CN103175458B - The method of the thickness of measurement mechanism and measurement film - Google Patents
The method of the thickness of measurement mechanism and measurement film Download PDFInfo
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- CN103175458B CN103175458B CN201110428943.0A CN201110428943A CN103175458B CN 103175458 B CN103175458 B CN 103175458B CN 201110428943 A CN201110428943 A CN 201110428943A CN 103175458 B CN103175458 B CN 103175458B
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Abstract
The invention discloses the method for the thickness of a kind of measurement mechanism and measurement film.Measurement mechanism is the thickness measuring test structure.Measurement mechanism comprises measuring sensor.Measuring sensor is in order to while touching at the upper surface with test structure, measures the thickness of test structure.Utilize the present invention, target can continue to utilize in process after detect thickness, and the result of thickness also helps operator to understand Expenditure Levels, the technology stability of target, and judges whether technique morphs, with real-time monitoring process.In addition, the present invention measure the method for the thickness of film simply, not disruptive, cost is low.
Description
Technical field
The invention relates to measurement mechanism and the method for the thickness of measurement film, relate to the method for measurement mechanism and the thickness of measurement film being applied in semiconductor applications especially.
Background technology
In some cases, the thickness of a test structure such as bulk at diverse location must be measured.Especially when the non-outer rim will measuring test structure, that is during the thickness of inboard portion, often need test structure to cut open, allow the part of the inner side of test structure appear, to be convenient for measuring thickness.
For example, in semiconductor processing, in use for some time, its surface can't present smooth state to sputtering target material, and on the contrary, the thickness of diverse location has height to rise and fall.The thickness only measuring target outer rim is still not enough to know overall consumption by inference, therefore cannot judge when this target more renewed monitoring process accurately.And utilize general method to measure the thickness distribution of target, the structure of target must be destroyed, cause target to reuse, manufacturing cost is improved.
Summary of the invention
The invention relates to measurement mechanism and the method for the thickness of measurement film, when not damage test structure, the thickness of test structure diverse location can be measured.
The invention provides a kind of measurement mechanism, in order to measure the thickness of test structure.Measurement mechanism comprises measuring sensor, and this measuring sensor, in order to while touching at the upper surface with test structure, measures the thickness of test structure.
The present invention also provides a kind of method measuring the thickness of film, comprises the following steps.Measurement mechanism is utilized to measure the thickness of test structure.Test structure has pedestal and the film be positioned on pedestal.Measurement mechanism comprises measuring sensor.Measuring sensor, in order to while touching at the upper surface with test structure, measures the thickness of test structure.The thickness of the test structure measured is cut the thickness of pedestal to obtain the thickness of film.
In embodiments of the present invention, measuring sensor is in order to while touching at the upper surface with test structure, measures the thickness of test structure.Test structure does not need the destroyed thickness can measuring diverse location, and the test structure after therefore measuring thickness can intactly continue to use.
For example, when test structure has pedestal and the film be positioned on pedestal, such as, sputtering target material for using in semiconductor technology, the thickness of film obtains by the thickness thickness of the test structure measured being cut known pedestal.Therefore target can continue to utilize in process after detect thickness, and the result of thickness also helps operator to understand Expenditure Levels, the technology stability of target, and judges whether technique morphs, with real-time monitoring process.In addition, measure in embodiment the method for the thickness of film simply, not disruptive, cost is low.
Accompanying drawing explanation
Fig. 1 illustrates the perspective view of measurement mechanism in an embodiment.
Fig. 2 illustrates the perspective view of measurement mechanism in an embodiment.
[main element symbol description]
2: placement seat
Settle element at 4: the first
Settle element at 6: the second
8: measuring sensor
10,110: test structure
12: retaining element
14,114: the first slide connecting parts
16,116: the first moving members
18,118: the second moving members
20,120: the second slide connecting parts
22,122: the three slide connecting parts
24: contact part
26: record part
130: catch elements 140: depth gauge
142: housing
144: pressing
Embodiment
In embodiment, the measurement mechanism in order to the thickness measuring test structure comprises measuring sensor, and measuring sensor is in order to while touching at the upper surface with test structure, measures the thickness of test structure.Test structure does not need the destroyed thickness can measuring diverse location, and the test structure after therefore measuring thickness can intactly continue to use.
For example, when test structure has pedestal and the film be positioned on pedestal, such as, sputtering target material for using in semiconductor technology, the thickness of film obtains by the thickness thickness of the test structure measured being cut known pedestal.Therefore target can continue to utilize in process after detect thickness, and the result of thickness also helps operator to understand Expenditure Levels, the technology stability of target, and judges whether technique morphs, with real-time monitoring process.In addition, measure in embodiment the method for the thickness of film simply, not disruptive, cost is low.
Below exemplify multiple embodiment to explain.
< first embodiment >
Fig. 1 illustrates the perspective view of measurement mechanism in the first embodiment.Measurement mechanism can comprise a placement seat 2, comprises the first arrangement element 4 and second adjoined each other and settles element 6.First settles element 4 and second to settle element 6 to arrange in fact orthogonally.
Measuring sensor 8 is configured on the first arrangement element 4.Test structure 10 is configured on the second arrangement element 6.Retaining element 12 can be fixed on the second arrangement element 6, settles the position on element 6 to move in order to engage test structure 10 second.
Measuring sensor 8 can comprise the first slide connecting part 14 such as slide block, with the first moving member 16 and the second moving member 18 adjacent to each other.First slide connecting part 14 is fixed on the first arrangement element 4.First moving member 16 comprises the second slide connecting part 20 such as slide block.First slide connecting part 14 is chimeric mutually with the second slide connecting part 20, more specifically, the projective structure of the first slide connecting part 14 is chimeric mutually with the notch configuration of the second slide connecting part 20, makes the first moving member 16 that the second slide connecting part 20 can be followed to move along the first direction of the extension of the first slide connecting part 14.For example, first direction is essentially X-direction.
Second moving member 18 comprises the 3rd slide connecting part 22 adjacent to each other, contact part 24 and record part 26.3rd slide connecting part 22 is such as slide block.3rd slide connecting part 22 is chimeric with the second slide connecting part 20, and in more detail for example, the notch configuration of the 3rd slide connecting part 22 is chimeric with the projective structure of the second slide connecting part 20, makes the second moving member 18 that the 3rd slide connecting part 22 can be followed to move along second direction.In embodiment, second direction is different from first direction.For example, second direction is essentially Z-direction.
The contact part 24 of the second moving member 18 is in order to contact with the upper surface of test structure 10.Contact part 24 is such as through the perforation of the 3rd slide connecting part 22 and is fixed on the Stainless Steel column of the 3rd slide connecting part 22.The record part 26 of the second moving member 18 is in order to record the situation of the second moving member 18 movement.In embodiment, record part 26 comprises writes structure, such as pen, pencil, ballpoint pen, pointer etc.Writing structure is settle element 4 to contact with first, the situation of the second moving member 18 movement to be recorded on the first arrangement element 4.
In embodiment, measuring the method for the thickness of test structure 10, is make the structure and first of writing of record part 26 settle element 4 (being such as arranged on the paper, contact panel etc. on surface) to contact.Make the second moving member 18 by from body weight, move along second direction (such as Z axis direction from top to bottom) toward the upper surface of test structure 10, make to contact the upper surface that part 24 touches test structure 10.By the first chimeric slide connecting part 14 and the second slide connecting part 20, and force makes the first moving member 16 mobile along first direction (such as X-axis direction from left to right), moves toward first direction to drive the second moving member 18.Wherein, move simultaneously at the second moving member 18 toward first direction, the variation in thickness of the part that contact part 24 contacts with test structure 10, makes the second moving member 18 move along second direction.While second moving member 18 movement, the situation of movement is recorded on the first arrangement element 4 by record part 26.The thickness of test structure can be obtained according to the result of record.
In an embodiment, test structure 10 has pedestal and the film be positioned on pedestal, such as, sputtering target material for using in semiconductor technology.The thickness of film obtains by the thickness thickness of the test structure measured 10 being cut known pedestal.Utilizing the measurement mechanism of embodiment, the thickness of diverse location can be obtained when not destroying target.In embodiment, the test structure 10 of standard can be utilized such as completely newly not use (curve recorded is smooth horizontal line) and the known sputtering target material correcting measuring device of specification, to obtain accurate measurement result.
< second embodiment >
Fig. 2 illustrates the perspective view of measurement mechanism in the second embodiment.Measurement mechanism in first embodiment and the measurement mechanism in the second embodiment different be in, 3rd slide connecting part 122 of the second moving member 118 is second slide connecting parts 120 utilizing catch elements 130 to be fastened in the first moving member 116,3rd slide connecting part 122 of the second moving member 118 cannot be moved along second direction (being such as essentially Z-direction), that is, the ad-hoc location that the 3rd slide connecting part 122 of the second moving member 118 is fixed in the Z-axis direction.Depth gauge 140 in Fig. 2 is the contact parts 24 replaced in Fig. 1.Depth gauge 140 comprise housing 142, with pass the pressing 144 of housing 142.Depth gauge 140 also can be called clock gauge, and can be electronic type or mechanical type instrument.Record part 26 in first embodiment shown in Fig. 1 is omitted.
In embodiment, measure the method for the thickness of test structure 110, be by by the perforation of the pressing 144 of depth gauge 140 through the 3rd slide connecting part 122 of the second moving member 118, the locking of the housing 142 of depth gauge 140 be fixed on the upper surface of the 3rd slide connecting part 122.Pressing 144 through the 3rd slide connecting part 122 contacts with the upper surface of test structure 110.Because housing 142 is by the fixing specific position in a second direction of the 3rd slide connecting part 122, therefore the change of the thickness of test structure 110 affects the degree of displacement of pressing 144, makes depth gauge 140 can read the thickness of test structure 110.
Moreover by the first chimeric slide connecting part 114 and the second slide connecting part 120, and force makes the first moving member 116 mobile along first direction (such as X-axis direction from left to right), moves toward first direction to drive the second moving member 118.Wherein, by mobile second moving member 118, depth gauge 140 is measured the thickness of test structure 110 along diverse location on first direction.
In an embodiment, test structure 110 has pedestal and the film be positioned on pedestal, such as, sputtering target material for using in semiconductor technology.The thickness of film obtains by the thickness thickness of the test structure measured 110 being cut known pedestal.Utilizing the measurement mechanism of embodiment, the thickness of diverse location can be obtained when not destroying target.In embodiment, the test structure 110 of standard can be utilized such as completely newly not use (curve recorded is smooth horizontal line) and the known sputtering target material correcting measuring device of specification, to obtain accurate measurement result.
Although the present invention discloses as above with preferred embodiment; so itself and be not used to limit the present invention; any those who are familiar with this art; without departing from the spirit and scope of the present invention; when doing a little change and retouching, therefore protection scope of the present invention is when being as the criterion of defining depending on the right of enclosing.
Claims (3)
1. a measurement mechanism, is characterized in that, this measurement mechanism is the thickness measuring a test structure, and this measurement mechanism comprises:
One measuring sensor, while touching at the upper surface with this test structure, measures the thickness of this test structure;
Wherein this measuring sensor comprises one first moving member adjacent to each other and one second moving member, and wherein this first moving member can move along a first direction, and this second moving member can move along a second direction, and this first direction is different from this second direction;
This measuring sensor more comprises one first slide connecting part, and this first moving member comprises one second slide connecting part, and this first slide connecting part is chimeric mutually with this second slide connecting part, and this second slide connecting part can be moved along the bearing of trend of this first slide connecting part;
This second moving member comprises one the 3rd slide connecting part, a contact portion and a recording section adjacent to each other, 3rd slide connecting part make three slide connecting part chimeric with this second slide connecting part can move along this second direction, this contact portion is in order to contact with the upper surface of this test structure, this recording section is in order to record the situation of this second moving member movement, this recording section comprises writes structure, and this recording section and this measurement mechanism are one;
Wherein, this recording section and this measurement mechanism are one, be specially: measurement mechanism comprises placement seat, placement seat comprises adjacent the first arrangement element, second and settles element, what recording section comprised write, and structure settles the paper of element surface with first, contact panel contacts, first slide connecting part is fixed on the first arrangement element, and test structure is placed on the second arrangement element by retaining element, is recorded by the thickness of above-mentioned structure by test structure.
2. measure a method for the thickness of film, it is characterized in that, comprising:
A measurement mechanism is utilized to measure the thickness of a test structure, wherein this test structure has a pedestal and the film be positioned on this pedestal, this measurement mechanism comprises a measuring sensor, while touching at the upper surface with this test structure, measures the thickness of this test structure; And
The thickness of this test structure measured is cut the thickness of this pedestal to obtain the thickness of this film;
Wherein, this measuring sensor comprises one first moving member adjacent to each other and one second moving member, and wherein this first moving member can move along a first direction, and this second moving member can move along a second direction, and this first direction is different from this second direction;
This measuring sensor more comprises one first slide connecting part, and this first moving member comprises one second slide connecting part, and this first slide connecting part is chimeric mutually with this second slide connecting part, and this second slide connecting part can be moved along the bearing of trend of this first slide connecting part;
This second moving member comprises one the 3rd slide connecting part, a contact portion and a recording section adjacent to each other, 3rd slide connecting part make three slide connecting part chimeric with this second slide connecting part can move along this second direction, this contact portion is in order to contact with the upper surface of this test structure, this recording section is in order to record the situation of this second moving member movement, this recording section comprises writes structure, and this recording section and this measurement mechanism are one;
Wherein, this recording section and this measurement mechanism are one, be specially: measurement mechanism comprises placement seat, placement seat comprises adjacent the first arrangement element, second and settles element, what recording section comprised write, and structure settles the paper of element surface with first, contact panel contacts, first slide connecting part is fixed on the first arrangement element, and test structure is placed on the second arrangement element by retaining element, is recorded by the thickness of above-mentioned structure by test structure.
3. the method for the thickness of measurement film according to claim 2, the method wherein utilizing this measurement mechanism to measure the thickness of this test structure comprises:
Make this second moving member by from body weight, move along a second direction toward the upper surface of this test structure, make this contact portion touch the upper surface of this test structure;
This second slide connecting part of this first moving member is moved along a first direction of the extension of this first slide connecting part, move toward this first direction to drive this second moving member, wherein move simultaneously at this second moving member toward this first direction, the variation in thickness of the part that this contact portion contacts with this test structure, makes this second moving member move along this second direction; And
This recording section is made first to settle element to contact, to record the situation of this second moving member movement, to obtain the thickness of this test structure with this.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110428943.0A CN103175458B (en) | 2011-12-20 | 2011-12-20 | The method of the thickness of measurement mechanism and measurement film |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110428943.0A CN103175458B (en) | 2011-12-20 | 2011-12-20 | The method of the thickness of measurement mechanism and measurement film |
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| CN103175458A CN103175458A (en) | 2013-06-26 |
| CN103175458B true CN103175458B (en) | 2016-03-23 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104101407B (en) * | 2014-06-27 | 2017-01-25 | 中航复合材料有限责任公司 | Automatic honeycomb sheet weight and thickness measuring method |
| CN107101552B (en) * | 2017-06-13 | 2019-04-02 | 京东方科技集团股份有限公司 | A kind of target residual amount measurement device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200533894A (en) * | 2004-04-13 | 2005-10-16 | Chien Hui Chuan | Computer control measuring center |
| CN101201239A (en) * | 2006-12-12 | 2008-06-18 | 爱信艾达株式会社 | Thickness determining apparatus |
| CN201293627Y (en) * | 2008-10-21 | 2009-08-19 | 中芯国际集成电路制造(上海)有限公司 | Thickness measurement instrument |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09229663A (en) * | 1996-02-21 | 1997-09-05 | Canon Inc | Stylus type film thickness measuring method and device |
| JPH11183111A (en) * | 1997-12-24 | 1999-07-09 | Toshiba Corp | Method for measuring change in film thickness and its device |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200533894A (en) * | 2004-04-13 | 2005-10-16 | Chien Hui Chuan | Computer control measuring center |
| CN101201239A (en) * | 2006-12-12 | 2008-06-18 | 爱信艾达株式会社 | Thickness determining apparatus |
| CN201293627Y (en) * | 2008-10-21 | 2009-08-19 | 中芯国际集成电路制造(上海)有限公司 | Thickness measurement instrument |
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