JP5165800B2 - 活性有機材料を含む電子デバイスのための気密シール - Google Patents

活性有機材料を含む電子デバイスのための気密シール Download PDF

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Publication number
JP5165800B2
JP5165800B2 JP2011552990A JP2011552990A JP5165800B2 JP 5165800 B2 JP5165800 B2 JP 5165800B2 JP 2011552990 A JP2011552990 A JP 2011552990A JP 2011552990 A JP2011552990 A JP 2011552990A JP 5165800 B2 JP5165800 B2 JP 5165800B2
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substrate
strip
cover
seal
sealing member
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Japanese (ja)
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JP2012519938A (ja
JP2012519938A5 (enExample
Inventor
コック、ロナルド・エス
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Global OLED Technology LLC
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Global OLED Technology LLC
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8721—Metallic sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8723—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2011552990A 2009-03-04 2010-02-25 活性有機材料を含む電子デバイスのための気密シール Active JP5165800B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/397,418 US7948178B2 (en) 2009-03-04 2009-03-04 Hermetic seal
US12/397,418 2009-03-04
PCT/US2010/025364 WO2010101763A1 (en) 2009-03-04 2010-02-25 Hermetic seal for an electronic device comprising an active organic material

Publications (3)

Publication Number Publication Date
JP2012519938A JP2012519938A (ja) 2012-08-30
JP2012519938A5 JP2012519938A5 (enExample) 2012-12-20
JP5165800B2 true JP5165800B2 (ja) 2013-03-21

Family

ID=42060448

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011552990A Active JP5165800B2 (ja) 2009-03-04 2010-02-25 活性有機材料を含む電子デバイスのための気密シール

Country Status (7)

Country Link
US (1) US7948178B2 (enExample)
EP (1) EP2404319B1 (enExample)
JP (1) JP5165800B2 (enExample)
KR (1) KR101278251B1 (enExample)
CN (1) CN102414812B (enExample)
TW (1) TWI397644B (enExample)
WO (1) WO2010101763A1 (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10387298B2 (en) 2017-04-04 2019-08-20 Hailo Technologies Ltd Artificial neural network incorporating emphasis and focus techniques
US11238334B2 (en) 2017-04-04 2022-02-01 Hailo Technologies Ltd. System and method of input alignment for efficient vector operations in an artificial neural network
US11544545B2 (en) 2017-04-04 2023-01-03 Hailo Technologies Ltd. Structured activation based sparsity in an artificial neural network
US11551028B2 (en) 2017-04-04 2023-01-10 Hailo Technologies Ltd. Structured weight based sparsity in an artificial neural network
US11615297B2 (en) 2017-04-04 2023-03-28 Hailo Technologies Ltd. Structured weight based sparsity in an artificial neural network compiler
US12430543B2 (en) 2017-04-04 2025-09-30 Hailo Technologies Ltd. Structured sparsity guided training in an artificial neural network

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KR20110064670A (ko) * 2009-12-08 2011-06-15 삼성모바일디스플레이주식회사 게터 조성물 및 상기 게터 조성물을 포함하는 유기 발광 장치
WO2011108020A1 (ja) * 2010-03-01 2011-09-09 パナソニック株式会社 有機ｅｌ装置およびその製造方法
KR101127595B1 (ko) * 2010-05-04 2012-03-23 삼성모바일디스플레이주식회사 유기 발광 표시 장치 및 그 제조방법
KR20130065219A (ko) * 2011-12-09 2013-06-19 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
US9386714B2 (en) * 2012-12-05 2016-07-05 Nokia Technologies Oy Apparatus for housing an electronic component, a method
CN103383992B (zh) * 2013-08-13 2015-12-02 深圳市华星光电技术有限公司 Oled器件的封装方法及用该方法封装的oled器件
DE102013110174B4 (de) * 2013-09-16 2025-04-10 Pictiva Displays International Limited Elektronisches Bauelement und Verfahren zur Herstellung eines elektronischen Bauelements
CN103531718B (zh) * 2013-10-25 2015-12-09 上海大学 Oled封装结构
US9334154B2 (en) 2014-08-11 2016-05-10 Raytheon Company Hermetically sealed package having stress reducing layer
CN106414309B (zh) * 2014-08-11 2020-02-28 雷声公司 具有应力减小层的气密性密封封装
JP2018084764A (ja) * 2016-11-25 2018-05-31 株式会社ブイ・テクノロジー フレキシブル表示装置及びフレキシブル表示装置の封止方法
CN110429206B (zh) * 2019-08-07 2021-11-23 京东方科技集团股份有限公司 封装盖板、显示装置、显示面板及显示面板的封装方法
KR20220000440A (ko) * 2020-06-25 2022-01-04 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법
US11591879B2 (en) * 2021-01-29 2023-02-28 Halliburton Energy Services, Inc. Thermoplastic with swellable metal for enhanced seal
CN115642131B (zh) * 2022-10-14 2025-10-31 南通大学 一种二维材料异质结器件

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US4769292A (en) * 1987-03-02 1988-09-06 Eastman Kodak Company Electroluminescent device with modified thin film luminescent zone
JPH09148066A (ja) * 1995-11-24 1997-06-06 Pioneer Electron Corp 有機ｅｌ素子
CN1287636C (zh) 1998-08-03 2006-11-29 杜邦显示器股份有限公司 有保护性无机材料封装层的发光装置及该装置的保护方法
US6226890B1 (en) * 2000-04-07 2001-05-08 Eastman Kodak Company Desiccation of moisture-sensitive electronic devices
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KR100819864B1 (ko) * 2001-12-28 2008-04-07 엘지.필립스 엘시디 주식회사 유기전기발광소자
US7202602B2 (en) * 2003-04-08 2007-04-10 Organic Lighting Technologies Llc Metal seal packaging for organic light emitting diode device
EP1571704A1 (en) 2004-03-04 2005-09-07 Interuniversitair Microelektronica Centrum Vzw Method for depositing a solder material on a substrate in the form of a predetermined pattern
JP2005251407A (ja) * 2004-03-01 2005-09-15 Sanyo Electric Co Ltd 表示パネルの製造方法および表示パネル
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CN101107705A (zh) * 2005-01-21 2008-01-16 西铁城控股株式会社 密封板以及其制造方法
US7842891B2 (en) * 2005-01-21 2010-11-30 Citizen Holdings Co. Ltd. Sealing board and method for producing the same
US20070172971A1 (en) * 2006-01-20 2007-07-26 Eastman Kodak Company Desiccant sealing arrangement for OLED devices
KR100688795B1 (ko) * 2006-01-25 2007-03-02 삼성에스디아이 주식회사 유기전계발광 표시장치 및 그 제조방법
JP5018820B2 (ja) * 2009-04-03 2012-09-05 株式会社デンソー Ｅｌ表示装置およびその製造方法

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10387298B2 (en) 2017-04-04 2019-08-20 Hailo Technologies Ltd Artificial neural network incorporating emphasis and focus techniques
US11216717B2 (en) 2017-04-04 2022-01-04 Hailo Technologies Ltd. Neural network processor incorporating multi-level hierarchical aggregated computing and memory elements
US11238331B2 (en) 2017-04-04 2022-02-01 Hailo Technologies Ltd. System and method for augmenting an existing artificial neural network
US11238334B2 (en) 2017-04-04 2022-02-01 Hailo Technologies Ltd. System and method of input alignment for efficient vector operations in an artificial neural network
US11263512B2 (en) 2017-04-04 2022-03-01 Hailo Technologies Ltd. Neural network processor incorporating separate control and data fabric
US11354563B2 (en) 2017-04-04 2022-06-07 Hallo Technologies Ltd. Configurable and programmable sliding window based memory access in a neural network processor
US11461615B2 (en) 2017-04-04 2022-10-04 Hailo Technologies Ltd. System and method of memory access of multi-dimensional data
US11514291B2 (en) 2017-04-04 2022-11-29 Hailo Technologies Ltd. Neural network processing element incorporating compute and local memory elements
US11544545B2 (en) 2017-04-04 2023-01-03 Hailo Technologies Ltd. Structured activation based sparsity in an artificial neural network
US11551028B2 (en) 2017-04-04 2023-01-10 Hailo Technologies Ltd. Structured weight based sparsity in an artificial neural network
US11615297B2 (en) 2017-04-04 2023-03-28 Hailo Technologies Ltd. Structured weight based sparsity in an artificial neural network compiler
US11675693B2 (en) 2017-04-04 2023-06-13 Hailo Technologies Ltd. Neural network processor incorporating inter-device connectivity
US12430543B2 (en) 2017-04-04 2025-09-30 Hailo Technologies Ltd. Structured sparsity guided training in an artificial neural network

Also Published As

Publication number Publication date
KR101278251B1 (ko) 2013-06-24
CN102414812B (zh) 2015-04-22
JP2012519938A (ja) 2012-08-30
TWI397644B (zh) 2013-06-01
CN102414812A (zh) 2012-04-11
US20100225231A1 (en) 2010-09-09
TW201040416A (en) 2010-11-16
KR20110134891A (ko) 2011-12-15
EP2404319A1 (en) 2012-01-11
US7948178B2 (en) 2011-05-24
EP2404319B1 (en) 2019-06-19
WO2010101763A1 (en) 2010-09-10

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