JP5314038B2 - Oled装置用の乾燥剤封止手順 - Google Patents
Oled装置用の乾燥剤封止手順 Download PDFInfo
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- JP5314038B2 JP5314038B2 JP2010534018A JP2010534018A JP5314038B2 JP 5314038 B2 JP5314038 B2 JP 5314038B2 JP 2010534018 A JP2010534018 A JP 2010534018A JP 2010534018 A JP2010534018 A JP 2010534018A JP 5314038 B2 JP5314038 B2 JP 5314038B2
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- protective cover
- oled device
- substrate
- sealing means
- moisture
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- 230000035699 permeability Effects 0.000 description 1
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 229920001197 polyacetylene Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000128 polypyrrole Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- WVIICGIFSIBFOG-UHFFFAOYSA-N pyrylium Chemical class C1=CC=[O+]C=C1 WVIICGIFSIBFOG-UHFFFAOYSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- PYWVYCXTNDRMGF-UHFFFAOYSA-N rhodamine B Chemical compound [Cl-].C=12C=CC(=[N+](CC)CC)C=C2OC2=CC(N(CC)CC)=CC=C2C=1C1=CC=CC=C1C(O)=O PYWVYCXTNDRMGF-UHFFFAOYSA-N 0.000 description 1
- 125000006413 ring segment Chemical group 0.000 description 1
- YYMBJDOZVAITBP-UHFFFAOYSA-N rubrene Chemical compound C1=CC=CC=C1C(C1=C(C=2C=CC=CC=2)C2=CC=CC=C2C(C=2C=CC=CC=2)=C11)=C(C=CC=C2)C2=C1C1=CC=CC=C1 YYMBJDOZVAITBP-UHFFFAOYSA-N 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- IFLREYGFSNHWGE-UHFFFAOYSA-N tetracene Chemical compound C1=CC=CC2=CC3=CC4=CC=CC=C4C=C3C=C21 IFLREYGFSNHWGE-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 150000004882 thiopyrans Chemical class 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 238000012800 visualization Methods 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/302—Details of OLEDs of OLED structures
- H10K2102/3023—Direction of light emission
- H10K2102/3026—Top emission
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Description
(a)基板上にOLED装置を形成すること、
(b)前記OLED装置及び前記基板を包囲する保護カバーを提供すること、
(c)前記保護カバーと前記基板の上面との間に第1の封止手段(sealing arrangement)を提供し、前記OLED装置を包囲する第1のチャンバを定めること、
(d)第2の封止手段を提供し、前記第1のチャンバから封止され且つ前記第1のチャンバを包囲する第2のチャンバを定めるために封止すること、及び
(e)前記第1のチャンバ内に第1の乾燥物質を提供すると共に、前記基板の上面よりも下面に近い前記第2のチャンバ内に第2の乾燥物質を提供すること
を含むOLED装置のカプセル化方法であって、
前記基板は、2つの共平面を定め、且つ前記第2の乾燥物質は、前記第1の乾燥物質よりも早く水分を吸収する、OLED装置のカプセル化方法によって達成される。
30 保護カバー
40 保護カバー
50 可撓性コネクタ
60 断面線
70 OLED装置
100 カプセル化OLED装置
110 封止手段
120 乾燥物質
130 チャンバ
140 封止手段
150 乾燥物質
160 チャンバ
170 封止手段
180 ガラスレッジ
190 上面
195 下面
200 カプセル化OLED装置
210 保護カバー
220 封止手段
230 乾燥剤
240 チャンバ
250 封止手段
260 乾燥剤
270 チャンバ
300 方法
310 ブロック
320 ブロック
330 ブロック
340 ブロック
350 ブロック
360 ブロック
370 ブロック
Claims (20)
- (a)基板上にOLED装置を形成すること、
(b)前記OLED装置及び前記基板を包囲する保護カバーを提供すること、
(c)前記保護カバーと前記基板の上面との間に第1の封止手段を提供し、前記OLED装置を包囲する第1のチャンバを定めること、
(d)第2の封止手段を提供し、前記第1のチャンバから封止され且つ前記第1のチャンバを包囲する第2のチャンバを定めるために封止すること、及び
(e)前記第1のチャンバ内に第1の乾燥物質を提供すると共に、前記基板の上面よりも下面に近い前記第2のチャンバ内に第2の乾燥物質を提供すること
を含むOLED装置のカプセル化方法であって、
前記基板は、2つの共平面を定め、且つ前記第2の乾燥物質は、前記第1の乾燥物質よりも早く水分を吸収する、OLED装置のカプセル化方法。 - 前記第1及び第2の乾燥物質は、粒子状物質又はマトリックス状に形成された粒子状物質である請求項1に記載の方法。
- 前記第1の乾燥物質は、前記第2の乾燥物質の平衡湿度よりも小さな平衡湿度を有する請求項1に記載の方法。
- 前記第1の乾燥物質は、1000ppmよりも小さな平衡湿度を有する請求項3に記載の方法。
- 前記第2の乾燥物質は、1000ppmよりも大きな平衡湿度を有する請求項3に記載の方法。
- 前記OLED装置の上方に1つ以上の薄膜カプセル化層をさらに提供する請求項1に記載の方法。
- 前記保護カバーは前記OLED装置から間隔を置いて配置され、且つ前記OLED装置と前記保護カバーとの間にポリマーバッファー層が配置される請求項1に記載の方法。
- 前記第1の封止手段若しくは前記第2の封止手段又はこれらの両方は、ガラスレッジを含む請求項1に記載の方法。
- 前記第1の乾燥物質と前記基板との間の距離が、前記第1の封止手段の厚さよりも小さいことをさらに提供する請求項1に記載の方法。
- 前記保護カバーは、2つ以上の部分と、単一の一体型保護カバーを形成する、それらの間の第3の封止装置とを含む請求項1に記載の方法。
- 前記第2の封止手段は、前記保護カバーと前記基板との間の前記基板の第2部分にシールされる請求項1に記載の方法。
- 前記第1及び第2の乾燥物質は、粒子状物質又はマトリックス状に形成された粒子状物質である請求項11に記載の方法。
- 前記第1の乾燥物質は、前記第2の乾燥物質の平衡湿度よりも小さな平衡湿度を有する請求項11に記載の方法。
- 前記第1の乾燥物質は、1000ppmよりも小さな平衡湿度を有する請求項13に記載の方法。
- 前記第2の乾燥物質は、1000ppmよりも大きな平衡湿度を有する請求項13に記載の方法。
- 前記OLED装置の上方に1つ以上の薄膜カプセル化層をさらに提供する請求項11に記載の方法。
- 前記保護カバーは前記OLED装置から間隔を置いて配置され、且つ前記OLED装置と前記保護カバーとの間にポリマーバッファー層が配置される請求項11に記載の方法。
- 前記第1の封止手段若しくは前記第2の封止手段又はこれらの両方は、ガラスレッジを含む請求項11に記載の方法。
- 前記第1の乾燥物質と前記基板との間の距離が、前記第1の封止手段の厚さよりも小さいことをさらに提供する請求項11に記載の方法。
- 前記保護カバーは、2つ以上の部分と、単一の一体型保護カバーを形成する、それらの間の第3の封止装置とを含む請求項11に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/941,301 US8016631B2 (en) | 2007-11-16 | 2007-11-16 | Desiccant sealing arrangement for OLED devices |
US11/941,301 | 2007-11-16 | ||
PCT/US2008/012465 WO2009064357A1 (en) | 2007-11-16 | 2008-11-04 | Desiccant sealing arrangement for oled devices |
Publications (2)
Publication Number | Publication Date |
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JP2011503820A JP2011503820A (ja) | 2011-01-27 |
JP5314038B2 true JP5314038B2 (ja) | 2013-10-16 |
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JP2010534018A Active JP5314038B2 (ja) | 2007-11-16 | 2008-11-04 | Oled装置用の乾燥剤封止手順 |
Country Status (6)
Country | Link |
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US (1) | US8016631B2 (ja) |
EP (1) | EP2223359A1 (ja) |
JP (1) | JP5314038B2 (ja) |
KR (1) | KR101245745B1 (ja) |
CN (1) | CN101855744B (ja) |
WO (1) | WO2009064357A1 (ja) |
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-
2007
- 2007-11-16 US US11/941,301 patent/US8016631B2/en active Active
-
2008
- 2008-11-04 EP EP08848738A patent/EP2223359A1/en not_active Withdrawn
- 2008-11-04 JP JP2010534018A patent/JP5314038B2/ja active Active
- 2008-11-04 CN CN2008801158547A patent/CN101855744B/zh active Active
- 2008-11-04 KR KR1020107013242A patent/KR101245745B1/ko active IP Right Grant
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WO2009064357A1 (en) | 2009-05-22 |
EP2223359A1 (en) | 2010-09-01 |
JP2011503820A (ja) | 2011-01-27 |
KR101245745B1 (ko) | 2013-03-26 |
KR20100108521A (ko) | 2010-10-07 |
US8016631B2 (en) | 2011-09-13 |
CN101855744A (zh) | 2010-10-06 |
US20090130941A1 (en) | 2009-05-21 |
CN101855744B (zh) | 2013-06-05 |
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