JP5158875B2 - Ceramic package for storing electronic components and manufacturing method thereof - Google Patents

Description

  The present invention relates to a ceramic package for storing an electronic component for storing an electronic component such as a semiconductor element, a light emitting element, and a crystal resonator, and a manufacturing method thereof, and more specifically, for storing an electronic component storing an electronic component. The present invention relates to a ceramic package for storing electronic components that can be mounted on a wiring board for mounting, and a method for manufacturing the same.

  2. Description of the Related Art Conventionally, a plurality of large ceramic green sheets capable of forming an assembly in which a plurality of rectangular ceramic substrates are arranged in a matrix form are used for ceramic packages for storing electronic components. Each ceramic green sheet is drilled for each ceramic substrate, and then a conductive metal wire for forming electrical continuity is formed in the package by screen printing. Are stacked and heated to form a laminated body by being pressed and adhered. This laminate is formed by firing together a ceramic green sheet and a conductor metal in a reducing atmosphere to form a fired ceramic base aggregate, which is then made into a single-piece ceramic base, and this ceramic base is mounted with an electronic component. This is a ceramic package for storing electronic components.

  As shown in FIGS. 6A and 6B, the above-described conventional ceramic package 50 for storing electronic parts is vertically and horizontally arranged in an assembly in which a plurality of individual ceramic substrates 51 before firing are arranged. Divided grooves 52 that are divided into individual pieces in a lattice shape are provided. The dividing grooves 52 are formed by pressing a cutting blade on both surfaces or one surface of a laminate in which a plurality of ceramic green sheets are pressed and adhered while being overlaid and heated. The laminate is formed into a ceramic base 51 aggregate by simultaneously firing a ceramic green sheet and a conductor metal in a reducing atmosphere. Furthermore, the fired ceramic substrate 51 aggregate is divided along the dividing grooves 52 and provided with a fractured surface 53 in the cross section, whereby a single-piece ceramic substrate 51 is obtained.

  However, as shown in FIGS. 7A and 7B, the above-described conventional ceramic package 50 for electronic component storage has a burr 54 protruding from the fracture surface 53 of the ceramic base 51 divided by the dividing groove 52, There is a problem that a dent that is a sag occurs and the cross-section becomes uneven and lacks flatness. Such an electronic component storing ceramic package 50 is used when the ceramic substrate 51 is erected by the burr 54 generated on the side surface when the ceramic substrate 51 is erected on the mounting wiring substrate 55 such as a board substrate. There was a problem in that it sometimes lacked stability and could not be mounted.

In the conventional ceramic package for storing electronic components, the manufacturing method of the ceramic package for storing electronic components in order to eliminate the problem of accurate positioning of the electronic components by the image recognition device due to the burr on the outer periphery is as follows. A division groove deeper than the thickness of the ceramic green sheet is formed to clarify the partition of the package area, and even if a burr occurs in the center in the thickness direction, the image recognition device can accurately position the electronic component. Has been proposed (see, for example, Patent Document 1).
Alternatively, in the conventional ceramic package for storing electronic components, in order to prevent the occurrence of processing defects such as burrs on the cut surface of the package that is cut and separated, chipping, and the like, Providing dividing grooves in the intermediate layer has also been proposed (see, for example, Patent Document 2).

JP-A-11-163193 JP 2005-72210 A

However, the above-described conventional ceramic package for storing electronic components and the manufacturing method thereof have the following problems.
The ceramic package for storing electronic components as disclosed in JP-A-11-163193 and JP-A-2005-72210, and the ceramic package for storing electronic components produced by the manufacturing method thereof are divided grooves in the thickness direction. The size of the burrs can be made as large as possible to reduce burrs and cracks that occur on the fracture surface during splitting, and while it can be made an inexpensive package, it is not possible to eliminate all burrs and chips on the fracture surface. When mounting by mounting one side surface on a wiring board for mounting such as a board substrate, there is a case where the mounting is impossible due to lack of stability when standing by a burr generated on the fracture surface. In addition, such a ceramic package for storing electronic components and a ceramic package for storing electronic components manufactured by the manufacturing method thereof, for example, can be erected on a mounting wiring board even if the package can be made inexpensive. Since reworking or the like is necessary for mounting, the cost of the electronic device mounted with the package is increased.
The present invention has been made in view of such circumstances, and is an inexpensive ceramic package for housing electronic components that can be easily mounted by stably standing one side of a rectangular ceramic substrate on a wiring board for mounting, and It aims at providing the manufacturing method.

  The ceramic package for electronic component storage according to the present invention that meets the above-mentioned object is an electronic component storage ceramic package in which an electronic component is mounted and stored on a ceramic substrate, and the ceramic substrate has a rectangular side surface with respect to the surface of the ceramic substrate. A cutting surface provided at right angles over the entire thickness direction, a split groove provided on the other three side surfaces excluding one side surface of the ceramic substrate from the surface of the ceramic substrate to the middle of the thickness direction, and adjacent to the split groove Has a fracture surface.

  A method for manufacturing an electronic component storage ceramic package according to the present invention that meets the above-described object is a method for manufacturing an electronic component storage ceramic package in which a multilayer body of ceramic green sheets is fired to form a ceramic substrate. Forming a split groove on the surface of the laminate by pressing with a tip of a cutting blade consisting of a double-edged blade at each of the positions on the other three side surfaces excluding the desired one side of the rectangular ceramic base; Firing the laminated body to form a fired body, cutting a cutting position while rotating and sliding the slice blade at a desired position on the ceramic substrate of the fired body, and firing the fired body. And a step of forming a ceramic substrate by breaking and dividing at a dividing groove of the body.

  Another method for manufacturing an electronic component storage ceramic package according to the present invention that meets the above-described object is a method for manufacturing an electronic component storage ceramic package in which a ceramic substrate is formed by firing a laminate of a plurality of ceramic green sheets. A step of forming a split groove on the surface of the laminated body by pressing the laminated body at the tip of the cutting blade consisting of both front edges at each of the other three side faces except the desired one side of the rectangular ceramic base. And a step of inserting a cutting edge consisting of double-edged blades at a position to be a desired side surface of the ceramic substrate of the laminated body to cut the laminated body to form one side surface, and firing the laminated body to form a fired body And a step of forming a ceramic substrate by breaking and dividing at a dividing groove of the fired body.

  The ceramic package for storing electronic components according to claim 1 is configured such that a cutting surface provided on one side surface of the rectangular shape of the ceramic base body at a right angle with respect to the surface of the ceramic base body in the thickness direction and one side surface of the ceramic base body are excluded. Since there are split grooves provided on the other three side surfaces from the surface of the ceramic base to the middle in the thickness direction, and a fracture surface adjacent to the split grooves, one side of the ceramic base has a cutting surface with excellent flatness for mounting wiring. The module can be mounted easily as a low-priced module by using a split groove that can be formed on the substrate in a stable manner and can be easily mounted, and can be easily formed on the three sides of the ceramic substrate, and a broken surface. A ceramic package for storing electronic components can be provided.

  3. The method of manufacturing a ceramic package for storing electronic components according to claim 2, wherein the tip of the cutting blade is composed of a double-edged blade at each of the other three side surfaces excluding the desired one side surface of the rectangular ceramic substrate in the laminate. A step of forming a split groove on the surface of the laminate by pressing with a portion, a step of firing the laminate to form a fired body, and rotating the slice blade to a desired side of the ceramic substrate of the fired body And having a step of cutting and cutting while sliding to form one side surface and a step of forming a ceramic base by breaking and dividing with a dividing groove of the fired body, and therefore, three side surfaces comprising the dividing groove on the ceramic base, and a cutting surface Therefore, it is possible to provide a method for manufacturing an electronic component housing ceramic package that can form an inexpensive ceramic base that can be easily formed on a wiring board for mounting.

  4. The method of manufacturing a ceramic package for storing electronic components according to claim 3, wherein the tip of the cutting blade is formed of a double-edged blade at each of the other three side surfaces of the laminated body other than the desired one side surface of the rectangular ceramic substrate. A step of forming a split groove on the surface of the laminate by pressing with a portion, and a position on the ceramic substrate of the laminate which is a desired one side is inserted with a cutting blade consisting of double-edged blades to cut the laminate A step of forming a fired body by firing the laminated body, and a step of forming a ceramic base by breaking and dividing at a split groove of the fired body, so that three side surfaces comprising the split groove on the ceramic base, Thus, it is possible to provide a method of manufacturing a ceramic package for storing electronic components, which can easily form one side surface made of a cut surface and forms an inexpensive ceramic base that can be easily mounted on a wiring board for mounting on one side surface.

Subsequently, the best mode for carrying out the present invention will be described with reference to the accompanying drawings to provide an understanding of the present invention.
1A to 1C are a perspective view, an AA ′ line longitudinal cross-sectional view, and a BB ′ line vertical cross-sectional view, respectively, of an electronic component storage ceramic package according to an embodiment of the present invention. 2 (A) and 2 (B) are partial explanatory views of a method of manufacturing an electronic component storage ceramic package according to an embodiment of the present invention, and FIGS. 3 (A) and 3 (B) are respectively the same electronic component. FIGS. 4A and 4B are partial explanatory views of another method for manufacturing an electronic component storing ceramic package according to an embodiment of the present invention, respectively. 5 (A) and 5 (B) are partial explanatory views of another manufacturing method of the ceramic package for storing electronic components.

As shown in FIG. 1, an electronic component housing ceramic package 10 according to an embodiment of the present invention includes a semiconductor substrate 11 made of ceramic such as alumina (Al ₂ O ₃ ) or aluminum nitride (AlN), and a semiconductor. An electronic component 12 such as an element, a light emitting element, or a crystal resonator is mounted and stored. The ceramic substrate 11 is formed by laminating a plurality of plate-shaped ceramic plates, and usually has a cavity portion 13 for mounting the electronic component 12 on one main surface side. Then, after the electronic component 12 is mounted on the ceramic base 11 in the cavity portion 13 so that the electronic component 12 and the outside are in an electrically connected state, a metal plate, a ceramic plate or the like is attached to the ceramic base 11. By joining the lid body 14 made of the above, the electronic component 12 in the cavity portion 13 is hermetically sealed. Although not shown, the ceramic substrate 11 has a conductor wiring pattern made of a refractory metal such as tungsten (W) or molybdenum (Mo) for electrically connecting the electronic component 12 and the outside. External connection terminal pads and the like are provided.

  The ceramic package 10 for storing electronic components has a cutting surface 15 provided on one side surface of the ceramic base 11 that is perpendicular to the surface of the ceramic base 11 over the entire thickness direction. The cutting surface 15 is formed by cutting the fired ceramic base 11 with a dicing saw or the like, or by cutting the ceramic base 11 before firing with a sharp cutting blade and firing it. It is excellent in flatness and can be provided substantially perpendicular to the surface of the ceramic substrate 11.

  In addition, the ceramic package 10 for storing electronic components is provided on one of the main surfaces of the ceramic substrate 11 or from both main surfaces to the middle in the thickness direction on the other three side surfaces of the ceramic substrate 11 except for one rectangular side surface. It has a dividing groove 16 and a fracture surface 17 adjacent to the dividing groove 16. The dividing grooves 16 are formed by pressing the tip of the cutting blade having a predetermined angle at each of the three side surfaces of the ceramic base 11 before firing and then firing. The three sides of the ceramic substrate 11 are divided along the respective dividing grooves 16 serving as the three side surfaces, the wall surfaces of the dividing grooves 16, and the fractured surface 17 of the ceramic that extends from the tip of the dividing grooves 16 and breaks. Are exposed to the outside adjacent to the dividing groove 16. In addition, when the dividing groove 16 is formed only on one main surface of the ceramic substrate 11, there is a case where the breaking destination is bent largely toward the other main surface extending from the tip of the dividing groove 16 and breaking. Therefore, it is usually often formed on both main surfaces of the ceramic substrate 11.

  The electronic component storing ceramic package 10 can be mounted by easily bringing the cutting surface 15 of the ceramic base 11 into contact with the mounting wiring board after mounting the electronic component 12. Further, the ceramic package 10 for storing electronic parts can be easily obtained by dividing the aggregate of the ceramic substrates 11 along the dividing grooves 16 into the dividing grooves 16 on the three side surfaces of the ceramic substrate 11 and the fractured surface 17 adjacent thereto. Therefore, an inexpensive package can be obtained.

Next, a method for manufacturing the electronic component housing ceramic package 10 according to the embodiment of the present invention will be described with reference to FIGS. 2 (A), 2 (B), 3 (A), and 3 (B).
As shown in FIG. 2A, a plurality of ceramic green sheets 18 are used in the method of manufacturing the electronic component housing ceramic package 10. For the production of the ceramic green sheet 18, for example, when the ceramic is made of alumina, a powder is prepared by adding an appropriate amount of a sintering aid such as magnesia, silica, calcia to alumina powder. To this powder, a plasticizer such as dioctyl phthalate, a binder such as acrylic resin, and a solvent such as toluene, xylene, and alcohols are added and kneaded sufficiently, and then defoamed to obtain a slurry having a viscosity of 2000 to 40000 cps. Yes. Then, the slurry is formed into a plurality of ceramic green sheets 18 which are formed into a sheet shape having a thickness of 0.25 mm, for example, by a doctor blade method and cut into an appropriate size.

  The ceramic green sheet 18 has a size that is formed as an aggregate in which a large number of individual ceramic bases 11 are arranged in a matrix. In each of the plurality of ceramic green sheets 18, via conductor through holes for forming upper and lower layers of electrical conduction for a plurality of individual ceramic bases 11, semiconductor elements, A through hole for the cavity 13 for mounting a light emitting element and an electronic component such as a crystal resonator is formed by using a punching die or a punching machine. Furthermore, each ceramic green sheet 18 is screen-printed using a conductive paste made of a refractory metal such as tungsten (W) or molybdenum (Mo) as necessary, and via conductors, conductor wiring patterns, A conductor printed pattern for external connection terminal pads is formed.

  Next, the plurality of ceramic green sheets 18 are overlaid and laminated by applying temperature and pressure to form a laminated body 19. The laminated body 19 has a tip angle of about 15 ° to 50 ° of a cutting blade attached to a press machine or the like at each of the other three side surfaces of the quadrangular ceramic base 11 other than the desired one side surface. The split groove 16 is formed on the surface of the laminate 19 by pressing with a tip portion having both isosceles triangular cutting edges. In the case where the thickness of the ceramic substrate 11 is thin, the dividing groove 16 may be formed on one main surface of the ceramic substrate 11 on the other three side surfaces excluding the desired one side surface. In the case where the thickness as 11 becomes thick, there may be a case where the tip that extends from the tip of the dividing groove 16 and breaks to the other main surface side is bent greatly at the time of division after firing. Therefore, the dividing groove 16 can be divided so that the ends of the dividing groove 16 are connected to each other by being formed on both main surfaces, and the divided cross-sections can be divided into two substantially equal to each other. Preferably formed.

  Next, as shown in FIG. 2B, the laminate 19 is formed by firing the ceramic green sheet and the refractory metal simultaneously at a temperature of about 1550 ° C. in a reducing atmosphere. The fired body 20 is an aggregate of ceramic bases 11 contracted by about 30% from the laminated body 19 of the ceramic green sheets 18 by firing, and the conductor print pattern formed on the ceramic green sheets 18 is applied to each ceramic base 11. The conductor wiring pattern is baked.

  Next, as shown in FIG. 3 (A), the fired body 20 rotates the disk-shaped slice blade attached to a cutting machine such as a dicing saw at a position that becomes a desired one side surface of the ceramic substrate 11. One side surface of the ceramic substrate 11 is formed by cutting and cutting while sliding. Thereby, the part which becomes one side surface of the ceramic base body 11 is finished to the cutting surface 15 excellent in flatness over the whole thickness direction at right angles to the surface of the ceramic base body 11.

  Next, as shown in FIG. 3 (B), the fired body 20 has the divided grooves 16 provided in the vertical and horizontal directions so as to be positioned on the other three side surfaces excluding the desired one side surface of the ceramic substrate 11. The ceramic substrate 11 is formed by breaking and dividing. Thus, the three side surfaces of the ceramic substrate 11 are finished from the surface of the ceramic substrate 11 to the middle of the thickness direction into the wall surface of the dividing groove 16 and the fractured surface 17 adjacent to the dividing groove 16.

Next, another method for manufacturing the electronic component housing ceramic package 10 according to the embodiment of the present invention will be described with reference to FIGS. 4 (A), 4 (B), 5 (A), and 5 (B). .
As shown in FIG. 4A, a plurality of ceramic green sheets 18 are used in another method for manufacturing the electronic component storing ceramic package 10. The ceramic green sheet 18 is the same as the ceramic green sheet 18 used in the method for manufacturing the ceramic package 10 for storing electronic components. The ceramic green sheet 18 has a size that is formed as an aggregate in which a large number of individual ceramic bases 11 are arranged in a matrix, as in the case of the method for manufacturing the ceramic package 10 for storing electronic components. It has become. A plurality of ceramic green sheets 18 are punched with via conductor through holes for forming upper and lower layers of electrical continuity and cavity part 13 through holes for mounting electronic parts as necessary. It is formed by drilling using a mold or a punching machine. Furthermore, each ceramic green sheet 18 is screen-printed using a conductive paste made of a refractory metal such as tungsten (W) or molybdenum (Mo) as necessary, and via conductors, conductor wiring patterns, A conductor printed pattern for external connection terminal pads is formed.

  Next, the plurality of ceramic green sheets 18 are overlaid and laminated by applying temperature and pressure to form a laminated body 19. The laminated body 19 has a tip angle of about 15 ° to 50 ° of a cutting blade attached to a press machine or the like at each of the other three side surfaces of the quadrangular ceramic base 11 other than the desired one side surface. The split groove 16 is formed on the surface of the laminate 19 by pressing with a tip portion having both isosceles triangular cutting edges. The dividing grooves 16 are formed on one main surface or both main surfaces that become the ceramic substrate 11 after firing. However, when the dividing groove 16 is provided only on one main surface of the ceramic substrate 11, the ceramic substrate 11 after firing may be thin, but if the thickness is increased, the dividing groove 16 is divided during firing. Since there is a case where the tip that extends from the tip of the first member and breaks toward the other main surface portion side is bent greatly, it can be divided so as to be formed on both main surfaces and connect the tips of the dividing grooves 16, and It can be divided into two substantially the same degree.

  Next, as shown in FIG. 4 (B), the laminate 19 is an isosceles triangle having a relatively sharp tip angle attached to a press or the like at a position corresponding to one desired side surface of the ceramic substrate 11. The laminated body 19 is cut by inserting cutting blades composed of both of the leading edges to form a portion that becomes one side surface of the ceramic substrate 11. As a result, the portion that becomes one side surface after firing is finished into a cutting surface 15 having excellent flatness over the entire thickness direction perpendicular to the surface of the ceramic substrate 11. In addition, for the cutting of the laminated body 19 by this cutting blade, it is preferable to heat and cut the laminated body 19 in advance.

  Next, as shown in FIG. 5 (A), the laminate 19 forms the fired body 20 by simultaneously firing the ceramic green sheet and the refractory metal at a temperature of about 1550 ° C. in a reducing atmosphere. The fired body 20 is an aggregate of ceramic bases 11 contracted by about 30% from the laminated body 19 of the ceramic green sheets 18 by firing, and the conductor print pattern formed on the ceramic green sheets 18 is applied to each ceramic base 11. The conductor wiring pattern is baked.

  Next, as shown in FIG. 5 (B), the fired body 20 has the divided grooves 16 provided in the vertical and horizontal directions so as to be positioned on the other three side surfaces excluding the desired one side surface of the ceramic substrate 11. The ceramic substrate 11 is formed by breaking and dividing. Thus, the three side surfaces of the ceramic substrate 11 are finished from the surface of the ceramic substrate 11 to the middle of the thickness direction into the wall surface of the dividing groove 16 and the fractured surface 17 adjacent to the dividing groove 16.

  The ceramic package for electronic component storage according to the present invention and the ceramic package for electronic component storage manufactured by the manufacturing method thereof are mounted on a board or the like after mounting an electronic component such as a semiconductor element, a light emitting element, or a crystal resonator. The cutting surface of the ceramic substrate is brought into contact with the wiring board for mounting, and the package is erected and mounted, and can be used by being incorporated into various electronic devices that need to improve the mounting density.

(A)-(C) are the perspective view, the A-A 'line longitudinal cross-sectional view, and the B-B' line vertical cross-sectional view of the ceramic package for electronic component storage which respectively concerns on one embodiment of this invention. (A), (B) is a partial explanatory drawing of the manufacturing method of the ceramic package for electronic component accommodation which concerns on one embodiment of this invention, respectively. (A), (B) is a partial explanatory drawing of the manufacturing method of the ceramic package for storing the said electronic components, respectively. (A), (B) is a partial explanatory view of the other manufacturing method of the ceramic package for electronic component accommodation which concerns on one embodiment of this invention, respectively. (A), (B) is a partial explanatory drawing of the other manufacturing method of the ceramic package for electronic component accommodation, respectively. (A), (B) is explanatory drawing of the manufacturing method of the conventional ceramic package for electronic component accommodation, respectively. (A), (B) is explanatory drawing of the conventional ceramic package for electronic component accommodation, and explanatory drawing of a mounting state, respectively.

Explanation of symbols

  10: Ceramic package for storing electronic components, 11: Ceramic substrate, 12: Electronic components, 13: Cavity, 14: Lid, 15: Cutting surface, 16: Dividing groove, 17: Broken surface, 18: Ceramic green sheet, 19: laminate, 20: fired body

Claims (3)

In an electronic component storage ceramic package for mounting and storing electronic components on a ceramic substrate
A cutting surface provided on one side of the square shape of the ceramic substrate at right angles to the surface of the ceramic substrate in the thickness direction, and on the other three sides of the ceramic substrate except for the one side surface, A ceramic package for storing an electronic component, comprising: a dividing groove provided from a surface to a middle in a thickness direction; and a fractured surface adjacent to the dividing groove. In the method of manufacturing a ceramic package for storing electronic components, in which a laminate of a plurality of ceramic green sheets is fired to form a ceramic substrate
The laminated body is pressed with the tip of a cutting edge consisting of double-edged blades at each of the other three side faces except the desired one side face of the square-shaped ceramic base so that a dividing groove is formed on the surface of the laminated body. Forming, and
Firing the laminate to form a fired body;
Forming the one side surface by cutting and cutting while rotating and sliding the slice blade at a position that becomes the desired one side surface of the ceramic base of the fired body;
A method of manufacturing a ceramic package for storing electronic parts, comprising the step of forming the ceramic substrate by breaking and dividing at the dividing groove of the fired body. In the method of manufacturing a ceramic package for storing electronic components, in which a laminate of a plurality of ceramic green sheets is fired to form a ceramic substrate
The laminated body is pressed with the tip of a cutting edge consisting of double-edged blades at each of the other three side faces except the desired one side face of the square-shaped ceramic base so that a dividing groove is formed on the surface of the laminated body. Forming, and
Inserting a cutting blade consisting of a double-edged blade at a position to be the desired one side surface of the ceramic substrate of the laminated body to cut the laminated body to form the one side surface;
Firing the laminate to form a fired body;
A method of manufacturing a ceramic package for storing electronic parts, comprising the step of forming the ceramic substrate by breaking and dividing at the dividing groove of the fired body.

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