JP5290367B2 - 電子制御装置 - Google Patents
電子制御装置 Download PDFInfo
- Publication number
- JP5290367B2 JP5290367B2 JP2011170829A JP2011170829A JP5290367B2 JP 5290367 B2 JP5290367 B2 JP 5290367B2 JP 2011170829 A JP2011170829 A JP 2011170829A JP 2011170829 A JP2011170829 A JP 2011170829A JP 5290367 B2 JP5290367 B2 JP 5290367B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- case
- electronic component
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 27
- 230000002265 prevention Effects 0.000 claims description 10
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 4
- 238000006073 displacement reaction Methods 0.000 abstract description 31
- 239000000758 substrate Substances 0.000 abstract description 22
- 230000017525 heat dissipation Effects 0.000 description 20
- 239000000463 material Substances 0.000 description 10
- 230000005540 biological transmission Effects 0.000 description 8
- 238000003780 insertion Methods 0.000 description 8
- 230000037431 insertion Effects 0.000 description 8
- 230000005855 radiation Effects 0.000 description 7
- 230000020169 heat generation Effects 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- 230000001629 suppression Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000029058 respiratory gaseous exchange Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Images
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011170829A JP5290367B2 (ja) | 2011-08-04 | 2011-08-04 | 電子制御装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011170829A JP5290367B2 (ja) | 2011-08-04 | 2011-08-04 | 電子制御装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008222827A Division JP4801126B2 (ja) | 2008-08-29 | 2008-08-29 | 電子制御装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013118662A Division JP5617011B2 (ja) | 2013-06-05 | 2013-06-05 | 電子制御装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011228749A JP2011228749A (ja) | 2011-11-10 |
| JP2011228749A5 JP2011228749A5 (enrdf_load_stackoverflow) | 2012-01-05 |
| JP5290367B2 true JP5290367B2 (ja) | 2013-09-18 |
Family
ID=45043644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011170829A Expired - Fee Related JP5290367B2 (ja) | 2011-08-04 | 2011-08-04 | 電子制御装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5290367B2 (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6366413B2 (ja) * | 2014-08-06 | 2018-08-01 | アルパイン株式会社 | 電子回路ユニット |
| JP2023172194A (ja) * | 2022-05-23 | 2023-12-06 | 日立Astemo株式会社 | 電力変換装置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11204958A (ja) * | 1998-01-07 | 1999-07-30 | Canon Inc | 電源装置及び該電源装置を用いた記録装置 |
| JP3922626B2 (ja) * | 2002-03-04 | 2007-05-30 | 株式会社日立製作所 | 箱形制御ユニット |
| JP4122862B2 (ja) * | 2002-06-24 | 2008-07-23 | 株式会社デンソー | 電子装置の放熱構造 |
-
2011
- 2011-08-04 JP JP2011170829A patent/JP5290367B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011228749A (ja) | 2011-11-10 |
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