JP5864808B1 - Holding device and holding method - Google Patents

Abstract

The pressing force of a large number of spring-loaded pins must be individually adjusted with each adjustment nut for each board mounting pattern. In a holding device for holding a substrate B on which each component P is mounted, a large number of pressing pins 39 are bundled and dropped in the longitudinal direction to sample the mounting pattern of each component P on the substrate B, and these pressing pins 39 is individually sandwiched between the through holes 34h and 35h and the through hole 36h from two directions substantially perpendicular to the longitudinal direction, and the bundle of the substrate B, each component P, and the presser pin 39 is turned upside down in this state. [Selection] Figure 1

Description

  For example, the present invention can be applied to any board on which various parts having various sizes and shapes are mounted in various patterns, and can stably hold the board and each part and easily solder each part to the board. The present invention relates to a holding device and a holding method.

  It is difficult to work with soldering the lead protruding from the board while passing the lead through the through hole and pressing each component mounted on the board by hand. For this reason, in an actual manufacturing site, a dedicated holding tool is manufactured for each board mounting pattern, and the board and each component are held and soldered using the holding tool.

  However, there are various sizes and shapes of each component, and there are various mounting patterns of each component on the board, so there are a wide variety of combinations of both, and it is labor and effort to produce and handle dedicated holding tools one by one. There is a problem in terms of cost. Therefore, the following prior art discloses a multi-holder type holding device that can repeatedly cope with any mounting pattern on a substrate.

FIG. 9 is a diagram showing a configuration of a conventional holding device. FIGS. 9A and 9B are perspective views of the holding device, and FIG. 9C is a cross-sectional view of the holding device. This conventional holding device is disclosed in Patent Document 1.
In FIG. 9, B is a substrate, P is each component, 111 is a base plate, 112 is a rotation support portion, 113 is a rotation frame, 114 is a pin with a spring, 115 is a lid, 116 is a lock mechanism, and 117 is an adjustment nut. .

Next, the usage method will be described.
First, as shown in FIG. 9A, the substrate B on which each component P is mounted is placed on the rotating frame 113, the lid 115 is closed, and the lid 115 is fixed to the rotating frame 113 by the lock mechanism 116. A large number of spring-loaded pins 114 are arranged in a matrix on the lid 115, and these spring-loaded pins 114 press each component P against the board B in the rotating frame 113.

  Next, with the lid 115 fixed to the rotation frame 113, the rotation frame 113 is rotated 180 degrees in the forward direction α around the axis z1 of the rotation support portion 112, and the surface opposite to the mounting surface of each component P is the upper side. When the rotating frame 113 is fixed upside down so as to become as shown in FIG. Since it is pressed by a large number of pins 114 with springs, each component P is kept mounted without falling from the substrate B even if the substrate B is inverted.

  In this state, the lead of each component P protruding from the substrate B through the through hole is soldered to the substrate B. When the soldering is completed, the rotary frame 113 is rotated 180 degrees in the reverse direction β around the axis z1 of the rotation support portion 112 while the lid 115 is fixed to the rotary frame 113 to return to the original state of FIG. . Finally, the lock mechanism 116 is released, the lid 115 is opened, and the substrate B is taken out from the rotating frame 113.

  Here, as shown in FIG. 9C, the spring-loaded pins 114 are each provided with an adjusting nut 117 for adjusting the spring length. If the spring length of the spring-loaded pin 114 is adjusted according to the height of each component P to be pressed by the adjustment nut 117, each component P is pressed against the substrate B with an appropriate force.

JP-A-8-97551

  Since the conventional holding device is configured as described above, the pressing force of a large number of spring-loaded pins must be individually adjusted with each adjustment nut for each board mounting pattern, which is difficult to work with. There was a problem.

  In other words, in the conventional holding device, since the pressing force of a large number of spring-loaded pins is applied to the board and each component, adjustment nuts are provided on each spring-loaded pin so as not to damage the board and each component due to excessive pressing force. The pressing force is adjusted individually. Considering that the smallest part of all the parts to be mounted on the substrate must be pressed without leaking, the holding device requires a large number of spring-loaded pins. Therefore, the individual adjustment of each adjustment nut is a very troublesome work, and it cannot be said that it is practical to employ in an actual manufacturing site.

  The present invention has been made to solve the above-described problems, and can easily cope with any substrate having a wide variety of mounting patterns, and can be stably performed without applying excessive pressing force to the substrate and each component. It is an object of the present invention to provide a holding device and a holding method that can be held.

  The holding device according to the present invention is a holding device for holding an object to be held. A plurality of press pins are bundled and dropped in the longitudinal direction to sample the shape pattern of the object to be held. And the bundle of the holding object and the presser pin are both turned upside down in this state.

  According to the present invention, it is possible to easily deal with a holding object having a wide variety of shape patterns, and an effect that the holding object can be stably held without applying an excessive pressing force is obtained.

It is a figure which shows the structure of the holding | maintenance apparatus by Embodiment 1 of this invention. It is a figure which shows the structure of the set stand which is a part of holding | maintenance apparatus. It is a figure which shows the structure of the pin holding mechanism which is a part of holding | maintenance apparatus. It is a flowchart which shows each step of the holding | maintenance method by Embodiment 1 of this invention. It is a figure which shows a mode that soldering work progresses according to the flowchart of FIG. 4 (the 1). It is a figure which shows a mode that soldering work progresses according to the flowchart of FIG. 4 (the 2). It is a figure which shows a mode that soldering work progresses according to the flowchart of FIG. 4 (the 3). It is a figure which shows a mode that soldering work progresses according to the flowchart of FIG. 4 (the 4). It is a figure which shows a mode that soldering work progresses according to the flowchart of FIG. 4 (the 5). It is a figure which shows a mode that soldering work progresses according to the flowchart of FIG. 4 (the 6). It is a figure which shows the structure of the holding | maintenance apparatus by Embodiment 2 of this invention. It is a figure which shows the structure of the holding | maintenance apparatus by Embodiment 3 of this invention. It is a figure which shows the structure of the holding | maintenance apparatus by Embodiment 4 of this invention. It is a figure which shows the structure of the conventional holding | maintenance apparatus.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the drawings, the same or corresponding components are denoted by the same or corresponding reference numerals.

Embodiment 1 FIG.
FIG. 1 is a diagram showing a configuration of a holding device according to Embodiment 1 of the present invention, and FIGS. 1A and 1B are a bottom view and a front view of the holding device, respectively. FIG. 2 is a diagram showing a configuration of a set table that is a part of the holding device, and FIGS. 2A and 2B are perspective views of the set table in a separated state and a connected state, respectively. Further, FIG. 3 is a diagram showing a configuration of a pin holding mechanism which is a part of the holding device, and FIGS. 3A and 3B are perspective views as seen from the upper side and the lower side, respectively.

  In FIGS. 1 and 2, 10 is a set stand, 11 is a getter, 12 is four pillars erected at the four corners of the getter 11, and 13 is a large rectangular opening corresponding to the substrate size formed in the center. The aperture plates 14 and 15 are metal rails provided along the long and short sides of the aperture plate 13, respectively, 16 is formed of two set plates, and 17 is formed on the opposite side of each set plate 16. The notches 18 are four thumbscrews for adjusting the positions on the rails 15 at both ends of each set plate 16.

  1 and 3, 30 is a pin holding mechanism, 31 is an acrylic upper plate, 32 and 33 are acrylic side plates provided along the long side and short side of the upper plate 31, and 34 and 35, respectively. Are two parallel acrylic stationary plates, 36 is an acrylic sliding plate sandwiched between the stationary plates 34, 35, and 37 is a cam lever (sliding) for sliding the sliding plate 36 forward / reverse. Means), 38 is a block for the cam lever 37.

  Further, in FIGS. 1 and 3, 39 is a number of lightweight and lightweight presser pins (* 1), 40 is an O-ring (annular elastic member) provided in the same number as the presser pins 39, and 41 is four each. The support column 42 is a push latch (engagement means) that engages with the set base 10, and 43 is a block for the push latch 42.

(* 1) “Presser pin 39”... In the perspective view of FIG. 3A and the like, only a part of the presser pin 39 is shown so as not to obscure the drawing.

  As will be described later with reference to FIG. 5C and the like, a large number of through holes 34h and 35h are formed in the same pattern from the upper surface to the lower surface in the non-moving plates 34 and 35, respectively. Are arranged substantially in parallel so that each through hole 34h and each through hole 35h overlap each other when viewed from above. The slide plate 36 is also formed with a large number of through holes 36h from the upper surface to the lower surface in the same pattern as the through holes 34h and 35h of the stationary plates 34 and 35. In particular, all of the through holes 36h are O-rings. 40 are respectively fitted. A number of pressing pins 39 are inserted into the through-holes 34h and 35h and the O-ring 40 of the through-hole 36h one by one with play in the same direction.

Next, the usage method will be described.
FIG. 4 is a flowchart showing the steps of the holding method according to the first embodiment of the present invention, and FIGS. 5-1 to 5-6 are views showing how the soldering operation proceeds according to the flowchart of FIG. is there.

<Step ST1>
In the perspective view of FIG. 5A, the set plate 10 is assembled by connecting the opening plate 13 on each column 12 of the getter 11, and the interval between the two set plates 16 is held by the thumbscrew 18. To the width of the substrate B. Next, the board B is set between the notches 17 of the set plates 16, and the components P are mounted on the upper surface of the board B. Then, as shown in FIG. 5-2 (b), four struts 41 are fitted to the rail 14, the push latch 42 is engaged with the set base 10, and the board B and each component placed on the set plate 16 The pin holding mechanism 30 is fixed to the set base 10 so as to cover the pin holding mechanism 30 from above P.

  At this time, a cross-sectional view taken along the section line CC is schematically shown in FIG. 5-2 (c) (* 2). That is, one end of a number of presser pins 39 inserted through the through holes 34h, 35h, 36h of the stationary plates 34, 35 and the slide plate 36 with respect to the board B on which the components P are mounted through the leads L through the through holes. It will be in the state arrange | positioned upwards so that it may each face with a clearance gap.

(* 2) FIG. 5-3 (e), FIG. 5-4 (g), FIG. 5-5 (i) and FIG. Similarly to the relationship with 2 (c), the section line CC in FIGS. 5-3 (d), 5-4 (f), 5-5 (h) and 5-6 (j) respectively. It is sectional drawing. However, in each figure other than FIG. 5-2 (b), illustration of the cutting line CC is omitted.

  Here, paying attention to the blowout FB in which the region R in the vicinity of the presser pin 39 is enlarged in FIG. It is locked by a cam lever 37 (not shown). Therefore, all of the presser pins 39 inserted through the through holes 34h and 35h and the O ring 36h of the through hole 36h are pressed against the right inner wall of the through holes 34h and 35h by the O ring 40 in the through hole 36h. It is in a state of being held without falling down.

<Step ST2>
From the state of FIG. 5-2 (b), the cam lever 37 is loosened and the slide plate 36 is slid in the forward direction as shown in FIG. 5-3 (d). At this time, each through hole 36h, which was slightly displaced in FIG. 5-2 (c), is moved to a position where it overlaps with the through holes 34h and 35h together with the O-ring 40 as shown in FIG. 5-3 (e). Slide. As a result, all the presser pins 39 are simultaneously released from the locked state of being pressed against the right inner wall of the through holes 34h and 35h by the O-ring 40, and each inside of the O-ring 40 and the through hole 35h of the through hole 34h and the through hole 36h. The substrate B and the components P are dropped onto the substrate B and each component P as a bundle by its own weight, and the mounting pattern (shape pattern) of the substrate B is sampled.

<Step ST3>
When the mounting pattern of the substrate B is sampled by the presser pins 39, the cam lever 37 is tightened again and the slide plate 36 is slid in the reverse direction as shown in FIG. The state at this time is shown in FIG. Due to the reverse slide of the slide plate 36, the through hole 36h is slightly shifted again from the position of the through holes 34h, 35h to the right in the drawing, so that the O-ring 40 presses the holding pin 39 against the right inner wall of the through holes 34h, 35h. The sampling state by the entire pin 39 is locked. Each presser pin 39 is sandwiched between two directions substantially orthogonal to the longitudinal direction thereof, that is, the right inner wall of the through holes 34h and 35h and the O-ring 40 of the through hole 36h.

<Step ST4>
5-5 (h), the set base 10 and the pin holding mechanism 30 are turned upside down together with the substrate B. At this time, as described above, since the presser pin 39 is locked to the sampling state of the mounting pattern of the substrate B as it is by the slide plate 36, each component P mounted on the substrate B can be reversed even if the substrate B is inverted. It is held by the entire pressing pin 39 in the sampling state and does not fall from the substrate B.

  In particular, the presser pins 39 are held by the slide plate 36 in which the O-rings 40 are respectively fitted in the respective through holes 36h by a force in the right direction on the paper surface substantially perpendicular to the longitudinal direction (center axis) of each presser pin 39 ( (See FIG. 5-5 (i).) Unlike the conventional holding device, no extra pressing force is applied to the substrate B and each component P from each presser pin 39. Therefore, it is possible to stably hold the substrate B and each component P without damaging them.

<Step ST5>
As shown in FIG. 5-6 (j), when the getter 11 and the support column 12 are separated from the set base 10, the substrate B appears from the opening of the opening plate 13, so that the solder S is melted by a soldering iron (not shown). The lead L of each component P is bonded to the substrate B. When the soldering is completed, the push latch 42 is expanded to remove the remaining part of the set base 10, and the substrate B is removed from the pin holding mechanism 30 (see FIG. 5-6 (k)).

<Step ST6>
When the soldering of the substrate B is completed, it is slid by the cam lever 37 (not shown) with the head (other end) of each presser pin 39 facing downward as shown in FIG. The plate 36 is slid in the forward direction to overlap the through holes 34h and 35h and the through hole 36h, respectively, and unlock the sampling state. Then, each presser pin 39 falls, the head hits the upper plate 31, and each presser pin 39 is aligned at the same height. Thereafter, the slide plate 36 is slid in the reverse direction by the cam lever 37 to hold the entire presser pin 39 as shown in FIG.

<Step ST7>
It is determined whether the substrate B that needs to be soldered still remains. If the substrate B still remains, the procedure from step ST1 to step ST6 is repeated. Since the holding device according to the first embodiment is a multi-holder type and can repeatedly sample a wide variety of mounting patterns of the substrate B by a large number of pressing pins 39, it can easily cope with any substrate B any number of times. There is no need to manufacture a dedicated holding tool for each mounting pattern of the substrate B.

  The interval between the presser pins 39 is determined in consideration of the size of the smallest component P among all the components P mounted on the substrate B so that there is no component P leaking from sampling.

  Further, although it is not always necessary to fit the O-ring 40 into each through hole 36 h of the slide plate 36, all the presser pins 36 are evenly placed by using the elasticity of the O-ring 40 by fitting the O-ring 40. It is possible to hold it.

  As described above, according to the first embodiment, a large number of through holes 34h and 35h overlap from the upper surface to the lower surface in the same pattern as the set base 10 for setting the substrate B on which each component P is mounted. A plurality of through holes 36h are formed from the upper surface to the lower surface in the same pattern as the through holes 34h and 35h. One slide plate 36, a number of presser pins 39 inserted through the through holes 34h, 35h, 36h in the same direction with play, and a slide plate in a forward direction substantially orthogonal to the longitudinal direction of the presser pin 39 36 is slid to overlap the through holes 36h with the through holes 34h and 35h, and the slide plate 36 is slid in the opposite direction substantially orthogonal to the longitudinal direction of the presser pin 39 to pass through the through holes 36h. Each of the through holes 36h from 34h, 35h, and a cam lever 37 that slides, and one end of the presser pin 39 is set by the push latch 42 so that the board B and each component P set on the set base 10 face each other. Since the pin holding mechanism 30 is fixed to the board B, the board holding mechanism 30 can be easily applied to any board B having various mounting patterns, and an extra pressing force is applied to the board B and each component P. The effect that it can hold | maintain stably is acquired.

  In addition, according to the first embodiment, the pin holding mechanism 30 includes the O-rings 40 through which the presser pins 39 are inserted with play in the through holes 36h formed in the slide plate 36, respectively. As a result, the effect of being able to hold all the presser pins 36 evenly using the elasticity of the O-ring 40 is obtained.

Embodiment 2.
If the force for holding the presser pin 39 is insufficient compared to the weight of the entire board B on which each component P is mounted, it becomes impossible to hold the board B stably. Therefore, in the second embodiment, a configuration for increasing the holding force with respect to the presser pin 39 will be described.

FIG. 6 is a diagram showing a configuration of a holding device according to Embodiment 2 of the present invention, and only the vicinity of one presser pin 39 is shown in a sectional view.
In FIG. 6A, O-rings 40 are fitted into the through holes 34 h and 35 h of the stationary plates 34 and 35, respectively, instead of the through holes 36 h of the slide plate 36. In FIG. 6B, the O-ring 40 is fitted into the through hole 36h and the through holes 34h and 35h.

  Further, in FIGS. 6C and 6D, two slide plates 36 and 44 are provided between the stationary plates 34 and 35 to apply a pressing force to the presser pin 39 in the same direction or in the opposite direction. O-rings 40 are fitted into the through holes 36h and 44h of the plates 36 and 44, respectively. Further, in FIG. 6 (e), slide plates 36, 44 are respectively provided between the three stationary plates 34, 35, 45, and the O-rings 40 are fitted into the through holes 36h, 44h, respectively.

  In any case of FIG. 6A to FIG. 6E, the contact area between the presser pin 39 and the O-ring 40 increases twice or three times as compared with the first embodiment. The holding force with respect to the presser pin 39 can be further increased. Further, in the case of FIGS. 6C to 6E, O-rings 40 may be provided in the through holes 34h, 35h, and 45h of the stationary plates 34, 35, and 45, respectively, and the holding force is further increased. Can be enhanced.

  The numbers of the stationary plates 34, 35, 45 and the sliding plates 36, 44 are not limited, but increase as appropriate, such as the stationary plates 34, 35, 45,..., The sliding plates 36, 44,. Can be made.

  As described above, according to the second embodiment, the pin holding mechanism 30 includes the through holes 34h, 35h, 45h,... And the slide plates 36, 44,. Since the O-ring 40 is provided in each of the through holes of at least two of the through holes 36h, 44h,..., The holding force for the presser pin 39 is further increased compared to the first embodiment. Thus, even the heavy substrate B and each component P can be stably held.

Embodiment 3 FIG.
In the holding device of the first embodiment, the static plates 34 and 35 and the slide plate 36 made of acrylic and the metal pressing pin 39 repeatedly rub against each other, so that static electricity is likely to be generated. In the third embodiment, countermeasures against static electricity that adversely affects each component P will be described.

FIG. 7 is a diagram showing a configuration of a holding device according to Embodiment 3 of the present invention.
In FIG. 7, 46 is a grounded conductive sheet (conductive member), and 47 is an insulating cap (insulating member) provided at one end of each presser pin 39 on the substrate B side.

  In FIG. 7, a conductive sheet 46 is provided on the inner surface of the upper plate 31 that is in contact with the head of each presser pin 39, and every time the presser pin 39 is reset, it comes into contact with the conductive sheet 46 and discharges static electricity. ing. As a result, each component P can be protected from static electricity.

  In addition, an insulating cap 47 is provided at one end of each presser pin 39 that contacts the substrate B and each component P so that static electricity is not transmitted from each presser pin 39 to the component P. As a result, each component P can be protected from static electricity.

  Although only one of the conductive sheet 46 and the insulating cap 47 is effective as a countermeasure against static electricity, by providing both the conductive sheet 46 and the insulating cap 47 simultaneously, a more reliable countermeasure against static electricity. Can be realized.

  As described above, according to the third embodiment, the pin holding mechanism 30 includes the grounded conductive sheet 46, and each presser pin 39 includes the through holes 34 h and 35 h of the stationary plates 34 and 35 and the slide. When the plate 36 passes through each through hole 36h and falls to the other end side, the other end is brought into contact with the conductive sheet 46. Static electricity is discharged, and the effect of protecting each component P from static electricity can be obtained.

  Further, according to the third embodiment, the pin holding mechanism 30 is provided with the insulating cap 47 at one end of each presser pin 39, so that static electricity is not transmitted from each presser pin 39 to the component P. Thus, the effect that each component P can be protected from static electricity can be obtained.

Embodiment 4 FIG.
Since the pin holding mechanism 30 shown in the first embodiment can cope with a substrate B that is so large that it cannot be covered by itself, it is possible to prepare a plurality of pin holding mechanisms 30 and multiplex them.

  FIG. 8 is a view showing a configuration of a holding device according to Embodiment 4 of the present invention, and FIGS. 8A and 8B are a bottom view and a front view of the holding device, respectively. In FIG. 8B, only one pin holding mechanism 30 is shown and the rest is omitted.

  In FIG. 8, 48 is a positioning pin provided on the upper plate 31 of the pin holding mechanism 30, 50 is a fixing base for fixing the plurality of pin holding mechanisms 30, 51 is an upper plate of the fixing base 50, and 52 is an upper plate. Reference numeral 51 denotes a handle, 53 denotes a screw hole of the upper plate 51, and 54 denotes a thumbscrew for fixing the positioning pin 48 to the screw hole 53.

  8, 70 is a set base, 71 is a rail, 72 and 73 are set plates, 74 is an opening plate, 75 and 76 are blocks, 77 is a clamp pin, 78 is a thumb screw, 79 is a mag catch, 80 Is a plate for the mag catch 79, 81 is a guide plate, 82 is a block for the mag catch 79, 83 is a support, 84 is a positioning pin, 85 is getter, 86 is an ST nut, and 87 is for preventing the substrate B from being bent. This is an anti-bending pin.

  In the fourth embodiment, as shown in FIG. 8 (a), six pin holding mechanisms 30 are prepared to hold the pin holding mechanism 30 in order to cope with a substrate B having a size that cannot be covered by the pin holding mechanism 30 alone. 6 pins are held so that the outermost rows 32L and 33S of the presser pins 39 close to the side plates 32 and 33 not provided with the cam lever 37 are close to each other so that the lower surface of the stationary plate 35 of the mechanism 30 is substantially in the same plane. The mechanisms 30 are fixed to the fixed base 50, respectively. By doing in this way, it becomes possible to multiplex the pin holding mechanism 30 with a 2 × 3 configuration.

  Since the cam lever 37 is provided on any one of the side plates 32 and 33 of the pin holding mechanism 30, a multi-unit configuration with a 2 × N configuration (where N is a natural number) is used, but instead of the cam lever 37, Depending on the configuration of other slide means for sliding the slide plate 36, it is possible to make an M × N configuration (where M and N are natural numbers, respectively).

  When the pin holding mechanism 30 is fixed to the fixing base 50, the positioning pin 48 provided on the upper plate 31 of the pin holding mechanism 30 is fitted into the screw hole 53 of the fixing base 50 so as to be opposite to the screw hole 53. Are fixed by a thumbscrew 54.

  Further, when the size of the board B is increased or the mounting weight of the component P is increased, the board B set on the set plates 72 and 73 of the set base 70 may be bent. Since the bending of the substrate B adversely affects sampling and soldering, in order to prevent this, in FIG. 8A and FIG. The anti-bending pins 87 are erected at various places, and the substrate B is supported by the anti-bending pins 87. By doing in this way, the bending of the board | substrate B is prevented and the bad influence on sampling and soldering can be suppressed.

  The bend prevention pin 87 may be erected on the getter 11 of the set base 10 shown in the first embodiment, and the same effect can be obtained. Further, as the bending prevention pin 87, a holding device shown in the present specification can be used.

  As described above, according to the fourth embodiment, six pin holding mechanisms 30 are provided, and the outermost presser pins 39 are arranged so that the lower surfaces of the stationary plates 35 of these pin holding mechanisms 30 are substantially flush with each other. Since the pin holding mechanism 30 is fixed to the fixing base 50 by the positioning pin 48, the screw hole 53, and the thumb screw 54 so that the rows 32L and 33S are close to each other, the pin holding mechanism 30 alone cannot be covered. The effect that it can respond also to the board | substrate B of a big size is acquired.

  Further, according to the fourth embodiment, the set stand 70 is provided with the plurality of deflection preventing pins 87 for supporting the substrate B from below on the surface of the getter 85 on the substrate B side. Therefore, it is possible to prevent the substrate B from being bent and to suppress an adverse effect on sampling and soldering.

  As described above, in Embodiments 1 to 4, the description has been made as a “substrate holding device” in which the substrate B and each component P are held objects, but the present invention is not limited to this. By appropriately changing the structure of the set bases 10 and 70, various articles other than the substrate B and each component P can be easily and stably held. At this time, in the case where the weight and size of the article are considerable and the holding force or sampling range is insufficient, the holding force enhancement configuration shown in the third embodiment or the holding device shown in the fourth embodiment is used. It is possible to cope with this by implementing multiple processing.

  In the first to fourth embodiments, the description has been made using the O-ring 40, but the present invention is not limited to this, and can be implemented as long as it is an annular elastic member. Instead of providing the annular elastic member, the material of the slide plates 36 and 44 may be constituted by an elastic member, and the same effect can be obtained.

  10 set base, 11 getter, 12 strut, 13 aperture plate, 14, 15 rail, 16 set plate, 17 notch, 18 thumbscrew, 30 pin holding mechanism, 31 upper plate, 32, 33 side plate, 32L, 33S presser pin 34, 35 fixed plate, 36 slide plate, 34h, 35h, 36h through hole, 37 cam lever (slide means), 38 block, 39 presser pin, 40 O-ring (annular elastic member), 41 strut, 42 Push latch (engagement means), 43 block, 44 slide plate, 44h through hole, 45 immovable plate, 45h through hole, 46 conductive sheet (conductive member), 47 insulating cap (insulating member), 48 positioning Pin, 50 Fixed base, 51 Top plate, 52 Handle, 53 Screw hole, 54 Thumb screw, 70 Set base, 71 72, 73 Set plate, 74 Opening plate, 75, 76 block, 77 Clamp pin, 78 Thumb screw, 79 Mag catch, 80 plate, 81 Guide plate, 82 block, 83 Post, 84 Positioning pin, 85 Getter, 86 ST nut, 87 Deflection prevention pin, B board, P component, L lead, S solder.

Claims (6)

A set stand for setting a holding object;
At least two substantially parallel immovable plates formed so that a large number of through holes overlap each other from the upper surface to the lower surface in the same pattern, and sandwiched between these immovable plates, the upper surface in the same pattern as each through hole of the immobile plate At least one slide plate in which a large number of through-holes are respectively formed from the bottom surface to the bottom surface, a number of presser pins inserted through the through-holes of the stationary plate and the through-holes of the slide plate with play, and the above The slide plate is slid in the forward direction substantially orthogonal to the longitudinal direction of the presser pin, and the through holes of the slide plate are overlaid on the through holes of the stationary plate, respectively, and the reverse is substantially orthogonal to the longitudinal direction of the presser pin. Slide means for sliding the slide plate in the direction to displace each through hole of the slide plate from each through hole of the stationary plate, and one end of the presser pin is And a pin holding mechanism is immobilized in the feeder tray to face the set table to the set of the holding object, respectively,
The pin holding mechanism includes an annular elastic member into which each presser pin is inserted with play in all the through holes formed in at least one of the stationary plate and the slide plate. holding apparatus according to claim Rukoto respectively provided. The pin holding mechanism includes a grounded conductive member,
Each presser pin and passes through the through holes of the through-hole and the slide plate immobile plate falling respectively to the other end side, claim 1, characterized in that respectively contact with the conductive member at the other end serial mounting of the holding device. The holding device according to claim 1 , wherein the pin holding mechanism includes an insulating member at one end of each presser pin. It has two or more pin holding mechanisms,
The pin holding mechanisms are respectively fixed so that the outermost rows of presser pins are close to each other so that the lower surfaces of the stationary plates on the holding object side of these pin holding mechanisms are substantially in the same plane. The holding device according to any one of claims 1 to 3 . The holding device according to any one of claims 1 to 4 , wherein the set table includes at least one bending prevention pin for supporting the holding object from below. Setting a holding object on a set base;
A plurality of through holes formed in the same pattern so as to overlap each other from the upper surface to the lower surface in at least two substantially parallel stationary plates, and at least one slide plate sandwiched between the stationary plates, One end of a number of presser pins inserted with play into a plurality of through holes respectively formed from the top surface to the bottom surface in the same pattern as each through hole, the holding object set on the set base Fixing to the set table so that the objects face each other,
Sliding the slide plate in a forward direction substantially orthogonal to the longitudinal direction of the presser pin and overlapping each through hole of the slide plate on each through hole of the stationary plate;
Sliding the slide plate in a reverse direction substantially perpendicular to the longitudinal direction of the presser pin to slide each through hole of the slide plate from each through hole of the stationary plate;
A step of reversing the fixed object to be held and the presser pins together ,
All of the through hole formed in at least one one plate of said stationary plate and the slide plate, that the annular elastic member each said pressing pin is inserted with play is not provided, respectively A holding method characterized by the above.

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