JP5196353B2 - 側面放出型発光装置及び線光源型発光装置 - Google Patents
側面放出型発光装置及び線光源型発光装置 Download PDFInfo
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- JP5196353B2 JP5196353B2 JP2009142062A JP2009142062A JP5196353B2 JP 5196353 B2 JP5196353 B2 JP 5196353B2 JP 2009142062 A JP2009142062 A JP 2009142062A JP 2009142062 A JP2009142062 A JP 2009142062A JP 5196353 B2 JP5196353 B2 JP 5196353B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Description
Claims (8)
- 実装面として提供される第1面と、前記第1面の反対に位置した第2面及び前記第1及び第2面の間に位置した側面を有する構造であり、前記側面のうち光の放出面に該当する側面に形成された凹部を有するパッケージ本体と、
前記パッケージ本体に形成されたリードフレームと、
前記凹部の底面に実装された発光ダイオードチップと、を含み、
前記凹部の向かい合う内部側壁のうち、前記発光ダイオードチップに隣接した領域に前記発光ダイオードチップに向かって夫々一側面が前記内部側壁と一体化され、2つの反射面を有した三角錐の形態の突出部が複数形成されたことを特徴とする側面放出型発光装置。 - 前記突出部が形成された内部側壁は、前記凹部の長軸方向に沿って形成された側壁であることを特徴とする請求項1に記載の側面放出型発光装置。
- 前記発光ダイオードチップを取り囲むように前記凹部内に形成された樹脂包装部をさらに含むことを特徴とする請求項1に記載の側面放出型発光装置。
- 前記樹脂包装部は、前記発光ダイオードチップから生成される光の波長を変換するための蛍光体粉末を含むことを特徴とする請求項3に記載の側面放出型発光装置。
- 凹部を有するパッケージ本体と、
前記パッケージ本体に形成されたリードフレームと、
前記凹部の底面に前記凹部の長軸方向に沿って実装された複数の発光ダイオードチップと、を含み、
前記凹部の向かい合う内部側壁のうち、前記夫々の発光ダイオードチップに隣接した領域にその隣接した発光ダイオードチップに向かって夫々一側面が前記内部側壁と一体化され、2つの反射面を有した三角錐の形態の突出部が複数形成されたことを特徴とする線光源型発光装置。 - 前記パッケージ本体は、実装面として提供される第1面と、前記第1面の反対に位置した第2面及び前記第1及び第2面の間に位置した側面を有する構造であり、前記凹部は、前記側面のうち光放出面に該当する側面に形成されたことを特徴とする請求項5に記載の線光源型発光装置。
- 前記発光ダイオードチップを取り囲むように前記凹部内に形成された樹脂包装部をさらに含むことを特徴とする請求項6に記載の線光源型発光装置。
- 前記樹脂包装部は、前記発光ダイオードチップから生成される光の波長を変換するための蛍光体粉末を含むことを特徴とする請求項7に記載の線光源型発光装置。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2008-0114888 | 2008-11-18 | ||
KR20080114888A KR101491485B1 (ko) | 2008-11-18 | 2008-11-18 | 측면 방출형 발광장치 및 선광원형 발광장치 |
Publications (2)
Publication Number | Publication Date |
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JP2010123915A JP2010123915A (ja) | 2010-06-03 |
JP5196353B2 true JP5196353B2 (ja) | 2013-05-15 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009142062A Active JP5196353B2 (ja) | 2008-11-18 | 2009-06-15 | 側面放出型発光装置及び線光源型発光装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8610154B2 (ja) |
JP (1) | JP5196353B2 (ja) |
KR (1) | KR101491485B1 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009047487A1 (de) * | 2009-12-04 | 2011-06-09 | Osram Gesellschaft mit beschränkter Haftung | Leuchtmodul |
EP2515028B1 (en) * | 2009-12-18 | 2017-05-03 | Sharp Kabushiki Kaisha | Illuminating device, display device, and television receiver |
TW201214804A (en) * | 2010-03-09 | 2012-04-01 | Lg Innotek Co Ltd | Light emitting device package, and display apparatus and lighting system having the same |
KR101103674B1 (ko) * | 2010-06-01 | 2012-01-11 | 엘지이노텍 주식회사 | 발광 소자 |
KR101676670B1 (ko) * | 2010-07-01 | 2016-11-16 | 엘지이노텍 주식회사 | 발광 소자 |
JP5488327B2 (ja) * | 2010-08-13 | 2014-05-14 | 横河電機株式会社 | 液晶バックライト装置 |
KR101644110B1 (ko) * | 2010-12-17 | 2016-08-02 | 삼성전자주식회사 | 발광소자 패키지 |
KR101830717B1 (ko) * | 2011-06-30 | 2018-02-21 | 엘지이노텍 주식회사 | 발광 소자 패키지 |
JP2013143463A (ja) * | 2012-01-11 | 2013-07-22 | Hitachi Consumer Electronics Co Ltd | 発光装置およびそれを用いたバックライトユニット、面光源装置および表示装置 |
KR101886157B1 (ko) * | 2012-08-23 | 2018-08-08 | 엘지이노텍 주식회사 | 발광 소자 및 조명시스템 |
KR102130524B1 (ko) * | 2013-08-28 | 2020-07-07 | 삼성디스플레이 주식회사 | 발광 소자 모듈, 이를 포함하는 백라이트 유닛 및 이를 포함하는 액정 표시 장치 |
US9841163B1 (en) * | 2015-04-29 | 2017-12-12 | Cooper Technologies Company | Light redirecting flange in luminaires |
US10338875B2 (en) * | 2016-03-31 | 2019-07-02 | Cae Inc. | Seam for visually suppressing a gap between two adjacent reflective surfaces |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3625498B2 (ja) * | 1994-09-21 | 2005-03-02 | 三洋電機株式会社 | 表示装置 |
JP2003282955A (ja) | 2001-07-19 | 2003-10-03 | Rohm Co Ltd | 反射ケース付半導体発光装置 |
JP4240275B2 (ja) | 2002-06-12 | 2009-03-18 | 株式会社ジーエス・ユアサコーポレーション | 非水電解質二次電池 |
JP3878579B2 (ja) * | 2003-06-11 | 2007-02-07 | ローム株式会社 | 光半導体装置 |
JP4868331B2 (ja) | 2005-02-18 | 2012-02-01 | ミネベア株式会社 | 面状照明装置 |
US7777244B2 (en) * | 2006-03-17 | 2010-08-17 | Seoul Semiconductor Co., Ltd. | Side-view light emitting diode package having a reflector |
JP5119621B2 (ja) | 2006-04-21 | 2013-01-16 | 日亜化学工業株式会社 | 発光装置 |
JP2008041567A (ja) | 2006-08-09 | 2008-02-21 | Sharp Corp | 発光装置 |
US7968900B2 (en) * | 2007-01-19 | 2011-06-28 | Cree, Inc. | High performance LED package |
-
2008
- 2008-11-18 KR KR20080114888A patent/KR101491485B1/ko active IP Right Grant
-
2009
- 2009-06-05 US US12/479,436 patent/US8610154B2/en active Active
- 2009-06-15 JP JP2009142062A patent/JP5196353B2/ja active Active
Also Published As
Publication number | Publication date |
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KR20100055966A (ko) | 2010-05-27 |
KR101491485B1 (ko) | 2015-02-11 |
JP2010123915A (ja) | 2010-06-03 |
US8610154B2 (en) | 2013-12-17 |
US20100123159A1 (en) | 2010-05-20 |
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