JP6349798B2 - Vehicle lighting - Google Patents

Description

  The present invention relates to a vehicular lamp.

  Conventionally, a vehicular lamp using a heat sink in which a metal flat plate is bent to support a substrate having a semiconductor-type light emitting element and a heat sink is formed behind the support portion is known (for example, Patent Documents). 1)

In recent years, the output of semiconductor light emitting devices has been increasing, and it is expected that high output semiconductor light emitting devices will be used in vehicle lamps.
However, the high-power semiconductor light-emitting element has a large heat capacity generated by the semiconductor-type light-emitting element, and the size of components and the like on which a substrate having the semiconductor-type light-emitting element is arranged is increased.

JP 2010-146817 A

  As disclosed in Patent Document 1, in the case of providing a heat dissipation part behind the support part that supports the substrate, the area of the portion where the substrate is arranged becomes large in consideration of increasing the output of the semiconductor light emitting element. There is a concern that the distance from the heat-emitting semiconductor-type light-emitting element to the heat-dissipating part is reduced, so that the heat-dissipation effect is reduced, and a sufficient cooling effect cannot be obtained with respect to the heat capacity of the semiconductor-type light-emitting element that increases due to higher output. .

  On the other hand, in order to ensure the thermal conductivity to the heat radiating part, it may be possible to increase the thickness of the part that conducts heat. However, if this is done, it will be necessary to increase the thickness of the metal plate, and productivity such as bending and pressing will occur. There is a problem that processing with good processing means becomes difficult.

  The present invention has been made in view of such circumstances, and realizes high heat dissipation without increasing the thickness of a member on which a substrate having a semiconductor type light emitting element is disposed, and has high productivity such as press molding. An object of the present invention is to provide a vehicular lamp that can be manufactured by the means.

The present invention is grasped by the following composition in order to achieve the above-mentioned object.
(1) A vehicular lamp according to the present invention includes a housing having an opening in the front, an outer lens attached to the opening, and a light source unit disposed in a lamp chamber formed by the housing and the outer lens, A light source unit is provided on a base plate, a substrate having a semiconductor-type light emitting element provided on the surface of the base plate, and a back surface of the base plate, and is disposed at a position facing the substrate across the base plate. It is equipped with this board.

(2) In the configuration of (1), the base plate has a recess formed by pressing and deforming the base plate from the front surface side to the back surface side, and the substrate is provided in the recess.

(3) In the configuration of (1) or (2), a reflector is provided on the surface of the base plate and reflects light from the semiconductor light emitting element.

(4) In any one of the constitutions (1) to (3), the base plate has an aiming recess for receiving a tip of an aiming screw formed by extruding and deforming the base plate.

(5) In any one of the constitutions (1) to (4), the base plate and the contact plate are made of the same material.

(6) In any one configuration of the above (1) to (5), between the base plate and the substrate and between the base plate and the contact plate, there is a heat radiation grease or a heat radiation sheet. Intervened.

(7) In any one of the constitutions (1) to (6), the base plate has a tap for fixing the contact plate, and the contact plate has a hole for inserting the tap. The tap is formed by pushing and deforming the base plate from the front surface side to the back surface side.

(8) In any one of the constitutions (1) to (7), the plate has a holding portion for holding a cooling fan on the surface opposite to the surface facing the base plate, A cooling fan is fixed to the holding portion.

  ADVANTAGE OF THE INVENTION According to this invention, the high heat dissipation is implement | achieved, without increasing the thickness of the member which arrange | positions the board | substrate which has a semiconductor type light emitting element, and it can manufacture by means with high productivity like press molding. Lamps can be provided.

1 is a plan view of a vehicle including a vehicle lamp according to a first embodiment of the present invention. It is sectional drawing of the vehicle lamp of FIG. It is the disassembled perspective view which looked at the light source unit part of FIG. 2 from the back surface side. It is the perspective view which looked at the light source unit part of FIG. 2 from the back surface side. It is a perspective view explaining the light source unit of 2nd Embodiment which concerns on this invention. It is the disassembled perspective view which looked at the light source unit part of 3rd Embodiment which concerns on this invention from the back surface side. It is sectional drawing of the principal part of the light source unit of 3rd Embodiment which concerns on this invention.

DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention (hereinafter referred to as “embodiments”) will be described in detail with reference to the accompanying drawings.
In description of embodiment, the same number is attached | subjected to the same element through the whole.
In this specification, front, rear, upper, lower, left, and right indicate directions viewed from a driver who rides on the vehicle when the vehicular lamp is mounted on the vehicle.

(First embodiment)
The vehicular lamp according to the embodiment of the present invention is a vehicular lamp (101R, 101L) provided on the left and right in front of the vehicle 102 shown in FIG. 1, and the configuration of the left and right vehicular lamps (101R, 101L) is left and right. Since it is symmetrical, only the left vehicle lamp 101L will be described below.

(Overall configuration of vehicle lamp)
FIG. 2 is a cross-sectional view of the vehicular lamp 101L cut through the center of the semiconductor light emitting element 51, and is a cross-sectional view of the vehicular lamp 101L viewed from the side.
As shown in FIG. 2, the vehicular lamp 101 </ b> L includes a housing 10 having an opening forward toward the front side of the vehicle and an outer lens 20 attached to the opening of the housing 10, and the lamp chamber is formed in the lamp chamber. A light source unit 30 attached to the housing 10 by an attachment means (not shown) is accommodated.

The light source unit 30 includes a base plate 40, a substrate 50 having a semiconductor light emitting element 51 provided on the surface of the base plate 40, a contact plate 60 provided on the back surface of the base plate 40, and a surface of the base plate 40. The reflector 70 provided is mainly provided.
In addition, you may make it provide the shade which light-shields a part of light reflected with the reflector as needed.

(light source)
As the light source, a semiconductor light emitting element 51 provided on a substrate 50 is used.
The semiconductor light-emitting element 51 is a self-light-emitting light-emitting element such as an LED or an EL (organic EL), for example, and is mounted on the substrate 50 via a wiring pattern formed on the substrate 50 as shown in FIG. Power is supplied. There are no particular restrictions on the number or shape of the semiconductor light emitting elements 51 used to form the light emitting section. For example, a plurality of square semiconductor light emitting elements 51 are arranged in a horizontal direction to form a planar rectangular shape as a whole. The light emitting surface may be formed, or the light emitting surface may be formed by providing only one square or rectangular semiconductor light emitting element 51. Further, the semiconductor light emitting element 51 may be packaged by sealing with a sealing resin.

The substrate 50 having the semiconductor light emitting element 51 may be provided so as to be in direct contact with the surface of the base plate 40, but as shown in FIG. 2, a thermally conductive material is provided between the substrate 50 and the base plate 40. It is preferable that the high heat radiation grease 46 and the heat radiation sheet 47 are sandwiched and fixed.
If it does in this way, the thermal radiation grease 46 and the thermal radiation sheet 47 will enter into the minute unevenness of the back surface (surface facing the base plate 40) of the substrate 50 and the surface of the base plate 40, and it can be formed between the substrate 50 and the base plate 40. The minute gaps are filled with the material having high heat conductivity (heat radiation grease 46 and heat radiation sheet 47), and good heat conduction can be obtained, so that heat radiation can be improved.

(Reflector)
As shown in FIG. 2, the reflector 70 is provided on the surface of the base plate 40 so as to cover the semiconductor light emitting element 51 from the upper side in a substantially semi-dome shape.
The reflector 70 is provided with a focal point F1 at or near the light emission center O1 of the light emitting surface formed by the semiconductor light emitting element 51 so that the light from the semiconductor light emitting element 51 is in a desired light distribution state. Is reflected to the front side of the vehicle.

(Base plate)
The base plate 40 is formed by pressing a plate material having high thermal conductivity. For this reason, the base plate 40 has almost the same thickness in any part, and the thickness is preferably 2 mm or less from the viewpoint of workability. Examples of the material having high thermal conductivity used for the base plate 40 include aluminum. In the case of aluminum, pure aluminum having high purity is preferable in terms of thermal conductivity.
Furthermore, the base plate 40 may be painted to increase the emissivity.
In this case, painting may be performed at the stage of the plate material before press processing, or may be performed after the press processing, but the cost can be reduced by performing the coating at the stage of the plate material. preferable.

As shown in FIG. 2, the base plate 40 has a recess 41 for placing the substrate 50 having the semiconductor light emitting element 51.
More specifically, the base plate 40 is a member having a shape formed by pressing a metal flat plate, and the concave portion 41 is formed on the base plate 40 from the front side (upper side in the figure) to the back side (lower side in the figure). It is formed by extruding and deforming with a press.

  Although the size of the recess 41 is not particularly limited, in this example, the size is substantially the same as the size of the substrate 50. In this way, the substrate 50 having the semiconductor light emitting element 51 is placed in the recess 41. Easy to do.

The depth of the recess 41 is substantially the same as the thickness of the substrate 50. Therefore, when the substrate 50 is disposed in the recess 41 on the surface of the base plate 40, the side of the semiconductor light emitting element 51 on the substrate 50 side. The bottom surface of the base plate 40 comes to a position that is substantially flush with the surface of the base plate 40 outside the recess 41.
For this reason, as shown in FIG. 2, the semiconductor light emitting element 51 is arranged at a level substantially flush with the surface of the base plate 40 to which the reflector 70 is attached.

Here, if the concave portion 41 is not provided, the semiconductor light emitting element 51 is disposed at a position higher by the thickness of the substrate 50, so that the reflector 70 is lifted by a fixing jig. Alternatively, the reflector 70 itself needs to be extended in the height direction accordingly. When a fixing jig that raises the height is used as in the former case, a gap or the like is likely to be formed between the reflector 70 and the base plate 40, and light may leak from the gap to become glare light.
On the other hand, when the latter is used, the height of the reflector 70 itself is increased.

  Therefore, in the present embodiment, by forming the recess 41 as described above, the substrate 50 can be arranged by effectively utilizing the space on the back surface side of the base plate 40 that tends to become a dead space. By doing so, it is not necessary to use a fixing jig that lifts the reflector 70 specially, so that the gap between the reflector 70 and the base plate 40 can be suppressed, the generation of glare light is suppressed, and the reflector 70 itself By suppressing the height, the surface can be used effectively as a reflecting surface without wasted parts.

  The base plate 40 also has a bent portion 42 that is bent by pressing so that the vehicle rear side of the base plate 40 is substantially orthogonal to the surface on which the substrate 50 and the reflector 70 are disposed.

FIG. 3 is a perspective view of the base plate 40 as seen from the back side opposite to the surface on which the substrate 50 is provided.
As can be seen from FIG. 3, a drooping plate portion 43 extending to the back side is formed at both ends of the bent portion 42, and an aiming recess 44 pushes and deforms the base plate 40 by pressing to the drooping plate portion 43. Is formed.

  As shown in FIG. 2, the leading end of the aiming screw 120 is brought into contact with the aiming recess 44, and the base plate 40 in the lamp chamber 40 is moved by moving the aiming screw 120 in the longitudinal direction of the vehicle by an adjusting unit (not shown). Are finely adjusted, that is, aiming of the light source unit 30 is performed.

(This board)
The contact plate 60 is provided on the back surface of the recess 41 as indicated by an arrow in FIG.
Specifically, as shown in FIG. 3, a tap 48 is provided by pressing on the back surface of the recess 41, and a through hole 61 through which the tap 48 is inserted is provided in the abutting plate 60. As shown in FIG. 4, the abutment plate 60 is attached by inserting the tap 48 into the through hole 61 and caulking the tap 48. However, the fixing mode is not necessarily limited to caulking, and may be fixed with a screw or the like.

  It is preferable to use a material with high heat dissipation for the plate 60. Therefore, it is preferable that the plate 60 is made of the same material as the base plate 40 described above. That is, pure aluminum with high purity is preferable in terms of thermal conductivity.

As shown in FIG. 2, similarly to the substrate 50, the abutment plate 60 is fixed between the base plate 40 and the abutment plate 60 with a heat-dissipating grease 46 and a heat-dissipating sheet 47 having high thermal conductivity interposed therebetween. Is preferred.
By doing in this way, the thermal radiation grease 46 and the thermal radiation sheet 47 enter the minute irregularities on the back surface of the base plate 40 (the back surface of the recess 41) and the surface of the contact plate 60, and the back surface of the base plate 40 (the back surface of the recess 41). This material with high thermal conductivity (heat dissipation grease 46 and heat dissipation sheet 47) fills the fine gaps formed between the contact plate 60 and the abutment plate 60, so that good heat conduction can be obtained and heat dissipation can be improved. It becomes.

As described above, by providing the abutment plate 60, it is possible to obtain substantially the same effect as increasing the thickness of the base plate 40, the thermal conductivity is increased, and the abutment plate 60 itself serves as a heat radiating portion. High heat dissipation effect can be obtained.
In addition, since the abutting plate 60 is located immediately below the substrate 50 on which the semiconductor light emitting element 51 is provided, the heat from the semiconductor light emitting element 51 is dissipated in the shortest distance. Compared with the thing which has a heat radiating part behind the support part which supports a heat dissipation, it becomes a thing with higher heat dissipation.
The plate 60 is preferably equal to or larger than the thickness of the base plate 40, that is, 2 mm or more from the viewpoint of improving heat dissipation, and the size thereof is three times or more of the outer shape of the semiconductor light emitting device 51. Is preferred.
However, if the outer shape becomes too large, it will be disadvantageous in terms of miniaturization.

(Operational effect of this embodiment)
With the configuration as described above, the base plate 40 itself can be manufactured by a highly productive means such as press molding without increasing the thickness of the base plate 40 itself. Heat dissipation can be obtained.

  Further, the portion where the substrate 50 is disposed is formed as a recess 41 by pressing and deforming the base plate 40 from the front surface side (upper side in the drawing) to the rear surface side (lower side in the drawing), so the base plate on which the reflector 70 is disposed. The semiconductor light emitting element 51 can be disposed at a height substantially flush with the portion 40, and there is no need to use a fixing jig or the like for lifting the reflector 70. Therefore, a gap or the like is provided between the reflector 70 and the base plate 40. Therefore, it is possible to suppress the height of the reflector 70 itself, and the surface can be effectively used as a reflecting surface without any useless part.

  In the above embodiment, the case where the recess 41 is provided has been described. As described above, it is preferable to provide the concave portion 41 because the provision of the concave portion 41 suppresses an increase in the height of the reflector 70 and suppresses the generation of glare light. If it is made, heat dissipation can be improved, and therefore, from the viewpoint of heat dissipation, it is not necessarily limited to the provision of the recess 41.

(Second Embodiment)
In the first embodiment, a so-called projector-type vehicular lamp has been exemplified in which light from the semiconductor-type light emitting element 51 is reflected by the reflector 70 and irradiated to the front side of the vehicle. However, the present invention is not limited to a projector-type vehicle lamp, and is also applicable to a lens direct-type vehicle lamp in which light from the semiconductor-type light emitting element 51 is directly incident on the lens and the light distribution is controlled by the lens. In the second embodiment, a lens direct-lighting vehicle lamp is illustrated.
In the following description, the description of the same parts as in the first embodiment may be omitted.

In the case of the direct lens type, the surface of the base plate 40, that is, the surface on which the substrate 50 having the semiconductor-type light emitting element 51 is placed is disposed toward the vehicle front side.
This state is shown in FIG. In FIG. 5, the lens is not shown.
FIG. 5 is a perspective view showing the front side of the base plate 40 so that the back side of the recess 41 of the base plate 40 is not shown. However, as in the first embodiment, the back side A plate 60 is provided.

  In the second embodiment, unlike the first embodiment, the concave portion 41 is wider than the substrate 50 in the vehicle width direction, and is provided from the lower end to the upper end of the base plate 40 in the vehicle vertical direction. Yes.

  A lens (not shown) is formed on both sides of the recess 41 using a pair of mounting legs integrally formed at both ends of the lens in the vehicle width direction so as to be positioned on the vehicle front side of the semiconductor light emitting element 51. It attaches to a pair of provided attachment parts 45 using the screw etc. which are not illustrated, for example.

  As described above, when the recess 41 is made wider than the substrate 50 and is provided from the lower end to the upper end of the base plate 40, the air passage between the lens and the base plate 40 is improved.

  Since the semiconductor light emitting element 51 emits heat during light emission, an updraft is generated by this heat, and cold air is guided from the lower end side by using the recess 41 as a guide so as to be drawn by the flow of the updraft. It flows into the place where the light emitting element 51 is present (see the arrow in FIG. 5).

Therefore, with such a configuration, not only the heat dissipation effect by the abutment plate 60 provided on the back surface, but also the heat dissipation effect is enhanced by the above-described air flow, thereby realizing a vehicular lamp with extremely high heat dissipation. be able to.
Even in the second embodiment, providing the recess 41 further enhances heat dissipation, so it is preferable to provide the recess 41. However, providing the contact plate 60 may provide sufficient heat dissipation. However, the present invention is not necessarily limited to providing the recess 41.

Also in the second embodiment, it is preferable to interpose the heat radiation grease 46 and the heat radiation sheet 47 between the substrate 50 and the base plate 40 and between the contact plate 60 and the base plate 40, and the base. You may make it form the recessed part 44 for aiming in the back surface of the board 40. FIG.
Further, a shade may be provided between the lens and the semiconductor light emitting element 51.

(Third embodiment)
In the third embodiment, a mode in which a cooling fan is provided to forcibly air-cool in order to improve heat dissipation will be exemplified.
Since the basic configuration of the third embodiment is the same as that of the first embodiment, the description of the same parts is omitted.

  In the third embodiment, in order to provide the cooling fan 130 (see FIG. 7), as shown in FIG. 6, a pair of cooling fan mounting legs 62 extending on the back surface side is provided on the abutting plate 60, and the cooling fan mounting legs are provided. A holding part for holding the cooling fan is formed by providing the cooling fan fixing part 63 at the tip of the part 62.

FIG. 7 is a cross-sectional view showing a state in which the cooling fan 130 is fixed to the cooling fan fixing portion 63 with a screw.
As shown in FIG. 7, the cooling fan 130 fixed to the cooling fan fixing portion 63 is opposite to the portion of the abutment plate 60 attached to the base plate 40, that is, the surface of the abutment plate 60 facing the base plate 40. Since the plate 60 is forcibly cooled by the wind of the cooling fan, a higher heat dissipation effect can be obtained.
Therefore, in the future, the output of the semiconductor light emitting device 51 will further increase, the heat capacity generated by the semiconductor light emitting device 51 will increase, and a sufficient heat dissipation effect will no longer be obtained with the contact plate 60 alone. In such a case, the third embodiment may be used.

  Note that the third embodiment is not limited to the projector-type vehicular lamp as in the first embodiment. Even in the case of the lens direct-light type as in the second embodiment, it is possible to apply the abutment plate 60 having the same structure as that shown in the third embodiment. Therefore, in the lens direct-light type vehicle lamp Can also be configured in the same manner as in the third embodiment.

  As described above, the present invention is not limited to the above-described embodiment, but includes modifications and improvements as long as the object of the present invention can be achieved.

DESCRIPTION OF SYMBOLS 10 Housing 20 Outer lens 30 Light source unit 40 Base plate 41 Concave part 42 Bending part 43 Hanging plate part 44 Aiming concave part 45 Mounting part 46 Thermal radiation grease 47 Thermal radiation sheet 48 Tap 50 Board | substrate 51 Semiconductor type light emitting element 60 This board 61 Through-hole 62 Cooling fan Mounting leg portion 63 Cooling fan fixing portion 70 Reflector 101L Left vehicle headlight (vehicle lamp)
101R Right side vehicle headlamp (vehicle lamp)
102 Vehicle 120 Aiming screw 130 Cooling fan O1 Light emission center F1 Focus

Claims (8)

A vehicular lamp,
A housing having an opening in the front;
An outer lens attached to the opening;
A light source unit disposed in a lamp chamber formed by the housing and the outer lens,
The light source unit is
A base plate formed of a plate material having high thermal conductivity ;
A substrate having a semiconductor light emitting element provided on the surface of the base plate;
A flat plate material made of a highly heat-dissipating material provided with the surface facing the back surface of the base plate, and a contact plate disposed at a position facing the substrate across the base plate ,
The wear plate is to be positioned immediately below the substrate, a vehicular lamp characterized that you have just attached to the base plate. The base plate has a recess formed by extruding and deforming the base plate from the front side to the back side;
The vehicular lamp according to claim 1, wherein the substrate is provided in the recess.   The vehicular lamp according to claim 1, further comprising a reflector provided on a surface of the base plate and configured to reflect light from the semiconductor-type light emitting element.   4. The vehicle according to claim 1, wherein the base plate has an aiming recess for receiving a tip of an aiming screw formed by extruding and deforming the base plate. 5. Light fixture.   The vehicular lamp according to any one of claims 1 to 4, wherein the base plate and the contact plate are made of the same material.   6. A heat dissipation grease or a heat dissipation sheet is interposed between the base plate and the substrate and between the base plate and the contact plate, respectively. Item 1. A vehicle lamp according to item 1. The base plate has a tap for fixing the contact plate,
The contact plate has a hole for inserting the tap,
The vehicular lamp according to any one of claims 1 to 6, wherein the tap is formed by pushing and deforming the base plate from the front surface side to the back surface side. The holding plate has a holding portion for holding a cooling fan on the surface side opposite to the surface facing the base plate;
The vehicle lamp according to any one of claims 1 to 7, wherein the cooling fan is fixed to the holding portion.

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