JP5323536B2 - Circuit board inspection equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To downsize a gripping part while reducing a cost increase. <P>SOLUTION: The circuit board inspection apparatus includes a board holding mechanism having a clamp 12a for gripping a circuit board 100 by a first member 31 and a second member 32, a determination part for determining the closeness of the second member 32 with respect to the first member 31, a sensor 4 for optically detecting the distance L1 to the circuit board 100, a movement mechanism for moving an inspection probe, an inspection unit for performing inspection processing on the basis of an electric signal inputted through the inspection probe, and a control unit for allowing the inspection probe to perform probing on the basis of the distance L1 and allowing the inspection unit to perform inspection processing when it has been determined to be in a close state by the determination unit. The sensor 4 detects a distance L2 to the bottom surface 54 of a recess 53 of the second member 32. The determination unit determines to be in a close state when the distance L2 detected by the sensor 4 is a standard value Ls or longer and determines to be in a non-close state when the distance L2 is shorter than the standard value Ls. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a circuit board inspection apparatus that includes a board holding mechanism capable of holding and holding a circuit board, and that performs a predetermined inspection process on the circuit board held by the board holding mechanism.

  As this type of circuit board inspection apparatus, a circuit board inspection apparatus disclosed by the applicant in Japanese Patent Application Laid-Open No. 2007-121183 is known. The circuit board inspection apparatus includes a mounting table, an XYZ moving mechanism, a probe, a measurement unit, an operation unit, a storage unit, and a control unit, and is configured to perform a predetermined inspection on the circuit board. Yes. In this case, the mounting table is configured to be capable of mounting the circuit board, and, for example, a plurality of clamping portions (clamps) that clamp the circuit board between the first member and the second member that is in contact with and away from the first member. And a circuit board can be fixed to the mounting table. In this circuit board inspection apparatus, a laser displacement meter is attached to an XYZ moving mechanism for moving the probe (probing), and the distance from the laser displacement meter to a measurement point on the circuit board is measured, and the measurement result The relative position in the height direction of the measurement point is specified based on the reference point, and the position information in the height direction of the measurement point is corrected based on the relative position to perform probing. For this reason, in this circuit board inspection apparatus, even if the circuit board is warped, deformed, thickness variation, and the circuit board is tilted with respect to the mounting table, the probe can be accurately probed at each measurement point. It is possible. On the other hand, when performing the inspection as described above, it is necessary to securely fix the circuit board to the mounting table. For this reason, the applicant uses a mechanical switch or the like that is turned on / off in accordance with the contact and separation of the second member with respect to the first member of the holding portion, and the proximity state of the second member to the first member (first member). The circuit board inspection apparatus employs a configuration in which an inspection is started when it is determined that the second member is in proximity to the other and the proximity state is determined.

JP 2007-121183 A (page 5-9, FIG. 1)

  However, the circuit board inspection apparatus already developed by the applicant has the following problems to be solved. That is, in the above circuit board inspection apparatus, the proximity state of the second member with respect to the first member is determined based on the detection result by the switch individually attached to each clamping part. For this reason, in this circuit board inspection apparatus, since the structure of a clamping part becomes complicated, there exists the subject that the manufacturing cost of a clamping part and by extension, the manufacturing cost of a circuit board inspection apparatus increase correspondingly. Moreover, since it is necessary to attach a switch to each clamping part separately, the subject that size reduction of a clamping part becomes difficult also exists.

  The present invention has been made in view of such a problem to be solved, and a main object of the present invention is to provide a circuit board inspection apparatus capable of realizing a reduction in the size of the sandwiching portion while suppressing an increase in cost.

  In order to achieve the above object, a circuit board inspection apparatus according to claim 1, further comprising a clamping portion that clamps the circuit board between the first member and the second member that is in contact with and away from the first member. A first distance between the substrate holding mechanism capable of holding the first substrate, a determination unit for determining a proximity state of the second member to the first member, and the circuit board held by the substrate holding mechanism. A distance detection unit that detects the movement, a moving mechanism that moves the inspection probe, an inspection unit that performs a predetermined inspection process on the circuit board based on an electrical signal input through the inspection probe, The moving mechanism is controlled based on the first distance detected by the distance detecting unit when the determining unit determines the proximity state, and the inspection probe is brought into contact with the circuit board. A circuit board inspection apparatus including a control unit that executes the inspection process, wherein the distance detection unit is configured to detect a second distance between the second member and a predetermined part, The discriminating unit discriminates the proximity state when the second distance detected by the distance detection unit is greater than or equal to a predetermined reference value, and discriminates the non-proximity state when the second distance is less than the reference value. .

  A circuit board inspection apparatus according to a second aspect is the circuit board inspection apparatus according to the first aspect, wherein the second member has a flat surface as the predetermined portion.

  The circuit board inspection apparatus according to claim 3 is the circuit board inspection apparatus according to claim 2, wherein the second member is formed with a concave portion having a bottom surface as the flat surface, and the depth of the concave portion is In the proximity state, the distance from the distance detection unit to the bottom surface and the distance from the distance detection unit to the clamping surface of the second member are defined to be the same distance.

  Further, the circuit board inspection apparatus according to claim 4 is a notification for notifying the circuit board inspection apparatus according to any one of claims 1 to 3 when the determination section determines that it is in the non-proximity state. Department.

  The circuit board inspection apparatus according to claim 5 is the circuit board inspection apparatus according to any one of claims 1 to 4, wherein the control unit determines that the non-proximity state is determined by the determination unit. The inspection process is stopped by the inspection unit.

  The circuit board inspection apparatus according to claim 1, wherein the second member approaches the first member when the second distance to the predetermined portion of the second member detected by the distance detection unit is equal to or greater than a reference value. When the second distance is less than the reference value, the non-proximity state is determined. That is, in this circuit board inspection apparatus, the distance detection unit used for specifying the position where the inspection probe should be brought into contact is also used for determining the proximity state. For this reason, according to this circuit board inspection apparatus, since it is not necessary to individually attach a dedicated switch for determining the proximity state to the holding part, the manufacturing cost of the holding part, and hence the manufacturing cost of the circuit board inspection apparatus, can be reduced. It can be sufficiently reduced. In addition, the holding part can be reduced in size because it is not necessary to attach a switch to the holding part. Moreover, according to this circuit board inspection apparatus, since the proximity state is determined based on the second distance detected by the distance detection unit that optically detects the distance, for example, using a mechanical switch or the like. Unlike the conventional circuit board inspection apparatus that determines the proximity state of the second member, it is possible to suppress a determination error due to a malfunction of the switch.

  According to the circuit board inspection apparatus of the second aspect, since the flat surface as the predetermined portion is formed on the second member, the second distance from the distance detection unit to the predetermined portion (that is, the flat surface) is accurately determined. Can be detected.

  According to the circuit board inspection apparatus of the third aspect, the recess having a bottom surface as a flat surface is formed in the second member, and the distance from the distance detection unit to the bottom surface and the second member from the distance detection unit in the proximity state. When using a distance detector that has a narrow range that can accurately detect the distance (detectable range) by defining the depth of the recess so that the distance to the clamping surface is the same distance Even so, it is possible to accurately detect both the first distance and the second distance by adjusting the arrangement position of the distance detection unit so that both the first distance and the second distance are within the detectable range. be able to.

  In addition, according to the circuit board inspection apparatus of the fourth aspect, the second member is in the non-proximity state by including the notification unit that notifies the fact when the determination unit determines that the non-proximity state is detected. Therefore, the user can be surely recognized that the inspection result is in a state that may be inaccurate.

  In addition, according to the circuit board inspection apparatus of the fifth aspect, when the determination unit determines that it is in the non-proximity state, the control unit causes the inspection unit to stop the inspection process, so that the inspection result becomes inaccurate. It is possible to reliably prevent the inspection from continuing in a state where there is a fear.

1 is a configuration diagram showing a configuration of a circuit board inspection device 1. FIG. 3 is a configuration diagram showing a configuration of a substrate holding mechanism 2. FIG. 3 is a plan view of a substrate holding mechanism 2. FIG. It is the sectional view on the AA line in FIG. FIG. 5 is a first explanatory view illustrating an inspection method for the circuit board 100. FIG. 6 is a second explanatory view for explaining an inspection method for the circuit board 100. FIG. 10 is a third explanatory diagram illustrating an inspection method for the circuit board 100.

  Embodiments of a circuit board inspection apparatus according to the present invention will be described below with reference to the accompanying drawings.

  First, the configuration of the circuit board inspection apparatus 1 shown in FIG. 1 will be described. A circuit board inspection apparatus 1 is an example of a circuit board inspection apparatus according to the present invention, and as shown in the figure, a board holding mechanism 2, a moving mechanism 3, a sensor 4, an inspection section 5, an operation section 6, and a storage section. 7. The display unit 8 and the control unit 9 are provided so that, for example, a predetermined electrical inspection can be performed on the circuit board 100 shown in FIGS.

  The substrate holding mechanism 2 is an example of a substrate holding mechanism according to the present invention. As shown in FIG. 2, the base body 11, clamp portions (clamping portions) 12a and 12b (hereinafter, both clamp portions 12a and 12b are distinguished from each other). When not, it is also referred to as a “clamp portion 12”), a compressor 13 and a solenoid valve 14, and is configured to hold the circuit board 100.

  As shown in FIG. 3, the base body 11 is formed in a plate shape having a substantially rectangular shape in plan view, as an example. Further, as shown in FIG. 4 and FIG. 4, an opening having a substantially rectangular shape in plan view that enables the inspection probe 71 (see FIG. 1) to contact the circuit board 100 at the center of the base body 11 at the time of inspection. Part 11a is formed. Further, a pair of facing edge portions 21 (for example, the edge portions 21b and 21d) among the respective edge portions 21a to 21d (hereinafter also referred to as "edge portions 21" when not distinguished) constituting the opening portion 11a are provided. A rail 22 for moving the clamp portion 12b is provided.

  The clamp parts 12a and 12b are an example of the clamping part in the present invention, and as shown in FIGS. 3 and 4, each of the clamp parts 12a and 12b includes a first member 31, a second member 32, and rotating mechanisms 33 and 33, respectively. The member 31 and the second member 32 are configured so that the edge of the circuit board 100 can be clamped. As shown in FIG. 3, the first member 31 is formed in a long plate shape. In this case, the first member 31 of the clamp part 12a is arranged along the extending direction of the edge part 21a (the Y direction shown in the figure) in the base body 11 and is fixed to the edge part 21a. In addition, the first member 31 of the clamp portion 12b is disposed along the extending direction (Y direction) of the edge portion 21c of the base body 11 and is orthogonal to the Y direction (X direction shown in the figure). It is configured to be movable along. Specifically, the first member 31 of the clamp portion 12b is fitted with the rails 22 and 22 of the base body 11 in the fitting grooves (not shown) formed on the back surfaces of both end portions, respectively. It is configured to be movable along the rails 22 and 22. Moreover, as shown in FIGS. 5-7, in the 1st member 31 of each clamp part 12, the support part 41 for supporting the 2nd member 32 rotatably is formed (in each figure, Only the clamp part 12a of both the clamp parts 12a and 12b is illustrated).

  As shown in FIG. 3, the second member 32 is formed in a long plate shape. Further, as shown in FIGS. 5 to 7, the second member 32 has a holding surface 52 that contacts the circuit board 100 at the time of clamping, with the hinge portion 51 supported by the support portion 41 of the first member 31. The first member 31 is configured to be rotatable so as to be in contact with and away from the holding surface 42 of the first member 31. Further, a recess 53 is formed on the upper surface side of the second member 32. In this case, as shown in FIG. 6, the concave portion 53 has a bottom surface 54 formed on a flat surface (flat surface). In addition, the depth of the recess 53 is determined when the clamping surface 52 of the second member 32 is close to the clamping surface 42 of the first member 31 (the proximity of the second member 32 to the first member 31). The distance (length) along the height direction (Z direction in the figure) from the sensor 4 to the bottom surface 54 and the distance along the height direction from the sensor 4 to the clamping surface 52 of the second member 32 are the same distance. It is stipulated that

  The rotation mechanism 33 includes a spring 61 and an air cylinder 62 as shown in FIGS. The spring 61 is disposed between the support portion 41 of the first member 31 and the hinge portion 51 of the second member 32, and the holding surface 52 of the second member 32 is close to the holding surface 42 of the first member 31. The second member 32 is biased in the direction. The air cylinder 62 is attached to the first member 31. In this case, the air cylinder 62 causes the rod 62a to protrude by the supply of air from the compressor 13, and presses the protrusion 55 formed on the second member 32 with the rod 62a. Accordingly, the second member 32 is rotated in a direction in which the clamping surface 52 of the second member 32 is separated from the clamping surface 42 of the first member 31.

  The compressor 13 supplies air (compressed air). The electromagnetic valve 14 is connected to the compressor 13 and the air cylinder 62 of the clamp unit 12 via an air tube, and supplies and stops supply of air from the compressor 13 to the air cylinder 62 according to control of the control unit 9.

  As shown in FIG. 1, the moving mechanism 3 moves the inspection probe 71 according to the control of the control unit 9, and the inspection probe 71 is moved to a predetermined probing point on the circuit board 100 held by the substrate holding mechanism 2. Probing (contacting) the tip. Further, the moving mechanism 3 moves the sensor 4 according to the control of the control unit 9. The sensor 4 is an optical distance measuring device that measures a distance in a non-contact manner using a laser beam, and constitutes a distance detection unit in the present invention. In this case, the sensor 4 has a distance L1 between the circuit board 100 held by the board holding mechanism 2 and the sensor 4 (first distance in the present invention: see FIG. 6), and the sensor according to the control of the control unit 9. 4 is an inspection light (for example, a distance L2 (second distance in the present invention) from the bottom surface 54 (a predetermined portion in the present invention) of the recess 53 formed in the second member 32 of the clamp portion 12 in the substrate holding mechanism 2. Optical detection is performed using the laser beam B) shown in FIG. 6, and a detection signal Sd is output.

  The inspection unit 5 performs a predetermined electrical inspection (inspection process) on the circuit board 100 based on the electric signal Si input through the inspection probe 71 probed on the circuit board 100 under the control of the control unit 9. Execute. The operation unit 6 includes various operation switches, and outputs an operation signal So when these operation switches are operated. The storage unit 7 stores probing data Dp for the circuit board 100. In this case, the probing data Dp includes the size of the circuit board 100 (specifically, the length of the circuit board 100 along the X direction (see FIG. 3) and the Y direction (see the same figure)). Length) and information indicating the probing point on the circuit board 100. In addition, the storage unit 7 has a position of the recess 53 formed in the second member 32 of the clamp unit 12 in the substrate holding mechanism 2 (for example, a predetermined portion of the first member 31 (for example, a lower left corner in the figure). To the recess 53, the position data Dh indicating the length along the X direction and the length along the Y direction) is stored. Further, the storage unit 7 stores reference value data Ds indicating the reference value Ls used in the determination process executed by the control unit 9. In this case, as shown in FIG. 6, the reference value Ls is such that the bottom surface 54 of the recess 53 is positioned when the clamp portion 12 clamps the circuit board 100 (that is, when the second member 32 is in the proximity state). A distance (length) along the Z direction (see the same figure) between the highest position to be obtained and the sensor 4 and when the clamp portion 12 clamps the circuit board 100 having an average thickness, the sensor 4 The distance is specified to be slightly shorter than the detected distance L2.

  The display unit 8 displays the inspection result according to the control of the control unit 9. The display unit 8 functions as a notification unit in the present invention, and displays a warning screen to be described later under the control of the control unit 9. The control unit 9 executes various processes according to the operation signal So output from the operation unit 6. The control unit 9 specifies the position (height) of the probing point where the inspection probe 71 should be probed based on the distance L1 indicated by the detection signal Sd output from the sensor 4, and controls the moving mechanism 3. Then, the inspection probe 71 is probed at that position.

  Further, the control unit 9 functions as a determination unit in the present invention, and the proximity state of the second member 32 with respect to the first member 31 of the clamp unit 12 in the substrate holding mechanism 2 (the second member 32 is in relation to the first member 31). A discrimination process for discriminating the state of being close to each other is executed. Specifically, the control unit 9 determines the proximity state when the distance L2 (the distance L2 detected by the sensor 4) indicated by the detection signal Sd output from the sensor 4 is equal to or greater than a predetermined reference value Ls, When the distance L2 is less than the reference value Ls, the non-proximity state (the state in which the second member 32 is not in the proximity state) is determined. The control unit 9 causes the inspection unit 5 to execute (continue) the inspection process when it is determined to be in the proximity state, and displays a warning screen on the display unit 8 when it is determined that the state is not close. At the same time, the inspection unit 5 is stopped (interrupted).

  In this case, in the circuit board inspection apparatus 1, the sensor 4 used for specifying the position of the probing point is also used for determining the proximity state (that is, the sensor 4 is also used). For this reason, it is not necessary to individually attach a dedicated switch for determining the proximity state to each clamp unit 12, and accordingly, the manufacturing cost of the clamp unit 12 and consequently the manufacturing cost of the circuit board inspection apparatus 1 are reduced. It is possible. Moreover, since it is not necessary to attach a switch to each clamp part 12, it is possible to make the clamp part 12 small.

  Next, an inspection method for performing a predetermined electrical inspection on the circuit board 100 shown in FIG. 3 using the circuit board inspection apparatus 1 will be described with reference to the accompanying drawings.

  First, the clamp part 12b of the substrate holding mechanism 2 is moved along the X direction shown in FIGS. 3 and 4 (along the rail 22), and the length along the X direction between the clamp parts 12a and 12b is increased. The edge of the circuit board 100 is adjusted to a length that can be clamped.

  Next, the operation unit 6 is operated to instruct the start of inspection. At this time, the control unit 9 starts processing according to the operation signal So output from the operation unit 6. In this case, the control unit 9 first controls the electromagnetic valve 14 of the substrate holding mechanism 2 to supply air from the compressor 13 to the air cylinder 62 of each rotation mechanism 33 in each clamp unit 12. At this time, in each clamp portion 12, as shown in FIG. 5, the rod 62 a of each air cylinder 62 protrudes and presses the projection portion 55 of the second member 32, and resists the urging force of the spring 61. The two members 32 are rotated. As a result, the clamping surface 52 of the second member 32 is separated from the clamping surface 42 of the first member 31 as shown in FIG.

  Next, the board supply device (not shown) supplies the circuit board 100 so that the lower surface of the edge of the circuit board 100 abuts on the clamping surface 42 of the first member 31 in the clamp portion 12 as shown in FIG. . Subsequently, the control unit 9 controls the electromagnetic valve 14 to stop the supply of air to each air cylinder 62. At this time, in each clamp part 12, as shown in FIG. 6, the protrusion of the rod 62a of each air cylinder 62 is released, and accordingly, the second member 32 is rotated by the biasing force of each spring 61, The edge of the circuit board 100 is pressed by the clamping surface 52 of the second member 32. Thereby, the edge part of the circuit board 100 is clamped by each clamp part 12, and the circuit board 100 is hold | maintained.

  Next, the control unit 9 reads the probing data Dp, the position data Dh, and the reference value data Ds from the storage unit 7. Subsequently, the control unit 9 executes a determination process for determining the proximity state of the second member 32 with respect to the first member 31. In this determination process, the control unit 9 includes the length along the length X direction of the circuit board 100 indicated by the probing data Dp, the length along the Y direction, and the first member indicated by the position data Dh. Based on the length along the X direction from the predetermined portion 31 to the recess 53 of the second member 32 and the length along the Y direction, the position (XY coordinate) of the recess 53 in each clamp portion 12 is determined. Identify. Next, the control unit 9 controls the moving mechanism 3 to move the sensor 4 above the concave portion 53 in either one of the clamp units 12 in the XY coordinate direction.

  Subsequently, the control unit 9 operates the sensor 4. In response to this, the sensor 4 detects the distance L2 (from the sensor 4 to the bottom surface 54) between the second member 32 and the bottom surface 54 of the recess 53, and outputs a detection signal Sd. Next, the control unit 9 determines whether or not the distance L2 indicated by the detection signal Sd output from the sensor 4 is greater than or equal to the reference value Ls indicated by the reference value data Ds. Is determined. In this case, for example, as illustrated in FIG. 6, when the distance L2 is equal to or greater than the reference value Ls, the control unit 9 determines that the proximity state. Here, as shown in the figure, when the distance L2 is greater than or equal to the reference value Ls, the second member 32 is sufficiently close to the first member 31, and the clamping surface 52 of the second member 32 is the edge of the circuit board 100. Thus, the circuit board 100 is securely clamped by the first member 31 and the second member 32.

  In this case, in this circuit board inspection apparatus 1, since the proximity state is determined based on the distance L2 detected by the sensor 4 that optically detects the distance, for example, the second member 32 with respect to the first member 31 is determined. Unlike conventional circuit board inspection devices that use a mechanical switch that turns on and off with contact and separation, it is possible to minimize discrimination errors caused by switch malfunctions. Yes. In the circuit board inspection apparatus 1, the distance from the sensor 4 to the bottom surface 54 and the distance between the sensor 4 and the second member 32 in the proximity state of the second member 32 to the first member 31 (state in which the circuit board 100 is clamped). The depth of the recess 53 is defined so that the distance to the clamping surface 52 is the same. For this reason, in this circuit board inspection apparatus 1, even if the distance detection range of the sensor 4 that can accurately detect the distance is limited to a narrow range, the distance L1 from the sensor 4 to the circuit board 100, and the sensor It is possible to accurately measure both the distance L2 from 4 to the bottom surface 54.

  Next, the control unit 9 controls the moving mechanism 3 to move the sensor 4 above the recess 53 in the other clamp unit 12 in the XY coordinate direction, and determines the proximity state in the same manner as described above. . In this case, when it is determined that the second members 32 of both the clamp portions 12 are in the proximity state, the control unit 9 controls the moving mechanism 3 to move the sensor 4 above the circuit board 100. Subsequently, the control unit 9 operates the sensor 4 to detect the distance L1 between the circuit board 100 (the distance L1 from the sensor 4 to the circuit board 100). Next, the control unit 9 specifies the position of the probing point based on the distance L1 indicated by the detection signal Sd output from the sensor 4. Next, the control unit 9 controls the moving mechanism 3 to probe the inspection probe 71 at that position.

  Subsequently, the control unit 9 instructs the inspection unit 5 to execute the inspection process, and in response thereto, the circuit unit 100 is based on the electrical signal Si input by the inspection unit 5 via the inspection probe 71. A predetermined electrical inspection is performed on the device. Next, the control unit 9 causes the display unit 8 to display the result of the inspection by the inspection unit 5.

  On the other hand, when the determination process is performed, for example, as shown in FIG. 7, when the distance L2 is less than the reference value Ls, the control unit 9 determines that the non-proximity state (the second member 32 is not in the close state). To do. Here, as shown in the figure, when the distance L2 is less than the reference value Ls, that is, when the second member 32 is in a non-adjacent state, the circuit board 100 is reliably clamped by the first member 31 and the second member 32. Therefore, the circuit board 100 may be displaced with respect to the substrate holding mechanism 2 during the inspection, and the inspection result may be inaccurate due to this. For this reason, in this circuit board inspection apparatus 1, when it is determined that it is in the non-proximity state at the time of execution of the determination process, the control unit 9 instructs the inspection unit 5 to stop (suspend) the inspection process, and accordingly The inspection unit 5 stops (interrupts) the inspection process. At this time, the control unit 9 causes the display unit 8 to display a warning screen for notifying that effect. In this case, in this circuit board inspection apparatus 1, since the inspection process is stopped (suspended) and a warning screen is displayed in this manner, the second member 32 is in a non-proximity state. It is possible to reliably prevent a situation in which the inspection is continued in a state where the inspection result may be inaccurate, and to make the user surely recognize that such a state is present.

  Thus, in this circuit board inspection apparatus 1, when the distance L2 to the predetermined part (bottom surface 54 of the recessed part 53) detected by the sensor 4 is equal to or larger than the reference value Ls, it is determined as the proximity state. When the distance L2 is less than the reference value Ls, the non-proximity state is determined. That is, in this circuit board inspection apparatus 1, the sensor 4 used for specifying the position of the probing point is also used for determining the proximity state. For this reason, according to this circuit board inspection apparatus 1, since it is not necessary to individually attach a dedicated switch for determining the proximity state to each clamp part 12, the manufacturing cost of the clamp part 12 and thus the circuit board inspection apparatus. 1 manufacturing cost can be sufficiently reduced. Moreover, the clamp part 12 can be reduced in size because it is not necessary to attach a switch to each clamp part 12. Further, according to the circuit board inspection apparatus 1, since the proximity state is determined based on the distance L2 detected by the sensor 4 that optically detects the distance, the proximity is determined using, for example, a mechanical switch or the like. Unlike the conventional circuit board inspection apparatus that determines the state, it is possible to suppress a determination error caused by a malfunction of the switch.

  Further, according to the circuit board inspection apparatus 1, the distance L2 from the sensor 4 to the bottom surface 54 can be accurately detected because the bottom surface 54 of the recess 53 is formed as a flat surface.

  Further, according to the circuit board inspection apparatus 1, in the proximity of the second member 32 to the first member 31, the height direction distance (distance L 2) from the sensor 4 to the bottom surface 54 and the second member 32 from the sensor 4. When the sensor 4 is used in which the range in which the distance can be accurately detected (detectable range) is limited to a narrow range by defining the depth of the recess 53 so that the distance to the clamping surface 52 is the same distance. Even so, it is possible to accurately detect both the distances L1 and L2 by adjusting the arrangement position of the sensor 4 so that both the distance L1 and the distance L2 are within the detectable range.

  In addition, according to the circuit board inspection apparatus 1, the second member 32 is in the non-proximity state by causing the display unit 8 to display a warning screen for notifying that effect when the non-proximity state is determined. Therefore, the user can be surely recognized that the inspection result is in a state that may be inaccurate.

  Further, according to the circuit board inspection apparatus 1, the inspection unit 5 is stopped when the non-proximity state is determined, thereby continuing the inspection in a state where the inspection result may be inaccurate. Can be reliably prevented.

  In addition, this invention is not limited to said structure. For example, the example in which the clamp part 12 in which the second member 32 rotates around the hinge part 51 is described above, but the second member moves up and down relative to the first member instead of the clamp part 12. Therefore, it is possible to employ a clamp portion that holds the circuit board 100. Moreover, although the example which formed the recessed part 53 in the 2nd member 32 was mentioned above, only the flat surface was formed in the 2nd member 32 without forming the recessed part 53, and based on the distance L2 from the sensor 4 to the flat surface. It is also possible to adopt a configuration for determining the proximity state. Further, the example applied to the circuit board inspection apparatus in which one inspection probe 71 is probed on one surface side (the upper surface side in the above example) of the circuit board 100 has been described above. It can also be applied to a circuit board inspection apparatus for probing to the side, or a circuit board inspection apparatus for probing one or a plurality of inspection probes 71 on both sides of the circuit board 100. Further, the present invention is applied to a circuit board inspection apparatus 1 of a type in which a probe unit (jig-type probe unit) in which a plurality of inspection probes are arranged side by side is moved to probe each inspection probe on the circuit board 100 at a time. You can also.

DESCRIPTION OF SYMBOLS 1 Circuit board inspection apparatus 2 Substrate holding mechanism 3 Movement mechanism 4 Sensor 5 Inspection part 8 Display part 9 Control part 12a, 12b Clamp part 31 1st member 32 2nd member 53 Recessed part 54 Bottom surface 71 Inspection probe 100 Circuit board L1, L2 Distance Ls Reference value Si Electric signal

Claims (5)

A board holding mechanism that holds a circuit board by holding a circuit board between the first member and a second member that contacts and separates from the first member, and the second member with respect to the first member. A discriminating unit for discriminating the proximity state of the member, a distance detecting unit for optically detecting a first distance to the circuit board held by the substrate holding mechanism, and a moving mechanism for moving the inspection probe An inspection unit that performs a predetermined inspection process on the circuit board based on an electrical signal input through the inspection probe, and the distance detection unit when the determination unit determines the proximity state And a control unit that controls the moving mechanism based on the detected first distance to bring the inspection probe into contact with the circuit board and to cause the inspection unit to execute the inspection process. An inspection apparatus,
The distance detection unit is configured to be able to detect a second distance to a predetermined part in the second member,
The discriminating unit discriminates the proximity state when the second distance detected by the distance detection unit is greater than or equal to a predetermined reference value, and discriminates the non-proximity state when the second distance is less than the reference value. Circuit board inspection device.   The circuit board inspection apparatus according to claim 1, wherein the second member has a flat surface as the predetermined portion. A recess having a bottom surface as the flat surface is formed in the second member,
The depth of the recess is defined such that, in the proximity state, the distance from the distance detection unit to the bottom surface and the distance from the distance detection unit to the clamping surface of the second member are the same distance. The circuit board inspection apparatus according to claim 2.   The circuit board inspection apparatus according to claim 1, further comprising a notification unit that notifies the fact when the determination unit determines that the non-proximity state is present.   5. The circuit board inspection apparatus according to claim 1, wherein the control unit causes the inspection unit to stop the inspection process when the determination unit determines that the non-proximity state is present. 6.

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