JP5191944B2 - 金型温度測定装置 - Google Patents
金型温度測定装置 Download PDFInfo
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- JP5191944B2 JP5191944B2 JP2009105752A JP2009105752A JP5191944B2 JP 5191944 B2 JP5191944 B2 JP 5191944B2 JP 2009105752 A JP2009105752 A JP 2009105752A JP 2009105752 A JP2009105752 A JP 2009105752A JP 5191944 B2 JP5191944 B2 JP 5191944B2
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- 238000001514 detection method Methods 0.000 claims description 10
- 238000004891 communication Methods 0.000 claims description 7
- 230000005684 electric field Effects 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 description 15
- 239000002184 metal Substances 0.000 description 6
- 229910000859 α-Fe Inorganic materials 0.000 description 6
- 238000009529 body temperature measurement Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
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- Measuring Temperature Or Quantity Of Heat (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Description
Claims (2)
- 一方の金型が他方の金型に対し相対移動ないし離脱可能に設けられた金型間の通信装置であって、前記一方の金型の必要箇所に配設された温度検出素子と、前記温度検出素子から出力される温度信号を高周波パルス信号に変換する変調手段と、前記一方の金型と他方の金型にそれぞれ設けられて、その間に生じる電界により前記高周波パルス信号を一方から他方へ伝達させる一対の電極と、前記他方の金型に設けられて前記一対の電極を介して前記一方の金型側から伝達された前記高周波パルス信号から前記温度信号を得る復調手段とを備える金型温度測定装置。
- 前記他方の金型は汎用型であり、前記一方の金型は前記汎用型に設けられた専用型であって、前記汎用型に対して前記専用型が接近移動してこれらが衝合されることにより型閉め状態となる請求項1に記載の金型温度測定装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2009105752A JP5191944B2 (ja) | 2009-04-24 | 2009-04-24 | 金型温度測定装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2009105752A JP5191944B2 (ja) | 2009-04-24 | 2009-04-24 | 金型温度測定装置 |
Publications (2)
Publication Number | Publication Date |
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JP2010256143A JP2010256143A (ja) | 2010-11-11 |
JP5191944B2 true JP5191944B2 (ja) | 2013-05-08 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2009105752A Expired - Fee Related JP5191944B2 (ja) | 2009-04-24 | 2009-04-24 | 金型温度測定装置 |
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JP (1) | JP5191944B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6323487B2 (ja) * | 2016-03-31 | 2018-05-16 | マツダ株式会社 | 射出成形装置および射出成形方法 |
JP7491566B2 (ja) | 2020-09-24 | 2024-05-28 | 株式会社Kmc | センサシステム、子タグ、親タグ及び情報処理プログラム |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01117739U (ja) * | 1988-01-29 | 1989-08-09 | ||
JPH0750182Y2 (ja) * | 1990-07-30 | 1995-11-15 | ダイライト株式会社 | 金型温度測定可能な2軸回転中空成型機 |
JPH0896289A (ja) * | 1994-09-22 | 1996-04-12 | Nec Corp | 信号伝送装置 |
JP2000106247A (ja) * | 1998-09-30 | 2000-04-11 | Chubu Sukegawa Kogyo Kk | コネクタ |
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2009
- 2009-04-24 JP JP2009105752A patent/JP5191944B2/ja not_active Expired - Fee Related
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JP2010256143A (ja) | 2010-11-11 |
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