前記相対移動方向後側に向かう前記不活性ガスの流れが形成される。 A fifth aspect of the present invention is the coating apparatus according to the fourth aspect, wherein the shielding plates are arranged adjacent to each other in the sub-scanning direction and each of the ejection surfaces is in the main scanning direction. It is a shielding element that has a plate shape extending over its entire length and includes a plurality of shielding elements that rotate about a rotation axis that is parallel to the main scanning direction, and is located most on the rear side in the relative movement direction among the plurality of shielding elements. When the rear end shielding element rotates and a part of the ejection surface is opened, the rear end shielding element moves toward the main surface of the substrate in a direction perpendicular to the main surface of the substrate. With the posture toward the rear side in the movement direction, in the vicinity of the rear end shielding element, the non-direction toward the main surface of the substrate and the rear side in the relative movement direction with respect to a direction perpendicular to the main surface of the substrate. Of active gas Les is formed.

請求項６に記載の発明は、請求項１ないし５のいずれかに記載の塗布装置であって、前記基板保持部または前記不活性ガス噴出機構の前記カバー部が、前記基板の前記主面と前記カバー部の前記噴出面との間の空間を前記主走査方向の両側から覆う側板を備える。 Invention of Claim 6 is a coating device in any one of Claim 1 thru | or 5, Comprising: The said holding | maintenance part or the said cover part of the said inert gas ejection mechanism is the said main surface of the said board | substrate. A side plate that covers the space between the cover portion and the ejection surface from both sides in the main scanning direction is provided.

請求項７に記載の発明は、請求項１ないし６のいずれかに記載の塗布装置であって、前記不活性ガス噴出機構が、前記カバー部と前記吐出機構との間に配置されるとともに前記基板の前記主走査方向の全長に亘るスリット状の噴出口から、前記基板の前記主面に向けて前記噴出面からの前記不活性ガスの噴出速度よりも高速にて不活性ガスを噴出するスリット噴射部をさらに備える。   A seventh aspect of the present invention is the coating apparatus according to any one of the first to sixth aspects, wherein the inert gas ejection mechanism is disposed between the cover portion and the discharge mechanism. A slit that ejects an inert gas at a higher speed than the ejection speed of the inert gas from the ejection surface toward the main surface of the substrate from a slit-like ejection port extending over the entire length of the substrate in the main scanning direction. An injection part is further provided.

請求項８に記載の発明は、請求項７に記載の塗布装置であって、前記不活性ガス噴出機構が、前記スリット噴射部と前記吐出機構との間に配置されてガスを吸引する吸引機構をさらに備える。   Invention of Claim 8 is a coating device of Claim 7, Comprising: The suction mechanism in which the said inert gas ejection mechanism is arrange | positioned between the said slit injection part and the said discharge mechanism, and attracts | sucks gas Is further provided.

請求項９に記載の発明は、請求項１ないし８のいずれかに記載の塗布装置であって、前記噴出面の前記副走査方向の長さが、前記基板の前記主面の前記副走査方向の長さよりも長い。 A ninth aspect of the present invention is the coating apparatus according to any one of the first to eighth aspects , wherein the length of the ejection surface in the sub-scanning direction is the sub-scanning direction of the main surface of the substrate. Longer than the length of.

請求項１０に記載の発明は、請求項１ないし９のいずれかに記載の塗布装置であって、前記吐出機構近傍において前記基板の前記主面に向かう空気の流れが形成されており、前記不活性ガス噴出機構が、前記噴出面の前記基板の相対移動方向後側の端部近傍において前記空気の流れの中に配置されるとともに前記基板の前記主面に近づくに従って前記相対移動方向後側に向かう傾斜面を有する。 A tenth aspect of the present invention is the coating apparatus according to any one of the first to ninth aspects, wherein an air flow toward the main surface of the substrate is formed in the vicinity of the discharge mechanism. An active gas ejection mechanism is disposed in the air flow in the vicinity of the end of the ejection surface on the rear side in the relative movement direction of the substrate, and further toward the rear side in the relative movement direction as it approaches the main surface of the substrate. Has an inclined surface to face.

本発明では、不活性ガスの使用量を低減することができる。また、請求項２ないし５の発明では、簡素な構造で不活性ガスの噴出制御を行うことができる。請求項６の発明では、不活性ガスの使用量をさらに低減することができる。   In the present invention, the amount of inert gas used can be reduced. Further, in the inventions according to claims 2 to 5, it is possible to control the ejection of the inert gas with a simple structure. In the invention of claim 6, the amount of the inert gas used can be further reduced.

第１の実施の形態に係る塗布装置の平面図である。It is a top view of the coating device concerning a 1st embodiment. 塗布装置の断面図である。It is sectional drawing of a coating device. 不活性ガス噴出機構の断面図である。It is sectional drawing of an inert gas ejection mechanism. カバー部の底面図である。It is a bottom view of a cover part. 塗布装置の断面図である。It is sectional drawing of a coating device. 塗布装置の断面図である。It is sectional drawing of a coating device. 塗布装置の断面図である。It is sectional drawing of a coating device. 塗布装置の断面図である。It is sectional drawing of a coating device. 不活性ガスの流量と経過時間との関係を示す図である。It is a figure which shows the relationship between the flow volume of an inert gas, and elapsed time. 塗布装置の断面図である。It is sectional drawing of a coating device. 塗布装置の断面図である。It is sectional drawing of a coating device. 塗布装置の断面図である。It is sectional drawing of a coating device. 塗布装置の一部を示す断面図である。It is sectional drawing which shows a part of coating device. 第２の実施の形態に係る塗布装置の断面図である。It is sectional drawing of the coating device which concerns on 2nd Embodiment. 第３の実施の形態に係る塗布装置の断面図である。It is sectional drawing of the coating device which concerns on 3rd Embodiment. 塗布装置の断面図である。It is sectional drawing of a coating device. 塗布装置の断面図である。It is sectional drawing of a coating device. 塗布装置の断面図である。It is sectional drawing of a coating device. 塗布装置の断面図である。It is sectional drawing of a coating device. 塗布装置の断面図である。It is sectional drawing of a coating device. 塗布装置の一部を示す断面図である。It is sectional drawing which shows a part of coating device. 塗布装置の一部を示す断面図である。It is sectional drawing which shows a part of coating device. 塗布装置の一部を示す断面図である。It is sectional drawing which shows a part of coating device. 塗布装置の一部を示す断面図である。It is sectional drawing which shows a part of coating device. 塗布装置の一部を示す断面図である。It is sectional drawing which shows a part of coating device. 塗布装置の一部を示す断面図である。It is sectional drawing which shows a part of coating device. 塗布装置の一部を示す断面図である。It is sectional drawing which shows a part of coating device. 塗布装置の一部を示す断面図である。It is sectional drawing which shows a part of coating device. 塗布装置の断面図である。It is sectional drawing of a coating device. 塗布装置の断面図である。It is sectional drawing of a coating device. 塗布装置の断面図である。It is sectional drawing of a coating device. 塗布装置の断面図である。It is sectional drawing of a coating device. 塗布装置の断面図である。It is sectional drawing of a coating device. 塗布装置の断面図である。It is sectional drawing of a coating device. 不活性ガス噴出機構の底面図である。It is a bottom view of an inert gas ejection mechanism. 不活性ガス噴出機構の底面図である。It is a bottom view of an inert gas ejection mechanism. 塗布装置の断面図である。It is sectional drawing of a coating device. 塗布装置の断面図である。It is sectional drawing of a coating device.

図１は、本発明の第１の実施の形態に係る塗布装置１を示す平面図であり、図２．Ａは塗布装置１を図１中のＡ−Ａの位置にて切断した断面図である。また、図２．Ｂは、図２．Ａの一部を拡大して示す図である。図２．Ａでは、図の理解を容易にするために、断面よりも手前側の構造の一部、および、移動後の基板９および基板保持部１１を二点鎖線にて示しており、また、断面への平行斜線への付与を省略している（後述する他の断面図においても同様）。塗布装置１は、平面表示装置用のガラス基板９（以下、単に「基板９」という。）に、平面表示装置用の画素形成材料を含む流動性材料を塗布する装置である。塗布装置１は、空気中に設置されており、塗布装置１の上方から下方に向かう（すなわち、（＋Ｚ）側から（−Ｚ）方向へと向かう）空気の流れが形成されている。本実施の形態では、塗布装置１において、アクティブマトリックス駆動方式の有機ＥＬ（Electro Luminescence）表示装置用の基板９に、有機ＥＬ材料を含む流動性材料（以下、「有機ＥＬ液」という。）が塗布される。   1 is a plan view showing a coating apparatus 1 according to a first embodiment of the present invention, and FIG. A is a cross-sectional view of the coating apparatus 1 taken along the line AA in FIG. In addition, FIG. B is shown in FIG. It is a figure which expands and shows a part of A. FIG. In A, in order to facilitate understanding of the drawing, a part of the structure on the near side of the cross section, and the substrate 9 and the substrate holding part 11 after the movement are indicated by a two-dot chain line. Is omitted from the parallel oblique lines (the same applies to other cross-sectional views described later). The coating apparatus 1 is an apparatus that applies a flowable material including a pixel forming material for a flat display device to a glass substrate 9 for flat display devices (hereinafter simply referred to as “substrate 9”). The coating device 1 is installed in the air, and an air flow is formed from the top to the bottom of the coating device 1 (that is, from the (+ Z) side to the (−Z) direction). In the present embodiment, in the coating apparatus 1, a fluid material containing an organic EL material (hereinafter referred to as “organic EL liquid”) is provided on a substrate 9 for an organic EL (Electro Luminescence) display device of an active matrix driving system. Applied.

図１および図２．Ａに示すように、塗布装置１は、基板９を保持する基板保持部１１、基板保持部１１を基板９の両主面に平行な所定の方向（すなわち、図１中のＹ方向であり、以下、「副走査方向」という。）に水平移動する基板移動機構１２、基板保持部１１に保持された基板９の（＋Ｚ）側の主面９１（以下、「上面９１」という。）に向けて流動性材料を吐出する吐出機構である塗布ヘッド１４、および、塗布ヘッド１４を基板９の上面９１に平行かつ副走査方向に垂直な方向（すなわち、図１中のＸ方向であり、以下、「主走査方向」という。）に水平移動するヘッド移動機構１５を備える。ヘッド移動機構１５は、基板保持部１１および基板移動機構１２を跨いで設けられる門型の支持部１５０の上部に配置される。   1 and 2. As shown in A, the coating apparatus 1 includes a substrate holding unit 11 that holds the substrate 9, and the substrate holding unit 11 in a predetermined direction parallel to both main surfaces of the substrate 9 (that is, the Y direction in FIG. Hereinafter, the substrate moving mechanism 12 that horizontally moves in the “sub-scanning direction” and the main surface 91 on the (+ Z) side of the substrate 9 held by the substrate holding unit 11 (hereinafter, referred to as “upper surface 91”). 1 and a direction perpendicular to the sub-scanning direction (that is, the X direction in FIG. 1; A head moving mechanism 15 that moves horizontally in the “main scanning direction”. The head moving mechanism 15 is disposed on an upper portion of a gate-shaped support unit 150 provided across the substrate holding unit 11 and the substrate moving mechanism 12.

塗布ヘッド１４は、同一種類の有機ＥＬ液を連続的に吐出する複数（本実施の形態では、３本）のノズル１４１を備える。３本のノズル１４１は、Ｘ方向（すなわち、主走査方向）に略直線状に配列されるとともにＹ方向（すなわち、副走査方向）に僅かにずれて配置される。３本のノズル１４１の吐出口は副走査方向に関して等間隔にて配列されており、隣接する２本のノズル１４１の間の副走査方向に関する距離は、基板９の上面９１に予め形成されている主走査方向に伸びる隔壁間のピッチ（以下、「隔壁ピッチ」という。）の３倍に等しくされる。   The coating head 14 includes a plurality (three in this embodiment) of nozzles 141 that continuously discharge the same type of organic EL liquid. The three nozzles 141 are arranged substantially linearly in the X direction (that is, the main scanning direction) and are slightly shifted in the Y direction (that is, the sub scanning direction). The discharge ports of the three nozzles 141 are arranged at equal intervals in the sub-scanning direction, and the distance in the sub-scanning direction between two adjacent nozzles 141 is formed in advance on the upper surface 91 of the substrate 9. It is made equal to three times the pitch between the partition walls extending in the main scanning direction (hereinafter referred to as “partition wall pitch”).

塗布装置１では、ヘッド移動機構１５および基板移動機構１２が、塗布ヘッド１４を基板９に対して主走査方向に相対的に移動するとともに基板９を塗布ヘッド１４に対して副走査方向に相対的に移動する移動機構となる。後述するように、塗布装置１では、基板９に対する有機ＥＬ液の塗布時に、基板９が基板保持部１１と共に副走査方向において図１中の（−Ｙ）側から（＋Ｙ）方向へと移動する。すなわち、図１中の（＋Ｙ）側が副走査方向における基板９の相対移動方向前側となり、（−Ｙ）側が副走査方向における基板９の相対移動方向後側となる。換言すれば、図１中の（＋Ｙ）側は、基板９の副走査方向における移動の下流側であり、（−Ｙ）側が基板９の移動の上流側である。   In the coating apparatus 1, the head moving mechanism 15 and the substrate moving mechanism 12 move the coating head 14 relative to the substrate 9 in the main scanning direction and the substrate 9 relative to the coating head 14 in the sub-scanning direction. It becomes a moving mechanism to move to. As will be described later, in the coating apparatus 1, when the organic EL liquid is applied to the substrate 9, the substrate 9 moves from the (−Y) side in FIG. 1 to the (+ Y) direction in the sub-scanning direction together with the substrate holder 11. . That is, the (+ Y) side in FIG. 1 is the front side of the relative movement direction of the substrate 9 in the sub-scanning direction, and the (−Y) side is the rear side of the relative movement direction of the substrate 9 in the sub-scanning direction. In other words, the (+ Y) side in FIG. 1 is the downstream side of the movement of the substrate 9 in the sub-scanning direction, and the (−Y) side is the upstream side of the movement of the substrate 9.

基板９に有機ＥＬ液が塗布される際には、基板９が図１および図２．Ａにおいて実線にて示す塗布開始位置に位置し、ヘッド移動機構１５により主走査方向に移動する塗布ヘッド１４の３本のノズル１４１から、基板９上の隔壁間に形成される３つの溝部に有機ＥＬ液が連続的に吐出されて塗布される。塗布装置１により有機ＥＬ液が塗布される各２つの溝部の間には、他の塗布装置等により他の種類の有機ＥＬ液が塗布される２つの溝部が挟まれている。   When the organic EL liquid is applied to the substrate 9, the substrate 9 is shown in FIGS. In A, the three nozzles 141 of the coating head 14 which are located at the coating start position indicated by the solid line and move in the main scanning direction by the head moving mechanism 15 are organically formed in the three grooves formed between the partition walls on the substrate 9. The EL liquid is continuously discharged and applied. Between each of the two groove portions to which the organic EL liquid is applied by the coating device 1, two groove portions to which other types of organic EL liquid are applied are sandwiched by another coating device or the like.

塗布ヘッド１４が主走査方向の一方側から他方側まで（例えば、基板９の（−Ｘ）側から（＋Ｘ）側まで）移動すると、基板移動機構１２により基板９が基板保持部１１と共に（＋Ｙ）方向（すなわち、副走査方向）に隔壁ピッチの９倍に等しい距離だけ移動する。副走査方向における基板９の移動が終了すると、塗布ヘッド１４が３本のノズル１４１から有機ＥＬ液を吐出しつつ（＋Ｘ）側から（−Ｘ）側まで主走査方向に移動することにより、基板９の上面９１の溝に有機ＥＬ液が塗布される。   When the coating head 14 moves from one side to the other side in the main scanning direction (for example, from the (−X) side to the (+ X) side of the substrate 9), the substrate 9 is moved together with the substrate holder 11 by the substrate moving mechanism 12 (+ Y ) Direction (ie, sub-scanning direction) by a distance equal to 9 times the partition wall pitch. When the movement of the substrate 9 in the sub-scanning direction is completed, the coating head 14 moves in the main scanning direction from the (+ X) side to the (−X) side while discharging the organic EL liquid from the three nozzles 141, thereby The organic EL liquid is applied to the grooves on the upper surface 91 of the substrate 9.

塗布装置１では、基板保持部１１および基板９が、図１および図２．Ａ中において二点鎖線にて示す塗布終了位置に位置するまで、塗布ヘッド１４の主走査方向における移動、および、基板９の（＋Ｙ）側へのステップ移動が繰り返され（すなわち、塗布ヘッド１４の基板９に対する主走査方向における相対移動が行われる毎に、基板９が塗布ヘッド１４に対して副走査方向に相対的に移動され）、これにより、基板９の上面９１において、有機ＥＬ液が隔壁ピッチの３倍に等しいピッチにて配列されたストライプ状に塗布される。塗布装置１では、副走査方向に関し、基板９上において有機ＥＬ液の塗布が進行する方向（すなわち、塗布ヘッド１４の基板９に対する相対移動方向）は、基板移動機構１２による基板９の移動方向とは反対向きとなっている。   In the coating apparatus 1, the substrate holding part 11 and the substrate 9 are formed as shown in FIGS. The movement of the coating head 14 in the main scanning direction and the step movement toward the (+ Y) side of the substrate 9 are repeated until the coating end position indicated by the two-dot chain line in FIG. Each time relative movement in the main scanning direction with respect to the substrate 9 is performed, the substrate 9 is moved relatively in the sub scanning direction with respect to the coating head 14). It is applied in the form of stripes arranged at a pitch equal to three times the pitch. In the coating apparatus 1, the direction in which the application of the organic EL liquid proceeds on the substrate 9 in the sub-scanning direction (that is, the relative movement direction of the coating head 14 with respect to the substrate 9) is the movement direction of the substrate 9 by the substrate moving mechanism 12. Is in the opposite direction.

塗布装置１は、副走査方向における基板９の相対移動方向前側において塗布ヘッド１４に隣接して配置され（すなわち、塗布ヘッド１４の（＋Ｙ）側に隣接して配置され）、基板９の上面９１に塗布された有機ＥＬ液に向けて不活性ガスを噴出する不活性ガス噴出機構２を備える。本実施の形態では、不活性ガス噴出機構２により窒素（Ｎ２）ガスが噴出されるが、他の様々な不活性ガスが噴出されてもよい。 The coating apparatus 1 is disposed adjacent to the coating head 14 on the front side in the relative movement direction of the substrate 9 in the sub-scanning direction (that is, disposed adjacent to the (+ Y) side of the coating head 14), and the upper surface 91 of the substrate 9. An inert gas ejection mechanism 2 that ejects an inert gas toward the organic EL liquid applied to the substrate is provided. In the present embodiment, nitrogen (N 2 ) gas is ejected by the inert gas ejection mechanism 2, but various other inert gases may be ejected.

不活性ガス噴出機構２は、塗布終了位置に位置した基板９の（＋Ｚ）側に配置される略直方体状のカバー部２１を有し、カバー部２１は、基板９の上面９１に垂直なＺ方向に関して基板９から離間しつつ基板９の上面９１を全面に亘って（すなわち、主走査方向の全長および副走査方向の全長に亘って）覆う。図２．Ａに示すように、カバー部２１の基板９に対向する下面は、全面に亘って不活性ガスを噴出する噴出面２１１となっており、噴出面２１１の主走査方向および副走査方向のそれぞれの長さは、基板９の上面９１の主走査方向および副走査方向の長さよりも長い。図２．Ａでは、図の理解を容易にするために、不活性ガス噴出機構２のカバー部２１の噴出面２１１を破線にて示す（後述する他の断面図においても同様）。   The inert gas ejection mechanism 2 has a substantially rectangular parallelepiped cover portion 21 disposed on the (+ Z) side of the substrate 9 located at the coating end position, and the cover portion 21 is Z perpendicular to the upper surface 91 of the substrate 9. The upper surface 91 of the substrate 9 is covered over the entire surface (that is, over the entire length in the main scanning direction and the entire length in the sub-scanning direction) while being separated from the substrate 9 in the direction. FIG. As shown to A, the lower surface which opposes the board | substrate 9 of the cover part 21 becomes the ejection surface 211 which ejects an inert gas over the whole surface, and each of the main scanning direction of the ejection surface 211 and a subscanning direction The length is longer than the length of the upper surface 91 of the substrate 9 in the main scanning direction and the sub-scanning direction. FIG. In A, the ejection surface 211 of the cover portion 21 of the inert gas ejection mechanism 2 is indicated by a broken line in order to facilitate understanding of the drawing (the same applies to other sectional views described later).

図３は、不活性ガス噴出機構２のカバー部２１の底面図である。図２．Ａおよび図３に示すように、カバー部２１の内部空間には、Ｙ方向に配列されるとともにそれぞれがカバー部２１のＸ方向の全長に亘る薄板状の部材である複数の仕切り板２１２が設けられ、複数の仕切り板２１２によりカバー部２１の内部空間が分割されることにより、Ｙ方向に配列される互いに独立した複数（本実施の形態では、１０個）の分割チャンバ２１３が形成される。これにより、図２．Ａに示すように、カバー部２１の噴出面２１１において、Ｙ方向に互いに隣接して配列されるとともにそれぞれが基板９の主走査方向の全長に亘る複数の噴出口２１４が設けられる。   FIG. 3 is a bottom view of the cover portion 21 of the inert gas ejection mechanism 2. FIG. As shown in FIG. 3A and FIG. 3, in the internal space of the cover portion 21, a plurality of partition plates 212 that are arranged in the Y direction and are each a thin plate-like member extending over the entire length of the cover portion 21 in the X direction are provided. In addition, by dividing the internal space of the cover portion 21 by the plurality of partition plates 212, a plurality of (in this embodiment, ten) divided chambers 213 arranged in the Y direction are formed. As a result, FIG. As shown in A, on the ejection surface 211 of the cover portion 21, there are provided a plurality of ejection ports 214 arranged adjacent to each other in the Y direction and each extending over the entire length of the substrate 9 in the main scanning direction.

図２．Ｂに示すように、不活性ガス噴出機構２では、各分割チャンバ２１３の（＋Ｚ）側に、分割チャンバ２１３に不活性ガスを供給する配管２２１が接続されており、各配管２２１には、配管２２１内の不活性ガスの流量を調整するマスフローコントローラ２２２が設けられている。不活性ガス噴出機構２は、これら複数のマスフローコントローラ２２２の開閉および開度を個別に制御するコンピュータである噴出領域制御部２２を有し、噴出領域制御部２２により、複数の分割チャンバ２１３への不活性ガスの供給（すなわち、複数の複数の噴出口２１４への不活性ガスの供給）が個別に制御され、噴出面２１１における不活性ガスの噴出領域が変更可能とされる。   FIG. As shown in B, in the inert gas ejection mechanism 2, a pipe 221 that supplies an inert gas to the divided chamber 213 is connected to the (+ Z) side of each divided chamber 213. A mass flow controller 222 that adjusts the flow rate of the inert gas in the 221 is provided. The inert gas ejection mechanism 2 includes an ejection area control unit 22 that is a computer that individually controls the opening and closing and the opening degree of the plurality of mass flow controllers 222, and the ejection area control unit 22 supplies the plurality of divided chambers 213 to the divided chambers 213. The supply of the inert gas (that is, the supply of the inert gas to the plurality of nozzles 214) is individually controlled, and the ejection area of the inert gas on the ejection surface 211 can be changed.

本実施の形態では、多数の貫通孔が形成された薄板状のパンチングメタル（図示省略）が、図２．Ａに示すカバー部２１の噴出面２１１において各噴出口２１４に設けられることにより、各分割チャンバ２１３において噴出口２１４へと向かう不活性ガスが噴出口２１４の全域に分散される。これにより、各噴出口２１４から噴出される不活性ガスの流量が各噴出口２１４の全域においておよそ均一となる。噴出面２１１と基板９の上面９１との間のＺ方向の距離は約１０ｍｍとされる。なお、各分割チャンバ２１３内では、上記パンチングメタルの上方にもう１枚のパンチングメタルが設けられ、噴出口２１４に向かう不活性ガスがより分散されてもよい。また、各分割チャンバ２１３において、配管２２１（図２．Ｂ参照）が接続される位置の下方に小さい薄板状の拡散板が設けられることにより、配管２２１から分割チャンバ２１３内に流入する不活性ガスが分割チャンバ２１３全体に拡散されてもよい。   In the present embodiment, a thin plate-like punching metal (not shown) in which a large number of through holes are formed is shown in FIG. By providing each ejection port 214 on the ejection surface 211 of the cover portion 21 shown in A, the inert gas toward the ejection port 214 in each divided chamber 213 is dispersed throughout the ejection port 214. As a result, the flow rate of the inert gas ejected from each ejection port 214 is approximately uniform over the entire area of each ejection port 214. The distance in the Z direction between the ejection surface 211 and the upper surface 91 of the substrate 9 is about 10 mm. In each of the divided chambers 213, another punching metal may be provided above the punching metal, and the inert gas directed toward the ejection port 214 may be further dispersed. Further, in each divided chamber 213, an inert gas flowing into the divided chamber 213 from the pipe 221 is provided by providing a small thin plate-like diffusion plate below the position where the pipe 221 (see FIG. 2.B) is connected. May be diffused throughout the dividing chamber 213.

図４は、塗布装置１を図１中のＢ−Ｂの位置にて切断した断面図である。図４では、図の理解を容易にするために、断面よりも（−Ｙ）側の構造を二点鎖線にて示す。図４に示すように、不活性ガス噴出機構２のカバー部２１は、基板９が塗布終了位置に位置した状態で、基板９の上面９１とカバー部２１の噴出面２１１との間の空間を主走査方向の両側（すなわち、（＋Ｘ）側および（−Ｘ）側）から覆う２つの側板２１５を備え、Ｙ方向においてカバー部２１の全長に亘って伸びる側板２１５の下端には、同じくＹ方向においてカバー部２１の全長に亘って伸びるとともに基板９の上面９１に平行に基板９および基板保持部１１に向かって突出する側底板２１５１が設けられる。なお、基板保持部１１の副走査方向への移動時に摩擦が生じないように、側底板２１５１と基板保持部１１との間には間隙が設けられる。塗布装置１では、図２．Ａに示すように、カバー部２１の（＋Ｙ）側にも、Ｘ方向においてカバー部２１の全長に亘って伸びるとともに基板９の上面９１とカバー部２１の噴出面２１１との間の空間を覆う側板２１６が設けられる。   FIG. 4 is a cross-sectional view of the coating apparatus 1 cut at the position BB in FIG. In FIG. 4, the structure on the (−Y) side of the cross section is indicated by a two-dot chain line for easy understanding of the drawing. As shown in FIG. 4, the cover portion 21 of the inert gas ejection mechanism 2 has a space between the upper surface 91 of the substrate 9 and the ejection surface 211 of the cover portion 21 in a state where the substrate 9 is located at the coating end position. Two side plates 215 covering from both sides in the main scanning direction (that is, (+ X) side and (−X) side) are provided, and the lower end of the side plate 215 extending over the entire length of the cover portion 21 in the Y direction is also in the Y direction. A side bottom plate 2151 is provided which extends over the entire length of the cover portion 21 and protrudes toward the substrate 9 and the substrate holding portion 11 in parallel with the upper surface 91 of the substrate 9. Note that a gap is provided between the side bottom plate 2151 and the substrate holder 11 so that friction does not occur when the substrate holder 11 moves in the sub-scanning direction. In the coating apparatus 1, FIG. As shown in A, the (+ Y) side of the cover portion 21 also extends over the entire length of the cover portion 21 in the X direction and covers the space between the upper surface 91 of the substrate 9 and the ejection surface 211 of the cover portion 21. Side plates 216 are provided.

塗布装置１では、基板９に対する流動性材料の塗布の際に、基板９の副走査方向への相対移動に伴って、基板９の上面９１の（＋Ｙ）側の領域が不活性ガス噴出機構２のカバー部２１により覆われ、カバー部２１により覆われる上面９１上の領域が（−Ｙ）側に向かって拡がっていく。換言すれば、基板９の副走査方向への相対移動に伴って、基板９の上面９１とカバー部２１の噴出面２１１との重複面積が増大する。   In the coating apparatus 1, when the fluid material is applied to the substrate 9, the (+ Y) side region of the upper surface 91 of the substrate 9 is moved to the inert gas ejection mechanism 2 as the substrate 9 moves relative to the sub-scanning direction. The region on the upper surface 91 covered with the cover portion 21 is expanded toward the (−Y) side. In other words, the overlapping area between the upper surface 91 of the substrate 9 and the ejection surface 211 of the cover portion 21 increases with relative movement of the substrate 9 in the sub-scanning direction.

図５．Ａおよびし図５．Ｂは、基板９に対する流動性材料の塗布途上の様子を示す断面図であり、図５．Ｃは、基板９に対する流動性材料の塗布終了時の様子を示す断面図である。図５．Ａないし図５．Ｃは図２．Ａに対応する。図２．Ａに示すように、基板９が不活性ガス噴出機構２のカバー部２１よりも（−Ｙ）側の塗布開始位置に位置する状態では、カバー部２１の各分割チャンバ２１３に接続された配管２２１（図２．Ｂ参照）における流量が０とされており、各分割チャンバ２１３の噴出口２１４から不活性ガスは噴出されていない。   FIG. A and FIG. B is a cross-sectional view showing a state in which the flowable material is being applied to the substrate 9, and FIG. C is a cross-sectional view showing a state at the end of application of the fluid material to the substrate 9. FIG. A thru | or FIG. C is the same as FIG. Corresponds to A. FIG. As shown to A, in the state which the board | substrate 9 is located in the application | coating start position of the (-Y) side rather than the cover part 21 of the inert gas ejection mechanism 2, it is the piping 221 connected to each division | segmentation chamber 213 of the cover part 21. The flow rate is 0 (see FIG. 2.B), and the inert gas is not ejected from the ejection port 214 of each divided chamber 213.

そして、基板９に対する流動性材料の塗布が開始され、図５．Ａに示すように、基板９の（＋Ｙ）側の部位が、カバー部２１の最も（−Ｙ）側に位置する分割チャンバ２１３の下方へと移動すると、噴出領域制御部２２（図２．Ｂ参照）の制御により当該分割チャンバ２１３に接続された配管２２１を介しての不活性ガスの流入が開始され、分割チャンバ２１３の噴出口２１４から不活性ガスの噴出が開始される。図５．Ａでは、図の理解を容易にするために、不活性ガスの噴出が行われている分割チャンバ２１３内に下向きの矢印を描いている（図５．Ｂおよび図５．Ｃにおいても同様）。   Then, application of the fluid material to the substrate 9 is started, and FIG. As shown to A, if the (+ Y) side site | part of the board | substrate 9 moves below the division | segmentation chamber 213 located in the most (-Y) side of the cover part 21, the ejection area | region control part 22 (FIG. 2.B). Under the control of the reference), the inflow of the inert gas is started through the pipe 221 connected to the division chamber 213, and the ejection of the inert gas is started from the outlet 214 of the division chamber 213. FIG. In A, in order to facilitate understanding of the figure, a downward arrow is drawn in the divided chamber 213 where the inert gas is ejected (the same applies to FIGS. 5.B and 5.C).

塗布装置１では、図５．Ａおよび図５．Ｂに示すように、基板９の（＋Ｙ）方向への相対移動に伴って基板９の上面９１とカバー部２１の噴出面２１１との平面視における重複面積が増大するに従って、噴出領域制御部２２により複数のマスフローコントローラ２２２（図２．Ｂ参照）が制御されることにより、カバー部２１の複数の噴出口２１４からの不活性ガスの噴出が、（−Ｙ）側から（＋Ｙ）側の噴出口２１４に向かって順次開始される。換言すれば、上記重複面積の増大に従って、カバー部２１の噴出面２１１における噴出領域が（＋Ｙ）側へと拡大される。   In the coating apparatus 1, FIG. A and FIG. As shown in B, as the overlapping area in a plan view of the upper surface 91 of the substrate 9 and the ejection surface 211 of the cover portion 21 increases with relative movement of the substrate 9 in the (+ Y) direction, the ejection region control unit 22. By controlling the plurality of mass flow controllers 222 (see FIG. 2.B), the ejection of the inert gas from the plurality of outlets 214 of the cover portion 21 is performed from the (−Y) side to the (+ Y) side. Begins sequentially toward exit 214. In other words, as the overlapping area increases, the ejection area on the ejection surface 211 of the cover portion 21 is expanded to the (+ Y) side.

これにより、基板９の上面９１において、カバー部２１と平面視にて重なっている領域に向けて不活性ガスが噴出され、基板９の上面９１に塗布された流動性材料の酸化や水分の吸着（すなわち、流動性材料が水分と反応して劣化してしまうこと）等が防止される。このとき、基板９とは重なっていない噴出口２１４からは不活性ガスが噴出されないため、基板９上に塗布された流動性材料の酸化を抑制するための不活性ガスの使用量を低減することができ、その結果、基板９への流動性材料の塗布に要するコスト（すなわち、塗布装置１のランニングコスト）を低減することができる。また、基板９の上面９１上の小さい空間のみを不活性ガス雰囲気とすることにより、塗布装置１全体を密閉装置に収容することなく流動性材料の酸化や水分の吸着等を防止することができるため、塗布装置１の小型化および簡素化が実現される。   As a result, the inert gas is ejected toward the region overlapping the cover portion 21 in plan view on the upper surface 91 of the substrate 9, thereby oxidizing the fluid material applied to the upper surface 91 of the substrate 9 and adsorbing moisture. (That is, the fluid material reacts with moisture and deteriorates) and the like is prevented. At this time, since the inert gas is not ejected from the ejection port 214 that does not overlap with the substrate 9, the amount of the inert gas used for suppressing the oxidation of the fluid material applied on the substrate 9 is reduced. As a result, the cost required for applying the fluid material to the substrate 9 (that is, the running cost of the coating apparatus 1) can be reduced. Further, by making only a small space on the upper surface 91 of the substrate 9 an inert gas atmosphere, it is possible to prevent the fluid material from being oxidized or moisture adsorbed without accommodating the entire coating apparatus 1 in the sealing apparatus. Therefore, size reduction and simplification of the coating device 1 is realized.

上述のように、カバー部２１の噴出面２１１における噴出領域の拡大は、噴出面２１１において副走査方向に配列された複数の噴出口２１４への不活性ガスの供給を、噴出領域制御部２２により個別に制御することにより実現される。このように、塗布装置１では、簡素な構造にて噴出面２１１からの不活性ガスの噴出制御を行うことができる。また、基板９の近傍に、不活性ガスの噴出制御に係る可動部を設ける必要がないため、パーティクル等による基板９の汚染をより一層抑制することができる。   As described above, the expansion of the ejection area on the ejection surface 211 of the cover portion 21 is performed by supplying the inert gas to the plurality of ejection openings 214 arranged in the sub-scanning direction on the ejection surface 211 by the ejection area control unit 22. Realized by individual control. Thus, in the coating apparatus 1, the ejection control of the inert gas from the ejection surface 211 can be performed with a simple structure. Further, since there is no need to provide a movable portion related to the inert gas ejection control in the vicinity of the substrate 9, contamination of the substrate 9 due to particles or the like can be further suppressed.

塗布装置１では、カバー部２１の噴出面２１１の副走査方向の長さが、基板９の上面９１の副走査方向の長さよりも長くされることにより、図５．Ｃに示すように、基板９が塗布終了位置に位置した状態において、カバー部２１の全ての噴出口２１４から基板９の上面９１全域に向けて不活性ガスが噴出される。塗布装置１では、噴出領域制御部２２により、複数の噴出口２１４からそれぞれ噴出される不活性ガスの単位面積当たりの流量は互いに等しくされる。これにより、基板９の上面９１のうちカバー部２１の噴出面２１１と平面視にて重なる領域において、不活性ガスの均一な付与が実現される。   In the coating apparatus 1, the length of the ejection surface 211 of the cover portion 21 in the sub-scanning direction is made longer than the length of the upper surface 91 of the substrate 9 in the sub-scanning direction. As shown in C, in the state where the substrate 9 is located at the coating end position, the inert gas is ejected from all the ejection ports 214 of the cover portion 21 toward the entire upper surface 91 of the substrate 9. In the coating apparatus 1, the flow rate per unit area of the inert gas ejected from the plurality of ejection ports 214 is made equal to each other by the ejection region control unit 22. Thereby, in the area | region which overlaps with the ejection surface 211 of the cover part 21 in planar view among the upper surfaces 91 of the board | substrate 9, uniform provision of an inert gas is implement | achieved.

カバー部２１では、図４に示すように、基板９の上面９１とカバー部２１の噴出面２１１との間の空間を（＋Ｘ）側および（−Ｘ）側から覆う側板２１５が設けられることにより、カバー部２１の噴出面２１１から基板９の上面９１に向けて噴出された不活性ガスが、カバー部２１の（＋Ｘ）側および（−Ｘ）側から外部へと流出することを抑制することができる。これにより、カバー部２１と基板９との間の空間における不活性ガスの濃度を維持しつつ不活性ガスの使用量をより低減することができる。   In the cover part 21, as shown in FIG. 4, by providing a side plate 215 that covers the space between the upper surface 91 of the substrate 9 and the ejection surface 211 of the cover part 21 from the (+ X) side and the (−X) side. Inhibiting the inert gas ejected from the ejection surface 211 of the cover portion 21 toward the upper surface 91 of the substrate 9 from flowing out from the (+ X) side and (−X) side of the cover portion 21 to the outside. Can do. Thereby, the usage-amount of an inert gas can be reduced more, maintaining the density | concentration of the inert gas in the space between the cover part 21 and the board | substrate 9. FIG.

また、側板２１５の下端に基板９および基板保持部１１に向かって突出する側底板２１５１が設けられることにより、基板９の（＋Ｘ）側および（−Ｘ）側において側板２１５と基板９との間の間隙から不活性ガスが外部へと流出することがさらに抑制される。その結果、カバー部２１と基板９との間の空間における不活性ガスの濃度を維持しつつ不活性ガスの使用量をより一層低減することができる。さらに、図２．Ａに示すように、カバー部２１の（＋Ｙ）側にも側板２１６が設けられることにより、カバー部２１の（＋Ｙ）側から不活性ガスが流出することを抑制することができ、不活性ガスの使用量をより一層低減することができる。   Further, a side bottom plate 2151 that protrudes toward the substrate 9 and the substrate holding portion 11 is provided at the lower end of the side plate 215, so that the side plate 215 and the substrate 9 can be located on the (+ X) side and the (−X) side of the substrate 9. It is further suppressed that the inert gas flows out from the gap. As a result, the amount of the inert gas used can be further reduced while maintaining the concentration of the inert gas in the space between the cover portion 21 and the substrate 9. Furthermore, FIG. As shown in A, by providing the side plate 216 also on the (+ Y) side of the cover part 21, it is possible to prevent the inert gas from flowing out from the (+ Y) side of the cover part 21, and the inert gas The amount of use can be further reduced.

上述の説明では、カバー部２１の分割チャンバ２１３と基板９とが重なり始めた時点で当該分割チャンバ２１３からの不活性ガスの噴出が開始されるとしたが、塗布装置１では、基板９の上面９１とカバー部２１の噴出面２１１との重複面積が増大するに従って、噴出面２１１の複数の噴出口２１４からの不活性ガスの噴出が、塗布ヘッド１４の主走査方向の移動経路に最も近い（−Ｙ）側の噴出口２１４から、塗布ヘッド１４の移動経路から最も離れた（＋Ｙ）側の噴出口２１４に向かって順次開始されるのであればよい。例えば、基板９が一の噴出口２１４に重なるよりも所定時間だけ前に、当該噴出口２１４からの不活性ガスの噴出が開始されてもよい。   In the above description, the injection of the inert gas from the division chamber 213 starts when the division chamber 213 of the cover portion 21 and the substrate 9 begin to overlap. As the overlapping area between 91 and the ejection surface 211 of the cover portion 21 increases, the ejection of the inert gas from the plurality of ejection ports 214 of the ejection surface 211 is closest to the movement path of the coating head 14 in the main scanning direction ( It suffices if it is sequentially started from the (Y) side jet outlet 214 toward the (+ Y) side jet outlet 214 farthest from the moving path of the coating head 14. For example, the ejection of the inert gas from the ejection port 214 may be started a predetermined time before the substrate 9 overlaps the one ejection port 214.

図６は、一の噴出口２１４から噴出される不活性ガスの流量と噴出開始からの経過時間との関係の一例を示す図である。図６では、当該噴出口２１４を有する分割チャンバ２１３内の酸素濃度の変化を、二点鎖線にて併せて描いている。図６に示す例では、基板９が噴出口２１４と重なり始めるよりも前の時刻ｔ０に、噴出口２１４からの不活性ガスの噴出が開始され、流量Ｑ１にて不活性ガスの噴出が継続して行われることにより、噴出開始から所定時間の経過後の時刻ｔ１には、分割チャンバ２１３内の酸素濃度が所定濃度まで低下する。   FIG. 6 is a diagram illustrating an example of the relationship between the flow rate of the inert gas ejected from one ejection port 214 and the elapsed time from the ejection start. In FIG. 6, a change in the oxygen concentration in the divided chamber 213 having the ejection port 214 is drawn together with a two-dot chain line. In the example shown in FIG. 6, the ejection of the inert gas from the ejection port 214 is started at time t0 before the substrate 9 begins to overlap the ejection port 214, and the ejection of the inert gas continues at the flow rate Q1. As a result, the oxygen concentration in the divided chamber 213 decreases to a predetermined concentration at time t1 after the elapse of a predetermined time from the start of ejection.

そして、時刻ｔ１に基板９と分割チャンバ２１３とが重なり始め、時刻ｔ１から時刻ｔ２までの間、基板９と噴出口２１４との重複面積は増大し、時刻ｔ２にて噴出口２１４全体が基板９と重なる。これと並行して、噴出領域制御部２２による制御が行われ、噴出口２１４から噴出する不活性ガスの流量はＱ２まで減少する。その結果、分割チャンバ２１３に流入する不活性ガスの流量の減少と、分割チャンバ２１３の噴出口２１４から流出する不活性ガスの流量とが等しくされ、分割チャンバ２１３内の酸素濃度（基板９の上面９１において分割チャンバ２１３と平面視にて重なる領域上の酸素濃度にほぼ等しい。）が上述の所定濃度のまま維持される。基板９が当該噴出口２１４と重なっている間は常に、基板９の噴出口２１４と重なっている部位上の流動性材料の周囲の雰囲気が所定濃度の低酸素雰囲気とされ、流動性材料の酸化抑制や水分の吸着防止等が均一に行われる。   Then, the substrate 9 and the division chamber 213 begin to overlap at time t1, and the overlapping area between the substrate 9 and the jet outlet 214 increases from time t1 to time t2, and the entire jet outlet 214 is completely transferred to the substrate 9 at time t2. And overlap. In parallel with this, control by the ejection region control unit 22 is performed, and the flow rate of the inert gas ejected from the ejection port 214 decreases to Q2. As a result, the decrease in the flow rate of the inert gas flowing into the division chamber 213 is made equal to the flow rate of the inert gas flowing out from the ejection port 214 of the division chamber 213, and the oxygen concentration in the division chamber 213 (the upper surface of the substrate 9) 91, the oxygen concentration in the region overlapping with the divided chamber 213 in plan view is maintained at the above-mentioned predetermined concentration. While the substrate 9 overlaps with the ejection port 214, the atmosphere around the fluid material on the portion of the substrate 9 overlapping the ejection port 214 is changed to a low-oxygen atmosphere having a predetermined concentration, and the fluid material is oxidized. Suppression and moisture adsorption prevention are performed uniformly.

塗布装置１では、図７．Ａおよび図７．Ｂに示すように、カバー部２１および基板保持部１１のＸ方向およびＹ方向の全長に亘ってカバー部２１および基板保持部１１の下側を覆う下部閉塞部２６が設けられてもよい。下部閉塞部２６は、カバー部２１の（＋Ｙ）側の端部（すなわち、塗布ヘッド１４の移動経路に最も近い端部）から基板保持部１１の（−Ｙ）側の端部まで設けられており、下部閉塞部２６の一部はＹ方向に伸縮可能な蛇腹状の伸縮部２６１とされる。伸縮部２６１は、図７．Ａに示すように、基板９が塗布開始位置に位置した状態では伸張状態とされており、基板９が図７．Ｂに示す塗布終了位置に位置するまで、基板９の（＋Ｙ）方向への移動に伴って収縮する。下部閉塞部２６は、Ｚ方向においてカバー部２１の（＋Ｘ）側および（−Ｘ）側に設けられる側板２１５（図４参照）の下端部とほぼ同じ高さとされる。   In the coating apparatus 1, FIG. A and FIG. As shown in B, a lower closing portion 26 that covers the lower side of the cover portion 21 and the substrate holding portion 11 may be provided over the entire length of the cover portion 21 and the substrate holding portion 11 in the X direction and the Y direction. The lower closing portion 26 is provided from the end portion on the (+ Y) side of the cover portion 21 (that is, the end portion closest to the moving path of the coating head 14) to the end portion on the (−Y) side of the substrate holding portion 11. A part of the lower closing part 26 is a bellows-like expansion / contraction part 261 that can expand and contract in the Y direction. The telescopic part 261 is shown in FIG. As shown in FIG. 7A, when the substrate 9 is located at the application start position, the substrate 9 is in an extended state. The substrate 9 contracts as it moves in the (+ Y) direction until it is located at the coating end position shown in B. The lower closing portion 26 has substantially the same height as the lower end portion of the side plate 215 (see FIG. 4) provided on the (+ X) side and the (−X) side of the cover portion 21 in the Z direction.

塗布装置１では、上述のように、カバー部２１の噴出口２１４と基板９とが重なり始めた時点で当該噴出口２１４からの不活性ガスの噴出が開始されるため、噴出口２１４の基板９と重なっていない領域から基板９の高さよりも下方へと不活性ガスが噴出されることとなるが、下部閉塞部２６によりカバー部２１の下方が覆われることにより、噴出口２１４から噴出された不活性ガスが大きく拡散することなく基板９の周囲に留まる。これにより、不活性ガスの使用量をより低減することができる。また、図６に示すように、カバー部２１の噴出口２１４と基板９とが重なり始めるよりも前から噴出口２１４からの不活性ガスの噴出が行われる場合には、特に、不活性ガスの拡散を抑制して不活性ガスの使用量をさらに低減することができる。   In the coating apparatus 1, as described above, since the ejection of the inert gas from the ejection port 214 starts when the ejection port 214 of the cover portion 21 and the substrate 9 begin to overlap, the substrate 9 of the ejection port 214 is started. Inert gas is ejected from the region not overlapping with the substrate 9 below the height of the substrate 9, but the lower portion of the cover portion 21 is covered by the lower closing portion 26, so that it is ejected from the ejection port 214. The inert gas stays around the substrate 9 without significantly diffusing. Thereby, the usage-amount of an inert gas can be reduced more. In addition, as shown in FIG. 6, particularly when the inert gas is ejected from the ejection port 214 before the ejection port 214 of the cover portion 21 starts to overlap the substrate 9, the inert gas Diffusion can be suppressed and the amount of inert gas used can be further reduced.

塗布装置１では、また、図８に示すように、カバー部２１の（＋Ｘ）側および（−Ｘ）側に不活性ガス循環機構２１７が設けられてもよい。不活性ガス循環機構２１７は、カバー部２１の側板２１５の外側を覆うとともに側板２１５と基板９との間の間隙を下側から覆うように配置される。そして、側板２１５と基板９との間隙から下側に流出する不活性ガスが、基板９の下方に位置する吸気口２１７１を介してポンプ２１７２により吸引され、側板２１５の外側に位置する給気口２１７３を介してカバー部２１の内側へと供給される。   In the coating apparatus 1, as shown in FIG. 8, an inert gas circulation mechanism 217 may be provided on the (+ X) side and the (−X) side of the cover portion 21. The inert gas circulation mechanism 217 is disposed so as to cover the outer side of the side plate 215 of the cover portion 21 and cover the gap between the side plate 215 and the substrate 9 from below. Then, the inert gas flowing out from the gap between the side plate 215 and the substrate 9 is sucked by the pump 2172 via the intake port 2171 located below the substrate 9 and is supplied to the outside of the side plate 215. It is supplied to the inside of the cover part 21 through 2173.

これにより、側板２１５と基板９および基板保持部１１との間の空間の不活性ガス濃度が、カバー部２１の内部空間（すなわち、基板９上の空間）に比べると低くはあるものの増大される。その結果、配管２２１（図２．Ｂ参照）を介してカバー部２１の各分割チャンバ２１３に供給される不活性ガスが、基板９と側板２１５との間の間隙から下側に流出することが抑制され、不活性ガスの使用量をより低減することができる。   Thereby, the inert gas concentration in the space between the side plate 215 and the substrate 9 and the substrate holding unit 11 is increased although it is lower than the internal space of the cover unit 21 (that is, the space on the substrate 9). . As a result, the inert gas supplied to each of the divided chambers 213 of the cover portion 21 via the pipe 221 (see FIG. 2.B) may flow downward from the gap between the substrate 9 and the side plate 215. It is suppressed and the usage-amount of an inert gas can be reduced more.

上述のように、塗布装置１は、（＋Ｚ）側から（−Ｚ）方向へと向かう空気の流れの中に設置されており、図２．Ａに示す塗布ヘッド１４近傍では、基板９の上面９１に向かう空気の流れが形成されている。塗布装置１では、図９に示す拡大図のように、不活性ガス噴出機構２のカバー部２１の（−Ｙ）側に、基板９の上面９１に近づくに従って（−Ｙ）側に向かう傾斜面２１８が設けられ、傾斜面２１８が、噴出面２１１の（−Ｙ）側の端部近傍において上記空気の流れの中に配置されてもよい。   As described above, the coating apparatus 1 is installed in the flow of air from the (+ Z) side toward the (−Z) direction, and FIG. In the vicinity of the coating head 14 shown in A, an air flow toward the upper surface 91 of the substrate 9 is formed. In the coating apparatus 1, as shown in the enlarged view of FIG. 9, an inclined surface that faces the (−Y) side toward the (−Y) side of the cover portion 21 of the inert gas ejection mechanism 2 and approaches the upper surface 91 of the substrate 9. 218 may be provided, and the inclined surface 218 may be disposed in the air flow in the vicinity of the (−Y) side end of the ejection surface 211.

これにより、図９中において細線の矢印にて示す空気の流れが、噴出面２１１の（−Ｙ）側の端部近傍において傾斜面２１８に沿って（−Ｙ）側へと向かう。その結果、基板９の上面９１に衝突して水平方向に拡がる空気が、カバー部２１の（−Ｙ）側からカバー部２１と基板９との間の空間に進入することを抑制することができ、カバー部２１と基板９との間の空間における不活性ガスの濃度の維持を容易とすることができる。なお、図９では、傾斜面２１８の下端縁は噴出面２１１の（−Ｙ）側のエッジとなっているが、例えば、図２．Ａに示すカバー部２１の（−Ｙ）側の上端縁と傾斜面２１８の上端縁とが一致するように傾斜面２１８が追加されてもよい。この場合、傾斜面２１８の（−Ｚ）側からは不活性ガスの噴出は行われない。   As a result, the air flow indicated by the thin-line arrows in FIG. 9 moves toward the (−Y) side along the inclined surface 218 in the vicinity of the (−Y) side end of the ejection surface 211. As a result, air that collides with the upper surface 91 of the substrate 9 and spreads in the horizontal direction can be prevented from entering the space between the cover portion 21 and the substrate 9 from the (−Y) side of the cover portion 21. Further, it is possible to easily maintain the concentration of the inert gas in the space between the cover portion 21 and the substrate 9. 9, the lower end edge of the inclined surface 218 is the (−Y) side edge of the ejection surface 211. For example, FIG. The inclined surface 218 may be added such that the upper end edge on the (−Y) side of the cover portion 21 shown in FIG. In this case, the inert gas is not ejected from the (−Z) side of the inclined surface 218.

次に、本発明の第２の実施の形態に係る塗布装置について説明する。図１０は、第２の実施の形態に係る塗布装置１ａを示す断面図であり、上述の図２．Ａに対応する。図１０に示すように、不活性ガス噴出機構２が、塗布ヘッド１４とカバー部２１との間に配置されるスリット噴射部２３、および、スリット噴射部２３と塗布ヘッド１４との間に配置される吸引機構２４をさらに備える点を除き、塗布装置１ａは、図１および図２．Ａに示す塗布装置１と同様の構成を備える。以下の説明では、塗布装置１の各構成に対応する塗布装置１ａの構成に同符号を付す。   Next, a coating apparatus according to the second embodiment of the present invention will be described. 10 is a cross-sectional view showing a coating apparatus 1a according to the second embodiment. Corresponds to A. As shown in FIG. 10, the inert gas ejection mechanism 2 is disposed between the slit ejection unit 23 disposed between the coating head 14 and the cover unit 21, and between the slit ejection unit 23 and the coating head 14. Except for the point further provided with a suction mechanism 24, the coating apparatus 1a is similar to that shown in FIGS. A configuration similar to that of the coating apparatus 1 shown in FIG. In the following description, the same reference numerals are given to the configurations of the coating apparatus 1 a corresponding to the respective configurations of the coating apparatus 1.

図１０に示すスリット噴射部２３は、基板９のＸ方向（すなわち、主走査方向）の全長に亘るスリット状の噴出口２３１から、カバー部２１の噴出面２１１からの不活性ガスの噴出速度よりも高速にて、基板９の上面９１に向けて不活性ガスを噴出する。本実施の形態では、スリット噴射部２３から噴出される不活性ガスは、カバー部２１から噴出される不活性ガスと同様に窒素ガスとされるが、噴出面２１１から噴出される不活性ガスとは異なる種類の不活性ガスであってもよい。吸引機構２４は、スリット噴射部２３およびカバー部２１から噴出される不活性ガスの一部、並びに、下方へと流れて基板９の上面９１にて水平方向に拡がる空気の一部を吸引する。   The slit injection part 23 shown in FIG. 10 is based on the ejection speed of the inert gas from the ejection surface 211 of the cover part 21 from the slit-like ejection outlet 231 over the entire length of the substrate 9 in the X direction (that is, the main scanning direction). Also, an inert gas is ejected toward the upper surface 91 of the substrate 9 at a high speed. In the present embodiment, the inert gas ejected from the slit ejection unit 23 is nitrogen gas, as is the inert gas ejected from the cover unit 21, but the inert gas ejected from the ejection surface 211 May be different types of inert gases. The suction mechanism 24 sucks a part of the inert gas ejected from the slit ejection part 23 and the cover part 21 and a part of the air that flows downward and spreads in the horizontal direction on the upper surface 91 of the substrate 9.

基板９に対する流動性材料の塗布が行われる際の塗布装置１ａの動作は、スリット噴射部２３からの不活性ガスの噴出、および、吸引機構２４による周囲のガスの吸引が継続的に行われる点を除き、第１の実施の形態に係る塗布装置１とほぼ同様である。   The operation of the coating apparatus 1a when the flowable material is applied to the substrate 9 is that the inactive gas is continuously ejected from the slit ejection unit 23 and the surrounding gas is sucked by the suction mechanism 24. Is substantially the same as the coating apparatus 1 according to the first embodiment.

塗布装置１ａでは、カバー部２１の（−Ｙ）側において、スリット噴射部２３により不活性ガスが噴出されてガスカーテンが形成される。これにより、基板９の上面９１にて水平方向に拡がる空気が、カバー部２１の（−Ｙ）側からカバー部２１と基板９との間の空間に進入することを抑制することができ、カバー部２１と基板９との間の空間における不活性ガスの濃度の維持を容易とすることができる。また、スリット噴射部２３の（−Ｙ）側において、吸引機構２４による吸引が行われることにより、空気がカバー部２１の（−Ｙ）側から進入することをより一層抑制することができ、カバー部２１と基板９との間の空間における不活性ガスの濃度の維持をさらに容易とすることができる。   In the coating apparatus 1a, an inert gas is ejected by the slit ejection unit 23 on the (−Y) side of the cover unit 21 to form a gas curtain. Thereby, it can suppress that the air which spreads in the horizontal direction on the upper surface 91 of the board | substrate 9 enters into the space between the cover part 21 and the board | substrate 9 from the (-Y) side of the cover part 21, and a cover. It is possible to easily maintain the concentration of the inert gas in the space between the portion 21 and the substrate 9. Further, the suction by the suction mechanism 24 is performed on the (−Y) side of the slit ejecting portion 23, so that air can be further suppressed from entering from the (−Y) side of the cover portion 21. The maintenance of the inert gas concentration in the space between the portion 21 and the substrate 9 can be further facilitated.

次に、本発明の第３の実施の形態に係る塗布装置について説明する。図１１は、第３の実施の形態に係る塗布装置１ｂを示す断面図であり、上述の図２．Ａに対応する。図１１に示すように、塗布装置１ｂでは、カバー部２１の内部空間に仕切り板は設けられておらず、カバー部２１の下端の噴出面２１１全体が１つの噴出口となる。また、不活性ガス噴出機構２は、噴出面２１１に対向することにより噴出面２１１からの不活性ガスの噴出を部分的に遮る遮蔽板２５をさらに備える。塗布装置１ｂの他の構成は、図１および図２．Ａに示す塗布装置１とほぼ同様の構成を備えるため、以下の説明では、塗布装置１の各構成に対応する塗布装置１ｂの構成に同符号を付す。   Next, a coating apparatus according to a third embodiment of the present invention will be described. FIG. 11 is a cross-sectional view showing a coating apparatus 1b according to the third embodiment, and FIG. Corresponds to A. As shown in FIG. 11, in the coating apparatus 1 b, no partition plate is provided in the internal space of the cover portion 21, and the entire ejection surface 211 at the lower end of the cover portion 21 serves as one ejection port. The inert gas ejection mechanism 2 further includes a shielding plate 25 that partially blocks the ejection of the inert gas from the ejection surface 211 by facing the ejection surface 211. Other configurations of the coating apparatus 1b are shown in FIGS. Since the configuration is almost the same as that of the coating apparatus 1 shown in A, the same reference numerals are given to the configurations of the coating apparatus 1b corresponding to the configurations of the coating apparatus 1 in the following description.

図１１に示すように、遮蔽板２５は、副走査方向であるＹ方向に互いに隣接して配列されるとともにそれぞれが噴出面２１１の主走査方向（Ｘ方向）の全長に亘る複数（本実施の形態では、１０個）の板状の遮蔽要素２５１を備え、各遮蔽要素２５１は、Ｘ方向に平行な回転軸２５１１を中心として回転可能とされる。塗布装置１ｂでは、噴出領域制御部２２ａにより、複数の遮蔽要素２５１にそれぞれ対応する複数の遮蔽要素回転機構（図示省略）が個別に制御されることにより、複数の遮蔽要素２５１が個別に回転する。   As shown in FIG. 11, the shielding plates 25 are arranged adjacent to each other in the Y direction, which is the sub-scanning direction, and each of the shielding plates 25 extends over the entire length of the ejection surface 211 in the main scanning direction (X direction) (this embodiment). In the embodiment, 10 pieces of plate-like shielding elements 251 are provided, and each shielding element 251 is rotatable around a rotation axis 2511 parallel to the X direction. In the coating apparatus 1b, the plurality of shielding elements 251 rotate individually by individually controlling a plurality of shielding element rotation mechanisms (not shown) respectively corresponding to the plurality of shielding elements 251 by the ejection region control unit 22a. .

図１２．Ａおよびし図１２．Ｂは、基板９に対する流動性材料の塗布途上の様子を示す断面図であり、図１２．Ｃは、基板９に対する流動性材料の塗布終了時の様子を示す断面図である。図１２．Ａないし図１２．Ｃは図１１に対応する。図１１に示すように、基板９が塗布開始位置に位置する状態では、配管を介してカバー部２１の内部空間に不活性ガスが供給されているが、カバー部２１の噴出面２１１全体が遮蔽板２５の複数の遮蔽要素２５１により覆われているため、噴出面２１１から基板９に向けての不活性ガスの噴出は行われていない。なお、図１１に示す状態において、カバー部２１の噴出面２１１は、噴出面２１１に近接する遮蔽板２５によりおよそ全域に亘って覆われていればよく、カバー部２１と遮蔽板２５との間に僅かな隙間が存在していてもよい。   FIG. A and FIG. B is a cross-sectional view showing a state in which the flowable material is being applied to the substrate 9, and FIG. C is a cross-sectional view showing a state at the end of application of the fluid material to the substrate 9. FIG. A thru | or FIG. C corresponds to FIG. As shown in FIG. 11, in the state where the substrate 9 is located at the application start position, the inert gas is supplied to the internal space of the cover portion 21 through the pipe, but the entire ejection surface 211 of the cover portion 21 is shielded. Since the plurality of shielding elements 251 of the plate 25 are covered, the inert gas is not ejected from the ejection surface 211 toward the substrate 9. In the state shown in FIG. 11, the ejection surface 211 of the cover portion 21 only needs to be covered over the entire area by the shielding plate 25 adjacent to the ejection surface 211, and between the cover portion 21 and the shielding plate 25. There may be a slight gap.

塗布装置１ｂにおいて基板９に対する流動性材料の塗布が開始され、図１２．Ａに示すように、基板９の（＋Ｙ）側の部位が、遮蔽板２５の最も（−Ｙ）側に位置する遮蔽要素２５１（すなわち、塗布ヘッド１４の主走査方向の移動経路に最も近い遮蔽要素２５１）の下方へと移動すると、噴出領域制御部２２ａ（図１１参照）の制御により当該遮蔽要素２５１が図１２．Ａ中における時計回りに９０°だけ回転し、基板９の上面９１に垂直な姿勢とされる。これにより、噴出面２１１のうち（−Ｙ）側の一部が開放され、当該開放された領域から基板９に向けて不活性ガスが噴出する。   In the coating apparatus 1b, the application of the fluid material to the substrate 9 is started, and FIG. As shown to A, the (+ Y) side site | part of the board | substrate 9 is the shielding element 251 located in the most (-Y) side of the shielding board 25 (namely, shielding closest to the moving path of the coating head 14 in the main scanning direction). When the element 251) moves downward, the shielding element 251 is controlled by the ejection region control unit 22a (see FIG. 11). It rotates 90 degrees clockwise in A and is in a posture perpendicular to the upper surface 91 of the substrate 9. Thereby, a part on the (−Y) side of the ejection surface 211 is opened, and the inert gas is ejected toward the substrate 9 from the opened area.

塗布装置１ｂでは、図１２．Ａないし図１２．Ｃに示すように、基板９の（＋Ｙ）方向への相対移動に伴って基板９の上面９１とカバー部２１の噴出面２１１との平面視における重複面積が増大するに従って、噴出領域制御部２２ａにより複数の遮蔽要素回転機構が制御されることにより、複数の遮蔽要素２５１が（−Ｙ）側から（＋Ｙ）側に向かって（すなわち、基板９の相対移動方向後側から相対移動方向前側に向かって）順次９０°だけ回転される。さらに換言すれば、遮蔽板２５によるカバー部２１の噴出面２１１全体の遮蔽が、塗布ヘッド１４の移動経路に最も近い（−Ｙ）側から塗布ヘッド１４の移動経路から最も離れた（＋Ｙ）側に向かって順次開放され、噴出面２１１において不活性ガスが噴出される領域が（−Ｙ）側から（＋Ｙ）側に向かって拡大される。   In the coating apparatus 1b, FIG. A thru | or FIG. As shown in C, as the overlapping area in a plan view of the upper surface 91 of the substrate 9 and the ejection surface 211 of the cover portion 21 increases with relative movement of the substrate 9 in the (+ Y) direction, the ejection region control unit 22a. By controlling the plurality of shielding element rotating mechanisms, the plurality of shielding elements 251 move from the (−Y) side toward the (+ Y) side (that is, from the rear side in the relative movement direction of the substrate 9 to the front side in the relative movement direction). Sequentially) by 90 °. In other words, the shielding of the entire ejection surface 211 of the cover portion 21 by the shielding plate 25 is from the (−Y) side closest to the movement path of the coating head 14 to the (+ Y) side farthest from the movement path of the coating head 14. The region where the inert gas is ejected on the ejection surface 211 is enlarged from the (−Y) side toward the (+ Y) side.

これにより、第１の実施の形態と同様に、基板９の上面９１において、カバー部２１と平面視にて重なっている領域に向けて不活性ガスが噴出され、基板９の上面９１に塗布された流動性材料の酸化や水分の吸着等が防止される。このとき、噴出面２１１のうち基板９とは重なっていない領域は遮蔽板２５により覆われており、当該領域からは不活性ガスは噴出されないため、不活性ガスの使用量を低減することができ、その結果、基板９への流動性材料の塗布に要するコストを低減することができる。また、基板９の上面９１上の小さい空間のみを不活性ガス雰囲気とすることにより、塗布装置１ｂの小型化および簡素化が実現される。   As a result, as in the first embodiment, the inert gas is jetted toward the region overlapping the cover portion 21 in plan view on the upper surface 91 of the substrate 9 and applied to the upper surface 91 of the substrate 9. Oxidation of the fluid material and adsorption of moisture are prevented. At this time, a region of the ejection surface 211 that does not overlap the substrate 9 is covered with the shielding plate 25, and the inert gas is not ejected from the region, so that the amount of inert gas used can be reduced. As a result, the cost required for applying the fluid material to the substrate 9 can be reduced. Further, by making only a small space on the upper surface 91 of the substrate 9 an inert gas atmosphere, the coating apparatus 1b can be reduced in size and simplified.

塗布装置１ｂでは、上述のように、カバー部２１の噴出面２１１における噴出領域の拡大は、遮蔽板２５による噴出面２１１の遮蔽を開放することにより実現されるため、簡素な構造にて噴出面２１１からの不活性ガスの噴出制御を行うことができる。また、カバー部２１の内部空間を複数に仕切る必要がないため、カバー部２１に対する不活性ガスの供給機構を簡素化することができる。   In the coating apparatus 1b, as described above, since the enlargement of the ejection area on the ejection surface 211 of the cover portion 21 is realized by opening the shielding of the ejection surface 211 by the shielding plate 25, the ejection surface has a simple structure. Inert gas ejection control from 211 can be performed. Moreover, since it is not necessary to partition the internal space of the cover part 21 into a plurality, the supply mechanism of the inert gas to the cover part 21 can be simplified.

塗布装置１ｂでは、図１３に示すように、遮蔽板２５の複数の遮蔽要素２５１のうち、基板９の相対移動方向の最も後側（すなわち、最も（−Ｙ）側）に位置する遮蔽要素（以下、「後端遮蔽要素２５１ａ」という。）が、基板９の上面９１に近づくに従って（−Ｙ）側に向かう姿勢とされてもよい。後端遮蔽要素２５１ａが図１３に示す姿勢とされることにより、後端遮蔽要素２５１ａ近傍において（−Ｚ）側かつ（−Ｙ）側（すなわち、カバー部２１から離れる方向）に向かう不活性ガスの流れが形成される。その結果、カバー部２１の（−Ｙ）側からカバー部２１と基板９との間の空間に空気が進入することをより一層抑制することができ、カバー部２１と基板９との間の空間における不活性ガスの濃度の維持を容易とすることができる。また、基板９上に噴射される不活性ガスの流れを基板９の上面９１全体においておよそ均一とするために、図１４に示すように、遮蔽板２５の全ての遮蔽要素２５１が後端遮蔽要素２５１ａと同様の姿勢とされてもよい。   In the coating apparatus 1b, as shown in FIG. 13, among the plurality of shielding elements 251 of the shielding plate 25, the shielding element (ie, the most (−Y) side) shielding element (ie, the most (−Y) side) in the relative movement direction of the substrate 9. Hereinafter, the “rear end shielding element 251a” may be in a posture toward the (−Y) side as it approaches the upper surface 91 of the substrate 9. The rear end shielding element 251a is in the posture shown in FIG. 13, so that the inert gas heads toward the (−Z) side and the (−Y) side (that is, the direction away from the cover portion 21) in the vicinity of the rear end shielding element 251a. Is formed. As a result, air can be further prevented from entering the space between the cover portion 21 and the substrate 9 from the (−Y) side of the cover portion 21, and the space between the cover portion 21 and the substrate 9. It is possible to easily maintain the concentration of the inert gas. Further, in order to make the flow of the inert gas sprayed onto the substrate 9 approximately uniform over the entire upper surface 91 of the substrate 9, all the shielding elements 251 of the shielding plate 25 are rear end shielding elements as shown in FIG. The posture may be the same as that of 251a.

塗布装置１ｂでは、第１の実施の形態に係る塗布装置１と同様に、カバー部２１および基板保持部１１の下側を覆う下部閉塞部２６（図７．Ａおよび図７．Ｂ参照）が設けられてもよく、カバー部２１の（＋Ｘ）側および（−Ｘ）側に不活性ガス循環機構２１７（図８参照）が設けられてもよい。また、カバー部２１の（−Ｙ）側に、基板９の上面９１に近づくに従って（−Ｙ）側に向かう傾斜面２１８（図９参照）が設けられてもよい。さらには、第２の実施の形態に係る塗布装置１ａと同様に、塗布ヘッド１４とカバー部２１との間に配置されるスリット噴射部２３（図１０参照）、および、スリット噴射部２３と塗布ヘッド１４との間に配置される吸引機構２４（図１０参照）が設けられてもよい。   In the coating apparatus 1b, similarly to the coating apparatus 1 according to the first embodiment, the lower closing portion 26 (see FIGS. 7A and 7B) that covers the lower side of the cover portion 21 and the substrate holding section 11 is provided. An inert gas circulation mechanism 217 (see FIG. 8) may be provided on the (+ X) side and the (−X) side of the cover portion 21. In addition, an inclined surface 218 (see FIG. 9) may be provided on the (−Y) side of the cover portion 21 toward the (−Y) side as it approaches the upper surface 91 of the substrate 9. Furthermore, similarly to the coating apparatus 1a according to the second embodiment, the slit spray unit 23 (see FIG. 10) disposed between the coating head 14 and the cover unit 21, and the slit spray unit 23 and coating. A suction mechanism 24 (see FIG. 10) disposed between the head 14 and the head 14 may be provided.

以上、本発明の実施の形態について説明してきたが、本発明は上記実施の形態に限定されるものではなく、様々な変更が可能である。   As mentioned above, although embodiment of this invention has been described, this invention is not limited to the said embodiment, A various change is possible.

第１の実施の形態に係る塗布装置１では、側板２１５の下端部において、側底板２１５１と基板保持部１１との間に、図１５．Ａないし図１５．Ｅに例示するラビンリンス構造２１９が形成されてもよい。このようなラビリンス構造２１９が設けられることにより、側板２１５と基板９との間からカバー部２１の内部空間へ空気が進入することがより一層抑制される。また、図１５．Ｅに示すラビリンス構造２１９では、溝部２１５２に液体が充填されることによりラビリンス構造２１９がシールされ、カバー部２１の内部空間への空気の進入が防止される。なお、溝部２１５２に充填される液体を磁性流体とし、溝部２１５２の底部に磁石２１５３を設けることにより、当該液体が溝部２１５２から流出することが容易に防止される。   In the coating apparatus 1 according to the first embodiment, at the lower end portion of the side plate 215, between the side bottom plate 2151 and the substrate holding portion 11, FIG. A thru | or FIG. A Rabin rinse structure 219 exemplified in E may be formed. By providing such a labyrinth structure 219, it is further suppressed that air enters the internal space of the cover portion 21 from between the side plate 215 and the substrate 9. FIG. In the labyrinth structure 219 shown in E, the labyrinth structure 219 is sealed by filling the groove portion 2152 with a liquid, and the ingress of air into the internal space of the cover portion 21 is prevented. In addition, the liquid with which the groove part 2152 is filled is made into a magnetic fluid, and the magnet 2153 is provided in the bottom part of the groove part 2152, so that the liquid can be easily prevented from flowing out of the groove part 2152.

側底板２１５１は、図１６．Ａに示すように、基板保持部１１の（＋Ｘ）側および（−Ｘ）側の側面から側方に突出するように設けられもよい。また、図１６．Ｂに示すように、基板保持部１１から突出する側底板２１５１と側板２１５との間にラビリンス構造２１９が設けられてもよい。さらには、図１７に示すように、カバー部２１の下端縁を基板９の上面９１よりも上方に位置させ、基板９の上面９１とカバー部２１の噴出面２１１との間の空間を（＋Ｘ）側および（−Ｘ）側から覆う２つの側板２１５が、基板保持部１１のＸ方向の両側に設けられてもよい。   The side bottom plate 2151 is shown in FIG. As shown to A, you may provide so that it may protrude from the side surface of the (+ X) side of the board | substrate holding | maintenance part 11 and the (-X) side. FIG. As shown in B, a labyrinth structure 219 may be provided between the side bottom plate 2151 and the side plate 215 protruding from the substrate holding part 11. Further, as shown in FIG. 17, the lower end edge of the cover portion 21 is positioned above the upper surface 91 of the substrate 9, and the space between the upper surface 91 of the substrate 9 and the ejection surface 211 of the cover portion 21 is (+ X ) Side and (−X) side, two side plates 215 may be provided on both sides of the substrate holding part 11 in the X direction.

第１の実施の形態に係る塗布装置１では、図７．Ａおよび図７．Ｂに示す蛇腹状の伸縮部２６１を有する下部閉塞部２６に代えて、図１８．Ａおよび図１８．Ｂに示すシャッター状の伸縮部２６１ａを有する下部閉塞部２６ａや、図１９．Ａおよび図１９．Ｂに示す軸２６２を中心としてロール状に巻き取られる伸縮部２６１ｂを有する下部閉塞部２６ｂが設けられてもよい。また、図２０．Ａおよび図２０．Ｂに示すように、カバー部２１の噴出面２１１の（−Ｙ）側の領域を覆うとともに、基板９の（＋Ｙ）方向への移動に伴って（＋Ｙ）側へと移動する下部閉塞部２６ｃが塗布装置１に設けられてもよい。   In the coating apparatus 1 according to the first embodiment, FIG. A and FIG. In place of the lower closing portion 26 having the bellows-like stretchable portion 261 shown in FIG. A and FIG. 19. A lower closing portion 26a having a shutter-like expansion / contraction portion 261a shown in FIG. A and FIG. A lower closing portion 26b having an expansion / contraction portion 261b wound around in a roll shape around the shaft 262 shown in B may be provided. FIG. A and FIG. As shown in B, the lower closing portion 26c that covers the (−Y) side region of the ejection surface 211 of the cover portion 21 and moves to the (+ Y) side as the substrate 9 moves in the (+ Y) direction. May be provided in the coating apparatus 1.

図２１．Ａは、不活性ガス噴出機構２の他の例を示す底面図である。図２１．Ａに示す例では、下部閉塞部２６ｄは、略Ｃ字状の固定部２６３、および、固定部２６３の（＋Ｘ）側および（−Ｘ）側の部位から内側へと突出する複数の板状の可動部２６４を備える。そして、図２１．Ｂに示すように、基板保持部１１（下部閉塞部２６ｄと同じ高さにおける断面にて示す。）が下部閉塞部２６ｄと重なる位置まで移動する際には、複数の可動部２６４が基板保持部１１を避けるように移動することにより、カバー部２１の下方が下部閉塞部２６ｄにより覆われた状態が維持され、不活性ガスの使用量を低減することができる。   FIG. A is a bottom view showing another example of the inert gas ejection mechanism 2. FIG. FIG. In the example shown in A, the lower blocking portion 26d includes a substantially C-shaped fixing portion 263 and a plurality of plate-like shapes protruding inward from the (+ X) side and (−X) side portions of the fixing portion 263. A movable part 264 is provided. And FIG. As shown in B, when the substrate holding part 11 (shown in a cross section at the same height as the lower closing part 26d) moves to a position where it overlaps with the lower closing part 26d, the plurality of movable parts 264 have the substrate holding part. 11, the state where the lower part of the cover part 21 is covered with the lower closing part 26d is maintained, and the amount of inert gas used can be reduced.

塗布装置１では、流動性材料の塗布が終了した基板９がカバー部２１の下方を通過してカバー部２１の（＋Ｙ）側から装置外に搬出されてもよい。基板９がカバー部２１の（＋Ｙ）側から搬出される場合、カバー部２１の（＋Ｙ）側の側板２１６は省略される。また、基板９の通過に伴い、複数の分割チャンバ２１３からの不活性ガスの噴出が、（−Ｙ）側から（＋Ｙ）側に向かって順次停止される。なお、基板９通過後も分割チャンバ２１３から少量の不活性ガスの噴出が継続されてもよく、これにより、次の基板９に対する所定の流量の不活性ガスの噴出を迅速に行うことができる。   In the coating apparatus 1, the substrate 9 on which the application of the flowable material has been completed may pass below the cover part 21 and be carried out of the apparatus from the (+ Y) side of the cover part 21. When the substrate 9 is carried out from the (+ Y) side of the cover part 21, the side plate 216 on the (+ Y) side of the cover part 21 is omitted. Further, as the substrate 9 passes, the ejection of the inert gas from the plurality of divided chambers 213 is sequentially stopped from the (−Y) side toward the (+ Y) side. Note that a small amount of inert gas may continue to be ejected from the divided chamber 213 even after passing through the substrate 9, whereby the inert gas having a predetermined flow rate to the next substrate 9 can be rapidly ejected.

第２の実施の形態に係る塗布装置１ａでは、スリット噴射部２３によるガスカーテンによりカバー部２１と基板９との間の空間における不活性ガスの濃度維持が実現できるのであれば、吸引機構２４は省略されてもよい。また、塗布装置１ａでは、スリット噴射部２３に代えて、ボールバルブ等の局所的にガスを噴出する複数の機構をＸ方向に配列することにより、上述のガスカーテンが形成されてもよい。   In the coating apparatus 1a according to the second embodiment, if the inert gas concentration can be maintained in the space between the cover part 21 and the substrate 9 by the gas curtain by the slit injection part 23, the suction mechanism 24 is It may be omitted. Further, in the coating apparatus 1a, the above-described gas curtain may be formed by arranging a plurality of mechanisms, such as a ball valve, for locally ejecting gas in the X direction instead of the slit ejection unit 23.

第３の実施の形態に係る塗布装置１ｂでは、図１１に示す複数の遮蔽要素２５１が、Ｘ方向に平行な回転軸を中心として回転することなく、噴出面２１１の（＋Ｘ）側または（−Ｘ）側へと個別に移動することにより、噴出面２１１の一部が開放されてもよい。また、複数の遮蔽要素２５１を有する遮蔽板２５に代えて、図２２．Ａおよび図２２．Ｂに示す１枚の遮蔽板２５ａがカバー部２１の下方に設けられてもよい。遮蔽板２５ａは破線にて簡略化して示す連結部材２５３を介して基板保持部１１に連結されており、基板９が基板保持部１１と共に（＋Ｙ）方向へ移動する際に、当該移動に伴って遮蔽板２５ａも（＋Ｙ）方向へと移動し、これにより、噴出面２１１の遮蔽板２５ａによる遮蔽が（−Ｙ）側から（＋Ｙ）側に向かって順次開放される。   In the coating apparatus 1b according to the third embodiment, the plurality of shielding elements 251 shown in FIG. 11 do not rotate around the rotation axis parallel to the X direction, and the (+ X) side or (− A part of the ejection surface 211 may be opened by individually moving to the X) side. Further, in place of the shielding plate 25 having a plurality of shielding elements 251, FIG. A and FIG. One shielding plate 25 a shown in B may be provided below the cover portion 21. The shielding plate 25a is connected to the substrate holding part 11 via a connecting member 253 that is simplified by a broken line. When the substrate 9 moves together with the substrate holding part 11 in the (+ Y) direction, The shielding plate 25a also moves in the (+ Y) direction, whereby the shielding of the ejection surface 211 by the shielding plate 25a is sequentially opened from the (−Y) side to the (+ Y) side.

上記実施の形態に係る塗布装置では、基板移動機構１２による基板９および基板保持部１１の移動に代えて、塗布ヘッド１４が副走査方向に移動することにより、副走査方向における基板９の塗布ヘッド１４に対する相対移動が行われてもよい。また、ヘッド移動機構１５による塗布ヘッド１４の移動に代えて、基板９および基板保持部１１が主走査方向に移動することにより、主走査方向における塗布ヘッド１４の基板９に対する相対移動が行われてもよい。さらには、塗布ヘッド１４から吐出される有機ＥＬ液は、隔壁が設けられていない基板９の上面９１にストライプ状に塗布されてもよい。   In the coating apparatus according to the above embodiment, instead of the movement of the substrate 9 and the substrate holding unit 11 by the substrate moving mechanism 12, the coating head 14 moves in the sub-scanning direction, whereby the coating head for the substrate 9 in the sub-scanning direction. A relative movement with respect to 14 may be performed. Further, instead of the movement of the coating head 14 by the head moving mechanism 15, the substrate 9 and the substrate holder 11 move in the main scanning direction, so that the coating head 14 moves relative to the substrate 9 in the main scanning direction. Also good. Furthermore, the organic EL liquid discharged from the coating head 14 may be applied in a stripe pattern on the upper surface 91 of the substrate 9 on which no partition wall is provided.

塗布装置では、正孔輸送材料を含む流動性材料が基板９に塗布されてもよい。ここで、「正孔輸送材料」とは、有機ＥＬ表示装置の正孔輸送層を形成する材料であり、「正孔輸送層」とは、有機ＥＬ材料により形成された有機ＥＬ層へと正孔を輸送する狭義の正孔輸送層のみを意味するのではなく、正孔の注入を行う正孔注入層も含む。また、上記塗布装置は、必ずしも有機ＥＬ表示装置用の有機ＥＬ材料または正孔輸送材料を含む流動性材料の塗布のみに利用されるわけではなく、例えば、液晶表示装置やプラズマ表示装置等の平面表示装置用の基板に対し、着色材料や蛍光材料等の他の種類の画素形成材料を含む流動性材料を塗布する場合に利用されてもよく、半導体基板等の様々な基板に対する様々な種類の流動性材料の塗布に利用されてもよい。さらには、塗布装置の不活性ガスの噴出に係る構造は、インクジェット方式のように断続的に流動性材料を吐出して基板上に塗布する装置にも適用することができる。   In the coating apparatus, a fluid material containing a hole transport material may be applied to the substrate 9. Here, the “hole transport material” is a material that forms a hole transport layer of an organic EL display device, and the “hole transport layer” is a positive electrode that is formed into an organic EL layer formed of an organic EL material. It means not only a narrowly defined hole transport layer that transports holes, but also includes a hole injection layer that injects holes. Further, the coating device is not necessarily used only for coating a fluid material containing an organic EL material or a hole transport material for an organic EL display device. For example, a flat surface of a liquid crystal display device, a plasma display device, or the like. It may be used when applying a fluid material containing other types of pixel forming materials such as coloring materials and fluorescent materials to a substrate for a display device. You may utilize for application | coating of a fluid material. Furthermore, the structure relating to the ejection of the inert gas of the coating apparatus can be applied to an apparatus that intermittently discharges a fluid material and applies the material onto a substrate, such as an inkjet method.

１，１ａ，１ｂ 塗布装置
２ 不活性ガス噴出機構
９ 基板
１１ 基板保持部
１２ 基板移動機構
１４ 塗布ヘッド
１５ ヘッド移動機構
２１ カバー部
２２，２２ａ 噴出領域制御部
２３ スリット噴射部
２４ 吸引機構
２５ 遮蔽板
９１ 上面
２１１ 噴出面
２１４ 噴出口
２１５ 側板
２１８ 傾斜面
２３１ 噴出口
２５１ 遮蔽要素
２５１ａ 後端遮蔽要素
２５１１ 回転軸 1, 1a, 1b Coating device 2 Inert gas ejection mechanism 9 Substrate 11 Substrate holding unit 12 Substrate moving mechanism 14 Coating head 15 Head moving mechanism 21 Cover unit 22, 22a Ejection area control unit 23 Slit ejecting unit 24 Suction mechanism 25 Shielding plate 91 Upper surface 211 Ejection surface 214 Ejection port 215 Side plate 218 Inclined surface 231 Ejection port 251 Shielding element 251a Rear end shielding element 2511 Rotating shaft

Claims (10)

基板に流動性材料を塗布する塗布装置であって、
基板を保持する基板保持部と、
前記基板の主面に向けて流動性材料を吐出する吐出機構と、
前記吐出機構を前記主面に平行な主走査方向に前記基板に対して相対的に移動するとともに、前記主走査方向への移動が行われる毎に前記基板を前記吐出機構に対して前記主走査方向に垂直かつ前記主面に平行な副走査方向に相対的に移動する移動機構と、
前記副走査方向における前記基板の相対移動方向前側において前記吐出機構に隣接して配置され、前記基板の前記主面に塗布された前記流動性材料に向けて不活性ガスを噴出する不活性ガス噴出機構と、
を備え、
前記不活性ガス噴出機構が、
前記基板の前記主面に垂直な方向に関して前記基板から離間しつつ前記主面を前記主走査方向の全長に亘って覆うとともに不活性ガスの噴出領域が変更可能な噴出面を有するカバー部と、
前記基板の前記副走査方向への相対移動に伴って前記基板の前記主面と前記噴出面との重複面積が増大するに従って、前記噴出面における前記噴出領域を、前記基板の前記相対移動方向前側へと拡大する噴出領域制御部と、
を備えることを特徴とする塗布装置。 An application device for applying a flowable material to a substrate,
A substrate holder for holding the substrate;
A discharge mechanism for discharging a flowable material toward the main surface of the substrate;
The ejection mechanism moves relative to the substrate in a main scanning direction parallel to the main surface, and each time the movement in the main scanning direction is performed, the substrate is moved relative to the ejection mechanism. A moving mechanism that moves relative to the sub-scanning direction perpendicular to the direction and parallel to the main surface;
Inert gas ejection that is disposed adjacent to the ejection mechanism on the front side of the substrate in the sub-scanning direction relative to the relative movement direction and ejects an inert gas toward the flowable material applied to the main surface of the substrate. Mechanism,
With
The inert gas ejection mechanism is
A cover portion having a jetting surface that covers the main surface over the entire length in the main scanning direction while being spaced apart from the substrate in a direction perpendicular to the main surface of the substrate and capable of changing a jetting region of the inert gas;
As the overlapping area of the main surface of the substrate and the ejection surface increases with relative movement of the substrate in the sub-scanning direction, the ejection region on the ejection surface is moved forward in the relative movement direction of the substrate. An ejection area control unit that expands into
A coating apparatus comprising: 請求項１に記載の塗布装置であって、
前記副走査方向に互いに隣接して配列されるとともにそれぞれが前記基板の前記主走査方向の全長に亘る複数の噴出口が前記カバー部の前記噴出面に設けられ、
前記噴出領域制御部により前記複数の噴出口への前記不活性ガスの供給が個別に制御され、前記基板の前記副走査方向への相対移動に伴って前記基板の前記主面と前記噴出面との重複面積が増大するに従って、前記複数の噴出口からの前記不活性ガスの噴出が、前記基板の相対移動方向後側の噴出口から前記相対移動方向前側の噴出口に向かって順次開始されることを特徴とする塗布装置。 The coating apparatus according to claim 1,
A plurality of jet outlets arranged adjacent to each other in the sub-scanning direction and extending over the entire length of the substrate in the main scanning direction are provided on the jetting surface of the cover part,
The supply of the inert gas to the plurality of ejection ports is individually controlled by the ejection region control unit, and the main surface and the ejection surface of the substrate are moved along with the relative movement of the substrate in the sub-scanning direction. As the overlapping area increases, the inactive gas is ejected from the plurality of ejection ports sequentially from the rear ejection port on the substrate in the relative movement direction toward the ejection port on the front side in the relative movement direction. An applicator characterized by that. 請求項２に記載の塗布装置であって、
前記複数の噴出口からそれぞれ噴出する前記不活性ガスの単位面積当たりの流量が互いに等しいことを特徴とする塗布装置。 The coating apparatus according to claim 2,
The coating apparatus characterized in that the flow rates per unit area of the inert gas ejected from the plurality of ejection ports are equal to each other. 請求項１に記載の塗布装置であって、
前記不活性ガス噴出機構が、前記噴出面に対向することにより前記噴出面からの不活性ガスの噴出を部分的に遮る遮蔽板をさらに備え、
前記基板の前記副走査方向への相対移動に伴って前記基板の前記主面と前記噴出面との重複面積が増大するに従って、前記噴出領域制御部により、前記遮蔽板による前記噴出面全体の遮蔽が前記基板の相対移動方向後側から前記相対移動方向前側に向かって順次開放されることを特徴とする塗布装置。 The coating apparatus according to claim 1,
The inert gas ejection mechanism further includes a shielding plate that partially blocks the ejection of the inert gas from the ejection surface by facing the ejection surface;
As the overlapping area between the main surface of the substrate and the ejection surface increases with relative movement of the substrate in the sub-scanning direction, the ejection area control unit shields the entire ejection surface by the shielding plate. Are sequentially opened from the rear side in the relative movement direction of the substrate toward the front side in the relative movement direction. 請求項４に記載の塗布装置であって、
前記遮蔽板が、前記副走査方向に互いに隣接して配列されるとともにそれぞれが前記噴出面の前記主走査方向の全長に亘る板状であって前記主走査方向に平行な回転軸を中心として回転する複数の遮蔽要素を備え、
前記複数の遮蔽要素のうち最も前記相対移動方向後側に位置する遮蔽要素である後端遮蔽要素が回転して前記噴出面の一部が開放される際に、前記後端遮蔽要素が、前記基板の前記主面に垂直な方向に関して前記基板の前記主面に近づくに従って前記相対移動方向後側に向かう姿勢とされることにより、前記後端遮蔽要素近傍において前記基板の前記主面に垂直な方向に関して前記基板の前記主面に向かうとともに前記相対移動方向後側に向かう前記不活性ガスの流れが形成されることを特徴とする塗布装置。 The coating apparatus according to claim 4,
The shielding plates are arranged adjacent to each other in the sub-scanning direction, and each is a plate-like shape that extends over the entire length of the ejection surface in the main scanning direction and rotates about a rotation axis parallel to the main scanning direction. A plurality of shielding elements
When a part of the ejection surface is opened most above with rear shielding element is rotated a shielding element positioned relative movement direction rear side of the plurality of shielding elements, the rear shielding element, said With respect to the direction perpendicular to the main surface of the substrate, the posture is directed toward the rear side in the relative movement direction as the main surface of the substrate is approached, so that it is perpendicular to the main surface of the substrate in the vicinity of the rear end shielding element. The coating apparatus characterized in that a flow of the inert gas is formed toward the main surface of the substrate with respect to the direction and toward the rear side in the relative movement direction. 請求項１ないし５のいずれかに記載の塗布装置であって、
前記基板保持部または前記不活性ガス噴出機構の前記カバー部が、前記基板の前記主面と前記カバー部の前記噴出面との間の空間を前記主走査方向の両側から覆う側板を備えることを特徴とする塗布装置。 A coating apparatus according to any one of claims 1 to 5,
The substrate holding part or the cover part of the inert gas ejection mechanism includes a side plate that covers a space between the main surface of the substrate and the ejection surface of the cover part from both sides in the main scanning direction. A characteristic coating apparatus. 請求項１ないし６のいずれかに記載の塗布装置であって、
前記不活性ガス噴出機構が、
前記カバー部と前記吐出機構との間に配置されるとともに前記基板の前記主走査方向の全長に亘るスリット状の噴出口から、前記基板の前記主面に向けて前記噴出面からの前記不活性ガスの噴出速度よりも高速にて不活性ガスを噴出するスリット噴射部をさらに備えることを特徴とする塗布装置。 The coating apparatus according to any one of claims 1 to 6,
The inert gas ejection mechanism is
The inert gas from the ejection surface disposed between the cover portion and the ejection mechanism and from the slit-shaped ejection port extending over the entire length of the substrate in the main scanning direction toward the main surface of the substrate. A coating apparatus, further comprising a slit spray unit that jets an inert gas at a higher speed than a gas jet speed. 請求項７に記載の塗布装置であって、
前記不活性ガス噴出機構が、前記スリット噴射部と前記吐出機構との間に配置されてガスを吸引する吸引機構をさらに備えることを特徴とする塗布装置。 The coating apparatus according to claim 7,
The coating apparatus according to claim 1, wherein the inert gas ejection mechanism further includes a suction mechanism that is disposed between the slit ejection unit and the ejection mechanism to suck the gas. 請求項１ないし８のいずれかに記載の塗布装置であって、
前記噴出面の前記副走査方向の長さが、前記基板の前記主面の前記副走査方向の長さよりも長いことを特徴とする塗布装置。 A coating apparatus according to any one of claims 1 to 8,
The coating apparatus, wherein a length of the ejection surface in the sub-scanning direction is longer than a length of the main surface of the substrate in the sub-scanning direction. 請求項１ないし９のいずれかに記載の塗布装置であって、
前記吐出機構近傍において前記基板の前記主面に向かう空気の流れが形成されており、
前記不活性ガス噴出機構が、前記噴出面の前記基板の相対移動方向後側の端部近傍において前記空気の流れの中に配置されるとともに前記基板の前記主面に近づくに従って前記相対移動方向後側に向かう傾斜面を有することを特徴とする塗布装置。 A coating apparatus according to any one of claims 1 to 9,
An air flow toward the main surface of the substrate is formed in the vicinity of the discharge mechanism,
The inert gas ejection mechanism is disposed in the air flow near the end of the ejection surface on the rear side in the relative movement direction of the substrate, and as the closer to the main surface of the substrate, the rearward in the relative movement direction. A coating apparatus having an inclined surface directed to the side.
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