JP5190305B2 - 蒸気チャンバ - Google Patents

蒸気チャンバ Download PDF

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Publication number
JP5190305B2
JP5190305B2 JP2008161248A JP2008161248A JP5190305B2 JP 5190305 B2 JP5190305 B2 JP 5190305B2 JP 2008161248 A JP2008161248 A JP 2008161248A JP 2008161248 A JP2008161248 A JP 2008161248A JP 5190305 B2 JP5190305 B2 JP 5190305B2
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JP
Japan
Prior art keywords
wick
chamber
heat
wick portion
steam chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008161248A
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English (en)
Japanese (ja)
Other versions
JP2010002125A (ja
Inventor
國仁 林
文榮 劉
志鴻 鄭
如足 黄
貞祥 林
Original Assignee
▲じつ▼新科技股▲ふん▼有限公司
珍通能源技術股▲ふん▼有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=49382687&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP5190305(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority to TW097117064A priority Critical patent/TW200946855A/zh
Priority to US12/128,127 priority patent/US7913748B2/en
Priority to DE202008017327U priority patent/DE202008017327U1/de
Priority to EP08010369A priority patent/EP2131132A1/en
Application filed by ▲じつ▼新科技股▲ふん▼有限公司, 珍通能源技術股▲ふん▼有限公司 filed Critical ▲じつ▼新科技股▲ふん▼有限公司
Priority to JP2008161248A priority patent/JP5190305B2/ja
Publication of JP2010002125A publication Critical patent/JP2010002125A/ja
Application granted granted Critical
Publication of JP5190305B2 publication Critical patent/JP5190305B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Central Heating Systems (AREA)
JP2008161248A 2008-05-08 2008-06-20 蒸気チャンバ Expired - Fee Related JP5190305B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
TW097117064A TW200946855A (en) 2008-05-08 2008-05-08 Vapor chamber
US12/128,127 US7913748B2 (en) 2008-05-08 2008-05-28 Vapor chamber
DE202008017327U DE202008017327U1 (de) 2008-05-08 2008-06-06 Dampfkammer
EP08010369A EP2131132A1 (en) 2008-05-08 2008-06-06 Vapor chamber
JP2008161248A JP5190305B2 (ja) 2008-05-08 2008-06-20 蒸気チャンバ

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW097117064A TW200946855A (en) 2008-05-08 2008-05-08 Vapor chamber
JP2008161248A JP5190305B2 (ja) 2008-05-08 2008-06-20 蒸気チャンバ

Publications (2)

Publication Number Publication Date
JP2010002125A JP2010002125A (ja) 2010-01-07
JP5190305B2 true JP5190305B2 (ja) 2013-04-24

Family

ID=49382687

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008161248A Expired - Fee Related JP5190305B2 (ja) 2008-05-08 2008-06-20 蒸気チャンバ

Country Status (5)

Country Link
US (1) US7913748B2 (enExample)
EP (1) EP2131132A1 (enExample)
JP (1) JP5190305B2 (enExample)
DE (1) DE202008017327U1 (enExample)
TW (1) TW200946855A (enExample)

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CN101754656B (zh) * 2008-12-10 2013-02-20 富准精密工业(深圳)有限公司 均温板
US9163883B2 (en) * 2009-03-06 2015-10-20 Kevlin Thermal Technologies, Inc. Flexible thermal ground plane and manufacturing the same
US20110027738A1 (en) * 2009-07-30 2011-02-03 Meyer Iv George Anthony Supporting structure with height difference and vapor chamber having the supporting structure
CN102155858A (zh) * 2011-04-07 2011-08-17 大连金三维科技有限公司 散热器
US8857502B2 (en) * 2011-07-26 2014-10-14 Kunshan Jue-Chung Electronics Co., Ltd. Vapor chamber having heated protrusion
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JPWO2014045714A1 (ja) 2012-09-19 2016-08-18 日本電気株式会社 冷却装置、それに使用される受熱部、沸騰部、その製造方法
US9685393B2 (en) 2013-03-04 2017-06-20 The Hong Kong University Of Science And Technology Phase-change chamber with patterned regions of high and low affinity to a phase-change medium for electronic device cooling
US9220184B2 (en) * 2013-03-15 2015-12-22 Hamilton Sundstrand Corporation Advanced cooling for power module switches
US9423188B2 (en) * 2013-12-23 2016-08-23 Palo Alto Research Center Incorporated Molded plastic objects having an integrated heat spreader and methods of manufacture of same
US9921004B2 (en) 2014-09-15 2018-03-20 Kelvin Thermal Technologies, Inc. Polymer-based microfabricated thermal ground plane
EP3194157A4 (en) * 2014-09-15 2018-04-25 The Regents of The University of Colorado, A Body Corporate Vacuum-enhanced heat spreader
US20190390919A1 (en) * 2014-09-15 2019-12-26 Kelvin Thermal Technologies, Inc. Polymer-based microfabricated thermal ground plane
US11598594B2 (en) 2014-09-17 2023-03-07 The Regents Of The University Of Colorado Micropillar-enabled thermal ground plane
EP3194113B1 (en) 2014-09-17 2022-06-08 The Regents Of The University Of Colorado, A Body Corporate, A Colorado Non-Profit Micropillar-enabled thermal ground plane
US11988453B2 (en) 2014-09-17 2024-05-21 Kelvin Thermal Technologies, Inc. Thermal management planes
US12385697B2 (en) 2014-09-17 2025-08-12 Kelvin Thermal Technologies, Inc. Micropillar-enabled thermal ground plane
US11397057B2 (en) * 2014-09-26 2022-07-26 Asia Vital Components Co., Ltd. Vapor chamber structure
US20160131437A1 (en) * 2014-11-12 2016-05-12 Asia Vital Components Co., Ltd. Thin heat pipe structure
US10082340B2 (en) * 2014-11-12 2018-09-25 Asia Vital Components Co., Ltd. Heat pipe structure
TWM512883U (zh) * 2015-05-05 2015-11-21 Cooler Master Co Ltd 散熱模組、水冷式散熱模組及散熱系統
JP6627594B2 (ja) * 2016-03-16 2020-01-08 株式会社オートネットワーク技術研究所 冷却部材、及び蓄電モジュール
US20170367219A1 (en) * 2016-06-16 2017-12-21 Asia Vital Components Co., Ltd. Vapor chamber structure
US12104856B2 (en) 2016-10-19 2024-10-01 Kelvin Thermal Technologies, Inc. Method and device for optimization of vapor transport in a thermal ground plane using void space in mobile systems
EP3539156A4 (en) 2016-11-08 2020-07-15 Kelvin Thermal Technologies, Inc. METHOD AND DEVICE FOR DISTRIBUTING HIGH HEAT FLOWS ON THERMAL GROUND SURFACES
KR102660510B1 (ko) * 2016-11-23 2024-04-24 삼성전자주식회사 열을 흡수하는 증기(상변화) 챔버를 포함하는 전자 장치
TWI620912B (zh) * 2017-04-14 2018-04-11 雙鴻科技股份有限公司 均溫板
WO2018208801A1 (en) 2017-05-08 2018-11-15 Kelvin Thermal Technologies, Inc. Thermal management planes
JP6588599B1 (ja) * 2018-05-29 2019-10-09 古河電気工業株式会社 ベーパーチャンバ
CN110708934A (zh) * 2019-10-31 2020-01-17 华为技术有限公司 一种均温部件及电子设备
US20210022266A1 (en) * 2020-09-25 2021-01-21 Intel Corporation Cooling apparatus with two-tier vapor chamber
CN115997099A (zh) 2020-06-19 2023-04-21 开尔文热技术股份有限公司 折叠式热接地平面
CN114158232A (zh) * 2020-09-08 2022-03-08 英业达科技有限公司 散热片与散热系统
CN112539670B (zh) * 2020-12-09 2023-09-05 福建永安市永清石墨烯研究院有限公司 一种vc均热板及制备方法
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Also Published As

Publication number Publication date
TWI388792B (enExample) 2013-03-11
US20090294104A1 (en) 2009-12-03
EP2131132A1 (en) 2009-12-09
TW200946855A (en) 2009-11-16
JP2010002125A (ja) 2010-01-07
DE202008017327U1 (de) 2009-06-18
US7913748B2 (en) 2011-03-29

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