JP5302776B2 - Crystal piece assembly board - Google Patents

Description

  The present invention relates to a crystal piece assembly substrate in which a plurality of crystal pieces serving as a crystal resonator element are assembled and integrated.

  A crystal resonator element is mounted inside a crystal resonator or crystal oscillator, which is one of electronic components. The crystal resonator element includes a crystal piece and an excitation electrode, a connection electrode, and a conductive wiring pattern provided on the surface of the crystal piece. The crystal piece is a thin plate, and the outer shape in plan view is, for example, a circular shape, a square shape, or a tuning fork shape. The excitation electrode is provided at a predetermined position on the surface of the crystal piece and excites at least a part of the crystal piece. The conductive wiring pattern is provided on the surface of the crystal piece so as to electrically connect, for example, a predetermined excitation electrode and a predetermined connection electrode described later. The connection electrode is provided at a predetermined position on the surface of the crystal piece and is electrically connected to a container on which the crystal resonator element is mounted. When manufacturing a crystal piece to be used as such a crystal resonator element, a crystal piece aggregate substrate in which a plurality of crystal pieces are assembled and integrated is used.

  FIG. 10 is a plan view showing an example of a conventional quartz piece aggregate substrate. FIG. 11 is an enlarged view of a portion D in FIG. FIG. 12 is an enlarged view of a portion E in FIG. As shown in FIG. 10, the crystal piece assembly substrate 800 includes a crystal plate 801, a breaker 810, and a crystal piece 820.

  As shown in FIGS. 10 and 11, the external shape of the crystal plate 801 is a substantially square shape in plan view, and the thickness is, for example, about 100 μm. The quartz plate 801 is provided with, for example, three through portions 802 having a rectangular opening. The through portions 802 are provided in the quartz plate 801 so as to be arranged at equal intervals. The penetrating portion 802 is sized so that a desired number of later-described breaker portions 810 and crystal pieces 820 can be aligned in the penetrating portion 802.

  As shown in FIG. 12, the folding unit 810 has a trapezoidal shape in plan view, and a plurality of long side surfaces are provided so as to be integrally connected to one of the side surfaces of each penetrating unit 802. Further, the short side surface of the breaker 810 is integrally connected to a crystal piece 820 described later. A boundary portion between the breaker 810 and the crystal piece 820 becomes a break line BL2 when the crystal piece 820 is separated from the breaker 810.

  As shown in FIGS. 10 and 11, the crystal piece 820 includes a base portion 821 that is substantially rectangular in plan view, a first vibrating arm portion 822 that extends in the same direction from one side of the base portion 821, and a second vibrating arm portion. 823 is generally configured in a tuning fork shape. On the front and back main surfaces of the first vibrating arm portion 822 and the second vibrating arm portion 823, a groove portion 824 having a predetermined length from the boundary portion with the base 821 toward the tip of each vibrating arm portion. Is provided. The entire length of the crystal piece 820 is, for example, about 2 mm, and the width is, for example, about 0.5 mm. Further, as shown in FIGS. 11 and 12, the crystal piece 820 is folded at the center portion of the side facing the side where the first vibrating arm portion 822 and the second vibrating arm portion 823 of the base portion 821 are extended. It connects with the short side surface of the taking part 820 integrally (for example, refer patent document 1).

Such a crystal piece assembly substrate 800 is manufactured by the following method, for example.
First, a corrosion-resistant film is formed on the entire front and back main surfaces of a flat plate and a substantially rectangular crystal plate in plan view. A resist film is formed on the entire surface of the corrosion resistant film. Of the resist film, the resist film in the portion that becomes the penetrating portion 802 and the portion that becomes the groove portion 824 provided in each vibrating arm portion of the crystal piece 820 is removed from the corrosion-resistant film by the photolithography technique and the etching technique.

  Thereafter, the portion of the corrosion-resistant film from which the resist film has been removed is removed from the quartz plate by an etching technique, and the remaining resist film on the corrosion-resistant film is removed. Then, of the portion from which the corrosion-resistant film has been removed, the quartz plate of the portion that becomes the groove portion 824 is half-etched to form the groove portion 824, and at the same time, the other quartz plate portion where the corrosion-resistant film is not formed is etched to 802 is formed. By forming the penetrating part 802, the outer shape of the breaker part 810 and the crystal piece 820 is formed. Thereafter, the corrosion-resistant film remaining on the surface of the quartz plate is removed. The crystal piece assembly substrate 800 is manufactured by such a method (see, for example, Patent Document 2).

JP 2003-198299 A (FIGS. 6, 7, 16, and 17) JP 2008-60952 A

  However, as the crystal resonator becomes thinner, the crystal piece 820 constituting the crystal resonator element mounted therein needs to be thinner. In the crystal piece assembly substrate 800 including the crystal piece 820, the crystal piece 820 and the breaker 810 other than the crystal piece 820 become thin at the same time in the manufacturing process. The mechanical strength of the breaker 810 decreases.

  For example, the crystal piece assembly substrate 800 is appropriately subjected to ultrasonic cleaning in the manufacturing process. When the quartz piece aggregate substrate 800 is subjected to ultrasonic cleaning, a load due to an impact at the time of bubble collapse generated by ultrasonic vibration is applied mainly from the main surface direction of the quartz plate 801 and the breaker 810. When such a conventional quartz piece aggregate substrate 800 is thinned, the load may cause a crack in the quartz plate 801 from the outer peripheral portion to the inside. Further, in the crystal piece aggregate substrate 800, the crystal plate 801 sometimes breaks from this crack. Further, the breakage portion 810 may be cracked by the load, and the breakage portion 810 may break due to the crack, and the crystal piece 820 may fall off the crystal piece assembly substrate 800.

If the ultrasonic vibration at the time of ultrasonic cleaning is reduced and the load is reduced with respect to such a problem, there is a possibility that foreign matter adhering to the surface of the crystal piece aggregate substrate 800 cannot be removed. It is also conceivable to increase the mechanical strength by making the quartz plate 801 and the breaker 810 thicker than the quartz piece 820. However, in that case, it is necessary to increase the photolithography process and the etching process for forming a portion having a thickness different from that of the crystal piece 820 in the crystal piece aggregate substrate 800, which increases the manufacturing cost of the crystal piece aggregate substrate 800. There is a problem.
An object of the present invention is to provide a crystal piece assembly substrate that can be manufactured without reducing the bending of the crystal plate and the breaker and without increasing the number of manufacturing steps.

  The present invention has been made to solve the above-described problems, and includes a quartz plate provided with at least one penetrating portion, a plurality of break-up portions provided on a side surface of the penetrating portion, A connection part connected to the breaker part and a crystal piece connected to the connection part are formed, and the crystal plate is formed with a pair of first groove parts at a predetermined interval on at least one main surface. A pair of second groove portions are formed between the first groove portions and at a predetermined interval in a direction perpendicular to the first groove portions, and the through-holes are formed in the first groove portions. Formed in a portion surrounded by one groove portion and the second groove portion, and a third surface extending from the breaker portion to the connection portion on at least one main surface of the breakaway portion and the connection portion. The crystal piece assembly substrate is provided with a groove portion.

  The present invention is also the crystal piece aggregate substrate characterized in that the external shape of the crystal piece is any one of a square shape, a tuning fork shape, and an H shape.

  According to the quartz crystal substrate according to the present invention, two pairs of first groove portions are provided at a predetermined interval on at least one main surface of the crystal plate, and are located between the first groove portions and the first groove portion. By providing two pairs of second groove portions at a predetermined interval in a direction orthogonal to the groove portions, the mechanical strength against the load from the main surface direction of the quartz plate can be improved.

  In addition, by providing a third groove portion from the breaker portion to the connection portion on at least one main surface of the breakage portion and the connection portion, the mechanical force against the load from the principal surface direction of the breakage portion and the connection portion is increased. Strength can be improved.

Furthermore, since the first groove portion, the second groove portion, and the third groove portion can be formed simultaneously in the process of forming the conventional groove portion on the vibrating arm portion of the crystal piece, the first groove portion, the second groove portion, Therefore, it is not necessary to provide a new process for forming the groove portion and the third groove portion, and the number of manufacturing steps for the crystal piece assembly substrate does not increase as compared with the prior art.
Thereby, this invention can manufacture a quartz-piece assembly board | substrate, without reducing the bending of a quartz plate and a folding part, and increasing a manufacturing man-hour.

It is a top view which shows an example of the crystal piece aggregate substrate which concerns on embodiment of this invention. It is the A section enlarged view of FIG. FIG. 3 is a cross-sectional view taken along a line BB in FIG. 2. It is the C section enlarged view of FIG. It is a perspective view which shows a part of crystal oscillation element comprised from the crystal piece which comprises the crystal piece aggregate | assembly board | substrate which concerns on embodiment of this invention. It is a fragmentary sectional view showing the 1st modification of a crystal piece aggregate substrate concerning an embodiment of the present invention. It is a fragmentary sectional view showing the 2nd modification of a crystal piece aggregate substrate concerning an embodiment of the present invention. It is a perspective view which shows the further modification of the crystal piece aggregate substrate which concerns on embodiment of this invention. It is a perspective view which shows the further modification of the crystal piece aggregate substrate which concerns on embodiment of this invention. It is a top view which shows the conventional quartz piece aggregate substrate. It is the D section enlarged view of FIG. It is the E section enlarged view of FIG.

Hereinafter, embodiments of a crystal piece assembly substrate according to the present invention will be described with reference to the drawings.
In each of the drawings, a part of the structure is not shown, and some dimensions are exaggerated for the sake of clarity. In particular, the thickness dimensions of FIGS. 3, 5, 6, 7, 8, and 9 are exaggerated.

FIG. 1 is a plan view showing a crystal piece assembly substrate according to an embodiment of the present invention. FIG. 2 is an enlarged view of part A in FIG. 3 is a cross-sectional view taken along the line BB in FIG. FIG. 4 is an enlarged view of a portion C in FIG. FIG. 5 is a perspective view showing a part of a crystal resonator element composed of crystal pieces constituting a crystal piece aggregate substrate according to an embodiment of the present invention. FIG. 6 is a partial cross-sectional view showing a first modification of the crystal resonator element according to the embodiment of the invention. FIG. 7 is a partial cross-sectional view showing a second modification of the crystal piece aggregate substrate according to the embodiment of the present invention. FIG. 8 is a perspective view showing a further modification of the crystal piece aggregate substrate according to the embodiment of the present invention. FIG. 9 is a perspective view showing a further modification of the crystal piece assembly substrate according to the embodiment of the present invention.
As shown in FIG. 1 and FIG. 2, the crystal piece assembly substrate 100 is generally configured by a crystal plate 101, a breaker 110, a connection part 120, and a crystal piece 130.

  As shown in FIG. 1, the quartz plate 101 is substantially rectangular in plan view, and has a thickness of about 100 μm, for example. The front and back main surfaces of the quartz plate 101 are provided with a pair of first grooves 102 on each main surface. One first groove portion 102 provided on each main surface is provided in the vicinity of the two sides of the outer periphery along two opposite sides of the quartz plate 101. As shown in FIG. 3, the first groove portion 102 includes a bottom surface of the first groove portion 102 provided on the front main surface of the crystal plate 101 and a crystal corresponding to the first groove portion 102 on the front main surface. It is provided so that the bottom surface of the first groove portion 102 provided on the back main surface of the plate 101 faces.

  Further, as shown in FIG. 1, two pairs of second grooves 103 are provided on each main surface on the front and back main surfaces of the crystal plate 101. The second groove portion 103 provided on each main surface is in the vicinity of two outer peripheral sides along the outer peripheral two sides different from the outer peripheral two sides of the crystal plate 101 provided along the first groove portion 102. And one each between two first grooves 102 provided on the same main surface. That is, the first groove 102 and the second groove 103 are provided in directions orthogonal to each other. The second groove 103 is formed on the bottom surface of the second groove 103 provided on the front main surface of the crystal plate 101 and on the back main surface of the crystal plate 101 corresponding to the second groove 103 on the front main surface. The second groove portion 103 is provided so as to face the bottom surface (not shown).

  In a portion surrounded by the first groove 102 and the second groove 103 of the crystal plate 101, for example, three through portions 104 having a rectangular opening are provided. The through-holes 104 are provided in the quartz plate 101 at regular intervals. The penetrating portion 104 is sized so that a desired number of later-described breaker portions 110, connecting portions 120, and crystal pieces 130 can be aligned in the penetrating portion 104. In this embodiment, the number of penetrating portions 104 provided in the crystal plate 101 is three, but a plurality of penetrating portions 104 may be provided corresponding to the size of the crystal plate 101.

  As shown in FIG. 4, the folding unit 110 has, for example, a trapezoidal shape in plan view, and a plurality of long side surfaces are provided so as to be integrally connected to one of the side surfaces of each penetrating unit 104. Further, the short side surface of the breaker 110 is integrally connected to a connecting portion 120 described later.

  As shown in FIG. 4, the connecting portion 120 is provided so as to be integrally connected to the short side surface of each breaker portion 110. In FIG. 4, the longitudinal direction with respect to the paper surface is the length direction of the connecting portion 120, and the horizontal direction with respect to the paper surface is the width direction of the connecting portion 120. The width dimension of one end in the length direction connected to the breaker part 110 of the connection part 120 is the same as the short side dimension of the breaker part 110. The shape of the connecting portion 120 in plan view is, for example, a width dimension that increases from one end in the length direction to the other end, and a width dimension from the position where the predetermined width dimension is reached to the other end in the length direction. Has a certain shape. Note that a boundary portion between the breaker 110 and the connection part 120 becomes a break line BL1 when the connection part 120 and the crystal piece 130 are separated from the breaker 110. By providing the connecting portion 120, it is possible to prevent the chip 131 or the crack forming the crystal piece 130 from being directly cracked or cracked when the crystal piece 130 described later is separated from the breaker 110.

  As shown in FIGS. 1 and 2, the crystal piece 130 includes a base 131 having a rectangular shape in plan view, a first vibrating arm 132 and a second vibrating arm 133 extending from one side of the base 131 in the same direction. It is roughly constructed in a tuning fork shape consisting of On both the front and back main surfaces of the first vibrating arm portion 132 and the second vibrating arm portion 133, a groove portion 134 having a predetermined length from the boundary portion with the base portion 131 toward the tip of each vibrating arm portion. Are provided in parallel for each vibrating arm. The entire length of the crystal piece 130 is, for example, about 2 mm, and the width is, for example, about 0.5 mm. As shown in FIG. 4, the crystal piece 130 is a central portion of the side surface facing the side where the first vibrating arm portion 132 and the second vibrating arm portion 133 of the base portion 131 are extended, and the connecting portion 120. It is connected integrally with the other end in the length direction. That is, the crystal piece 130 is integrally connected to the breaker 110 via the connecting part 120.

As shown in FIG. 4, a third groove 111 extending from the folding part 110 to the connection part 120 is provided on both main surfaces of the folding part 110 and the connection part 120. The third groove 111 is formed so that the central axis CL2 of the width of the third groove 111 coincides with the central axis CL1 of the width of the crystal piece 130 shown in FIG. Is provided.
w In addition, the crystal plate 101 other than the groove part 134 provided in each vibration arm part of the 1st groove part 102, the 2nd groove part 103, the 3rd groove part 111, and the crystal piece, the breaker part 110, the connection part 120, and the crystal The pieces 130 have the same thickness.

Such a crystal piece assembly substrate 100 is manufactured by the following method, for example.
First, a corrosion-resistant film is formed on the entire front and back main surfaces of a flat plate and a substantially rectangular crystal plate in plan view. A resist film is formed on the entire surface of the corrosion resistant film. Of the resist film, a portion to be a through portion 104, a portion to be each first groove portion 102, a portion to be each second groove portion 103, a portion to be each third groove portion 111, and each vibrating arm of a crystal piece The resist film in the portion to be the groove 124 provided in the portion is removed from the corrosion-resistant film by photolithography technology and etching technology.

  Thereafter, the portion of the corrosion-resistant film from which the resist film has been removed is removed from the quartz plate by an etching technique, and the remaining resist film on the corrosion-resistant film is removed. Of the portions from which the corrosion-resistant film has been removed, the portion to be the first groove portion 102, the portion to be the second groove portion 103, the portion to be the third groove portion 111, and the groove portion provided in each vibrating arm portion of the crystal piece A portion of the crystal plate 134 that is to be formed is half-etched to form the groove portions, and at the same time, portions other than the crystal plate that are not provided with the corrosion-resistant film are etched to form the penetrating portion 104. By forming the penetrating portion 104, the outer shape of the folding portion 110, the connecting portion 120, and the crystal piece 130 is formed. Thereafter, the corrosion-resistant film remaining on the surface of the quartz plate is removed. The crystal piece assembly substrate 100 is manufactured by such a method.

  According to such a crystal piece assembly substrate 100, two pairs of first groove portions 102 are provided on the front and back main surfaces of the crystal plate 101, and are between the first groove portions 102 and orthogonal to the first groove portions 102. By providing two pairs of the second groove portions 103 in the direction to perform, the mechanical strength against the load from the main surface direction of the crystal plate 101 can be improved. In addition, by providing a third groove 111 from the breaker 110 to the connection part 120 on the front and back main surfaces of the breaker 110 and the connection part 120, the main part of the breaker 110 and the connection part 120 from the main surface direction is provided. The mechanical strength against the load can be improved.

  Therefore, for example, it is possible to prevent occurrence of chipping or cracking of the crystal plate 101 due to a load from the main surface direction of the crystal piece assembly substrate 100, which occurred when ultrasonic cleaning was performed on the crystal piece assembly substrate 100, It is also possible to prevent the crystal plate 101 from being broken due to this chipping or crack. In addition, it is possible to prevent the breakage of the breaker 110 and the connection part 120, and the breakage part 110 and the connection part 120 are broken by the crack, and the crystal piece 130 is dropped from the crystal piece assembly substrate 100. Can be prevented.

In addition, the first groove 102, the second groove 103, and the third groove 111 can be formed at the same time in the process of forming the groove 134 provided on each vibrating arm of the crystal piece 130. It is not necessary to provide a new process for forming the first groove portion 102, the second groove portion 103, and the third groove portion 111, and the number of manufacturing steps for the crystal piece assembly substrate 100 does not increase as compared with the prior art.
Therefore, according to the present invention, it is possible to reduce the breakage of the crystal plate 101, the breaker 110, and the connection part 120, and it is possible to manufacture the crystal piece assembly substrate 100 without increasing the number of manufacturing steps.

  Each crystal piece 130 in the crystal piece assembly substrate 100 has an excitation electrode 201, a connection electrode 202, and a conductive wiring pattern 203 as illustrated in FIG. Are provided to form the crystal resonator element 200. The connection electrode 202 is used for electrical connection with an element connection electrode pad provided on an element mounting member constituting the crystal resonator. The conductive wiring pattern 202 electrically connects the excitation electrode 201 and the connection electrode 202. Each crystal resonator element 200 is separated from the folding part 110 by the break line BL1 after the excitation electrode 201, the connection electrode 202, and the conductive wiring pattern 203 are formed on each crystal piece 130 of the quartz piece aggregate substrate 100. It is divided into pieces.

(First modification)
Next, a first modification of the crystal piece aggregate substrate according to the embodiment of the present invention will be described. FIG. 6 is a partial cross-sectional view showing a first modification of the crystal piece aggregate substrate according to the embodiment of the present invention. 6 is a cross-sectional view of the same portion as FIG. In the first modification of the crystal piece assembly substrate according to the embodiment of the invention, the first groove portion 102, the second groove portion 103, and the third groove portion 111 are provided only on one main surface of the crystal plate 101. This is different from the above embodiment. In addition, even if it comprises the 1st modification of the crystal piece aggregate substrate 100 in this way, there exists an effect similar to embodiment of this invention.

(Second modification)
Next, a second modification of the crystal piece aggregate substrate according to the embodiment of the present invention will be described. FIG. 7 is a partial cross-sectional view showing a second modification of the crystal piece aggregate substrate according to the embodiment of the present invention. 7 is a cross-sectional view of the same portion as FIG. The second modification of the crystal piece assembly substrate according to the embodiment of the present invention is the first groove portion 102 and the second groove portion 103 provided on the front and back main surfaces of the crystal plate 101, and the first groove portion provided on the front main surface. The bottom surfaces of the one groove portion 102 and the second groove portion 103 and the bottom surfaces of the first groove portion 102 and the second groove portion 103 provided on the back main surface corresponding to the first groove portion 102 and the second groove portion 103 are It differs from the said embodiment by the point provided so that it may not oppose. In addition, even if it comprises the 2nd modification of the crystal piece assembly board | substrate 100 in this way, there exists an effect similar to embodiment of this invention.

(Further modifications)
Next, a further modification of the crystal piece aggregate substrate 100 according to the embodiment of the present invention will be described. The external shape of the crystal piece 130 in the above-described embodiment, the first modification, and the second modification is an example, and does not limit the present invention. For example, the external shape of the crystal piece may be a quadrangular shape or an H-shape in which four arms are extended from the base.

FIG. 8 is a perspective view showing a further modification of the crystal piece assembly substrate 100 according to the embodiment of the present invention, and shows an example in which the external shape of the crystal piece constituting the crystal piece assembly substrate 100 is a square shape. ing.
As shown in FIG. 8 (a), for example, a quartz crystal piece having a rectangular outer shape has a long thickness along the X axis, which is one of the crystal axes, and the entire thickness of the flat crystal plate has a thickness. There is a flat crystal piece 300 that is the same. The connecting portion 120 provided with the third groove portion 111 is formed in the length direction of the connecting portion 120 at the central portion of the side surface 301 on one short side of the crystal piece 300 along the Z ′ axis that is one of the crystal axes. The other end of is connected together.
Further, as shown in FIG. 8 (b), a crystal piece having a square outer shape is formed on the front and back main surfaces of a flat plate-shaped crystal plate 311 having a long side along the X axis which is one of crystal axes. There is also a so-called mesa crystal piece 310 having a convex portion 312 and using the convex portion 312 as a vibrating portion. The connecting portion 120 provided with the third groove portion 111 is formed in the length direction of the connecting portion 120 at the central portion of the side surface 313 on one short side of the crystal piece 310 along the Z ′ axis that is one of the crystal axes. The other end of is connected together.
Further, as shown in FIG. 8 (c), one main surface of a plate-like crystal plate 321 having a long side along the X-axis which is one of the crystal axes is included in a crystal piece having a rectangular outer shape. There is also a so-called inverted mesa crystal piece 320 in which the opening portion has a quadrangular concave portion 322 and the bottom surface of the concave portion 322 is a vibrating portion. The connection part 120 provided with the third groove part 111 is formed in the length direction of the connection part 120 at the center part of the side surface 323 on one short side of the crystal piece 320 along the Z ′ axis which is one of the crystal axes. The other end of is connected together. Even if such a further modification of the crystal piece assembly substrate 100 is configured, the same effects as those of the embodiment of the present invention are obtained.

FIG. 9 is a perspective view showing a further modification of the crystal piece assembly substrate 100 according to the embodiment of the present invention, and an example in which the outer shape of the crystal piece constituting the crystal piece assembly substrate 100 is an H-shape. Show.
A crystal piece having an H-shaped outer shape is used as, for example, a component of an angular velocity sensor element. As shown in FIG. 8, for example, the crystal piece 400 includes a rectangular base 401 having a long side along the X ′ axis, and a pair of excitation arms 402 extending from the base 401 along the Y ′ axis. A pair of detection arms 403 extending from the base 401 on the opposite side of the excitation arm 402, and a support 404 for fixing the element mounting member to the base 401. It is provided between the arm portions 403. The connection part 120 provided with the third groove part 111 is integrated with the other end in the length direction of the connection part 120 at the center part of the side surface 405 along the X ′ axis of the tip part of the support part 404. It is connected. Even if such a further modification of the crystal piece assembly substrate 100 is configured, the same effects as those of the embodiment of the present invention are obtained.

  In addition to the above-described embodiments, various changes and improvements can be made without departing from the scope of the present invention. For example, the size of the quartz plate in the quartz piece aggregate substrate, the size and number of the penetrating portions provided in the quartz plate, and the number of breakers, connecting portions, and quartz pieces arranged in the penetrating portion are described as the above embodiment. The present invention is not limited to the disclosed crystal piece aggregate substrate 101.

DESCRIPTION OF SYMBOLS 100 ... Quartz piece aggregate substrate 101 ... Quartz plate 102 ... 1st groove part 103 ... 2nd groove part 104 ... Penetration part 110 ... Breaking part 111 ... 3rd Groove portion 120 ... connection portion 130, 300, 310, 320, 400... Crystal piece 131... Base portion 132... First vibration arm portion 133. Groove

Claims (2)

A quartz plate provided with at least one penetrating part;
A plurality of breakers provided on a side surface of the penetrating part;
A connecting portion connected to each of the folding portions;
A crystal piece connected to the connection part,
In the quartz plate, a pair of first groove portions are formed at a predetermined interval on at least one main surface, and the direction is between the first groove portions and perpendicular to the first groove portion. A pair of two second grooves are formed at a predetermined interval,
The penetrating portion is formed in a portion surrounded by the first groove portion and the second groove portion,
3. A quartz piece aggregate substrate, wherein a third groove part extending from the breaker part to the connection part is provided on at least one main surface of the breaker part and the connection part.   2. The crystal piece aggregate substrate according to claim 1, wherein an outer shape of the crystal piece is any one of a quadrangular shape, a tuning fork shape, and an H-shape.

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