JP2004042001A - Injection coating device and injection application method of pattern forming material - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily treat the change of the pitch of a pattern to be formed. <P>SOLUTION: A discharge head 22 is provided with a plurality of discharge holes 25 in a straight line. The discharge holes 25 are disposed at a predetermined pitch in a direction crossing with a head travel direction A and a rotation driving part of the discharge head 22 is provided. While the pitch of a pattern formed on a substrate is changed by controlling the rotation angles θ of the discharge head 22, a pattern forming material is injection applied on the substrate. Thereby, an extraction electrode pattern 30 is formed on the substrate while corresponding to the change of the pitch. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an injection coating method and an injection coating apparatus for a pattern forming material, and more particularly to an injection coating apparatus and an injection coating apparatus for injection coating a pattern forming material on a substrate when an electrode pattern for a display panel is formed on the substrate. About the method.
[0002]
[Prior art]
First, as an example of a display panel, a structure of a general plasma display panel (hereinafter, referred to as PDP) will be described. FIG. 1 is an exploded perspective view showing an internal structure of the PDP, and FIG. 2 is a plan view schematically showing a structure of a row electrode pair 2 (X, Y) of the PDP.
[0003]
In FIG. 1, a plurality of row electrode pairs 2 (X, Y), a dielectric layer 3 covering the row electrode pairs 2 (X, Y), a dielectric layer 3, a protective layer 4 made of MgO is formed in order. The row electrode pair 2 is composed of a transparent electrode 2a made of a transparent conductive film such as ITO having a large width, and a metal electrode (bus electrode) 2b made of a metal film having a small width to supplement the conductivity.
[0004]
On the other hand, on the rear glass substrate 5 on the rear side opposed to the discharge space 8, columns are arranged in a direction orthogonal to the row electrode pairs 2 (X, Y), and a display cell is formed at each intersection. The three primary color phosphor layers 7 </ b> R provided between the electrodes 6 and 6 in a strip shape and partitioning the discharge space 8 so as to cover the side surfaces of the column electrode 6 and the partition 9 with respect to the discharge space 8. , 7G, 7B are formed. A rare gas is injected and sealed in the discharge space 8.
[0005]
As shown in FIG. 2, each row electrode pair 2 (X, Y) corresponds to one line (row) L in a matrix display, and alternates in the column direction so as to be adjacent to each other with a discharge gap G interposed therebetween. Are arranged. In each line L, a display cell (discharge cell) is defined in the unit light emitting region E by each row electrode pair 2 (X, Y).
[0006]
Next, the display operation of the display in the above PDP will be described.
First, by performing an address operation by selective discharge between the column electrode 6 and the row electrode pair 2 (X, Y) shown in FIG. 2, a lighted cell (a cell on which wall charges are formed) and a light-off cell (a wall charge is formed). Cell that was not performed) is selected. After the address operation, by applying a sustaining pulse to all the lines L simultaneously and alternately to the row electrode pairs X and Y, a surface discharge is generated in the lighting cell every time the sustaining pulse is applied. The phosphor layers 7R, 7G, and 7B are excited by the ultraviolet light generated by the surface discharge to emit visible light.
[0007]
By the way, in the case of manufacturing a display panel such as the PDP described above, conventionally, the formation of the bus electrode 2b and the column electrode 6 has generally been performed by batch formation using photolithography.
[0008]
However, electrode formation by photolithography has problems such as poor material utilization and the use of large amounts of water. Recently, as another method for solving this problem, a paste in which fine metal powder has been dispersed has been applied to an inkjet or dispenser. Has proposed an injection coating method for forming a pattern directly on a substrate.
[0009]
[Problems to be solved by the invention]
However, when the above-described injection coating method is adopted, although the above-described problem in photolithography can be solved, another problem occurs.
That is, when a dispenser is used, although a straight portion can be easily formed in the electrode pattern, a method of drawing with one nozzle is used to draw a pattern in which the pitch changes like a lead portion. Or, or a method of using a complex head having a large number of nozzles with variable nozzle pitch, but in the former case the throughput is reduced, in the latter case the drawing accuracy and controllability are poor, etc. In each case there was a problem.
[0010]
In addition, in the case of an ink jet, since a pattern is basically formed by dots, any pattern can be formed by drawing the entire surface of the substrate by scanning, but there is a problem of reduction in throughput.
[0011]
The present invention has been made in view of the above circumstances, and has an improved pattern forming material injection coating apparatus which can easily cope with a change in the pitch of a pattern to be formed while improving throughput, accuracy and controllability. And an injection coating method.
[0012]
[Means for Solving the Problems]
In order to achieve the above object, the invention according to claim 1 is an injection coating apparatus for forming a predetermined pattern for a display panel on a substrate by injection coating a pattern forming material, wherein the pattern forming material A plurality of ejection holes for ejecting the ejection head, an ejection head in which opening centers are arranged at a predetermined pitch along a same straight line in a direction intersecting a head traveling direction with respect to the substrate, and the ejection head and the substrate are relatively positioned. A relative movement drive unit for moving, and an ejection head rotation drive unit for changing a pitch of a pattern formed on the substrate by rotating the ejection head in a plane parallel to a pattern formation surface of the substrate. Features.
[0013]
The invention according to claim 6 is an injection coating method for forming a predetermined pattern for a display panel on a substrate by injection coating a pattern forming material from a discharge head, wherein the pattern forming material is formed from the discharge head. A method of injection-coating a pattern-forming material, characterized in that the discharge head and the substrate are relatively moved while discharging, and the discharge head is rotated in a plane parallel to a pattern-forming surface of the substrate. .
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 3 is a perspective view illustrating a schematic configuration of the injection coating apparatus according to the embodiment. Here, a dispenser in which an electrode forming material (pattern forming material) is injection-coated on a front substrate (hereinafter simply referred to as a substrate) 1 of a PDP will be described as an example. The injection coating device 10 forms a predetermined electrode pattern on the substrate 1 by injection coating of an electrode forming material. A pattern of the transparent electrode 2a is formed on the substrate 1 in advance. A case where an electrode forming material is injection-coated on the substrate 1 to form a metal electrode (bus electrode) along the line will be described.
[0015]
As shown in FIG. 3, the injection coating device 10 is provided with a base 11 as a mounting table for the substrate 1, a portal frame 12 disposed so as to straddle the base 11, and movably mounted on the portal frame 12. And a discharge device 20. The base 11 is moved in the X-axis direction with respect to the portal frame 12 by an X-axis moving mechanism (corresponding to a relative movement drive unit) not shown.
[0016]
The discharge device 20 is moved in a Y-axis direction orthogonal to the X-axis direction by a Y-axis moving mechanism (not shown) provided on the portal frame 12. At the time of injection coating, the substrate 1 and the ejection device 20 are relatively moved mainly with the X-axis direction as the traveling direction.
[0017]
Therefore, the substrate 1 is placed on the base 11 with the pattern forming direction aligned with the X-axis direction. When the substrate 1 is placed on the base 11, the pattern forming surface of the substrate 1 is located in the XY plane.
[0018]
As shown in FIG. 4, the discharge device 20 includes a discharge head 22 having a plurality of discharge holes 25 for discharging a pattern forming material (the electrode forming material in the present embodiment) toward the substrate 1, and a point O. An ejection head rotation drive unit 24 for rotating the ejection head 22 around the center is provided. The ejection holes 25 are arranged at a predetermined pitch along the same straight line in the direction intersecting the head advancing direction (X-axis direction) with respect to the substrate 1. The pitch of the ejection holes 25 is the maximum of the pattern to be formed. It is set equal to the pitch. Alternatively, it may be set larger than the maximum pitch of the pattern to be formed.
[0019]
The ejection head rotation drive unit 24 is for rotating the ejection head 22 in a plane parallel to the pattern formation surface of the substrate 1 (that is, in the XY plane), and for example, sets a position orthogonal to the X-axis direction. The rotation angle θ of the ejection head 22 can be arbitrarily adjusted based on the reference.
[0020]
When the ejection head 22 is rotated by the angle θ in this manner, the pattern formation pitch P2 = P1 cos θ, assuming that the reference pitch = P1 as shown in FIGS. 4B and 4C. Therefore, by controlling the rotation angle θ of the ejection head 22, the pitch of the pattern formed on the substrate 1 can be changed.
[0021]
Therefore, for example, as shown in FIG. 5, it is possible to form a pattern of the bus electrode 2b such that the pitch changes from within the display area along the lead-out portion 2c as a single stroke.
[0022]
Next, an injection coating method for forming the extraction electrode pattern 30 as shown in FIG. 6 using the above-described injection coating apparatus 10 will be described. The lead electrode pattern 30 is gradually narrowed from the region where the electrode pitch is constant in the pattern forming direction A.
[0023]
When a pattern in which such an electrode pitch is changed is formed, as shown in FIGS. 7 and 8, the discharge head 22 and the substrate are relatively moved while discharging the pattern forming material from the discharge head 22 so that the pattern is formed on the substrate 1. To form a pattern. At this time, the pattern forming material is applied by injection while changing the pitch of the pattern formed on the substrate by rotating the ejection head 22.
[0024]
That is, when the pattern forming material is applied by injection to the area where the pitch changes, the pattern shown is formed by controlling the rotation angle θ of the ejection head 22 and the amount of movement of the substrate in association with each other.
[0025]
FIG. 7 shows a case where one block is formed by one ejection head 22, and FIG. 8 shows a case where one block is formed by a plurality of (two in the figure) ejection heads 22. 7 and 8, (a) shows a state in which the ejection head is not rotated (θ = 0), and (b) shows a state in which the ejection head is rotated by an angle θ. By rotating the ejection head 22 by the angle θ, the pattern formation pitch changes from P1 to P2 (= P1 cos θ).
[0026]
By rotating the ejection head 22 in this manner, it is possible to easily cope with a change in pitch. Therefore, it is not necessary to use an ejection head having a complicated structure equipped with a variable-pitch nozzle, and control can be simplified.
[0027]
Further, the pitch can be easily adjusted only by rotating the ejection head 22, so that good drawing accuracy can be maintained. In addition, since the pattern forming material can be simultaneously ejected from the large number of ejection holes 25 and drawn on the substrate, the throughput can be improved.
[0028]
One specific example of the electrode pattern formed as described above is shown in the plan view of FIG. As shown in FIG. 9, the electrode pattern 40 in the PDP is composed of a large number of electrodes, and the pattern 40 is formed by injecting the pattern forming material for one block by one head using the above-described injection coating apparatus. It can be formed by drawing on a substrate. Alternatively, one block may be formed by injecting a pattern forming material with two heads and drawing on a substrate.
[0029]
In the above-described embodiment, an example is described in which a lead portion of a row electrode (lead portion by a bus electrode) is formed as a pattern. However, the present invention is applicable to a pattern formation in which a pitch of a lead portion of a column electrode changes. It is also applicable.
[0030]
In the above embodiment, the case of a dispenser has been described, but the present invention can also be applied to an ink jet type injection coating apparatus.
In the case of the ink jet type, if the traveling direction of the discharge head is made to coincide with the extending direction of the electrode, useless head traveling such as scanning over the entire surface is not required, and the throughput can be improved.
[0031]
If a pattern forming material discharge amount control unit for controlling the discharge amount of the pattern forming material from the plurality of discharge holes 25 is added to the above-described injection coating apparatus, the pattern forming operation can be more finely controlled. .
[0032]
Further, if a pattern forming material discharge amount control unit capable of adjusting the discharge amounts of the plurality of discharge holes 25 is adopted as the pattern forming material discharge amount control unit, finer control can be performed.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view showing an internal structure of a general PDP.
FIG. 2 is a plan view schematically showing a structure of a row electrode pair in the PDP of FIG.
FIG. 3 is a perspective view illustrating a schematic configuration of an injection coating apparatus according to an embodiment of the present invention.
4A and 4B are schematic configuration diagrams of an ejection head in the injection coating apparatus of FIG. 3, wherein FIG. 4A is a side view, FIG. 4B is a bottom view, and FIG. 4C is a bottom view when the ejection head is rotated by an angle θ. It is.
FIG. 5 is a plan view of a substrate on which a pattern is to be formed by the injection coating apparatus of FIG. 3;
FIG. 6 is a plan view of a lead electrode pattern formed on the substrate of FIG. 5;
FIG. 7 is an explanatory diagram of an operation of the ejection head when a lead electrode pattern is formed by one ejection head.
FIG. 8 is an operation explanatory view of a discharge head when a lead electrode pattern is formed by two discharge heads.
FIG. 9 is a plan view showing a specific example of an electrode pattern.
[Explanation of symbols]
1 Substrate 10 Injection coating device 22 Discharge head 24 Discharge head rotation drive unit 25 Discharge hole 30 Extraction electrode pattern

Claims (9)

An injection coating apparatus for forming a predetermined pattern for a display panel on a substrate by injection coating a pattern forming material,
A plurality of discharge holes for injecting the pattern forming material, in a direction intersecting with the head advancing direction with respect to the substrate, a discharge head in which opening centers are arranged at a predetermined pitch along the same straight line,
A relative movement drive unit that relatively moves the ejection head and the substrate,
An ejection head rotation driving unit that changes a pitch of a pattern formed on the substrate by rotating the ejection head in a plane parallel to a pattern formation surface of the substrate, and injecting a pattern forming material. Coating device. 2. The apparatus according to claim 1, wherein a pitch of the plurality of ejection holes is set to be substantially equal to or greater than a maximum pitch of a pattern to be formed. 3. 3. The apparatus according to claim 1, further comprising a pattern forming material discharge amount control unit that controls a discharge amount of the pattern forming material from the plurality of discharge holes. 4. 4. The apparatus according to claim 3, wherein the pattern forming material discharge amount control unit is capable of adjusting discharge amounts of the plurality of discharge holes, respectively. 5. 5. The injection coating apparatus for a pattern forming material according to claim 1, wherein the pattern forming material is an electrode forming material. An injection coating method for forming a predetermined pattern for a display panel on a substrate by injection coating a pattern forming material from a discharge head,
While discharging the pattern forming material from the discharge head, the discharge head and the substrate are relatively moved, and the discharge head is rotated in a plane parallel to the pattern forming surface of the substrate. Injection coating method of the pattern forming material to be applied. The ejection head is characterized in that a plurality of ejection holes for ejecting the pattern forming material are arranged at a predetermined pitch along the same straight line in the direction intersecting the head traveling direction with respect to the substrate. An injection coating method of the pattern forming material according to claim 6. 8. The method according to claim 6, wherein the ejection amount is adjusted in each of the plurality of ejection holes, and the ejection is performed. The method according to any one of claims 6 to 8, wherein the pattern forming material is an electrode forming material.

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