JP2013207290A - Electronic apparatus - Google Patents

Electronic apparatus Download PDF

Info

Publication number
JP2013207290A
JP2013207290A JP2012078424A JP2012078424A JP2013207290A JP 2013207290 A JP2013207290 A JP 2013207290A JP 2012078424 A JP2012078424 A JP 2012078424A JP 2012078424 A JP2012078424 A JP 2012078424A JP 2013207290 A JP2013207290 A JP 2013207290A
Authority
JP
Japan
Prior art keywords
circuit board
support seat
cover
flange
case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012078424A
Other languages
Japanese (ja)
Other versions
JP5963501B2 (en
Inventor
Katsuhiro Namikii
勝博 波木井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Keihin Corp
Original Assignee
Keihin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Keihin Corp filed Critical Keihin Corp
Priority to JP2012078424A priority Critical patent/JP5963501B2/en
Publication of JP2013207290A publication Critical patent/JP2013207290A/en
Application granted granted Critical
Publication of JP5963501B2 publication Critical patent/JP5963501B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide an electronic apparatus enabling highly precise attachment of a circuit board to a case body.SOLUTION: In an electronic apparatus, a case body 30 includes a flange 33 supporting a bottom face of a circuit board 10, a flange peripheral wall 35 extending upward from the flange, protrusions 37 and 38 protruding from the flange peripheral wall 35 and restricting a position of a side face of a circuit board 10 supported by a flange part 33, and a recess 39 formed between roots of the bottoms 37 and 38 and the flange 33.

Description

本発明は、電子機器、特に、電子部品が実装された回路基板をケース内に収容してカバーで覆った電子機器に関する。   The present invention relates to an electronic device, and more particularly to an electronic device in which a circuit board on which an electronic component is mounted is accommodated in a case and covered with a cover.

電子部品が実装された回路基板と、回路基板を収容するケース本体と、ケース本体の開口を覆うカバーとからなる電子機器が知られている。   2. Description of the Related Art There is known an electronic apparatus including a circuit board on which electronic components are mounted, a case main body that accommodates the circuit board, and a cover that covers an opening of the case main body.

例えば、特許文献1には、導電材料で形成されたカバーを、プリント基板(回路基板)の四隅に形成された貫通穴を挿通させたねじによって、ケース(ケース本体)に固定した電子制御装置(電子機器)が記載されている。   For example, Patent Document 1 discloses an electronic control device in which a cover formed of a conductive material is fixed to a case (case body) with screws through which through holes formed at four corners of a printed circuit board (circuit board) are inserted. Electronic equipment).

特開平8−148842号公報JP-A-8-148842

しかしながら、上記特許文献1の構造では、プリント基板はケースの四隅の棚部上に載置され、ケースの側周壁によって位置決めされるが、プリント基板の側面とケースの側周壁との間には隙間がある。そのため、プリント基板の貫通穴とねじ穴とに位置ずれが生じることがあり、プリント基板とカバーとをケースにねじで固定する際、作業性が悪い。   However, in the structure of Patent Document 1, the printed circuit board is placed on the shelf at the four corners of the case and positioned by the side peripheral wall of the case, but there is a gap between the side surface of the printed circuit board and the side peripheral wall of the case. There is. For this reason, positional displacement may occur between the through hole and the screw hole of the printed board, and workability is poor when the printed board and the cover are fixed to the case with screws.

本発明は、以上の点に鑑み、ケース本体に回路基板を高精度に位置決めすることが可能電子機器を提供することを目的とする。   In view of the above points, an object of the present invention is to provide an electronic device capable of positioning a circuit board on a case body with high accuracy.

本発明は、電子部品及びコネクタを実装した回路基板と、前記回路基板を収納するケース本体と、前記ケース本体の開口を覆うカバーとを有する電子機器であって、前記ケース本体は、前記回路基板の底面を支持する基板支持座と、前記基板支持座から前記カバー側に向って伸びる支持座側壁と、前記支持座側壁から突出し、前記基板支持座に支持された前記回路基板の側面の位置を規制する凸部と、前記凸部の根元と前記基板支持座との間に形成された凹部とを備えることを特徴とする。   The present invention is an electronic apparatus having a circuit board on which electronic components and connectors are mounted, a case main body that houses the circuit board, and a cover that covers an opening of the case main body, and the case main body includes the circuit board A substrate support seat that supports the bottom surface of the circuit board, a support seat side wall that extends from the substrate support seat toward the cover, and a side surface position of the circuit board that protrudes from the support seat side wall and is supported by the substrate support seat. It is characterized by comprising a convex part to be regulated and a concave part formed between the base of the convex part and the substrate support seat.

本発明によれば、基板支持座に支持された回路基板は、その側面が支持座側壁から突出した凸部によって位置決めされる。そのため、従来のように、基板ケースの側壁の内周面全体で回路基板を位置決めする場合と比較して、凸部の内側面だけを高精度に位置出しするだけで、回路基板を高精度に位置決めすることができる。   According to the present invention, the circuit board supported by the board support seat is positioned by the convex portion whose side surface protrudes from the side wall of the support seat. Therefore, compared with the conventional case where the circuit board is positioned on the entire inner peripheral surface of the side wall of the board case, the circuit board can be made with high accuracy by positioning only the inner surface of the convex portion with high accuracy. Can be positioned.

さらに、凸部の根元には凹部が形成されているので、ケース本体を鍛造や鋳造で成形して、凸部の根元にバリなどの不要な部分が形成され、丸みを帯びた場合であっても、この丸みと回路基板とが干渉することはない。よって、基板支持座に浮き上りなく回路基板を支持することが可能となる。   Furthermore, since the concave portion is formed at the base of the convex portion, the case body is formed by forging or casting, and unnecessary portions such as burrs are formed at the base of the convex portion, which is rounded. However, this roundness and the circuit board do not interfere with each other. Therefore, it becomes possible to support the circuit board without floating on the board support seat.

本発明において、前記ケース本体には、前記コネクタを配置するために、前記基板支持座及び前記支持座側壁に切欠きが形成され、前記凸部は、前記切欠きの両側に形成されていることが好ましい。   In the present invention, the case body is provided with notches in the board support seat and the support seat side wall in order to arrange the connector, and the convex portions are formed on both sides of the notch. Is preferred.

この場合、切欠きの両側に凸部が形成されているので、回路基板の位置決め機能とともに、凸部を補強リブとしても機能させることで、ケース本体を補強することが可能になる。   In this case, since the convex portions are formed on both sides of the notch, it is possible to reinforce the case body by causing the convex portions to function as reinforcing ribs as well as the function of positioning the circuit board.

また、本発明において、前記カバーは前記凸部の上方に配置され、前記凸部の頭頂面は、前記基板支持座の上面と平行であることが好ましい。   Moreover, in this invention, it is preferable that the said cover is arrange | positioned above the said convex part, and the top surface of the said convex part is parallel to the upper surface of the said board | substrate support seat.

この場合、下向きの外力が作用してカバーが下向きに撓むように変形しても、凸部の頭頂面にカバーが接触し、カバーの変形が抑制される。そのため、回路基板の上面に電子部品が実装される場合であっても、カバーが接触して電子部品が破損などするおそれを確実に防止することができる。   In this case, even if the cover is deformed so as to bend downward due to a downward external force, the cover comes into contact with the top surface of the convex portion, and deformation of the cover is suppressed. Therefore, even when the electronic component is mounted on the upper surface of the circuit board, it is possible to reliably prevent the electronic component from being damaged due to the contact of the cover.

また、本発明において、前記凸部は、前記頭頂面から前記凹部の間に、前記基板支持座側壁側から前記回路基板側に向って傾斜するテーパ面を備えることが好ましい。   In the present invention, it is preferable that the convex portion includes a tapered surface inclined from the top surface to the circuit board side from the side wall side of the substrate support seat between the top surface and the concave portion.

この場合、凸部がテーパ面を備えるので、凸部に引っ掛ることなく、回路基板を滑らかに基板支持座に載置することができる。   In this case, since the convex portion has a tapered surface, the circuit board can be smoothly placed on the substrate support seat without being caught by the convex portion.

本発明の実施形態に係る電子機器を示す斜視図。1 is a perspective view showing an electronic apparatus according to an embodiment of the present invention. ケース本体を示し、(a)は上面図、(b)は斜視図。A case main body is shown, (a) is a top view, (b) is a perspective view. リブ付近の拡大斜視図。The expansion perspective view near a rib. 図1のIV−IV線断面図であり、(a)は外力が存在しない状態、(b)は外力がカバーに作用した状態をそれぞれ示す。4A and 4B are cross-sectional views taken along the line IV-IV in FIG. 1, in which FIG. 1A shows a state where no external force is present, and FIG.

本発明の実施形態に係る電子機器について図面を参照して説明する。図1に示すように、本実施形態に係る電子機器100は、例えば電子制御装置(ECU)であり、回路基板10(図2参照)を内部に収容する筐体である収容ケース20を備えている。収容ケース20は、ケース本体30と、ケース本体30の開口部を覆うカバー40とから構成されている。そして、ケース本体30に位置決めされて支持された回路基板10が、ねじ50によってカバー40と共締めされてケース本体30に固定されている。   An electronic apparatus according to an embodiment of the present invention will be described with reference to the drawings. As shown in FIG. 1, an electronic device 100 according to the present embodiment is an electronic control unit (ECU), for example, and includes a housing case 20 that is a housing that houses a circuit board 10 (see FIG. 2). Yes. The housing case 20 includes a case body 30 and a cover 40 that covers the opening of the case body 30. The circuit board 10 positioned and supported by the case body 30 is fastened together with the cover 40 by screws 50 and fixed to the case body 30.

なお、本実施形態の説明においては、便宜上、ケース本体30に収容された回路基板10の表裏面に沿う方向を水平方向とし、回路基板10の表裏面に直交する方向を上下方向として説明する。しかし、電子機器100が実際に取り付けられる姿勢は、設置箇所に応じて変化する。   In the description of the present embodiment, for the sake of convenience, the direction along the front and back surfaces of the circuit board 10 accommodated in the case main body 30 will be described as the horizontal direction, and the direction orthogonal to the front and back surfaces of the circuit board 10 will be described as the vertical direction. However, the posture in which electronic device 100 is actually attached varies depending on the installation location.

回路基板10には、コネクタ11の他に図示しない電子部品が実装されると共に配線パターンが形成されている。電子部品としては、例えばICチップ、トランジスタ、ダイオード、コンデンサが挙げられる。なお、電子部品は、回路基板10の表面、裏面、又は表面及び裏面に実装されている。そして、回路基板10には、四隅に貫通穴が形成されている(図2(a)参照)。   In addition to the connector 11, electronic components (not shown) are mounted on the circuit board 10 and a wiring pattern is formed. Examples of the electronic component include an IC chip, a transistor, a diode, and a capacitor. The electronic component is mounted on the front surface, the back surface, or the front and back surfaces of the circuit board 10. The circuit board 10 has through holes at four corners (see FIG. 2A).

ケース本体30及びカバー40は、アルミニウム、銅、ステンレス鋼、鉄などの高い熱伝導性を有する金属を、プレス加工、切削加工、溶接加工、ダイカスティングなど適宜な加工方法を用いることによって形成されている。ケース本体30はダイカスティングによって、カバー40は板金をプレス加工することによってそれぞれ形成されることが好ましい。   The case main body 30 and the cover 40 are formed by using a metal having high thermal conductivity, such as aluminum, copper, stainless steel, and iron, by using an appropriate processing method such as pressing, cutting, welding, or die casting. Yes. The case body 30 is preferably formed by die casting, and the cover 40 is formed by pressing a sheet metal.

図2(a)及び図2(b)に示すように、ケース本体30は、平面視略四角形状(矩形状)の底壁31と、底壁31の各周縁部から上方(カバー40に向かう側の方向)にそれぞれ延出する側壁32とを備え、全体として上方が開放された略直方体の箱状となっている。ただし、ケース本体30の一の側壁32には、コネクタ11に対応する部分に切欠が形成されている。これにより、電子機器100からコネクタ11が露出し、コネクタ11と図示しない外部のハーネスとが接続可能となっている。   As shown in FIGS. 2A and 2B, the case main body 30 has a substantially rectangular (rectangular) bottom wall 31 in plan view, and upwards (from the peripheral edge of the bottom wall 31 toward the cover 40). Side wall 32 extending in the direction of the side), and has a substantially rectangular parallelepiped box shape with the upper part opened as a whole. However, a cutout is formed in the side wall 32 of the case body 30 at a portion corresponding to the connector 11. Thereby, the connector 11 is exposed from the electronic device 100, and the connector 11 and an external harness (not shown) can be connected.

各側壁32の上部に亘って水平なフランジ部33が形成されており、このフランジ部33の上面が回路基板10を載置して支持するための基板支持面となっている。フランジ部33は、本発明の基板支持座に相当する。そして、フランジ部33の四隅には、回路基板10の貫通穴にそれぞれ対応するねじ穴34が形成されている。   A horizontal flange portion 33 is formed over the upper portion of each side wall 32, and the upper surface of the flange portion 33 serves as a substrate support surface for placing and supporting the circuit board 10. The flange portion 33 corresponds to the substrate support seat of the present invention. Screw holes 34 corresponding to the through holes of the circuit board 10 are formed at the four corners of the flange portion 33.

さらに、フランジ部33の外周端から上方にフランジ周壁35が立ち上がっている。フランジ周壁35の内側面は、平面視でカバー40の外側面と略同一形状となるように形成されており、カバー40はフランジ周壁35によって位置決めされる。フランジ周壁35は本発明の支持座側壁に相当する。ケース本体30の一方の長辺側のフランジ部33及びフランジ周壁35にも、回路基板10のコネクタ11に対応する部分に、切欠きが形成されている。   Further, a flange peripheral wall 35 rises upward from the outer peripheral end of the flange portion 33. The inner surface of the flange peripheral wall 35 is formed to have substantially the same shape as the outer surface of the cover 40 in plan view, and the cover 40 is positioned by the flange peripheral wall 35. The flange peripheral wall 35 corresponds to the support seat side wall of the present invention. A notch is also formed in the flange portion 33 and the flange peripheral wall 35 on one long side of the case body 30 at a portion corresponding to the connector 11 of the circuit board 10.

ケース本体30は、電子機器100を他の図示しない装置にボルトなどで取り付けるために、貫通穴が形成された膨出部36を有している。   The case main body 30 has a bulging portion 36 in which a through hole is formed in order to attach the electronic device 100 to another device (not shown) with a bolt or the like.

そして、ケース本体30のフランジ周壁35には、内方に向って突出し、フランジ部33から上方に向って延びる凸部37がケース本体30と一体に形成されている。凸部37は、その内側面37a(図3及び図4(a)参照)が回路基板10の側面と当接して、フランジ部33に支持された回路基板10の位置決めを行う機能を有する。ここでは、凸部37は、ケース本体30の切欠きが形成されていない長辺側のフランジ周壁35に2個、ケース本体30の両短辺側のフランジ周壁35にそれぞれ1個、合計4個形成されている。   A convex portion 37 that protrudes inward and extends upward from the flange portion 33 is formed integrally with the case main body 30 on the flange peripheral wall 35 of the case main body 30. The convex portion 37 has a function of positioning the circuit board 10 supported by the flange portion 33 with its inner side surface 37a (see FIGS. 3 and 4A) contacting the side surface of the circuit board 10. Here, two convex portions 37 are provided on the flange peripheral wall 35 on the long side where the notch of the case main body 30 is not formed, and one on each of the flange peripheral walls 35 on both short sides of the case main body 30, for a total of four. Is formed.

さらに、ケース本体30の切欠きの両側端部のフランジ周壁35にはそれぞれ、内方に向って突出し、フランジ部33から上方に向って延びる凸部38がケース本体30と一体に形成されている。凸部38も、その内側面が回路基板10の側面と当接して、フランジ部33に支持された回路基板10の位置決めを行う機能を有する。   Further, the flange peripheral walls 35 at both end portions of the cutout of the case body 30 are each formed integrally with the case body 30 so as to protrude inward and extend upward from the flange portion 33. . The convex portion 38 also has a function of positioning the circuit board 10 supported by the flange portion 33 with the inner side surface thereof coming into contact with the side surface of the circuit board 10.

また、図3に示すように、凸部37の根元とフランジ部33との間に凹部39が形成されている。   In addition, as shown in FIG. 3, a recess 39 is formed between the root of the protrusion 37 and the flange portion 33.

そして、凸部37は、頭頂面37bから凹部39の間に、フランジ部33側から回路基板10側(内方)側に向って傾斜するテーパ面37cを有している。ここでは、頭頂面37bの内方側が面取りされてテーパ面37cとなっている。また、凸部37の頭頂面37bは、フランジ部33の上面と平行、即ち水平になっている。   And the convex part 37 has the taper surface 37c which inclines toward the circuit board 10 side (inward) side from the flange part 33 side between the top surface 37b and the recessed part 39. FIG. Here, the inner side of the top surface 37b is chamfered to form a tapered surface 37c. Further, the top surface 37 b of the convex portion 37 is parallel to the upper surface of the flange portion 33, that is, is horizontal.

なお、詳細は図示しないが、凸部38も、凸部37と同様に、凹部が形成され、テーパ面を有し、頭頂面が水平になっている。   Although not shown in detail, the convex portion 38 is also formed with a concave portion, has a tapered surface, and the top surface is horizontal, like the convex portion 37.

図1に示すように、カバー40は、平面視略四角形状(矩形状)であり、その四隅が窪んでフランジ部41となっており、各フランジ部41にそれぞれ1個の貫通穴42が形成されている。これら貫通穴42はケース本体30のねじ穴34に対応している。カバー40の四隅が窪んでおり、この窪んだフランジ部41にねじ50のねじ頭部51が位置するので、カバー40の上面からねじ頭部51が突出しない。   As shown in FIG. 1, the cover 40 has a substantially quadrangular shape (rectangular shape) in plan view, and the four corners are recessed to form flange portions 41, and one through hole 42 is formed in each flange portion 41. Has been. These through holes 42 correspond to the screw holes 34 of the case body 30. Since the four corners of the cover 40 are recessed, and the screw head 51 of the screw 50 is positioned in the recessed flange portion 41, the screw head 51 does not protrude from the upper surface of the cover 40.

以下、電子機器100の組み立て方法について説明する。   Hereinafter, a method for assembling the electronic device 100 will be described.

まず、回路基板10をケース本体30に仮支持する。具体的には、回路基板10をケース本体30の開口側から下降させて、フランジ部33の上面に載置する。このとき、回路基板10は、その側面が凸部37の内側面37a及び凸部38の内側面に当接されて位置決めされる。   First, the circuit board 10 is temporarily supported on the case body 30. Specifically, the circuit board 10 is lowered from the opening side of the case body 30 and placed on the upper surface of the flange portion 33. At this time, the side surface of the circuit board 10 is positioned in contact with the inner side surface 37 a of the convex portion 37 and the inner side surface of the convex portion 38.

次に、カバー40をケース本体30に仮支持する。具体的には、ケース本体30に仮支持された回路基板10の上にカバー40を載置する。このとき、カバー40は、ケース本体30のフランジ周壁35によって位置決めされる。   Next, the cover 40 is temporarily supported on the case body 30. Specifically, the cover 40 is placed on the circuit board 10 temporarily supported by the case body 30. At this time, the cover 40 is positioned by the flange peripheral wall 35 of the case body 30.

次に、ねじ50を、回路基板10の貫通穴とカバー40の貫通穴42とを挿通させて、ケース本体30のねじ穴34にそれぞれ螺合させる。これにより、回路基板10及びカバー40がケース本体30に固定され、電子機器100の組み立てが完了する。   Next, the screw 50 is inserted through the through hole of the circuit board 10 and the through hole 42 of the cover 40 and screwed into the screw hole 34 of the case body 30. Thereby, the circuit board 10 and the cover 40 are fixed to the case main body 30, and the assembly of the electronic device 100 is completed.

以上のように、回路基板10は、その側面が凸部37の内側面37a及び凸部38の内側面に当接されて位置決めされる。そのため、従来のように、フランジ周壁35の内周面全体で回路基板10を位置決めする場合と比較して、凸部37,38の内側面だけを高精度に位置出しするだけで、回路基板10を高精度に位置決めすることが可能となる。   As described above, the side surface of the circuit board 10 is positioned in contact with the inner side surface 37 a of the convex portion 37 and the inner side surface of the convex portion 38. Therefore, as compared with the conventional case where the circuit board 10 is positioned on the entire inner peripheral surface of the flange peripheral wall 35, the circuit board 10 can be obtained by positioning only the inner surfaces of the convex portions 37 and 38 with high accuracy. Can be positioned with high accuracy.

そして、凸部37,38にはテーパ面37cが形成されているので、凸部37,38に引っ掛ることなく、回路基板10を滑らかにフランジ部33に載置することができる。よって、回路基板10のケース本体30のフランジ部33への載置、位置決め工程の作業性が向上する。   Since the convex portions 37 and 38 are formed with the tapered surface 37c, the circuit board 10 can be smoothly placed on the flange portion 33 without being caught by the convex portions 37 and 38. Therefore, the workability of placing and positioning the circuit board 10 on the flange portion 33 of the case main body 30 is improved.

また、回路基板10が高精度に位置決めされてフランジ部33に載置されるので、回路基板10の各貫通穴と、これら貫通穴に対応するねじ穴34との位置合わせが確実に行われる。よって、ねじ50をねじ穴34に螺合させる際に、ねじ50が回路基板10の貫通穴を確実に挿通させることができ、ねじ締め工程の作業性も向上する。   Further, since the circuit board 10 is positioned with high accuracy and placed on the flange portion 33, the alignment of each through hole of the circuit board 10 and the screw hole 34 corresponding to these through holes is reliably performed. Therefore, when the screw 50 is screwed into the screw hole 34, the screw 50 can be surely inserted through the through hole of the circuit board 10, and the workability of the screw tightening process is improved.

さらに、図3に示すように、凸部37の根元とフランジ部33との間に凹部39が形成されている。これにより、ケース本体30を鍛造や鋳造で成形して、凸部37の根元にバリなどの不要な部分が形成され、丸みを帯びた場合であっても、この丸みと回路基板10とが干渉することはない。よって、フランジ部33からの浮き上りなく回路基板10を支持することができる。   Further, as shown in FIG. 3, a concave portion 39 is formed between the root of the convex portion 37 and the flange portion 33. As a result, the case body 30 is formed by forging or casting, and an unnecessary portion such as a burr is formed at the base of the convex portion 37. Even when the round portion is rounded, the roundness and the circuit board 10 interfere with each other. Never do. Therefore, the circuit board 10 can be supported without lifting from the flange portion 33.

なお、凸部37,38は、リブとしても機能し、ケース本体30を補強することが可能となる。   The convex portions 37 and 38 also function as ribs, and the case main body 30 can be reinforced.

ところで、図4(a)に示すように、カバー40は凸部37,38の上方に隙間を隔てて配置されている。そのため、下向きの外力が作用してカバー40が変形すると、回路基板10の上面に電子部品12が実装されていた場合、この電子部品12とカバー40が接触し、電子部品12が破損するおそれがある。   By the way, as shown in FIG. 4A, the cover 40 is disposed above the convex portions 37 and 38 with a gap therebetween. Therefore, when the cover 40 is deformed by a downward external force, if the electronic component 12 is mounted on the upper surface of the circuit board 10, the electronic component 12 and the cover 40 may come into contact with each other and the electronic component 12 may be damaged. is there.

しかし、凸部37,38の頭頂面37bは水平であるので、外力が作用してカバー40が変形しても、凸部37の頭頂面37bにカバー40が接触し、カバー40の変形が抑制される。そのため、回路基板10の上面に実装された電子部品12にカバー40が接触することを確実に防止することができる。   However, since the top surface 37b of the convex portions 37 and 38 is horizontal, even if an external force is applied and the cover 40 is deformed, the cover 40 comes into contact with the top surface 37b of the convex portion 37 and the deformation of the cover 40 is suppressed. Is done. Therefore, it is possible to reliably prevent the cover 40 from coming into contact with the electronic component 12 mounted on the upper surface of the circuit board 10.

以上、本発明の実施形態について図面を参照して説明したが、本発明はこれに限定されない。例えば、本発明の基板支持座及び支持座側壁にそれぞれ相当するフランジ部33及びフランジ周壁35を、コネクタ11用の切欠きを除いて、全周に亘って形成される場合について説明した。しかし、本発明の基板支持座及び支持座側壁は、必ずしも全周に亘って形成する必要はなく、部分的に又は断続的に形成してもよい。   As mentioned above, although embodiment of this invention was described with reference to drawings, this invention is not limited to this. For example, the case where the flange portion 33 and the flange peripheral wall 35 corresponding to the substrate support seat and the support seat side wall of the present invention are formed over the entire circumference excluding the notch for the connector 11 has been described. However, the substrate support seat and the support seat side wall of the present invention are not necessarily formed over the entire circumference, and may be formed partially or intermittently.

また、回路基板10の4つの全側面をそれぞれ凸部37,38で位置決めする場合について説明した。しかし、回路基板10の4側面の内、一部の側面のみを凸部37,38で位置決めしてもよい。   Further, the case where the four all side surfaces of the circuit board 10 are positioned by the convex portions 37 and 38 has been described. However, only some of the four side surfaces of the circuit board 10 may be positioned by the convex portions 37 and 38.

10…回路基板、 11…コネクタ、 12…電子部品、 20…収容ケース、 30…ケース本体、 31…底壁、 32…側壁、 33…フランジ部、 34…ねじ穴、 35…フランジ周壁、 37,38…凸部、 37a…内側面、 37b…頭頂面、 37c…テーパ面、 39…凹部、 40…カバー、 41…フランジ部、 42…貫通穴、 50…ねじ、 100…電子機器。   DESCRIPTION OF SYMBOLS 10 ... Circuit board 11 ... Connector 12 ... Electronic component 20 ... Housing case 30 ... Case main body 31 ... Bottom wall 32 ... Side wall 33 ... Flange part 34 ... Screw hole 35 ... Flange peripheral wall 37 38 ... convex portion, 37a ... inner surface, 37b ... top surface, 37c ... tapered surface, 39 ... concave portion, 40 ... cover, 41 ... flange portion, 42 ... through hole, 50 ... screw, 100 ... electronic device.

Claims (4)

電子部品及びコネクタを実装した回路基板と、前記回路基板を収納するケース本体と、前記ケース本体の開口を覆うカバーとを有する電子機器であって、
前記ケース本体は、
前記回路基板の底面を支持する基板支持座と、
前記基板支持座から前記カバー側に向って伸びる支持座側壁と、
前記支持座側壁から突出し、前記基板支持座に支持された前記回路基板の側面の位置を規制する凸部と、
前記凸部の根元と前記基板支持座との間に形成された凹部とを備えることを特徴とする電子機器。
An electronic device having a circuit board on which an electronic component and a connector are mounted, a case main body that houses the circuit board, and a cover that covers an opening of the case main body,
The case body is
A board support seat for supporting the bottom surface of the circuit board;
A support seat side wall extending from the substrate support seat toward the cover;
A protrusion that protrudes from the side wall of the support seat and regulates the position of the side surface of the circuit board supported by the substrate support seat;
An electronic apparatus comprising: a concave portion formed between a base of the convex portion and the substrate support seat.
前記ケース本体には、前記コネクタを配置するために、前記基板支持座及び前記支持座側壁に切欠きが形成され、前記凸部は、前記切欠きの両側に形成されていることを特徴とする請求項1に記載の電子機器。   The case body has a notch formed in the substrate support seat and the support seat side wall in order to arrange the connector, and the convex portions are formed on both sides of the notch. The electronic device according to claim 1. 前記カバーは前記凸部の上方に配置され、前記凸部の頭頂面は、前記基板支持座の上面と平行であることを特徴とする請求項1又は2に記載の電子機器。   The electronic device according to claim 1, wherein the cover is disposed above the convex portion, and a top surface of the convex portion is parallel to an upper surface of the substrate support seat. 前記凸部は、前記頭頂面から前記凹部の間に、前記支持座側壁側から前記回路基板側に向って傾斜するテーパ面を備えることを特徴とする請求項3に記載の電子機器。   The electronic device according to claim 3, wherein the convex portion includes a tapered surface that is inclined from the top surface to the circuit board side between the top surface and the concave portion.
JP2012078424A 2012-03-29 2012-03-29 Electronics Expired - Fee Related JP5963501B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012078424A JP5963501B2 (en) 2012-03-29 2012-03-29 Electronics

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012078424A JP5963501B2 (en) 2012-03-29 2012-03-29 Electronics

Publications (2)

Publication Number Publication Date
JP2013207290A true JP2013207290A (en) 2013-10-07
JP5963501B2 JP5963501B2 (en) 2016-08-03

Family

ID=49526033

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012078424A Expired - Fee Related JP5963501B2 (en) 2012-03-29 2012-03-29 Electronics

Country Status (1)

Country Link
JP (1) JP5963501B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015151445A1 (en) * 2014-04-04 2015-10-08 富士電機株式会社 Electric motor device
JP2016039205A (en) * 2014-08-06 2016-03-22 アルパイン株式会社 Electronic circuit unit

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0244388U (en) * 1988-09-21 1990-03-27
JP2002118381A (en) * 2000-10-06 2002-04-19 Keihin Corp Substrate housing case
JP2002118369A (en) * 2000-10-06 2002-04-19 Keihin Corp Substrate housing case

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0244388U (en) * 1988-09-21 1990-03-27
JP2002118381A (en) * 2000-10-06 2002-04-19 Keihin Corp Substrate housing case
JP2002118369A (en) * 2000-10-06 2002-04-19 Keihin Corp Substrate housing case

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015151445A1 (en) * 2014-04-04 2015-10-08 富士電機株式会社 Electric motor device
JPWO2015151445A1 (en) * 2014-04-04 2017-04-13 富士電機株式会社 Electric motor device
JP2016039205A (en) * 2014-08-06 2016-03-22 アルパイン株式会社 Electronic circuit unit

Also Published As

Publication number Publication date
JP5963501B2 (en) 2016-08-03

Similar Documents

Publication Publication Date Title
JP4437958B2 (en) Electrical junction box
JP5995113B2 (en) Electrical junction box
JP6501116B2 (en) Electrical connection box
JP2010087044A (en) Electronic apparatus
US20170150619A1 (en) Electronic circuit unit
JP2017130252A (en) Battery housing structure for electronic equipment
JP6597804B2 (en) Power storage module
JP5963501B2 (en) Electronics
JP6855985B2 (en) Electronic unit
JP2010086071A (en) Electronic apparatus
JP2014239105A (en) Mounting structure between power supply circuit board and chassis
JP6021481B2 (en) Fixing structure between fuse holder and fuse cover
JP5169690B2 (en) Circuit module
JP2011147265A (en) Electrical junction box
JP4947392B2 (en) Electronic device and cooling fan fixing method
JP2013115338A (en) Fitting structure for diode
JP2011066148A (en) Storage case with board
JP4869419B2 (en) Electronics
JP2013207289A (en) Electronic apparatus
JP6230799B2 (en) Control device
JP7366676B2 (en) Electronics
KR20120081645A (en) Mounting structur for pcb
JP2009043436A (en) Connector device
JP2022096958A (en) Semiconductor device
JP5627784B2 (en) Electronic component holding structure and electronic device using the same

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20150204

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20151118

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20151124

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160121

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20160621

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20160628

R150 Certificate of patent or registration of utility model

Ref document number: 5963501

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

S111 Request for change of ownership or part of ownership

Free format text: JAPANESE INTERMEDIATE CODE: R313111

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees