JP5209249B2 - Copper manufacturing method - Google Patents
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- JP5209249B2 JP5209249B2 JP2007203517A JP2007203517A JP5209249B2 JP 5209249 B2 JP5209249 B2 JP 5209249B2 JP 2007203517 A JP2007203517 A JP 2007203517A JP 2007203517 A JP2007203517 A JP 2007203517A JP 5209249 B2 JP5209249 B2 JP 5209249B2
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 343
- 239000010949 copper Substances 0.000 title claims description 255
- 229910052802 copper Inorganic materials 0.000 title claims description 252
- 238000004519 manufacturing process Methods 0.000 title claims description 41
- 238000004090 dissolution Methods 0.000 claims description 79
- 238000000034 method Methods 0.000 claims description 66
- 239000000243 solution Substances 0.000 claims description 57
- 239000007788 liquid Substances 0.000 claims description 44
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 38
- 229910000510 noble metal Inorganic materials 0.000 claims description 35
- 238000002386 leaching Methods 0.000 claims description 31
- 238000001914 filtration Methods 0.000 claims description 23
- 239000003792 electrolyte Substances 0.000 claims description 22
- 239000012535 impurity Substances 0.000 claims description 19
- 238000000746 purification Methods 0.000 claims description 15
- 239000000706 filtrate Substances 0.000 claims description 14
- 239000002245 particle Substances 0.000 claims description 14
- 238000000227 grinding Methods 0.000 claims description 12
- 229910052709 silver Inorganic materials 0.000 claims description 12
- 239000002699 waste material Substances 0.000 claims description 12
- 239000010970 precious metal Substances 0.000 claims description 11
- 239000007800 oxidant agent Substances 0.000 claims description 10
- 238000011084 recovery Methods 0.000 claims description 10
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 9
- 239000008151 electrolyte solution Substances 0.000 claims description 9
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 8
- 238000010298 pulverizing process Methods 0.000 claims description 8
- 239000002994 raw material Substances 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 8
- 229910052737 gold Inorganic materials 0.000 claims description 7
- 239000010931 gold Substances 0.000 claims description 7
- 229910052763 palladium Inorganic materials 0.000 claims description 6
- 229910052697 platinum Inorganic materials 0.000 claims description 6
- 238000009692 water atomization Methods 0.000 claims description 5
- 238000009826 distribution Methods 0.000 claims description 4
- 238000006467 substitution reaction Methods 0.000 claims description 4
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 230000001590 oxidative effect Effects 0.000 claims description 3
- 229910052703 rhodium Inorganic materials 0.000 claims description 3
- 239000010948 rhodium Substances 0.000 claims description 3
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052707 ruthenium Inorganic materials 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 43
- 238000005868 electrolysis reaction Methods 0.000 description 36
- 238000001556 precipitation Methods 0.000 description 16
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 239000002244 precipitate Substances 0.000 description 9
- 239000007921 spray Substances 0.000 description 8
- 238000002347 injection Methods 0.000 description 7
- 239000007924 injection Substances 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 230000002829 reductive effect Effects 0.000 description 7
- 229910052785 arsenic Inorganic materials 0.000 description 6
- 238000001816 cooling Methods 0.000 description 6
- 230000000670 limiting effect Effects 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 238000005507 spraying Methods 0.000 description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000000155 melt Substances 0.000 description 4
- 239000010944 silver (metal) Substances 0.000 description 4
- 239000002002 slurry Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 229910052787 antimony Inorganic materials 0.000 description 3
- 238000000889 atomisation Methods 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 3
- 229910000365 copper sulfate Inorganic materials 0.000 description 3
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 3
- 229910052745 lead Inorganic materials 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000003570 air Substances 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 229910001882 dioxygen Inorganic materials 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000005363 electrowinning Methods 0.000 description 2
- 238000009689 gas atomisation Methods 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 229910000037 hydrogen sulfide Inorganic materials 0.000 description 2
- 230000002401 inhibitory effect Effects 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052711 selenium Inorganic materials 0.000 description 2
- 239000011669 selenium Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052714 tellurium Inorganic materials 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000002351 wastewater Substances 0.000 description 2
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 238000003723 Smelting Methods 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 238000011001 backwashing Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- HTXDPTMKBJXEOW-UHFFFAOYSA-N dioxoiridium Chemical compound O=[Ir]=O HTXDPTMKBJXEOW-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910000457 iridium oxide Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000006193 liquid solution Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000007873 sieving Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000003828 vacuum filtration Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Electrolytic Production Of Metals (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Powder Metallurgy (AREA)
Description
本発明は、粗銅を粉体化処理した粗銅粉を用いた新規な電気銅の製造方法に関する。 The present invention relates to a novel method for producing electrolytic copper using crude copper powder obtained by pulverizing crude copper.
従来より、粗銅を電気銅にする電解精製プロセスとしては、例えば、図1に示すように、電解槽4内の銅電解液3中で、粗銅からなるアノード1から高純度の銅板からなるカソード2に直流電流を流すことにより、アノード1中の銅分が溶解してカソード2に移行し、カソード板の表面に電気銅(純銅)として析出するものである。
前記粗銅中には、通常貴金属等が含まれており、これら貴金属は電解精製過程でスライムとして電解槽の底に沈降し堆積している。この沈降し堆積したスライムを別途処理することにより貴金属、及び不純物を回収している。
Conventionally, as an electrolytic purification process for converting crude copper to electrolytic copper, for example, as shown in FIG. 1, in a copper electrolyte 3 in an electrolytic cell 4, an anode 1 made of crude copper to a cathode 2 made of a high-purity copper plate. When a direct current is passed through, the copper content in the anode 1 dissolves and moves to the cathode 2 and deposits as electrolytic copper (pure copper) on the surface of the cathode plate.
The crude copper usually contains noble metals and the like, and these noble metals settle and deposit on the bottom of the electrolytic cell as slime during the electrolytic purification process. Precious metals and impurities are recovered by separately treating the sedimented and accumulated slime.
しかし、前記従来の方法では、アノードとカソードとの間隔は、単位面積当たりの生産性を向上させるためには、短いことが好ましいが、短すぎるとショートが発生しやすくなる。そして、ショートが発生すると電流効率が低下すると共に、ノジュール(こぶ)等の発生により、カソードの外観形状の悪化、スライムの巻き込み等により不純物の増加が生じる。
また、電解による銅析出量は電流の大きさに比例するので、電流密度を大きくすると生産能力が増加するが、スライム及び銅電解液の巻き込みにより電気銅中の不純物レベルが増加し、電気銅の品質が悪化する。また、アノード隣接部分の電解液でCuイオンが飽和し、導電性のないCuSO4・5H2Oの結晶が析出し、Cuの溶出ができなくなる不働態現象が発生し、電解効率上の制約が生じる。更に、粗銅中に微量に含まれている貴金属は最終工程までいかないと回収することができず、貴金属の回収が遅くなってしまうという課題がある。
However, in the conventional method, the distance between the anode and the cathode is preferably short in order to improve the productivity per unit area. However, if the distance is too short, a short circuit is likely to occur. When a short circuit occurs, current efficiency is reduced, and generation of nodules or the like causes an increase in impurities due to deterioration of the external shape of the cathode, entrainment of slime, and the like.
In addition, since the amount of copper deposited by electrolysis is proportional to the magnitude of the current, increasing the current density increases the production capacity, but the inclusion of slime and copper electrolyte increases the level of impurities in the electrolytic copper, and Quality deteriorates. In addition, Cu ions are saturated in the electrolyte solution adjacent to the anode, non-conductive CuSO 4 · 5H 2 O crystals are precipitated, and a passive state phenomenon in which Cu cannot be eluted occurs, resulting in restrictions on electrolytic efficiency. Arise. Furthermore, there is a problem in that the noble metal contained in a trace amount in the crude copper cannot be recovered unless the final process is reached, and the recovery of the noble metal is delayed.
銅品位の高い高純度銅を直接製造できる方法として、例えば特許文献1に記載の方法が開示されている。この方法は、銅アノードを用いた銅の電解精製後に得られる銅濃度が25g/L以上の硫酸酸性の銅電解液から、金属基体に貴金属系金属酸化物が被覆されたものからなる不溶性アノードを用いて、電解採取により、電気銅を得る。好ましくは、不溶性アノードは、酸化イリジウムを被覆したチタン板である。また、好ましくは、アノード及びカソードに対して平行に銅電解液を流すものである。
しかし、この方法においては、鋳造したアノード板を用いているので、大型の溶解設備が必要となり、貴金属を早期に回収することができず、及び不純物を電解前に除去することは困難であるのが実情である。
As a method for directly producing high-purity copper having a high copper quality, for example, a method described in Patent Document 1 is disclosed. In this method, an insoluble anode composed of a sulfuric acid acidic copper electrolyte having a copper concentration of 25 g / L or more obtained after electrolytic purification of copper using a copper anode is coated with a noble metal based metal oxide. Used to obtain electrolytic copper by electrowinning. Preferably, the insoluble anode is a titanium plate coated with iridium oxide. Preferably, the copper electrolyte is made to flow in parallel with the anode and the cathode.
However, in this method, since a cast anode plate is used, a large melting facility is required, noble metals cannot be recovered early, and impurities are difficult to remove before electrolysis. Is the actual situation.
本発明は、貴金属を早期に回収でき、該貴金属の有効利用が早期に図れ、不純物を電解前に除去することができ、硫酸(銅溶液)を繰り返し使用して効率よく高純度な電気銅を製造することができる銅の製造方法を提供することを目的とする。
また、本発明は、いわゆる鋳造したアノード板を用いないので、大型の溶解設備を用いずとも、銅の溶解効率を向上させることができる銅の製造方法を提供することを目的とする。
The present invention can recover a noble metal early, can effectively use the noble metal early, can remove impurities before electrolysis, and can efficiently use high-purity electrolytic copper by repeatedly using sulfuric acid (copper solution). It aims at providing the manufacturing method of the copper which can be manufactured.
Another object of the present invention is to provide a copper manufacturing method that can improve the copper melting efficiency without using a so-called cast anode plate without using a large melting equipment.
前記課題を解決するための手段としては、以下の通りである。即ち、
<1> 粗銅粉を、酸化剤及び硫酸を含む液に溶解させて銅溶解液を作製する銅粉溶解工程と、
前記銅溶解液を濾過し、濾液と貴金属を含む一次残渣を得る濾過工程と、
前記濾液を銅電解液とし、該銅電解液を電解して電気銅を製造する電解工程と、を含むことを特徴とする銅の製造方法である。
<2> 銅粉溶解工程と濾過工程の間に脱銀置換工程を含む前記<1>に記載の銅の製造方法である。
<3> 一次残渣を使用済み銅電解液で浸出してなる浸出液に酸化剤を添加し、一次残渣より貴金属濃度を上げた二次残渣を得る二次浸出工程を含む前記<1>から<2>のいずれかに記載の銅の製造方法である。
<4> 濾過工程における濾液の遊離硫酸濃度を下げ、不純物を除去して銅電解液を得る浄液工程を含む前記<1>から<3>のいずれかに記載の銅の製造方法である。
<5> 二次残渣から貴金属を回収する貴金属回収工程を含む前記<3>から<4>のいずれかに記載の銅の製造方法である。
<6> 貴金属が、銀、金、白金、パラジウム、ロジウム、及びルテニウムのいずれかである前記<5>に記載の銅の製造方法である。
<7> 粗銅粉が粗銅を粉体化処理したものである前記<1>から<6>のいずれかに記載の銅の製造方法である。
<8> 粉体化処理が、アトマイズ法である前記<7>に記載の銅の製造方法である。
<9> アトマイズ法が、水アトマイズ法である前記<8>に記載の銅の製造方法である。
<10> 粗銅粉の粒度分布において、粒径250μm以下の粗銅粉の質量割合が90%以上である前記<1>から<9>のいずれかに記載の銅の製造方法である。
<11> 粗銅の原料が、廃プリント基板、廃電子部品、及び廃電気部品から選択されるリサイクル原料である前記<7>から<10>のいずれかに記載の銅の製造方法である。
<12> 粗銅中における銅濃度が80質量%〜99質量%である前記<7>から<11>のいずれかに記載の銅の製造方法である。
Means for solving the problems are as follows. That is,
<1> A copper powder dissolving step in which a crude copper powder is dissolved in a liquid containing an oxidizing agent and sulfuric acid to prepare a copper solution,
Filtering the copper solution to obtain a primary residue containing the filtrate and noble metal;
And an electrolytic process of producing electrolytic copper by electrolyzing the copper electrolyte and using the filtrate as a copper electrolyte.
<2> The method for producing copper according to <1>, including a desilvering substitution step between the copper powder dissolution step and the filtration step.
<3> The above-mentioned <1> to <2 including a secondary leaching step of adding an oxidizing agent to a leachate obtained by leaching a primary residue with a spent copper electrolyte to obtain a secondary residue having a noble metal concentration higher than that of the primary residue. > The method for producing copper according to any one of the above.
<4> The method for producing copper according to any one of <1> to <3>, further including a liquid purification step in which the free sulfuric acid concentration of the filtrate in the filtration step is reduced to remove impurities to obtain a copper electrolyte.
<5> The method for producing copper according to any one of <3> to <4>, including a noble metal recovery step of recovering noble metal from the secondary residue.
<6> The method for producing copper according to <5>, wherein the noble metal is any one of silver, gold, platinum, palladium, rhodium, and ruthenium.
<7> The method for producing copper according to any one of <1> to <6>, wherein the crude copper powder is obtained by pulverizing crude copper.
<8> The copper production method according to <7>, wherein the pulverization treatment is an atomization method.
<9> The method for producing copper according to <8>, wherein the atomizing method is a water atomizing method.
<10> The method for producing copper according to any one of <1> to <9>, wherein in the particle size distribution of the coarse copper powder, a mass ratio of the coarse copper powder having a particle size of 250 μm or less is 90% or more.
<11> The method for producing copper according to any one of <7> to <10>, wherein the raw material of the crude copper is a recycled raw material selected from a waste printed board, a waste electronic component, and a waste electrical component.
<12> The copper production method according to any one of <7> to <11>, wherein the copper concentration in the crude copper is 80% by mass to 99% by mass.
本発明によると、従来における問題を解決することができ、貴金属を早期に回収でき、その有効利用が図れ、不純物を電解前に除去することができ、粗銅粉を用いることにより銅の溶解効率が向上し、硫酸(銅溶液)を繰り返し使用して効率よく電気銅を製造することができる銅の製造方法を提供することができる。また、本発明によれば、粗銅の品位が低くても、効率よく高純度な電気銅を製造することができる。 According to the present invention, conventional problems can be solved, precious metals can be recovered early, their effective use can be achieved, impurities can be removed before electrolysis, and the copper dissolution efficiency can be improved by using crude copper powder. It can improve and can provide the manufacturing method of copper which can manufacture electrolytic copper efficiently using sulfuric acid (copper solution) repeatedly. Moreover, according to the present invention, even if the quality of crude copper is low, high-purity electrolytic copper can be produced efficiently.
本発明の銅の製造方法は、少なくとも、銅粉溶解工程と、濾過工程と、電解工程とを含み、好ましくは、粗銅の粉体化工程、脱銀置換工程、二次浸出工程、浄液工程、貴金属回収工程を含み、更に必要に応じてその他の工程を含んでなる。なお、銅粉溶解工程と、濾過工程とを併せて一次浸出工程と称することもある。 The method for producing copper of the present invention includes at least a copper powder dissolving step, a filtration step, and an electrolysis step, and preferably a crude copper powdering step, a desilvering replacement step, a secondary leaching step, and a liquid purification step. , Including a noble metal recovery step, and further including other steps as necessary. In addition, a copper powder melt | dissolution process and a filtration process may be collectively called a primary leaching process.
ここで、図2は、本発明の銅の製造方法の各工程を示す図である。以下、図2を参照して、本発明の銅の製造方法の各工程について説明する。 Here, FIG. 2 is a figure which shows each process of the manufacturing method of the copper of this invention. Hereafter, with reference to FIG. 2, each process of the manufacturing method of the copper of this invention is demonstrated.
<粗銅の粉体化工程>
−粗銅−
前記粗銅の原料としては、特に制限はなく、例えば鉱山から掘り出した銅品位0.5%〜2.0%の銅鉱石を選鉱して銅品位20%〜40%に高めた銅精鉱を用いることが一般的であるが、本発明においては、廃プリント基板、廃電子部品、及び廃電気部品から選択されるリサイクル原料を用いることが、資源の有効利用を図ることができる点から好ましい。
<Powdering process of crude copper>
-Crude copper-
There is no restriction | limiting in particular as a raw material of the said rough copper, For example, the copper concentrate which selected the copper ore of the copper grade 0.5%-2.0% excavated from the mine, and raised it to the copper grade 20%-40% is used. However, in the present invention, it is preferable to use a recycled material selected from a waste printed circuit board, a waste electronic component, and a waste electrical component from the viewpoint of effective utilization of resources.
前記リサイクル原料は、粉砕、篩い分けし、これを比重差、磁力、渦電流選別、静電選別により、銅及び貴金属等を濃縮回収して銅濃縮物とし、これを乾式製錬して、粗銅の製造を行う。乾式製錬は典型的には前述の図1に示す工程などが挙げられるが、これに限定されない。
前記粗銅中には、Cu以外にも、通常、As、Ni、Pb、Sn、Zn、Fe、Sb、Bi、S、Te、Se、Au、Ag、Pt、Pdなどが微量に含まれており、これらの中でも、Au、Ag、Pt、Pdの貴金属を多く含むものが特に好ましい。
The recycled material is crushed, sieved, concentrated and recovered copper and precious metals, etc. by specific gravity difference, magnetic force, eddy current sorting, electrostatic sorting, and dry smelted into crude copper. Manufacture. The dry smelting typically includes the process shown in FIG. 1 described above, but is not limited thereto.
In addition to Cu, the crude copper usually contains trace amounts of As, Ni, Pb, Sn, Zn, Fe, Sb, Bi, S, Te, Se, Au, Ag, Pt, Pd and the like. Among these, those containing a large amount of noble metals such as Au, Ag, Pt, and Pd are particularly preferable.
前記粗銅中における銅濃度は、特に制限はなく、目的に応じて適宜選択することができ、80質量%〜99質量%が好ましく、90質量%〜99質量%がより好ましく、93質量%〜95質量%が更に好ましい。本発明の銅の製造方法によれば、このように銅濃度が低い粗銅からでも、高純度な電気銅を効率よく得ることができる。 There is no restriction | limiting in particular in the copper concentration in the said crude copper, According to the objective, it can select suitably, 80 mass%-99 mass% are preferable, 90 mass%-99 mass% are more preferable, 93 mass%-95 mass% More preferred is mass%. According to the method for producing copper of the present invention, high-purity electrolytic copper can be efficiently obtained even from crude copper having a low copper concentration.
−粉体化処理−
前記粉体化処理としては、特に制限はなく、目的に応じて適宜選択することができ、例えば湿式還元法、気相還元法、アトマイズ法などが挙げられる。これらの中でも、低コストで大量に生産できる点からアトマイズ法が特に好ましい。
-Powdering treatment-
There is no restriction | limiting in particular as said powdering process, According to the objective, it can select suitably, For example, a wet reduction method, a vapor phase reduction method, an atomization method etc. are mentioned. Among these, the atomizing method is particularly preferable because it can be produced in large quantities at a low cost.
前記アトマイズ法とは、溶融金属流に高圧のガス又は水を粉砕媒体として噴射して金属流を粉砕し、冷却し、凝固させて粗銅粉を製造する方法である。
前記粉砕媒体にガスを用いるガスアトマイズ法では、得られる粗銅粉は球形状を呈しており、不活性ガスを用いることで酸素含有量の低い粗銅粉を製造することができるが、粒径が比較的粗くなってしまう。これは、前記ガスアトマイズ法では溶融した銅の冷却速度が低いことによる。
The atomizing method is a method of producing a crude copper powder by injecting a high-pressure gas or water as a grinding medium into a molten metal stream, grinding the metal stream, cooling and solidifying it.
In the gas atomization method using a gas for the grinding medium, the obtained crude copper powder has a spherical shape, and an inert gas can be used to produce a crude copper powder having a low oxygen content, but the particle size is relatively small. It becomes rough. This is because the cooling rate of molten copper is low in the gas atomization method.
これに対し、前記粉砕媒体に水を用いる水アトマイズ法は、ガスと同じ流速でせん断しても、水の質量がガスよりも重いことより、せん断エネルギーが大きく、粒径の小さなものが製造できる。また、冷却速度を高くすることができ、粒形状は不定形で表面に凹凸の多い粉体が製造されることが多い。また、上記の理由から、表面積の大きい粒子となるため、溶融金属の冷却時に発生する水蒸気と雰囲気中の酸素の影響で、酸素含有量が比較的高い粉体が製造される。 In contrast, the water atomization method using water as the pulverizing medium can produce a product having a large shear energy and a small particle size because the mass of water is heavier than the gas even when shearing at the same flow rate as the gas. . In addition, the cooling rate can be increased, and a powder having an irregular grain shape and many irregularities on the surface is often produced. Moreover, since it becomes a particle | grain with a large surface area for said reason, the powder with comparatively high oxygen content is manufactured under the influence of the water vapor | steam which generate | occur | produces at the time of molten metal cooling, and the oxygen in atmosphere.
本発明においては、前記水アトマイズ法では、溶融金属流を略中心に流し、水ジェットをその周囲から逆円錐形状となるよう噴射し、又は溶融金属流に帯状の水ジェットを対向させたV字形状となるように噴射して、この水ジェットの収束する点(線)又はその近傍で溶融金属を粉砕している。アトマイズにおいて、溶湯と水ジェットとのなす角度は、粉砕力に大きく影響し、また、溶融金属(溶湯)の跳ね返り現象にも大きく影響するため、溶融金属流に帯状の水ジェットを対向させたV字形状となるように噴射する方が、噴射角度の調製などの自由度の点では好ましい。 In the present invention, in the water atomization method, a molten metal flow is caused to flow substantially in the center, and a water jet is jetted from its periphery so as to have an inverted conical shape, or a V-shaped water jet is opposed to the molten metal flow. The molten metal is crushed at the point (line) where the water jet converges or in the vicinity thereof by injecting it into a shape. In atomization, the angle between the molten metal and the water jet greatly affects the crushing force and also greatly affects the rebound phenomenon of the molten metal (molten metal). It is more preferable to inject so that it may become a letter shape from the point of freedom, such as adjustment of an injection angle.
ここで、前記アトマイズ処理に使用するアトマイズ装置の例としては、図3に示すように、溶融した粗銅を保持し、傾転できる保持炉から樋16をつたって溶融した溶融銅流を受け、貯留するタンディッシュ10と、該タンディッシュ10の底部のノズル11より溶融銅流を流下して、該流下している溶融銅流に対し高圧の水又は空気を吐出して溶融銅流を粉状化する噴霧部12と、該噴霧部12の下方にあって、粉状化した粗銅粉を冷却し、貯蔵し、搬出する貯蔵部13とを有している。図3中、14はストッパー、15はタンディッシュ10内の溶融銅を保温するためのバーナー、17は邪魔板棒を表す。
また別の装置の例としては、ルツボを有する炉内のルツボ底部に溶湯ノズル孔を空け、上述と同様にノズルより出湯してもよい。
Here, as an example of the atomizing apparatus used for the atomizing process, as shown in FIG. 3, the molten copper flow is retained by holding a molten iron flow from a holding furnace capable of holding and tilting molten copper. The molten copper flow is made to flow down from the tundish 10 and the nozzle 11 at the bottom of the tundish 10, and the molten copper flow is pulverized by discharging high-pressure water or air to the flowing molten copper flow. The spraying part 12 to be used, and the storage part 13 which is below the spraying part 12 and cools, stores and carries out the powdered crude copper powder. In FIG. 3, 14 is a stopper, 15 is a burner for keeping the molten copper in the tundish 10 warm, and 17 is a baffle plate bar.
As another example of the apparatus, a molten metal nozzle hole may be formed at the bottom of the crucible in the furnace having the crucible, and the hot water may be discharged from the nozzle in the same manner as described above.
更に、水アトマイズ法について詳細に説明する。まず、粗銅を溶解しこの溶融粗銅をタンディッシュ10の底部ノズル11から流下して溶融銅流の流れを形成し、この溶融銅流の流れに対し水ジェットを噴射する。この溶融銅の温度は銅の溶融温度(約1083℃)に対して50℃以上高温とすることが好ましく、150℃以上高温とするのがより好ましい。前記溶融温度が、150℃未満であると、不純物の多い溶融銅流の粘度が高すぎてスムースに流れができないことがある。また、タンディッシュ10から溶融銅流を流下する際には、その底部にノズル11を設け、該ノズル11より溶融銅流を流下させるのが一般的であるが、前記ノズル径は直径0.5mm〜30mmが好ましく、0.5mm〜20mmがより好ましく、3mm〜15mmが更に好ましく、3mm〜10mmが特に好ましい。また、ノズル形状は円形でなくてもよいが、その面積は前記円形の場合の面積と同等の範囲であることが好ましい。この範囲を外れると溶融銅流の流量の調節が困難となると共に、溶融銅流の詰まりが生じるおそれがある。また、前記ノズル径が大きすぎると微細な粒系の粉末を製造するのが困難となるからである。
また、ノズルは複数あってもよく、前記溶融銅流量は1ノズルあたり10kg/min〜60kg/minが好ましく、20kg/min〜50kg/minがより好ましい。
溶融銅の噴射流速(圧力)は、吐出水流速を決める要因となり、吐出水流の流速としては、100m/s以上が好ましく、200m/s以上がより好ましい。
水量は、水/溶体比で2以上が好ましく、3以上がより好ましく、4以上が更に好ましい。前記水/溶体比が不十分では、十分な粉砕効果が得られず、粗粉となりやすい。また、水溶体比を高くすることで、発生する水蒸気量を低減できる。
総溶体流量は、上記関係のバランスをとれば出湯量については、特に制限はなく、目的に応じて適宜選択することができ、例えば60kg/min〜80kg/min程度が好ましい。
Further, the water atomization method will be described in detail. First, the crude copper is melted, and the molten crude copper is flowed down from the bottom nozzle 11 of the tundish 10 to form a molten copper flow, and a water jet is injected into the molten copper flow. The temperature of the molten copper is preferably 50 ° C. or higher and more preferably 150 ° C. or higher with respect to the copper melting temperature (about 1083 ° C.). When the melting temperature is less than 150 ° C., the viscosity of the molten copper stream containing many impurities may be too high to smoothly flow. In addition, when the molten copper flow is caused to flow down from the tundish 10, a nozzle 11 is generally provided at the bottom thereof, and the molten copper flow is caused to flow down from the nozzle 11, but the nozzle diameter is 0.5 mm in diameter. -30 mm is preferable, 0.5 mm to 20 mm is more preferable, 3 mm to 15 mm is still more preferable, and 3 mm to 10 mm is particularly preferable. Further, the nozzle shape may not be circular, but the area thereof is preferably in a range equivalent to the area in the case of the circular shape. Outside this range, it becomes difficult to adjust the flow rate of the molten copper flow, and the molten copper flow may be clogged. Further, if the nozzle diameter is too large, it is difficult to produce fine granular powder.
Moreover, there may be a plurality of nozzles, and the molten copper flow rate is preferably 10 kg / min to 60 kg / min, more preferably 20 kg / min to 50 kg / min per nozzle.
The injection flow rate (pressure) of the molten copper is a factor that determines the discharge water flow rate, and the flow rate of the discharge water flow is preferably 100 m / s or more, and more preferably 200 m / s or more.
The amount of water is preferably 2 or more, more preferably 3 or more, and still more preferably 4 or more in terms of water / solution ratio. If the water / solution ratio is insufficient, a sufficient pulverization effect cannot be obtained, and a coarse powder tends to be obtained. Moreover, the amount of water vapor | steam generated can be reduced by making water solution ratio high.
The total solution flow rate is not particularly limited as long as the above relationship is balanced, and can be appropriately selected according to the purpose, and is preferably about 60 kg / min to 80 kg / min, for example.
前記水ジェットの噴射条件として、その水圧は10MPa〜100MPaが好ましく、20MPa〜50MPaがより好ましい。前記水圧が10MPa未満であると、粗銅粉の粒径を微細化することができなくなることがあり、前記水圧が10MPa以上であれば粒径の微細化、表面の平滑化が可能となるが、水圧が100MPaを超えるような高圧では噴射させる装置が大掛かりとなり現実的ではなくなる。また、前記水圧を上記範囲とすることに加え、水流量は50L/min〜1,000L/minが好ましく、300L/min〜600L/minがより好ましい。前記水流量が、50L/min未満であると、発生水蒸気の巻き上げが生じて、粗銅粉の酸化が促進され酸素含有量が大きくなることがあり、1,000L/minを超えると、粉末の過冷却が生じると共に装置的にも困難となる。 As the injection conditions of the water jet, the water pressure is preferably 10 MPa to 100 MPa, more preferably 20 MPa to 50 MPa. If the water pressure is less than 10 MPa, the particle size of the coarse copper powder may not be refined, and if the water pressure is 10 MPa or more, the particle size can be refined and the surface smoothed. At a high pressure such that the water pressure exceeds 100 MPa, the spraying apparatus becomes large and unrealistic. Moreover, in addition to making the said water pressure into the said range, 50 L / min-1,000 L / min are preferable, and 300 L / min-600 L / min are more preferable. When the water flow rate is less than 50 L / min, the generated water vapor is wound up, and the oxidation of the crude copper powder is promoted to increase the oxygen content. Cooling occurs and the apparatus becomes difficult.
噴霧部12の噴射ノズルから噴射する水ジェット流の形状としては、扇状かつ平面状に噴射され、図4に示すように3個の噴射ノズル100,100,100を用いた逆3角錐形状、或いは図5に示すように4個の噴射ノズル100,100,100,100を用いた逆4角錐形状が好ましい。
図4では、3個の噴射ノズル100,100,100より3方向から水を扇状かつ平面状に噴射し、水の噴射で逆3角錐状の形状を形成し、その略中心部に溶融銅流101を流下して、粉砕する。
図5では、4個の噴射ノズル100,100,100,100より4方向から水を扇状かつ平面状に噴射し、水の噴射で逆4角錐状の形状を形成し、その略中心部に溶融銅流101を流下して、粉砕する。
また、図6に示すように、噴射ノズル100から噴出する水ジェット流の扇状の頂角θは10°〜30°が好ましく、15°〜25°がより好ましい。前記頂角θが、10°未満であると、溶融銅流が水ジェット流から外れる場合があり、ある程度の角度で広げて、溶融銅流と水ジェットが確実に衝突する必要がある。また、その角度が広すぎても、水ジェット流が無駄に広がるため、有効でない水流が存在してしまう。
As the shape of the water jet flow ejected from the spray nozzle of the spray section 12, it is sprayed in a fan shape and in a planar shape, and as shown in FIG. 4, an inverted triangular pyramid shape using three spray nozzles 100, 100, 100, or As shown in FIG. 5, an inverted quadrangular pyramid shape using four injection nozzles 100, 100, 100, 100 is preferable.
In FIG. 4, water is sprayed in three directions from three spray nozzles 100, 100, 100 in a fan shape and a flat shape, and an inverted trigonal pyramid shape is formed by the water spray. Flow down 101 and grind.
In FIG. 5, water is sprayed in four directions from the four spray nozzles 100, 100, 100, 100 in a fan-like and flat shape, and an inverted quadrangular pyramid shape is formed by the water spray, and is melted at a substantially central portion thereof. The copper stream 101 flows down and is crushed.
Further, as shown in FIG. 6, the fan-like apex angle θ of the water jet flow ejected from the ejection nozzle 100 is preferably 10 ° to 30 °, and more preferably 15 ° to 25 °. When the apex angle θ is less than 10 °, the molten copper flow may deviate from the water jet flow, and it is necessary to spread the molten copper flow at a certain angle so that the molten copper flow and the water jet collide with each other. Moreover, even if the angle is too wide, the water jet flow unnecessarily spreads, so that there is an ineffective water flow.
前記粉体化処理により得られる粗銅粉の粒度分布において、粒径250μm以下の粗銅粉の質量割合は90%以上が好ましく、粒径106μm以下の粗銅粉の質量割合が90%以上であることがより好ましい。前記粒径が大きすぎると、後述する銅粉溶解工程において粗銅粉の溶解速度が遅くなって効率が悪くなることがある。 In the particle size distribution of the crude copper powder obtained by the powdering treatment, the mass ratio of the coarse copper powder having a particle size of 250 μm or less is preferably 90% or more, and the mass ratio of the crude copper powder having a particle size of 106 μm or less is 90% or more. More preferred. If the particle size is too large, the dissolution rate of the coarse copper powder may be slowed in the copper powder dissolving step described later, resulting in poor efficiency.
<一次浸出工程>
前記一次浸出工程は、銅粉溶解工程と、濾過工程とを含み、必要に応じて脱銀置換工程を含んでいてもよい。
<Primary leaching process>
The primary leaching step includes a copper powder dissolution step and a filtration step, and may include a desilvering replacement step as necessary.
−銅粉溶解工程−
前記銅粉溶解工程は、前記粉体化工程で得られた粗銅粉を、酸化剤及び硫酸を含む液に溶解させて銅溶解液を作製する工程である
前記酸化剤としては、例えば酸素ガス、空気、過酸化水素、などが挙げられる。
前記銅粉溶解工程で得られる銅溶解液の銅濃度は、50g/L〜150g/Lが好ましく、70g/L〜140g/Lがより好ましい。前記銅濃度が、50g/L未満であると、後工程で銅電解液を調製するときに濃度が低すぎて好ましくないことがあり、150g/Lを超えると、温度によっては硫酸銅の析出が生じることがある。
-Copper powder dissolution process-
The copper powder dissolving step is a step of preparing a copper solution by dissolving the crude copper powder obtained in the powdering step in a liquid containing an oxidizing agent and sulfuric acid. As the oxidizing agent, for example, oxygen gas, Air, hydrogen peroxide, etc. are mentioned.
The copper concentration of the copper solution obtained in the copper powder dissolving step is preferably 50 g / L to 150 g / L, and more preferably 70 g / L to 140 g / L. When the copper concentration is less than 50 g / L, the concentration may be too low when the copper electrolyte is prepared in a later step, and when it exceeds 150 g / L, copper sulfate may be precipitated depending on the temperature. May occur.
前記銅粉溶解工程は、特に制限はなく、目的に応じて適宜選択することができるが、例えば、以下に説明する粗銅粉を溶解する溶解槽を用いて粗銅粉を溶解する。更に必要に応じて、溶解槽で溶解し残った残粗銅粉を沈殿させて再度溶解槽に戻す沈殿槽を用いて行っても構わない。 There is no restriction | limiting in particular in the said copper powder melt | dissolution process, Although it can select suitably according to the objective, For example, a crude copper powder is melt | dissolved using the dissolution tank which melt | dissolves the crude copper powder demonstrated below. Further, if necessary, the precipitation may be carried out using a precipitation tank in which the remaining crude copper powder remaining after dissolution in the dissolution tank is precipitated and returned to the dissolution tank again.
ここで、前記銅溶解液を作製する溶解槽30は、図7に示すように、銅溶解液を貯留する溶解槽本体31と、本体の内側には、邪魔板32が配置され、銅溶解液の攪拌のための攪拌機33が配置されている。攪拌機33は、回転数の制御可能とし、タービン羽4枚が1段となっている。また、貯留している液の温度の昇降、恒温制御を可能としている。溶解槽には、側壁に液の一部を流出し、沈殿槽35に送液する配管34がある。沈殿槽35は、溶解槽30で溶解し残った残粗銅粉が液とともに流入され、残粗銅粉を沈降させ、溶解槽30に戻すポンプ36を備えてある。図7中、37は粗銅粉供給ホッパ、38は酸化剤供給としてのエアー噴出器を表す。 Here, as shown in FIG. 7, the dissolution tank 30 for preparing the copper dissolution liquid has a dissolution tank main body 31 for storing the copper dissolution liquid, and a baffle plate 32 is disposed inside the main body. A stirrer 33 is disposed for stirring. The stirrer 33 can control the number of rotations, and four turbine blades are in one stage. In addition, the temperature of the stored liquid can be raised and lowered and controlled at a constant temperature. In the dissolution tank, there is a pipe 34 through which a part of the liquid flows out to the side wall and is sent to the precipitation tank 35. The settling tank 35 is provided with a pump 36 into which the remaining coarse copper powder that has been dissolved in the dissolving tank 30 flows in together with the liquid, precipitates the remaining coarse copper powder, and returns it to the dissolving tank 30. In FIG. 7, reference numeral 37 denotes a coarse copper powder supply hopper, and 38 denotes an air ejector as an oxidant supply.
なお、粗銅粉の溶解効率を向上させるため、必要に応じて沈殿槽を用いて溶解を促進させてもよい。溶解を開始から数分間後には、溶解途中である残銅粉が浮遊してくるため、これを液とともに沈殿槽35に送液する。そのため、配管34の溶解槽30側の開口は、銅溶解液液面付近が好ましい。沈殿槽35では、攪拌機がないため残粗銅粉は送液後にすぐに沈降始め、沈殿槽の底部周辺に堆積する。これを底部より液とともに抜き出し、ポンプ36を介して溶解槽30に液と残粗銅粉を投入する。この際、溶解槽30の底部に戻すことが好ましい。 In addition, in order to improve the melt | dissolution efficiency of rough copper powder, you may promote melt | dissolution using a precipitation tank as needed. After several minutes from the start of dissolution, the remaining copper powder that is in the middle of dissolution floats, and is sent to the precipitation tank 35 together with the liquid. Therefore, the opening on the side of the dissolution tank 30 of the pipe 34 is preferably near the copper solution liquid surface. In the settling tank 35, since there is no stirrer, the remaining coarse copper powder begins to settle immediately after the liquid is fed and is deposited around the bottom of the settling tank. This is extracted together with the liquid from the bottom, and the liquid and the remaining coarse copper powder are put into the dissolution tank 30 via the pump 36. At this time, it is preferable to return to the bottom of the dissolution tank 30.
図7に示すように、溶解槽30に沈殿槽35を配置し、沈殿槽にて沈殿させた粗銅粉を溶解槽30に送り、再度溶解反応をさせる。このように未溶解の粗銅粉を巡回させながら粗銅粉を溶解すると銅の溶解効率が顕著に向上し、溶解時間の短縮が可能となり、製造コストの大幅な削減が可能となる。銅溶解液は、次工程の濾過工程に送液される。 As shown in FIG. 7, the precipitation tank 35 is arrange | positioned in the dissolution tank 30, and the coarse copper powder precipitated in the precipitation tank is sent to the dissolution tank 30, and a dissolution reaction is carried out again. When the crude copper powder is dissolved while circulating the undissolved crude copper powder in this manner, the copper dissolution efficiency is remarkably improved, the dissolution time can be shortened, and the manufacturing cost can be greatly reduced. The copper solution is sent to the subsequent filtration step.
−濾過工程−
前記濾過工程は、銅粉溶解槽の銅粉溶解スラリーを含む銅溶解液を、濾過する工程である。ここで銅が溶け込んだ銅溶解液に溶けず、沈殿物として残ったものを濾過し、一次残渣を得る。
-Filtration process-
The said filtration process is a process of filtering the copper solution containing the copper powder melt | dissolution slurry of a copper powder melt | dissolution tank. Here, what is not dissolved in the copper solution in which copper is dissolved but remains as a precipitate is filtered to obtain a primary residue.
−脱銀置換工程−
前記銅粉溶解工程と前記濾過工程の間に、脱銀置換工程を含んでいてもよい。この脱銀置換工程は、銅溶解槽の銅粉溶解スラリーを含む溶液を、銅粉溶解槽から脱銀置換槽に送液し、この脱銀置換槽の中で処理する工程である。
ここでは、銅が溶け込んだ銅溶解液中に、微量に溶解している銀、及びその他の貴金属を、銅粉溶解スラリー中にある未溶解銅粉で、セメンテーションして、溶解分の銀、貴金属を固体化する工程となる。銅粉溶解槽で温度をかけて、酸化すると、銅以外に銀等が微量に溶け出すためそれを戻す役目もある。脱銀置換槽は、低攪拌のみで、酸素の吹き込みを行わず、一定の滞留時間でセメンテーションを行うものである。その後、前記セメンテーションによる沈殿物を濾過して貴金属を含む一次残渣を得る。
前記濾過の方法としては、特に制限はなく、目的に応じて適宜選択することができるが、例えばフィルタープレス、減圧濾過などが挙げられる。
-Desilvering substitution process-
A desilvering substitution step may be included between the copper powder dissolution step and the filtration step. This desilvering and replacing step is a step in which a solution containing the copper powder dissolving slurry in the copper dissolving tank is fed from the copper powder dissolving tank to the desilvering and replacing tank and processed in the desilvering and replacing tank.
Here, in the copper solution in which copper is dissolved, silver dissolved in a trace amount and other noble metals are cemented with undissolved copper powder in the copper powder dissolution slurry, and the dissolved silver, This is a step of solidifying the noble metal. When oxidized by applying a temperature in a copper powder dissolution tank, silver and the like dissolve in a very small amount in addition to copper, and have the role of returning it. The desilvering / replacement tank performs cementation with a constant residence time without blowing oxygen with only low stirring. Thereafter, the precipitate resulting from the cementation is filtered to obtain a primary residue containing a noble metal.
The filtration method is not particularly limited and may be appropriately selected depending on the intended purpose. Examples thereof include a filter press and vacuum filtration.
なお、後述する二次浸出槽(残渣溶解槽)の濾液、及び浄液溶解槽の濾液には、大量の銀が溶け出しているため、これらの濾液は脱銀置換槽に入れ、上記銅粉溶解スラリーとともに、セメンテーションを行います。また、溶解した銀は電解では銅よりも先に電着され、電気銅品位悪化の原因になるので、一次浸出工程、及び二次浸出工程で残渣として取り出し、後述する貴金属回収工程で回収する。 Since a large amount of silver is dissolved in the filtrate of the secondary leaching tank (residue dissolution tank) and the filtrate of the purification liquid dissolution tank, which will be described later, these filtrates are put in a desilvering and replacement tank, and the above copper powder Perform cementation with the dissolved slurry. In addition, since the dissolved silver is electrodeposited prior to copper in electrolysis and causes deterioration of the quality of electrolytic copper, it is taken out as a residue in the primary leaching process and the secondary leaching process, and collected in a noble metal recovery process described later.
<二次浸出工程(残渣溶解工程)>
前記二次浸出工程は、前記一次残渣を使用済み銅電解液で浸出してなる浸出液に酸化剤を添加し、一次残渣より貴金属濃度を上げた二次残渣を得る工程であり、一次残渣中の貴金属濃度を上げるために実施される。
即ち、前記一次浸出工程の一次残渣を前記使用済み銅溶解液中に浸漬し、溶解するが、更に二次残渣(不溶性沈殿)が残存する。これを濾過し、不溶性沈殿を除去する。このとき、二次残渣(不溶性沈殿)中の貴金属濃度は一次残渣よりも高くなっている。
前記酸化剤としては、例えば酸素ガス、空気、過酸化水素、などが挙げられる。
<Secondary leaching process (residue dissolution process)>
The secondary leaching step is a step of adding an oxidant to a leaching solution obtained by leaching the primary residue with a used copper electrolyte solution to obtain a secondary residue having a noble metal concentration higher than that of the primary residue. Performed to increase the concentration of noble metals.
That is, the primary residue of the primary leaching step is immersed and dissolved in the used copper solution, but a secondary residue (insoluble precipitate) remains. This is filtered to remove insoluble precipitates. At this time, the concentration of noble metal in the secondary residue (insoluble precipitate) is higher than that of the primary residue.
Examples of the oxidizing agent include oxygen gas, air, and hydrogen peroxide.
前記二次浸出工程では、前記一次浸出工程からの一次残渣(溶解残渣)を後述の電解工程で使用済みとなった銅電解液(電解尾液)を用いて浸出することが好ましい。この電解尾液は、電解において銅等の金属イオンが液中から採取されているため、遊離硫酸濃度が高く、浸出性が強い酸である。一次残渣中の銅は、ほとんど液中に浸出されるが、硫酸に溶けにくい貴金属類は二次残渣中に移行される。二次残渣は、濾過等により得られ、貴金属回収工程の原料として使用される。 In the secondary leaching step, the primary residue (dissolved residue) from the primary leaching step is preferably leached using a copper electrolyte solution (electrolytic tail solution) that has been used in an electrolysis step described later. This electrolytic tail solution is an acid having a high concentration of free sulfuric acid and a strong leachability since metal ions such as copper are collected from the solution during electrolysis. Most of the copper in the primary residue is leached into the liquid, but noble metals that are hardly soluble in sulfuric acid are transferred into the secondary residue. The secondary residue is obtained by filtration or the like and used as a raw material for the precious metal recovery step.
<貴金属回収工程>
前記貴金属回収工程は、二次残渣から貴金属を回収する工程である。
前記貴金属としては、銀、金、白金、パラジウム、ロジウム、ルテニウムなどが挙げられる。
前記二次残渣から貴金属を回収する方法としては、特に制限はなく、目的に応じて適宜選択することができるが、例えば電解精製、電解採取などが挙げられる。
<Precious metal recovery process>
The noble metal recovery step is a step of recovering noble metal from the secondary residue.
Examples of the noble metal include silver, gold, platinum, palladium, rhodium, and ruthenium.
There is no restriction | limiting in particular as a method of collect | recovering noble metals from the said secondary residue, Although it can select suitably according to the objective, For example, electrolytic purification, electrowinning, etc. are mentioned.
<浄液工程>
前記浄液工程は、前記濾過工程における濾液である前記銅溶解液の遊離硫酸濃度を下げ、銅溶解液中の不純物を除去する工程であり、電解工程の前に実施することが好ましい。
前記浄液工程において、銅溶解液を浄液溶解槽に入れ、銅粉を溶かし込み遊離硫酸濃度を0(ゼロ)に近づけることで、砒素、アンチモン、錫等の不純物の化合物が溶解度を越えた分沈殿物として落ちる。これを固液分離することで、溶解液中の不純物を効率よく除去することができる。
また、この沈殿物として落ちたものは、濾過により分離されるが、その中には、溶け残り銅粉と貴金属も少量存在するため、その回収を行うことが好ましい。このプロセスでは、フィルタープレスにて、濾過後、逆洗浄を電解後液で行うことで、不純物を再溶解させてフィルタープレス中には未溶解銅粉と貴金属を残して回収することができる。不純物を再溶解させた液は脱銅電解で、銅を回収した後は排水として、排水処理することが好ましい。
前記浄液工程においては、銅溶解液中の不純物(例えばAs、Sb)を低減する。例えば、銅溶解液に、粗銅粉を添加し、空気を液中に吹き込み、攪拌しながら銅溶解液中に粗銅粉を溶解して遊離硫酸濃度を低減した。反応後は濾過し、濾液の銅濃度を電解用に調整すれば銅電解用の電解液が得られる。このように粗銅粉を用いることにより、特に銅電解において阻害元素である砒素の除去が可能となり、硫化水素などのあらたな薬剤を用いることもないのでコストの増大を抑制することができる。
<Purification process>
The said liquid purification process is a process of reducing the free sulfuric acid concentration of the said copper solution which is a filtrate in the said filtration process, and removing the impurity in a copper solution, It is preferable to implement before an electrolysis process.
In the liquid purification step, the copper solution was put into a liquid solution dissolution tank, the copper powder was dissolved, and the free sulfuric acid concentration was brought close to 0 (zero), so that impurities such as arsenic, antimony and tin exceeded the solubility. Falls as a minute precipitate. By separating this from solid and liquid, impurities in the solution can be efficiently removed.
Moreover, although what fell as this deposit is isolate | separated by filtration, since there exists a small amount of undissolved copper powder and a noble metal in it, it is preferable to collect | recover. In this process, after filtration with a filter press, backwashing is performed with a post-electrolysis solution, so that impurities can be redissolved and recovered while leaving undissolved copper powder and noble metal in the filter press. The solution in which the impurities are redissolved is copper removal electrolysis, and after copper is recovered, it is preferably treated as waste water as waste water.
In the liquid purification step, impurities (for example, As and Sb) in the copper solution are reduced. For example, crude copper powder was added to the copper solution, air was blown into the liquid, and the crude copper powder was dissolved in the copper solution while stirring to reduce the free sulfuric acid concentration. After the reaction, the solution is filtered, and the copper concentration of the filtrate is adjusted for electrolysis to obtain an electrolytic solution for copper electrolysis. By using the crude copper powder in this manner, it is possible to remove arsenic, which is an inhibitory element, particularly in copper electrolysis, and it is possible to suppress an increase in cost because a new chemical agent such as hydrogen sulfide is not used.
<電解工程>
前記電解工程は、前記一次浸出工程又は前記浄液工程において得られた銅溶解液(濾液)を、電解用に調整された銅電解液を電解して電気銅を得る工程である。
前記一次浸出工程又は前記浄液工程の銅濃度を例えば使用済銅電解液により調整して銅電解液とする。銅電解液は、銅濃度が70g/L〜100g/L、遊離硫酸濃度が5g/L以下が好ましく、特に1g/L以下の硫酸銅溶液であり、液温は10℃〜40℃に調整されている。
前記電解工程における電解条件としては、特に制限はなく、目的に応じて適宜選択することができるが、以下の通りであることが好ましい。
〔電解条件〕
・電流密度:20A/m2〜700A/m2が好ましく、30A/m2〜400A/m2がより好ましい。
・浴電圧:0.5V〜3V
・浴温度:30℃〜80℃が好ましく、40℃〜70℃がより好ましい。
アノードとしては、例えばPb、Pb合金などが用いられる。
カソードとしては、例えば銅、ステンレスなどが用いられる。
<Electrolysis process>
The electrolysis step is a step of obtaining electrolytic copper by electrolyzing a copper solution (filtrate) obtained in the primary leaching step or the liquid purification step with a copper electrolyte adjusted for electrolysis.
The copper concentration in the primary leaching step or the liquid purification step is adjusted with, for example, a used copper electrolytic solution to obtain a copper electrolytic solution. The copper electrolytic solution is preferably a copper sulfate solution having a copper concentration of 70 g / L to 100 g / L and a free sulfuric acid concentration of 5 g / L or less, particularly 1 g / L or less, and the liquid temperature is adjusted to 10 ° C. to 40 ° C. ing.
There is no restriction | limiting in particular as electrolysis conditions in the said electrolysis process, Although it can select suitably according to the objective, It is preferable as follows.
[Electrolysis conditions]
Current density: Preferably 20A / m 2 ~700A / m 2 , 30A / m 2 ~400A / m 2 is more preferable.
・ Bath voltage: 0.5V-3V
-Bath temperature: 30 to 80 degreeC is preferable and 40 to 70 degreeC is more preferable.
As the anode, for example, Pb, Pb alloy or the like is used.
For example, copper or stainless steel is used as the cathode.
なお、液温は高いほど電力原単位が低下できるので高い方が好ましいが、表面を平滑化させる目的で添加するニカワなどの分解速度が大きくなり、設備上の温度制約、作業雰囲気、加熱コストなどの理由から、上限を設定することが好ましい。 In addition, the higher the liquid temperature, the lower the power intensity, which is preferable. However, the decomposition rate of glue added for the purpose of smoothing the surface increases, the temperature constraint on the equipment, working atmosphere, heating cost, etc. For this reason, it is preferable to set an upper limit.
前記電解工程としては、具体的には、図8に示すように、電解槽4内の銅電解液3中で、鉛系アノード1から高純度の銅板からなるカソード2に整流器を経て直流電流を流すことにより、アノード1で水が電気分解して電子がカソード2に移行し、カソード板の表面に電気銅(純銅)として析出するものである。
前記電解工程においては、従来に比べて、アノードが不働態化せず、また、アノードから発生するスライムの影響を受け難く、電気銅品位が向上する。
Specifically, as shown in FIG. 8, in the electrolytic process, the electrolysis process is performed by applying a direct current from a lead-based anode 1 to a cathode 2 made of a high-purity copper plate through a rectifier in a copper electrolyte 3 in an electrolytic cell 4. By flowing, water is electrolyzed at the anode 1, electrons move to the cathode 2, and deposit as electrolytic copper (pure copper) on the surface of the cathode plate.
In the electrolysis step, the anode is not passivated as compared with the prior art, and is less susceptible to the slime generated from the anode, so that the quality of electrolytic copper is improved.
本発明の銅の製造方法により製造された銅は、従来に比べて銅電解液に含まれる不純物(貴金属を含む)が少ないために銅品位の高い高純度なものであり、電子部品材料、電子機器材料、LSI用配線、電線等の各種分野に好適に用いられる。 The copper produced by the copper production method of the present invention has a high purity and high purity because it contains less impurities (including noble metals) in the copper electrolyte than in the past. It is suitably used in various fields such as equipment materials, LSI wiring, and electric wires.
以下、本発明の実施例について説明するが、本発明はこれらの実施例に何ら限定されるものではない。 Examples of the present invention will be described below, but the present invention is not limited to these examples.
(実施例1)
<粗銅の粉体化工程>
−粗銅の調製−
粗銅の原料として、廃プリント基板、廃電子部品、廃電気部品を回収し、これらを、粉砕、篩い分けし、これを比重差、磁力、渦電流選別、静電選別により選別し、銅を濃縮回収して銅濃縮物とし、これを転炉で処理し、粗銅を得た。この粗銅の組成を表1に示す。なお、粗銅には、表1に記載の元素以外にも、Bi、S、Te、Se、Au、Ag、Ptなどが微量に含まれていた。
Example 1
<Powdering process of crude copper>
-Preparation of crude copper-
As raw materials for crude copper, waste printed circuit boards, waste electronic components, and waste electrical components are collected, crushed and sieved, and sorted by specific gravity difference, magnetic force, eddy current sorting, and electrostatic sorting to concentrate copper. It collect | recovered and it was set as the copper concentrate, this was processed with the converter, and crude copper was obtained. The composition of this crude copper is shown in Table 1. In addition to the elements described in Table 1, the crude copper contained trace amounts of Bi, S, Te, Se, Au, Ag, Pt, and the like.
−粉体化処理−
次に、前記組成の粗銅を溶解炉にて溶融し、粗銅粉を得るためのアトマイズ処理を行った。
このアトマイズ処理に使用するアトマイズ装置は、図3に示すように溶融した粗銅を保持し、傾転できる保持炉から溶融した溶融銅を受け貯留するタンディッシュ10と、該タンディッシュの底部より溶融銅流を流下して、該流下している溶融銅流に高圧の水を吐出して溶融銅を粉状化する噴霧部12と、該噴霧部の下方には、粉状化した粗銅粉を冷却し、貯蔵し、搬出する貯蔵部13とを有している。
このアトマイズ装置を用いて、前記粗銅100kgを1150℃で溶融銅が貯留されている保持炉からタンディッシュ内に溶融銅を受け、保温しながら、直径13mmの流下口より10kg/min〜13kg/minで溶融銅流を流下して、流下された溶融銅流に対し3方吹きにより、水の圧力20MPa、流量68L/minで噴霧して、粗銅粉50kgを得た。このとき、ノズルより噴出させた水により、逆3角錐状を形成し、溶融銅流をその略中心部に流下した。
-Powdering treatment-
Next, the crude copper having the above composition was melted in a melting furnace, and an atomizing process for obtaining a coarse copper powder was performed.
As shown in FIG. 3, the atomizing apparatus used for this atomizing process holds molten copper, receives and stores molten copper melted from a tiltable holding furnace, and molten copper from the bottom of the tundish. A spraying part 12 for pulverizing molten copper by discharging high-pressure water into the flowing molten copper stream and cooling the pulverized coarse copper powder below the spraying part And a storage unit 13 for storing and unloading.
Using this atomizing device, 100 kg of the crude copper was received in a tundish from a holding furnace in which molten copper was stored at 1150 ° C., and while keeping the temperature, 10 kg / min to 13 kg / min from a downstream outlet having a diameter of 13 mm. Then, the molten copper flow was flown down and sprayed at a water pressure of 20 MPa and a flow rate of 68 L / min by three-way blowing on the flow of molten copper flow to obtain 50 kg of crude copper powder. At this time, an inverted triangular pyramid shape was formed by the water ejected from the nozzle, and the molten copper flow was allowed to flow down to its substantially central portion.
得られた粗銅粉について、目開き106μmの篩いで、篩って細粒粉側を106μmアンダー粉として得た。この際、篩いを通過した粗銅粉質量を、篩いにかけた粗銅粉との全質量で除算し、割合を百分率にして篩い下移行率として求めたところ、98質量%であった。また、篩いにより粒度分布を測定したところ、25μm未満が60質量%、25μm以上45μm未満が22質量%、45μm以上106μm未満が16質量%、106μm以上が残部であった。
得られた実施例1の106μmアンダー粉の組成は、下記表2に示す通りであった。
The obtained coarse copper powder was sieved with a sieve having an opening of 106 μm, and the fine particle side was obtained as 106 μm under powder. At this time, the mass of the coarse copper powder that passed through the sieve was divided by the total mass of the coarse copper powder that had been sieved, and the percentage was obtained as a percentage, and it was 98 mass%. Further, when the particle size distribution was measured by sieving, 60% by mass was less than 25 μm, 22% by mass was 25 μm or more and less than 45 μm, 16% by mass was 45 μm or more but less than 106 μm, and the remainder was 106 μm or more.
The composition of the obtained 106 μm under powder of Example 1 was as shown in Table 2 below.
<一次浸出工程>
−銅粉溶解工程−
上記表2に示す篩い下の粗銅粉を用い、以下のようにして溶解して銅溶解液を作製した。
図7に示すように、銅溶解液を作製する溶解槽30は、銅溶解液を貯留する溶解槽本体31と、溶解槽本体の内側には、邪魔板32が配置され、銅溶解液の攪拌のための攪拌機33が配置されている。攪拌機33は、回転数の制御可能とし、タービン羽4枚が1段となっている。また、貯留している液の温度の昇降、恒温制御を可能としている。溶解槽には、側壁に液の一部を流出し、沈殿槽35に送液する配管34がある。沈殿槽35は、溶解槽30で溶解し残った残粗銅粉が液とともに流入され、残粗銅粉を沈降させ、溶解槽30に戻すポンプ36を備えてある。図7中、37は粗銅粉供給ホッパ、38はエアー噴出器を表す。
<Primary leaching process>
-Copper powder dissolution process-
Using the crude copper powder under the sieve shown in Table 2 above, dissolution was performed as follows to prepare a copper solution.
As shown in FIG. 7, the dissolution tank 30 for producing the copper dissolution liquid includes a dissolution tank body 31 for storing the copper dissolution liquid, and a baffle plate 32 disposed inside the dissolution tank body, and stirring of the copper dissolution liquid. A stirrer 33 is arranged. The stirrer 33 can control the number of rotations, and four turbine blades are in one stage. In addition, the temperature of the stored liquid can be raised and lowered and controlled at a constant temperature. In the dissolution tank, there is a pipe 34 through which a part of the liquid flows out to the side wall and is sent to the precipitation tank 35. The settling tank 35 is provided with a pump 36 into which the remaining coarse copper powder that has been dissolved in the dissolving tank 30 flows in together with the liquid, precipitates the remaining coarse copper powder, and returns it to the dissolving tank 30. In FIG. 7, 37 represents a coarse copper powder supply hopper, and 38 represents an air jet.
溶解槽30内には、硫酸銅溶液中の銅濃度が40g/L、遊離硫酸濃度10g/Lの液100Lを用意し、これに、粗銅粉4.4kgを添加し、攪拌しながら粗銅粉を溶解した。溶解槽の設定液温は60℃として、1時間溶解反応した。
溶解を開始から数分間後には、溶解途中である残銅粉が浮遊してくるため、これを液とともに沈殿槽35に送液する。そのため、配管34の溶解槽30側の開口は、銅溶解液液面付近が好ましい。沈殿槽35では、攪拌機がないため残粗銅粉は送液後にすぐに沈降始め、沈殿槽の底部周辺に堆積する。これを底部より液とともに抜き出し、ポンプ36を介して溶解槽30に液と残粗銅粉を投入する。この際、溶解槽30の底部に戻す。
図7に示すように、溶解槽30に沈殿槽35を配置し、この沈殿槽30にて沈殿させた粗銅粉を溶解槽に送り、再度溶解反応をさせる。このように未溶解の粗銅粉を巡回させながら粗銅粉を溶解すると銅の溶解効率が顕著に向上し、溶解時間の短縮が可能となり、製造コストの大幅な削減が可能となる。
そして、溶解開始から30分間の時点での溶解槽中の銅溶解液の溶解率を以下のようにして求めた。結果を表3に示す。また、30分間の時点での残粗銅粉の組成を表4に示す。
In the dissolution tank 30, 100 L of a liquid having a copper concentration of 40 g / L and a free sulfuric acid concentration of 10 g / L in a copper sulfate solution is prepared. To this, 4.4 kg of crude copper powder is added, and the crude copper powder is stirred and stirred. Dissolved. The set liquid temperature of the dissolution tank was 60 ° C., and the dissolution reaction was performed for 1 hour.
After several minutes from the start of dissolution, the remaining copper powder that is in the middle of dissolution floats, and is sent to the precipitation tank 35 together with the liquid. Therefore, the opening on the side of the dissolution tank 30 of the pipe 34 is preferably near the copper solution liquid surface. In the settling tank 35, since there is no stirrer, the remaining coarse copper powder begins to settle immediately after the liquid is fed and is deposited around the bottom of the settling tank. This is extracted together with the liquid from the bottom, and the liquid and the remaining coarse copper powder are put into the dissolution tank 30 via the pump 36. At this time, it is returned to the bottom of the dissolution tank 30.
As shown in FIG. 7, the precipitation tank 35 is arrange | positioned in the dissolution tank 30, the coarse copper powder precipitated in this precipitation tank 30 is sent to a dissolution tank, and a dissolution reaction is made again. When the crude copper powder is dissolved while circulating the undissolved crude copper powder in this manner, the copper dissolution efficiency is remarkably improved, the dissolution time can be shortened, and the manufacturing cost can be greatly reduced.
And the melt | dissolution rate of the copper solution in a melt | dissolution tank at the time of 30 minutes from a melt | dissolution start was calculated | required as follows. The results are shown in Table 3. In addition, Table 4 shows the composition of the remaining crude copper powder at 30 minutes.
〔粗銅粉の溶解性の評価〕
溶解開始から30分間の時点での溶解槽中の銅溶解液をサンプリングし、該銅溶解液中の銅濃度をICP発光分光分析装置(島津製作所製)により分析して求めた。
溶解率(質量%)は、ICP分析により得た銅濃度値により計算して得た溶解銅量(g)を分子として、添加した粗銅粉中の銅質量(g)を分母として除算し、百分率で表した。
[Evaluation of solubility of crude copper powder]
The copper solution in the dissolution tank at 30 minutes from the start of dissolution was sampled, and the copper concentration in the copper solution was analyzed by an ICP emission spectroscopic analyzer (manufactured by Shimadzu Corporation).
The dissolution rate (% by mass) is obtained by dividing the dissolved copper amount (g) obtained by calculation based on the copper concentration value obtained by ICP analysis as a numerator and the copper mass (g) in the added crude copper powder as the denominator. Expressed in
比較として、実施例1において、沈殿槽を設けず溶解槽のみで粗銅粉の溶解を行った。溶解開始から30分間後の時点での溶解率を実施例1と同様にして求めた。結果を表3に示す。 For comparison, in Example 1, the crude copper powder was dissolved only in the dissolution tank without providing a precipitation tank. The dissolution rate at 30 minutes after the start of dissolution was determined in the same manner as in Example 1. The results are shown in Table 3.
表3の結果から、溶解槽に沈殿槽を配置し、沈殿槽にて沈殿させた粗銅粉を溶解槽に送り、再度溶解させ、巡回させながら溶解すると銅の溶解の効率が顕著に向上することがわかった。これにより、工程の時間の短縮が可能となり製造コストの大幅な削減が可能となった。なお、このときの銅溶解液中の銅濃度は約80g/Lであった。 From the results in Table 3, when a precipitation tank is placed in the dissolution tank, and the crude copper powder precipitated in the precipitation tank is sent to the dissolution tank, dissolved again, and dissolved while circulating, the efficiency of copper dissolution is significantly improved. I understood. As a result, the process time can be shortened, and the manufacturing cost can be greatly reduced. In addition, the copper concentration in the copper solution at this time was about 80 g / L.
−濾過工程−
得られた銅溶解液100Lを静かに攪拌した後、生成した沈殿を濾過により固液分離し、一次残渣を得た。この一次残渣の組成を表5に示す。
After 100 L of the obtained copper solution was gently stirred, the produced precipitate was subjected to solid-liquid separation by filtration to obtain a primary residue. The composition of this primary residue is shown in Table 5.
<二次浸出工程>
次に、一次残渣を使用済み銅電解液(銅濃度約40g/L)で浸出し、該浸出液に酸化剤として空気を添加し、貴金属濃度を上げた二次残渣を得た。この二次残渣の組成を表6に示す。
Next, the primary residue was leached with a used copper electrolyte (copper concentration of about 40 g / L), and air was added to the leaching solution as an oxidizing agent to obtain a secondary residue having an increased precious metal concentration. The composition of this secondary residue is shown in Table 6.
表4〜表6の結果から、一次浸出工程(銅粉溶解工程及び濾過工程)並びに二次浸出工程によって、Au、Pd及びAgの濃度が上昇し、この二次残渣を用いて貴金属の回収が効率よく行えることが分かった。また、不純物のSb、Ni、Pbも除去されていることがわかった。 From the results of Tables 4 to 6, the concentration of Au, Pd and Ag is increased by the primary leaching process (copper powder dissolution process and filtration process) and the secondary leaching process, and the recovery of precious metals can be performed using this secondary residue. It turns out that it can do efficiently. It was also found that impurities Sb, Ni, and Pb were also removed.
このように銅粉溶解工程にて粗銅粉を硫酸に溶解し、銅溶解液の銅濃度を所望の濃度に調整し、銅電解液にするために後工程へ移行される。銅濃度で管理するため、粗銅粉の全量を溶解しきらない場合もあって、未溶解物である残渣が発生する。これら残渣には有価金属が含まれているので、残渣を処理する一次浸出工程及び二次浸出工程にて処理される。二次浸出工程では、残渣を更に酸に溶解し、金属溶液を得ると同時に、更に未溶解物の二次残渣が発生する。
二次浸出工程では、前記一次浸出工程からの液を濾過し、残った二次残渣を後述の電解工程で使用済みとなった電解尾液を用いて浸出する。電解尾液は、電解において銅等の金属イオンが液中から採取されているため、遊離硫酸濃度が高く、浸出性が強い酸である。残渣中の銅は、ほとんど液中に浸出されるが、硫酸に溶けにくい貴金属類は二次残渣中に移行する。二次残渣は、濾過により得られ、貴金属回収工程の原料として使用可能である。
Thus, in the copper powder dissolution step, the crude copper powder is dissolved in sulfuric acid, the copper concentration of the copper solution is adjusted to a desired concentration, and the process proceeds to the subsequent step in order to obtain a copper electrolyte. Since it manages by copper concentration, the whole quantity of coarse copper powder may not be melt | dissolved, and the residue which is an undissolved substance generate | occur | produces. Since these residues contain valuable metals, they are treated in a primary leaching process and a secondary leaching process for treating the residues. In the secondary leaching step, the residue is further dissolved in an acid to obtain a metal solution, and at the same time, an undissolved secondary residue is generated.
In the secondary leaching step, the liquid from the primary leaching step is filtered, and the remaining secondary residue is leached using the electrolytic tail solution that has been used in the electrolysis step described later. The electrolytic tail solution is an acid having a high concentration of free sulfuric acid and a strong leachability since metal ions such as copper are collected from the solution during electrolysis. Most of the copper in the residue is leached into the liquid, but noble metals that are hardly soluble in sulfuric acid migrate into the secondary residue. The secondary residue is obtained by filtration and can be used as a raw material for the precious metal recovery step.
<浄液工程>
銅溶解液中の不純物を低減することで、銅電解液を作製した。なお、銅溶解液として、上記一次浸出工程を経て得た濾液を用いてもよい。銅溶解液の組成を表7に示す
A copper electrolyte was prepared by reducing impurities in the copper solution. In addition, you may use the filtrate obtained through the said primary leaching process as a copper solution. Table 7 shows the composition of the copper solution.
<実験1>
次に、実験的に、上記銅溶解液0.7Lに、粗銅粉を乾燥質量で2g、4g、12g、及び24g添加し、空気を液中に吹き込み、攪拌しながら銅溶解液中に粗銅粉を溶解して遊離硫酸(FA)濃度を低減化した。結果を表8に示す。液温は75℃、反応時間は4時間とした。反応後は濾過し、濾液の銅濃度を電解用に調整すれば銅電解用の銅電解液が得られた。
<Experiment 1>
Next, experimentally, 2 g, 4 g, 12 g, and 24 g of crude copper powder are added to 0.7 L of the above copper solution by dry mass, air is blown into the liquid, and the copper solution is stirred into the copper solution. Was dissolved to reduce the free sulfuric acid (FA) concentration. The results are shown in Table 8. The liquid temperature was 75 ° C. and the reaction time was 4 hours. After the reaction, the solution was filtered, and the copper concentration of the filtrate was adjusted for electrolysis to obtain a copper electrolyte for copper electrolysis.
<電解工程>
得られた銅電解液を、図8に示す電解槽を用い、以下の電解条件で電解を行い電気銅を得た。即ち、電解槽4内の銅電解液3中で、鉛系アノード1から高純度の銅板からなるカソード2に整流器を経て直流電流を流すことにより、アノード1で水が電気分解して電子がカソード2に移行し、カソード板の表面に電気銅(純銅)として析出した。
−電解条件−
・電流密度:100A/m2
・浴電圧:1.5V
・浴温度:60℃
アノードとしては、Pbを用いた。
カソードとしては、銅を用いた。
<Electrolysis process>
The obtained copper electrolyte was electrolyzed under the following electrolysis conditions using the electrolytic cell shown in FIG. 8 to obtain electrolytic copper. That is, in the copper electrolyte 3 in the electrolytic cell 4, a direct current is passed from the lead-based anode 1 to the cathode 2 made of a high-purity copper plate through a rectifier, whereby water is electrolyzed at the anode 1 and electrons are converted into the cathode. 2 and deposited as electrolytic copper (pure copper) on the surface of the cathode plate.
-Electrolysis conditions-
・ Current density: 100 A / m 2
・ Bath voltage: 1.5V
・ Bath temperature: 60 ° C
Pb was used as the anode.
Copper was used as the cathode.
得られた電気銅を分析すると銅が99.99質量%以上であり、低品位の粗銅から高純度な電気銅(精製銅)を製造できることが確認された。 Analysis of the obtained electrolytic copper confirmed that it was 99.99% by mass or more and that high-purity electrolytic copper (purified copper) could be produced from low-grade crude copper.
本発明の銅の製造方法は、貴金属を早期に回収でき、該貴金属の有効利用が図れ、不純物を電解前に除去することができ、粗銅粉を用いることにより銅の溶解効率が向上し、硫酸を繰り返し使用でき、高品位な電気銅の効率的な製造方法であり、該方法により製造された銅は、電子部品材料、電子機器材料、LSI用配線、電線等の各種分野に好適に用いられる。 The copper production method of the present invention can recover a noble metal at an early stage, can effectively use the noble metal, can remove impurities before electrolysis, improves the copper dissolution efficiency by using crude copper powder, Can be used repeatedly, and is an efficient method for producing high-quality electrical copper, and the copper produced by this method is suitably used in various fields such as electronic component materials, electronic equipment materials, LSI wiring, electric wires, etc. .
1 銅アノード
2 カソード
3 銅電解液
4 電解槽
10 タンディッシュ
11 底部ノズル
12 噴霧部
13 貯蔵部
30 溶解槽
31 溶解槽本体
32 邪魔板
33 攪拌器
35 沈殿槽
100 噴射ノズル
101 溶融銅流
DESCRIPTION OF SYMBOLS 1 Copper anode 2 Cathode 3 Copper electrolyte 4 Electrolysis tank 10 Tundish 11 Bottom nozzle 12 Spraying part 13 Storage part 30 Dissolution tank 31 Dissolution tank main body 32 Baffle plate 33 Stirrer 35 Precipitation tank 100 Injection nozzle 101 Molten copper flow
Claims (11)
前記銅溶解液を濾過し、濾液と貴金属を含む一次残渣を得る濾過工程と、
前記一次残渣を使用済み銅電解液で浸出してなる浸出液に酸化剤を添加し、前記一次残渣より貴金属濃度を上げた二次残渣を得る二次浸出工程と、
前記濾液を銅電解液とし、該銅電解液を電解して電気銅を製造する電解工程と、を含むことを特徴とする銅の製造方法。 A copper powder dissolving step of preparing a copper solution by dissolving the crude copper powder in a solution containing an oxidizing agent and sulfuric acid;
Filtering the copper solution to obtain a primary residue containing the filtrate and noble metal;
A secondary leaching step of adding an oxidant to a leachate obtained by leaching the primary residue with a spent copper electrolyte, and obtaining a secondary residue having a higher precious metal concentration than the primary residue;
An electrolytic process for producing electrolytic copper by using the filtrate as a copper electrolyte and electrolyzing the copper electrolyte to produce copper.
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