JP5166212B2 - Manufacturing method of multilayer capacitor - Google Patents

Description

  The present invention relates to a method for manufacturing a multilayer capacitor. More specifically, the present invention relates to a method of manufacturing a multilayer capacitor having a structure in which a plurality of ceramic dielectric layers and a plurality of internal electrode layers are alternately stacked.

Conventionally, a multilayer capacitor having a structure in which a plurality of ceramic layers and a plurality of internal electrode layers are alternately stacked is known. The internal electrode layers of the multilayer capacitor are electrically connected to via conductors penetrating in the stacking direction and led to external electrodes disposed on the outer surface of the multilayer capacitor (Patent Document 1). And 2). The multilayer capacitor is used by being electrically connected to an external component (such as a semiconductor element) via an external electrode. For this reason, high connection reliability is required for each part of the multilayer capacitor in order to extract the capability of the external component element more effectively.
Patent Document 1 below discloses that the external electrodes of a multilayer capacitor have a multistage shape for the purpose of improving the connection reliability with external components. On the other hand, Patent Document 2 below discloses that a specific amount of the common ceramic powder is contained for the purpose of preventing cracks around the via conductor in the multilayer body of the multilayer capacitor.

JP 2005-347648 A JP 2007-081351 A

In the above Patent Documents 1 and 2, although contributing to the improvement of connection reliability in each part, in recent years, higher and higher connection reliability is required for multilayer capacitors, and further improvement of connection reliability is required. Yes.
The present invention has been made in view of the above circumstances, and provides a method of manufacturing a multilayer capacitor that can further improve the connection reliability between the external electrode of the multilayer capacitor and the ceramic dielectric layer as compared with the conventional one. Objective.

That is, the present invention is as follows.
(1) A plurality of ceramic dielectric layers and a plurality of internal electrode layers that have one surface and a facing surface and are alternately laminated between the one surface and the facing surface, and electrically connect the plurality of internal electrode layers to each other A multilayer capacitor comprising: the via conductor, and an external electrode disposed on the one surface and / or the opposite surface and electrically connected to the via conductor,
An unfired laminate having a structure in which the unfired ceramic dielectric layer to be the ceramic dielectric layer and the unfired internal electrode layer to be the internal electrode layer formed by printing an internal electrode paste are alternately laminated Forming the body (hereinafter referred to as “unfired laminate forming step”);
A step of forming a through-hole penetrating the surface on the one surface side and the surface on the opposite side of the unfired laminate (hereinafter referred to as a “through-hole forming step”);
Filling the via conductor paste into the through-hole into the via conductor paste to form an unfired via conductor (hereinafter referred to as “unfired via conductor forming step”);
On the at least one of the one-side surface and the opposite-side surface of the unfired laminate, an external electrode paste to be the external electrode connected to the unfired via conductor is printed and unfired A step of forming external electrodes (hereinafter referred to as “unfired external electrode forming step”) in this order,
The internal electrode layer paste, the via conductor paste and the external electrode paste each contain conductive particles,
When the average particle diameter of the conductive particles in the via conductor paste is R _V and the average particle diameter of the conductive particles in the external electrode paste is R _O , R _V ≧ R _O and ,
When the viscosity at the shear rate of 1 s ⁻¹ of the external electrode paste is V _{O (1)} and the viscosity at the shear rate of 100 s ⁻¹ is V _{O (100)} , 1 ≦ V _{O (1)} / V _{O ( 100)} ≦ 5 , A method for producing a multilayer capacitor, wherein
(2) an average particle diameter of the conductive particles in the paste for the internal electrode layer in case of the R _I, a manufacturing method of the multilayer capacitor according to the above (1) is R _O> R _I.
(3) The manufacturing method of the multilayer capacitor according to (1) or (2), wherein an average particle diameter R _V of the conductive particles in the via conductor paste is 2.0 μm ≦ R _V ≦ 10.0 μm.
(4) The multilayer capacitor according to any one of the above (1) to (3), wherein the average particle diameter R _O of the conductive particles in the external electrode paste is 1.0 μm ≦ R _O ≦ 5.0 μm. Manufacturing method.
(5) When the average particle diameter of the conductive particles in the internal electrode layer paste is R _I , the R _I is 0.05 μm ≦ R _I <1.0 μm (1) to (4) ). The manufacturing method of the multilayer capacitor in any one of.
(6) the viscosity of the internal electrode layer paste at a shear rate of ^{5s -1} and _{V I (5),} the viscosity of the via conductor paste at a shear rate of ^{5s -1} and _{V V (5),} the shear rate 5s ^- Of the above (1) to ₍₅₎ where V _{I (5)} ≦ V _{O (5)} <V _{V (5)} where the viscosity of the external electrode paste in ¹ is V _{O (5)} The manufacturing method of the multilayer capacitor in any one.
(7) one connection area between the unfired external electrode of the unfired via conductors and S _V, the planar area of the one yet-fired external electrode when the _{S O, S O / S V} ≧ 1 The method for manufacturing a multilayer capacitor as described in any one of (1) to (6) above.

According to the multilayer capacitor manufacturing method of the present invention, the connection reliability between the external electrode and the ceramic dielectric layer can be further improved as compared with the conventional case. In particular, even when unevenness is generated on the surface of the multilayer capacitor by having a portion where the number of laminated internal electrode layers is small and a portion where the number of laminated internal electrode layers is large, the surface of the ceramic dielectric layer and the external electrode are high. Adhesion can be obtained.
With respect to the average particle diameter R _O of the conductive particles in the external electrode paste, the average particle diameter R _I of the conductive particles in the paste for internal electrode layers, if a R _O> R _I, each paste In addition to being able to print on each corresponding part with good printability, particularly high adhesion between the surface of the ceramic dielectric layer and the external electrode can be obtained.
When the average particle size R _V of the conductive particles in the via conductor paste is 2.0 μm ≦ R _V ≦ 10.0 μm, the unfired via conductor can be reliably filled by printing, and the via conductor and its surroundings Particularly excellent adhesion can be obtained.
When the average particle size R _O of the conductive particles in the external electrode paste is 1.0 μm ≦ R _O ≦ 5.0 μm, a gap is formed between the green ceramic dielectric layer and the green external electrode. While being prevented, the non-fired external electrode can be reliably formed by printing, and particularly excellent adhesion can be obtained between the ceramic dielectric layer and the external electrode after firing.
When the average particle size R _I of the conductive particles in the internal electrode layer paste is 0.05 μm ≦ R _I <1.0 μm, the green internal electrode layer is printed on the surface of the green ceramic dielectric layer. While being able to form well, the especially outstanding adhesiveness can be acquired between the ceramic dielectric material layer and internal electrode layer after baking.
The viscosity of the paste for internal electrode layers at a shear rate of ^{5s -1} _{V I (5),} the viscosity _{V V (5)} of the paste for via conductors at a shear rate of ^{5s -1,} the viscosity of the external electrode paste at a shear rate of ^{5s -1} V _{When O (5)} is V _{I (5)} ≦ V _{O (5)} <V _{V (5)} , the adhesion of each part of each conductor can be obtained to a particularly high degree, and the entire multilayer capacitor is excellent. Connection reliability can be obtained.
The connection area between the unfired external electrodes of one unfired via conductors and S _V, if the planar area of the one unfired external electrodes is S _{O /} S _V ≧ 1.5 when the S _O is
Even if irregularities are formed on the surface of the multilayer capacitor due to a mixture of parts where the number of laminated internal electrode layers is small and parts where the number of laminated internal electrode layers is large, each conductor can be prevented Excellent connection reliability can be obtained.

[1] Multilayer Capacitor Hereinafter, the multilayer capacitor manufactured in the present invention will be described with reference to FIGS. For convenience, the same reference numerals are used before and after firing as the reference numerals of the respective parts.
The manufacturing method of the present invention includes a plurality of ceramic dielectric layers 110 and a plurality of internal electrode layers 120 that have one surface 100a and a facing surface 100b, and are alternately stacked between the one surface 100a and the facing surface 100b. Via conductors 140 electrically connected to each other, and external electrodes 150 disposed on the one surface 100a and / or the opposite surface 100b and electrically connected to the via conductors 140. Applied to the multilayer capacitor 100.

  The “multilayer capacitor (100)” (see FIG. 1) has one surface 101 and a facing surface 100b, and a plurality of ceramic dielectric layers 110 and a plurality of layers alternately stacked between the one surface 100a and the facing surface 100b. The internal electrode layer 120, the via conductor 140 electrically connected to the plurality of internal electrode layers 120, and disposed on the one surface 100 a and / or the facing surface 100 b and electrically connected to the via conductor 140. An external electrode 150.

  The general shape of the multilayer capacitor 100 is not particularly limited, but is usually a rectangular parallelepiped shape, and a plate shape is particularly preferable. Further, the facing surface 100b of the multilayer capacitor 100 is a surface facing the one surface 100a of the multilayer capacitor 100, and these surfaces may be arranged on the upper side, the lower side, or the side when mounted (during mounting). Good. Furthermore, the ceramic dielectric layer 110, the internal electrode layer 120, the via conductor 140 and the external electrode 150 constituting the multilayer capacitor 100 are obtained by integrally firing simultaneously. Among these, the ceramic dielectric layer 110 and the internal electrode layer 120 are each a multilayer body 130 including a plurality of layers and laminated alternately (only the ceramic dielectric layer 110 and the internal electrode layer 120 of the multilayer capacitor 100). The site | part which consists of. Further, a plurality of via conductors 140 are usually provided in one multilayer capacitor 100, and furthermore, these can be provided in an array. That is, a via array type multilayer capacitor can be obtained.

The “ceramic dielectric layer (110)” is a dielectric layer made of ceramics disposed between the internal electrode layers 120. As illustrated in FIG. 1, the ceramic dielectric layer 110 is usually a ceramic dielectric layer portion integrated with other ceramic dielectric layers by firing. The dielectric material constituting the ceramic dielectric layer 110 is not particularly limited except that it is ceramics, but titanate is usually used. Examples of the titanate include barium titanate (BaTiO ₃ ), lead titanate (PbTiO ₃ ), and strontium titanate (SrTiO ₃ ). These may use only 1 type and may use 2 or more types.
The thickness of the ceramic dielectric layer 110 is not particularly limited, but is preferably 1 to 10 μm, and more preferably 1 to 5 μm. The total number (the number of stacked layers) of the ceramic dielectric layers 110 is not particularly limited, but may be 50 to 150 layers, for example.

The “internal electrode layer (120)” is a conductor layer disposed opposite to the ceramic dielectric layer 110. The conductive material constituting the internal electrode layer 120 is not particularly limited, and examples thereof include nickel, copper, tungsten, gold, platinum, palladium, and silver. These may use only 1 type and may use 2 or more types. Of these, nickel is preferred. This is because nickel is suitable for simultaneous firing with a ceramic dielectric material such as titanate. The conductive material constituting the internal electrode layer may be the same as or different from the conductive material constituting the external electrode and via conductor described later, but the adhesion and bonding strength between the conductors. It is preferable that it is the same from a viewpoint of.
The internal electrode layer 120 can contain other components in addition to the conductive material. Examples of other components include ceramics constituting the ceramic dielectric layer 110. That is, it is a common material. By containing this common substrate material, the adhesion and bonding strength of the internal electrode layer 120 and the ceramic dielectric layer 110 after firing can be further improved.

  Further, the shape or the like of the internal electrode layer 120 is not particularly limited, but the thickness is preferably thinner than the ceramic dielectric layer 110, more specifically 0.5 to 5 μm is preferable, and 0.5 to 2 μm is preferable. Is more preferable. The total number (the number of stacked layers) of the internal electrode layers 120 is not particularly limited. For example, the internal electrode layers 120 may be 50 to 150 layers like the ceramic dielectric layer 110.

The “via conductor (140)” is a conductor in which a plurality of internal electrode layers 120 are electrically connected. Usually, a plurality of ceramic dielectric layers 110 and a plurality of internal electrode layers 120 are arranged to penetrate in the stacking direction. The end face of the via conductor 140 is connected to the external electrode 150. Furthermore, the via conductor 140 is electrically connected to a part of the internal electrode layer 120 on its side surface. The conductive material constituting the via conductor 140 is not particularly limited, but the conductive material constituting the internal electrode layer 120 can be applied as it is.
In addition, the via conductor 140 can contain a common material as another component in addition to the conductive material, like the internal electrode layer 120. By including the common base material, it is possible to further improve the adhesion and bonding strength of the via conductor 140 and the ceramic dielectric layer 110 after firing.

Further, the size of each part of the via conductor 140 is not particularly limited, but the diameter is preferably 50 to 150 μm, more preferably 60 to 120 μm, and still more preferably 70 to 110 μm. The total number of via conductors is not particularly limited, but can be 50 / cm ² or more. Furthermore, in the case where a plurality of via conductors 140 are provided, the pitch of the via conductors 140 (the distance between the centers of adjacent via conductors 140) is preferably 200 to 1000 μm, and more preferably 300 to 600 μm.

  The “external electrode 150” is a conductor that is disposed on one surface 100 a and / or the opposite surface 100 b of the outer surface of the multilayer capacitor 100 and is electrically connected to the via conductor 140. The external electrode 150 may be formed on both the one surface 100a side and the facing surface 100b side of the laminate 130, or may be formed only on either the one surface 100a side or the facing surface 100b side. The external electrode 150 can function as an external power supply terminal or a ground connection terminal for the multilayer capacitor 100.

  The form of the external electrode 150 is not particularly limited, and may be (1) an electrode formed individually corresponding to the number of via conductors 140 (see FIG. 3), and (2) a plurality of via conductors 140. It may be a shared electrode (see FIG. 4). The planar shape of each external electrode in the form (1) is not particularly limited, and may be, for example, a circular shape, an elliptical shape, a quadrangular shape, a polygonal shape having five or more corners, and a cross shape. These shapes may be used alone or in combination in one multilayer capacitor. Further, the planar shape of the external electrode in the form (2) is not particularly limited. For example, a continuous shape having a clearance hole 153 for avoiding connection with another group of via conductors similar to the internal electrode is used. It can be an electrode.

  The conductive material constituting the external electrode 150 is not particularly limited, and the conductive material constituting the internal electrode layer 120 can be applied as it is. Furthermore, the external electrode 150 can contain a common material as another component in addition to the conductive material, like the internal electrode layer 120. By including the common base material, it is possible to further improve the adhesion and bonding strength of the external electrode 150 and the ceramic dielectric layer 110 after firing.

  Furthermore, a plating layer 160 (see FIG. 5) can be provided on the outer surface of the external electrode 150 (the surface not in contact with the ceramic dielectric layer 110 and the via conductor 140). This plating layer 160 may include only one layer or two or more layers. By providing the plating layer 160, the oxidation of the external electrode 150 can be prevented, the wettability with respect to the solder can be improved, and furthermore, the resistance of the surface of the external electrode 150 can be reduced, and as a result In addition, it is possible to improve the bondability (such as adhesion and bonding strength) with other conductors connected to the external electrode 150.

  When the plating layer 160 (outer surface plating layer 161) is provided, the plating layer 160 is preferably made of only a conductive material. That is, it is preferable that a common material that can be included in the internal electrode layer 120, the via conductor 140, the external electrode 150, and the like is not contained. Gold and copper are mentioned as a conductive material which comprises this plating layer 160 (outer surface plating layer 161). These may use only 1 type and may use 2 or more types together.

  Further, when two or more plating layers (outer surface plating layer 161 and interlayer plating layer 162) are provided (see FIG. 5), the conductive material constituting the interlayer plating layer 162 is a conductive material constituting the external electrode 150. Is preferably the same. That is, for example, when nickel is used as the conductive material of the external electrode 150, the interlayer plating layer 162 is preferably a nickel plating layer. In particular, when the external electrode 150 contains a common material, it is preferable to include an interlayer plating layer 162. By providing the interlayer plating layer 162, the adhesion between the external electrode 150 and the outer surface plating layer 161 can be improved, and as a result, the bondability (adhesion) with other conductors connected to the external electrode 150. Can be further improved.

  Each of the internal electrode layers 120, the via conductors 140, and the external electrodes 150, which are conductors constituting the multilayer capacitor 100, is usually composed of at least two or more groups that are electrically independent from each other. That is, for example, the internal electrode layer 120 includes a first group of internal electrode layers 121 and a second group of internal electrode layers 122 that are insulated from the first group of internal electrode layers 121. Similarly, the via conductor 140 includes a first group of via conductors 141 and a second group of via conductors 142 that are insulated from the first group of via conductors 141. Further, the external electrode 150 includes a first group of external electrodes 151 and a second group of internal electrode layers 122 that are insulated from the first group of external electrodes 151. Each electrically independent group may include two groups as described above, or three or more groups.

  More specifically, the case of the two groups will be described. As illustrated in FIGS. 1 to 5, etc., the first group of internal electrode layers 121, the first group of via conductors 141, and the first group of outsides. The electrodes 151 are electrically connected to each other. The second group of internal electrode layers 122, the second group of via conductors 142, and the second group of external electrodes 152 are electrically connected to each other. The first group of internal electrode layers 121, the first group of via conductors 141, and the first group of external electrodes 151 include the second group of internal electrode layers 122, the second group of via conductors 142, and the second group. The external electrode 152 is insulated. Among them, the first group of internal electrode layers 121 and the second group of internal electrode layers 122 are insulated by being disposed to face each other via the ceramic dielectric layer 110, thereby functioning as a capacitor.

  For example, in the internal electrode layer illustrated in FIGS. 1 and 2, the first group via conductor 141 and the first group internal electrode layer 121 are electrically insulated from each other. While being connected, the first group of via conductors 141 and the second group of internal electrode layers 122 can be insulated via the clearance holes 123. Similarly, the second group of internal electrode layers 122 and the second group of via conductors 142 are electrically connected, while the second group of via conductors 142 and the first group of internal electrode layers 121 have sufficient clearance. It can be insulated through the hole 123.

[2] Manufacturing Method of Multilayer Capacitor Hereinafter, the manufacturing method of the multilayer capacitor of the present invention will be described with reference to FIGS. For convenience, the same reference numerals are used before and after firing as the reference numerals of the respective parts.
As described above, the manufacturing method of the present invention includes the unfired laminate forming step (P1), the through-hole forming step (P2), the unfired via conductor forming step (P3), and the unfired external electrode forming step ( P4) are provided in this order (see FIG. 6).
In the following description, the unfired laminate formed in the unfired laminate forming step (P1) is referred to as “unfired first laminate (131)”, and the unfired first laminate is formed in the through-hole forming step (P2). “Unfired second laminate (132)” in which the through holes are formed, and “Unfired” in which the unfired via conductor is formed in the unfired second laminate in the unfired via conductor formation step (P3). The “third laminated body (133)”, and the unfired external electrode formed on the unfired third laminated body in the unfired external electrode forming step (P4) are referred to as “unfired fourth laminated body (134)”. Shall.

The “unfired laminate forming step (P1)” includes an unfired ceramic dielectric layer 110 to be the ceramic dielectric layer 110 and an unfired internal electrode to be the internal electrode layer 120 formed by printing the internal electrode paste. This is a step of forming an unfired stacked body 130 (unfired first stacked body 131) having a structure in which the layers 120 are alternately stacked.

  The “unfired ceramic dielectric layer (110)” is a layer that becomes the ceramic dielectric layer 110 after firing, and is a ceramic dielectric material constituting the ceramic dielectric layer 110 (usually contained as a ceramic powder). The form is usually a green sheet. The structure of the unfired ceramic dielectric layer 110 is not particularly limited, but usually contains the ceramic dielectric material and a vehicle component.

  The average particle size of the ceramic powder contained in the green sheet is preferably 0.1 μm or more and 1.0 μm or less, and more preferably 0.3 μm or more and 0.7 μm or less. Within this range, in relation to various unfired conductive materials (unfired internal electrode layers, unfired via conductors, and unfired external electrodes) described later, printability during formation of unfired laminates, shrinkage behavior during firing And the adhesion of each conductor of the obtained multilayer capacitor is particularly excellent.

  The “unfired internal electrode layer (120)” is a layer formed by printing an internal electrode paste, and becomes the internal electrode layer 120 after firing. Also, the unfired internal electrode layer 120 is usually formed by printing an internal electrode paste on the surface of the unfired ceramic dielectric layer 110. Further, as described in the internal electrode layer 120, the unfired internal electrode layer 120 is printed so that a clearance hole 123 is formed in order to insulate it from a part of the via conductors 140. The shape and size of the clearance hole 123 are not particularly limited, but it is preferable that the clearance hole 123 be as small as possible within a range where sufficient insulation can be achieved from the viewpoint of capacitor performance. In particular, the ratio (H1 / H2) between the diameter H1 of the clearance hole 123 and the diameter H2 of a through hole for a via conductor described later is preferably 2 or more.

  The “internal electrode paste” is a paste for forming the unfired internal electrode layer 120 by printing. This internal electrode paste contains, as conductive particles, a conductive material that will form the internal electrode layer 120 after firing. Other common materials for improving adhesion and bonding strength after firing with the ceramic dielectric layer (ceramics constituting the ceramic dielectric layer, usually ceramic powder), and internal electrodes Contains vehicle components for adjusting the properties of the paste for use.

As the conductive particles (conductive powder), various metals listed as the conductive material can be appropriately used. That is, examples of the metal component constituting the conductive particles include nickel, copper, tungsten, gold, platinum, palladium, and silver. These may use only 1 type and may use 2 or more types. Of these, nickel is preferred. This is because nickel is suitable for simultaneous firing with a ceramic dielectric material such as titanate.
Furthermore, as the common material, ceramics constituting the ceramic dielectric layer can be used, and among these, barium titanate is preferable.

The average particle diameter R _I of the conductive particles contained in the internal electrode layer paste is preferably 0.05 μm ≦ R _I <1.0 μm, and more preferably 0.1 μm ≦ R _I ≦ 0.6 μm. Preferably, 0.2 μm ≦ R _I ≦ 0.4 μm is more preferable. In this range, the correlation between the via conductor paste and the external electrode paste is particularly excellent in printability when forming the unfired multilayer body, shrinkage behavior during firing, and adhesion of each conductor of the resulting multilayer capacitor.
The average particle size of the common material (ceramic powder) contained in the internal electrode layer paste is preferably 0.05 μm or more and 0.7 μm or less, and is 0.1 μm or more and 0.3 μm or less. Is more preferable. In this range, the correlation between the via conductor paste and the external electrode paste is particularly excellent in printability when forming the unfired multilayer body, shrinkage behavior during firing, and adhesion of each conductor of the resulting multilayer capacitor.

Examples of the organic binder include acrylic resins, alkyl celluloses (ethyl cellulose, methyl cellulose) and celluloses such as nitrocellulose, acrylic ester resins such as polymethyl methacrylate, butyral resins such as polyvinyl butyral, phenolic resins, and Polyester resin (alkyd resin etc.) etc. are mentioned. These may use only 1 type and may use 2 or more types together. The plasticizer is preferably selected as appropriate according to the type of organic binder.
Furthermore, as solvents, ketone solvents (acetone, methyl ethyl ketone, etc.), hydrocarbon solvents (cyclohexane, toluene, etc.), monohydric alcohols (terpineol, butyl carbitol, etc.), and polyhydric alcohols (ethylene glycol, diethylene glycol, etc.) Etc. These solvents may be used alone or in combination of two or more.

The content of each component constituting the internal electrode layer paste is not particularly limited. For example, when an inorganic component (conductive particles and a common base material) and a vehicle component (organic binder, plasticizer, and solvent) are contained, When the total amount of these pastes is 100% by volume, usually, the inorganic component is contained in the range of 5 to 20% by volume (preferably 7.5 to 18% by volume), and the conductive particles are 4 to 17% by volume. % (Preferably 6 to 16% by volume), and the common base material is preferably 0.8 to 3.5% by volume (preferably 1 to 3% by volume). On the other hand, the vehicle component is contained in the range of 80 to 95% by volume (preferably 82 to 92.5% by volume), and among these, the organic binder is preferably 1.5 to 10% by volume. Within these ranges, the correlation between the via conductor paste and the external electrode paste is particularly excellent in the printability at the time of forming the unfired multilayer body, the shrinkage behavior at the time of firing, and the adhesion of each conductor of the obtained multilayer capacitor.
The viscosity and the like of the internal electrode paste will be described later together with other pastes.

  The “unfired laminate (130)” is the aforementioned unfired first laminate 131. The unfired first laminated body 131 has a structure in which the unfired ceramic dielectric layers 110 and the unfired internal electrode layers 120 are alternately laminated. Then, after the unfired first laminated body 131 passes through the unfired second laminated body 132, the unfired third laminated body 133, and the unfired fourth laminated body 134, the unfired first laminated body 131 is further fired to form the multilayer capacitor 100. Become.

The formation method of the unbaked 1st laminated body 131 is not specifically limited, It can carry out by various methods. That is, for example, as illustrated in FIG. 7, (1) after the green internal electrode layer 120 is printed on the surface of each of the multiple green ceramic dielectric layers 110, the green internal electrode layer 120 is formed. Each of the provided unfired ceramic dielectric layers 110 can be laminated together to form the unfired first laminated body 131.
Further, as illustrated in FIG. 8, (2) after the green internal electrode layer 120 is printed on one surface of one green ceramic dielectric layer 110, the green internal electrode layer 120 thus formed is covered. The unfired first laminated body is formed by repeating the steps of laminating another unfired ceramic dielectric layer 110 and then printing and forming the unfired internal electrode layer 120 on the surface of the other unfired ceramic dielectric layer 110. 131 can be formed.
Only one of these methods may be used, or two methods may be used in combination.

The “through-hole forming step (P2)” is a step of forming the through-hole 132c penetrating between the one surface 132a and the facing surface 132b of the unfired first laminated body 132. By this through hole forming step, an unfired second laminate 132 (an unfired laminate having a through hole 132c not filled with the unfired via conductor 140) is obtained. The method of forming the through hole 132c is not particularly limited, and may be punching by punching, laser drilling, or a combination thereof. Furthermore, other methods can be used.
The diameter of the through hole 132c to be formed is not particularly limited, but is usually 50 μm or more, and particularly when the diameter of the through hole 132c (that is, the outer diameter of the unfired via conductor) is 70 to 140 μm. Therefore, the effect of improving the adhesion by using the production method of the present invention can be obtained more remarkably. The aperture is more preferably 85 to 130 μm.

The “unfired via conductor forming step (P3)” is a step of forming the unfired via conductor 140 by filling the through-hole 132c with a via conductor paste to be the via conductor 140. By this unfired via conductor formation step, an unfired third laminated body 133 (an unfired laminated body having the unfired via conductor 140 and not having the external electrode 150) is obtained.
The method for filling the via conductor paste into the through hole 132c is not particularly limited, and it may be filled by printing (screen printing or the like), may be filled by a dispenser, or these methods may be used in combination. Furthermore, other methods can be used.

  The “via conductor paste” is a paste that forms the unfired via conductor 140 by filling the through hole 132c. This via conductor paste contains, as conductive particles, a conductive material that will form the via conductor 140 after firing. Other common substrate materials for improving adhesion and bonding strength after firing with the ceramic dielectric layer (ceramics constituting the ceramic dielectric layer, usually ceramic powder), and via conductor paste Contains vehicle components for adjusting the properties and the like.

As the conductive particles (conductive powder), the conductive material particles in the internal electrode layer paste can be applied as they are.
The average particle size R _V of the conductive particles contained in the via conductor paste is preferably 2.0 μm ≦ R _V ≦ 10.0 μm, and more preferably 2.0 μm ≦ R _V ≦ 7.5 μm. Preferably, 2.0 μm ≦ R _V ≦ 5.0 μm is more preferable. In this range, in the correlation between the internal electrode layer paste and the external electrode paste, the filling property during printing of the green laminate, the printability, the shrinkage behavior during firing, and the adhesion of each conductor of the resulting multilayer capacitor Especially excellent.
The average particle size of the common material (ceramic powder) contained in the via conductor paste is preferably 0.1 μm or more and 1.0 μm or less, and preferably 0.3 μm or more and 0.7 μm or less. More preferred. In this range, in the correlation between the internal electrode layer paste and the external electrode paste, the filling property during printing of the green laminate, the printability, the shrinkage behavior during firing, and the adhesion of each conductor of the resulting multilayer capacitor Especially excellent.

The content of each component constituting the via conductor paste is not particularly limited. For example, when an inorganic component (conductive particles and a common base material) and a vehicle component (organic binder, plasticizer and solvent) are contained, In general, the inorganic component is contained in the range of 30 to 70% by volume (preferably 40 to 60% by volume), and the conductive particles are 20 to 50% by volume (preferably). Is 25 to 45% by volume), and the common base material is preferably 8 to 25% by volume (preferably 10 to 20% by volume). On the other hand, the vehicle component is contained in the range of 30 to 70% by volume (preferably 40 to 60% by volume), and among these, the organic binder is preferably 3.5 to 15% by volume.
The viscosity of the via conductor paste will be described later together with other pastes.

In the “unfired external electrode forming step (P4)”, an unfired external electrode that is an external electrode that is connected to the unfired via conductor by printing an external electrode paste on at least one of one surface and the opposite surface Is a step of forming. By this unfired external electrode formation step, unfired fourth laminate 134 (unfired laminate having unfired via conductor 140 and unfired external electrode 150 connected thereto) is obtained.
The form of the unfired external electrode formed in this step is not particularly limited, and various forms and shapes described as the shape of the external electrode in the multilayer capacitor 100 can be applied as they are.

  The “unfired external electrode (150)” is a layer formed by printing an external electrode paste, and becomes the external electrode layer 150 after firing. Also, the unfired internal electrode layer 120 is usually formed by printing an internal electrode paste on the surface of the unfired ceramic dielectric layer 110.

  The “external electrode paste” is a paste for forming the unfired external electrode 150 by printing. This external electrode paste contains, as conductive particles, a conductive material that will form the external electrode layer 150 after firing. In addition, a common material for improving adhesion and bonding strength after firing with the ceramic dielectric layer (ceramic constituting the ceramic dielectric layer, usually ceramic powder), and paste for external electrodes Contains vehicle components for adjusting the properties and the like.

As the conductive particles (conductive powder), the conductive material particles in the internal electrode layer paste can be applied as they are.
The average particle size R _O of the conductive particles contained in the external electrode paste is preferably 1.0 μm ≦ R _O ≦ 5.0 μm, and more preferably 1.3 μm ≦ R _O ≦ 4.0 μm. Preferably, 1.5 μm ≦ R _O ≦ 3.0 μm is more preferable. In this preferable range, in the correlation with the internal electrode layer paste and the via conductor paste, the printability at the time of forming the unfired laminate, the shrinkage behavior at the time of firing, and the adhesion of each conductor of the obtained multilayer capacitor are particularly Excellent.
In particular, as the conductive particles in the external electrode paste, two or more (two are more preferable) conductive particles having different average particle diameters can be used. In this case, large-diameter conductive particles having an average particle diameter R _O1 of 2.0 ≦ R _O1 ≦ 3.0 μm and small-diameter conductive particles having an average particle diameter R _O2 of 1.0 ≦ R _O1 ≦ 1.5 μm. It is particularly preferable to mix the active particles with the average particle diameter as a whole within the above range. In this preferable range, excellent printability can be ensured while sufficiently maintaining the amount of the inorganic component in the unfired external electrode, so that firing shrinkage can be suppressed and occurrence of cracks can be prevented.

  The average particle size of the common material (ceramic powder) contained in the external electrode paste is preferably 0.05 μm or more and 0.7 μm or less, and preferably 0.1 μm or more and 0.3 μm or less. More preferred. In this range, in the correlation with the internal electrode layer paste and the via conductor paste, the printability at the time of forming the unfired multilayer body, the shrinkage behavior at the time of firing, and the adhesion of each conductor of the obtained multilayer capacitor are particularly excellent. .

The content of each component constituting the external electrode paste is not particularly limited. For example, when an inorganic component (conductive particles and a common base material) and a vehicle component (organic binder, plasticizer and solvent) are contained, these components In general, the inorganic component is contained in the range of 15 to 30% by volume (more preferably 18 to 25% by volume), and the conductive particles are 10 to 25% by volume (100% by volume). More preferably, it is 12-18 volume%), and it is preferable that a co-substrate material is 4-12 volume% (more preferably 4-10 volume%). On the other hand, the vehicle component is contained in the range of 70 to 85% by volume (more preferably 72.5 to 82.5% by volume), and among these, the organic binder is preferably 7 to 18% by volume.
The viscosity and the like of this external electrode paste will be described later together with other pastes.

The size and shape of the unfired external electrode formed in the unfired external electrode formation step (P4) are not particularly limited as long as the size and shape of the unfired external electrode can be the external electrode. the connection area between the electrode and S _V, the planar area of the one unfired external electrodes when the S _O, is preferably formed in a size to be S O _/ S _V ≧ 1.5 (see FIG. 10 ).
That is, normally, the unfired external electrode 150 is brought into contact with the entire end face of the unfired via conductor 140 in order to obtain the maximum contact area with the unfired via conductor 140, so that the area _SV is equal to the unfired via conductor. Equal to 140 end face area. The area S _O is an area when the non-fired external electrode 150 is viewed in plan from the stacking direction, regardless of the uneven form on the surface of the non-fired laminated body followed by the non-fired external electrode 150.

In particular, as illustrated in FIG. 3, in the case of having a configuration having one external electrode corresponding to one via conductor, this S _O / S _V satisfies 1.5 ≦ S _O / S _V ≦ 30. More preferably, 2.0 ≦ S _O / S _V ≦ 25 is even more preferable. Within the above range, the external electrode can reliably cover the via, and an external electrode particularly excellent in adhesion to the ceramic dielectric layer can be obtained.
More specifically, _{S O} is preferably ^{_{0.003mm 2 ≦ S O ≦ 0.53mm 2}} , more preferably ^{_{0.003mm 2 ≦ S O ≦ 0.48mm 2}} , 0.004mm More preferably, ² ≦ S _O ≦ 0.44 mm ² . On the other hand, _{S V} is preferably ^{_{0.0020mm 2 ≦ S V ≦ 0.018mm 2}} , more preferably ^{_{0.0024mm 2 ≦ S V ≦ 0.014mm 2}} , 0.0028mm 2 ≦ S V More preferably, ≦ 0.011 mm ² .

As described above, in the conventional manufacturing method, as shown in FIG. 12, the gap 20 may be generated, and higher connection reliability is required. The cause of the gap 20 is the above-described unevenness, that is, FIG. 6 (in FIG. 6, the size of the unevenness is exaggerated for the sake of clarity. The same applies to FIGS. 5, 9 and 12). As shown in FIG. 4, it is considered that this is caused by a difference in thickness generated in the stacking direction of the unfired first stacked body 131. Unfired the first laminate 131, a region X ₁ densely green internal electrode layer 120 are laminated by stacking direction, region X green internal electrode layer 120 more coarse than this portion is laminated ₂ and. Therefore, the region X ₁ densely green internal electrode layer 120 from among the outer surface of which is laminated unfired first laminate 131 becomes convex region green internal electrode layer 120 to a more rough are stacked X ₂ becomes a concave shape, so that the irregularities are formed (not shown also in FIGS. 7 and 8, the unevenness is formed).

The size of the unevenness is not particularly limited. For example, when the maximum height difference of the unevenness (reference symbol T in FIG. 5) is 3 to 25 μm, the effect of using the method of the present invention is more easily obtained. It is easy to remarkably improve the adhesion between the via conductor 140 and the ceramic dielectric layer 110 and the external electrode 150.
That is, as in this method, the average particle size R _V of the conductive particles in the via conductor paste and the average particle size R _O of the conductive particles in the external electrode paste are set as R _V ≧ R _O. and a viscosity at a shear rate ^{1s -1} of the external electrode paste _{V O (1),} and a viscosity _{V O (100)} at a shear rate _{^{100s -1, 1 ≦ V O (}} 1) / V O (100) ≦ By setting the number to 5 , the formation of the gap 20 can be prevented.

That is, by using each of the conductive pastes having the above correlation, the printability (leveling property, etc.) at the time of forming the unfired laminate in the correlation with the internal electrode layer paste, the external electrode layer paste, and the via conductor paste. Each of the shrinkage behavior during firing and the adhesion of each conductor of the obtained multilayer capacitor can be improved.
In particular, the followability of the external electrode paste with respect to the unevenness may be dealt with by using conductive particles having a smaller average particle size. However, there is a problem that the solvent added to suppress the increase in the viscosity of the external electrode paste accompanying the reduction in diameter increases, and the influence on the unfired ceramic dielectric layer that becomes the printing surface increases. On the other hand, when the average particle size of the conductive particles contained in the external electrode paste is used in the above-described relatively large range, there is no problem with the unfired ceramic dielectric layer, printability and firing. The shrinkage behavior can be controlled within a suitable range. In addition, sufficient adhesion between the unfired external electrode and the unfired via conductor is obtained, and residual compressive stress generated by appropriate firing shrinkage of the external electrode is generated on the surface of the obtained multilayer capacitor (near the surface). And the mechanical strength of the entire multilayer capacitor can be improved.

In addition, the larger the size of the unfired external electrode 150 to be formed, the easier it is to significantly improve the adhesion between the via conductor 140 and the ceramic dielectric layer 110 and the external electrode 150. That is, rather than using the external electrodes 150 corresponding to the individual via conductors 140 as shown in FIG. 3, the external electrodes 150 shared corresponding to the plurality of via conductors 140 as shown in FIG. 4 are formed. It is easier to remarkably improve the adhesion between the via conductor 140 and the ceramic dielectric layer 110 and the external electrode 150.
More specifically, the connection area between the unfired external electrodes 150 of one unfired via conductors 140 and S _V, the planar area of the one unfired external electrode 150 when the S _O, S _{O /} S _When forming an unfired external electrode satisfying _V ≧ 1.5, the effect of using the manufacturing method of the present invention is more easily obtained. The S _O / S _V is more preferably 1.5 ≦ S _O / S _V ≦ 30, more preferably 1.7 ≦ S _O / S _V ≦ 27, and 2.0 ≦ S _O / S _V ≦ 25. Particularly preferred.

Furthermore, the average particle diameter R _V of the conductive particles in the via conductor paste and the average particle diameter R _O of the conductive particles in the external electrode paste may satisfy the relationship of R _V ≧ R _O. Further, 1.0 ≦ R _V / R _O ≦ 10 is preferable, 1.0 ≦ R _V / R _O ≦ 5 is more preferable, and 1.1 ≦ R _V / R _O ≦ 3 is particularly satisfied. Preferably there is. In a preferable range, firing contraction matching between the respective conductors (internal electrode layer, via conductor and external electrode) can be taken, and problems such as cracks and peeling can be more reliably suppressed.

Also, the viscosity at a shear rate ^{1s -1} of the external electrode paste _{V O (1),} and _the viscosity _{V O (100)} at a shear rate 100s _^-1, the _{V O (1) / V O} (100) ≦ 100 However, it is preferable that 0.1 ≦ V _{O (1)} / V _{O (100)} ≦ 50, and more preferably 0.25 ≦ V _{O (1)} / V _{O (100)} ≦ 45. Preferably, 0.5 ≦ V 2 _{O (1)} / V 2 _{O (100)} ≦ 40 is particularly preferable. In a preferred range, an external electrode paste that is more excellent in conformity to unevenness on the surface of the unfired laminate can be obtained. Especially, in the range where V _{O (1)} / V _{O (100)} is smaller, it is more preferable that 1 ≦ V _{O (1)} / V _{O (100)} ≦ 18, and 1 ≦ V _{O (1)} / It is particularly preferable that V 2 _{O (100)} ≦ 5. On the other hand, in the range where V _{O (1)} / V _{O (100)} is larger, it is more preferable that 20 ≦ V _{O (1)} / V _{O (100)} ≦ 40, and 20 ≦ V _{O (1)} / V. It is particularly preferable that _{O (100)} ≦ 30. Of these, the above range in which V _{O (1)} / V _{O (100)} is smaller is particularly preferable. In the present invention, 1 ≦ V _{O (1)} / V _{O (100)} ≦ 5.
In addition, all the various viscosities in this specification are viscosities at a temperature of 25 ° C., and shall follow the measuring method of the rotary viscometer.

More _{specifically, V O (1)} is preferably _{100Pa · s ≦ V O (1} ) ≦ 1000Pa · s, more to be _{100Pa · s ≦ V O (1} ) ≦ 400Pa · s Preferably, 150 Pa · s ≦ V 2 _{O (1)} ≦ 300 Pa · s is more preferable. On the other hand, V _{O (100)} is preferably 10 Pa · s ≦ V _{O (100)} ≦ 500 Pa · s, more preferably 30 Pa · s ≦ V 2 _{O (100)} ≦ 200 Pa · s, and 40 Pa · s. More preferably, s ≦ V _{O (100)} ≦ 100 Pa · s.

Furthermore, the average particle diameter R _O of the conductive particles in the external electrode paste and the average particle diameter R _I of the conductive particles in the internal electrode layer paste are preferably R _O > R _I. 0.1 ≦ R _O / R _I ≦ 100 is more preferable, 1.5 ≦ R _O / R _I ≦ 50 is further preferable, and 3 ≦ R _O / R _I ≦ 30 is particularly preferable. In a preferable range, firing contraction matching between the respective conductors (internal electrode layer, via conductor and external electrode) can be taken, and problems such as cracks and peeling can be more reliably suppressed.

Furthermore, the viscosity of the paste for the internal electrode layers at a shear rate of ^{5s -1} _{V I (5),} and the viscosity of the paste for via conductor at a shear rate of ^{5s -1} _{V V (5),} the external electrodes at a shear rate of ^{5s -1} The viscosity V _{O (5) of the} paste is preferably V _{I (5)} ≦ V _{O (5)} <V _{V (5)} . In a preferable range, a more reliable capacitor can be manufactured.
More _{specifically, V I (5)} is preferably from _{5Pa · s ≦ V I (5} ) ≦ 30Pa · s, more preferably _{6Pa · s ≦ V I (5} ) ≦ 23Pa · s, 7Pa · s ≦ V _{I (5)} ≦ 15 Pa · s is more preferable. _{Also, V O (5)} is preferably from _{100Pa · s ≦ V O (5} ) ≦ 300Pa · s, and more preferably _{120Pa · s ≦ V O (5} ) ≦ 270Pa · s, 150Pa · s ≦ V O (5 ₎ ≦ 250 Pa · s is more preferable. Further, V _{V (5)} is preferably 500 Pa · s ≦ V _{V (5)} ≦ 10,000 Pa · s, more preferably 800 Pa · s ≦ V _{V (5)} ≦ 7,000 Pa · s, and 1,000 Pa · s. More preferably, s ≦ V _{V (5)} ≦ 5,000 Pa · s.

Further, when the common electrode material is contained in each of the internal electrode layer paste, the external electrode paste, and the via conductor paste, the volume ratio of the common material in the internal electrode layer paste is expressed by C _I (volume% ) and, when the volume ratio of the co-matrix material occupying the external electrode paste to the C _{O (vol%),} the volume ratio of the co-matrix material occupying the paste for via conductor was C _{V (vol%),} C _I It is preferable that <C _O ≦ Cv and 0.2 ≦ C _O / C _V ≦ 1.0.

The thickness in the stacking direction of each part in the unfired stacked body is usually larger in the order of unfired internal electrode layer <unfired external electrode <unfired via conductor, and the firing shrinkage in the stacking direction also increases in this order. For this reason, firing shrinkage with the unfired ceramic dielectric layer can be achieved by making the content of the common substrate material in the unfired external electrode and unfired via conductor larger than the content of the common substrate material in the unfired internal electrode layer. The behavior can be adjusted more skillfully, and cracks and peeling after firing can be more effectively suppressed.
More specifically, C _I is preferably 0.8% by volume ≦ C _I ≦ 3.5% by volume, and more preferably 1.0% by volume ≦ C _I ≦ 3.0% by volume. The C 2 _O is preferably 4.0% by volume ≦ C 2 _O ≦ 12.0% by volume, more preferably 4.0% by volume ≦ C 2 _O ≦ 10.0% by volume. _CV is preferably 8.0% by volume ≦ C _V ≦ 25.0% by volume, and more preferably 10.0% by volume ≦ C _V ≦ 20.0% by volume.

[3] Multilayer Capacitor for Capacitor-Incorporated Wiring Substrate The multilayer capacitor obtained by the method of the present invention may be used as it is as one component, but particularly as a multilayer capacitor for a capacitor-embedded wiring substrate (a multilayer capacitor for substrate embedding). Is preferred.
The capacitor-embedded wiring substrate 10 is generally capable of mounting a substrate core portion 20, a capacitor portion 21 (including the multilayer capacitor 100) housed in the substrate core portion 20, and a semiconductor element 90. And a build-up unit 30 stacked on the capacitor unit 21.

The “substrate core part (20)” is a part that accommodates the capacitor part 21 and serves as a core that supports the entire wiring substrate 10. The substrate core 20 may be a simple plate-like body, but usually has a housing portion 201 that houses the capacitor portion 21. The accommodating portion 201 can use a through hole and / or a bottomed hole provided in the substrate core portion 20. The material constituting the substrate core 20 is not particularly limited, but it is preferable to use a heat-resistant polymer material such as an epoxy resin, a polyimide resin, a bismaleimide / triazine resin, a polyphenylene ether resin, or the like. Furthermore, it may have glass fibers, glass fiber woven fabrics, glass fiber nonwoven fabrics, polyamide fibers, polyamide fiber nonwoven fabrics, polyamide fiber woven fabrics, etc. as core materials for obtaining better strength and better thermal properties. .
As illustrated in FIG. 11, the substrate core 20 can be provided with a through-hole conductor 202 that conducts between the upper surface side 20 a and the lower surface side 20 b. The inside of the through hole may be filled with a conductor other than the through hole conductor, but can be closed with the insulating hardened body 203.

  The “capacitor portion 21” is a capacitor in which the multilayer capacitor 100 obtained by the method of the present invention is accommodated in the substrate core portion 20. The capacitor unit 21 is normally fixed in the storage unit 201 with a filler 204 such as a resin material such as an epoxy resin while being stored in the substrate core 20 (see FIG. 11).

The “build-up portion 30” is a portion laminated on the substrate core 20 and the capacitor portion 21 accommodated in the substrate core 20, and includes a conductor layer (31a and 31b) and an interlayer insulating layer (32a and 32b). Are alternately laminated, and the outermost layer is usually a portion provided with resist layers (321a and 321b).
The build-up unit 30 (30a and 30b) may be provided only on one surface side of the wiring board 10, but is usually provided on both surface sides, and further preferably provided in a target shape. In general, there is a large difference between the terminal pitch of the connection terminals 311a on the semiconductor element 90 side of the capacitor built-in wiring board 10 and the terminal pitch of the connection terminals 311b on the motherboard side of the capacitor built-in wiring board 10. For this reason, by providing the build-up portion 30 (30a and 30b), the pitch can be freely adjusted in the build-up portion 30 (30a and 30b), and the lower surface side from the upper surface side (semiconductor element mounting side) of the wiring board 10 It is possible to output different pitches between terminals to the motherboard mounting side (see FIG. 11).

Moreover, the material which comprises the interlayer insulation layer 32 (32a and 32b) of the buildup part 30 (30a and 30b) is not specifically limited, However, Heat resistance, such as an epoxy resin, a polyimide resin, a bismaleimide triazine resin, a polyphenylene ether resin, etc. It is preferable to use a polymer material having
Furthermore, the conductor layers 31 (31a and 31b) constituting the buildup section 30 (30a and 30b) can be electrically connected to other conductor layers through vias or the like as necessary. If vias are used, they may be stacked using a non-stacked via method (connecting vias may be filled vias or conformal vias) to avoid connection directly above each via. The vias may be stacked in a stacked via system (each via is usually a filled via). The form of each via may be the same or different between the upper surface side buildup portion 30a and the lower surface side buildup portion 30b.

Hereinafter, the present invention will be described in more detail with reference to examples.
[1] Manufacture of multilayer capacitor (1) Preparation of green sheet to be unfired ceramic dielectric layer Barium titanate powder (average particle size 0.5 μm), organic binder and plasticizer in a mixed solvent of ethanol and toluene Wet mixed. Thereafter, a binder was added and further mixed, and the resulting slurry was formed into a sheet having a thickness of 7 μm by a doctor blade method to produce a green sheet serving as an unfired ceramic dielectric layer.

(2) Preparation of External Electrode Paste <2-1> External Electrode Paste of Example 1 As the conductive particles of the external electrode paste, the first nickel powder having an average particle diameter R _O1 of 2.5 μm and the average A second nickel powder having a particle size R _O2 of 1.0 μm is mixed at a volume ratio of 75%: 25% to obtain a mixed nickel powder having an average particle size R _O (D50 in the particle size distribution) of about 2.0 μm. Obtained. Viscosity ratio obtained by wet-mixing the obtained mixed nickel powder, common powder (barium titanate powder, average particle size 0.1 μm), and vehicle component at a volume ratio of 16%: 8%: 76%. V _{O (1)} / V _{O (100)} ≦ 100 (V _{O (1)} / V _{O (100)} = 5, V _{O (1)} = 350 Pa · s, V _{O (100)} = 70 Pa · s, V _{O (5)} = 200 Pa · s) External electrode paste (Example 1) was obtained.

<2-2> External Electrode Paste of Comparative Example 1 As the conductive particles of the external electrode paste, the first nickel powder having an average particle diameter R _O1 of 0.4 μm and the average particle diameter R _O2 of 1.0 μm A second nickel powder was mixed at a volume ratio of 50%: 50% to obtain a mixed nickel powder having an average particle size R _O (D50 in the particle size distribution) of about 0.8 μm. The obtained mixed nickel powder, common powder (barium titanate powder, average particle size 0.1 μm), and vehicle component were wet-mixed in a mixed solvent at a volume ratio of 30%: 10%: 60%. Viscosity ratio V _{O (1)} / V _{O (100)} > 100 (V _{O (1)} / V _{O (100)} = 125, V _{O (1)} = 500 Pa · s, V _{O (100)} = 4 Pa · s, V 2 _{O (5)} = 150 Pa · s), an external electrode paste (Comparative Example 1) was obtained.

(3) and conductive particles prepared internal electrode paste of the internal electrode paste {nickel powder having an average particle diameter R _I is 0.2 [mu] m}, co material powder (barium titanate powder, the average particle diameter of 0.1 [mu] m) The vehicle component was wet-mixed at a volume ratio of 12%: 3%: 85% to obtain an internal electrode paste (V _{I (5)} = 11 Pa · s).

(4) and the conductive particles prepared via conductor paste for via conductor paste {nickel powder having an average particle diameter R _V is 2.5 [mu] m}, co material powder (barium titanate powder, the average particle diameter of 0.5 [mu] m) And the vehicle component was wet-mixed at a volume ratio of 40%: 16%: 44% to obtain a via conductor paste (V _{V (5)} = 2500 Pa · s).

In addition, the viscosity of each paste in this specification is based on the following measurement and conversion. That is, the viscosity {V _{I (5)} } of the internal electrode paste was measured at a temperature of 25 ° C. and a shear rate of 5 to 500 s ⁻¹ using a coaxial double cylindrical viscometer (manufactured by HAAKE). It is the viscosity value at the shear rate of 5 s ⁻¹ obtained. Further, the viscosity {V 2 _{O (1)} , V 2 _{O (5)} , V 2 _{O (100)} } of the paste for the external electrode is determined by using the coaxial double cylindrical viscometer at a temperature of 25 ° C. and a shear rate of 1 to 100 s. It is a viscosity value at each shear rate obtained when measured in the range of ^-1 . Furthermore, the viscosity {V _{V (5)} } of the paste for via electrodes is an approximate curve obtained by plotting viscosity values measured in a low shear rate region of 1 s ⁻¹ or less using a T-bar type spindle for a B-type viscometer. The viscosity value at a shear rate of 5 s- ¹ .

(5) Unbaked laminate forming step (P1)
The internal electrode paste obtained in (3) above is applied to the surface of the green sheet (unfired ceramic dielectric layer) obtained in (1) above by screen printing in FIGS. 2 (a) and 2 (b). Each green sheet was printed so as to have a corresponding shape. At this time, the diameter of the clearance hole 123 of the unfired internal electrode layer 120 was about 400 μm.
Thereafter, 100 to 150 unfired ceramic dielectric layers each having an unfired internal electrode layer were pressure-bonded (60 to 80 ° C., about 300 kgf / cm ² ) to obtain an unfired first laminate 131. (See FIG. 8).
The obtained unfired first laminated body 131 has a thickness of about 1200 μm, and the unevenness (corresponding to “T” in FIG. 5 in the unfired state) generated in the unfired first laminated body 131 is 10 to 20 μm. (Average value measured with a surface roughness meter for 10 randomly selected recesses).

(6) Through-hole forming step (P2)
Using the laser molding machine, via holes 132c having a diameter of about 120 μm were drilled at 450 to 700 μm pitch in the unfired first laminate 131 obtained in the above (5) to obtain an unfired second laminate 132. .

(7) Unfired via conductor formation process (P3)
The via-conductor paste obtained in (3) above is filled into the via hole 132c of the unfired second laminated body 132 obtained up to (6) above by screen printing, and the unfired via conductor 140 is formed. An unfired third laminate 133 was obtained.

(8) Unfired external electrode forming step (P4)
The external electrode paste of Example 1 and the external electrode paste of Comparative Example 1 obtained in (2) above were respectively applied to the surface of the unfired third laminate 133 obtained up to (7) above. Screen printing was performed to obtain each unfired fourth laminate 134 in which the unfired external electrode 150 having the shape shown in FIG. 3 was formed. Connection area _{S V} the unfired via conductors 140 of the resulting unfired external electrode 150 and the non-fired external electrode 150 is 0.00785mm ^2, planar area _{S O} of green outer electrode 0.1256Mm ² met It was. That is, S _O / S _V = 16 and S _O / S _V ≧ 1.5 was satisfied. The area _SV and the area _SO are average values of areas obtained from the diameters measured by the optical measuring device.
Thereafter, the unfired external electrode 150 formed on the unfired fourth laminate 134 is peeled off from the unfired ceramic dielectric layer 110 immediately below the unfired external electrode 150 by the evaluation method shown in [2] below. It was observed whether or not there was a site.

(9) Firing step Each unfired fourth laminated body 134 of Example 1 and Comparative Example 1 obtained up to (8) above (as in a panel shape) is degreased at 250 to 300 ° C. in the atmosphere for 10 to 20 hours. Then, firing was performed at 1200 to 1300 ° C. in a reducing atmosphere, and the multilayer capacitor obtained by using the external electrode paste of Example 1 (Example 1) and the external electrode paste of the comparative example were obtained. 50 multilayer capacitors (Comparative Example 1) were obtained.

[2] Evaluation (1) Evaluation of peeling of unfired external electrode Unfired fourth laminate (5 pieces) of Example 1 obtained in [1] and (8) above and Unfired fourth laminate of Comparative Example 1 And the unfired external electrode 150 and the unfired ceramic dielectric layer 110 using a digital image obtained by photographing the unfired external electrode 150 on the surface of the body with an optical microscope at 100 times magnification. The presence or absence of each defect of cracks (crack cracks), which are signs of peeling at the interface, was confirmed for the total number of each unfired fourth laminate. Then, the number of individuals having these defects (addition of any solids generated) was converted. As a result, with respect to 5 unfired fourth laminated bodies, when the number of individuals having the above-mentioned defects is 0, it is evaluated as “◯”, and when the number is 1 or more, “×” Was evaluated and listed in Table 1.
As a result, the unfired fourth laminate of Example 1 was “◯”, while the unfired fourth laminate of Comparative Example 1 was “x”.

(2) Evaluation of Adhesiveness of External Electrode The multilayer capacitor of Example 1 (20 pieces) obtained in [1] and (9) above and the multilayer capacitor of Comparative Example 1 (20 pieces) were subjected to ultrasonic flaw detection. The presence or absence of a defect such as a gap due to insufficient adhesion at the interface between the external electrode 150 and the ceramic dielectric layer 110 was evaluated, and the section judged to be defective was subjected to cross section polishing and the cross section was observed. Then, the number of individuals having these defects (addition of any solids generated) was converted. As a result, with respect to 20 multilayer capacitors, when the number of individuals having the above problems is 0, it is evaluated as “◯”, and when the number is 1 or more, it is evaluated as “×”. The results are shown in Table 1.
As a result, the multilayer capacitor of Example 1 was “◯”, while the multilayer capacitor of Comparative Example 1 was “x”.

  In addition, in this invention, it can restrict to what is shown to said specific Example, It can be set as the Example variously changed within the range of this invention according to the objective and the use.

It is a schematic sectional drawing of a multilayer capacitor. It is a schematic plan view explaining an example of the internal electrode layer of a multilayer capacitor, (a) represents the 1st group internal electrode layer, (b) represents the 2nd group internal electrode layer. It is a schematic plan view explaining the planar shape of an example of an external electrode. It is a schematic plan view illustrating a planar shape of another example of the external electrode. It is a general | schematic expanded sectional view explaining the cross-sectional shape of an example of an external electrode. It is explanatory drawing explaining each process in the manufacturing method of this invention. It is explanatory drawing explaining the process of an example of an unbaking laminated body formation process. It is explanatory drawing explaining the process of the other example of an unbaking laminated body formation process. It is explanatory drawing explaining the manufacturing method of a multilayer capacitor provided with the via conductor penetrated only to one side. A connection area S _V the unfired via conductor and unfired external electrodes is an explanatory diagram for explaining a planar area S _O unfired external electrodes. It is a schematic sectional drawing which shows an example of the wiring board with a built-in capacitor incorporating the multilayer capacitor. It is a general | schematic expanded sectional view explaining the problem in the vicinity of the unfired external electrode in the past.

Explanation of symbols

  100; multilayer capacitor (unfired multilayer capacitor), 101; one side, 102; facing, 110; ceramic dielectric layer (unfired multilayer ceramic dielectric layer), 120; internal electrode layer (unfired multilayer internal electrode layer), 121 ; First group internal electrode layer, 122; second group internal electrode layer, 130; laminate (unfired laminate), 140; via conductor (unfired via conductor), 150; external electrode (unfired external electrode); ), Plating layer; 160, outer surface plating layer 161, interlayer plating layer 162, 10; wiring board with built-in capacitor, 20; substrate core, 201; accommodating portion, 204; filler, 202; through-hole conductor, 203; , 21; capacitor portion (multilayer capacitor 100), 30; build-up portion, 30a; upper surface side build-up portion, 30b; lower surface side build-up portion, 31a and 31b; conductor , 311a and 311b; connection terminals (connection terminals of the capacitor built-in wiring board surface), 32a and 32 b; interlayer insulating layer, 321a and 321b; solder resist layer, 40; connection terminal group 90; semiconductor device.

Claims (7)

A plurality of internal electrode layers that have one surface and a facing surface, and are alternately stacked via a plurality of ceramic dielectric layers between the one surface and the facing surface, and the plurality of internal electrode layers are electrically connected to each other A method of manufacturing a multilayer capacitor comprising a via conductor and an external electrode disposed on the one surface and / or the opposite surface and electrically connected to the via conductor,
An unfired laminate having a structure in which the unfired ceramic dielectric layer to be the ceramic dielectric layer and the unfired internal electrode layer to be the internal electrode layer formed by printing an internal electrode paste are alternately laminated Forming a body;
Forming a through hole that penetrates the surface on the one surface side and the surface on the opposite side of the unfired laminate,
Filling the via conductor paste into the through-hole into the via conductor and forming an unfired via conductor;
On the at least one of the one-side surface and the opposite-side surface of the unfired laminate, an external electrode paste to be the external electrode connected to the unfired via conductor is printed and unfired A step of forming external electrodes in this order,
The internal electrode layer paste, the via conductor paste and the external electrode paste each contain conductive particles,
When the average particle diameter of the conductive particles in the via conductor paste is R _V and the average particle diameter of the conductive particles in the external electrode paste is R _O , R _V ≧ R _O and ,
When the viscosity at the shear rate of 1 s ⁻¹ of the external electrode paste is V _{O (1)} and the viscosity at the shear rate of 100 s ⁻¹ is V _{O (100)} , 1 ≦ V _{O (1)} / V _{O ( 100)} ≦ 5 , A method for producing a multilayer capacitor, wherein 2. The method of manufacturing a multilayer capacitor according to claim 1, wherein R _O > R _I when R _I is an average particle diameter of the conductive particles in the internal electrode layer paste. 3. The method of manufacturing a multilayer capacitor according to claim 1, wherein an average particle size R _V of the conductive particles in the via conductor paste is 2.0 μm ≦ R _V ≦ 10.0 μm. 4. The method for producing a multilayer capacitor according to claim 1, wherein an average particle diameter R _O of the conductive particles in the external electrode paste is 1.0 μm ≦ R _O ≦ 5.0 μm. The average particle diameter of the conductive particles in the paste for the internal electrode layer in case of the R _I, wherein R _I is one of claims 1 to 4 is 0.05 .mu.m ≦ R _{I <1.0} .mu.m A method for producing the multilayer capacitor as described in 1. above. The viscosity of the internal electrode layer paste at a shear rate of ^{5s -1} and _{V I (5),} the viscosity of the via conductor paste at a shear rate of ^{5s -1} and _{V V (5),} said at a shear rate of ^{5s -1} The laminate according to any one of claims 1 to ₅ , wherein V _{I (5)} ≤ V _{O (5)} <V _{V (5)} when the viscosity of the external electrode paste is V _{O (5).} Capacitor manufacturing method. The connection area between the unfired external electrode of one of the unfired via conductors and S _V, the planar area of the one yet-fired external electrode when the S _O, at S O _/ S _V ≧ 1.5 The method for manufacturing a multilayer capacitor according to claim 1.

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