JP5194003B2 - 金属コア手段を使用した高純度多結晶シリコン棒の製造方法 - Google Patents
金属コア手段を使用した高純度多結晶シリコン棒の製造方法 Download PDFInfo
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- JP5194003B2 JP5194003B2 JP2009511942A JP2009511942A JP5194003B2 JP 5194003 B2 JP5194003 B2 JP 5194003B2 JP 2009511942 A JP2009511942 A JP 2009511942A JP 2009511942 A JP2009511942 A JP 2009511942A JP 5194003 B2 JP5194003 B2 JP 5194003B2
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- 229910052751 metal Inorganic materials 0.000 title claims description 148
- 239000002184 metal Substances 0.000 title claims description 146
- 229910021420 polycrystalline silicon Inorganic materials 0.000 title claims description 62
- 238000004519 manufacturing process Methods 0.000 title claims description 46
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 181
- 229910052710 silicon Inorganic materials 0.000 claims description 168
- 239000010703 silicon Substances 0.000 claims description 162
- 238000000926 separation method Methods 0.000 claims description 161
- 238000001556 precipitation Methods 0.000 claims description 119
- 230000008021 deposition Effects 0.000 claims description 101
- 239000010955 niobium Substances 0.000 claims description 100
- 238000006243 chemical reaction Methods 0.000 claims description 48
- 239000007789 gas Substances 0.000 claims description 40
- 229910052757 nitrogen Inorganic materials 0.000 claims description 39
- 238000010438 heat treatment Methods 0.000 claims description 33
- 230000004888 barrier function Effects 0.000 claims description 31
- 230000005611 electricity Effects 0.000 claims description 26
- 229910021332 silicide Inorganic materials 0.000 claims description 23
- 239000012495 reaction gas Substances 0.000 claims description 21
- 150000004767 nitrides Chemical class 0.000 claims description 19
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 19
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims description 19
- 239000000203 mixture Substances 0.000 claims description 18
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 15
- 239000010936 titanium Substances 0.000 claims description 15
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 13
- 229910052721 tungsten Inorganic materials 0.000 claims description 13
- 239000010937 tungsten Substances 0.000 claims description 13
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 12
- 239000011651 chromium Substances 0.000 claims description 12
- 239000010948 rhodium Substances 0.000 claims description 12
- 239000013078 crystal Substances 0.000 claims description 11
- 229910052776 Thorium Inorganic materials 0.000 claims description 8
- 239000001257 hydrogen Substances 0.000 claims description 8
- 229910052739 hydrogen Inorganic materials 0.000 claims description 8
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- ZSLUVFAKFWKJRC-IGMARMGPSA-N 232Th Chemical compound [232Th] ZSLUVFAKFWKJRC-IGMARMGPSA-N 0.000 claims description 7
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 7
- 229910052735 hafnium Inorganic materials 0.000 claims description 7
- 229910052746 lanthanum Inorganic materials 0.000 claims description 7
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- 239000011733 molybdenum Substances 0.000 claims description 7
- 229910052715 tantalum Inorganic materials 0.000 claims description 7
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 7
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052765 Lutetium Inorganic materials 0.000 claims description 6
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 229910052786 argon Inorganic materials 0.000 claims description 6
- 229910052804 chromium Inorganic materials 0.000 claims description 6
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 claims description 6
- 239000001307 helium Substances 0.000 claims description 6
- 229910052734 helium Inorganic materials 0.000 claims description 6
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 6
- 229910052741 iridium Inorganic materials 0.000 claims description 6
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 6
- OHSVLFRHMCKCQY-UHFFFAOYSA-N lutetium atom Chemical compound [Lu] OHSVLFRHMCKCQY-UHFFFAOYSA-N 0.000 claims description 6
- 229910052758 niobium Inorganic materials 0.000 claims description 6
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 6
- 229910052762 osmium Inorganic materials 0.000 claims description 6
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 claims description 6
- 229910052697 platinum Inorganic materials 0.000 claims description 6
- 229910052702 rhenium Inorganic materials 0.000 claims description 6
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 claims description 6
- 229910052703 rhodium Inorganic materials 0.000 claims description 6
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 6
- 229910052707 ruthenium Inorganic materials 0.000 claims description 6
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 claims description 6
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 6
- 229910052713 technetium Inorganic materials 0.000 claims description 6
- GKLVYJBZJHMRIY-UHFFFAOYSA-N technetium atom Chemical compound [Tc] GKLVYJBZJHMRIY-UHFFFAOYSA-N 0.000 claims description 6
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims description 6
- 229910052727 yttrium Inorganic materials 0.000 claims description 6
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 5
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 4
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 claims description 4
- 239000005052 trichlorosilane Substances 0.000 claims description 4
- VXEGSRKPIUDPQT-UHFFFAOYSA-N 4-[4-(4-methoxyphenyl)piperazin-1-yl]aniline Chemical compound C1=CC(OC)=CC=C1N1CCN(C=2C=CC(N)=CC=2)CC1 VXEGSRKPIUDPQT-UHFFFAOYSA-N 0.000 claims description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- SLLGVCUQYRMELA-UHFFFAOYSA-N chlorosilicon Chemical compound Cl[Si] SLLGVCUQYRMELA-UHFFFAOYSA-N 0.000 claims description 3
- BUMGIEFFCMBQDG-UHFFFAOYSA-N dichlorosilicon Chemical compound Cl[Si]Cl BUMGIEFFCMBQDG-UHFFFAOYSA-N 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical group N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- 239000005049 silicon tetrachloride Substances 0.000 claims description 3
- 229910003902 SiCl 4 Inorganic materials 0.000 claims description 2
- 229910000041 hydrogen chloride Inorganic materials 0.000 claims description 2
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 claims description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 claims 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 1
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- 229910052760 oxygen Inorganic materials 0.000 description 11
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- 239000004065 semiconductor Substances 0.000 description 8
- 239000002210 silicon-based material Substances 0.000 description 8
- 238000012546 transfer Methods 0.000 description 8
- 230000008901 benefit Effects 0.000 description 7
- 238000009792 diffusion process Methods 0.000 description 7
- 230000006870 function Effects 0.000 description 7
- 239000007769 metal material Substances 0.000 description 7
- -1 rods Chemical compound 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 230000008878 coupling Effects 0.000 description 6
- 238000010168 coupling process Methods 0.000 description 6
- 238000005859 coupling reaction Methods 0.000 description 6
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- 229910007991 Si-N Inorganic materials 0.000 description 5
- 229910006294 Si—N Inorganic materials 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- 150000002431 hydrogen Chemical class 0.000 description 5
- 150000002500 ions Chemical class 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 229910007746 Zr—O Inorganic materials 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
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- 150000001247 metal acetylides Chemical class 0.000 description 4
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- 229910018540 Si C Inorganic materials 0.000 description 3
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- 238000005979 thermal decomposition reaction Methods 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910018663 Mn O Inorganic materials 0.000 description 2
- 229910003176 Mn-O Inorganic materials 0.000 description 2
- 229910017299 Mo—O Inorganic materials 0.000 description 2
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- 229910007733 Zr—O—N Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
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- 238000007740 vapor deposition Methods 0.000 description 2
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- 229910019596 Rh—Si Inorganic materials 0.000 description 1
- 229910019854 Ru—N Inorganic materials 0.000 description 1
- 229910019832 Ru—Si Inorganic materials 0.000 description 1
- 229910002795 Si–Al–O–N Inorganic materials 0.000 description 1
- 229910004305 Tc—Si Inorganic materials 0.000 description 1
- 229910004339 Ti-Si Inorganic materials 0.000 description 1
- 229910011210 Ti—O—N Inorganic materials 0.000 description 1
- 229910010978 Ti—Si Inorganic materials 0.000 description 1
- 229910009257 Y—Si Inorganic materials 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 229910007744 Zr—N Inorganic materials 0.000 description 1
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- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4581—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber characterised by material of construction or surface finish of the means for supporting the substrate
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/02—Silicon
- C01B33/021—Preparation
- C01B33/027—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material
- C01B33/035—Preparation by decomposition or reduction of gaseous or vaporised silicon compounds other than silica or silica-containing material by decomposition or reduction of gaseous or vaporised silicon compounds in the presence of heated filaments of silicon, carbon or a refractory metal, e.g. tantalum or tungsten, or in the presence of heated silicon rods on which the formed silicon is deposited, a silicon rod being obtained, e.g. Siemens process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/24—Deposition of silicon only
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/546—Polycrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Silicon Compounds (AREA)
Description
Ca コア要素
Cb,Cb',Cb” 分離層
D 析出生成物
E 電極手段
Gf 反応ガス
Go 排ガス
Nf ガス供給部
No ガス排出部
Rb 析出反応器ベースユニット
Ri 析出反応器の内部空間
Rs 析出反応器シェル
T 電力伝達手段
V 電力供給源
Claims (15)
- コア手段をシリコン棒を製造するために使用される析出反応器の内部空間に準備する工程と、
前記コア手段を電極手段に接続して保持する工程と、
前記電極手段を介して電気を供給することにより、前記コア手段を加熱する工程と、
シリコン析出のための前記内部空間内に反応ガスを供給し、その結果前記コア手段の表面の外側方向にシリコン析出生成物(silicon deposition output)を形成する工程と、を有し、
前記コア手段は、金属コア要素の表面に1または複数の分離層を形成することにより構成されている、
金属コア手段を使用する多結晶シリコン棒を製造する方法。 - 前記反応ガスが、モノシラン(SiH4)、ジクロロシラン(SiH2Cl2)、トリクロロシラン(SiHCl3)、四塩化ケイ素(SiCl4)及びそれらの混合物からなる群から選択される少なくとも1のシリコン含有成分を含む
請求項1に記載の金属コア手段を使用する多結晶シリコン棒を製造する方法。 - 前記反応ガスが、水素、窒素、アルゴン、ヘリウム、塩化水素及びそれらの混合物からなる群から選択される少なくとも1のガス成分を更に含む、
請求項2に記載の金属コア手段を使用する多結晶シリコン棒を製造する方法。 - 前記シリコン析出が、内部空間内で、絶対圧力1〜20バールの範囲内の反応圧力及び前記シリコン析出生成物の表面温度に基づく650〜1,300℃の範囲内の反応温度で、起こる
請求項1に記載の金属コア手段を使用する多結晶シリコン棒を製造する方法。 - 前記金属コア要素が、円形、楕円形または多角形の断面形状を有する棒、ワイヤー、フィラメント、バー、ストリップ及びリボンと、同心円形、同心楕円形または同心多角形の断面形状を有する導管、チューブ、シリンダー及びダクトからなる群から選択される形状を有する
請求項1に記載の金属コア手段を使用する多結晶シリコン棒を製造する方法。 - 前記金属コア要素は、タングステン(W)、レニウム(Re)、オスミウム(Os)、タンタル(Ta)、モリブデン(Mo)、ニオブ(Nb)、イリジウム(Ir)、ルテニウム(Ru)、テクネチウム(Tc)、ハフニウム(Hf)、ロジウム(Rh)、バナジウム(V)、クロム(Cr)、ジルコニウム(Zr)、白金(Pt)、トリウム(Th)、ランタン(La)、チタン(Ti)、ルテチウム(Lu)、イットリウム(Y)及びそれらの混合物からなる群から選択される少なくとも1の金属元素を含む金属または合金である
請求項1又は5に記載の金属コア手段を使用する多結晶シリコン棒を製造する方法。 - 各々異なる障壁成分で作られた前記分離層の数は、1〜5の範囲である
請求項1に記載の金属コア手段を使用する多結晶シリコン棒を製造する方法。 - 前記分離層の各層を構成する障壁成分は、窒化ケイ素、酸化ケイ素、炭化ケイ素、酸窒化ケイ素及びそれらの混合物からなる群から選択される
請求項7に記載の金属コア手段を使用する多結晶シリコン棒を製造する方法。 - 前記分離層の各層を構成する前記障壁成分は、タングステン(W)、レニウム(Re)、オスミウム(Os)、タンタル(Ta)、モリブデン(Mo)、ニオブ(Nb)、イリジウム(Ir)、ルテニウム(Ru)、テクネチウム(Tc)、ハフニウム(Hf)、ロジウム(Rh)、バナジウム(V)、クロム(Cr)、ジルコニウム(Zr)、白金(Pt)、トリウム(Th)、ランタン(La)、チタン(Ti)、ルテチウム(Lu)、イットリウム(Y)及びそれらの混合物からなる群から選択される少なくとも1の金属元素を具備する窒化物、酸化物、ケイ化物、炭化物、酸窒化物または酸ケイ化物(oxysilicide)から選択される
請求項7に記載の金属コア手段を使用する多結晶シリコン棒を製造する方法。 - 前記分離層の全体の厚さは、10nmから20mmの範囲内である
請求項7から9のいずれかに記載の金属コア手段を使用する多結晶シリコン棒を製造する方法。 - 前記分離層にシリコン層を加える工程を更に具備し、
前記シリコン層が1μm〜10mmの範囲の厚さを有し、
前記シリコンが障壁成分として選択される
請求項7から9のいずれかに記載の金属コア手段を使用する多結晶シリコン棒を製造する方法。 - 前記シリコン層が、前記金属コア手段と前記電極手段は互いに接続されて、析出反応器の内部空間に設置された状態で前記分離層に追加され、前記金属コア手段は前記電極手段を介して電気を供給することにより加熱され、前記シリコン層を形成するための供給ガスは、反応条件で析出反応器の前記内部空間内に供給され、
前記供給ガスは、前記多結晶シリコン棒を製造するときには、前記シリコン析出生成物を形成するための反応ガス成分から選択され、
前記反応条件は、前記シリコン層と前記シリコン析出生成物が結晶構造と熱膨張に関して、互いに異なり得るように提供される
請求項11に記載の金属コア手段を使用する多結晶シリコン棒を製造する方法。 - 前記金属コア要素及び電極手段は互いに接続されて、前記析出反応器の内部空間内に設置され、
前記金属コア要素は前記電極手段を介して電気を供給することにより加熱され、前記分離層を形成するための供給ガスは前記析出反応器の内部空間内に供給され、前記分離層が形成され、その結果、前記コア手段を製造する
請求項1に記載の金属コア手段を使用する多結晶シリコン棒を製造する方法。 - 前記金属コア要素上に前記分離層の一部を形成することにより予め製造された予備コア手段と前記電極手段が互いに接続されて、前記析出反応器の内部空間に設置され、
前記予備コア手段は前記電極手段を介して電気を供給することにより加熱され、付加的な分離層を形成するための供給ガスは内部空間に供給されて、付加的な分離層が形成され、その結果、前記コア手段を製造する
請求項1に記載の金属コア手段を使用する多結晶シリコン棒を製造する方法。 - 前記コア手段は、予め製造された分離層を前記金属コア要素とともに、前記分離層が前記金属コア要素を取り囲み得る方法で組み立てることにより製造される
請求項1に記載の金属コア手段を使用する多結晶シリコン棒を製造する方法。
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PCT/KR2007/002457 WO2007136209A1 (en) | 2006-05-22 | 2007-05-21 | Methods for preparation of high-purity polysilicon rods using a metallic core means |
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Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100768148B1 (ko) * | 2006-05-22 | 2007-10-17 | 한국화학연구원 | 금속 코어수단을 이용한 다결정 실리콘 봉의 제조방법 |
TWI464292B (zh) * | 2008-03-26 | 2014-12-11 | Gtat Corp | 塗覆金之多晶矽反應器系統和方法 |
MY156940A (en) * | 2008-03-26 | 2016-04-15 | Gt Solar Inc | System and methods for distributing gas in a chemical vapor deposition reactor |
JP5481886B2 (ja) * | 2008-03-27 | 2014-04-23 | 三菱マテリアル株式会社 | 多結晶シリコン製造装置 |
RU2494579C2 (ru) * | 2008-04-14 | 2013-09-27 | Хемлок Семикондактор Корпорейшн | Производственная установка для осаждения материала и электрод для использования в ней |
KR101096178B1 (ko) | 2008-07-21 | 2011-12-22 | 한국과학기술원 | 다결정 실리콘의 제조장치에 사용되는 불순물 방지막이있는 금속 심재 |
KR100892123B1 (ko) * | 2008-12-31 | 2009-04-09 | (주)세미머티리얼즈 | 폴리 실리콘 증착장치 |
DE202010002486U1 (de) * | 2009-03-31 | 2010-06-10 | Centrotherm Sitec Gmbh | Spann- und Kontaktierungsvorrichtung für Silizium-Dünnstäbe |
WO2011071030A1 (ja) * | 2009-12-09 | 2011-06-16 | コスモ石油株式会社 | 多結晶シリコンの製造方法及び多結晶シリコン製造用の反応炉 |
DE102010045041A1 (de) * | 2010-09-10 | 2012-03-15 | Centrotherm Sitec Gmbh | CVD-Reaktor/Gaskonverter und Elektrodeneinheit hierfür |
US20120322175A1 (en) * | 2011-06-14 | 2012-12-20 | Memc Electronic Materials Spa | Methods and Systems For Controlling SiIicon Rod Temperature |
DE102011077970A1 (de) * | 2011-06-22 | 2012-12-27 | Wacker Chemie Ag | Vorrichtung und Verfahren zur Temperaturbehandlung von korrosiven Gasen |
DE102011119353A1 (de) * | 2011-11-23 | 2013-05-23 | Centrotherm Sitec Gmbh | Verfahren zur Zerkleinerung von Halbleiterformkörpern |
DE102012207513A1 (de) * | 2012-05-07 | 2013-11-07 | Wacker Chemie Ag | Polykristalliner Siliciumstab und Verfahren zu dessen Herstellung |
CN104411864B (zh) * | 2012-07-10 | 2017-03-15 | 赫姆洛克半导体公司 | 用于沉积材料的制造设备和用于其中的托座 |
US9701541B2 (en) * | 2012-12-19 | 2017-07-11 | Gtat Corporation | Methods and systems for stabilizing filaments in a chemical vapor deposition reactor |
KR101311739B1 (ko) * | 2013-01-14 | 2013-10-14 | 주식회사 아이제이피에스 | 폴리실리콘 제조장치 |
DE102013206339A1 (de) | 2013-04-10 | 2014-10-16 | Wacker Chemie Ag | Vorrichtung und Verfahren zum Ausbau von polykristallinen Siliciumstäben aus einem Reaktor |
DE102013207251A1 (de) * | 2013-04-22 | 2014-10-23 | Wacker Chemie Ag | Verfahren zur Herstellung von polykristallinem Silicium |
DE102013214799A1 (de) | 2013-07-29 | 2015-01-29 | Wacker Chemie Ag | Verfahren zur Herstellung von polykristallinem Silicium |
KR101654148B1 (ko) * | 2013-09-27 | 2016-09-05 | 한화케미칼 주식회사 | 폴리실리콘 제조용 화학 기상 증착 반응기 |
US10287704B2 (en) * | 2014-08-29 | 2019-05-14 | Tokuyama Corporation | Process for producing silicon single crystal |
US10100439B2 (en) * | 2015-05-08 | 2018-10-16 | Sunpower Corporation | High throughput chemical vapor deposition electrode |
CN105970288A (zh) * | 2016-06-22 | 2016-09-28 | 江苏拜尔特光电设备有限公司 | 新型多晶硅芯棒拉制方法 |
CN106517211B (zh) * | 2016-11-29 | 2018-11-09 | 陈生辉 | 一种生产多晶硅的装置及其应用 |
CN108017059A (zh) * | 2017-12-12 | 2018-05-11 | 江西赛维Ldk光伏硅科技有限公司 | 用于制备多晶硅的热载体和多晶硅反应炉 |
CN107777689A (zh) * | 2017-12-12 | 2018-03-09 | 江西赛维Ldk光伏硅科技有限公司 | 一种多晶硅及其制备方法 |
CN109250720A (zh) * | 2018-11-15 | 2019-01-22 | 新疆大全新能源股份有限公司 | 还原炉 |
JP2021157931A (ja) * | 2020-03-26 | 2021-10-07 | 株式会社Helix | 水プラズマ発生装置及びこれに用いられる陰極保持ユニット |
EP4279452A1 (en) * | 2022-05-18 | 2023-11-22 | Zadient Technologies SAS | Sic growth substrate, cvd reactor and method for the production of sic |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3128154A (en) * | 1958-12-19 | 1964-04-07 | Eagle Picher Co | Process for producing crystalline silicon over a substrate and removal therefrom |
JPS50814B1 (ja) * | 1969-05-12 | 1975-01-11 | ||
JPS496463B1 (ja) * | 1970-05-21 | 1974-02-14 | ||
JPS496463A (ja) | 1972-05-10 | 1974-01-21 | ||
US3821814A (en) | 1972-11-14 | 1974-06-28 | Rca Corp | Apparatus for providing individual adjustment of movable multiple transducers in a plural tape cartridge player |
BE806098A (fr) | 1973-03-28 | 1974-02-01 | Siemens Ag | Procede de fabrication de silicium ou autre matiere semi-conductrice tres pure |
JPS53108030A (en) | 1977-03-04 | 1978-09-20 | Komatsu Mfg Co Ltd | Method of producing high purity and multicrystalline silicon |
US4179530A (en) | 1977-05-20 | 1979-12-18 | Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh | Process for the deposition of pure semiconductor material |
DE2753567C3 (de) | 1977-12-01 | 1982-04-15 | Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen | Verfahren zur Herstellung von hochreinen Halbleitermaterialien und Reinstmetallen |
JPH0729874B2 (ja) | 1989-11-04 | 1995-04-05 | コマツ電子金属株式会社 | 多結晶シリコン製造装置の芯線間接続用ブリッジ |
KR950013069B1 (ko) | 1989-12-26 | 1995-10-24 | 어드밴스드 실리콘 머티어리얼즈 인코포레이티드 | 수소 침투 방지용 외부 코팅층을 갖는 흑연 척 및 탄소가 거의 없는 다결정 실리콘 제조 방법 |
KR960003734B1 (ko) | 1990-06-27 | 1996-03-21 | 유니온 카바이드 코팅즈 서비스 테크놀러지 코포레이션 | 다결정 실리콘 제조에서의 스타터 필라멘트용 흑연 척 및 그 보호 방법 |
JPH08169797A (ja) * | 1994-08-26 | 1996-07-02 | Advanced Silicon Materials Inc | 多結晶シリコン棒の製造方法及び製造装置 |
DE19608885B4 (de) | 1996-03-07 | 2006-11-16 | Wacker Chemie Ag | Verfahren und Vorrichtung zum Aufheizen von Trägerkörpern |
DE19780520B4 (de) * | 1996-05-21 | 2007-03-08 | Tokuyama Corp., Tokuya | Stab aus polykristallinem Silicium und Herstellungsverfahren hierfür |
JPH118398A (ja) | 1997-06-16 | 1999-01-12 | Tokin Corp | 半導体加速度センサ及び製造方法 |
US5904981A (en) * | 1998-05-27 | 1999-05-18 | Tokuyama Corporation | Polycrystal silicon rod having an improved morphyology |
US6150216A (en) * | 1998-12-29 | 2000-11-21 | United Microelectronics Corp. | Method for forming an electrode of semiconductor device capacitor |
US6365225B1 (en) * | 1999-02-19 | 2002-04-02 | G.T. Equipment Technologies, Inc. | Cold wall reactor and method for chemical vapor deposition of bulk polysilicon |
US6503563B1 (en) | 2001-10-09 | 2003-01-07 | Komatsu Ltd. | Method of producing polycrystalline silicon for semiconductors from saline gas |
WO2003069027A2 (en) | 2002-02-14 | 2003-08-21 | Advanced Silicon Materials Llc | Energy efficient method for growing polycrystalline silicon |
CN1222471C (zh) * | 2002-10-23 | 2005-10-12 | 同济大学 | 用三氯氢硅和四氯化硅混合源生产多晶硅的方法 |
JP2004149324A (ja) | 2002-10-28 | 2004-05-27 | Sumitomo Mitsubishi Silicon Corp | 多結晶シリコンロッド及びその製造方法、並びにそのロッドの製造に使用されるシリコン芯材 |
JP2006036628A (ja) | 2004-06-22 | 2006-02-09 | Shinetsu Film Kk | 多結晶シリコンの製造方法およびその製造方法によって製造される太陽光発電用多結晶シリコン |
KR100768147B1 (ko) * | 2006-05-11 | 2007-10-18 | 한국화학연구원 | 혼합된 코어수단을 이용한 다결정 실리콘 봉의 제조방법과그 제조장치 |
KR100768148B1 (ko) * | 2006-05-22 | 2007-10-17 | 한국화학연구원 | 금속 코어수단을 이용한 다결정 실리콘 봉의 제조방법 |
DE102006031105A1 (de) * | 2006-07-05 | 2008-01-10 | Wacker Chemie Ag | Verfahren zur Reinigung von Polysilicium-Bruch |
DE102006040486A1 (de) * | 2006-08-30 | 2008-03-13 | Wacker Chemie Ag | Verfahren zur zerstörungsfreien Materialprüfung von hochreinem polykristallinen Silicium |
KR101115697B1 (ko) * | 2009-12-02 | 2012-03-06 | 웅진폴리실리콘주식회사 | 에너지 효율을 높여주는 복사열 차단막을 갖는 화학기상증착 반응기 |
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CA2654732A1 (en) | 2007-11-29 |
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WO2007136209A1 (en) | 2007-11-29 |
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CA2654732C (en) | 2012-01-10 |
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US8216643B2 (en) | 2012-07-10 |
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US20100041215A1 (en) | 2010-02-18 |
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US7923358B2 (en) | 2011-04-12 |
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KR100768148B1 (ko) | 2007-10-17 |
EA200870558A1 (ru) | 2009-04-28 |
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