JP5212995B2 - モジュールおよびモジュールの製造方法 - Google Patents
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Description
Claims (32)
- 平面状の複数の電子部品を備えるモジュールであって、前記複数の電子部品の各々は、可撓性を有する変形可能な一つの基板の上に形成されたベース電極と、前記ベース電極の上に形成された光学活性層と、前記光学活性層を被覆するカバー電極とを有し、前記複数の電子部品の各々は互いに離間され、
前記カバー電極(2)は、前記複数の電子部品の各々(1)の同一方向の片側において前記光学活性層(3)を超えて突出しており、前記ベース電極(4)は前記複数の電子部品の各々(1)の同一方向の反対側において前記光学活性層(3)を超えて突出しており、前記複数の電子部品の各々(1)は、前記一つの基板(5)上で互いから離間されているので、前記複数の電子部品の各々(1)同士の間には前記一つの基板(5)上に自由基板表面(6)が設けられており、前記自由基板表面(6)の領域において折り曲げると、隣接し合う前記複数の電子部品の各々(1)の前記ベース電極(4)および前記カバー電極(2)が互いに平面状に接触して、直列に電気接続されるよう導電接触が得られるモジュール。 - 前記複数の電子部品の各々(1)は、太陽電池または有機発光ダイオードである請求項1に記載のモジュール。
- 前記一つの基板(5)は、紙、段ボール、ポリマー膜、または金属膜、または、これらの材料の混合物から選択される請求項1または請求項2に記載のモジュール。
- 折り曲げられた状態において、圧縮力を加える少なくとも2つの部材(7)の間に配置される請求項1から請求項3のうちいずれか一項に記載のモジュール。
- 前記部材(7)は、板状部材からなる請求項4に記載のモジュール。
- 前記一つの基板(5)の外側周縁領域には、周囲に何も設けられない請求項1から請求項5のうちいずれか一項に記載のモジュール。
- 前記ベース電極(4)および前記カバー電極(2)の少なくとも一方には、少なくとも導電接続を接触によって実現するための領域において、前記ベース電極(4)および前記カバー電極(2)の少なくとも一方よりも比電気抵抗が小さいコーティング(8)を設ける請求項1から請求項6のうちいずれか一項に記載のモジュール。
- 前記ベース電極(4)の領域、および、隣接する前記複数の電子部品の各々(1)のカバー電極(2)の領域は、互いに面で隣接するように配設されており、導電接着剤(9)を用いて材料が連続するように接続されている請求項1から請求項7のうちいずれか一項に記載のモジュール。
- 前記一つの基板(5)は、少なくとも一面において保護層が設けられているか、または、保護層として形成されている請求項1から請求項8のうちいずれか一項に記載のモジュール。
- 折り曲げられた状態では、凸状および凹状の少なくとも一方の曲線を描く請求項1から請求項9のうちいずれか一項に記載のモジュール。
- 前記一つの基板(5)の折り曲げ部分(10)は、U字形またはV字形である請求項1から請求項10のうちいずれか一項に記載のモジュール。
- 前記複数の電子部品のうちの任意の電子部品(1)のカバー電極(2)の領域は、折り曲げられた状態では、前記任意の電子部品(1)の下方に配置され、前記任意の電子部品に隣接する前記複数の電子部品のうちの他の電子部品(1)の前記ベース電極(4)の領域の上に位置することによって、これら2つの電子部品(1)の間に導電接続が構築される請求項1から請求項11のうちいずれか一項に記載のモジュール。
- 前記カバー電極(2)は、導電性を有すると共に光学的に透明である物質から形成されているか、または、導電性を有すると共に光学的に透明である化合物から形成されている請求項1から請求項12のうちいずれか一項に記載のモジュール。
- 前記部材(7)は、光学的に透明であると共に電気絶縁性を有する請求項4または5に記載のモジュール。
- 前記部材(7)は、気体および液体に対して不浸透性を持つ請求項14に記載のモジュール。
- 前記複数の電子部品の各々(1)は、前記モジュールにおいて、前記複数の電子部品の各々(1)の前記カバー電極(2)および前記ベース電極(4)の少なくとも一方は、隣接する電子部品の前記カバー電極(2)または前記ベース電極(4)と導電接続される請求項1から請求項15のうちいずれか一項に記載のモジュール。
- 前記複数の電子部品の各々(1)は、前記モジュールの前記一つの基板(5)において列状に配置されている請求項1から請求項16のうちいずれか一項に記載のモジュール。
- 前記複数の電子部品の各々(1)において、前記カバー電極(2)は、前記カバー電極(2)が前記光学活性層(3)を超えて突出している面に対して直角となっている面において前記光学活性層(3)を超えて突出しており、前記カバー電極(2)は、前記光学活性層(3)を超えて突出し、前記ベース電極(4)は、前記複数の電子部品の各々(1)の反対の面において、前記光学活性層(3)を超えて突出し、前記複数の電子部品の各々(1)は、前記一つの基板(5)上で互いから離間されて直角に配置されているので、前記複数の電子部品の各々(1)同士の間の前記一つの基板(5)上には自由基板表面(6)が形成され、第1の折り曲げに対して直角に折り曲げると、互いに上下に配置されている前記複数の電子部品の各々(1)の前記ベース電極(4)および前記カバー電極(2)は、前記自由基板表面(6)の領域において平面状に互いに接触して、導電接触が構築され、前記複数の電子部品の各々(1)は直列に電気接続される請求項17に記載のモジュール。
- 弾性を有しており変形可能な担体(11)の一面にスリット(11´)が形成されており、モジュール(12)の折り曲げ部分(10)は前記スリット(11´)に導き入れられて締め付けられるように保持される請求項1から請求項18のうちいずれか一項に記載のモジュール。
- 前記スリット(11´)は、前記担体(11)において互いに対して平行になるように形成され、各スリット(11´)は、前記モジュール(12)の一の折り曲げ部分(10)と対応付けられている請求項19に記載のモジュール。
- 前記モジュール(12)は、前記折り曲げ部分(10)が前記スリット(11´)内に締め付けられることによって、前記担体(11)の表面と平面状に接触するように保持される請求項19または請求項20に記載のモジュール。
- 前記一つの基板(5)は、前記複数の電子部品の各々(1)同士の間において、前記自由基板表面(6)の領域に、開口、および少なくとも一部の領域における低減された厚みの少なくとも一方を有する請求項1から請求項21のうちいずれか一項に記載のモジュール。
- 前記開口および前記低減された厚みの少なくとも一方は、直線に沿って配置または形成される請求項22に記載のモジュール。
- 請求項1から請求項23のうちいずれか一項に記載のモジュールを製造する方法であって、可撓性を有する平面状の一つの基板(5)に、互いに対して隣接すると共に互いから離間されるようにベース電極(4)が形成され、光学活性層(3)が前記ベース電極(4)の上に形成され、カバー電極(2)が前記光学活性層(3)の上に形成され、前記ベース電極(4)は電子部品(1)の片側において前記光学活性層(3)を超えて突出し、前記カバー電極(2)は前記複数の電子部品の各々(1)の反対側において前記光学活性層(3)を超えて突出しており、前記複数の電子部品の各々(1)は前記一つの基板(5)上で離間して配置され、前記複数の電子部品の各々(1)同士の間の前記一つの基板(5)上には、自由基板表面(6)が形成されていて、
前記複数の電子部品の各々(1)が形成された後、前記自由基板表面(6)の領域において前記一つの基板(5)は折り曲げられて、任意のベース電極(4)の領域は、前記複数の電子部品のうち隣接する電子部品(1)のカバー電極(2)の領域と平面状に導電接触させて、前記複数の電子部品の各々(1)を直列に電気接続する方法。 - 前記カバー電極(2)、前記光学活性層、および前記ベース電極(4)の少なくとも1つは、薄膜形成プロセスまたはインプリンティングによって形成される請求項24に記載の方法。
- 前記カバー電極(2)、前記光学活性層、および、前記ベース電極(4)を形成する場合に、前記一つの基板(5)は、ロールから引き出されて、別のロールに再度巻き取られる請求項24または請求項25に記載の方法。
- 前記一つの基板(5)上に形成された前記複数の電子部品の各々(1)は、折り曲げた後で、導電接続され、形成される直列電気接続の電気抵抗が決定される請求項24から請求項26のうちいずれか一項に記載の方法。
- 欠陥を有する電子部品(1)は、前記一つの基板(5)から分離されて、分離箇所は材料を連続させて再度接続される請求項27に記載の方法。
- 前記接続は、導電接着剤を用いて行われる請求項28に記載の方法。
- 欠陥を有する電子部品(1)は、前記一つの基板(5)の下方に配置されるように折り曲げられて、この欠陥を有する電子部品(1)に隣接する2つの電子部品(1)は互いに、前記一つの基板(5)を折り曲げることによって、導電接続される請求項27に記載の方法。
- 前記一つの基板(5)の外側周縁に位置している自由周縁は、端縁を保護するように、折り曲げられる請求項24から請求項27のうちいずれか一項に記載の方法。
- 折り曲げの後、前記モジュールは、少なくとも2つの部材(7)の間で、少なくとも折り曲げ部分(10)の領域において、圧縮される請求項24から請求項31のうちいずれか一項に記載の方法。
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DE102007034252A DE102007034252B4 (de) | 2007-07-19 | 2007-07-19 | Modul und Verfahren zu seiner Herstellung |
PCT/DE2008/001175 WO2009010052A2 (de) | 2007-07-19 | 2008-07-17 | Modul und verfahren zu seiner herstellung |
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DE102010038869A1 (de) | 2010-08-04 | 2012-02-23 | Robert Bosch Gmbh | Photovoltaikmodul |
DE102012109777A1 (de) * | 2012-10-15 | 2014-04-17 | Heliatek Gmbh | Verfahren zum Bedrucken optoelektronischer Bauelemente mit Stromsammelschienen |
US9378450B1 (en) * | 2014-12-05 | 2016-06-28 | Vivalnk, Inc | Stretchable electronic patch having a circuit layer undulating in the thickness direction |
JP5933061B1 (ja) * | 2015-03-13 | 2016-06-08 | 株式会社東芝 | 太陽電池モジュール |
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US4019924A (en) | 1975-11-14 | 1977-04-26 | Mobil Tyco Solar Energy Corporation | Solar cell mounting and interconnecting assembly |
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JPS60245158A (ja) | 1984-05-18 | 1985-12-04 | Matsushita Electric Ind Co Ltd | 薄膜太陽電池 |
DE69824786T2 (de) * | 1997-04-21 | 2005-07-14 | Canon K.K. | Solarzellenmodul und Verfahren zu dessen Herstellung |
US20080011350A1 (en) * | 1999-03-30 | 2008-01-17 | Daniel Luch | Collector grid, electrode structures and interconnect structures for photovoltaic arrays and other optoelectric devices |
JP2001332752A (ja) * | 2000-05-19 | 2001-11-30 | Canon Inc | 太陽電池モジュール、その搬送方法、その施工方法および太陽光発電装置 |
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JP4024161B2 (ja) * | 2003-02-12 | 2007-12-19 | 三洋電機株式会社 | 太陽電池モジュールの製造方法 |
JP2004342768A (ja) | 2003-05-14 | 2004-12-02 | Matsushita Electric Ind Co Ltd | 薄膜太陽電池モジュール |
US7271534B2 (en) * | 2003-11-04 | 2007-09-18 | 3M Innovative Properties Company | Segmented organic light emitting device |
US20050170735A1 (en) * | 2004-02-04 | 2005-08-04 | Strip David R. | Manufacture of flat panel light emitting devices |
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