JP5291300B2 - Work processing device - Google Patents

Work processing device Download PDF

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Publication number
JP5291300B2
JP5291300B2 JP2007135981A JP2007135981A JP5291300B2 JP 5291300 B2 JP5291300 B2 JP 5291300B2 JP 2007135981 A JP2007135981 A JP 2007135981A JP 2007135981 A JP2007135981 A JP 2007135981A JP 5291300 B2 JP5291300 B2 JP 5291300B2
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workpiece
work
unit
support
introduction
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JP2008294092A (en
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晃 植原
昌之 都田
優 梅田
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Watanabe Shoko KK
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Watanabe Shoko KK
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Priority to PCT/JP2008/059248 priority patent/WO2008143260A1/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742Mechanical parts of transfer devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67126Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Multi-Process Working Machines And Systems (AREA)

Abstract

Provided is a work processing device which can hold a plurality of works arranged coaxially and apart from one another in the vertical direction which orthogonally intersects the work convey direction (horizontal direction), which requires few constrains for an installation space. The work processing device includes: a work processing unit (10) which has a lot (13) for multi-mounting works (W) apart from one another in the vertical direction and processes the works in the multi-supported state; a work introduction unit (20) connected to the upper or lower portion of the work processing unit (10); and a work discharge unit (30) connected to the lower or upper portion of the work processing unit (10). Shutter members (23, 33) which shut off the communication state with the atmosphere side are arranged at an introduction opening (22) and a discharge opening (32) provided in the work introduction unit (20) and the work discharge unit (30).

Description

本発明は、半導体ウエハ等のワークの製造工程において、連続した同一処理を複数のワークに対して行うことができるワーク処理装置に関する。   The present invention relates to a workpiece processing apparatus capable of performing the same continuous processing on a plurality of workpieces in a manufacturing process of workpieces such as semiconductor wafers.

特開2002−001099号公報JP 2002-001099 A 特開平11−290016号公報 従来から、半導体ウエハ等の薄肉な円盤状のワークを成形加工する際、その製造工程において時間を要する処理に対して複数のワークを同時期に処理することができれば、製造ライン全体の簡素化や省スペース化を実現することができることから、種々の提案がなされている(例えば、特許文献1,2参照)。JP, 11-290016, A Conventionally, when processing thin disk-like work, such as a semiconductor wafer, if a plurality of works can be processed at the same time with respect to processing which requires time in the manufacturing process, Various proposals have been made since simplification and space saving of the entire production line can be realized (see, for example, Patent Documents 1 and 2).

例えば、特許文献1に開示の技術の場合、複数のワークを立ち上げた対面状態で保持し、そのワークの間に処理装置(洗浄装置)を配置して一度に2枚のワークを同時期に処理するように構成されている。   For example, in the case of the technology disclosed in Patent Document 1, a plurality of workpieces are held in a face-to-face state, and a processing device (cleaning device) is disposed between the workpieces, so that two workpieces are placed at the same time. Configured to process.

また、特許文献2に開示の技術では、ベルトコンベア等の搬送装置上にワークを載置し、ベルトコンベアの搬送方向に沿って処理装置(金属有機化合物塗布装置)を設け、ベルトコンベアによるワーク搬送中に複数のワークを同時期に処理するように構成されている。   In the technique disclosed in Patent Document 2, a workpiece is placed on a conveyor device such as a belt conveyor, a processing device (metal organic compound coating device) is provided along the conveyor direction of the belt conveyor, and the workpiece is conveyed by the belt conveyor. It is configured to process multiple workpieces at the same time.

ところで、上述したワーク処理装置にあっては、ワーク間に処理装置を配置したり、搬送方向に隣接していることから、大量のワークをコンパクトな処理装置で同時期に処理するには余りにも制約があり、2〜5枚程度のワークを同時期に処理するのが限界であった。   By the way, in the workpiece processing apparatus described above, since the processing apparatuses are arranged between the workpieces or adjacent to each other in the transport direction, it is too much to process a large amount of workpieces simultaneously with a compact processing apparatus. Due to restrictions, it was the limit to process about 2 to 5 workpieces at the same time.

また、近年の半導体ウエハや液晶表示装置用のガラス基板等のように大型化が進んでいる現状にあっては、上述した処理枚数はさらに少なく制約されてしまうという問題が生じていた。   Further, in the present situation where the size is increasing like a recent semiconductor wafer or a glass substrate for a liquid crystal display device, there has been a problem that the number of processed sheets described above is further limited.

そこで、本発明は、上記事情を考慮し、大量のワークを同時期に処理することができるワーク処理装置を提供することを目的とする。   In view of the above circumstances, an object of the present invention is to provide a workpiece processing apparatus capable of processing a large amount of workpieces at the same time.

請求項1に記載のワーク処理装置は、ワークを離間状態で上下に多重支持する支持部材を内装し且つその多重支持状態でワーク処理を行うワーク処理部と、該ワーク処理部の上方又は下方に接続されたワーク導入部と、前記ワーク処理部の下方又は上方に接続されたワーク排出部とを備え、前記ワーク導入部及び前記ワーク排出部に設けられた導入口又は排出口と前記ワーク処理部に設けられた前記ワーク導入部及び前記ワーク排出部との各連通口との少なくとも何れか一方には大気側との連通状態を遮断するシャッタ部材が設けられていることを特徴とする。   The workpiece processing apparatus according to claim 1 includes a support member that multiplex-supports the workpiece in a vertical state in a separated state and performs workpiece processing in the multiplex support state, and above or below the workpiece processing unit. A workpiece introduction unit connected to the workpiece processing unit, or a workpiece ejection unit connected to a lower side or an upper side of the workpiece processing unit; an introduction port or an ejection port provided in the workpiece introduction unit and the workpiece ejection unit; and the workpiece processing unit. At least one of the workpiece introduction portion and the communication outlet of the workpiece discharge portion provided in a shutter is provided with a shutter member that blocks communication with the atmosphere side.

請求項1に記載のワーク処理装置によれば、ワークは搬送方向(水平方向)とは直交する設置スペース等の制約の少ない上下方向に離間した状態で同軸上に複数保持することができ、大量のワークを同時期に処理することができる。   According to the workpiece processing apparatus of claim 1, a plurality of workpieces can be held on the same axis in a state of being spaced apart in the vertical direction with less restrictions such as installation space orthogonal to the conveyance direction (horizontal direction). Can be processed at the same time.

請求項に記載のワーク処理装置は、前記支持部材は、一対複数組の棒状に構成され且つ内方に向けて突出する複数の段状支持突起を備え、各一対の一方は一段分の範囲で上下方向に昇降可能となっており、各一対の他方は一方の支持部材がワークを支持したまま昇降している際にはワーク被支持状態とするように退避可能となっていることを特徴とする。 The work processing apparatus according to claim 1 , wherein the support member includes a plurality of stepped support protrusions configured in a pair of a plurality of rod shapes and projecting inwardly, and each one of the pair corresponds to one step. It is possible to move up and down in the range, and the other of each pair can be retracted so as to be in a workpiece supported state when one support member is lifted while supporting the workpiece. Features.

請求項に記載のワーク処理装置は、前記支持部材は、螺旋状に分割されたワーク支持部を備えていると共にワークの中心を基準にスイング回転することによってワークを上段又は下段へと移送することを特徴とする。 The workpiece processing apparatus according to claim 2 , wherein the support member includes a workpiece support portion that is divided in a spiral shape, and moves the workpiece to an upper stage or a lower stage by swinging and rotating with respect to the center of the workpiece. It is characterized by that.

本発明のワーク処理装置によれば、大量のワークを同時期に処理することができる。   According to the workpiece processing apparatus of the present invention, a large amount of workpieces can be processed at the same time.

次に、本発明の一実施形態に係るワーク処理装置についてワーク乾燥装置に適用し、図面を参照して説明する。   Next, a workpiece processing apparatus according to an embodiment of the present invention is applied to a workpiece drying apparatus and will be described with reference to the drawings.

図1乃至図11は本発明の一実施形態に係るワーク処理装置を示し、図1はワーク処理装置の外観斜視図、図2(A)はワーク処理装置の大気側とのワーク受け渡し状態の説明図、図2(B)はワーク処理装置の処理室側とのワーク受け渡し状態の説明図、図3乃至図11はワーク処理装置のワーク搬送処理状態を時系列で示した説明図である。   1 to 11 show a workpiece processing apparatus according to an embodiment of the present invention, FIG. 1 is an external perspective view of the workpiece processing apparatus, and FIG. 2A is a description of a workpiece delivery state with the atmosphere side of the workpiece processing apparatus. FIG. 2B is an explanatory diagram of a workpiece delivery state with the processing chamber side of the workpiece processing apparatus, and FIGS. 3 to 11 are explanatory diagrams showing the workpiece transfer processing status of the workpiece processing device in time series.

図において、ワーク処理装置1は、円盤状のワークWを処理するワーク処理部10と、前段のワーク処理から搬送されたワークWが導入されるワーク導入部20と、後段のワーク処理等に向けて搬送するワーク排出部30とを備えている。   In the figure, a workpiece processing apparatus 1 is directed to a workpiece processing unit 10 that processes a disk-shaped workpiece W, a workpiece introduction unit 20 into which a workpiece W transported from a previous workpiece processing is introduced, a subsequent workpiece processing, and the like. And a workpiece discharge unit 30 that conveys the workpiece.

ワーク処理部10は、ドラム状(円筒状)に形成された石英製のチャンバー11と、このチャンバー11の外周に設けられてワークWを乾燥処理するためのベーク炉12と、ワークWを離間状態で上下に多重支持する支持部材としての一対複数組のセラミック製のロット13と、ロット13の下端を支持する支持台14とを備えている。   The workpiece processing unit 10 includes a quartz chamber 11 formed in a drum shape (cylindrical shape), a baking furnace 12 provided on the outer periphery of the chamber 11 for drying the workpiece W, and the workpiece W in a separated state. A pair of a plurality of ceramic lots 13 as support members that are supported in multiple directions in the vertical direction, and a support base 14 that supports the lower ends of the lots 13 are provided.

ロット13の下端と支持台14とは、図3に示すように、ワーク処理装置1を支持する架台2の機械室3に配置されている。   As shown in FIG. 3, the lower end of the lot 13 and the support base 14 are arranged in the machine room 3 of the gantry 2 that supports the work processing apparatus 1.

尚、一対複数組のロット13は、ワークWを支持するように内方に向けて突出されたリブにより複数のワーク支持部15(図3参照)が形成されている。また、一対複数組のロット13は、例えば、一対の一方は昇降可能且つワークWの中心(支持中心)に対して退避可能となっており、一対の他方はワークWの中心(支持中心)に対して退避可能となっている。   Note that in the pair 13 of a plurality of lots 13, a plurality of workpiece support portions 15 (see FIG. 3) are formed by ribs protruding inward so as to support the workpiece W. In addition, for example, one pair of the lots 13 can be moved up and down and can be retracted with respect to the center (support center) of the workpiece W, and the other pair is at the center (support center) of the workpiece W. On the other hand, it can be evacuated.

これにより、例えば、ワークWを一段上昇させる場合、支持台14は、
(1)他方のロット13を中心から退避させてワーク支持部15によるワーク支持状態を一旦解除する。
(2)ワーク支持状態を維持している一方のロット13をワーク支持部15の一段分だけ上昇する。
(3)他方のロット13を中心に向けて再接近させてワーク支持部15によるワーク支持状態を復帰する。
(4)一方のロット13を中心から退避させてワーク支持部15によるワーク支持状態を一旦解除する。
(5)ワーク支持状態を解除した一方のロット13を元の位置に下降する。
(6)一方のロット13を中心に向けて再接近させてワーク支持部15によるワーク支持状態を復帰する(一対のロット13の支持が復帰)。
の順で順次ワークWを上段へと移送することができる。
Thereby, for example, when raising the work W one step, the support base 14 is
(1) The other lot 13 is withdrawn from the center and the workpiece support state by the workpiece support portion 15 is once released.
(2) The one lot 13 maintaining the workpiece support state is raised by one stage of the workpiece support portion 15.
(3) The other lot 13 is re-approached toward the center to return the workpiece support state by the workpiece support portion 15.
(4) One lot 13 is withdrawn from the center and the workpiece support state by the workpiece support unit 15 is once released.
(5) Lower one lot 13 whose work support state has been released to its original position.
(6) One lot 13 is moved again toward the center to return the workpiece support state by the workpiece support portion 15 (support of the pair of lots 13 is restored).
The workpiece W can be sequentially transferred to the upper stage in this order.

尚、ロット13の対を解除して複数設けると共にワーク支持部15を複数の全体として仮想の螺旋溝状となるように構成すると共に、ワークWを保持したままそのワークWが自重により回転しないようにロット13をワークWの周囲(ワークWを中心)で全体的にスイング回転(1回転)する支持台14とすることにより、仮想の螺旋溝状のワーク支持部15にワークが案内されて上方へと変位するように構成するなど、ワークWの上昇(又は下降)は上記に限定されるものではない。   A plurality of pairs of lots 13 are released and a plurality of workpiece support portions 15 are formed in a virtual spiral groove shape as a whole, and the workpiece W is not rotated by its own weight while holding the workpiece W. In addition, the lot 13 is used as a support base 14 that rotates as a whole (one rotation) around the workpiece W (centering around the workpiece W), so that the workpiece is guided to the virtual spiral groove-shaped workpiece support portion 15 and moved upward. The raising (or lowering) of the workpiece W is not limited to the above, for example, it is configured so as to be displaced to the right.

ワーク導入部20は、セラミック製のボトムチャンバー21と、このボトムチャンバー21へとワークWを取り入れるための導入口22と、導入口22を開閉するシャッタ部材23と、導入口22からボトムチャンバー21の内部へと取り入れたワークWをロット13の最下段のワーク支持部15に支持させるワーク移送用のアーム24と、このアーム24でのワークWの支持の際に導入口22から取り入れたワークWを浮上状態で保持する浮上装置25とを備えている。   The workpiece introduction unit 20 includes a ceramic bottom chamber 21, an introduction port 22 for taking the workpiece W into the bottom chamber 21, a shutter member 23 that opens and closes the introduction port 22, and the introduction chamber 22 to the bottom chamber 21. A workpiece transfer arm 24 that supports the workpiece W taken inside by the lowermost workpiece support portion 15 of the lot 13, and the workpiece W taken from the introduction port 22 when the workpiece W is supported by the arm 24. And a levitation device 25 that holds the levitation state.

ワーク排出部30は、セラミック製のトップチャンバー31と、このトップチャンバー31から取り出したワークWを排出するための排出口32と、排出口32を開閉するシャッタ部材33と、ロット13の最上段のワーク支持部15から排出口32へとワークWを取り出すためのアーム34と、このアーム34でのワークWの支持後に排出口32からワークWを排出する際に浮上状態で保持する浮上装置35とを備えている。   The workpiece discharge unit 30 includes a ceramic top chamber 31, a discharge port 32 for discharging the workpiece W taken out from the top chamber 31, a shutter member 33 for opening and closing the discharge port 32, and the uppermost stage of the lot 13. An arm 34 for taking out the workpiece W from the workpiece support 15 to the discharge port 32, and a levitation device 35 that holds the workpiece W in a floating state when the workpiece W is discharged from the discharge port 32 after the arm 34 supports the workpiece W. It has.

上記の構成において、ワーク製造工程の搬送方向上流側より搬送されてきたワークWは、シャッタ部材23によって開放状態とされた導入口22から取り入れ(図3参照)、浮上装置25による浮上状態でボトムチャンバー21内で停止させ(図4参照)た後、アーム24によりロット13の最下段のワーク支持部15に支持させる(図5参照)。   In the above configuration, the workpiece W conveyed from the upstream side in the conveying direction of the workpiece manufacturing process is taken in from the inlet 22 opened by the shutter member 23 (see FIG. 3), and is bottomed in the floating state by the floating device 25. After stopping in the chamber 21 (see FIG. 4), the arm 24 supports the work support 15 at the lowermost stage of the lot 13 (see FIG. 5).

そして、上記(1)〜(6)に示したロット13の制御によって、最下段のワーク支持部15に支持されたワークWを次段(上段)のワーク支持部15に移送しつつ次のワークWをチャンバー21へと取り入れた後(図6参照)、アーム24によりロット13の最下段のワーク支持部15に支持させる(図7参照)。   Then, under the control of the lot 13 shown in the above (1) to (6), the workpiece W supported by the lowermost workpiece support 15 is transferred to the next workpiece (upper) workpiece support 15 while the next workpiece is transferred. After taking W into the chamber 21 (see FIG. 6), the arm 24 supports the work support 15 at the lowermost stage of the lot 13 (see FIG. 7).

以下、順次ワークWの取り入れと上段移送とを繰り返しつつベーク炉12の発熱によりワークWを乾燥させ(図8参照)、ロット13の最上段のワーク支持部15にワークWが達したらば、アーム34によりワークWをトップチャンバー31へと取り出して浮上装置35による浮上状態でトップチャンバー31内で停止させ(図9参照)た後、シャッタ部材33によって開放状態とされた排出口32から取り出し(図10参照)、再びシャッタ部材23によって開放状態とされた導入口22からワークWを取り入れる(図11参照)。   Thereafter, the work W is dried by the heat generated in the baking furnace 12 while sequentially taking the work W and transferring the upper stage (see FIG. 8), and when the work W reaches the uppermost work support portion 15 of the lot 13, the arm 34 Then, the workpiece W is taken out into the top chamber 31 and stopped in the top chamber 31 in the floating state by the floating device 35 (see FIG. 9), and then taken out from the discharge port 32 opened by the shutter member 33 (see FIG. 10). The workpiece W is taken in from the inlet 22 that is opened again by the shutter member 23 (see FIG. 11).

尚、上記実施の形態では、ワークWをワーク処理部10の下方から取り入れて上方から排出する例を示したが、逆でも良い。   In the above-described embodiment, the example in which the workpiece W is taken in from the lower side of the workpiece processing unit 10 and discharged from the upper side is shown.

このように、本発明のワーク処理装置1にあっては、支持部材としての一対複数組のセラミック製のロット13に上下方向に多段にワークWを支持すると共に、上下方向の移送と同時期に乾燥処理を行うことにより、ワーク搬送方向と直交する上下方向に広く且つ搬送方向を含む平面内の装置スペースの省スペース化に貢献したものでありながら、多数のワークWを同時期に支持し且つ(乾燥)処理を行うことができる。   Thus, in the workpiece processing apparatus 1 of the present invention, the workpieces W are supported in multiple stages in the vertical direction on a pair of ceramic lots 13 as support members, and at the same time as the vertical transfer. By performing the drying process, while supporting a large number of workpieces W at the same time while contributing to space saving of the apparatus space in a plane that is wide in the vertical direction perpendicular to the workpiece conveyance direction and includes the conveyance direction, and (Dry) treatment can be performed.

本発明の一実施形態に係るワーク処理装置の外観斜視図である。1 is an external perspective view of a work processing apparatus according to an embodiment of the present invention. 本発明の一実施形態に係るワーク処理装置を示し、(A)はワーク処理装置の大気側とのワーク受け渡し状態の説明図、(B)はワーク処理装置の処理室側とのワーク受け渡し状態の説明図である。1 shows a workpiece processing apparatus according to an embodiment of the present invention, in which (A) is an explanatory diagram of a workpiece delivery state with the atmosphere side of the workpiece processing device, and (B) is a workpiece delivery state with a processing chamber side of the workpiece processing device. It is explanatory drawing. 本発明の一実施形態に係るワーク処理装置の時系列の断面図である。It is sectional drawing of the time series of the workpiece | work processing apparatus which concerns on one Embodiment of this invention. 本発明の一実施形態に係るワーク処理装置の時系列の断面図である。It is sectional drawing of the time series of the workpiece | work processing apparatus which concerns on one Embodiment of this invention. 本発明の一実施形態に係るワーク処理装置の時系列の断面図である。It is sectional drawing of the time series of the workpiece | work processing apparatus which concerns on one Embodiment of this invention. 本発明の一実施形態に係るワーク処理装置の時系列の断面図である。It is sectional drawing of the time series of the workpiece | work processing apparatus which concerns on one Embodiment of this invention. 本発明の一実施形態に係るワーク処理装置の時系列の断面図である。It is sectional drawing of the time series of the workpiece | work processing apparatus which concerns on one Embodiment of this invention. 本発明の一実施形態に係るワーク処理装置の時系列の断面図である。It is sectional drawing of the time series of the workpiece | work processing apparatus which concerns on one Embodiment of this invention. 本発明の一実施形態に係るワーク処理装置の時系列の断面図である。It is sectional drawing of the time series of the workpiece | work processing apparatus which concerns on one Embodiment of this invention. 本発明の一実施形態に係るワーク処理装置の時系列の断面図である。It is sectional drawing of the time series of the workpiece | work processing apparatus which concerns on one Embodiment of this invention. 本発明の一実施形態に係るワーク処理装置の時系列の断面図である。It is sectional drawing of the time series of the workpiece | work processing apparatus which concerns on one Embodiment of this invention.

符号の説明Explanation of symbols

1…ワーク処理装置
10…ワーク処理部
13…ロット(支持部材)
20…ワーク導入部
22…導入口
23…シャッタ部材
30…ワーク排出部
32…排出口
33…シャッタ部材
DESCRIPTION OF SYMBOLS 1 ... Work processing apparatus 10 ... Work processing part 13 ... Lot (support member)
DESCRIPTION OF SYMBOLS 20 ... Work introduction part 22 ... Introduction port 23 ... Shutter member 30 ... Work discharge part 32 ... Discharge port 33 ... Shutter member

Claims (2)

ワークを離間状態で上下に多重支持する支持部材を内装し且つその多重支持状態でワーク処理を行うワーク処理部と、該ワーク処理部の上方又は下方に接続されたワーク導入部と、前記ワーク処理部の下方又は上方に接続されたワーク排出部とを備え、
前記ワーク導入部及び前記ワーク排出部に設けられた導入口又は排出口と前記ワーク処理部に設けられた前記ワーク導入部及び前記ワーク排出部との各連通口との少なくとも何れか一方には大気側との連通状態を遮断するシャッタ部材が設け、
前記支持部材は、一対複数組の棒状に構成され且つ内方に向けて突出する複数の段状支持突起を備え、各一対の一方は一段分の範囲で上下方向に昇降可能となっており、各一対の他方は一方の支持部材がワークを支持したまま昇降している際にはワーク被支持状態とするように退避可能となっていることを特徴とするワーク処理装置。
A work processing unit that includes a support member that supports multiple workpieces in the vertical direction in a separated state and performs workpiece processing in the multiple support state, a workpiece introduction unit that is connected above or below the workpiece processing unit, and the workpiece processing A work discharge part connected to the lower part or upper part of the part,
At least one of the introduction port or discharge port provided in the work introduction unit and the work discharge unit and the communication port between the work introduction unit and the work discharge unit provided in the work processing unit is air. A shutter member for blocking communication with the side is provided;
The support member includes a plurality of stepped support protrusions configured in a pair of bar shapes and projecting inward, and one of each pair can be moved up and down in a range of one step. The workpiece processing apparatus is characterized in that each of the other pair is retractable so as to be in a workpiece supported state when the one supporting member is lifted and lowered while supporting the workpiece.
前記支持部材は、螺旋状に分割されたワーク支持部を備えていると共にワークの中心を基準にスイング回転することによってワークを上段又は下段へと移送することを特徴とする請求項1に記載のワーク処理装置。   The said support member is provided with the workpiece | work support part divided | segmented helically, and transfers a workpiece | work to an upper stage or a lower stage by swinging rotation on the basis of the center of a workpiece | work. Work processing device.
JP2007135981A 2007-05-22 2007-05-22 Work processing device Expired - Fee Related JP5291300B2 (en)

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JP2007135981A JP5291300B2 (en) 2007-05-22 2007-05-22 Work processing device
PCT/JP2008/059248 WO2008143260A1 (en) 2007-05-22 2008-05-20 Work processing device

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Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63241928A (en) * 1987-03-30 1988-10-07 Hitachi Ltd Vertical heating apparatus
JPH11204535A (en) * 1998-01-16 1999-07-30 Matsushita Electric Ind Co Ltd Heat treatment method for semiconductor substrate and device therefor

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