JP5273062B2 - LED soldering jig - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a soldering jig capable of mounting an LED element on a board while the LED element is floated by a lead terminal. <P>SOLUTION: A first plate 11 provided with an opening exposing a solder surface of a board 10 includes: an LED holder 50 holding an LED element 54; and a locking member supporting the LED holder 50 so that a lead terminal 54a of the held element 54 is positioned just above a through hole 10c of the board 10. A second plate 12 is provided with a pressing member 60 pressing the LED holder 50. The locking member 52 of the plate 11 supports the LED holder 50 with a shaft capable of being extended and retracted freely. When the second plate 12 is placed over the first plate 11, the pressing member 60 presses the LED holder 50 to sink the shaft of the locking member, and the lead terminal 54a projects from the board 10 through the through hole 10c. A length of a sunk lead terminal 54a is set according to a size of the pressing member 60, and soldering is performed while the LED element 54 is floated and the opening of the plate 11 is faced upward. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a soldering jig used for soldering a retrofitting component to a circuit board.

  In a flow type or reflow type automatic machine, parts that are difficult to solder are soldered as manual parts or soldering robots.

  In such manual work or soldering by a soldering robot, there is usually a soldering point on the surface opposite to the component surface on which the component is mounted. For this reason, it is necessary to invert the circuit board by inserting the lead terminals of the retrofitted components into the through holes on the component surface of the circuit board, and soldering is performed with the soldering surface of the board facing upward.

However, when the board on which the component is mounted is reversed, the mounted component falls off or rises from the board. Therefore, it is necessary to hold the parts.
As a method for solving this problem, for example, a digging jig as shown in FIG. 11 is used.
As shown in FIG. 11, this digging type jig is formed with a digging 1 having a shape matched to a circuit board, and a recess 2 is formed in the digging 1 according to the mounting position of the component 6. Then, after putting the component 6 in the recess 2 with the lead terminal facing upward, as shown in FIG. 12, the circuit board 3 is placed (inserted) into the digging 1 with the component side facing downward. ), Soldering work.

  However, this method is effective when the number of components 6 to be mounted is small and the number of lead terminals of the components 6 to be mounted is small. However, when the number of components 6 to be mounted is large or the number of lead terminals of the components 6 to be mounted is large, there arises a problem that the lead terminals of the components 6 cannot be successfully inserted into the through holes of the circuit board 3. Furthermore, there is a problem that a gap is generated between the circuit board 3 and the component 6 because the variation of the component 6 and the shape of the component are different.

  As one method for solving these problems, for example, it is conceivable to use pins of a surface mounting jig device shown in Patent Document 1 of FIG.

  This surface mounting jig device is provided with a piston pin 4 biased by a spring on a jig substrate 5, and the jig substrate 5 provided with the pin 4 is mounted on a circuit board 3 on which surface mounting components are temporarily placed. It is made to cover. In this way, when the surface-mounted component is pressed and held against the circuit board 3 and placed in a high-temperature steam atmosphere, the surface-mounted component is converted into a circuit by the condensate of high-temperature steam cooled by the low-temperature circuit board 3. This is to prevent the substrate 3 from floating.

Japanese Utility Model Publication No. 64-369

By the way, for example, when an LED for display is attached to a substrate in an electronic device or the like, there are many cases where it is desired to attach the LED in a state where it is floated from the substrate using the lead terminals of the LED.
However, in the method using the above pins, when the lead terminals are extended from the substrate and attached at an arbitrary height, there is a problem that the piston pins cannot be pressed and held.

  Accordingly, an object of the present invention is to allow the LED element to be attached to the substrate in a state where it is floated by the lead terminal.

In order to solve the above problems, the present invention includes a first plate provided with an opening for exposing a soldering surface of a mounted circuit board, and a second plate that covers the first plate,
The first plate has an LED holder for holding an LED element having a lead terminal, and a latch for supporting the LED holder so that the lead terminal of the held LED element is positioned directly above the through hole of the substrate. A locking member that supports the LED holder with a retractable shaft that is urged into an advanced state by an elastic member, and a pressing member that presses the LED holder is attached to the second plate. It is possible to adopt the configuration as described.

By adopting such a configuration, the circuit board is mounted on the first plate with the soldering surface facing down, and the LED element is mounted on the LED holder supported on the mounted board. At this time, since the LED holder for mounting the LED element is supported on the through hole of the substrate by the shaft biased to the advanced state by the elastic member, the mounting can be easily performed. Thus, when the second plate is put on the first plate on which the LED element is mounted, the pressing member of the second plate presses the LED holder of the first plate, so that the LED holder is locked. The axis of the means is sunk, and the lead terminal of the LED element held by the holder is projected from the solder surface of the substrate through the through hole.
Thus, since the lead terminal of the LED element can be inserted into the through hole of the substrate, the efficiency of the soldering operation can be improved.
At this time, the length of the lead terminal of the LED element protruding on the substrate is determined by setting the length of the lead terminal immersed in the substrate by the dimension of the pressing member, and the length of the LED element floating is determined.
When the plate is inverted in this state and the opening is directed upward, the soldering surface of the substrate faces from the opening, so that the soldering operation can be performed. At this time, the LED element mounted on the substrate is fixed so as not to fall by the pressing member, so that the soldering operation can be performed stably and reliably without trouble.

  At this time, the structure which the said LED holder shall hold | maintain the LED element for every one is employable.

  By adopting such a configuration, if the number of LED holders is increased or decreased according to the number of LED elements attached, it is possible to cope with substrates having different circuit patterns.

  Moreover, the structure which has arrange | positioned the said press member for every LED holder and presses for every LED holder is employable.

By adopting such a configuration, for example, if the thickness (height) of the pressing member is changed for each LED holder, the height of the LED element can be changed for each LED holder.
Therefore, if a pressing member is prepared for each part, the dimensional error of the element can be absorbed.

  Further, at this time, it is possible to employ a configuration in which the LED element is formed in the vicinity of one root of the lead terminal and the shape of the LED holder is matched to the protruding portion.

  By adopting such a configuration, the shape of the LED holder is matched to the lead terminal of the LED element. Therefore, when the lead terminal of the LED element is mounted in the reverse direction, the shape of the LED holder and the lead terminal of the LED does not match. Since the LED element cannot be mounted, mounting errors can be prevented.

  Since the present invention is configured as described above, the LED element is attached in a state of floating from the substrate.

Perspective view of an embodiment The perspective view of the principal part of embodiment Perspective view of an embodiment Action explanatory diagram of the embodiment Sectional drawing of the principal part of embodiment Cross-sectional view of the embodiment Perspective view of an embodiment (A) Perspective view of LED holder, (b) Cross section of LED holder (A) Action explanatory diagram of the embodiment, (b) Action explanatory diagram of the embodiment Action explanatory drawing of Example 1 Action explanatory diagram of conventional example Action explanatory diagram of conventional example Action explanatory diagram of conventional example

Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.
As shown in FIG. 1, the soldering jig of this embodiment includes a first plate 11 on which the circuit board 10 is mounted and a second plate 12 that covers the circuit board 10. The two plates 11 and 12 are attached to one end with a hinge 13 so as to be freely opened and closed. In addition, an engaging member 14a for stopping the first and second plates 11 and 12 is provided at the other end, and the second plate 12 pushes against the circuit board 10 and the component 15 on the circuit board 10 as will be described later. Pressure can be applied.

That is, the first plate 11 is provided with an opening 16 in the center of the plate 11 so as to expose the soldering surface of the mounted circuit board 10.
In this embodiment, a plurality of protrusions 17 are provided from the periphery of the opening 16 toward the inside. The protrusion 17 is provided with a positioning pin that fits into a hole for mounting the circuit board 10 at the tip.
Further, the opening 16 is tapered at the edge portion, and is wide open to the outside for easy operation.

  In this embodiment, in order to position the circuit board 10, the protrusion 17 is provided toward the inside of the opening 16. However, instead of the protrusion 17, for example, the opening 16 is sufficiently smaller than the circuit board 10. If positioning pins are provided around the opening 16, the circuit board 10 can be positioned by the opening 16 itself.

  Further, as shown in FIG. 2, the hinge 13 is attached with a rising 18 at one end in the longitudinal direction of the first plate 11 (right side in FIG. 1). The hinge 13 is biased by a spring, The open state is maintained for safety. A plurality of LED holders 50 are provided before the rise 18.

  The plurality of LED holders 50 are installed on a base (pedestal) 51 as shown in FIG. The base 51 has, for example, a shape in which a long plate-like engagement piece is passed between the standing walls on both sides and screwed, and a locking member 52 is attached to the base 51.

  As shown in FIG. 5 to be described later, the locking member 52 is of a cylinder type attached so as to project the shaft 53 from the base 51, and the shaft 53 is biased to the advanced state by an elastic member such as a spring. It has become free to appear and disappear. An LED holder 50 is detachably attached to the shaft 53 with, for example, a C ring.

The LED holder 50 is formed in a Z shape as shown in FIG. 8A. As shown in FIG. 8B, the through hole 50b is provided in the upper horizontal portion 50a to The shaft 53 is inserted. A groove 55 for mounting the LED element 54 is provided at the tip of the lower horizontal portion 50c.
The groove 55 includes an upper first groove 55a and a lower second groove 55b. When the body of the LED element 54 is attached to the first groove 55a as shown in FIG. 54 lead terminals 54a are fitted in the second grooves 55b.
Further, as shown in FIG. 8A, one of the second grooves 55b is opened, and after the soldering operation is finished, the substrate 10 is slid to place the LED element 54 in the first of the holder 50. The groove 55a and the second groove 55b can be opened.
Then, by providing a notch 50d on one of the side walls forming the second groove 55b and aligning it with the protruding portion 54b of the lead terminal 54a of the LED element 54, as shown in FIG. It is designed so that it can cope with the case where the installation direction is regulated.
Furthermore, as shown in FIG. 8A, the other side wall is cut 55c diagonally, so that when the mounting mistake is made, the LED element 54 slides on the side wall cut 55c as shown in FIG. 9B. Can not be held.

When the LED holder 50 is attached to the locking member 52, the held lead terminal of the LED element 54 is held immediately above the through hole 10 c of the substrate 10.
At this time, the number of LED holders 50 attached to the locking member 52 can be increased or decreased according to the number of LED elements 54 attached to the substrate 10.
In this embodiment, the LED holder 50 is provided at one end in the longitudinal direction, but the installation location is not limited to one end in the longitudinal direction. It is appropriately determined according to the pattern of the substrate.
In this embodiment, one LED element 54 is attached to the LED holder 50, but the present invention is not limited to this, and a plurality of LEDs can be attached to one holder 50.

  On the other hand, the engagement member 14 is attached to the other end of the first plate 11 as shown in FIG. The engaging member 14 is composed of a clip 14a provided on the first plate 11 and a hook-like engaging piece 14b provided on the second plate 12 described later. The clip 14a has a spiral spring. It has a prepared structure.

Further, the first plate 11 is provided with a stopper 19 at the end of the opening 16 between the opening 16 and the clip 14a. The stopper 19 is rod-shaped and is used for positioning the end part 15 to be mounted on the circuit board 10.
Further, the first plate 11 is provided with support legs 21 at the four corners. The support leg 21 is made of resin and has a cylindrical shape. As shown in FIG. 1, the support plate 21 is screwed to the back side of the first plate 11 to lift the first plate 11 and lead terminals of components. Does not touch the floor.
In this embodiment, the support leg 21 is made of resin and has a cylindrical shape, but is not limited thereto. For example, any material and shape may be used as long as the first plate 11 can be floated and a space can be formed between the first plate 11 and the pedestal, such as a metal prism.

On the other hand, the second plate 12 is provided with a notch 59 at one end in the longitudinal direction, that is, a portion facing the base 51 to which the LED holder 50 is attached, so that the tip of the LED holder 50 is exposed.
In addition, pressing members 22 a and 22 b and a pressing member 60 are attached to the second plate 12. The holding members 22a and 22b are used for holding the circuit board 10 and the circuit component 15 on the circuit board 10 so as not to be detached. In this embodiment, the holding members 22a and 22b are made of a pin 22a and an elastic material 22b.
The pin 22a is of a cylinder type whose shaft is urged by a spring, and its rear portion projects from the second plate 12. Further, for example, by forming a screw between the inner shaft and the outer outer shell at the protruding rear portion, when the outer shell portion is rotated, the spring expands and contracts and the protruding dimension of the pin 22a is set according to the thickness of the component 15. Can be changed.
On the other hand, the elastic member 22b is formed by forming rubber or elastic sponge into a rectangular parallelepiped or a cube, and is detachably attached to the second plate 12 with an engaging pin.
For this reason, the second plate 12 is provided with a plurality of through holes for attaching the pins 22a and the elastic material 22b, and the plurality of through holes can be selected according to the mounting component 15 and the circuit board 10 ( By the way, in the thing of FIG. 1, holding members 22a and 22b are inserted in all the through holes).

As shown in FIG. 2, the pressing member 60 is made of plastic having a level difference according to the shape of the LED holder 50, and is screwed to the end of the notch 59 of the second plate with the level difference facing down. Yes.
When the pressing member 60 attached in this manner covers the second plate 12 over the first plate 11, the lower horizontal portion 50c in which the first groove 55 of the LED holder 50 is formed is formed as shown in FIG. It comes to press. In this way, the pressing member 60 presses the LED holder 50, so that the LED holder 50 supported by the locking member 52 is sunk and the lead terminal 54a is inserted into the through hole 10c.
Therefore, if the length of the lead terminal 54a submerged in the substrate 10 is set by the dimension of the pressing member 60, the length of the lead terminal of the LED element 54 protruding on the substrate 10 is determined and the LED element 54 is lifted up. Can be decided.

As described above, the second plate 12 has two hinges 13 attached to one end in the longitudinal direction as shown in FIG. 1, and a hook-like locking piece 14b attached to the other end. It is configured to engage with the clip 14a of the first plate 11 described above.
Further, support legs 21 are provided at the four corners of the second plate 12. As shown in FIG. 4, the support leg 21 is provided on the back side of the second plate 12, and supports the inverted jig when soldering, as will be described later.

This configuration is configured as described above, and this soldering jig opens the second plate 12 and lowers the soldering surface of the circuit board 10 to which the component 15 is retrofitted as shown in FIG. And mounted on the first plate 11.
At this time, the end portion of the circuit board 10 is brought into contact with the stopper 19 of the first plate 11 (in preparation for mounting components described later). At the same time, the positioning pin of the projection 17 of the opening 16 is fitted into the mounting hole of the circuit board 10. At that time, in the circuit board 10 having such a size, the mounting hole of the circuit board 10 is often provided at the end portion of the substrate 10. In this case, even different types of circuit boards 10 can be supported.

Thus, the retrofit component 15 is mounted on the circuit board 10 mounted on the first plate 11.
First, the component 15 other than the LED element 54 attached to the board 10 by being lifted from the board 10 by the lead terminal 54 a is mounted on the board 10. When the mounting is completed, the pressing members 22 a and 22 b are attached to the second plate 12.

  That is, the pin 22a is attached to the attachment hole of the second plate 12 in accordance with the position of the component 15 to be attached. At this time, in the case of the large component 15, a plurality of pins 22a may be attached so as to be stably supported. Next, if the pin 22a is difficult to hold down, such as a connector with a complicated shape or an electrolytic capacitor with a unique shape (especially those that are laid down or easily fall over by a flat capacitor), press the elastic material 22b such as a sponge. Attach a member (cube or rectangular parallelepiped). Further, if necessary, pins 22a for supporting the circuit board 10 are attached. In this way, a plurality of parts 15 having different shapes can be operated without changing the workability.

  On the other hand, the LED element 54 that is mounted by being floated by the lead terminal 54a is attached to the LED holder 50 as shown in FIG. At this time, the LED holder 50 is supported on the substrate 10 by the shaft 53 of the locking member 52, and the lead terminal 54 a of the LED element 54 to be held is positioned directly above the through hole 10 c of the substrate 10. . Therefore, since the lead terminal 54a does not have to be inserted into the through hole 10c only by mounting the LED element 54, the attachment is simple.

  Here, the components 15 other than the LED elements are also mounted on the first plate 11, but the present invention is not limited to this. The circuit board 10 on which the component 15 is mounted in advance may be mounted.

  Thus, when the LED element 54 and the parts 15 other than the element 54 can be mounted, the second plate 12 is closed as shown in FIG. Then, the locking piece 14b of the closed second plate 12 is locked by the clip 14a of the first plate 11 and stopped.

  Then, since the pressing member 60 of the second plate 12 presses the LED holder 50 of the first plate 11 as shown in FIG. 4, the shaft of the locking member 52 that locks the pressed LED holder 50. As shown in FIG. 5, the lead terminal 54a of the LED element 54 held by the holder 50 protrudes from the solder surface of the substrate 10 through the through hole 10c.

Then, the entire jig on which the circuit board 10 is mounted is reversed so that the opening 16 of the first plate 11 faces upward as shown in FIG. As shown in FIG. 7, the soldering surface of the circuit board 10 faces the opening 16 that faces upward, and the lead terminal 54 a protrudes from the through hole 10 c. At this time, as shown in FIG. 6, the locking member 52 presses the LED holder 50 and holds it so as not to fall, so that it can be easily soldered. Further, the components 15 other than the LED elements 54 can be soldered because the pins 22a support the mounting components 15 and the circuit board 10 so as not to fall.
Thus, since the LED element 54 mounted on the substrate 10 is fixed by the pressing member so as not to drop, the soldering operation can be performed stably and reliably without trouble. At this time, since the LED element 54 can be held and positioned, it is not necessary to hold the circuit board 10 or the component 15 by hand.
Further, if the LED element 54 is mounted on the LED holder 50 and the second plate 12 is closed, the lead terminal 54a of the LED element 54 can be inserted into the through hole 10c of the substrate 10, so that the mounting to the substrate 10 is easy. it can.

  The inverted jig is supported by the support legs 21 of the second plate 12 as shown in FIG. 6, so that the state can be stably maintained even if the jig is inverted. For example, even if the pin 22a or the locking piece 14b protrudes, the pin 22a and the locking piece 14b can be stably held without rattling, so that the soldering operation can be performed stably, easily and efficiently without any trouble.

  When the soldering is completed, the jig is reversed again, the clip 14a is released, the second plate 12 is opened, and the circuit board 10 is taken out. In this way, the circuit board 10 can be held and released with one touch.

  In this way, since the components 15 are reversed after being mounted, the mounting can be performed well even when the number of components 15 to be mounted is large or the number of leads of the components 15 to be mounted is large. Therefore, soldering can be done without mistakes.

In the first embodiment, as shown in FIG. 10, a cylinder pin 60 is used as a pressing member 60 that presses the LED holder 50, and the cylinder pin 60 is provided for each LED holder 50.
As described above, by providing the pressing member 60 for each LED holder 50, the protruding amount of each cylinder pin 60 can be changed, so that the height when the LED element 54 is mounted can be changed.
Therefore, if the pressing member 60 is set in accordance with each part, the dimensional error of the element 54 can be absorbed.

DESCRIPTION OF SYMBOLS 10 Board | substrate 10c Through hole 11 1st plate 12 2nd plate 14a Clip 16 Opening 50 LED holder 51 Base 52 Locking member 54 LED element 54a Lead terminal 54b Alignment 55 Groove 60 Pressing member

Claims (4)

A first plate provided with an opening that exposes a soldering surface of the mounted circuit board; and a second plate that covers the first plate;
The first plate has an LED holder for holding an LED element having a lead terminal, and a latch for supporting the LED holder so that the lead terminal of the held LED element is positioned directly above the through hole of the substrate. Comprising a member, and the locking member supports the LED holder by a retractable shaft that is urged into an advanced state by an elastic member,
On the other hand, a soldering jig for LED in which a pressing member that presses the LED holder is attached to the second plate.   The LED soldering jig according to claim 1, wherein the LED holder holds LED elements one by one.   The soldering jig for LED according to claim 2, wherein the pressing member is arranged for each LED holder so as to press each LED holder.   4. The LED soldering device according to claim 1, wherein the LED element is formed in the vicinity of one root of a lead terminal, and the shape of the LED holder is matched to the protruding portion. jig.

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