JP5230063B2 - 電子ビーム暗視野像形成のための装置および方法 - Google Patents
電子ビーム暗視野像形成のための装置および方法 Download PDFInfo
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- JP5230063B2 JP5230063B2 JP2005238374A JP2005238374A JP5230063B2 JP 5230063 B2 JP5230063 B2 JP 5230063B2 JP 2005238374 A JP2005238374 A JP 2005238374A JP 2005238374 A JP2005238374 A JP 2005238374A JP 5230063 B2 JP5230063 B2 JP 5230063B2
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- 238000010894 electron beam technology Methods 0.000 title claims description 53
- 238000000034 method Methods 0.000 title claims description 10
- 238000003384 imaging method Methods 0.000 title description 10
- 238000007654 immersion Methods 0.000 claims description 11
- 238000000605 extraction Methods 0.000 claims description 3
- 230000005684 electric field Effects 0.000 claims description 2
- 230000005405 multipole Effects 0.000 claims description 2
- 230000000903 blocking effect Effects 0.000 claims 1
- 238000001514 detection method Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 9
- 238000012937 correction Methods 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
- H01J37/28—Electron or ion microscopes; Electron or ion diffraction tubes with scanning beams
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement or ion-optical arrangement
- H01J37/05—Electron or ion-optical arrangements for separating electrons or ions according to their energy or mass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/244—Detectors; Associated components or circuits therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/26—Electron or ion microscopes; Electron or ion diffraction tubes
- H01J37/261—Details
- H01J37/265—Controlling the tube; circuit arrangements adapted to a particular application not otherwise provided, e.g. bright-field-dark-field illumination
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/05—Arrangements for energy or mass analysis
- H01J2237/053—Arrangements for energy or mass analysis electrostatic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/15—Means for deflecting or directing discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/153—Correcting image defects, e.g. stigmators
- H01J2237/1536—Image distortions due to scanning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/244—Detection characterized by the detecting means
- H01J2237/2446—Position sensitive detectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/244—Detection characterized by the detecting means
- H01J2237/24485—Energy spectrometers
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Electron Tubes For Measurement (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Description
Claims (22)
- 入射電子ビームを標本表面に集束させ、該標本表面から散乱電子ビームを抽出するように構成された対物レンズと、
前記入射電子ビームを偏向し、前記入射電子ビームで前記標本表面を走査するように構成された走査デフレクタと、
前記散乱電子ビームを偏向し、前記入射電子ビームの走査方向を補正するように構成された反走査デフレクタと、
前記反走査デフレクタよりも後ろで前記散乱電子ビームを受け取るように配置され、前記散乱電子ビーム中の電子を前記標本表面からの軌道の極角に従って整列させるように、その軸方向の前記散乱電子のエネルギーが大きくなるほど極角が大きくなるように放射状に拡散させるエネルギーフィルタ・ドリフトチューブと、
前記エネルギーフィルタ・ドリフトチューブよりも後ろで前記散乱電子ビームを受け取るように配置された、領域分割された検出器と
からなる電子ビーム走査装置。 - 前記対物レンズは、高い抽出電界を有するように構成されたイマージョンレンズを含み、前記散乱電子の方位角の識別が可能である、請求項1に記載の電子ビーム走査装置。
- 前記反走査デフレクタは四重極レンズから構成される、請求項1に記載の電子ビーム走査装置。
- 前記反走査デフレクタは、前記散乱電子をほぼ軸に沿って、軸に垂直であって標本表面に平行な半径方向の僅かな傾きをもって前記検出器の入口面に入射させるように構成される、請求項3に記載の電子ビーム走査装置。
- 前記エネルギーフィルタ・ドリフトチューブは、両端にエネルギーフィルタ網を有するドリフトチューブと、隙間によって分離された接地網とから構成される、請求項1に記載の電子ビーム走査装置。
- 前記ドリフトチューブに可変電圧が印加され、前記接地網に接地電圧が印加され、前記可変電圧が標本表面の電位に設定されることをさらに含む、請求項5に記載の電子ビーム走査装置。
- 前記領域分割された検出器は、領域分割された光パイプに取り付けられたYAPシンチレータからなる、請求項1に記載の電子ビーム走査装置。
- 前記光パイプは、中央領域と外側領域とに領域分割される、請求項7に記載の電子ビーム走査装置。
- 前記外側領域は4つの四分円を含む、請求項8に記載の電子ビーム走査装置。
- 画像形成モードは、全ての前記領域から検出された信号を加算することにより画像を生成する、請求項8に記載の電子ビーム走査装置。
- 画像形成モードは、四分円のうちの少なくとも1つから検出された信号を用いて画像を生成する、請求項10に記載の電子ビーム走査装置。
- 画像形成モードは、少なくとも2つの外側領域から検出された信号間の差を計算することにより画像を生成する、請求項10に記載の電子ビーム走査装置。
- 前記散乱電子ビームの円錐角を調節するように構成された静電レンズをさらに含む、請求項1に記載の電子ビーム走査装置。
- 前記静電レンズは、前記標本表面と前記走査デフレクタの間に配置される、請求項13に記載の電子ビーム走査装置。
- 前記静電レンズは前記ドリフトチューブよりも後ろに配置され、且つ前記デフレクタよりも前に配置される、請求項13に記載の電子ビーム走査装置。
- 前記静電レンズは前記反走査デフレクタよりも後ろに配置され、且つ前記ドリフトチューブよりも前に配置される、請求項13に記載の電子ビーム走査装置。
- 電子ビーム走査を使用して画像形成する方法であって、
入射電子ビームを偏向し、該入射電子ビームで標本表面を走査するステップと、
前記入射電子ビームを標本表面に集束させるステップと、
前記標本表面から散乱電子ビームを抽出するステップと、
前記散乱電子ビームを偏向し、前記入射電子ビームの走査方向を補正するステップと、
エネルギーフィルタ・ドリフトチューブを用いてその軸方向の前記散乱電子のエネルギーが大きくなるほど極角が大きくなるように放射状に拡散させることで前記散乱電子ビーム中の電子を前記標本表面からの軌道の極角に従って整列させるステップと、
前記散乱電子ビームを領域分割された検出器を用いて検出するステップと
からなる方法。 - 前記エネルギーフィルタ・ドリフトチューブの電圧を前記標本表面の電位に設定するステップをさらに含む、請求項17に記載の方法。
- 前記電圧は、電圧スウィープにより二次電子の遮断電圧を判定することによって設定される、請求項18に記載の方法。
- 前記集束させるステップおよび前記抽出するステップは、イマージョン対物レンズシステムを用いて実施され、前記散乱電子ビーム中の電子の方位角の識別が可能である、請求項17に記載の方法。
- 前記散乱電子ビームを偏向するステップは、多重極レンズを用いて実施される、請求項17に記載の方法。
- 入射電子ビームを偏向し、該入射電子ビームで標本表面を走査する手段と、
前記入射電子ビームを前記標本表面に集束させる手段と、
前記標本表面から散乱電子ビームを抽出する手段と、
前記散乱電子ビームを偏向し、前記入射電子ビームの走査方向を補正する手段と、
軸方向の前記散乱電子のエネルギーが大きくなるほど極角が大きくなるように放射状に拡散させることで前記散乱電子ビーム中の電子を前記標本表面からの軌道の極角に従って整列させるエネルギーフィルタ・ドリフトチューブと、
前記エネルギーフィルタ・ドリフトチューブからの前記散乱電子ビームを領域分割された検出器を用いて検出する手段と
からなる走査型電子顕微鏡。
Applications Claiming Priority (2)
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US10/935,834 | 2004-09-07 | ||
US10/935,834 US7141791B2 (en) | 2004-09-07 | 2004-09-07 | Apparatus and method for E-beam dark field imaging |
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JP2006080061A JP2006080061A (ja) | 2006-03-23 |
JP5230063B2 true JP5230063B2 (ja) | 2013-07-10 |
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JP2005238374A Active JP5230063B2 (ja) | 2004-09-07 | 2005-08-19 | 電子ビーム暗視野像形成のための装置および方法 |
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Families Citing this family (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006114225A (ja) * | 2004-10-12 | 2006-04-27 | Hitachi High-Technologies Corp | 荷電粒子線装置 |
US7462828B2 (en) * | 2005-04-28 | 2008-12-09 | Hitachi High-Technologies Corporation | Inspection method and inspection system using charged particle beam |
US7880154B2 (en) | 2005-07-25 | 2011-02-01 | Karl Otto | Methods and apparatus for the planning and delivery of radiation treatments |
CN101247852B (zh) * | 2005-07-25 | 2011-12-07 | 卡尔·奥托 | 用于计划和供给放射治疗的方法和装置 |
US7705301B2 (en) * | 2006-07-07 | 2010-04-27 | Hermes Microvision, Inc. | Electron beam apparatus to collect side-view and/or plane-view image with in-lens sectional detector |
US7525090B1 (en) * | 2007-03-16 | 2009-04-28 | Kla-Tencor Technologies Corporation | Dynamic centering for behind-the-lens dark field imaging |
JP4977509B2 (ja) * | 2007-03-26 | 2012-07-18 | 株式会社日立ハイテクノロジーズ | 走査電子顕微鏡 |
USRE46953E1 (en) | 2007-04-20 | 2018-07-17 | University Of Maryland, Baltimore | Single-arc dose painting for precision radiation therapy |
US20100302520A1 (en) * | 2007-10-26 | 2010-12-02 | Hermes-Microvision, Inc. | Cluster e-beam lithography system |
US7838833B1 (en) * | 2007-11-30 | 2010-11-23 | Kla-Tencor Technologies Corporation | Apparatus and method for e-beam dark imaging with perspective control |
US7714287B1 (en) * | 2008-06-05 | 2010-05-11 | Kla-Tencor Corporation | Apparatus and method for obtaining topographical dark-field images in a scanning electron microscope |
US7932495B2 (en) * | 2008-09-02 | 2011-04-26 | ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH | Fast wafer inspection system |
EP2159817B1 (en) | 2008-09-02 | 2012-01-25 | ICT, Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH | Fast wafer inspection system |
WO2010051546A2 (en) | 2008-10-31 | 2010-05-06 | Fei Company | Measurement and endpointing of sample thickness |
EP2194565A1 (en) * | 2008-12-03 | 2010-06-09 | FEI Company | Dark field detector for use in a charged-particle optical apparatus |
FR2957674B1 (fr) * | 2010-03-19 | 2012-06-08 | Commissariat Energie Atomique | Procede de caracterisation d'un echantillon cristallin par diffusion d'ions ou atomes |
US8624186B2 (en) * | 2010-05-25 | 2014-01-07 | Hermes Microvision, Inc. | Movable detector for charged particle beam inspection or review |
US9289627B2 (en) | 2010-06-22 | 2016-03-22 | Varian Medical Systems International Ag | System and method for estimating and manipulating estimated radiation dose |
US20120223227A1 (en) * | 2011-03-04 | 2012-09-06 | Chien-Huei Chen | Apparatus and methods for real-time three-dimensional sem imaging and viewing of semiconductor wafers |
US9496425B2 (en) | 2012-04-10 | 2016-11-15 | Kla-Tencor Corporation | Back-illuminated sensor with boron layer |
US9384936B2 (en) | 2013-03-25 | 2016-07-05 | Hermes Microvision Inc. | Energy filter for charged particle beam apparatus |
US9000395B2 (en) | 2013-03-25 | 2015-04-07 | Hermes Microvision, Inc. | Energy filter for charged particle beam apparatus |
US9048063B1 (en) | 2013-05-14 | 2015-06-02 | Hermes Microvision, Inc. | Electron beam apparatus |
US9048062B1 (en) | 2013-05-14 | 2015-06-02 | Hermes Microvision, Inc. | Method for improving performance of an energy filter |
US9347890B2 (en) | 2013-12-19 | 2016-05-24 | Kla-Tencor Corporation | Low-noise sensor and an inspection system using a low-noise sensor |
US9748294B2 (en) | 2014-01-10 | 2017-08-29 | Hamamatsu Photonics K.K. | Anti-reflection layer for back-illuminated sensor |
US9410901B2 (en) | 2014-03-17 | 2016-08-09 | Kla-Tencor Corporation | Image sensor, an inspection system and a method of inspecting an article |
US9767986B2 (en) | 2014-08-29 | 2017-09-19 | Kla-Tencor Corporation | Scanning electron microscope and methods of inspecting and reviewing samples |
DE112014007154B4 (de) * | 2014-12-10 | 2021-02-11 | Hitachi High-Tech Corporation | Ladungsteilchen-Strahlvorrichtung |
SG11201707201SA (en) | 2015-03-24 | 2017-10-30 | Kla Tencor Corp | Method and system for charged particle microscopy with improved image beam stabilization and interrogation |
US9860466B2 (en) | 2015-05-14 | 2018-01-02 | Kla-Tencor Corporation | Sensor with electrically controllable aperture for inspection and metrology systems |
US10462391B2 (en) | 2015-08-14 | 2019-10-29 | Kla-Tencor Corporation | Dark-field inspection using a low-noise sensor |
US10192716B2 (en) * | 2015-09-21 | 2019-01-29 | Kla-Tencor Corporation | Multi-beam dark field imaging |
US10313622B2 (en) | 2016-04-06 | 2019-06-04 | Kla-Tencor Corporation | Dual-column-parallel CCD sensor and inspection systems using a sensor |
US10778925B2 (en) | 2016-04-06 | 2020-09-15 | Kla-Tencor Corporation | Multiple column per channel CCD sensor architecture for inspection and metrology |
US10347460B2 (en) * | 2017-03-01 | 2019-07-09 | Dongfang Jingyuan Electron Limited | Patterned substrate imaging using multiple electron beams |
AU2018273352B2 (en) | 2017-05-22 | 2023-07-27 | Howmedica Osteonics Corp. | Device for in-situ fabrication process monitoring and feedback control of an electron beam additive manufacturing process |
WO2019100600A1 (en) * | 2017-11-21 | 2019-05-31 | Focus-Ebeam Technology (Beijing) Co., Ltd. | Low voltage scanning electron microscope and method for specimen observation |
US10964522B2 (en) * | 2018-06-06 | 2021-03-30 | Kla Corporation | High resolution electron energy analyzer |
US11114489B2 (en) | 2018-06-18 | 2021-09-07 | Kla-Tencor Corporation | Back-illuminated sensor and a method of manufacturing a sensor |
AU2019206103A1 (en) | 2018-07-19 | 2020-02-06 | Howmedica Osteonics Corp. | System and process for in-process electron beam profile and location analyses |
US11114491B2 (en) | 2018-12-12 | 2021-09-07 | Kla Corporation | Back-illuminated sensor and a method of manufacturing a sensor |
US11417492B2 (en) | 2019-09-26 | 2022-08-16 | Kla Corporation | Light modulated electron source |
US11239048B2 (en) * | 2020-03-09 | 2022-02-01 | Kla Corporation | Arrayed column detector |
US11848350B2 (en) | 2020-04-08 | 2023-12-19 | Kla Corporation | Back-illuminated sensor and a method of manufacturing a sensor using a silicon on insulator wafer |
US11749495B2 (en) | 2021-10-05 | 2023-09-05 | KLA Corp. | Bandpass charged particle energy filtering detector for charged particle tools |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2919170B2 (ja) * | 1992-03-19 | 1999-07-12 | 株式会社日立製作所 | 走査電子顕微鏡 |
JPH0773841A (ja) * | 1993-09-03 | 1995-03-17 | Hitachi Ltd | 走査電子顕微鏡と二次電子検出系 |
US5644132A (en) * | 1994-06-20 | 1997-07-01 | Opan Technologies Ltd. | System for high resolution imaging and measurement of topographic and material features on a specimen |
DE69504294T2 (de) * | 1994-12-19 | 1999-04-08 | Opal Technologies Ltd., Nes Ziona | System zur Hochauflösungsbildgebung und Messung von topographischen Characteristiken und Materialcharakteristiken einer Probe |
JP3774953B2 (ja) * | 1995-10-19 | 2006-05-17 | 株式会社日立製作所 | 走査形電子顕微鏡 |
US6667476B2 (en) * | 1998-03-09 | 2003-12-23 | Hitachi, Ltd. | Scanning electron microscope |
JP4236742B2 (ja) * | 1998-10-29 | 2009-03-11 | 株式会社日立製作所 | 走査形電子顕微鏡 |
JP2000252330A (ja) * | 1999-03-01 | 2000-09-14 | Jeol Ltd | 電子ビーム検査装置 |
US6407373B1 (en) | 1999-06-15 | 2002-06-18 | Applied Materials, Inc. | Apparatus and method for reviewing defects on an object |
JP4006946B2 (ja) * | 2000-01-25 | 2007-11-14 | 株式会社日立製作所 | 走査電子顕微鏡 |
US6787772B2 (en) * | 2000-01-25 | 2004-09-07 | Hitachi, Ltd. | Scanning electron microscope |
KR100494300B1 (ko) * | 2000-03-31 | 2005-06-10 | 가부시끼가이샤 히다치 세이사꾸쇼 | 주사 전자현미경 |
EP1288996B1 (en) * | 2001-09-04 | 2006-03-22 | Advantest Corporation | Particle beam apparatus |
DE10211977A1 (de) * | 2002-03-18 | 2003-10-02 | Leo Elektronenmikroskopie Gmbh | Rasterelektronenmikroskop |
DE10236738B9 (de) * | 2002-08-09 | 2010-07-15 | Carl Zeiss Nts Gmbh | Elektronenmikroskopiesystem und Elektronenmikroskopieverfahren |
-
2004
- 2004-09-07 US US10/935,834 patent/US7141791B2/en not_active Expired - Lifetime
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US7141791B2 (en) | 2006-11-28 |
JP2006080061A (ja) | 2006-03-23 |
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