JP5301931B2 - 研磨方法および研磨装置 - Google Patents

研磨方法および研磨装置 Download PDF

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Publication number
JP5301931B2
JP5301931B2 JP2008234991A JP2008234991A JP5301931B2 JP 5301931 B2 JP5301931 B2 JP 5301931B2 JP 2008234991 A JP2008234991 A JP 2008234991A JP 2008234991 A JP2008234991 A JP 2008234991A JP 5301931 B2 JP5301931 B2 JP 5301931B2
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polishing
target
substrate
vibration
unit
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JP2008234991A
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Japanese (ja)
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JP2010064220A (ja
JP2010064220A5 (https=
Inventor
利文 金馬
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Ebara Corp
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Ebara Corp
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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2008234991A 2008-09-12 2008-09-12 研磨方法および研磨装置 Expired - Fee Related JP5301931B2 (ja)

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JP2008234991A JP5301931B2 (ja) 2008-09-12 2008-09-12 研磨方法および研磨装置

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JP2008234991A JP5301931B2 (ja) 2008-09-12 2008-09-12 研磨方法および研磨装置

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JP2010064220A JP2010064220A (ja) 2010-03-25
JP2010064220A5 JP2010064220A5 (https=) 2011-10-13
JP5301931B2 true JP5301931B2 (ja) 2013-09-25

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230010759A1 (en) * 2021-07-06 2023-01-12 Applied Materials, Inc. Chemical mechanical polishing vibration measurement using optical sensor
US11897077B2 (en) 2020-03-10 2024-02-13 Kioxia Corporation Semiconductor manufacturing apparatus

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5612945B2 (ja) * 2010-07-23 2014-10-22 株式会社荏原製作所 基板の研磨の進捗を監視する方法および研磨装置
JP2016004903A (ja) 2014-06-17 2016-01-12 株式会社東芝 研磨装置、研磨方法、及び半導体装置の製造方法
US9902038B2 (en) 2015-02-05 2018-02-27 Toshiba Memory Corporation Polishing apparatus, polishing method, and semiconductor manufacturing method
CN106112810A (zh) * 2016-08-08 2016-11-16 泉州装备制造研究所 石材磨抛系统故障智能检测和分析方法和装置
JP7312103B2 (ja) * 2016-09-15 2023-07-20 アプライド マテリアルズ インコーポレイテッド 化学機械研磨スマートリング
JP7403213B2 (ja) * 2017-10-31 2023-12-22 株式会社荏原製作所 研磨装置、及び研磨方法
KR102677387B1 (ko) * 2018-03-13 2024-06-24 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마 동안 진동들의 모니터링
WO2020046502A1 (en) * 2018-08-31 2020-03-05 Applied Materials, Inc. Polishing system with capacitive shear sensor
US20200230781A1 (en) * 2019-01-23 2020-07-23 Applied Materials, Inc. Polishing pads formed using an additive manufacturing process and methods related thereto
JP7306054B2 (ja) * 2019-05-17 2023-07-11 Ａｇｃ株式会社 異常検知装置及び異常検知方法
JP7468856B2 (ja) * 2019-12-03 2024-04-16 株式会社荏原製作所 研磨装置および研磨方法
KR102793516B1 (ko) * 2019-12-03 2025-04-11 가부시키가이샤 에바라 세이사꾸쇼 연마 장치 및 연마 방법
CN111002214B (zh) * 2019-12-25 2021-08-06 唐山万士和电子有限公司 一种压电石英晶片凸面研磨频率实时监测装置
JP2021141255A (ja) 2020-03-06 2021-09-16 キオクシア株式会社 半導体製造装置および半導体装置の製造方法
JP2024117029A (ja) * 2023-02-16 2024-08-28 株式会社東京精密 研磨終点検出装置及び方法並びにｃｍｐ装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5964643A (en) * 1995-03-28 1999-10-12 Applied Materials, Inc. Apparatus and method for in-situ monitoring of chemical mechanical polishing operations
JP3894367B2 (ja) * 1995-04-26 2007-03-22 富士通株式会社 研磨装置
JP2006187837A (ja) * 2005-01-06 2006-07-20 Toyo Tire & Rubber Co Ltd 研磨パッド
JP4904027B2 (ja) * 2005-08-10 2012-03-28 ニッタ・ハース株式会社 研磨パッド
JP4857659B2 (ja) * 2005-08-24 2012-01-18 富士電機株式会社 膜厚評価方法、研磨終点検出方法及びデバイス製造装置
JP2008068388A (ja) * 2006-09-15 2008-03-27 Tokyo Seimitsu Co Ltd 静電結合型センサ及びそれを用いた終点検出方法及び終点検出装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11897077B2 (en) 2020-03-10 2024-02-13 Kioxia Corporation Semiconductor manufacturing apparatus
US20230010759A1 (en) * 2021-07-06 2023-01-12 Applied Materials, Inc. Chemical mechanical polishing vibration measurement using optical sensor
TWI858348B (zh) * 2021-07-06 2024-10-11 美商應用材料股份有限公司 使用光學感測器來進行化學機械研磨振動測量的設備及方法
US12447579B2 (en) 2021-07-06 2025-10-21 Applied Materials, Inc. Chemical mechanical polishing vibration measurement using optical sensor

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