JP5332081B2 - Resin composition and molded article comprising the same - Google Patents
Resin composition and molded article comprising the same Download PDFInfo
- Publication number
- JP5332081B2 JP5332081B2 JP2006158158A JP2006158158A JP5332081B2 JP 5332081 B2 JP5332081 B2 JP 5332081B2 JP 2006158158 A JP2006158158 A JP 2006158158A JP 2006158158 A JP2006158158 A JP 2006158158A JP 5332081 B2 JP5332081 B2 JP 5332081B2
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- Prior art keywords
- structural unit
- acid
- parts
- resin
- weight
- Prior art date
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- 239000011342 resin composition Substances 0.000 title claims description 18
- 239000000835 fiber Substances 0.000 claims description 50
- 229920005989 resin Polymers 0.000 claims description 48
- 239000011347 resin Substances 0.000 claims description 48
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 37
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 35
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims description 32
- 229920000412 polyarylene Polymers 0.000 claims description 31
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 28
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims description 27
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 claims description 23
- 239000007788 liquid Substances 0.000 claims description 21
- 239000000155 melt Substances 0.000 claims description 19
- 238000002844 melting Methods 0.000 claims description 18
- 230000008018 melting Effects 0.000 claims description 18
- 229920000728 polyester Polymers 0.000 claims description 17
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 claims description 13
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims description 10
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 claims description 10
- 238000000465 moulding Methods 0.000 claims description 10
- 239000011256 inorganic filler Substances 0.000 claims description 7
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 7
- 238000000034 method Methods 0.000 description 25
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 23
- 239000000047 product Substances 0.000 description 18
- 238000010438 heat treatment Methods 0.000 description 17
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 15
- 229910052751 metal Inorganic materials 0.000 description 15
- 239000002184 metal Substances 0.000 description 15
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 13
- 125000003118 aryl group Chemical group 0.000 description 12
- 239000004734 Polyphenylene sulfide Substances 0.000 description 11
- 239000000945 filler Substances 0.000 description 11
- 239000000203 mixture Substances 0.000 description 11
- 229920000069 polyphenylene sulfide Polymers 0.000 description 11
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 10
- 239000003960 organic solvent Substances 0.000 description 10
- 229920000642 polymer Polymers 0.000 description 10
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 9
- 229920000106 Liquid crystal polymer Polymers 0.000 description 9
- 238000003756 stirring Methods 0.000 description 9
- 229920005992 thermoplastic resin Polymers 0.000 description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 239000002253 acid Substances 0.000 description 8
- -1 aromatic dicarboxylic acids Chemical class 0.000 description 8
- 238000005406 washing Methods 0.000 description 8
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 6
- 239000007822 coupling agent Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 238000001746 injection moulding Methods 0.000 description 6
- 229910052757 nitrogen Inorganic materials 0.000 description 6
- 229920006111 poly(hexamethylene terephthalamide) Polymers 0.000 description 6
- 238000011282 treatment Methods 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 5
- 229920002292 Nylon 6 Polymers 0.000 description 5
- 239000002216 antistatic agent Substances 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 239000004033 plastic Substances 0.000 description 5
- 229920003023 plastic Polymers 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- 239000000454 talc Substances 0.000 description 5
- 229910052623 talc Inorganic materials 0.000 description 5
- 229910001369 Brass Inorganic materials 0.000 description 4
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 125000001931 aliphatic group Chemical group 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 239000010951 brass Substances 0.000 description 4
- 238000007707 calorimetry Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229920006122 polyamide resin Polymers 0.000 description 4
- 229920006149 polyester-amide block copolymer Polymers 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 235000011054 acetic acid Nutrition 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000012765 fibrous filler Substances 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 229920002647 polyamide Polymers 0.000 description 3
- 239000004645 polyester resin Substances 0.000 description 3
- 229920001225 polyester resin Polymers 0.000 description 3
- 229920006123 polyhexamethylene isophthalamide Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- QPFMBZIOSGYJDE-UHFFFAOYSA-N 1,1,2,2-tetrachloroethane Chemical compound ClC(Cl)C(Cl)Cl QPFMBZIOSGYJDE-UHFFFAOYSA-N 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical group O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 2
- KAUQJMHLAFIZDU-UHFFFAOYSA-N 6-Hydroxy-2-naphthoic acid Chemical compound C1=C(O)C=CC2=CC(C(=O)O)=CC=C21 KAUQJMHLAFIZDU-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 239000005995 Aluminium silicate Substances 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 2
- 235000010893 Bischofia javanica Nutrition 0.000 description 2
- 240000005220 Bischofia javanica Species 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- 241000790917 Dioxys <bee> Species 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- IPRJXAGUEGOFGG-UHFFFAOYSA-N N-butylbenzenesulfonamide Chemical compound CCCCNS(=O)(=O)C1=CC=CC=C1 IPRJXAGUEGOFGG-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 238000010306 acid treatment Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 2
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- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 125000005530 alkylenedioxy group Chemical group 0.000 description 2
- 235000012211 aluminium silicate Nutrition 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
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- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000004917 carbon fiber Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000007385 chemical modification Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
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- 239000004927 clay Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
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- JXTHNDFMNIQAHM-UHFFFAOYSA-N dichloroacetic acid Chemical compound OC(=O)C(Cl)Cl JXTHNDFMNIQAHM-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
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- 230000006872 improvement Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 150000002763 monocarboxylic acids Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
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- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
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- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
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- JITSWUFGPFIMFG-UHFFFAOYSA-N 1,1,2,2,4-pentachlorobutane Chemical compound ClCCC(Cl)(Cl)C(Cl)Cl JITSWUFGPFIMFG-UHFFFAOYSA-N 0.000 description 1
- SCYULBFZEHDVBN-UHFFFAOYSA-N 1,1-Dichloroethane Chemical compound CC(Cl)Cl SCYULBFZEHDVBN-UHFFFAOYSA-N 0.000 description 1
- OCJBOOLMMGQPQU-UHFFFAOYSA-N 1,4-dichlorobenzene Chemical compound ClC1=CC=C(Cl)C=C1 OCJBOOLMMGQPQU-UHFFFAOYSA-N 0.000 description 1
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- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
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- WUPHOULIZUERAE-UHFFFAOYSA-N 3-(oxolan-2-yl)propanoic acid Chemical compound OC(=O)CCC1CCCO1 WUPHOULIZUERAE-UHFFFAOYSA-N 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- 239000004953 Aliphatic polyamide Substances 0.000 description 1
- KWIUHFFTVRNATP-UHFFFAOYSA-N Betaine Natural products C[N+](C)(C)CC([O-])=O KWIUHFFTVRNATP-UHFFFAOYSA-N 0.000 description 1
- 239000004132 Calcium polyphosphate Substances 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical class NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- KWIUHFFTVRNATP-UHFFFAOYSA-O N,N,N-trimethylglycinium Chemical compound C[N+](C)(C)CC(O)=O KWIUHFFTVRNATP-UHFFFAOYSA-O 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920000299 Nylon 12 Polymers 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 229920003231 aliphatic polyamide Polymers 0.000 description 1
- 150000008051 alkyl sulfates Chemical class 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- CUBCNYWQJHBXIY-UHFFFAOYSA-N benzoic acid;2-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=CC=C1.OC(=O)C1=CC=CC=C1O CUBCNYWQJHBXIY-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 229960003237 betaine Drugs 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 229910052980 cadmium sulfide Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 235000019827 calcium polyphosphate Nutrition 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- FOCAUTSVDIKZOP-UHFFFAOYSA-N chloroacetic acid Chemical compound OC(=O)CCl FOCAUTSVDIKZOP-UHFFFAOYSA-N 0.000 description 1
- 229940106681 chloroacetic acid Drugs 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
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- 229930003836 cresol Natural products 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 229960005215 dichloroacetic acid Drugs 0.000 description 1
- IMHDGJOMLMDPJN-UHFFFAOYSA-N dihydroxybiphenyl Natural products OC1=CC=CC=C1C1=CC=CC=C1O IMHDGJOMLMDPJN-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- POLCUAVZOMRGSN-UHFFFAOYSA-N dipropyl ether Chemical compound CCCOCCC POLCUAVZOMRGSN-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000000706 filtrate Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 210000004209 hair Anatomy 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
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- 235000000396 iron Nutrition 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000011490 mineral wool Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- 229910052982 molybdenum disulfide Inorganic materials 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000001579 optical reflectometry Methods 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 125000005740 oxycarbonyl group Chemical group [*:1]OC([*:2])=O 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000001818 polyoxyethylene sorbitan monostearate Substances 0.000 description 1
- 235000010989 polyoxyethylene sorbitan monostearate Nutrition 0.000 description 1
- 229920001955 polyphenylene ether Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- YGSDEFSMJLZEOE-UHFFFAOYSA-M salicylate Chemical compound OC1=CC=CC=C1C([O-])=O YGSDEFSMJLZEOE-UHFFFAOYSA-M 0.000 description 1
- 229960001860 salicylate Drugs 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 229920006012 semi-aromatic polyamide Polymers 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 229940048181 sodium sulfide nonahydrate Drugs 0.000 description 1
- WMDLZMCDBSJMTM-UHFFFAOYSA-M sodium;sulfanide;nonahydrate Chemical compound O.O.O.O.O.O.O.O.O.[Na+].[SH-] WMDLZMCDBSJMTM-UHFFFAOYSA-M 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- MHSKRLJMQQNJNC-UHFFFAOYSA-N terephthalamide Chemical compound NC(=O)C1=CC=C(C(N)=O)C=C1 MHSKRLJMQQNJNC-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Description
本発明は、低そり性、ピン圧入強度に優れ、かつ、可視光領域(400〜700nm波長)での高反射特性を有する樹脂組成物に関するものである。 The present invention relates to a resin composition excellent in low warpage and pin press-fit strength and having high reflection characteristics in a visible light region (400 to 700 nm wavelength).
これまで樹脂化が困難とされていた分野への用途開拓も盛んに試みられ、樹脂に対する要求性能は、益々多様化すると共に厳しくなる傾向にある。 There have been many attempts to develop applications in fields where resinization has been difficult so far, and the required performance for resins tends to become more diversified and stricter.
近年、電気・電子用途の軽量・高性能化が進む中、モバイルパソコン、携帯電話、PDA等に用いられるコネクタなどで小型・軽量化のため、更なる薄肉化と寸法精度が、求められるようになってきた。また、照明器具等においてもパソコン用ディスプレー、テレビ等の液晶画面のバックライト、照明用あるいは自動車用のライト、インスツルメントパネル、アクセサリー用照明器具などに消費電力が少なく、長寿命の半導体素子が使用が増加しており、この半導体素子パッケージに用いる反射板に、易加工性や軽量化の観点から、熱可塑性樹脂製反射板が使用されている。しかし、反射板には高い反射率を有することが要求されるため、反射板表面には、通常、メッキ加工が施されるが、工程が煩雑となるため、メッキ加工工程が不要で、かつ反射率が高い樹脂製反射板の開発が望まれ、これまで種々の改良方法が提案されている。 In recent years, with the progress of lightweight and high performance for electrical and electronic applications, connectors for use in mobile personal computers, cellular phones, PDAs, etc. are required to be thinner and more dimensional accuracy for miniaturization and weight reduction. It has become. Also in lighting fixtures, low power consumption and long-life semiconductor elements are used for backlights for LCD screens of personal computers, televisions, etc., lighting or automotive lights, instrument panels, accessory lighting fixtures, etc. The use is increasing, and the reflector made from a thermoplastic resin is used for the reflector used for this semiconductor element package from a viewpoint of easy workability and weight reduction. However, since the reflecting plate is required to have a high reflectance, the surface of the reflecting plate is usually subjected to plating. However, the process is complicated, so that the plating step is not necessary and the reflecting plate is not reflective. Development of a resin reflector having a high rate is desired, and various improvement methods have been proposed so far.
上記課題の改良方法として例えば、熱可塑性ポリエステルに針状酸化チタンを添加する方法(特許文献1参照)、ポリフェニレンエーテル系樹脂、ポリアミド樹脂およびゴム状物質の組成物にシロキサン処理した特定の針状酸化チタンを添加する方法(特許文献2参照)、熱可塑性樹脂にチタン酸カリウム含有化合物を添加する方法(特許文献3参照)が提案されている。 Examples of methods for improving the above-described problems include a method of adding acicular titanium oxide to thermoplastic polyester (see Patent Document 1), a specific acicular oxidation in which a composition of polyphenylene ether resin, polyamide resin and rubber-like substance is treated with siloxane. A method of adding titanium (see Patent Document 2) and a method of adding a potassium titanate-containing compound to a thermoplastic resin (see Patent Document 3) have been proposed.
しかしながら、特許文献1、特許文献2および特許文献3にて提案されている材料が、ともに成形品のそり性および成形品組み立て時に必要なピン圧入強度が十分とは言えず、さらに可視光領域での反射率を向上させるために用いるフィラーの充填量を増加させた場合、成形品ソリが増大し、かえって反射率の低下を招くという問題があり、実用上満足できるものではなかった。
本発明は、上述した従来の問題点を解消し、熱可塑性樹脂の特徴である製品設計自由度および生産性を保持しつつ、低そり性、ピン圧入強度に優れ、かつ、可視光領域(400〜700nm波長)での高反射特性を有する樹脂組成物を提供することを課題とする。 The present invention eliminates the above-described conventional problems, maintains the product design freedom and productivity that are the characteristics of thermoplastic resins, and is excellent in low warpage, pin press-fit strength, and in the visible light region (400 It is an object of the present invention to provide a resin composition having high reflection characteristics at a wavelength of ˜700 nm.
本発明者らは、上記問題点を解決するために鋭意検討を重ねた結果、本発明に至った。 As a result of intensive studies to solve the above problems, the present inventors have reached the present invention.
すなわち本発明は、
(1)(A)融点(Tm)+10℃の条件で、ずり速度1,000(1/秒)で測定した溶融粘度が0.5〜80Pa・sであり、p−ヒドロキシ安息香酸から生成した構造単位、4,4’−ジヒドロキシビフェニルから生成した構造単位、ハイドロキノンから生成した構造単位、テレフタル酸から生成した構造単位およびイソフタル酸から生成した構造単位からなる液晶性ポリエステルおよび/または300℃、剪断速度1000/秒で測定した溶融粘度が80Pa・s以下であるポリアリーレンスルフィド樹脂100重量部に対し、(B)平均繊維長2μm以上10μm以下であり、平均繊維長(l)を平均繊維径(d)で除した値(l/d)が12以上50以下である針状酸化チタンを10〜250重量部配合してなる樹脂組成物、
(2)さらに(C)針状酸化チタンを除く無機フィラーを(A)融点(Tm)+10℃の条件で、ずり速度1,000(1/秒)で測定した溶融粘度が0.5〜80Pa・sであり、p−ヒドロキシ安息香酸から生成した構造単位、4,4’−ジヒドロキシビフェニルから生成した構造単位、ハイドロキノンから生成した構造単位、テレフタル酸から生成した構造単位およびイソフタル酸から生成した構造単位からなる液晶性ポリエステルおよび/または300℃、剪断速度1000/秒で測定した溶融粘度が80Pa・s以下であるポリアリーレンスルフィド樹脂100重量部に対して5〜150重量部配合してなる上記(1)記載の樹脂組成物、
(3)上記(1)または(2)記載の樹脂組成物を成形してなる成形品、
(4)成形品が電気・電子部品である(3)記載の成形品、および
(5)電気・電子部品が筐体、リフレクタまたはコネクタである(4)記載の成形品、
である。
That is, the present invention
(1) (A) Melting viscosity measured at a shear rate of 1,000 (1 / sec) under the condition of melting point (Tm) + 10 ° C. is 0.5 to 80 Pa · s, and produced from p-hydroxybenzoic acid. structural units, 4,4'-dihydroxybiphenyl a structural unit produced from liquid crystalline polyester and / or 300 consists Haidorokino down or we generated structural units, structural units and isophthalic acid produced from terephthalic acid or al a structural unit produced (B) average fiber length of 2 μm to 10 μm and average fiber length (l) averaged with respect to 100 parts by weight of polyarylene sulfide resin having a melt viscosity of 80 Pa · s or less measured at 1000 ° C. and a shear rate of 1000 / sec. A resin composition comprising 10 to 250 parts by weight of acicular titanium oxide having a value (l / d) divided by fiber diameter (d) of 12 or more and 50 or less ,
(2 ) Further, (C) the inorganic filler excluding acicular titanium oxide has a melt viscosity of 0.5 to 80 Pa measured at a shear rate of 1,000 (1 / second) under the conditions of (A) melting point (Tm) + 10 ° C. · a s, p-hydroxybenzoic acid structural unit produced from 4,4' a structural unit produced from dihydroxybiphenyl, Haidorokino down or we generated structural units, structural units and isophthalic acid or we generated from terephthalic acid 5 to 150 parts by weight is blended with 100 parts by weight of the liquid crystalline polyester composed of the generated structural unit and / or polyarylene sulfide resin having a melt viscosity of 80 Pa · s or less measured at 300 ° C. and a shear rate of 1000 / second. comprising (1) Symbol placement of the resin composition,
( 3 ) A molded product formed by molding the resin composition according to (1) or (2) above,
(4) molded article is an electrical and electronic components (3), wherein the molded article, and (5) electric and electronic parts housing, a reflector or connector (4), wherein the molded article,
It is.
本発明は、低そり性、ピン圧入強度に優れ、かつ、可視光領域(4000〜700nm波長)での高反射特性に優れていることから、本特性が必要とされる電気・電子部品、特に筐体、リフレクタ、コネクタなどの用途に特に実用的に用いることができる。 Since the present invention is excellent in low warpage and pin press-in strength and excellent in high reflection characteristics in the visible light region (4000 to 700 nm wavelength), it is particularly necessary for electric / electronic components that require this characteristic. It can be used particularly practically for applications such as housings, reflectors and connectors.
以下、本発明を詳細に説明する。なお本発明において「重量」とは「質量」を意味する。 Hereinafter, the present invention will be described in detail. In the present invention, “weight” means “mass”.
本発明における熱可塑性樹脂は、(A)融点(Tm)+10℃の条件で、ずり速度1,000(1/秒)で測定した溶融粘度が0.5〜80Pa・sであり、p−ヒドロキシ安息香酸から生成した構造単位、4,4’−ジヒドロキシビフェニル、ハイドロキノン等の芳香族ジヒドロキシ化合物から生成した構造単位、テレフタル酸およびイソフタル酸などの芳香族ジカルボン酸から生成した構造単位の液晶性ポリエステルおよび/または300℃、剪断速度1000/秒で測定した溶融粘度が80Pa・s以下であるポリアリーレンスルフィド樹脂が使用できる。具体例としては、例えば、液晶性ポリマー(液晶性ポリエステル樹脂、液晶性ポリエステルアミド樹脂など)、ポリアリーレンスルフィド樹脂から選ばれる1種または2種以上の混合物が挙げられる。 The thermoplastic resin in the present invention, under the condition of (A) a melting point (Tm) + 10 ° C., melt viscosity measured at a shear rate of 1,000 (1 / second) Ri 0.5~80Pa · s der, p- Liquid crystalline polyester of structural units generated from hydroxybenzoic acid, structural units generated from aromatic dihydroxy compounds such as 4,4′-dihydroxybiphenyl and hydroquinone, and structural units generated from aromatic dicarboxylic acids such as terephthalic acid and isophthalic acid A polyarylene sulfide resin having a melt viscosity of 80 Pa · s or less measured at 300 ° C. and a shear rate of 1000 / sec can be used. Specific examples thereof include a liquid crystal polymer (liquid crystalline polyester resins, liquid crystal polyester amide resin), one or a mixture of two or more can be mentioned selected from Po Leary sulfide resin.
ポリアミド樹脂の具体例としては、例えば環状ラクタムの開環重合物、アミノカルボン酸の重縮合物、ジカルボン酸とジアミンとの重縮合物などが挙げられ、具体的にはナイロン4・6、あるいは、ポリノナンメチレンテレフタルアミドなどの脂肪族ポリアミド、ナイロン6/ポリ(ヘキサメチレンテレフタルアミド)、ナイロン6・6/ポリ(ヘキサメチレンテレフタルアミド)、ナイロン6/ナイロン6・6/ポリ(ヘキサメチレンイソフタルアミド)、ポリ(ヘキサメチレンイソフタルアミド)/ポリ(ヘキサメチレンテレフタルアミド)、ナイロン6/ポリ(ヘキサメチレンイソフタルアミド)/ポリ(ヘキサメチレンテレフタルアミド)、ナイロン12/ポリ(ヘキサメチレンテレフタルアミド)、ポリ(メチルペンタメチレンテレフタルアミド)/ポリ(ヘキサメチレンテレフタルアミド)等の半芳香族ナイロンが挙げられる。 Specific examples of the polyamide resin include ring-opening polymers of cyclic lactams, polycondensates of aminocarboxylic acids, such as polycondensates of a dicarboxylic acid and a diamine, and the like, specifically or nylon 4.6, , Aliphatic polyamides such as polynonanemethylene terephthalamide, nylon 6 / poly (hexamethylene terephthalamide), nylon 6/6 / poly (hexamethylene terephthalamide), nylon 6 / nylon 6/6 / poly (hexamethylene isophthalamide) ), poly (hexamethylene isophthalamide) / poly (hexamethylene terephthalamide), nylon 6 / poly (hexamethylene isophthalamide) / poly (hexamethylene terephthalamide), nylon 12 / poly (hexamethylene terephthalamide), Po Li (Methyl pentamethylenete And semi-aromatic nylons such as (rephthalamide) / poly (hexamethylene terephthalamide) .
特に上述したポリアミドのうち、リフローなどの処理工程ならびに実使用環境下で耐えうる耐熱性を得るため、融点(Tm)が280℃以上が好ましく、290℃以上がより好ましく、300℃以上が特に好ましい。 In particular, among the polyamides described above, the melting point (Tm) is preferably 280 ° C. or higher, more preferably 290 ° C. or higher, and particularly preferably 300 ° C. or higher, in order to obtain heat resistance that can withstand treatment steps such as reflow and actual use environments. .
ここで融点(Tm)とは、示差熱量測定において、ポリマーを室温から20℃/分の昇温条件で測定した際に観測される吸熱ピーク温度(Tm1)の観測後、Tm1+20℃の温度で5分間保持した後、20℃/分の降温条件で室温まで一旦冷却した後、再度20℃/分の昇温条件で測定した際に観測される吸熱ピーク温度(Tm2)とした。 Here, the melting point (Tm) is 5 at a temperature of Tm1 + 20 ° C. after observing an endothermic peak temperature (Tm1) observed when the polymer is measured at room temperature from 20 ° C./min in differential calorimetry. After maintaining for 20 minutes, the sample was once cooled to room temperature under a temperature-decreasing condition of 20 ° C./min, and the endothermic peak temperature (Tm 2) observed when measured again under a temperature-raising condition of 20 ° C./min.
本発明に使用する融点が280℃以上のポリアミド樹脂は、本発明のピン圧入特性と流動性とのバランスを得るため、25℃における硫酸溶液相対粘度(1%濃度)が、1.5〜3.5であることが好ましく、1.8〜3.0がより好ましく、2.0〜2.7がさらに好ましい。 The polyamide resin used in the present invention having a melting point of 280 ° C. or higher has a sulfuric acid solution relative viscosity (concentration of 1%) at 25 ° C. of 1.5 to 3 in order to obtain a balance between the pin press-fitting property and fluidity of the present invention. 0.5, more preferably 1.8 to 3.0, and still more preferably 2.0 to 2.7.
また、液晶性ポリマーの代表例としては、異方性溶融相を形成し得る樹脂であり、エステル結合を有するものが好ましい。例えば芳香族オキシカルボニル単位、芳香族ジオキシ単位、芳香族および/または脂肪族ジカルボニル単位、アルキレンジオキシ単位などから選ばれた構造単位からなり、かつ異方性溶融相を形成する液晶性ポリエステル樹脂、あるいは、上記構造単位と芳香族イミノカルボニル単位、芳香族ジイミノ単位、芳香族イミノオキシ単位などから選ばれた構造単位からなり、かつ異方性溶融相を形成する液晶性ポリエステルアミド樹脂などが挙げられ、具体的には、p−ヒドロキシ安息香酸および6−ヒドロキシ−2−ナフトエ酸から生成した構造単位からなる液晶性ポリエステル、p−ヒドロキシ安息香酸から生成した構造単位、6−ヒドロキシ−2−ナフトエ酸から生成した構造単位、芳香族ジヒドロキシ化合物および/または芳香族ジカルボン酸から生成した構造単位からなる液晶性ポリエステル、p−ヒドロキシ安息香酸から生成した構造単位、4,4’−ジヒドロキシビフェニルから生成した構造単位、テレフタル酸、イソフタル酸等の芳香族ジカルボン酸および/またはアジピン酸、セバシン酸等の脂肪族ジカルボン酸から生成した構造単位からなる液晶性ポリエステル、p−ヒドロキシ安息香酸から生成した構造単位、エチレングリコールから生成した構造単位、テレフタル酸から生成した構造単位からなる液晶性ポリエステル、p−ヒドロキシ安息香酸から生成した構造単位、エチレングリコールから生成した構造単位、4,4’−ジヒドロキシビフェニルから生成した構造単位、テレフタル酸から生成した構造単位からなる液晶性ポリエステル、p−ヒドロキシ安息香酸から生成した構造単位、エチレングリコールから生成した構造単位、テレフタル酸およびイソフタル酸から生成した構造単位からなる液晶性ポリエステル、p−ヒドロキシ安息香酸から生成した構造単位、ハイドロキノンから生成した構造単位、4,4’−ジヒドロキシビフェニルから生成した構造単位、テレフタル酸およびイソフタル酸から生成した構造単位からなる液晶性ポリエステル、p−ヒドロキシ安息香酸から生成した構造単位、エチレングリコールから生成した構造単位、芳香族ジヒドロキシ化合物から生成した構造単位、テレフタル酸、イソフタル酸、2,6−ナフタレンジカルボン酸などの芳香族ジカルボン酸から生成した構造単位からなる液晶性ポリエステルなど、また液晶性ポリエステルアミド樹脂としては、芳香族オキシカルボニル単位、芳香族ジオキシ単位、芳香族および/または脂肪族ジカルボニル単位、アルキレンジオキシ単位などから選ばれた構造単位以外にさらにp−アミノフェノールから生成したp−イミノフェノキシ単位を含有した異方性溶融相を形成するポリエステルアミドである。 A typical example of the liquid crystalline polymer is a resin that can form an anisotropic molten phase, and preferably has an ester bond. For example, a liquid crystalline polyester resin comprising a structural unit selected from an aromatic oxycarbonyl unit, an aromatic dioxy unit, an aromatic and / or aliphatic dicarbonyl unit, an alkylenedioxy unit, etc., and forming an anisotropic melt phase Or a liquid crystalline polyester amide resin comprising a structural unit selected from the structural unit and an aromatic iminocarbonyl unit, an aromatic diimino unit, an aromatic iminooxy unit, etc., and forming an anisotropic melt phase. Specifically, a liquid crystalline polyester comprising a structural unit produced from p-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid, a structural unit produced from p-hydroxybenzoic acid, 6-hydroxy-2-naphthoic acid Structural units, aromatic dihydroxy compounds and / or aromatic dicals generated from A liquid crystalline polyester comprising a structural unit produced from an acid, a structural unit produced from p-hydroxybenzoic acid, a structural unit produced from 4,4′-dihydroxybiphenyl, an aromatic dicarboxylic acid such as terephthalic acid and isophthalic acid, and / or Or a liquid crystalline polyester comprising a structural unit produced from an aliphatic dicarboxylic acid such as adipic acid or sebacic acid, a structural unit produced from p-hydroxybenzoic acid, a structural unit produced from ethylene glycol, or a structural unit produced from terephthalic acid A liquid crystalline polyester, a structural unit produced from p-hydroxybenzoic acid, a structural unit produced from ethylene glycol, a structural unit produced from 4,4′-dihydroxybiphenyl, a liquid crystalline polyester comprising a structural unit produced from terephthalic acid, p-hydroxybenzo Structural units produced from acids, structural units produced from ethylene glycol, liquid crystalline polyesters comprising structural units produced from terephthalic acid and isophthalic acid, structural units produced from p-hydroxybenzoic acid, structural units produced from hydroquinone, 4 , 4′-dihydroxybiphenyl structural unit, liquid crystalline polyester composed of terephthalic acid and isophthalic acid structural unit, p-hydroxybenzoic acid structural unit, ethylene glycol structural unit, aromatic dihydroxy Structural units generated from compounds, liquid crystalline polyesters composed of structural units generated from aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, and 2,6-naphthalenedicarboxylic acid, and liquid crystalline polyester amide resins include aromatic In addition to a structural unit selected from oxycarbonyl units, aromatic dioxy units, aromatic and / or aliphatic dicarbonyl units, alkylenedioxy units, etc., a different type containing a p-iminophenoxy unit generated from p-aminophenol. Polyesteramide that forms an isotropic melt phase.
上述した液晶性ポリマーのうち、液晶性ポリエステル樹脂が好ましく、機械的性質、成形性などの点から、p−ヒドロキシ安息香酸から生成した構造単位、4,4’−ジヒドロキシビフェニル、ハイドロキノン等の芳香族ジヒドロキシ化合物から生成した構造単位、テレフタル酸およびイソフタル酸などの芳香族ジカルボン酸から生成した構造単位の液晶性ポリエステルが特に好ましく用いられる。 Among the liquid crystalline polymer described above is preferably a liquid crystalline polyester resin, the mechanical properties, the point or these moldability, a structural unit derived from p- hydroxybenzoic acid, 4,4'-dihydroxybiphenyl, fragrance hydroquinone A liquid crystalline polyester having a structural unit generated from an aromatic dicarboxylic acid such as terephthalic acid and isophthalic acid is particularly preferably used.
本発明に使用する液晶性ポリマーは、フィラーを高充填した場合の流動性低下を抑制するため、溶融粘度は0.5〜80Pa・sが好ましく、特に1〜50Pa・sがより好ましい。また、流動性がより優れた組成物を得ようとする場合には、溶融粘度を40Pa・s以下とすることが好ましい。 The liquid crystalline polymer used in the present invention preferably has a melt viscosity of 0.5 to 80 Pa · s, more preferably 1 to 50 Pa · s in order to suppress a decrease in fluidity when the filler is highly filled. Moreover, when trying to obtain a composition with more excellent fluidity, the melt viscosity is preferably 40 Pa · s or less.
なお、この溶融粘度は融点(Tm)+10℃の条件で、ずり速度1,000(1/秒)の条件下で高化式フローテスターによって測定した値である。 The melt viscosity is a value measured by a Koka flow tester under the condition of melting point (Tm) + 10 ° C. and shear rate of 1,000 (1 / second).
ここで、融点(Tm)とは示差熱量測定において、重合を完了したポリマーを室温から20℃/分の昇温条件で測定した際に観測される吸熱ピーク温度(Tm1 )の観測後、Tm1 +20℃の温度で5分間保持した後、20℃/分の降温条件で室温まで一旦冷却した後、再度20℃/分の昇温条件で測定した際に観測される吸熱ピーク温度(Tm2 )を指す。 Here, the melting point (Tm) is the Tm1 +20 after the observation of the endothermic peak temperature (Tm1) observed when the polymer having been polymerized is measured from room temperature under the temperature rising condition at 20 ° C./min in the differential calorimetry. This is the endothermic peak temperature (Tm2) that is observed when the temperature is kept at a temperature of 5 ° C. for 5 minutes, cooled to room temperature under a temperature drop condition of 20 ° C./minute, and then measured again under a temperature rise condition of 20 ° C./minute. .
ポリアリーレンスルフィド樹脂の代表例としては、ポリフェニレンスルフィド(以下、PPSと略す場合もある)、ポリフェニレンスルフィドスルホン、ポリフェニレンスルフィドケトン、これらのランダム共重合体、ブロック共重合体およびそれらの混合物などが挙げられ、中でもポリフェニレンスルフィドが特に好ましく使用される。かかるポリフェニレンスルフィドは、下記構造式で示される繰り返し単位を好ましくは70モル%以上、より好ましくは90モル%以上含む重合体であり、上記繰り返し単位が70モル%以上の場合には、耐熱性が優れる点で好ましい。 Typical examples of the polyarylene sulfide resin include polyphenylene sulfide (hereinafter sometimes abbreviated as PPS), polyphenylene sulfide sulfone, polyphenylene sulfide ketone, random copolymers thereof, block copolymers, and mixtures thereof. Of these, polyphenylene sulfide is particularly preferably used. Such polyphenylene sulfide is a polymer containing a repeating unit represented by the following structural formula, preferably 70 mol% or more, more preferably 90 mol% or more. When the repeating unit is 70 mol% or more, the heat resistance is high. It is preferable at an excellent point.
また、かかるポリフェニレンスルフィド樹脂は、その繰り返し単位の30モル%以下を、下記の構造式を有する繰り返し単位などで構成することが可能であり、ランダム共重合体、ブロック共重合体であってもよく、それらの混合物であってもよい。 In addition, the polyphenylene sulfide resin can be composed of 30 mol% or less of the repeating unit with a repeating unit having the following structural formula, and may be a random copolymer or a block copolymer. Or a mixture thereof.
かかるポリアリーレンスルフィド樹脂は、通常公知の方法、つまり特公昭45−3368号公報に記載される比較的分子量の小さな重合体を得る方法あるいは特公昭52−12240号公報や特開昭61−7332号公報に記載される比較的分子量の大きな重合体を得る方法などによって製造することができる。 Such polyarylene sulfide resins are generally known in the art, that is, a method for obtaining a polymer having a relatively small molecular weight described in JP-B-45-3368, or JP-B-52-12240 and JP-A-61-7332. It can be produced by a method for obtaining a polymer having a relatively large molecular weight described in the publication.
本発明においては、上記のようにして得られたポリアリーレンスルフィド樹脂を、空気中加熱による架橋/高分子量化、窒素などの不活性ガス雰囲気下あるいは減圧下での熱処理、有機溶媒、熱水、酸水溶液などによる洗浄、酸無水物、アミン、イソシアネート、官能基含有ジスルフィド化合物などの官能基含有化合物による活性化などの種々の処理を施した上で使用することも、もちろん可能である。 In the present invention, the polyarylene sulfide resin obtained as described above is subjected to crosslinking / polymerization by heating in air, heat treatment under an inert gas atmosphere such as nitrogen or under reduced pressure, an organic solvent, hot water, Of course, it is possible to use it after various treatments such as washing with an acid aqueous solution, activation with a functional group-containing compound such as an acid anhydride, amine, isocyanate, or a functional group-containing disulfide compound.
ポリアリーレンスルフィド樹脂を加熱により架橋/高分子量化する場合の具体的方法としては、空気、酸素などの酸化性ガス雰囲気下あるいは前記酸化性ガスと窒素、アルゴンなどの不活性ガスとの混合ガス雰囲気下で、加熱容器中で所定の温度において希望する溶融粘度が得られるまで加熱を行う方法を例示することができる。この場合の加熱処理温度としては、好ましくは150〜280℃、より好ましくは200〜270℃の範囲が選択して使用され、処理時間としては、好ましくは0.5〜100時間、より好ましくは2〜50時間の範囲が選択されるが、この両者をコントロールすることによって、目標とする粘度レベルを得ることができる。かかる加熱処理の装置は、通常の熱風乾燥機でもまた回転式あるいは撹拌翼付の加熱装置であってもよいが、効率よくしかもより均一に処理する場合は、回転式あるいは撹拌翼付の加熱装置を用いるのがより好ましい。 Specific methods for crosslinking / high molecular weight polyarylene sulfide resin by heating include an atmosphere of an oxidizing gas such as air or oxygen, or a mixed gas atmosphere of the oxidizing gas and an inert gas such as nitrogen or argon. Below, a method of heating until a desired melt viscosity is obtained at a predetermined temperature in a heating container can be exemplified. In this case, the heat treatment temperature is preferably 150 to 280 ° C., more preferably 200 to 270 ° C., and the treatment time is preferably 0.5 to 100 hours, more preferably 2 A range of ˜50 hours is selected, but by controlling both, a target viscosity level can be obtained. Such a heat treatment apparatus may be a normal hot air dryer or a heating apparatus with a rotary or stirring blade. However, in the case of efficient and more uniform treatment, a heating apparatus with a rotary or stirring blade is used. Is more preferable.
ポリアリーレンスルフィド樹脂を窒素などの不活性ガス雰囲気下あるいは減圧下で熱処理する場合の具体的方法としては、窒素などの不活性ガス雰囲気下あるいは減圧(好ましくは7,000Nm−2以下)下で、加熱処理温度150〜280℃、好ましくは200〜270℃、加熱時間0.5〜100時間、好ましくは2〜50時間の条件で加熱処理する方法を例示することができる。かかる加熱処理の装置は、通常の熱風乾燥機でもまた回転式あるいは撹拌翼付の加熱装置であってもよいが、効率よくしかもより均一に処理する場合は、回転式あるいは撹拌翼付の加熱装置を用いるのがより好ましい。 As a specific method for heat-treating the polyarylene sulfide resin under an inert gas atmosphere such as nitrogen or under reduced pressure, an inert gas atmosphere such as nitrogen or under reduced pressure (preferably 7,000 Nm -2 or less), Examples of the heat treatment method include a heat treatment temperature of 150 to 280 ° C, preferably 200 to 270 ° C, and a heating time of 0.5 to 100 hours, preferably 2 to 50 hours. Such a heat treatment apparatus may be a normal hot air dryer or a heating apparatus with a rotary or stirring blade. However, in the case of efficient and more uniform treatment, a heating apparatus with a rotary or stirring blade is used. Is more preferable.
ポリアリーレンスルフィド樹脂を有機溶媒で洗浄する場合に、洗浄に用いる有機溶媒としては、ポリアリーレンスルフィド樹脂を分解する作用などを有しないものであれば特に制限はなく使用することができる。例えばN−メチルピロリドン、ジメチルホルムアミド、ジメチルアセトアミドなどの含窒素極性溶媒、ジメチルスルホキシド、ジメチルスルホンなどのスルホキシド・スルホン系溶媒、アセトン、メチルエチルケトン、ジエチルケトン、アセトフェノンなどのケトン系溶媒、ジメチルエーテル、ジプロピルエーテル、テトラヒドロフランなどのエーテル系溶媒、クロロホルム、塩化メチレン、トリクロロエチレン、2塩化エチレン、ジクロロエタン、テトラクロロエタン、クロロベンゼンなどのハロゲン系溶媒、メタノール、エタノール、プロパノール、ブタノール、ペンタノール、エチレングリコール、プロピレングリコール、フェノール、クレゾール、ポリエチレングリコールなどのアルコール・フェノール系溶媒、およびベンゼン、トルエン、キシレンなどの芳香族炭化水素系溶媒などが使用される。これらの有機溶媒のなかでも、特にN−メチルピロリドン、アセトン、ジメチルホルムアミドおよびクロロホルムなどが好ましく使用される。また、これらの有機溶媒は、1種類または2種類以上の混合で使用される。 When the polyarylene sulfide resin is washed with an organic solvent, the organic solvent used for washing is not particularly limited as long as it does not have an action of decomposing the polyarylene sulfide resin. For example, nitrogen-containing polar solvents such as N-methylpyrrolidone, dimethylformamide, dimethylacetamide, sulfoxide sulfone solvents such as dimethyl sulfoxide, dimethylsulfone, ketone solvents such as acetone, methyl ethyl ketone, diethyl ketone, acetophenone, dimethyl ether, dipropyl ether , Ether solvents such as tetrahydrofuran, halogen solvents such as chloroform, methylene chloride, trichloroethylene, ethylene chloride, dichloroethane, tetrachloroethane, chlorobenzene, methanol, ethanol, propanol, butanol, pentanol, ethylene glycol, propylene glycol, phenol, Alcohol / phenolic solvents such as cresol and polyethylene glycol, benzene and toluene Ene, and aromatic hydrocarbon solvents such as xylene may be used. Of these organic solvents, N-methylpyrrolidone, acetone, dimethylformamide, chloroform and the like are particularly preferably used. These organic solvents are used alone or in combination of two or more.
かかる有機溶媒による洗浄の具体的方法としては、有機溶媒中にポリアリーレンスルフィド樹脂を浸漬せしめるなどの方法があり、必要により適宜撹拌または加熱することも可能である。有機溶媒でポリアリーレンスルフィド樹脂を洗浄する際の洗浄温度については特に制限はなく、常温〜300℃程度の任意の温度が選択できる。洗浄温度が高くなるほど洗浄効率が高くなる傾向があるが、通常は常温〜150℃の洗浄温度で十分な効果が得られる。なお、有機溶媒洗浄を施されたポリアリーレンスルフィド樹脂は、残留している有機溶媒を除去するため、水または温水で数回洗浄することが好ましい。上記水洗浄の温度は50〜90℃であることが好ましく、60〜80℃であることが好ましい。 As a specific method of washing with such an organic solvent, there is a method of immersing a polyarylene sulfide resin in an organic solvent, and it is possible to appropriately stir or heat as necessary. There is no restriction | limiting in particular about the washing | cleaning temperature at the time of wash | cleaning polyarylene sulfide resin with an organic solvent, Arbitrary temperature of about normal temperature-about 300 degreeC can be selected. Although the cleaning efficiency tends to increase as the cleaning temperature increases, a sufficient effect is usually obtained at a cleaning temperature of room temperature to 150 ° C. The polyarylene sulfide resin that has been washed with an organic solvent is preferably washed several times with water or warm water in order to remove the remaining organic solvent. The water washing temperature is preferably 50 to 90 ° C, and preferably 60 to 80 ° C.
ポリアリーレンスルフィド樹脂を熱水で処理する場合の具体的方法としては、以下の方法を例示することができる。すなわち、熱水洗浄によるポリアリーレンスルフィド樹脂の好ましい化学的変性の効果を発現するために、使用する水は蒸留水あるいは脱イオン水であることが好ましい。熱水処理の操作は、通常、所定量の水に所定量のポリアリーレンスルフィド樹脂を投入し、常圧であるいは圧力容器内で加熱、撹拌することにより行われる。ポリアリーレンスルフィド樹脂と水との割合は、水の多い方がよく、好ましくは水1リットルに対し、ポリアリーレンスルフィド樹脂200g以下の浴比で使用される。 The following method can be illustrated as a specific method when the polyarylene sulfide resin is treated with hot water. That is, the water used is preferably distilled water or deionized water in order to exhibit a preferable chemical modification effect of the polyarylene sulfide resin by hot water washing. The operation of the hot water treatment is usually performed by adding a predetermined amount of polyarylene sulfide resin to a predetermined amount of water, and heating and stirring at normal pressure or in a pressure vessel. The ratio of the polyarylene sulfide resin and water is preferably as much as possible, and is preferably used at a bath ratio of 200 g or less of polyarylene sulfide resin with respect to 1 liter of water.
ポリアリーレンスルフィド樹脂を酸処理する場合の具体的方法としては、以下の方法を例示することができる。すなわち、酸または酸の水溶液にポリアリーレンスルフィド樹脂を浸漬せしめるなどの方法があり、必要により適宜撹拌または加熱することも可能である。用いられる酸としては、ポリアリーレンスルフィド樹脂を分解する作用を有しないものであれば特に制限はなく、ギ酸、酢酸、プロピオン酸、酪酸などの脂肪族飽和モノカルボン酸、クロロ酢酸、ジクロロ酢酸などのハロ置換脂肪族飽和カルボン酸、アクリル酸、クロトン酸などの脂肪族不飽和モノカルボン酸、安息香酸、サリチル酸などの芳香族カルボン酸、シュウ酸、マロン酸、コハク酸、フタル酸、フマル酸などのジカルボン酸、および硫酸、リン酸、塩酸、炭酸、珪酸などの無機酸性化合物などが用いられる。これらの酸のなかでも、特に酢酸、塩酸がより好ましく用いられる。酸処理を施されたポリアリーレンスルフィド樹脂は、残留している酸または塩などを除去するため、水で数回洗浄することが好ましい。上記水洗浄の温度は50〜90℃であることが好ましく、60〜80℃であることが好ましい。また、洗浄に用いる水は、酸処理によるポリアリーレンスルフィド樹脂の好ましい化学的変性の効果を損なわない意味で、蒸留水または脱イオン水であることが好ましい。 The following method can be illustrated as a specific method in the case of acid-treating a polyarylene sulfide resin. That is, there is a method of immersing a polyarylene sulfide resin in an acid or an aqueous solution of an acid, and stirring or heating can be appropriately performed as necessary. The acid used is not particularly limited as long as it does not have the action of decomposing the polyarylene sulfide resin, such as aliphatic saturated monocarboxylic acids such as formic acid, acetic acid, propionic acid and butyric acid, chloroacetic acid and dichloroacetic acid. Halo-substituted aliphatic saturated carboxylic acids, aliphatic unsaturated monocarboxylic acids such as acrylic acid and crotonic acid, aromatic carboxylic acids such as benzoic acid and salicylic acid, oxalic acid, malonic acid, succinic acid, phthalic acid, fumaric acid, etc. Dicarboxylic acid and inorganic acidic compounds such as sulfuric acid, phosphoric acid, hydrochloric acid, carbonic acid and silicic acid are used. Of these acids, acetic acid and hydrochloric acid are particularly preferably used. The polyarylene sulfide resin subjected to the acid treatment is preferably washed several times with water in order to remove the remaining acid or salt. The water washing temperature is preferably 50 to 90 ° C, and preferably 60 to 80 ° C. The water used for washing is preferably distilled water or deionized water in the sense that the effect of the preferred chemical modification of the polyarylene sulfide resin by acid treatment is not impaired.
本発明で用いられるポリアリーレンスルフィド樹脂の溶融粘度は、流動性の向上し、かつ得られた樹脂組成物に組成ムラをなくすために300℃、剪断速度1000/秒の条件下で80Pa・s以下であることが好ましく、50Pa・s以下がより好ましく、30Pa・s以下であることが更に好ましい。溶融粘度の下限については特に制限はないが、5Pa・s以上であることが好ましい。また溶融粘度の異なる2種以上のポリアリーレンスルフィド樹脂を併用して用いてもよい。 The polyarylene sulfide resin used in the present invention has a melt viscosity of 80 Pa · s or less under conditions of 300 ° C. and a shear rate of 1000 / sec in order to improve fluidity and eliminate compositional unevenness in the obtained resin composition. It is preferably 50 Pa · s or less, and more preferably 30 Pa · s or less. Although there is no restriction | limiting in particular about the minimum of melt viscosity, It is preferable that it is 5 Pa.s or more. Two or more polyarylene sulfide resins having different melt viscosities may be used in combination.
なお、ポリアリーレンスルフィド樹脂の溶融粘度は、キャピログラフ(東洋精機(株)社製)装置を用い、ダイス長10mm、ダイス孔直径0.5〜1.0mmの条件により測定することができる。 The melt viscosity of the polyarylene sulfide resin can be measured using a capilograph (manufactured by Toyo Seiki Co., Ltd.) apparatus under conditions of a die length of 10 mm and a die hole diameter of 0.5 to 1.0 mm.
本発明における(B)針状酸化チタンとは、従来の顔料用として多用されている粒状の酸化チタンとは異なり、針状のものであり、結晶構造がルチル型の方が、安定性の点から好ましい。 The (B) acicular titanium oxide in the present invention is different from the granular titanium oxide frequently used for conventional pigments, and is acicular, and the rutile type crystal structure is more stable. To preferred.
(B)針状酸化チタンの平均繊維長については、本発明の効果である高反射率と組成物製造時の針状酸化チタンの折損によるピン圧入強度に代表される強度低下抑制とのバランス化発現のため、2μm以上が必須であり、2.5μm以上が好ましく、5μmがさらに好ましい。上限については、生産性、補強効果の観点から、10μm以下である。 (B) About the average fiber length of acicular titanium oxide, it balances with the high reflectance which is the effect of this invention, and intensity | strength fall suppression represented by the pin press-fit strength by the breakage of acicular titanium oxide at the time of composition manufacture For expression, 2 μm or more is essential, preferably 2.5 μm or more, and more preferably 5 μm. About an upper limit, it is 10 micrometers or less from a viewpoint of productivity and a reinforcement effect.
また、平均繊維長(l)を平均繊維径(d)で除した値(l/d)が、ピン圧入強度、低そり性などの特性を高効率に発現させるために、12以上が好ましく、12〜50の範囲がより好ましく、13〜40の範囲がさらに好ましい。 Further, the value (l / d) obtained by dividing the average fiber length (l) by the average fiber diameter (d) is preferably 12 or more in order to express characteristics such as pin press-in strength and low warpage with high efficiency. The range of 12-50 is more preferable, and the range of 13-40 is more preferable.
なお、平均繊維長(l)および平均繊維径(d)の測定方法は、得られた組成物から成形品を取得し、その成形品を一部切り出し、るつぼに入れて550℃×8時間電気炉で焼成する。その後、灰化した物を100mg採取し、走査型電子顕微鏡(日立製作所製S2100A)を用いて観察、10000倍で写真撮影し、ランダムに500本サンプリングし、各繊維(粒子)の最長部の長さの重量平均値を平均繊維長とした。また、最短部の重量平均値を平均繊維径として算出した。また、他フィラーとの併用、粒子状酸化チタンとの併用の場合、観察倍率を30000倍でXMAにより、フィラーの点分析および面分析により、フィラーを同定し、針状酸化チタンのみをピックアップして平均繊維長および平均繊維径を算出した。粒状酸化チタン併用の場合、形状および厚みにより、ある程度、差異判断可能であるが、加工時の破砕により判断不可能な粒子は、粒子状酸化チタンに含めて算出する。なお、本発明に使用する上記の(B)針状酸化チタンは、その表面を公知のカップリング剤(例えば、シラン系カップリング剤、チタネート系カップリング剤、アルミ系カップリング剤など)、その他の表面処理剤で処理して用いることもできる。 The average fiber length (l) and the average fiber diameter (d) are measured by obtaining a molded product from the obtained composition, partially cutting the molded product, placing it in a crucible, and applying electricity at 550 ° C. for 8 hours. Bake in a furnace. Thereafter, 100 mg of the incinerated material was collected, observed with a scanning electron microscope (S2100A manufactured by Hitachi, Ltd.), photographed at a magnification of 10000 times, randomly sampled 500 pieces, and the length of the longest part of each fiber (particle). The weight average value was taken as the average fiber length. Moreover, the weight average value of the shortest part was calculated as an average fiber diameter. In addition, in the case of combined use with other fillers or in combination with particulate titanium oxide, the filler is identified by point analysis and surface analysis of the filler with XMA at an observation magnification of 30000 times, and only acicular titanium oxide is picked up. Average fiber length and average fiber diameter were calculated. In the case of using granular titanium oxide together, the difference can be determined to some extent depending on the shape and thickness, but particles that cannot be determined by crushing during processing are included in the particulate titanium oxide and calculated. In addition, said (B) acicular titanium oxide used for this invention has the surface of a well-known coupling agent (For example, a silane coupling agent, a titanate coupling agent, an aluminum coupling agent etc.), others It can also be used after being treated with a surface treatment agent.
本発明において(A)融点(Tm)+10℃の条件で、ずり速度1,000(1/秒)で測定した溶融粘度が0.5〜80Pa・sである液晶性ポリマーおよび/または300℃、剪断速度1000/秒で測定した溶融粘度が80Pa・s以下であるポリアリーレンスルフィド樹脂に対する針状酸化チタンの配合比は、低そり性、ピン圧入強度の向上、かつ、可視光領域(400〜700nm波長)での高反射特性を得るために(A)融点(Tm)+10℃の条件で、ずり速度1,000(1/秒)で測定した溶融粘度が0.5〜80Pa・sである液晶性ポリマーおよび/または300℃、剪断速度1000/秒で測定した溶融粘度が80Pa・s以下であるポリアリーレンスルフィド樹脂100重量部に対し、(B)平均繊維長2μm以上の針状酸化チタンを10〜250重量部、好ましくは20〜200重量部、さらに好ましくは25〜150重量部である。 In the present invention, (A) a liquid crystalline polymer having a melt viscosity of 0.5 to 80 Pa · s measured at a shear rate of 1,000 (1 / second) under the condition of melting point (Tm) + 10 ° C. and / or 300 ° C., compounding ratio of the needle-like titanium oxide against the melt viscosity measured at a shear rate of 1000 / sec to polyarylene sulfide resins or less 80 Pa · s, the low warping property, improvement of the pins press-fitting strength, and the visible light region (400 (A) Melting viscosity measured at a shear rate of 1,000 (1 / sec) under conditions of (A) melting point (Tm) + 10 ° C. in order to obtain a high reflection characteristic at a wavelength of ˜700 nm is 0.5 to 80 Pa · s. there liquid crystalline polymer and / or 300 ° C., polyarylene sulfide resins 1 00 parts by weight with respect to the melt viscosity measured at a shear rate of 1000 / sec or less 80Pa · s, (B) an average fiber length of 2μm or less 10 to 250 parts by weight of needle-like titanium oxide, preferably 20 to 200 parts by weight, more preferably 25 to 150 parts by weight.
また、本発明において、ピン圧入強度およびその他機械特性をさらに向上させるために(C)針状酸化チタンを除く無機フィラーを添加することが可能であり、例えば、繊維状フィラーの具体例としてガラス繊維、PAN系やピッチ系の炭素繊維、ステンレス繊維、アルミニウム繊維や黄銅繊維などの金属繊維、芳香族ポリアミド繊維などの有機繊維、石膏繊維、セラミック繊維、アスベスト繊維、ジルコニア繊維、アルミナ繊維、シリカ繊維、酸化チタン繊維、炭化ケイ素繊維、ロックウール、チタン酸カリウムウィスカー、チタン酸バリウムウィスカー、ほう酸アルミニウムウィスカー、窒化ケイ素ウィスカー等が挙げられ、ガラス繊維あるいは炭素繊維の種類は、一般に樹脂の強化用に用いるものなら特に限定はなく、例えば長繊維タイプや短繊維タイプのチョップドストランド、ミルドファイバーなどから選択して用いることができる。また、上記フィラーはエチレン/酢酸ビニル共重合体などの熱可塑性樹脂、エポキシ樹脂などの熱硬化性樹脂で被覆あるいは集束されていてもよい。 Further, in the present invention, in order to further improve the pin press-fit strength and other mechanical properties, (C) an inorganic filler other than acicular titanium oxide can be added. For example, glass fiber can be used as a specific example of the fibrous filler. , PAN-based and pitch-based carbon fibers, stainless steel fibers, metal fibers such as aluminum fibers and brass fibers, organic fibers such as aromatic polyamide fibers, gypsum fibers, ceramic fibers, asbestos fibers, zirconia fibers, alumina fibers, silica fibers, Examples include titanium oxide fiber, silicon carbide fiber, rock wool, potassium titanate whisker, barium titanate whisker, aluminum borate whisker, silicon nitride whisker, etc. The type of glass fiber or carbon fiber is generally used for resin reinforcement If there is no particular limitation, for example, long fiber tape Flop and short fiber type, chopped strands, may be selected from such milled fiber. The filler may be coated or focused with a thermoplastic resin such as an ethylene / vinyl acetate copolymer or a thermosetting resin such as an epoxy resin.
また、上記金属繊維の金属種の具体例としては、鉄、銅、ステンレス、アルミニウムおよび黄銅などを例示することができる。 Moreover, iron, copper, stainless steel, aluminum, brass, etc. can be illustrated as a specific example of the metal seed | species of the said metal fiber.
非繊維状フィラーの具体例として、マイカ、タルク、カオリン、シリカ、炭酸カルシウム、ガラスビーズ、ガラスフレーク、ガラスマイクロバルーン、クレー、二硫化モリブデン、ワラステナイト、ポリリン酸カルシウム、グラファイト、金属粉、金属フレーク、金属リボン、金属酸化物(アルミナ、酸化亜鉛、酸化チタン等)、カーボン粉末、黒鉛、カーボンフレーク、鱗片状カーボン、カーボンナノチューブなどが挙げられる。また、金属粉、金属フレーク、金属リボンの金属種の具体例としては銀、ニッケル、銅、亜鉛、アルミニウム、ステンレス、鉄、黄銅、クロム、錫などが例示できる。 Specific examples of non-fibrous fillers include mica, talc, kaolin, silica, calcium carbonate, glass beads, glass flakes, glass microballoons, clay, molybdenum disulfide, wollastonite, calcium polyphosphate, graphite, metal powder, metal flakes, Examples thereof include metal ribbons, metal oxides (alumina, zinc oxide, titanium oxide, etc.), carbon powder, graphite, carbon flakes, scaly carbon, carbon nanotubes and the like. Moreover, silver, nickel, copper, zinc, aluminum, stainless steel, iron, brass, chromium, tin etc. can be illustrated as a specific example of the metal seed | species of metal powder, metal flakes, and a metal ribbon.
ここで、上記金属粉、金属フレークおよび金属リボンの金属種の具体例としては、銀、ニッケル、銅、亜鉛、アルミニウム、マグネシウム、ステンレス、鉄、黄銅、クロムおよび錫など、金属酸化物の具体例としては、SnO2(アンチモンドープ)、In2O3(アンチモンドープ)およびZnO(アルミニウムドープ)など、窒化物の具体例としては、AlN(窒化アルミニウム)、BN(窒化ホウ素)、Si3N4(窒化珪素)などを例示することができる。 Here, specific examples of metal species of the metal powder, metal flake and metal ribbon include specific examples of metal oxides such as silver, nickel, copper, zinc, aluminum, magnesium, stainless steel, iron, brass, chromium and tin. Specific examples of nitrides such as SnO 2 (antimony dope), In 2 O 3 (antimony dope) and ZnO (aluminum dope) include AlN (aluminum nitride), BN (boron nitride), Si 3 N 4 Examples thereof include (silicon nitride).
本発明において、反射板として用いる場合には、機械特性と反射率の関係から、ガラス繊維、ガラスフレーク、ガラスビーズ、ガラスマイクロバルーン、金属酸化物(アルミナ、酸化亜鉛、酸化チタン)、タルクが好ましく用いられる。 In the present invention, when used as a reflector, glass fibers, glass flakes, glass beads, glass microballoons, metal oxides (alumina, zinc oxide, titanium oxide), and talc are preferred from the relationship between mechanical properties and reflectance. Used.
なお、本発明に使用する上記の(C)針状酸化チタンを除く無機フィラーは、その表面を公知のカップリング剤(例えば、シラン系カップリング剤、チタネート系カップリング剤、アルミ系カップリング剤など)、その他の表面処理剤で処理して用いることもできる。 The inorganic filler excluding the above-mentioned (C) acicular titanium oxide used in the present invention has a known coupling agent (for example, silane coupling agent, titanate coupling agent, aluminum coupling agent) on the surface. Etc.) and other surface treatment agents.
本発明における(C)成分の添加量は、本発明の低そり性、ピン圧入強度および反射特性を損なわない範囲で添加することが好ましく、具体的には(A)融点(Tm)+10℃の条件で、ずり速度1,000(1/秒)で測定した溶融粘度が0.5〜80Pa・sである液晶性ポリマーおよび/または300℃、剪断速度1000/秒で測定した溶融粘度が80Pa・s以下であるポリアリーレンスルフィド樹脂100重量部に対して5〜150重量部が好ましく、10〜100重量部がさらに好ましい。 The addition amount of the component (C) in the present invention is preferably added within a range that does not impair the low warpage property, pin press-fitting strength and reflection property of the present invention. Specifically, (A) melting point (Tm) + 10 ° C. And a liquid crystalline polymer having a melt viscosity of 0.5 to 80 Pa · s measured at a shear rate of 1,000 (1 / sec) and / or a melt viscosity of 80 Pa · measured at 300 ° C. and a shear rate of 1000 / sec. 5-150 parts by weight is preferable with respect to the polyarylene sulfide resins 1 00 parts by weight is s or less, more preferably 10 to 100 parts by weight.
また、本発明において(B)針状酸化チタンと(C)針状酸化チタンを除く無機フィラーを併用した場合の(A)成分に対する(B)/(C)の添加量の比率は、本発明の低そり性、ピン圧入強度、および可視光領域(400〜700nm波長)での高反射特性のバランスから、(B)/(C)=62.5/37.5〜99/1が好ましく、(B)/(C)=65/35〜95/5がより好ましい。 In the present invention, when (B) acicular titanium oxide and (C) an inorganic filler other than acicular titanium oxide are used in combination, the ratio of the amount of (B) / (C) added to component (A) is (B) / (C) = 62.5 / 37.5 to 99/1 is preferable from the balance of the low warpage property, pin press-in strength, and high reflection characteristics in the visible light region (400 to 700 nm wavelength), (B) / (C) = 65/35 to 95/5 is more preferable.
本発明の樹脂組成物には、さらに本発明の効果を損なわない範囲で他の成分、例えば酸化防止剤や耐熱安定剤(ヒンダードフェノール系、ヒドロキノン系、ホスファイト系およびこれらの置換体等)、耐候剤(レゾルシノール系、サリシレート系、ベンゾトリアゾール系、ベンゾフェノン系、ヒンダードアミン系等)、離型剤及び滑剤、顔料(硫化カドミウム、フタロシアニン、着色用カーボンブラック等)、染料(ニグロシン等)、結晶核剤(タルク、シリカ、カオリン、クレー等)、可塑剤(p−オキシ安息香酸オクチル、N−ブチルベンゼンスルホンアミド等)、帯電防止剤(アルキルサルフェート型アニオン系帯電防止剤、4級アンモニウム塩型カチオン系帯電防止剤、ポリオキシエチレンソルビタンモノステアレートのような非イオン系帯電防止剤、ベタイン系両性帯電防止剤等)、難燃剤、他の重合体を添加することができる。 In the resin composition of the present invention, other components, for example, antioxidants and heat stabilizers (hindered phenols, hydroquinones, phosphites, and substituted products thereof) are within the range not impairing the effects of the present invention. , Weathering agents (resorcinol, salicylate, benzotriazole, benzophenone, hindered amine, etc.), mold release agents and lubricants, pigments (cadmium sulfide, phthalocyanine, carbon black for coloring, etc.), dyes (nigrosine, etc.), crystal nuclei Agents (talc, silica, kaolin, clay, etc.), plasticizers (octyl p-oxybenzoate, N-butylbenzenesulfonamide, etc.), antistatic agents (alkyl sulfate type anionic antistatic agents, quaternary ammonium salt type cations Antistatic agents such as polyoxyethylene sorbitan monostearate Emissions antistatic agents, betaine-based amphoteric antistatic agent, etc.), can be added a flame retardant, other polymers.
本発明の樹脂組成物は、通常公知の方法で製造される。例えば、(A)成分、(B)成分中および、(C)成分などのその他の必要な添加剤を予備混合して、またはせずに押出機などに供給して十分溶融混練することにより調製される。また、(C)針状酸化チタンを除く無機フィラーを添加する場合、特に繊維状フィラーの繊維の折損を抑制するために好ましくは、(A)成分およびその他必要な添加剤を押出機の元から投入し、(B)および(C)成分をサイドフィーダーを用いて、押出機へ供給することにより調整される。 The resin composition of the present invention is usually produced by a known method. For example, it is prepared by premixing other necessary additives such as component (A), component (B), and component (C), or without supplying them to an extruder or the like and sufficiently melt-kneading them. Is done. Moreover, when adding the inorganic filler except (C) acicular titanium oxide, in order to suppress the breakage of the fiber of the fibrous filler, it is preferable to add the component (A) and other necessary additives from the origin of the extruder. It is adjusted by charging and supplying the components (B) and (C) to the extruder using a side feeder.
樹脂組成物を製造するに際し、例えば“ユニメルト”(R)タイプのスクリューを備えた単軸押出機、二軸、三軸押出機およびニーダタイプの混練機などを用いて180〜350℃で溶融混練して組成物とすることができる。 When producing a resin composition, for example, melt-kneading at 180 to 350 ° C. using a single-screw extruder, twin-screw, three-screw extruder and kneader-type kneader equipped with a “unimelt” (R) type screw. To obtain a composition.
また、(B)針状酸化チタンおよび(C)針状酸化チタンを除く無機フィラーを多量に添加する場合、例えば添加量が(A)100重量部に対して250重量部を越える(B)成分および(C)成分を添加するフィラー高充填樹脂組成物を得る方法として、例えば、特開平8−1663号公報の如く、押出機のヘッド部分をはずして押し出し、粗粉砕、均一ブレンド化する方法、あるいは、原料を圧縮成形して錠剤化する方法が挙げられる。特に原料を圧縮成形して錠剤化する方法が、得られた組成物の品質安定性の点から好ましい。 In addition, when adding a large amount of (B) acicular titanium oxide and (C) inorganic filler other than acicular titanium oxide, for example, the amount of addition exceeds 250 parts by weight with respect to 100 parts by weight of (A) component (B) And as a method of obtaining a highly filled resin composition with a filler added with component (C), for example, as disclosed in JP-A-8-1663, extruding the head portion of the extruder, roughly pulverizing, and uniformly blending, Or the method of compressing and molding a raw material into a tablet is mentioned. In particular, the method of tableting by compressing the raw material is preferable from the viewpoint of the quality stability of the obtained composition.
本発明の樹脂組成物の成形方法は、通常の成形方法(射出成形、プレス成形、インジェクションプレス成形など)により、溶融成形することが可能であるが、なかでも量産性の点から射出成形、インジェクションプレス成形が好ましい。 The resin composition molding method of the present invention can be melt-molded by an ordinary molding method (injection molding, press molding, injection press molding, etc.), and in particular, from the point of mass production, injection molding and injection are possible. Press molding is preferred.
本発明の樹脂組成物は、金属代替用途、セラミック代替用途、照明用途、高精度部品(低寸法変化)に有用であり、具体的には、各種ケース、ギヤーケース、LEDパッケージおよびLEDランプ関連部品、コネクター、リレーケース、スイッチ、バリコンケース、光ピックアップレンズホルダー、光ピックアップスライドベース、ランプリフレクター、各種端子板、変成器、プリント配線板、液晶パネル枠、パワーモジュールおよびそのハウジング、プラスチック磁石、半導体、液晶ディスプレー部品、投影機等のランプカバー、FDDキャリッジ、FDDシャーシ、アクチュエーター、シャーシ等のHDD部品、コンピューター関連部品などに代表される電気・電子部品;VTR部品、テレビ部品、アイロン、ヘアードライヤー、炊飯器部品、電子レンジ部品、音響部品、オーディオ・レーザーディスク(登録商標)・コンパクトディスク・デジタルビデオディスクなどの音声機器部品、照明部品、冷蔵庫部品、エアコン部品などに代表される家庭、事務電気製品部品、オフィスコンピューター関連部品、電話機関連部品、ファクシミリ関連部品、印字ヘッドまわりおよび転写ロール等のプリンター・複写機関連部品、洗浄用治具、モーター部品、顕微鏡、双眼鏡、カメラ、時計などに代表される光学機器、精密機械関連部品;オルタネーターターミナル、オルタネーターコネクター、ICレギュレーター、ライトディマー用ポテンショメーターベース、モーターコア封止材、インシュレーター用部材、パワーシートギアハウジング、エアコン用サーモスタットベース、エアコンパネルスィッチ基板、ホーンターミナル、電装部品絶縁板、ランプハウジング、点火装置ケース、空気圧センサー、ヒューズ用コネクター、車速センサーなどの自動車・車両関連部品、パソコンハウジング、携帯電話ハウジング、携帯電話基地局のアンテナケース、その他情報通信分野においてチップアンテナ、無線LAN用アンテナ、ETC(エレクトロリックトールコレクションシステム)用、衛星通信などのアンテナおよびその他の各種用途で有用に用いられ、特に小型精密化による製品設計自由度および成形時の成形品の歪みによるソリの抑制、かつ、ピン圧入強度等の強度面および表面平滑性が優れることによる高反射特性等から、特にこれら特性が要求される電気・電子部品用途、具体的には電気・電子部品のピックアップレンズホルダーに代表される小型の筐体、LEDパッケージ内に用いるリフレクタおよび照明用リフレクタ、あるいは携帯機器、記録媒体接続用等に使用される狭ピッチコネクタなどに有用である。 The resin composition of the present invention is useful for metal substitute applications, ceramic substitute applications, lighting applications, and high-precision parts (low dimensional change). Specifically, various cases, gear cases, LED packages, and LED lamp-related parts. , Connectors, relay cases, switches, variable capacitor cases, optical pickup lens holders, optical pickup slide bases, lamp reflectors, various terminal boards, transformers, printed wiring boards, liquid crystal panel frames, power modules and their housings, plastic magnets, semiconductors, LCD parts, projector lamp covers, FDD carriages, FDD chassis, actuators, HDD parts such as chassis, electrical and electronic parts represented by computer-related parts, VTR parts, TV parts, irons, hair dryers, rice cookers vessel Products, microwave oven parts, acoustic parts, audio equipment parts such as audio / laser disc (registered trademark) / compact disc / digital video disc, lighting parts, refrigerator parts, air conditioner parts, household electrical appliance parts, Optical equipment such as office computer-related parts, telephone-related parts, facsimile-related parts, printer head and copying machine parts such as print heads and transfer rolls, cleaning jigs, motor parts, microscopes, binoculars, cameras, watches, etc. , Precision machinery related parts: alternator terminal, alternator connector, IC regulator, light dimmer potentiometer base, motor core sealant, insulator member, power seat gear housing, air conditioner thermostat base, air conditioner Panel switch board, horn terminal, electrical component insulation plate, lamp housing, ignition device case, air pressure sensor, fuse connector, vehicle speed sensor and other automotive / vehicle related parts, personal computer housing, mobile phone housing, mobile phone base station antenna case In other information and communication fields, it is useful for chip antennas, wireless LAN antennas, ETC (Electronic Toll Collection System), antennas for satellite communications, and other various applications. Suppression of warpage due to distortion of molded parts during molding, and high reflection characteristics due to excellent strength and surface smoothness such as pin press-fit strength, etc. There is a pickup lens for electrical and electronic parts. It is useful for a small housing represented by a holder, a reflector used in an LED package and a reflector for illumination, or a narrow pitch connector used for connecting a portable device, a recording medium, and the like.
以下、実施例を挙げて本発明を詳細に説明するが、本発明の骨子は以下の実施例にのみ限定されるものではない。 Hereinafter, although an example is given and the present invention is explained in detail, the gist of the present invention is not limited only to the following examples.
参考例1 熱可塑性樹脂
ポリアミド樹脂;ヘキサメチレンジアミン−アジピン酸の等モル塩12重量%(360g)、ヘキサメチレンジアミン−イソフタル酸を25重量%(750g)、ヘキサメチレンジアミン−テレフタル酸を62重量%(1860g)の混合水溶液(固形原料濃度60重量%)を加圧重合缶に仕込み、攪拌下に昇温し、水蒸気圧3.43MPaで3.5時間反応させた後反応混合物を重合缶下部吐出口から吐出、回収した。ここで得られたポリアミドプレポリマの硫酸溶液相対粘度(1%濃度)は1.45であった。このものを真空下220℃/10時間固相重合することにより、相対粘度2.4、312℃のポリアミドを得た。
Reference Example 1 Thermoplastic resin Polyamide resin: Hexamethylenediamine-adipic acid equimolar salt 12% by weight (360 g), Hexamethylenediamine-isophthalic acid 25% by weight (750 g), Hexamethylenediamine-terephthalic acid 62% by weight (1860 g) of a mixed aqueous solution (solid raw material concentration 60% by weight) was charged into a pressure polymerization can, heated with stirring, reacted at a water vapor pressure of 3.43 MPa for 3.5 hours, and then the reaction mixture was discharged from the bottom of the polymerization can It was discharged from the outlet and collected. The relative viscosity (1% concentration) of the sulfuric acid solution of the polyamide prepolymer obtained here was 1.45. This was subjected to solid state polymerization at 220 ° C. for 10 hours under vacuum to obtain a polyamide having a relative viscosity of 2.4 and 312 ° C.
なお、融点(Tm)は示差熱量測定において、ポリマーを室温から20℃/分の昇温条件で測定した際に観測される吸熱ピーク温度(Tm1)の観測後、Tm1+20℃の温度で5分間保持した後、20℃/分の降温条件で室温まで一旦冷却した後、再度20℃/分の昇温条件で測定した際に観測される吸熱ピーク温度(Tm2)とした。 The melting point (Tm) is determined by differential calorimetry. After observing the endothermic peak temperature (Tm1) observed when the polymer is measured at room temperature to 20 ° C./minute, the temperature is maintained at Tm1 + 20 ° C. for 5 minutes. Then, after cooling to room temperature under a temperature drop condition of 20 ° C./minute, the endothermic peak temperature (Tm 2) observed when measured again under a temperature rise condition of 20 ° C./minute was used.
LCP(液晶ポリマー):攪拌翼、留出管を備えた5Lの反応容器にp−ヒドロキシ安息香酸870g(6.300モル)、4,4’−ジヒドロキシビフェニル327g(1.890モル)、ハイドロキノン89g(0.810モル)、テレフタル酸292g(1.755モル)、イソフタル酸157g(0.945モル)および無水酢酸1367g(フェノール性水酸基合計の1.03当量)を仕込み、窒素ガス雰囲気下で攪拌しながら145℃で2時間反応させた後、320℃まで4時間で昇温した。その後、重合温度を320℃に保持し、1.0時間で1.0mmHg(133Pa)に減圧し、更に90分間反応を続け、トルクが15kgcmに到達したところで重縮合を完了させた。次に反応容器内を1.0kg/cm2(0.1MPa)に加圧し、直径10mmの円形吐出口を1ケ持つ口金を経由してポリマーをストランド状物に吐出し、カッターによりペレタイズした。 LCP (liquid crystal polymer): p-hydroxybenzoic acid 870 g (6.300 mol), 4,4′-dihydroxybiphenyl 327 g (1.890 mol), hydroquinone 89 g in a 5 L reaction vessel equipped with a stirring blade and a distillation tube. (0.810 mol), 292 g (1.755 mol) of terephthalic acid, 157 g (0.945 mol) of isophthalic acid, and 1367 g of acetic anhydride (1.03 equivalent of the total phenolic hydroxyl groups) were stirred in a nitrogen gas atmosphere. The mixture was reacted at 145 ° C. for 2 hours and then heated to 320 ° C. in 4 hours. Thereafter, the polymerization temperature was maintained at 320 ° C., the pressure was reduced to 1.0 mmHg (133 Pa) in 1.0 hour, the reaction was continued for 90 minutes, and the polycondensation was completed when the torque reached 15 kgcm. Next, the inside of the reaction vessel was pressurized to 1.0 kg / cm 2 (0.1 MPa), the polymer was discharged to a strand-like material via a die having one circular discharge port having a diameter of 10 mm, and pelletized by a cutter.
この液晶性ポリエステルはp−オキシベンゾエート単位がp−オキシベンゾエート単位、4,4’−ジオキシビフェニル単位および1,4−ジオキシベンゼン単位の合計に対して70モル%、4,4’−ジオキシビフェニル単位が4,4’−ジオキシビフェニル単位および1,4−ジオキシベンゼン単位の合計に対して70モル%、テレフタレート単位がテレフタレート単位およびイソフタレート単位の合計に対して65モル%からなり、Tm(液晶性ポリエステルの融点)は314℃であり、高化式フローテスターを用い、温度324℃、剪断速度1,000/sで測定した溶融粘度が15Pa・sであった。 In this liquid crystalline polyester, the p-oxybenzoate unit is 70 mol% with respect to the total of the p-oxybenzoate unit, the 4,4′-dioxybiphenyl unit and the 1,4-dioxybenzene unit, The oxybiphenyl unit is 70 mol% with respect to the total of 4,4'-dioxybiphenyl units and 1,4-dioxybenzene units, and the terephthalate unit is 65 mol% with respect to the total of terephthalate units and isophthalate units. , Tm (melting point of the liquid crystalline polyester) was 314 ° C., and the melt viscosity measured at a temperature of 324 ° C. and a shear rate of 1,000 / s using a Koka flow tester was 15 Pa · s.
なお、融点(Tm)は示差熱量測定において、ポリマーを室温から20℃/分の昇温条件で測定した際に観測される吸熱ピーク温度(Tm1)の観測後、Tm1+20℃の温度で5分間保持した後、20℃/分の降温条件で室温まで一旦冷却した後、再度20℃/分の昇温条件で測定した際に観測される吸熱ピーク温度(Tm2)とした。 The melting point (Tm) is determined by differential calorimetry. After observing the endothermic peak temperature (Tm1) observed when the polymer is measured at room temperature to 20 ° C./minute, the temperature is maintained at Tm1 + 20 ° C. for 5 minutes. Then, after cooling to room temperature under a temperature drop condition of 20 ° C./minute, the endothermic peak temperature (Tm 2) observed when measured again under a temperature rise condition of 20 ° C./minute was used.
PPS(ポリフェニレンスルフィド):調整撹拌機付きオートクレーブに硫化ナトリウム9水塩6.005kg(25モル)、酢酸ナトリウム0.11kg(1.35モル)およびN−メチル−2−ピロリドン(NMP)5kgを仕込み、窒素を通じながら徐々に205℃まで昇温し、水3.6リットルを留出した。次に反応容器を180℃に冷却後、1,4−ジクロロベンゼン3.756kg(25.55モル)ならびにNMP3.7kgを加えて、窒素下に密閉し、270℃まで昇温後、270℃で2.5時間反応した。冷却後、反応生成物を温水で5回洗浄し、次に100℃に加熱されNMP10kg中に投入して、約1時間攪拌し続けたのち、濾過し、さらに熱湯で数回洗浄した。これを90℃に加熱されたpH4の酢酸水溶液25リットル中に投入し、約1時間攪拌し続けたのち、濾過し、濾液のpHが7になるまで約90℃のイオン交換水で洗浄後、80℃で24時間減圧乾燥して、乾燥PPSを得た。キャピログラフ(東洋精機(株)社製)装置を用いて、孔直径1.0mm×長さ10mmのオリフィスを使用し、樹脂温310℃、剪断速度1000/秒の条件で測定すると、PPSの溶融粘度は30Pa・sであった。 PPS (polyphenylene sulfide): A sodium sulfide nonahydrate 6.005 kg (25 mol), sodium acetate 0.11 kg (1.35 mol), and N-methyl-2-pyrrolidone (NMP) 5 kg were charged into an autoclave equipped with a regulated stirrer. Then, the temperature was gradually raised to 205 ° C. through nitrogen, and 3.6 liters of water was distilled. Next, after cooling the reaction vessel to 180 ° C., 3.756 kg (25.55 mol) of 1,4-dichlorobenzene and 3.7 kg of NMP were added, sealed under nitrogen, heated to 270 ° C., heated at 270 ° C. Reacted for 2.5 hours. After cooling, the reaction product was washed 5 times with warm water, then heated to 100 ° C., poured into 10 kg of NMP, stirred for about 1 hour, filtered, and washed several times with hot water. This was put into 25 liters of an acetic acid aqueous solution of pH 4 heated to 90 ° C., and stirred for about 1 hour, filtered, washed with ion-exchanged water of about 90 ° C. until the pH of the filtrate reached 7, Drying under reduced pressure at 80 ° C. for 24 hours yielded dry PPS. Using a capillograph (manufactured by Toyo Seiki Co., Ltd.) and an orifice with a hole diameter of 1.0 mm and a length of 10 mm and measuring at a resin temperature of 310 ° C. and a shear rate of 1000 / sec, the melt viscosity of PPS Was 30 Pa · s.
参考例2 針状酸化チタン
B−1:FTL−300(平均繊維長5.15μm、平均繊維径0.27μm、l/d=19.1、石原産業(株)社製)
B−2:FLT−100(平均繊維長1.68μm、平均繊維径0.13μm、l/d=12.9、石原産業(株)社製)
Reference Example 2 Acicular titanium oxide B-1: FTL-300 (average fiber length 5.15 μm, average fiber diameter 0.27 μm, l / d = 19.1, manufactured by Ishihara Sangyo Co., Ltd.)
B-2: FLT-100 (average fiber length 1.68 μm, average fiber diameter 0.13 μm, l / d = 12.9, manufactured by Ishihara Sangyo Co., Ltd.)
参考例3 その他フィラー
C−1:ティスモN(チタン酸カリウム繊維、平均繊維長16μm、平均繊維長0.45μm、l/d=35.5、大塚化学(株)社製)
C−2:“タイペーク”CR−50(ルチル型酸化チタン、平均粒子径0.25μm、石原産業(株)社製)
C−3:LMS−400(タルク、平均粒径3.8、富士タルク社製)
Reference Example 3 Other filler C-1: Tismo N (potassium titanate fiber, average fiber length 16 μm, average fiber length 0.45 μm, 1 / d = 35.5, manufactured by Otsuka Chemical Co., Ltd.)
C-2: “Taipeke” CR-50 (rutile titanium oxide, average particle size 0.25 μm, manufactured by Ishihara Sangyo Co., Ltd.)
C-3: LMS-400 (talc, average particle size 3.8, manufactured by Fuji Talc)
実施例1〜2、 比較例1〜4
参考例1の熱可塑性樹脂、参考例2の針状酸化チタンおよび参考例3のその他フィラーをリボンブレンダーで表1に示す量でブレンドし、3ホールストランドダイヘッド付きPCM30(2軸押出機;池貝鉄工社製)にて表1に示す樹脂温度でスクリュー回転数150rpmで溶融混練を行い、ペレットを得た。ついで130℃の熱風乾燥機で5時間乾燥した後、後述する評価を行った。
Examples 1-2 , Comparative Examples 1-4
A thermoplastic resin of Reference Example 1, acicular titanium oxide of Reference Example 2 and other fillers of Reference Example 3 were blended in a ribbon blender in the amounts shown in Table 1, and PCM30 with a three-hole strand die head (biaxial extruder; Ikekai Iron Works) The product was melt-kneaded at the resin temperature shown in Table 1 at a screw speed of 150 rpm to obtain pellets. Subsequently, after drying for 5 hours with a 130 degreeC hot-air dryer, evaluation mentioned later was performed.
比較例5
参考例1の熱可塑性樹脂、参考例2の針状酸化チタンをリボンブレンダーで表1に示す量でブレンドし、3ホールストランドダイヘッド付きPCM30(2軸押出機;池貝鉄工社製)にて表1に示す樹脂温度でスクリュー回転数220rpmで溶融混練を行い、ペレットを得た。ついで130℃の熱風乾燥機で5時間乾燥した後、後述する評価を行った。
Comparative Example 5
The thermoplastic resin of Reference Example 1 and the acicular titanium oxide of Reference Example 2 were blended in the amounts shown in Table 1 using a ribbon blender, and Table 1 was prepared using PCM30 with a three-hole strand die head (2-screw extruder; manufactured by Ikekai Tekko Co., Ltd.). Melt-kneading was performed at a resin temperature shown in FIG. Subsequently, after drying for 5 hours with a 130 degreeC hot-air dryer, evaluation mentioned later was performed.
実施例3、4
参考例1の熱可塑性樹脂、参考例2の針状酸化チタンをリボンブレンダーで表1に示す量でブレンドし、自動原料供給フィーダーを備えた月島機械社製ロータリー打錠機を用いて常温タブレット化により、6mm直径×3mm長の円柱状のタブレット(錠剤型樹脂組成物)(最大値6mm、最小値3mm)を得た。ついで130℃の熱風乾燥機で5時間乾燥した後、以下に示す評価を行った。
Examples 3 and 4
The thermoplastic resin of Reference Example 1 and the acicular titanium oxide of Reference Example 2 were blended in a ribbon blender in the amounts shown in Table 1, and tableted at room temperature using a rotary tableting machine manufactured by Tsukishima Kikai Co., Ltd. equipped with an automatic raw material supply feeder. Thus, a 6 mm diameter × 3 mm long columnar tablet (tablet-type resin composition) (maximum value 6 mm, minimum value 3 mm) was obtained. Subsequently, after drying with a 130 degreeC hot-air dryer for 5 hours, the following evaluation was performed.
(1)繊維長および繊維径
射出成形機UH1000(80t)(日精樹脂工業社製)を用い、表1の樹脂温度、金型温度の温度条件で、70mm長×70mm幅×1mm厚(フィンゲート)の成形品を作成し、突き出しピン側を表側として反ゲート側左側隅を1cm×1cmで切り出し、るつぼに入れて550℃×8時間電気炉で焼成する。その後、灰化した物を100mg採取し、走査型電子顕微鏡(日立製作所製S2100A)を用いて観察、10000倍で写真撮影し、ランダムに500本サンプリングし、各繊維(粒子)の最長部の長さの重量平均値を平均繊維長した。また、最短部の重量平均値を平均繊維径として算出した。なお、(B)針状酸化チタンと(C)針状酸化チタンを除くその他フィラーを併用した場合には、30000倍まで倍率をあげてXMAによる点分析、面分析により、フィラー組成を同定して(B)針状酸化チタンとそれ以外を分離し、針状酸化チタンのみの平均繊維長および平均繊維径を算出した。
(1) Fiber length and fiber diameter Using an injection molding machine UH1000 (80t) (manufactured by Nissei Plastic Industry Co., Ltd.), under the temperature conditions of the resin temperature and mold temperature shown in Table 1, 70 mm length x 70 mm width x 1 mm thickness (fin gate) ), The protruding pin side is the front side, the left corner on the side opposite to the gate is cut out at 1 cm × 1 cm, placed in a crucible, and baked in an electric furnace at 550 ° C. × 8 hours. Thereafter, 100 mg of the incinerated material was collected, observed with a scanning electron microscope (S2100A manufactured by Hitachi, Ltd.), photographed at a magnification of 10000 times, randomly sampled 500 pieces, and the length of the longest part of each fiber (particle). The weight average value was the average fiber length. Moreover, the weight average value of the shortest part was calculated as an average fiber diameter. In addition, when (B) acicular titanium oxide and other fillers other than (C) acicular titanium oxide are used in combination, the filler composition is identified by point analysis and surface analysis by XMA with magnification up to 30000 times. (B) The acicular titanium oxide and the others were separated, and the average fiber length and the average fiber diameter of only acicular titanium oxide were calculated.
(2)ソリ特性
射出成形機UH1000(80t)(日精樹脂工業社製)を用い、表1の樹脂温度、金型温度の温度条件で、70mm長×70mm幅×0.5mm厚(中心部20mmフィンゲート)の成形品を作成し、四隅のうち、一個所抑えた際の最大そり量を測定した。
(2) Warp characteristics Using an injection molding machine UH1000 (80t) (manufactured by Nissei Plastic Industry Co., Ltd.), under the temperature conditions of the resin temperature and mold temperature shown in Table 1, 70 mm length x 70 mm width x 0.5 mm thickness (center 20 mm) Fingate) was created, and the maximum amount of warpage when one of the four corners was suppressed was measured.
(3)ピン圧入特性射出成形機UH1000(80t)(日精樹脂工業社製)を用い、表1の樹脂温度、金型温度の温度条件で、)内径1.0mm、深さ10mmの円筒状の穴を持つ成形品を得た。 (3) Pin press fit characteristics Using an injection molding machine UH1000 (80t) (manufactured by Nissei Plastic Industry Co., Ltd.) A molded product with holes was obtained.
次に、外径1.1mm、長さ8mmのメッキ仕上げの鉄製ピンを前記の円筒状の穴に小型ハンマーを用いて長さ8mm全てを挿入し、挿入後の成形品の破損状況について20個の成形品で観察し、16個以上の成形品の円筒状の穴部分にクラックや破損が認められた成形品を×、4個未満の成形品の円筒状の穴部分にクラックや破損が認められた成形品を△、20個全ての成形品の円筒状の穴部分にクラックや破損が認められない成形品を○と判定した。 Next, insert a steel pin with an outer diameter of 1.1 mm and a length of 8 mm into the cylindrical hole, using a small hammer to insert a length of 8 mm. No cracks and breaks were observed in the cylindrical hole portions of less than 4 molded products. The obtained molded product was evaluated as Δ, and a molded product in which no cracks or breakage was observed in the cylindrical hole portions of all 20 molded products was determined as ◯.
(4)光反射特性(光反射率)
射出成形機UH1000(80t)(日精樹脂工業社製)を用い、表1の樹脂温度、金型温度の温度条件で、50mm長×50mm幅×2mm厚の角形成形品(フィルムゲート)を成形し、この成形品を紫外近赤外分光光度計(UV−3150:島津製作所社製)を用いて400〜800nmまでの波長の拡散反射率を測定し、450、550、650nmの3波長の反射率を評価した。この値が大きいほど光反射特性が優れているといえる。
(4) Light reflection characteristics (light reflectivity)
Using an injection molding machine UH1000 (80t) (manufactured by Nissei Plastic Industry Co., Ltd.), a corner forming product (film gate) of 50 mm length x 50 mm width x 2 mm thickness is molded under the resin temperature and mold temperature conditions shown in Table 1. The diffuse reflectance of wavelengths from 400 to 800 nm was measured for this molded product using an ultraviolet near infrared spectrophotometer (UV-3150: manufactured by Shimadzu Corporation), and the reflectance of three wavelengths of 450, 550 and 650 nm was measured. Evaluated. It can be said that the larger this value, the better the light reflection characteristics.
表1の結果から明らかなように本発明の樹脂組成物から得られた成形品は、成形時のソリが少なく、また、組込時必要なピン圧入強度および光反射特性が均衡して優れることがわかる。このことから、これら特性が必要な電気・電子部品のピックアップレンズホルダーに代表される小型の筐体、LEDパッケージ内に用いるリフレクタおよび照明用リフレクタ、あるいは携帯機器、記録媒体接続用等に使用される狭ピッチコネクタなどに有用である。 As is apparent from the results in Table 1, the molded product obtained from the resin composition of the present invention has little warpage during molding, and is excellent in balance between pin press-in strength and light reflection characteristics required during assembly. I understand. For this reason, it is used for small housings typified by pickup lens holders for electrical and electronic parts that require these characteristics, reflectors and reflectors used in LED packages, or for connecting portable devices and recording media. Useful for narrow pitch connectors.
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