JP5193494B2 - Ti膜の成膜方法および記憶媒体 - Google Patents
Ti膜の成膜方法および記憶媒体 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims description 36
- 238000003860 storage Methods 0.000 title claims description 11
- 239000007789 gas Substances 0.000 claims description 198
- 239000000758 substrate Substances 0.000 claims description 63
- 230000005684 electric field Effects 0.000 claims description 23
- 238000006243 chemical reaction Methods 0.000 claims description 22
- 239000002243 precursor Substances 0.000 claims description 22
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 18
- 238000010438 heat treatment Methods 0.000 claims description 12
- 239000011261 inert gas Substances 0.000 claims description 2
- 239000010408 film Substances 0.000 description 166
- 239000010936 titanium Substances 0.000 description 87
- 235000012431 wafers Nutrition 0.000 description 50
- 230000015572 biosynthetic process Effects 0.000 description 36
- 230000007246 mechanism Effects 0.000 description 18
- 230000008859 change Effects 0.000 description 13
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- 238000000151 deposition Methods 0.000 description 11
- 238000005121 nitriding Methods 0.000 description 9
- 230000008021 deposition Effects 0.000 description 7
- 239000010410 layer Substances 0.000 description 7
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 7
- 229920005591 polysilicon Polymers 0.000 description 7
- 229910021332 silicide Inorganic materials 0.000 description 7
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 7
- 230000007704 transition Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 230000002159 abnormal effect Effects 0.000 description 5
- 238000000354 decomposition reaction Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 229910052721 tungsten Inorganic materials 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- 238000000576 coating method Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 230000001737 promoting effect Effects 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000005108 dry cleaning Methods 0.000 description 2
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- DFJQEGUNXWZVAH-UHFFFAOYSA-N bis($l^{2}-silanylidene)titanium Chemical compound [Si]=[Ti]=[Si] DFJQEGUNXWZVAH-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910021352 titanium disilicide Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
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Description
ガスが一般的に用いられ、還元ガスとしてH2ガス等が用いられるが、このTiCl4 ガスの結合エネルギーはかなり高く、熱エネルギー単独では1200℃程度の高温でなければ分解しないので、プラズマエネルギーを併用するプラズマCVDによって、通常、プロセス温度650℃程度で成膜を行っている。また、反応を促進する観点から、比較的高い圧力および高周波電力パワーを採用してプラズマを形成している。
また、被処理基板やチャンバに対するプラズマダメージが生じ難いTi膜の成膜方法を提供することを目的とする。
図1は本発明の一実施形態に係るTi膜の成膜方法の実施に用いるTi膜成膜装置の一例を示す概略断面図である。このTi膜成膜装置100は平行平板電極に高周波電界を形成することによりプラズマを形成しつつCVD成膜を行うプラズマCVD成膜装置として構成される。
本実施形態において対象とするウエハWは、Si部分が露出しているものであり、Si部分としてはSi基板であってもよいし、その上に形成されたポリシリコン膜であってもよく、その上にTi膜が形成される。通常は層間絶縁膜としてSiO2膜(またはLow−k膜)等のSiO2部分を含んでおり、Si部分とSiO2部分の両方にTi膜が形成される。
図2は、横軸にウエハ温度をとり、縦軸に抵抗値Rsの平均値(Ω/□)およびそのばらつき(1σ,%)をとって、Si上とSiO2上にTi膜を堆積した際における各膜上での抵抗値およびそのばらつきの温度変化を示す図である。また、各温度でシリコン上で生成する相を示す。
まず、成膜原料であるTiCl4がプラズマ中で(1)式の反応に従って活性化する。次に、活性化されたTiCl4 *が(2)式の反応に従って還元され、TiCl3が形成され、反応に寄与するプリカーサとなる。また、(3)式に従ってTiCl3 *同士が反応してTiCl2が形成され、これも反応に寄与するプリカーサとなる。
TiCl4+Ar → TiCl4 *+Ar (1)
TiCl4 *+H+ → TiCl3+HCl (2)
TiCl3 *+TiCl3 * → TiCl2+TiCl4 (3)
(y−333)<160400/(x−266)……(4)
ただし、他の条件を、TiCl4流量:3〜20mL/min(sccm)、Ar流量:100〜2000mL/min(sccm)、H2流量:1000〜5000mL/min(sccm)、ウエハ温度:500〜600℃の範囲内とする。
図7は、従来よりも高周波電力パワーおよびチャンバ内圧力を低下させた場合のSi上とSiO2上にTi膜を堆積した際における各膜上での抵抗値およびそのばらつきの温度変化を示す図である。また、各温度でシリコン上で生成する相を示す。
i)高周波電源34からの高周波電力の周波数:300kHz〜27MHz
ii)TiCl4ガス流量:3〜20mL/min(sccm)
iii)Arガス流量:500〜2000mL/min(sccm)
iv)H2ガス流量:1000〜5000mL/min(sccm)
i)高周波電源34からの高周波電力
周波数:300kHz〜27MHz
パワー:500〜1500W
ii)ヒーター5によるサセプタ2の温度:300〜670℃
iii)Arガス流量:800〜2000mL/min(sccm)
iv)H2ガス流量:1500〜4500mL/min(sccm)
v)NH3ガス流量:500〜2000mL/min(sccm)
vi)チャンバ内圧力:133〜1333Pa(1〜10Torr)
なお、窒化処理は必須ではないが、Ti膜の酸化防止等の観点から実施することが好ましい。
2…サセプタ
5…ヒーター
10…シャワーヘッド
20…ガス供給機構
21…ClF3ガス供給源
22…TiCl4ガス供給源
23…Arガス供給源
24…H2ガス供給源
25…NH3ガス供給源
26…N2ガス供給源
34…高周波電源
W……半導体ウエハ
Claims (6)
- 被処理基板を収容するチャンバと、チャンバ内で被処理基板を載置する載置台と、載置台上の基板を加熱する加熱手段と、チャンバ内にTiCl 4 ガスおよび還元ガスを含む処理ガスを供給する処理ガス供給手段と、前記載置台上の被処理基板の上方の空間に高周波電界を形成する高周波電界形成手段と、前記チャンバ内を排気する排気手段とを有する成膜装置により、Si部分を有する被処理基板のSi含有部分にTi膜を形成するTi膜の成膜方法であって、
前記載置台にSi部分を有する被処理基板を配置し、被処理基板を加熱し、チャンバ内を所定の圧力にし、チャンバ内にTiCl 4 ガスおよび還元ガスを含む処理ガスを導入しつつ、前記高周波電界形成手段により高周波電界を形成することにより前記処理ガスをプラズマ化し、被処理基板の表面でTiCl 4 ガスおよび還元ガスによる反応を生じさせて被処理基板のSi部分にTi膜を成膜し、
その際に、基板温度が550℃±20℃であり、550℃近傍でプリカーサとしてTiCl 3 が主体となる成膜反応が生じるように、チャンバ内圧力が266〜1333Paの範囲、前記高周波電界形成手段の高周波電力パワーが200〜1000Wの範囲内において、チャンバ内圧力をx(Pa)、高周波電力パワーをy(W)としたときに、
(y−333)<160400/(x−266)
を満たすことを特徴とするTi膜の成膜方法。 - 被処理基板を収容するチャンバと、チャンバ内で被処理基板を載置する載置台と、載置台上の基板を加熱する加熱手段と、チャンバ内にTiCl 4 ガスおよび還元ガスを含む処理ガスを供給する処理ガス供給手段と、前記載置台上の被処理基板の上方の空間に高周波電界を形成する高周波電界形成手段と、前記チャンバ内を排気する排気手段とを有する成膜装置により、Si部分を有する被処理基板のSi含有部分にTi膜を形成するTi膜の成膜方法であって、
前記載置台にSi部分を有する被処理基板を配置し、被処理基板を加熱し、チャンバ内を所定の圧力にし、チャンバ内にTiCl 4 ガスおよび還元ガスを含む処理ガスを導入しつつ、前記高周波電界形成手段により高周波電界を形成することにより前記処理ガスをプラズマ化し、被処理基板の表面でTiCl 4 ガスおよび還元ガスによる反応を生じさせて被処理基板のSi部分にTi膜を成膜し、
その際に、基板温度が550℃±20℃であり、550℃近傍でプリカーサとしてTiCl 3 が主体となる成膜反応が生じるように、チャンバ内圧力を300〜800Paの範囲とし、前記高周波電界形成手段の高周波電力パワーを300〜600Wとすることを特徴とするTi膜の成膜方法。 - TiCl4ガスおよび還元ガスおよび不活性ガスを前記チャンバ内に導入した後に、高周波電界を形成してプラズマを生成することを特徴とする請求項1または請求項2に記載のTi膜の成膜方法。
- 被処理基板は、Si部分の他にSiO2部分を有し、Si部分とSiO2部分の両方にTi膜を成膜することを特徴とする請求項1から請求項3のいずれか1項に記載のTi膜の成膜方法。
- 被処理基板のSi部分にTi膜が形成されることにより、その界面がシリサイド化することを特徴とする請求項1から請求項4のいずれか1項に記載のTi膜の成膜方法。
- コンピュータ上で動作し、成膜装置を制御するプログラムが記憶された記憶媒体であって、前記制御プログラムは、実行時に、上記請求項1から請求項5のいずれかの方法が行われるように、コンピュータに前記成膜装置を制御させることを特徴とする記憶媒体。
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