JP5309225B2 - 熱交換器および関連方法 - Google Patents
熱交換器および関連方法 Download PDFInfo
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- JP5309225B2 JP5309225B2 JP2011544441A JP2011544441A JP5309225B2 JP 5309225 B2 JP5309225 B2 JP 5309225B2 JP 2011544441 A JP2011544441 A JP 2011544441A JP 2011544441 A JP2011544441 A JP 2011544441A JP 5309225 B2 JP5309225 B2 JP 5309225B2
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- heat
- working fluid
- cavity
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
- F28F2250/08—Fluid driving means, e.g. pumps, fans
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
表1および図12の走査型電子顕微鏡写真(SEM:Scanning Electron Micrograph)に示すように、5種類の大きさの球状銅粒子を用いて、微細構造吸上げ芯を作製した。
Claims (26)
- 第1のパイプと流体連通する空洞を画定する熱接触板と、
それぞれが空洞を画定する複数の静止要素であって、各空洞が、前記第1のパイプと流体連通し、少なくとも一つの空洞が吸上げ芯を含む、複数の静止要素と、
複数の可動要素であって、前記可動要素と前記静止要素は、略平行に交互に配置され、前記可動要素の一部は、前記静止要素の一部と重なり合う、複数の可動要素と、
前記第1のパイプ内、前記静止要素により画定される空洞内、および、前記熱接触板により画定される空洞内の作動流体と、を含む装置。 - 前記吸上げ芯は焼結粒子を含む、請求項1に記載の装置。
- 前記吸上げ芯は、10μmから100μmの範囲の高さ、500nmから50μmの範囲の幅、500nmから50μmの範囲の長さ、および500nmから50μmの範囲のピッチを有する一連の柱を含む、請求項1に記載の装置。
- 64立方インチを超えない全体積を有する、請求項1に記載の装置。
- 5cm〜10cm×5cm〜10cm×5cm〜10cmの範囲の全体寸法を有する、請求項1に記載の装置。
- 前記静止要素、前記可動要素、前記熱接触板、または前記第1のパイプは、銅、アルミニウム、シリコン、黒鉛、鋼、ステンレス鋼、チタン、ダイアモンド、銀、グラフェン、これらの合金、およびこれらの混合物から成る群から選択される材料を含む、請求項1に記載の装置。
- 前記作動流体は、水、アンモニア、メタノール、エタノール、およびこれらの混合物から成る群から選択される、請求項1に記載の装置。
- 前記作動流体は、40℃から150℃の範囲の蒸発温度を有する、請求項1に記載の装置。
- 前記静止要素および対応するパイプの区画は、モノブロックから形成される、請求項1に記載の装置。
- 前記静止要素の上面より上に一定の距離だけ延びる第1パイプ区画と、前記静止要素の底面より下に一定の距離だけ延びる第2パイプ区画と、互いに等距離に積層される複数の静止要素と、を更に含む、請求項1に記載の装置。
- 前記第1のパイプの直径は1mm未満である、請求項1に記載の装置。
- 前記第1のパイプの直径は5mm未満である、請求項1に記載の装置。
- 0.5K/W未満の全体熱抵抗を有する、請求項1に記載の装置。
- 前記装置は、0.25kWから1kWの熱を放散できる、請求項1に記載の装置。
- 負荷からの熱を低減する方法であって、
空洞を画定する熱接触板に前記負荷から熱を伝達し、
吸上げ作用によって、前記熱接触板によって画定される前記空洞から、前記熱接触板とは異なる第1のパイプを介して、静止要素によって画定される空洞内に作動流体を送り、
前記可動要素と交互に配置された静止要素に対して可動要素を回転させること、を含む方法。 - 前記可動要素の少なくとも一部は、前記静止要素の一部と重なり合う、請求項15に記載の方法。
- 前記可動要素はモータにより回転される、請求項15に記載の方法。
- 焼結粒子を用いて前記作動流体を吸上げる、請求項15に記載の方法。
- 10μmから100μmの範囲の高さ、500nmから50μmの範囲の幅、500nmから50μmの範囲の長さ、および500nmから50μmの範囲のピッチを有する一連の柱を用いて前記作動流体を吸上げることを更に含み、
前記柱は、前記第1のパイプおよび前記静止要素により画定される空洞のいずれか一つの内面から延びる、請求項15に記載の方法。 - 前記熱は、全体積が64立方インチを超えない装置を用いて低減される、請求項15に記載の方法。
- 前記熱は、全体寸法が5cm〜10cm×5cm〜10cm×5cm〜10cmの範囲である装置を用いて低減される、請求項15に記載の方法。
- 前記作動流体は、水、アンモニア、メタノール、エタノール、およびこれらの混合物から成る群から選択される、請求項15に記載の方法。
- 前記作動流体は、40℃から150℃の範囲の蒸発温度を有する、請求項15に記載の方法。
- 前記熱は、0.5K/Wより低い全体熱抵抗を有する装置を用いて低減される、請求項15に記載の方法。
- 0.25kWと1kWの間の熱が、前記負荷から放散する、請求項15に記載の方法。
- 負荷からの熱を低減する方法であって、
それぞれが空洞を画定する複数の静止要素であって、各空洞が、第1のヒートパイプと流体連通し、少なくとも一つの空洞が吸上げ芯を含む、複数の静止要素を提供し、
前記静止要素と交互に配置されるとともに一部が前記静止要素の一部と重なり合う可動要素を、前記静止要素に対して移動して、前記静止要素の間で空気を流動させる、方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14272209P | 2009-01-06 | 2009-01-06 | |
US61/142,722 | 2009-01-06 | ||
PCT/US2009/066190 WO2010080235A1 (en) | 2009-01-06 | 2009-12-01 | Heat exchangers and related methods |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012514855A JP2012514855A (ja) | 2012-06-28 |
JP5309225B2 true JP5309225B2 (ja) | 2013-10-09 |
Family
ID=42310962
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011544441A Expired - Fee Related JP5309225B2 (ja) | 2009-01-06 | 2009-12-01 | 熱交換器および関連方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8678075B2 (ja) |
EP (1) | EP2374150A4 (ja) |
JP (1) | JP5309225B2 (ja) |
WO (1) | WO2010080235A1 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010036442A1 (en) * | 2008-07-21 | 2010-04-01 | The Regents Of The University Of California | Titanium-based thermal ground plane |
CN102340208A (zh) * | 2010-07-15 | 2012-02-01 | 建准电机工业股份有限公司 | 马达及具有该马达的散热风扇 |
CN103228885A (zh) * | 2010-07-30 | 2013-07-31 | Tas能量股份有限公司 | 高性能orc发电设备气冷式冷凝器系统 |
KR101422097B1 (ko) * | 2012-11-26 | 2014-07-28 | 잘만테크 주식회사 | 루프형 히트파이프 시스템용 증발기 및 그의 제조방법 |
US9409264B2 (en) * | 2013-03-25 | 2016-08-09 | International Business Machines Corporation | Interleaved heat sink and fan assembly |
US10947992B2 (en) * | 2015-08-17 | 2021-03-16 | Pedro Arnulfo Sarmiento | Convectors |
US11122715B2 (en) | 2018-05-11 | 2021-09-14 | General Electric Company | Conformal heat pipe assemblies |
US11043876B2 (en) | 2018-05-11 | 2021-06-22 | General Electric Company | Electric motor having conformal heat pipe assemblies |
SE543734C2 (en) * | 2019-03-11 | 2021-07-06 | Apr Tech Ab | Cooling of electronic components with an electrohydrodynamic flow unit |
US11976543B2 (en) * | 2019-03-19 | 2024-05-07 | Indian Institute Of Technology, Madras | High energy fracking device for focused shock wave generation for oil and gas recovery applications |
CN113054802A (zh) * | 2019-12-26 | 2021-06-29 | 通用电气公司 | 具有适形热管组件的电动马达 |
CN112566459B (zh) * | 2020-11-30 | 2022-01-11 | 瑞声科技(南京)有限公司 | 散热装置的制作方法及散热装置 |
US11988471B2 (en) | 2021-03-27 | 2024-05-21 | Massachusetts Institute Of Technology | Devices and methods for fabrication of components of a multiscale porous high-temperature heat exchanger |
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-
2009
- 2009-12-01 EP EP09837788.0A patent/EP2374150A4/en not_active Withdrawn
- 2009-12-01 JP JP2011544441A patent/JP5309225B2/ja not_active Expired - Fee Related
- 2009-12-01 US US12/628,331 patent/US8678075B2/en not_active Expired - Fee Related
- 2009-12-01 WO PCT/US2009/066190 patent/WO2010080235A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
US8678075B2 (en) | 2014-03-25 |
JP2012514855A (ja) | 2012-06-28 |
EP2374150A4 (en) | 2014-04-09 |
US20100170660A1 (en) | 2010-07-08 |
WO2010080235A1 (en) | 2010-07-15 |
EP2374150A1 (en) | 2011-10-12 |
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