JP5266359B2 - ピクセル、ピクセル配列及びピクセル配列を含む画像センサー - Google Patents
ピクセル、ピクセル配列及びピクセル配列を含む画像センサー Download PDFInfo
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- JP5266359B2 JP5266359B2 JP2011103318A JP2011103318A JP5266359B2 JP 5266359 B2 JP5266359 B2 JP 5266359B2 JP 2011103318 A JP2011103318 A JP 2011103318A JP 2011103318 A JP2011103318 A JP 2011103318A JP 5266359 B2 JP5266359 B2 JP 5266359B2
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- 239000003990 capacitor Substances 0.000 claims description 97
- 238000006243 chemical reaction Methods 0.000 claims description 30
- 238000012546 transfer Methods 0.000 claims description 20
- 230000005540 biological transmission Effects 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 7
- 238000009792 diffusion process Methods 0.000 claims description 3
- 230000035945 sensitivity Effects 0.000 description 11
- 238000010586 diagram Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/50—Control of the SSIS exposure
- H04N25/57—Control of the dynamic range
- H04N25/59—Control of the dynamic range by controlling the amount of charge storable in the pixel, e.g. modification of the charge conversion ratio of the floating node capacitance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14641—Electronic components shared by two or more pixel-elements, e.g. one amplifier shared by two pixel elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/50—Control of the SSIS exposure
- H04N25/57—Control of the dynamic range
- H04N25/58—Control of the dynamic range involving two or more exposures
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
- H04N25/745—Circuitry for generating timing or clock signals
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
- H04N25/75—Circuitry for providing, modifying or processing image signals from the pixel array
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
- H04N25/778—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising amplifiers shared between a plurality of pixels, i.e. at least one part of the amplifier must be on the sensor array itself
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- Power Engineering (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Description
図1は、第1実施形態によるピクセル及びピクセル配列の回路の例示図であり、図2は、第2実施形態によるピクセル及びピクセル配列の回路の例示図である。
C(v)=C0+C1×tanh(VGB−VC1/NC1)
Claims (18)
- 光電変換部と、
前記光電変換部で変換された電荷を蓄積するためのコンデンサと、
前記コンデンサに接続されて前記コンデンサの電位に応じてキャパシタンスが変化する可変コンデンサと、
前記コンデンサの電位を出力するためのスイッチング素子と、を含むピクセル。 - 前記可変コンデンサは、セルフバイアスされる請求項1に記載のピクセル。
- 前記可変コンデンサは、p型可変コンデンサである請求項1に記載のピクセル。
- 前記スイッチング素子は、前記コンデンサの電位を出力するための出力スイッチング素子を含み、
前記可変コンデンサの一方のノードは前記コンデンサまたは前記出力スイッチング素子のゲートと、他方のノードは基板と接続される請求項1に記載のピクセル。 - 前記スイッチング素子は、前記光電変換部で変換された電荷を前記コンデンサに伝達するための伝達スイッチング素子を含み、
前記可変コンデンサを用いて前記伝達スイッチング素子のゲートに、FDをリセットせずに、前記伝達スイッチング素子を複数回ON/OFFさせる制御信号を与えるマルチクロックによりで前記コンデンサがストレージの役割を果たす請求項1に記載のピクセル。 - 前記スイッチング素子は、前記光電変換部と前記コンデンサの間に備えられ、前記光電変換部で変換された電荷を前記コンデンサに伝達するための伝達スイッチング素子と、電源電圧ラインと前記コンデンサの間に備えられ前記コンデンサの電位をリセットするためのリセットスイッチング素子と、前記電源電圧ラインに接続されて前記コンデンサの電位を出力するための出力スイッチング素子と、をさらに含み、
前記可変コンデンサは、前記コンデンサと電気的に接続される請求項1に記載のピクセル。 - 前記コンデンサは、共有されることを特徴とする請求項1に記載のピクセル。
- 前記光電変換部は、第1光電変換部と第2光電変換部を含み、
前記スイッチング素子は、前記第1光電変換部で変換された電荷を前記コンデンサに伝達するための第1伝達スイッチング素子と、前記第2光電変換部で変換された電荷を前記コンデンサに伝達するための第2伝達スイッチング素子と、を含み、
前記第1伝達スイッチング素子と前記第2伝達スイッチング素子は、前記コンデンサと前記可変トランジスタと電気的に共有され接続された請求項7に記載のピクセル。 - 前記可変コンデンサは、前記コンデンサに並列に接続されて前記コンデンサの電位が増加することによってキャパシタンスが増加する請求項1に記載のピクセル。
- 請求項1乃至9のうちのいずれか一項に記載のピクセルを配列に含むピクセル配列。
- 請求項10のピクセル配列を含む画像センサー。
- 前記コンデンサの予め定めた電位の間で可変コンデンサのセルフバイアスが実行されることを特徴とする請求項1または2に記載のピクセル。
- 前記コンデンサの予め定めた電位で可変コンデンサがセルフバイアスされ、それにより可変コンデンサのキャパシタンスが増加することを特徴とする請求項1または2に記載のピクセル。
- 前記可変コンデンサのセルフバイアスは、前記コンデンサの電位が小さくなる2.0V〜0Vの間で実行されることを特徴とする請求項13に記載のピクセル。
- 前記可変コンデンサのセルフバイアスは、前記コンデンサの電位が小さくなる1.5V〜0.5Vの間で実行されることを特徴とする請求項1または2に記載のピクセル。
- セルフバイアスされる可変コンデンサとしてバラクタを用いた場合、TXマルチクロックにより前記コンデンサがストレージの役割を果たすため、前記光電変換部の電子を複数回読むことができるので、マルチキャプチャ方式の画像を具現することを特徴とする請求項2に記載のピクセル。
- 前記コンデンサノードをメモリとして用いることで、トランスファトランジスタTxのマルチクロックを適用して予め定めた光電変換部出力より小さい場合でもフレームレートの速度を維持しながらマルチキャプチャ方式の画像を具現することを特徴とする請求項2に記載のピクセル。
- 前記光電変換部のリフレッシュ後、リセットと信号の読み出しの間に前記光電変換部を空けながら、前記コンデンサであるフローティングディフュージョン領域に電子情報が継続的に蓄積されることを特徴とする請求項1に記載のピクセル。
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KR1020110034449A KR101294386B1 (ko) | 2011-04-13 | 2011-04-13 | 픽셀, 픽셀 어레이 및 픽셀 어레이를 포함하는 이미지센서 |
KR10-2011-0034449 | 2011-04-13 |
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JP2012222807A JP2012222807A (ja) | 2012-11-12 |
JP5266359B2 true JP5266359B2 (ja) | 2013-08-21 |
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JP (1) | JP5266359B2 (ja) |
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US9287304B2 (en) | 2016-03-15 |
KR101294386B1 (ko) | 2013-08-08 |
KR20120116795A (ko) | 2012-10-23 |
JP2012222807A (ja) | 2012-11-12 |
US20120261549A1 (en) | 2012-10-18 |
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