JP5153399B2 - Substrate case and processing method - Google Patents

Description

  The present invention relates to a substrate case for supporting a substrate and a processing method for performing chemical treatment on a substrate using the substrate case.

  Generally, when a chemical process is performed on a substrate in a manufacturing process of a semiconductor device, a substrate case containing a plurality of substrates is immersed in the chemical solution. Each of the plurality of substrates is inserted into a pair of vertical grooves formed on a pair of inner walls of the substrate case. As a result, the plurality of substrates are supported in a state of standing parallel to each other in the substrate case.

Here, in order to prevent the substrates adjacent to each other from sticking when the substrate case is pulled out from the chemical solution, it has been proposed to provide a partitioning jig between each of the plurality of substrates (for example, patents). Reference 1).
JP 2000-208604 A

  However, when the substrate case described in Patent Document 1 is pulled up from the chemical solution, there is a problem that the substrate is cracked or warped due to sticking to the side surface of the longitudinal groove or the partitioning jig.

  The present invention has been made in view of the above-described situation, and an object of the present invention is to provide a substrate case that can prevent the substrate from being cracked or warped, and a processing method for performing chemical treatment on the substrate using the substrate case. To do.

  A substrate case according to one aspect of the present invention is a substrate case that supports a substrate substantially perpendicularly to a predetermined direction, and includes a lower end support portion having a lower groove that supports a lower end portion of the substrate, and an upper end of the substrate. And a pair of side end support portions each having a longitudinal groove supporting both side end portions of the substrate, the longitudinal groove extending along the vertical direction, and the longitudinal groove is Each of the pair of side surfaces of the longitudinal groove that has a taper shape has a first angle with respect to a predetermined direction, and the first angle is determined based on the bending of the substrate in the predetermined direction. The gist is that

  According to the substrate case according to one feature of the present invention, when the substrate case is pulled up from the chemical solution, the first angle can be determined as an angle at which the substrate does not stick to each of the pair of side surfaces of the longitudinal groove. Therefore, it can suppress that a board | substrate sticks to each of a pair of side surface of a vertical groove. As a result, it is possible to prevent the substrate from being cracked or warped.

  In one aspect of the present invention, the vertical groove may have a flat bottom surface connected to each of the pair of side surfaces of the vertical groove.

  In one feature of the present invention, at least one of the lower groove and the upper groove is formed in a tapered shape, and the pair of side surfaces of the one groove has a second angle with respect to a predetermined direction. The second angle may be determined according to the bending of the substrate in the predetermined direction.

  In one aspect of the present invention, the lower groove may have a planar bottom surface that is connected to a pair of side surfaces of the lower groove.

  In one aspect of the present invention, the lower end support portion includes a first lower end support portion and a second lower end support portion that extend along a predetermined direction, and each of the first lower end support portion and the second lower end support portion includes a lower groove. You may have.

  In one aspect of the present invention, the lower groove and the upper groove may restrict the positional deviation of the substrate in a predetermined direction to a predetermined range.

    A processing method according to one aspect of the present invention is a processing method for performing chemical treatment on a substrate, and includes a step A in which a substrate is stood and stored in a substrate case, a step B in which the substrate case is immersed in a chemical solution, A step C for removing the substrate case from the chemical solution, the substrate case including a lower end support portion having a lower groove for supporting the lower end portion of the substrate, an upper end support portion having an upper groove for supporting the upper end portion of the substrate, and a substrate And a pair of side end support portions each having a longitudinal groove for supporting both side end portions thereof, the longitudinal groove extending along the vertical direction, the longitudinal groove being formed in a tapered shape, and the pair of longitudinal grooves having Each of the side surfaces has a first angle with respect to a direction perpendicular to the substrate, and the first angle is determined based on the deflection of the substrate in the direction perpendicular to the substrate.

  ADVANTAGE OF THE INVENTION According to this invention, the board | substrate case which can suppress that a crack and a curvature generate | occur | produce in a board | substrate and the processing method which performs a chemical | medical solution process to a board | substrate using it can be provided.

  Next, embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic and ratios of dimensions and the like are different from actual ones. Accordingly, specific dimensions and the like should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.

(Configuration of board case)
The configuration of the substrate case 1 according to the embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a top view of the substrate case 1. FIG. 2 is a top view of the substrate case 1 with the upper end support 10 shown in FIG. 1 removed. 3 is a cross-sectional view taken along the line AA in FIG.

  As shown in FIGS. 1 and 2, the substrate case 1 includes an upper end support portion 10, a side end support portion 20, a fixing portion 30, and a lower end support portion 40.

  The substrate case 1 is used when a chemical treatment is performed on a substrate S such as a glass substrate or a semiconductor wafer in a manufacturing process of a semiconductor manufacturing apparatus. Therefore, the substrate case 1 is made of a material having resistance to the chemical used for the chemical processing. As such a material, for example, a fluororesin such as PFA (Tetrafluoroethylene perfluoroalkoxy vinyl ether copolymer) and PTFE (Polytetrafluoroethylene) having resistance to acidic and alkaline chemicals, or PEEK (Polyether ether ketone) can be used. . The plurality of substrates S are arranged in the substrate case 1 according to the arrangement direction and are supported substantially parallel to each other. The substrate case 1 can be used not only when the substrate S is subjected to the chemical treatment, but also as a storage case when the substrate S is transported.

  The upper end support portion 10 includes a first upper end support portion 10a and a second upper end support portion 10b (hereinafter also referred to as the upper end support portion 10). The upper end support part 10 supports the upper end part of the substrate S, and suppresses the substrate S from floating when the substrate case 1 is immersed in the chemical solution. The upper end support part 10 is arrange | positioned along the sequence direction. The upper end support part 10 is detachably fixed to a fixing part 30 described later by using a fixing tool 15. As shown in FIG. 2, the substrate S is inserted from above the substrate case 1 with the upper end support 10 removed.

  The upper end support portion 10 includes a plurality of upper grooves 10G that are continuous in the arrangement direction. The upper groove 10G is formed in a tapered shape. The upper end portion of the substrate S is supported by being housed inside the upper groove 10G (see FIG. 4). In the present embodiment, the upper groove 10 </ b> G is formed in an annular shape centering on the axis of the upper end support portion 10, but may be formed only on the lower surface side of the upper end support portion 10.

  The side end support portion 20 includes a pair of first side end support portions 20a and second side end support portions 20b (hereinafter also referred to as side end support portions 20) facing each other. The side end support part 20 supports the side end part of the substrate S, and restricts the movement of the substrate S in the orthogonal direction substantially orthogonal to the arrangement direction when viewed from above. Both end portions in the arrangement direction of the side end support portion 20 are fixed to the fixing portion 30. The chemical solution passes between the upper end support portions 10 or between the upper end support portion 10 and the side end support portion 20.

  The side end support part 20 has a plurality of vertical grooves 20G that are continuous along the arrangement direction. The vertical groove 20G is formed in a tapered shape. The vertical groove 20G extends along the vertical direction. The side edge part of the board | substrate S is supported by being stored inside the vertical groove 20G (refer FIG. 6).

  The lower end support portion 40 includes a first lower end support portion 40a and a second lower end support portion 40b (hereinafter also referred to as the lower end support portion 40). The lower end support part 40 supports the lower end part of the substrate S. Both end portions of the lower end support portion 40 are fixed to the fixing portion 30. The chemical solution passes between the lower end support portions 40 or between the lower end support portion 40 and the side end support portion 20.

  The lower end support part 40 has a plurality of lower grooves 40G that are continuous in the arrangement direction. The lower groove 40G is formed in a tapered shape. The lower end portion of the substrate S is placed in the lower groove 40G (see FIG. 5B).

  The fixing part 30 includes a pair of first fixing part 30a and second fixing part 30b (hereinafter also referred to as the fixing part 30) facing each other. The fixing portion 30 fixes the end portions of the side end support portion 20 and the lower end support portion 40.

  As described above, the substrate S is supported substantially vertically in the substrate case 1 by the upper groove 10G, the vertical groove 20G, and the lower groove 40G, as shown in FIG.

(Upper groove configuration)
Next, the configuration of the upper groove 10G included in the upper end support portion 10 will be described with reference to FIG. FIG. 4 is an enlarged cross-sectional view of the first upper end support portion 10a taken along line BB in FIG.

  As shown in FIG. 4, the upper groove 10G is tapered upward. By accommodating the substrate S inside the upper groove 10G, the positional deviation in the arrangement direction of the substrates S is suppressed within a predetermined range.

Here, when the substrate S is placed in the lower groove 40G, the distance α between the deep portion of the upper groove 10G and the substrate S is preferably equal to or larger than the distance β. That is, it is preferable that the upper end support portion 10 does not hold down the substrate S. For example, when a single crystal silicon substrate of about 104 mm square and about 70 μm thickness is used, the interval α is about 0.5 mm, the width γ ₁ of the upper groove 10G is about 4.75 mm, and the height δ ₁ of the upper groove 10G is set. It can be set to about 4.00 mm.

(Configuration of lower groove)
Next, the configuration of the lower groove 40G included in the lower end support portion 40 will be described with reference to FIG. Fig.5 (a) is sectional drawing of the 1st lower end support part 40a in CC line of FIG. FIG. 5B is an enlarged view of a Y portion in FIG.

  As shown in FIG. 5A, the lower groove 40G is formed in a tapered shape downward. When the substrate S is accommodated in the lower groove 40G, the positional deviation in the arrangement direction of the substrates S is suppressed within a predetermined range.

  As shown in FIG. 5B, the lower groove 40G has a pair of side surfaces 40L and 40M and a bottom surface 40N. The bottom surface 40N is formed in a planar shape and is connected to the pair of side surfaces 40L and 40M. The lower end portion of the substrate S is placed on the bottom surface 40N.

Here, a pair of side surfaces 40L, 40M, respectively, an angle theta ₁ with respect to the arrangement direction. Such an angle θ ₁ is preferably determined based on the bending of the substrate S in the arrangement direction. Specifically, as shown in FIG. 5B, the angle θ ₁ is equal to the substrate S and the pair of side surfaces 40L and 40M, even when the substrate S is bent at the end of the bottom surface 40N in the arrangement direction. It is preferable that it is the magnitude | size which does not carry out surface contact. For example, when a single crystal silicon substrate of about 104 mm square and about 70 μm thickness is used, the width γ ₂ of the lower groove 40G is about 4.75 mm, the height δ ₂ of the lower groove 40G is about 3.00 mm, and the angle θ _1. Can be set to about 65 degrees.

However, the smaller the angle theta _1, since the spread pitch and if lower groove 40G, the number of substrates S can be stored on board case 1 is reduced. Therefore, it is preferable that the angle θ ₁ is as large as possible within the range satisfying the above condition.

(Vertical groove configuration)
Next, the configuration of the vertical groove 20G included in the side end support portion 20 will be described with reference to FIG. FIG. 6 is an enlarged view of a portion X in FIG.

  As shown in FIG. 6, the vertical groove 20G is formed in a tapered shape toward the side. When the substrate S is accommodated inside the vertical groove 20G, the positional deviation of the substrate S in the orthogonal direction is suppressed.

  As shown in FIG. 6, the vertical groove 20G has a pair of side surfaces 20L and 20M and a bottom surface 20N. The bottom surface 20N is a plane extending in the vertical direction, and is connected to each of the pair of side surfaces 20L and 20M.

Here, a pair of side surfaces 20L, 20M, respectively, an angle theta ₂ with respect to the arrangement direction. Such an angle θ ₂ is preferably determined based on the bending of the substrate S in the arrangement direction. Specifically, as shown in FIG. 6, the angle θ ₂ is such that the substrate S and the pair of side surfaces 20L and 20M face each other even when the substrate S is bent at the end of the bottom surface 20N in the arrangement direction. It is preferable that it is the size which does not contact. For example, when a single crystal silicon substrate of about 104 mm square and about 70 μm thickness is used, the width γ ₃ of the vertical groove 20G is about 4.75 mm, the height δ ₃ of the vertical groove 20G is about 6 mm, the bottom surface 20N and the lower groove The interval δ ₄ of 40G can be set to about 19 mm, and the angle θ ₂ can be set to about 73 degrees.

However, it is preferable that the angle θ ₂ is as large as possible within a range satisfying the above conditions.

(Function and effect)
In board case 1 according to the present embodiment, the longitudinal groove 20G of the pair of side faces 20L, 20M, respectively, an angle theta ₂ with respect to the arrangement direction. Angle theta ₂ is determined based on the deflection of the substrate S in the arrangement direction.

Accordingly, the board case 1 when pulled from the chemical solution, the substrate S can be determined the angle theta ₂ to the angle not sticking to each longitudinal groove 20G of the pair of side faces 20L, 20M. Therefore, it can suppress that the board | substrate S sticks to each of a pair of side surface 20L, 20M of the vertical groove 20G. As a result, it is possible to suppress the substrate S from being cracked or warped.

Further, the lower groove 40G and the upper groove 10G restrict the positional deviation in the arrangement direction of the substrates S to a predetermined range. Therefore, since the angle θ ₂ can be set under such a restriction, the angle θ ₂ can be set with high accuracy. Further, since the positional deviation of the substrates S is restricted to a predetermined range, when a plurality of substrates S are stored in the substrate case 1, it is possible to suppress the plurality of substrates S from sticking to each other.

  The vertical groove 20G is tapered and has a flat bottom surface 20N connected to each of the pair of side surfaces 20L and 20M. Here, when the vertical groove is formed in a V shape, when the substrate S is inserted into and removed from the vertical groove, the substrate S is easily cracked or chipped by being sandwiched between the vertical grooves. On the other hand, since the vertical groove 20G according to the present embodiment has a planar bottom surface 20N, the substrate S can be prevented from being sandwiched between the vertical grooves 20G.

Further, a pair of side surfaces 40L of lower groove 40G of the present embodiment, 40M, respectively, an angle theta ₁ with respect to the arrangement direction. The angle θ ₁ is determined based on the bending of the substrate S in the arrangement direction. Therefore, when the substrate case 1 is pulled up from the chemical solution, the substrate S can be prevented from sticking to the pair of side surfaces 40L and 40M of the lower groove 40G.

  The lower groove 40G is tapered and has a flat bottom surface 40N connected to the pair of side surfaces 40L and 40M. Here, when the lower groove is formed in a V shape, the substrate S is easily cracked or chipped by being sandwiched between the lower grooves. On the other hand, since the lower groove 40G according to the present embodiment supports the substrate S with the flat bottom surface 40N, the substrate S can be prevented from being sandwiched between the lower grooves 40G.

  In addition, each of the first lower end support portion 40a and the second lower end support portion 40b included in the lower end support portion 40 according to the present embodiment has a lower groove 40G. Accordingly, the lower end portion of the substrate S is supported by the two lower grooves 40G. For this reason, it is possible to prevent the substrate S from being cracked or chipped due to the concentration of its own weight on a part of the substrate S. Moreover, since the space | interval of the lower end support part 40 and the side end support part 20 can be made small, it can suppress that the board | substrate S bends between the lower end support part 40 and the side end support part 20. FIG.

(Other embodiments)
Although the present invention has been described according to the above-described embodiments, it should not be understood that the descriptions and drawings constituting a part of this disclosure limit the present invention. From this disclosure, various alternative embodiments, examples and operational techniques will be apparent to those skilled in the art.

  For example, in the above embodiment, the upper groove 10G and the lower groove 40G have different shapes, but the upper groove 10G may have the same configuration as the lower groove 40G. In this case, sticking of the upper groove 10G and the substrate S can be suppressed.

  In the above-described embodiment, the dimensions of the upper groove 10G, the vertical groove 20G, and the lower groove 40G are illustrated, but these dimensions can be changed as appropriate in consideration of the dimensions and materials of the substrate S.

  Moreover, in the said embodiment, although the two upper end support parts 10 and the lower end support parts 40 were provided along the sequence direction, it is not restricted to this. For example, the upper end support portion 10 and the lower end support portion 40 may be formed in a plate shape, and the upper groove 10G and the lower groove 40G extending along the orthogonal direction may be formed.

  In the above embodiment, the upper groove 10G and the lower groove 40G are formed at the same position in a top view, but the position of the upper groove 10G and the position of the lower groove 40G may not be the same. That is, the substrate S and the vertical groove 20G may be substantially perpendicular to the horizontal plane and allow a slight inclination with respect to the horizontal plane.

  Moreover, in the said embodiment, although each cross section of the upper side groove | channel 10G and the lower side groove | channel 40G was made into the taper shape, the cross section of each of the upper side groove | channel 10G and the lower side groove | channel 40G may be a rectangle.

  In the above-described embodiment, the substrate S is stored in the substrate case 1 with the upper end support 10 removed, but the upper end support 10 may be fixed to the fixed portion 30. In this case, it is only necessary that either the side end support part 20 or the lower end support part 40 is removable from the fixed part 30.

  As described above, the present invention naturally includes various embodiments not described herein. Therefore, the technical scope of the present invention is defined only by the invention specifying matters according to the scope of claims reasonable from the above description.

  Hereinafter, examples of the substrate case according to the present invention will be specifically described. However, the present invention is not limited to those shown in the following examples, and may be appropriately changed without departing from the scope of the invention. Can be implemented.

(Configuration of board case)
The substrate case according to this example has the same configuration as the substrate case 1 according to the above-described embodiment described with reference to FIGS. Specifically, the substrate case according to the present embodiment is configured with the following dimensions.

Referring to FIG. 4, the distance α between the deep portion of the upper groove 10G and the substrate was 0.5 mm, the width γ ₁ of the upper groove 10G was 4.75 mm, and the height δ ₁ of the upper groove 10G was 4.00 mm. .

Referring to FIG. 5, the width γ ₂ of the lower groove 40G was 4.75 mm, the height δ ₂ of the lower groove 40G was about 3.00 mm, and the angle θ ₁ was 65 degrees.

Referring to FIG. 6, the width γ ₃ of the longitudinal groove 20G is 4.75 mm, the height δ ₃ of the longitudinal groove 20G is 6 mm, the distance δ ₄ between the bottom surface 20N and the lower groove 40G is 19 mm, and the angle θ ₂ is 73. It was a degree.

(Substrate etching process)
Next, a plurality of single crystal silicon substrates (104 mm square) having various thicknesses were prepared, and etching treatment was performed as follows.

  First, a plurality of single crystal silicon substrates were arranged substantially in parallel in a substrate case having the above configuration.

  Next, the substrate case was immersed in an etching tank in which an alkaline etching solution was placed, and etching treatment was performed on a plurality of single crystal silicon substrates.

  Thereafter, the substrate case was pulled up from the etching tank.

(Check for sticking)
After lifting the substrate case from the etching tank, the occurrence of sticking between the single crystal silicon substrate and the side surfaces of the upper and lower grooves was confirmed.

  As a result, when the thickness of the single crystal silicon substrate was about 70 μm or more, no sticking between the single crystal silicon substrate and the side surface of each groove occurred, and the yield of the etching process was 100%. On the other hand, when the thickness of the single crystal silicon substrate was smaller than about 70 μm, the single crystal silicon substrate and the side surface of each groove were stuck, and the single crystal silicon substrate was cracked or warped. This is because as the thickness of the single crystal silicon substrate is smaller, the deflection of the single crystal silicon substrate is larger.

From this, for the bending of the single crystal silicon substrate having a thickness of 70 μm or more, the angle θ ₁ of the side surface of the lower groove 40G may be 65 degrees or less, and the angle θ ₂ of the side surface of the vertical groove 20G may be 73 degrees or less. It turned out to be preferable.

For the bending of the single crystal silicon substrate having a thickness of less than 70 μm, the angle θ ₁ of the side surface of the lower groove 40G is made smaller than 65 degrees, and the angle θ ₂ of the side surface of the vertical groove 20G is made smaller than 73 degrees. Was found to be preferable.

  From the above, it has been confirmed that sticking between the substrate and the side surface of each groove can be suppressed by determining the angles of the side surfaces of the vertical groove 20G and the lower groove 40G based on the material and dimensions of the substrate, that is, the bending of the substrate. It was.

1 is a top view of a substrate case 1 according to an embodiment of the present invention. 1 is a top view of a substrate case 1 according to an embodiment of the present invention. It is sectional drawing in the AA of FIG. It is sectional drawing in the BB line of FIG. It is sectional drawing in the CC line of FIG. FIG. 3 is an enlarged view of a portion X in FIG. 2.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Substrate case 10 ... Upper end support part 10G ... Upper side groove | channel 10a ... Upper end support part 15 ... Fixing tool 20 ... Side end support part 20G ... Vertical groove 20L, 20M ... Side surface 20N ... Bottom face 30 ... Fixed part 40 ... Lower end support part 40G ... Lower groove 40L, 40M ... Side 40N ... Bottom S ... Substrate

Claims (5)

A substrate case used to perform a predetermined process by supporting a predetermined substrate substantially perpendicularly to a predetermined direction,
A lower end support having a lower groove for supporting the lower end of the substrate;
An upper end support portion having an upper groove for supporting the upper end portion of the substrate;
A pair of side end support portions each having a longitudinal groove for supporting both side end portions of the substrate,
The vertical groove extends along the vertical direction,
The vertical groove is formed in a tapered shape ,
Each of the pair of side surfaces of the longitudinal groove has a first angle with respect to the predetermined direction,
The substrate case according to claim 1, wherein the first angle is determined based on a deflection of the substrate in the predetermined direction that occurs in the predetermined substrate during the predetermined processing . The substrate case according to claim 1, wherein the vertical groove has a flat bottom surface connected to each of a pair of side surfaces of the vertical groove. The substrate case according to claim 1, wherein the lower groove has a planar bottom surface connected to each of a pair of side surfaces of the lower groove. The lower end support part includes a first lower end support part and a second lower end support part extending along the predetermined direction,
Each of the first lower end support portion and the second lower end support portion has the lower groove.
The substrate case according to any one of claims 1 to 3. A processing method for supporting a predetermined substrate substantially perpendicularly to a predetermined direction and performing a chemical treatment,
Step A for storing the substrate upright in a substrate case;
Step B of immersing the substrate case in a chemical solution;
Step C for removing the substrate case from the chemical solution;
With
The substrate case is
A lower end support having a lower groove for supporting the lower end of the substrate;
An upper end support portion having an upper groove for supporting the upper end portion of the substrate;
A pair of side end support portions each having a longitudinal groove for supporting both side end portions of the substrate;
With
The vertical groove extends along the vertical direction,
The vertical groove is formed in a tapered shape,
Each of the pair of side surfaces of the longitudinal groove has a first angle with respect to a direction perpendicular to the substrate,
The first angle is determined based on the deflection of the substrate in the predetermined direction that occurs in the predetermined substrate during the chemical treatment.
A processing method characterized by the above.

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