JP5250795B2 - Soldering method of tape-shaped superconducting wire and tape-shaped stabilizer - Google Patents

Description

The present invention relates to a soldering where the tape-shaped superconducting wire and a tape-like stabilizing material.

  Conventionally, a tape-shaped superconducting wire as described in the following Non-Patent Document 1 (FIG. 1 on page 32) has been known. This tape-shaped superconducting wire comprises a metal substrate, an intermediate layer formed on the metal substrate, a superconductor layer formed on the intermediate layer, and a stabilization layer formed on the superconductor layer. In order.

"Cryogenic Journal 2007", page 32 Fig. 1 Cryogenic Engineering Association, published in March 2007

  In the tape-shaped superconducting wire described in Non-Patent Document 1 (FIG. 1 on page 32), further stabilization is performed for the purpose of stabilizing the superconducting state and for the purpose of further mechanical reinforcement. A tape-like stabilizing material such as a tape-like copper wire may be soldered on the layer. As shown in FIG. 9, this soldering is performed by supplying a tape-shaped superconducting wire 101 and a tape-shaped stabilizing material 102 such as a tape-shaped copper wire from the spools 111 and 112, and a part of the solder bath 202 in the solder bath 201. It is carried out by simultaneously feeding the solder bath 202 through the immersed guide roller 113. Then, the soldered tape-like superconducting wire 100 with the stabilizing material is wound around the spool 115 after solidification via the guide roller 114 partially immersed in the solder bath 202. Here, the guide rollers 113 and 114 are provided with grooves that serve as guides for the tape-shaped superconducting wire 101 and the tape-shaped stabilizing material 102 around the circumference, as shown in the side sectional view of FIG. The central hole is for inserting a rotating shaft.

  The above-described tape-shaped superconducting wire 101 is not a tape-shaped wire having a flat cross section in the width direction unless normally corrected, but has a curvature as shown in FIG. . The reason why such a curvature occurs is considered as follows. That is, it is considered that the tape-shaped superconducting wire 101 is bent during manufacturing due to differences in physical properties of the metal substrate, the intermediate layer, and the stabilizing layer constituting the tape-shaped superconducting wire 101. Here, as an example of a specific curve, in a tape-shaped superconducting wire having a cross section of thickness 0.1 mm × width 10 mm, h shown in FIG. 11A is about 0.1 mm to 0.2 mm. In the cross-sectional view of the tape-shaped superconducting wire 101 in FIG. 11A, “curvature” is exaggerated for convenience of explanation.

  Accordingly, a tape-like copper wire or the like is formed on the stabilization layer of the tape-like superconducting wire 101 shown in FIG. 11A while applying a predetermined tension using the apparatus having the configuration shown in FIG. When the stabilizer 102 is soldered, it becomes flat as shown in FIG. 11B immediately after soldering. However, as shown in FIG. 11C, the solidified finished product is in a curved state due to the influence of the tape-shaped superconducting wire 101. In particular, the flat tape-shaped stabilizing material 102 has a cross section that is substantially similar to the cross-sectional shape of the tape-shaped superconducting wire 101, although the shape is slightly different near both ends in the width direction. In addition, the solder layer 103 between the tape-shaped superconducting wire 101 and the tape-shaped stabilizing material 102 becomes thicker from the center in the width direction to the vicinity of both ends.

  In this way, the tape-shaped superconducting wire 100 with the stabilizing material including the tape-shaped superconducting wire 101, the tape-shaped stabilizing material 102, and the solder layer 103 is curved as a whole, and the width direction The thickness becomes non-uniform at the center and both ends in the width direction (see FIG. 11C). As a result, as shown in FIG. 11 (c), the tape-shaped superconducting wire 100 with a stabilizing material has a thickness represented by H or a thickness at the end in the width direction. Therefore, the tape-shaped superconducting wire 100 with the stabilizer is not suitable for winding a coil densely, and a local distortion occurs due to a difference in thickness existing in the width direction at the time of winding. In some cases, it has a cross-sectional shape that causes deterioration such as a decrease in (critical current) and a decrease in stabilization effect due to poor contact.

The present invention has been made in view of the above problems, and can provide a tape-shaped superconducting wire with a stabilizing material that has a cross-sectional shape that is suitable for tightly winding a coil and is unlikely to deteriorate during winding. , and to provide a soldering where the tape-shaped superconducting wire and a tape-like stabilizing material.

Means and effects for solving the problems

In the present invention, the following features are provided alone or in combination as appropriate. Soldering method of the tape-shaped superconducting wire and a tape-like stabilizing material of the present invention to solve the above problems, a tape-shaped superconducting wires spaced vertically and the tape-like stabilizing material, said tape-shaped superconducting wires wherein the step of the tape-like stabilizing material is fed simultaneously into the solder bath at an acute angle, in said solder bath, immersed in the solder bath of the guide rollers which rotate lower portion is immersed in a solder bath and through the outer periphery are, so as to sandwich the solder by integrally superimposed with said tape-shaped stabilizer member and the tape-shaped superconducting wires, wherein by sending the guide rollers, stabilizing material with tape-like The tape-shaped superconducting wire with the stabilizing material is shaped into a predetermined shape before and after the step of forming the superconducting wire and before and after sending out the tape-shaped superconducting wire with the stabilizing material from the solder bath. A step of, and a step of solidifying the solder between said tape-shaped superconducting wire and the tape-shaped stabilizing substrate, in the step of correcting the stabilizing material with tape-like superconducting wires into a predetermined shape, the stable while applying a predetermined tension to reduction material with tape-shaped superconducting wires, it is shall slide along one surface of the stabilizing material with tape-shaped superconducting wires in the curved surface of the member having a first curved surface .

According to the said structure, the soldering method of a tape-shaped superconducting wire and a tape-shaped stabilizing material from which the tape-shaped superconducting wire with a stabilizer which has a cross-sectional shape suitable for winding a coil densely is obtained can be provided. That is, it is possible to manufacture a tape-like superconducting wire with a stabilizing material that is suitable for winding a coil densely and has a cross-sectional shape that is unlikely to deteriorate during winding. Moreover, the method which can solder a tape-shaped superconducting wire and a tape-shaped stabilizer so that all the layers may become flat can be provided. That is, it is possible to manufacture a tape-shaped superconducting wire with a stabilizing material in which all layers are flat and the thickness is uniform. In addition, the amount of solder used for soldering can be reduced, and the solder layer between the tape-shaped superconducting wire and the tape-shaped stabilizing material can be made thinner. A tape-shaped superconducting wire with chemicals can be easily manufactured. In addition, in this way, the tape-shaped superconducting wire with a stabilizing material having a thin thickness is difficult to apply an excessive force to the superconducting layer and the intermediate layer constituting the tape-shaped superconducting wire when bending to wind a coil. It also leads to suppression of performance deterioration and breakage of the tape-shaped superconducting wire. Further, if the solder layer is thin at the time of connection to the electrode, the connection resistance can be reduced, and the loss when the coil is energized can be reduced.

  In the soldering method of the present invention, the tape with the stabilizing material is formed by sliding one surface of the tape-shaped superconducting wire with the stabilizing material along the curved surface of the member having the first curved surface. It is preferable that the other surface of the superconducting wire is continuously slid along the curved surface of the member having the second curved surface.

  According to the said structure, the method which can solder a tape-shaped superconducting wire and a tape-shaped stabilizer so that all the layers may become flat can be provided. Moreover, the thickness of the tape-shaped superconducting wire with the stabilizing material can be made more uniform.

  In the soldering method of the present invention, it is preferable that the member having the first curved surface and / or the member having the second curved surface is a roller that is rotatable about a center.

  According to the above configuration, the tape-shaped superconducting wire and the tape-shaped stabilizing material can be soldered reliably and easily so that the entire layer is flat while reducing the load on the wire. As a result, it is difficult to apply an excessive force, which leads to suppression of performance deterioration and breakage of the tape-shaped superconducting wire. Moreover, the thickness of the tape-shaped superconducting wire with the stabilizing material can be made more uniform.

  The curved surface of the member having the first curved surface and / or the curved surface of the member having the second curved surface is preferably an arc shape.

  According to the above configuration, the tape-shaped superconducting wire and the tape-shaped stabilizing material can be soldered reliably and easily so that all the layers are flat. Moreover, the thickness of the tape-shaped superconducting wire with the stabilizing material can be made more uniform.

  In the soldering method of the present invention, it is preferable that the tape-shaped superconducting wire with the stabilizing material is wound around the member having the first curved surface until the solder is solidified.

  According to the above configuration, since the solder is solidified while all the layers are flat, it is possible to reliably provide a tape-shaped superconducting wire with a stabilizer having a small thickness.

As another aspect, in the soldering method of the present invention, the member having the first curved surface has the first curved surface at a side portion, and the first curved surface has the stabilizing material. In the step of correcting the tape-shaped superconducting wire with the stabilizing material into a predetermined shape, which is a curved surface protruding toward the outside of the member having the first curved surface on the side along the thickness direction of the tape-shaped superconducting wire. In the solder bath, while applying a predetermined tension to the tape-shaped superconducting wire with the stabilizing material, one side of the tape-shaped superconducting wire with the stabilizing material was provided on the side of the first curved surface . It is preferable to slide along the side of the member.

  According to the said structure, the method which can solder a tape-shaped superconducting wire and a tape-shaped stabilizing material can be provided so that it may become a similar shape although all the layers are curving. That is, a tape-shaped superconducting wire with a stabilizing material having a uniform thickness can be manufactured.

In the soldering method of the present invention, it is preferable that the member having the first curved surface at the side is a disk-shaped roller that is rotatable about the center.

  According to the above configuration, it is possible to provide a method in which the tape-shaped superconducting wire and the tape-shaped stabilizing material can be soldered so that the entire layer is curved but has a similar shape while reducing the load on the wire. Moreover, the thickness of the tape-shaped superconducting wire with the stabilizing material can be made more uniform.

In the soldering method of the present invention, it is preferable that the member having the first curved surface at the side is a member having an arc shape, and the arc-shaped portion has the first curved surface. .

  According to the above configuration, it is possible to provide a method capable of soldering the tape-shaped superconducting wire and the tape-shaped stabilizing material so that all layers are curved but have a similar shape. Moreover, the thickness of the tape-shaped superconducting wire with the stabilizing material can be made more uniform.

  In the soldering method of the present invention, the tape-shaped superconducting wire includes a metal substrate, an intermediate layer formed on the metal substrate, a superconductor layer formed on the intermediate layer, and the superconductor wire. It is preferable to have a metal thin film layer formed on the conductor layer. The intermediate layer here includes not only one layer but also two or more layers. The present invention is a more suitable method for soldering a tape-shaped stabilizing material to such a tape-shaped superconducting wire.

  Hereinafter, embodiments of the soldering method of a tape-shaped superconducting wire and a tape-shaped stabilizing material and a tape-shaped superconducting wire with a stabilizing material according to the present invention will be described with reference to the drawings.

<First Embodiment>
FIG. 1 is a schematic configuration diagram of a soldering apparatus for performing a soldering method according to a first embodiment of the present invention. A soldering device 10 includes a spool 11 around which a tape-like superconducting wire 1 is wound, a spool 12 around which a tape-like stabilizing material 2 such as a tape-like copper wire is wound, and a solder tank 21 having a solder bath 22. And a guide roller 13, 14 partly immersed in the solder bath 22 of the solder bath 21, a guide roller 15 provided outside the solder bath 22, and finally a finished product of the tape-shaped superconducting wire 3 with a stabilizer. And a spool (not shown). The guide rollers 13, 14, and 15 have the same configuration as the guide rollers 113 and 114 shown in FIG. 10, and a gap between the tape-shaped superconducting wire 1 and the tape-shaped stabilizing material 2 is caused by a groove (guide). Can be prevented. The guide rollers 13, 14, and 15 are made of materials that are difficult to solder and have good heat conductivity to some extent, but aluminum, Teflon (registered trademark), or the like is used depending on the purpose.

  A tension applying device (not shown) is attached to the spools 11 and 12 so that tension can be applied to the wire when necessary. Typical examples of the tension applying device include a torque control motor and an air motor.

Although not shown, the tape-shaped superconducting wire 1 is for reinforcing (1) a superconductor layer (for example, there is a yttrium-based superconductor, but the present invention is not limited thereto, and any rare earth oxide superconductor may be used). Metal substrates (for example, those made of Hastelloy (registered trademark) and the like are not limited thereto), (2) an intermediate layer formed to ensure the bonding between the superconductor layer and the metal substrate ( For example, some are made of ceria (CeO ₂ ), but are not limited to this.) (3) Superconductor layer formed on the intermediate layer, (4) Easy soldering when attaching to the electrode Stabilization layer (for example, there is a metal coating layer made of silver, but not limited to this) and for the purpose of ensuring energization and heat transfer for releasing current and heat during quenching. Not in order) .

  Next, a method for using the soldering apparatus 10 and a soldering method according to the present embodiment will be described. First, the tape-shaped superconducting wire 1 and the tape-shaped stabilizing material 2 are simultaneously fed into the solder bath 22 from the spools 11 and 12 through the guide roller 13 while applying a predetermined tension. Subsequently, the tape-shaped superconducting wire 1 and the tape-shaped stabilizing material 2 are integrated by soldering to form the tape-shaped superconducting wire 3 with the stabilizing material. Thereafter, the tape-shaped superconducting wire 3 with the stabilizer is fed from the solder bath 22 to the outside of the bath via the guide roller 14. And while the surface opposite to the surface in contact with the guide roller 14 in the tape-like superconducting wire 3 with the stabilizing material is in contact with and sliding on the curved surface of the guide roller 15 rotating in the opposite direction to the guide roller 14, The tape-shaped superconducting wire 3 with the stabilizing material is flattened and the thickness is corrected uniformly. Here, in a portion 5 surrounded by a dotted line in FIG. 1, the tape-shaped stabilizing material 2 with the stabilizing material in which the tape-shaped stabilizing material 2 is flatly soldered by the solder layer 4 having a uniform thickness (see FIG. 2). In this state, the solder is solidified in the vicinity of the front and back of the guide roller 15 and solidified. The finished product of the tape-shaped superconducting wire 3 with the stabilizing material after solidification is wound up by a spool (not shown) provided with a driving means.

  According to the soldering method having the above configuration, the tape-shaped superconducting wire 3 with the stabilizing material in which the tape-shaped stabilizing material 2 is soldered flat by the solder layer 4 is obtained. That is, the tape-shaped superconducting wire 3 with a stabilizing material having a cross-sectional shape in which all the layers are flattened, the thickness is uniformed, suitable for winding the coil densely, and hardly deteriorated during winding can be manufactured. .

  Further, since the solder layer 4 between the tape-shaped superconducting wire 1 and the tape-shaped stabilizing material 2 can be thinned, the tape-shaped superconducting wire 3 with a stabilizing material having a thinner thickness than that of the prior art can be easily manufactured. it can. In this way, the thin-film tape-shaped superconducting wire 3 with the stabilizing material is subjected to an excessive force on the superconducting layer and the intermediate layer constituting the tape-shaped superconducting wire 1 when being bent to wind the coil. Since it is difficult, it leads also to the performance degradation of the tape-shaped superconducting wire 1, and suppression of breakage.

  Moreover, since the guide roller is used, the tape-shaped superconducting wire 1 and the tape-shaped stabilizing material 2 can be soldered so that all layers are flat while reducing the load applied to the wire. As a result, it is difficult to apply an excessive force, which leads to further deterioration in performance and damage of the tape-shaped superconducting wire 1.

  Here, as a modification, instead of using the guide roller 14, members 31, 33, and 35 having an arc shape that is fixed and does not rotate as shown in FIGS. 3A to 3C are used. May be. More specifically, the member shown in FIG. 3A is a fan-shaped member having an arc shape at the side, and the tape-shaped superconducting wire 32 with the stabilizing material is formed in an arc shape as in the first embodiment. The tape-shaped superconducting wire 32 with a stabilizing material having a cross-sectional shape suitable for winding the coil closely can be obtained. .

  The member 33 shown in FIG. 3B has a circular arc shape at a part (corner portion) of the side portion, and a flat surface portion is connected to the start and end of the circular arc shape, and the circular arc is also connected to one end of the flat surface portion. It is a member provided with another arc shape whose R is smaller than the shape, and by sliding the tape-shaped superconducting wire 32 with the stabilizing material along the flat portion and the arc shape as in the first embodiment, It is possible to obtain a tape-like superconducting wire 34 with a stabilizing material having a cross-sectional shape in which the layer is flattened, the thickness is uniformed, suitable for winding a coil densely, and hardly deteriorated during winding.

  The member 35 shown in FIG. 3 (c) is a semicircular member having an arc shape at the side, and the tape-shaped superconducting wire 36 with a stabilizer is arranged along the arc shape as in the first embodiment. By sliding, all layers are flattened, the thickness is uniform, suitable for winding coils closely, tape-shaped superconducting wire with stabilizing material having a cross-sectional shape that does not easily deteriorate during winding 36 can be obtained.

  These modified examples in FIGS. 3A to 3C may be appropriately used in the following embodiments. Moreover, although the angle of the fan of Fig.3 (a) is 90 degrees, it is not restricted to this, You may change suitably.

Second Embodiment
Next, a soldering method according to the second embodiment and a tape-shaped superconducting wire with a stabilizing material will be described. FIG. 4 is a schematic configuration diagram of a soldering apparatus for carrying out the soldering method according to the second embodiment of the present invention. Here, the members denoted by reference numerals 41 to 43, 51 to 54, 61, and 62 in FIG. 4 are the same as the members denoted by reference numerals 1 to 11, 11 to 14, 21, and 22 in the first embodiment in order, Description may be omitted.

  The soldering device 40 used in the present embodiment has no guide roller corresponding to the guide roller 15, and the tape-shaped superconducting wire 43 with a stabilizing material is engaged with the guide roller 54 to the extent that the solder is solidified. This is different from the first embodiment.

  Next, a method for using the soldering apparatus 40 and a soldering method according to the present embodiment will be described. First, the tape-shaped superconducting wire 41 and the tape-shaped stabilizing material 42 are simultaneously fed from the spools 51 and 52 into the solder bath 62 through the guide roller 53 while applying a predetermined tension. Subsequently, the tape-shaped superconducting wire 41 and the tape-shaped stabilizing material 42 are soldered and integrated to form a tape-shaped superconducting wire 43 with a stabilizing material. Thereafter, the tape-shaped superconducting wire 43 with the stabilizer is fed from the solder bath 62 to the outside of the bath via the guide roller 54. And, like the first embodiment, while having the guide roller 54 engaged and slid until the solder layer in the tape-shaped superconducting wire 43 with the stabilizer is solidified, as shown in FIG. The tape-like superconducting wire 43 with the stabilizing material is flattened and the thickness is corrected uniformly. The finished product of the tape-shaped superconducting wire 43 with the stabilizing material after solidification is wound up by a spool (not shown) provided with a driving means.

  According to the soldering method having the above-described configuration, the solder is solidified while all the layers in the tape-shaped superconducting wire 43 with the stabilizer are flat, and thus the same effect as that of the first embodiment is obtained.

<Third Embodiment>
Next, a soldering method according to a third embodiment and a tape-shaped superconducting wire with a stabilizing material will be described. FIG. 5 is a schematic configuration diagram of a soldering apparatus for carrying out the soldering method according to the third embodiment of the present invention. Here, the members denoted by reference numerals 71 to 73, 81 to 84, 91, and 92 in FIG. 5 are the same as the members denoted by reference numerals 1 to 11, 11 to 14, 21, and 22 in the first embodiment in this order, Description may be omitted.

  The soldering apparatus 70 used in the present embodiment has pins 85c and 85d, a first arm 85a that can be rotated around the pin 85c, and a pin 85d as the center, instead of having a guide roller corresponding to the guide roller 15. This is different from the first embodiment in that a sandwiching mechanism 85 having a rotatable second arm 85b is provided.

  The first arm 85a and the second arm 85b are members each having a substantially L-shaped cross section. The first arm 85a and the second arm 85b are arranged symmetrically so that the tape-like superconducting wire 73 with a stabilizer can be sandwiched between the vicinity of one end of each of the first arm 85a and the second arm 85b (the solder tank 91 side in FIG. 5). Further, the first arm 85a and the second arm 85b sandwich the tape-shaped superconducting wire 73 with the stabilizing material with an appropriate force using a spring mechanism (not shown) or the like.

  Note that the sandwiching mechanism 85 only needs to be disposed at a position where the solder layer of the tape-like superconducting wire 73 with the stabilizing material is solidified. However, when the melting point of the solder is high, it may be better to separate from the solder tank 91. Further, the width and length of the first arm 85a and the second arm 85b are adjusted as appropriate in the portion where the tape-shaped superconducting wire 73 with the stabilizing material is sandwiched. In addition to naturally cooling the first arm 85a and the second arm 85b, forced air cooling or cooling using a liquid or a cooler may be performed.

  Next, a method for using the soldering apparatus 70 and a soldering method according to the present embodiment will be described. First, the tape-shaped superconducting wire 71 and the tape-shaped stabilizing material 72 are simultaneously fed from the spools 81 and 82 into the solder bath 92 through the guide roller 83 while applying a predetermined tension. Subsequently, the tape-shaped superconducting wire 71 and the tape-shaped stabilizing material 72 are integrated by soldering to form a tape-shaped superconducting wire 73 with a stabilizing material. Thereafter, the tape-shaped superconducting wire 73 with the stabilizing material is fed from the solder bath 92 to the outside of the bath via the guide roller 84. Then, as in the first embodiment, the tape with the stabilizing material has a cross section as shown in FIG. 2 while being sandwiched by the sandwiching mechanism 85 until the solder layer in the tape-like superconducting wire 73 with the stabilizing material is solidified. The flat superconducting wire 73 is flattened and the thickness is uniformly corrected. The finished product of the tape-shaped superconducting wire 73 with the stabilizing material after solidification is wound up by a spool (not shown) provided with driving means.

  According to the soldering method having the above-described configuration, since the solder is solidified while all the layers in the tape-shaped superconducting wire 73 with the stabilizing material are flat, the same effects as those of the first embodiment can be obtained.

<Fourth embodiment>
Next, a soldering method according to a fourth embodiment and a tape-shaped superconducting wire with a stabilizing material will be described. FIG. 5 is a side sectional view of a roller used in a soldering apparatus for carrying out a soldering method according to a fourth embodiment of the present invention.

  The soldering device used in this embodiment is not shown, but differs in that a roller 93 having the cross section shown in FIG. 6 is used instead of the guide roller 14 of the soldering device described in the first embodiment. The other members are the same. Therefore, the description of the same thing as 1st Embodiment is abbreviate | omitted.

  The roller 93 is a disk-shaped member having an R shape on the side. The central hole is for inserting a rotating shaft. Further, the R shape may be matched with the curved shape that the tape-shaped superconducting wire has from the beginning, or may be shaped according to a desired curved shape.

  Next, a soldering method according to this embodiment will be described. Although it is almost the same as in the first embodiment, the action of the roller 93 used in place of the guide roller 14 is different. Specifically, the tape-shaped superconducting wire 97 with a stabilizing material that is in contact with and slides on the roller 93 is corrected to have a bowed shape (curved shape) as shown in FIG. As shown in FIG. 7, each of the tape-shaped superconducting wire 94, the solder layer 95, and the tape-shaped stabilizing material 96 constituting the tape-shaped superconducting wire 97 with the stabilizing material has a similar shape, and the solder layer 95. Is corrected to a uniform thickness in the width direction. The tape-shaped superconducting wire 97 with the stabilizing material having a constant thickness can be manufactured by solidifying the tape-shaped superconducting wire 97 with the stabilizing material in these shapes.

  According to the soldering method having the above configuration, the tape-shaped superconducting wire 97 with a stabilizing material having a cross-sectional shape suitable for winding a coil densely can be manufactured. Further, the tape-shaped superconducting wire 97 with a stabilizing material having a small thickness is not easily subjected to an excessive force on the superconducting layer and the intermediate layer constituting the tape-shaped superconducting wire 94 when being bent for winding a coil. This also leads to suppression of performance deterioration and breakage of the superconducting wire 94. Furthermore, since the roller 93 is used, the tape-shaped superconducting wire 97 with a stabilizing material can be manufactured, reducing the load concerning a wire.

  Here, as a modification, instead of the roller 93, a fan-shaped member 98 having an R-shaped portion 98 a similar to the roller 93 on the curved surface portion as shown in FIG. 8 may be used. Here, Fig.8 (a) is a front view of a fan-shaped member, FIG.8 (b) is the II arrow directional view of Fig.8 (a).

  Further, as another modification, although not shown, a roller similar to the roller 93 may be further provided in the subsequent stage of the roller 93. At this time, the tape-shaped superconducting wire 94 fed from the roller 93 and the shape of the side portion of the roller are combined, and the tape-shaped superconducting wire 94 is wound around the roller, whereby the tape-shaped superconducting wire having a desired shape is obtained. 94 can be obtained more reliably.

  The present invention can be modified in design without departing from the scope of the claims, and is not limited to the above embodiment. For example, although the guide roller 13 is used in the first embodiment, the guide roller 14 for directly correcting the tape-shaped superconducting wire 1 and the tape-shaped stabilizing material 2 from the spools 11 and 12 without using the guide roller 13, respectively. It is also possible to hang it on. The same applies to other embodiments and modifications.

  Moreover, in 4th Embodiment, although the roller 93 was used instead of the guide roller 14 in 1st Embodiment, it is also possible to use the same member as the roller 93 instead of the guide roller 54 in 2nd Embodiment. Good.

  In the first embodiment, the tape-shaped superconducting wire 1 is brought into contact with the guide rollers 13 and 14 and the tape-shaped stabilizing material 2 is soldered. It is good also as soldering the tape-shaped superconducting wire 1 with the chemical | drug | medicine 2 contact | abutting. The same applies to other embodiments and modifications.

  Moreover, it is good also as a soldering method of the tape-shaped superconducting wire which combined each embodiment and each modification suitably, and a tape-shaped stabilizer.

1 is a schematic configuration diagram of a soldering apparatus for carrying out a soldering method according to a first embodiment of the present invention. It is sectional drawing which shows the tape-shaped superconducting wire with a stabilizer corrected by the soldering method which concerns on 1st Embodiment of this invention. It is a figure which shows the member used with the modification of the soldering apparatus for enforcing the soldering method which concerns on 1st Embodiment of this invention, Comprising: (a) is a figure which shows the fan-shaped member which had circular arc shape in the side part , (B) is a diagram showing a member having a circular arc shape at a part (corner portion) of a side portion, and a plane portion connected to the starting end and the terminal end of the circular arc shape, and (c) having a circular arc shape at the side portion. It is a figure which shows the semicircular member which was made. It is the structure schematic of the soldering apparatus for enforcing the soldering method which concerns on 2nd Embodiment of this invention. It is the structure schematic of the soldering apparatus for enforcing the soldering method which concerns on 3rd Embodiment of this invention. It is sectional drawing which shows the roller used with the soldering apparatus for enforcing the soldering method which concerns on 4th Embodiment of this invention. It is a figure for demonstrating the effect | action of the soldering method which concerns on 4th Embodiment of this invention. (A) is a front view of a fan-shaped member, (b) is a II arrow view of (a). It is the structure schematic of the soldering apparatus for enforcing the soldering method of the conventional tape-shaped superconducting wire and tape-shaped stabilizer. It is a sectional side view of the guide roller used with the soldering apparatus of FIG. (A) is a cross-sectional view of a normal tape-shaped superconducting wire, (b) is a cross-sectional view of a tape-shaped superconducting wire with a stabilizing material immediately after soldering (before solidification) using the soldering apparatus of FIG. FIG. 10c is a cross-sectional view of a tape-shaped superconducting wire with a stabilizing material after solidification soldered using the soldering apparatus of FIG. 9;

Explanation of symbols

1, 32, 34, 36, 41, 71, 94, 101 Tape-shaped superconducting wire 2, 42, 72, 96, 102 Tape-shaped stabilizing material 3, 43, 73, 97, 100 Tape-shaped superconducting wire with stabilizing material 4, 95, 102 Solder layer 5 Position 10, 40, 70 Soldering device 11, 12, 51, 52, 81, 82, 111, 112, 115 Spool 13, 14, 15, 53, 54, 83, 84, 113 , 114 Guide rollers 21, 61, 91, 201 Solder tanks 22, 62, 92, 202 Solder baths 31, 33, 35 A member 85a having an arc shape at the side thereof First arm 85b Second arm 85c, 85d Pin 85 sandwiched Mechanism 93 Roller 98 Fan-shaped member 98a R-shaped part

Claims (9)

A step of simultaneously feeding the tape-shaped superconducting wire and the tape-shaped stabilizing material separated in the vertical direction into the solder bath so that the tape-shaped superconducting wire and the tape-shaped stabilizing material form an acute angle;
In the solder bath, the tape-shaped superconducting wire and the tape-shaped stabilizing material are arranged so as to sandwich the solder through the outer periphery of the rotating guide roller immersed in the solder bath in the solder bath. A process of forming a tape-shaped superconducting wire with a stabilizing material by superimposing and integrating, and feeding from the guide roller,
Before and after feeding out the tape-shaped superconducting wire with the stabilizing material from the solder bath, correcting the tape-shaped superconducting wire with the stabilizing material into a predetermined shape;
Solidifying the solder between the tape-shaped superconducting wire and the tape-shaped stabilizing material,
In the step of correcting the tape-shaped superconducting wire with the stabilizing material into a predetermined shape,
Sliding one surface of the tape-shaped superconducting wire with the stabilizing material along the curved surface of the member having the first curved surface while applying a predetermined tension to the tape-shaped superconducting wire with the stabilizing material. A soldering method of a tape-shaped superconducting wire and a tape-shaped stabilizer.   After sliding one surface of the tape-shaped superconducting wire with the stabilizing material along the curved surface of the member having the first curved surface, the other surface of the tape-shaped superconducting wire with the stabilizing material is moved to the second surface. 2. The soldering method according to claim 1, wherein the member having the curved surface is continuously slid along the curved surface.   The soldering method according to claim 2, wherein the member having the first curved surface and / or the member having the second curved surface is a disk-shaped roller that is rotatable about a center.   3. The soldering method according to claim 2, wherein the curved surface of the member having the first curved surface and / or the curved surface of the member having the second curved surface has an arc shape.   2. The soldering method according to claim 1, wherein the tape-shaped superconducting wire with the stabilizing material is wound around the member having the first curved surface until the solder is solidified. The member having the first curved surface has the first curved surface on a side portion,
The first curved surface is a curved surface protruding toward the outside of a member having the first curved surface at a side portion along the thickness direction of the tape-shaped superconducting wire with the stabilizing material,
In the step of correcting the tape-shaped superconducting wire with the stabilizing material into a predetermined shape,
In the solder bath, a member having one side of the tape-shaped superconducting wire with the stabilizing material and the first curved surface at the side while applying a predetermined tension to the tape-shaped superconducting wire with the stabilizing material. The soldering method according to claim 1, wherein the solder is slid along the side portion.   The soldering method according to claim 6, wherein the member having the first curved surface on the side is a disk-shaped roller that is rotatable about the center.   7. The soldering according to claim 6, wherein the member having the first curved surface on the side is a member having an arc shape, and the arc-shaped portion has the first curved surface. Method.   The tape-shaped superconducting wire comprises a metal substrate, an intermediate layer formed on the metal substrate, a superconductor layer formed on the intermediate layer, and a metal formed on the superconductor layer. It has a thin film layer, The soldering method of any one of Claims 1-8 characterized by the above-mentioned.

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