JP5179967B2 - LED lighting fixtures - Google Patents

Description

  The present invention relates to an LED lighting apparatus having an LED (light emitting diode) as a light source.

Conventionally, various LED lighting fixtures using LEDs as light sources are known (see, for example, Patent Document 1). On the other hand, since the amount of heat generated by the LED increases with the increase in the output of the LED, a countermeasure against the heat generation of the LED is required in order to extend the life of the LED.
Therefore, in the conventional lighting fixture, a large number of heat radiation fins are provided in the lamp body, and the first technology for dissipating heat by the heat transfer action from the heat radiation fins to the outside air has sufficient heat capacity for the amount of heat generated by the LED. Second technology for incorporating a heat sink that absorbs the heat generated by the LED into the lamp body, a third technique in which the lamp body itself has a sufficient heat capacity for the amount of heat generated by the LED, and the lamp body absorbs the heat generated by the LED, etc. Various technologies have been proposed.
JP 2007-234558 A

  However, the first technique has a problem in that dust and dirt accumulate between the radiating fins and the heat radiating effect is reduced. This problem is particularly noticeable when the luminaire is used outdoors. Furthermore, depending on the installation state of the luminaire, there is a problem in that the heat dissipating fins are close to the mounting surface, so that it is difficult for air to flow through the heat dissipating fins and the heat dissipating effect is reduced. Decreasing the heat dissipation effect leads to shortening of the LED life and decreasing the luminous flux, and hinders stable use of the lighting fixture.

  Further, in the second technique, although the problem of the first technique is solved, it is necessary to increase the volume of the heat sink in order to give the heat sink a sufficient heat capacity for the heat generation of the LED. For this reason, there exists a problem that the lamp main body which accommodates a heat sink will also enlarge. Further, when the number of LEDs is increased or the output of the LEDs is increased in order to increase the luminous flux amount of the lighting fixture, the size of the heat sink exceeds the size that can be practically used.

  In the third technique, in order to give the lamp body a sufficient heat capacity for the amount of heat generated by the LED, the lamp body is made of metal and its thickness is set to a sufficient thickness. There is a problem that the mass of the lamp body becomes heavy. As a result, for example, a member that holds the lighting device such as an arm on the mounting surface and a strong strength are required for the mounting surface, and the installation location of the lighting device is limited. Similarly to the second technique, when the number of LEDs is increased or the output is increased, it is very difficult to construct a lamp body that can withstand practical use.

  This invention is made | formed in view of the situation mentioned above, provides the LED lighting fixture which can suppress reduction of the heat dissipation effect of LED, and can implement | achieve sufficient heat dissipation with the lamp body of a practical magnitude | size. For the purpose.

In order to achieve the above object, the present invention provides a bottomed lamp body having a projection opening on the front surface , an arm that rotatably supports the lamp body and that can adjust a light projection direction, and the lamp. an LED light source that is spaced apart from the bottom surface of the main body, and the LED light source and is provided between the bottom of the lamp body, the transfer heat heat transfer unit of the LED light source emits heat to the lamp body, The heat transfer unit includes a heat receiving portion that contacts the LED light source and receives heat to contact the inner surface of the lamp body and transfers heat, and a bottom heat transfer portion that contacts the bottom surface of the lamp body. And a unit body having high thermal conductivity, a straight part extending to the heat receiving part of the unit body, a straight part extending to the bottom heat transfer part, and a bent part connecting these straight parts, and a working fluid inside There is enclosed, the heat receiving portion of the unit body and the bottom heat transfer unit The provided a heat pipe thermally connected, and to provide an LED lighting apparatus, characterized in that provided in the unit body by intersecting the respective bent portion of the at least two of said heat pipes.

Moreover, this invention is the LED lighting fixture which concerns on the said invention, In the unit main body of the said heat-transfer unit, the trunk | drum between the said heat receiving part and the said bottom face heat-transfer part is set to the direction of the said axis of rotation. A plurality of penetrating cavities are formed.

  Further, the present invention provides the LED lighting apparatus according to the present invention, wherein the heat pipe has a cross-sectional area, a cross-sectional area of the body portion between the heat receiving portion and the bottom surface heat transfer portion in the unit body of the heat transfer unit, and The ratio of the cross-sectional area of the heat receiving portion is a predetermined ratio that makes the temperature of the outer shell of the lamp body that has received heat from the LED light source substantially uniform.

  Moreover, this invention WHEREIN: In the LED lighting fixture which concerns on the said invention, ratio of the cross-sectional area of the said heat pipe, the cross-sectional area of the said trunk | drum, and the cross-sectional area of the said heat receiving part was set to 1: about 30: about 15. It is characterized by.

In the LED lighting apparatus according to the present invention, the unit main body of the heat transfer unit contacts the inner side surface at an intermediate position between the contact portion of the inner side surface of the lamp main body and the bottom surface that the heat receiving unit contacts. There may be a configuration including an intermediate heat transfer section that transfers heat.
Moreover, in the LED lighting apparatus according to the present invention, a straight line connecting a connection point between the one end side of the heat pipe and the heat receiving portion and a connection point between the other end side of the heat pipe and the bottom heat transfer portion. However, there may be a configuration in which the heat receiving part and the bottom surface heat transfer part are connected by the heat pipe so as to be inclined with respect to the light projecting direction.

  According to the present invention, the heat generated by the LED light source is transferred to the lamp body through the heat transfer unit, and is radiated from the outer surface of the lamp body to the outside air. At this time, in addition to the heat of the LED light source being transferred to the side surface of the lamp body by the heat receiving portion, the heat is also transferred to the bottom heat transfer portion connected to the heat receiving portion via the heat pipe. As a result, heat is transmitted not only to the side surface of the lamp body but also to the bottom surface, and heat is dissipated using substantially the entire outer surface of the lamp body. This makes it possible to achieve sufficiently high heat dissipation without the need for heat dissipation fins, and it is not necessary to incorporate a heat sink in the lamp body or to increase the heat capacity of the lamp body itself. And a sufficient heat dissipation can be realized with a practically sized lamp body.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a front view of an LED projector 1 as one aspect of a lighting apparatus according to the present embodiment, FIG. 2 is a rear view of the LED projector 1, and FIG. 3 is a main cross-sectional view of the LED projector 1 as viewed from the side.
As shown in these drawings, the LED projector 1 includes a lamp body 4 in which an LED light source unit 2 is housed, a power supply case 6 provided integrally with the lamp body 4, and a power supply case 6 that is rotatably supported. And an arm 8 to be operated.
As shown in FIG. 3, the lamp body 4 is formed of, for example, aluminum die casting so as to form a bottomed box shape that gradually expands from the back side to the front side, and is formed by a substantially rectangular opening on the front side. A light projection opening 10 is formed, and an aluminum die-cast front frame 12 is attached to the light projection opening 10. In this embodiment, the lamp body 4 has a volume of 50000 mm ³ / W or less with respect to the power consumption of the LED light source unit 2 and is miniaturized.
The front frame 12 is configured to be openable and closable with the lower surface 4A side of the lamp body 4 as a support shaft, and is configured to be latched on the upper surface 4B of the lamp body 4 by a latch 13 (FIG. 2). A front glass 14 that closes the light projection opening 10 of the lamp body 4 is fitted into the front frame 12.

  The power supply case 6 has a built-in power supply in which external power is supplied through the power line 16 and converted into power suitable for the LED light source unit 2 to supply power. The power supply case 6 is formed by molding, for example, aluminum die casting into a substantially box shape having the same width as the lamp body 4, and is integrally connected to the lower surface 4 </ b> A of the lamp body 4. A large number of radiating fins 18 (FIGS. 2 and 3) are provided on the outer surface of the power supply case 6 for radiating heat generated by the built-in power supply.

The arm 8 is a support member formed by bending a flat plate-like member into a substantially U-shape, and an arm clamping screw so that the power supply case 6 can be rotated around the rotation support shaft P between two tip portions. 20 is pivotally supported. When the arm fastening screw 20 is loosened, the power supply case 6 can be rotated around the rotation support shaft P with respect to the arm 8 integrally with the lamp body 4 as shown in FIG.
As shown in FIGS. 4 (A) and 4 (B), the LED projector 1 is installed on the mounting surface S so that the light projecting surface faces downward or upward, and supports the power supply case 6 and the lamp body 4 in a rotating manner. The projection direction Q is adjusted by rotating around the axis P.

As shown in FIG. 3, the LED light source unit 2 includes a plurality of LED devices 30 and a heat transfer unit 32 that transfers heat generated by each LED device 30 to the lamp body 4.
As shown in FIG. 1, each LED device 30 is arranged in a matrix form vertically and horizontally, and in this embodiment, 4 × 6 LED devices 30 are arranged to constitute a light source. As shown in FIG. 3, each LED device 30 includes, for example, a 1.2 W high-power light emitting diode element (LED element) 40 and a lens body 42 provided on the light emitting surface of the light emitting diode element 40. It is configured to be mounted on an aluminum plate-like substrate 44 having excellent thermal conductivity. The substrate 44 may be provided for each LED device 30, but in the present embodiment, 2 × 6 light emitting diode elements 40 are mounted on one substrate 44.

The heat transfer unit 32 includes a holding plate 46 and a heat transfer body 48 as a unit body.
The holding plate 46 is formed by molding an aluminum material having high thermal conductivity into a flat square dish shape, and as shown in FIG. 3, the side surface 46A is brought into close contact with the inner side surface 4D of the lamp body 4 so that heat can be transferred. The lamp body 4 is fitted into and fixed to the lamp body 4, and the two substrates 44 are juxtaposed on the flat surface. That is, the holding plate 46 functions as a heat receiving portion that receives heat generated by each LED device 30 mounted on the substrate 44, and transfers the received heat from the side surface 46 </ b> A to the inner side surface 4 </ b> D of the lamp body 4.
Such a holding plate 46 is positioned away from the inner bottom surface 4C (30 mm in this embodiment) in order to arrange each LED device 30 in the vicinity of the light projecting opening 10 of the lamp body 4 and increase the illumination efficiency of the lamp body 4. (Positions separated from each other). The heat transfer body 48 is disposed between the holding plate 46 and the inner bottom surface 4 </ b> C of the lamp body 4.

FIG. 5 is a diagram showing a configuration of the heat transfer body 48.
The heat transfer body 48 is molded from, for example, aluminum, which is a metal material having high thermal conductivity, and as shown in FIGS. 3 and 5, a holding plate mounting portion 50 that is in surface contact with the holding plate 46 and thermally connected thereto. And a bottom surface heat transfer portion 52 in surface contact with the inner bottom surface 4C of the lamp body 4, and a set of heat transfer means for thermally connecting between the holding plate mounting portion 50 and the bottom surface heat transfer portion 52. Heat pipes 54 and 56 are provided.
With this configuration, the heat generated by the LED device 30 is transferred from the holding plate mounting portion 50 thermally connected to the holding plate 46 to the bottom surface heat transfer portion 52 via the heat pipes 54 and 56. 52 is transmitted to substantially the entire inner bottom surface 4 </ b> C of the lamp body 4.

  That is, in addition to the heat transfer from the holding plate 46 serving as the heat receiving portion to the inner side surface 4D of the lamp body 4, heat is also transferred to the inner bottom surface 4C of the lamp body 4 by the bottom surface heat transfer portion 52. The heat is transferred over substantially the entire lamp body 4, and heat is radiated to the outside air using substantially the entire outer surface of the lamp body 4. At this time, since the holding plate 46 and the bottom surface heat transfer section 52 are connected by the heat pipes 54 and 56, both have substantially the same temperature. As a result, the holding plate 46 and the bottom surface heat transfer section 52 have the same degree. The heat is dissipated.

  The configuration is not limited to the configuration where the LED device 30 is mounted on the holding plate 46, and may be directly attached and fixed to the holding plate mounting portion 50 of the heat transfer body 48. In this case, the edge portion 50A of the holding plate mounting portion 50 is extended so as to be in surface contact with the inner side surface 4D of the lamp body 4, and the heat generated by the LED device 30 is transferred to the inner side surface 4D.

  Now, the configuration of the heat transfer body 48 will be described in more detail. The heat transfer body 48 has a body portion 58 that connects the holding plate mounting portion 50 and the bottom surface heat transfer portion 52, and both side surfaces 58 </ b> A of the body portion 58. 58B is further provided with an intermediate heat transfer section 60 that is a ridge extending in the width direction of the lamp body 4 and whose tip is in surface contact with the inner side surface 4D of the lamp body 4.

The front end portion of the intermediate heat transfer portion 60 is in surface contact with the inner side surface 4D of the lamp body 4 at a substantially intermediate position between the location of the inner side surface 4D with which the side surface 46A of the holding plate 46 contacts and the inner bottom surface 4C. .
With this configuration, the heat generated by the LED device 30 is transmitted from the holding plate mounting portion 50 and the bottom surface heat transfer portion 52 through the body portion 58 to the intermediate heat transfer portion 60 through the same amount of heat. The heat has the same level as that of the bottom heat transfer section 52, and this heat is transferred to the inner side surface 4 </ b> D of the lamp body 4.
Thereby, heat can be transmitted substantially uniformly over the entire lamp body 4 to dissipate it.

The body portion 58 is formed with a plurality of hollow portions 62 penetrating in the width direction of the lamp body 4, thereby reducing the weight of the heat transfer body 48. Although the effect of reducing the weight can be obtained as the volume of the hollow portion 62 is increased, if it is too large, heat conduction to the intermediate heat transfer portion 60 may be hindered. In the present embodiment, the volume of the heat transfer body 48 is about 15% to 20% with respect to the volume of the lamp body 4, and the volume of the cavity 62 is 40% to 50% with respect to the volume of the heat transfer body 48. Thus, the maximum and minimum temperature difference on the outer surface of the lamp body 4 is 3 ° C. or less, and uniform heat dissipation using the entire outer surface of the lamp body 4 is realized.
Further, by setting the volume of the cavity 62 to 40% to 55% with respect to the volume of the heat transfer body 48, the temperature estimated by the calculation at the junction of the light emitting element in the light emitting diode 40, and the outer surface of the lamp body 4 Can be suppressed to 25 ° C. or less, and the LED projector 1 having a small temperature difference between the LED device 30 and the lamp body 4, that is, excellent in cooling performance is realized.

Such a heat transfer body 48 is formed by, for example, extruding aluminum to integrally form the holding plate mounting portion 50, the bottom surface heat transfer portion 52, the body portion 58, the intermediate heat transfer portion 60, and the cavity portion 62. It is configured to prevent excessive thermal resistance from being generated due to bonding or the like.
Here, in addition to the heat transfer through the heat pipes 54 and 56 from the holding plate mounting part 50 to the bottom heat transfer part 52, heat is also transferred through the body part 58, but the heat conductivity of aluminum. Is generally about 200 W · m ⁻¹ · K ⁻¹ , and loss of heat conduction occurs depending on the distance to the lamp body 4, so the holding plate mounting portion 50 and the bottom surface heat transfer portion 52 There is a temperature difference between them. On the other hand, each of the heat pipes 54 and 56 of the present embodiment has a heat about 50 times higher than that of a metal material having high thermal conductivity (for example, 237 W · m ⁻¹ · K ⁻¹ of the thermal conductivity of aluminum). Since it has conductivity and can move almost the same heat quickly regardless of the distance, the heat generated by the LED device 30 is quickly transferred from the holding plate mounting portion 50 to the bottom heat transfer portion 52 without loss of heat. It is possible to suppress the temperature difference between them.
Incidentally, in the configuration in which the heat pipes 54 and 56 are removed from the heat transfer body 48, the temperature difference between the LED device 30 and the inner bottom surface 4C of the lamp body 4 reaches 40 ° C., and the LED device 30 has a short life. It becomes the imprisonment of the conversion and the decrease of luminous flux.

  Next, the attachment structure of the heat pipes 54 and 56 to the heat transfer body 48 will be described. Each of the holding plate attachment portion 50 and the bottom surface heat transfer portion 52 has a holding plate 46 or an inner bottom surface 4C as shown in FIG. Two pipe grooves 64 are formed in the surface in contact with each other, and the straight portions 54A, 56A, 54B, and 56B of the heat pipes 54 and 56 bent in a U-shape are fitted into each pipe groove 64. . As described above, the heat pipes 54 and 56 are configured to be accommodated in the pipe groove 64, so that heat is generated between the holding plate mounting portion 50 and the holding plate 46 and between the bottom surface heat transfer portion 52 and the inner bottom surface 4C. A gap is prevented from being formed by the pipes 54 and 56 so that the thermal conductivity is not impaired.

Here, when one straight portion 56A of the heat pipe 56 is connected to the holding plate mounting portion 50 and the other straight portion 56B of the heat pipe 56 is connected to the bottom surface heat transfer portion 52, the holding plate mounting portion 50 is connected. The extending direction of the bent portion 56 </ b> C, which is a path from the base to the bottom heat transfer section 52, is connected so as to be inclined with respect to the front direction (light projection direction Q) of the lamp body 4.
More specifically, as shown in FIG. 4, the lamp body 4 is configured to be able to adjust the light projecting direction Q by being rotatably held by the arm 8. If the rotation angle α = 0 degrees of the lamp body 4 is in a state where the light projection direction Q shown in FIG. 4A is vertically downward, the rotation angle α exceeds 90 degrees as shown in FIG. 4B. In this case, in the heat transfer body 48, the holding plate mounting portion 50 is positioned above the bottom surface heat transfer portion 52 as shown in FIG. On the other hand, the heat pipe 56 encloses the hydraulic fluid therein, evaporates the hydraulic fluid at the holding plate mounting portion 50 on the heat source side, and moves the vapor to the bottom surface heat transfer portion 52 on the heat radiation source side to condense. Thus, heat is transferred from the holding plate mounting portion 50 toward the bottom heat transfer portion 52.
That is, as shown in FIG. 6B, when the holding plate mounting portion 50 is positioned above the bottom surface heat transfer portion 52, the working fluid in the heat pipe 56 is on the heat radiation source side unless any countermeasure is taken. It accumulates in the bottom heat transfer section 52 and the heat transfer function is reduced.

Therefore, in this embodiment, as shown in FIG. 6A, when the surface of the holding plate mounting portion 50 is vertical (rotation angle α = 90 degrees), the holding plate mounting portion 50 and the heat pipe 56, the connection point SA2 between the other straight part 56B of the heat pipe 56 and the bottom surface heat transfer part 52 is positioned above the connection point SA1 with one straight part 56A, and the two connection points SA1, The heat pipe 56 is attached so that the straight line connecting SA2 is inclined with respect to the light projecting direction Q.
Accordingly, as shown in FIG. 6A, even when the lamp body 4 is rotated to the rotation angle α = 90 degrees in order to direct the light projecting direction Q in the horizontal direction, the heat pipe 56 holds the lamp. Since the connection point SA1 with the plate mounting part 50 is maintained below the connection point SA2 with the bottom surface heat transfer part 52, the heat transfer function of the heat pipe 56 can be maintained well.

  Further, as shown in FIG. 6B, even when the lamp body 4 has a rotation angle α> 90, the connection is made up to the rotation angle αth at which the connection points SA1 and SA2 are both at the same height position. The point SA1 can be positioned below the connection point SA2, and the heat transfer function of the heat pipe 56 can be maintained well as described above. The rotation angle αth is an angle formed by a straight line connecting the connection point SA1 and the connection point SA2 and the normal direction of the surface of the holding plate mounting portion 50 (in the present embodiment, coincides with the light projecting direction Q) as θ. In this case, αth = 90 degrees + θ.

When the connection points SA1 and SA2 of the heat pipe 54 are arranged so as to be shifted from each other when viewed from the light projecting direction Q, the lamp body 4 is rotated 90 degrees when the heat transfer body 48 is stored in the lamp body 4. Therefore, it is necessary to take care that the connection point SA2 is located above the connection point SA1. Therefore, in this embodiment, when the top and bottom of the heat transfer body 48 is reversed, by providing the heat pipe 54 arranged in the same manner as the heat pipe 56, when the heat transfer body 48 is housed in the lamp body 4, The need to consider the orientation of the heat transfer body 48 is eliminated.
Further, by providing such a heat pipe 54, the U-shaped portions (bent portions 54C and 56C) of the heat pipes 54 and 56 face different directions (in a non-parallel state), and particularly in the present embodiment. 6, since the heat pipes 54 and 56 are laid out symmetrically with respect to a straight line in the normal direction (light projecting direction Q) of the surface of the holding plate mounting portion 50, for example, the heat pipes 54 and 56 There is an effect that the amount of heat transferred by the heat exchanger becomes substantially uniform.
Thereby, even when the rotation angle α> αth, a good heat transfer function can be maintained by two or more heat pipes.

Further, in the present embodiment, when the set of heat pipes 54 and 56 is attached to the heat transfer body 48, as shown in FIG. 5, it is a path from the holding plate attachment portion 50 to the bottom surface heat transfer portion 52. The bent portions 54C and 56C of the heat pipes 54 and 56 are attached so as to face each other with the heat transfer body 48 interposed therebetween.
By configuring in this way, the lamp is such that any one of the bent portions 54C and 56C of the heat pipes 54 and 56 is positioned below the straight portions 54A and 56A arranged on the surface of the holding plate mounting portion 50. When the main body 4 is disposed at an inclination, the working fluid is accumulated in the bent portions 54C and 56C located on the lower side thereof, but the other bent portions 54C and 56C are more than the straight portions 54A and 56A. Since it is always located on the upper side, the hydraulic fluid always accumulates in one of the straight portions 54A and 56A, and the heat transfer function of one of the heat pipes 54 and 56 is maintained well.

  Thus, by eliminating the directionality of the heat transfer body 48, in the LED projector 1 of this embodiment, even when the direction of the light projecting direction Q of the lamp body 4 is arbitrarily changed, the light emission in the light emitting diode 40 is achieved. The temperature difference between the temperature estimated by the calculation at the junction of the element and the outer surface of the lamp body 4 can be kept within a range of 23 ° C. to 25 ° C., and the lamp body 4 can be in the posture (direction of the light projecting direction Q). Regardless, it is possible to maintain a constant cooling performance and maintain the LED light source unit 2 at an appropriate temperature.

In particular, in this embodiment, about 45% of the heat generation amount of the LED light source unit 2 is transferred to the outer bottom surface of the lamp body 4. About 75% of the heat transferred to the outer bottom surface is transferred through the heat pipes 54 and 56, and the remaining 25% is transferred by the heat transfer body 48.
Further, 35% of the heat generated by the LED light source unit 2 is transferred to the outer side surface of the lamp body 4 through the holding plate 46 and the intermediate heat transfer unit 60 as heat receiving parts. In addition, 20% of the heat amount is transferred from the bottom surface heat transfer section 52 so that a total of about 55% of the heat amount is transferred.
In the present embodiment, the ratio of the cross-sectional area of the two heat pipes 54 and 56, the cross-sectional area of the body 58 of the heat transfer body 48, and the cross-sectional area of the holding plate 46 serving as the heat receiving part is 1: about 30: about 15. Thus, the distribution of the heat amount to the outer bottom surface and the outer side surface as described above is accurately realized.
By distributing the heat transfer amount of the LED light source unit 2 in this way, the temperature of the outer surface of the lamp body 4 becomes substantially uniform as a whole, and the entire outer surface of the lamp body 4 is efficiently used as a heat radiator. Then, heat is radiated to the outside air, and the temperature of the LED light source unit 2 can be suppressed to an appropriate temperature.

  As described above, according to the present embodiment, the heat transfer unit 32 that transfers the heat generated by the LED light source unit 2 to the lamp body 4 between the LED light source unit 2 and the inner bottom surface 4C of the lamp body 4. The heat transfer unit 32 is in surface contact with the entire surface of the substrate 44 of the LED light source unit 2 to receive heat from the LED light source unit 2 and contact the inner side surface 4D of the lamp body 4 to transfer heat. In addition to the holding plate 46, a bottom heat transfer portion 52 that is in surface contact with substantially the entire inner bottom surface 4C of the lamp body 4 and a heat pipe 54 that thermally connects the holding plate 46 and the bottom heat transfer portion 52 are provided. Configured.

According to this configuration, the heat generated by the LED light source unit 2 is transferred from the holding plate 46 to the inner side surface 4D of the lamp body 4 by the holding plate 46, and the bottom heat transfer section 52 from the holding plate 46 through the heat pipe 54. Heat is also transferred. As a result, heat is transferred not only to the side surface of the lamp body 4 but also to the inner bottom surface 4 </ b> C equally to the side surface, and heat is dissipated using substantially the entire outer surface of the lamp body 4.
Thereby, it is possible to achieve a sufficiently high heat dissipation without providing a heat radiating fin in the lamp body 4, and it is necessary to incorporate a heat sink in the lamp body 4 or to increase the heat capacity of the lamp body 4 itself. Therefore, it is possible to suppress the reduction of the heat dissipation effect of the LED and to achieve sufficient heat dissipation with the lamp body 4 having a practical size.

  In addition, according to the present embodiment, the inside of the lamp body 4 that is thermally connected to the heat transfer body 48 of the heat transfer unit 32 with the holding plate 46 and the bottom heat transfer portion 52 that are heat receiving portions, and the holding plate 46 contacts. Since the intermediate heat transfer section 60 that contacts and heats the inner side surface 4D is provided at an intermediate position between the location of the side surface 4D and the inner bottom surface 4C, temperature unevenness of the entire side surface of the lamp body 4 is suppressed, Heat can be dissipated substantially uniformly from the entire outer surface of the main body 4.

  Further, according to the present embodiment, the heat transfer body 48 of the heat transfer unit 32 is integrally formed by extrusion molding of aluminum having high thermal conductivity, and is also thermally connected in contact with the holding plate 46 serving as a heat receiving portion. Since the hollow portion 62 is provided in the body portion 58 between the holding plate mounting portion 50 and the bottom surface heat transfer portion 52, the weight of the heat transfer body 48 can be reduced.

In particular, the volume of the heat transfer body 48 is set to about 15% to 20% with respect to the volume of the lamp body 4, and the volume of the cavity 62 is set to 40% to 50% with respect to the volume of the heat transfer body 48. Thus, the maximum and minimum temperature difference on the outer surface of the lamp body 4 is set to 3 ° C. or less, and the heat generation of the LED light source unit 2 can be uniformly transmitted to the entire outer surface of the lamp body 4.
Moreover, the contact location between the board | substrate 44 of LED device 30, and the holding | maintenance board 46 (holding board attaching part 50) is set to 40%-55% of the volume of the cavity part 62 with respect to the volume of the heat exchanger 48. And the temperature difference with the outer surface of the lamp | ramp main body 4 can be suppressed to 25 degrees C or less, and the LED projector 1 excellent in cooling property is implement | achieved.

  Further, according to the present embodiment, the connection point SA1 between the one end side of the heat pipe 54 and the holding plate 46 (holding plate mounting portion 50) as the heat receiving portion, the other end side of the heat pipe 54, and the bottom surface heat transfer portion 52 Since the heat pipe 54 connects the holding plate mounting part 50 and the bottom heat transfer part 52 so that the straight line connecting the connection point SA2 is inclined with respect to the light projecting direction Q, the light projecting direction Q Can be maintained substantially horizontally, the connection point SA1 is located below the connection point SA2, and the heat transfer function of the heat pipe 54 can be maintained well.

  In the present embodiment, the ratio of the cross-sectional area of the two heat pipes 54 and 56, the cross-sectional area of the body 58 of the heat transfer body 48, and the cross-sectional area of the holding plate 46 serving as the heat receiving part is 1: about 30: about 15. With this predetermined ratio, the temperature of the entire outer surface of the lamp body 4 becomes substantially uniform, and the entire outer surface of the lamp body 4 is efficiently used as a radiator to dissipate heat to the outside air. The temperature can be suppressed to an appropriate temperature.

The above-described embodiment is merely an aspect of the present invention, and can be arbitrarily modified and applied within the scope of the present invention.
For example, in the above-described embodiment, the bent portions 54C and 56C of the pair of heat pipes 54 and 56 are provided so as to intersect with each other when viewed from the side surface of the lamp body 4, but not limited thereto, the bent portions 54C and 56C. However, it is only necessary that the axis is symmetric with respect to the normal direction of the holding plate mounting portion 50.
Further, for example, in the above-described embodiment, the case where the LED lighting device of the present invention is applied to a projector has been described. However, the present invention is not limited to this, and any lighting device may be used as long as the lighting device has a configuration in which the LED light source is housed in the lamp body. The present invention can be applied to instruments.

It is a front view of the LED projector which is 1 aspect of the lighting fixture which concerns on embodiment of this invention. It is a rear view of a LED projector. It is the principal sectional view which looked at the LED floodlight from the side. It is a figure which shows the attachment aspect of LED projector. It is a figure which shows the structure of a heat exchanger. It is a figure which shows the attachment aspect of 1 set of heat pipes.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 LED projector 2 LED light source unit 4 Lamp main body 4C Inner bottom surface 4D Inner side surface 10 Light projection opening 30 LED apparatus 32 Heat transfer unit 40 Light emitting diode element 46 Holding plate 48 Heat transfer body 50 Holding plate attachment part 52 Bottom heat transfer part 54, 56 Heat pipe 58 Body 60 Intermediate heat transfer 62 Cavity Q Light projection direction SA1, SA2 Connection point

Claims (4)

A bottomed lamp body with a projection opening on the front ;
An arm that rotatably supports the lamp body and adjusts a light projecting direction;
An LED light source disposed away from the bottom surface of the lamp body ;
A heat transfer unit that is provided between the LED light source and the bottom surface of the lamp body, and transfers heat generated by the LED light source to the lamp body;
The heat transfer unit is
A unit having high heat conductivity, having a heat receiving part that contacts the LED light source and receives heat to contact and heat transfer to the inner surface of the lamp body, and a bottom heat transfer part that contacts the bottom surface of the lamp body The body,
The unit body has a linear portion extending to the heat receiving portion, a linear portion extending to the bottom surface heat transfer portion, and a bent portion connecting these linear portions, and the working fluid is sealed therein, and the heat receiving portion and bottom surface of the unit body A heat pipe that thermally connects the heat transfer section;
Equipped with a,
The LED lighting apparatus according to claim 1, wherein the unit main body is provided with the bent portions of at least two heat pipes intersecting each other . The unit body of the heat transfer unit is characterized in that a plurality of hollow portions penetrating in the direction of the axis of rotation are formed in a body portion between the heat receiving portion and the bottom surface heat transfer portion. Item 2. The LED lighting apparatus according to Item 1.   The ratio of the cross-sectional area of the heat pipe, the cross-sectional area of the body part between the heat receiving part and the bottom heat transfer part in the unit main body of the heat transfer unit, and the ratio of the cross-sectional area of the heat receiving part is determined as the heat generation of the LED light source. The LED lighting apparatus according to claim 1, wherein the temperature of the outer shell of the lamp body that has received the light is set to a predetermined ratio that is substantially uniform.   4. The LED lighting apparatus according to claim 3, wherein a ratio of a cross-sectional area of the heat pipe, a cross-sectional area of the body portion, and a cross-sectional area of the heat receiving portion is 1: approximately 30: approximately 15. 5.

Images